Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design LP8860-Q1 SNVSAM5 – AUGUST 2016 LP8860-Q1 Low-EMI Automotive LED Driver With Four 150-mA Channels 1 Features 2 Applications • • • 1 • • • • • • • • • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Input Voltage Operating Range 3 V to 48 V Four High-Precision Current Sinks – Current Matching 0.5% (typical) – LED String Current up to 150 mA per Channel – Dimming Ratio >13 000:1 With External PWM Brightness Control – 16-bit Dimming Control with SPI or I2C – Supports Display Mode (Global Dimming) and Cluster Mode (Independent Dimming) Hybrid PWM and Current Dimming for Higher LED Drive Optical Efficiency Synchronization for LED PWM Frequency Boost Controller With Programmable Switching Frequency 100 kHz to 2.2 MHz and SpreadSpectrum Option for Lower EMI Boost Synchronization Input Power-Line FET Control for Inrush Current Protection and Standby Energy Saving Automatic LED Current Reduction With External Temperature Sensor Extensive Fault Diagnostics Backlight for: – Automotive Infotainment – Automotive Instrument Clusters – Smart Mirrors – Heads-Up Displays (HUD) – Central Information Displays (CID) – Audio-Video Navigation (AVN) 3 Description The LP8860-Q1 is an automotive high-efficiency LED driver with boost controller. It has 4 high-precision current sinks that can be controlled by a PWM input signal, an SPI or I2C master, or both. The boost converter has adaptive output voltage control based on the headroom voltages of the LED current sinks. This feature minimizes the power consumption by adjusting the voltage to the lowest sufficient level in all conditions. A wide-range adjustable frequency allows the LP8860-Q1 to avoid disturbance for AM radio band. The LP8860-Q1 supports built-in hybrid PWM and current dimming, which reduces EMI, extends the LED lifetime, and increases the total optical efficiency. Phase-shift PWM reduces audible noise and output ripple. To request a full data sheet or other design resources: request LP8860-Q1. Simplified Schematic VIN RISENSE 3...40 V Device Information(1) D L Q2 Up to 48V CIN COUT C1P SD VSENSE_N System Efficiency ISENSE VDD 3.3V RSENSE VDD 95 ISENSE_GND CPUMP BODY SIZE (NOM) 7.00 mm × 7.00 mm GD VSENSE_P CCPUMP PACKAGE HLQFP (32) (1) For all available packages, see the orderable addendum at the end of the data sheet. Q1 C1N PART NUMBER LP8860-Q1 C2x FB CVDD 90 SQW FILTER LP8860-Q1 SYNC V/H SYNC Efficiency (%) BOOST SYNC Up to 150 mA/string OUT1 VSYNC BRIGHTNESS PWM OUT2 SCLK/SCL OUT3 MOSI/SDA OUT4 MISO FAULT RESET 85 VIN = 5 V 80 VIN = 6 V 75 VIN = 8 V NSS EN TSENSE VDDIO/EN FAULT SGND NTC 65 VIN = 12 V ISET IF FAULT RT° 70 PGND LGND VIN = 15 V PAD RISET VDDIO 0 10 20 30 40 50 60 Brightness (%) 70 80 90 100 C001 Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LP8860-Q1 SNVSAM5 – AUGUST 2016 www.ti.com 4 Device Comparison Table VIN range Number of LED channels LED current / channel LP8860-Q1 LP8862-Q1 LP8861-Q1 TPS61193-Q1 TPS61194-Q1 TPS61196-Q1 3 V to 48 V 4.5 V to 45 V 4.5 V to 45 V 4.5 V to 45 V 4.5 V to 45 V 8 V to 30 V 4 2 4 3 4 6 150 mA 160 mA 100 mA 100 mA 100 mA 200 mA I2C/SPI support Yes No No No No No SEPIC support No Yes Yes Yes Yes No 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LP8860-Q1 LP8860-Q1 www.ti.com SNVSAM5 – AUGUST 2016 5 Device and Documentation Support 5.1 Device Support 5.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 5.2 Documentation Support 5.2.1 Related Documentation For related documentation see the following: • PowerPAD™ Thermally Enhanced Package Application Note • Understanding Boost Power Stages in Switch Mode Power Supplies • Power Stage Designer™ Tools 5.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LP8860-Q1 3 PACKAGE OPTION ADDENDUM www.ti.com 5-Nov-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP8860AQVFPRQ1 ACTIVE HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860AQ1 LP8860BQVFPRQ1 PREVIEW HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860BQ1 LP8860CQVFPRQ1 ACTIVE HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860CQ1 LP8860DQVFPRQ1 ACTIVE HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860DQ1 LP8860HQVFPRQ1 PREVIEW HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860HQ1 LP8860JQVFPRQ1 PREVIEW HLQFP VFP 32 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 LP8860JQ1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Nov-2016 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP8860AQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 LP8860BQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 LP8860CQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 LP8860DQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 LP8860HQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 LP8860JQVFPRQ1 HLQFP VFP 32 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP8860AQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 LP8860BQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 LP8860CQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 LP8860DQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 LP8860HQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 LP8860JQVFPRQ1 HLQFP VFP 32 1000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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