Material Content Data Sheet Sales Product Name TLE7469G V53 MA# MA000616594 Package PG-DSO-12-11 Issued 28. August 2013 Weight* 401.69 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 3.559 0.89 0.230 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.89 8860 8860 574 0.069 0.02 230.106 57.28 57.36 572851 172 573597 0.155 0.04 0.04 386 386 0.316 0.08 788 14.553 3.62 143.319 35.68 39.38 356794 36231 393813 4.235 1.05 1.05 10544 10544 0.001 0.00 0.612 0.15 0.113 0.03 0.091 0.02 4.324 1.08 4 0.15 1524 225 1.13 10765 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1528 282 11272 1000000