FEDL610Q304-01 Issue Date: Jul 16, 2014 ML610Q304 8-bit Microcontroller with Voice Output Function ■GENERAL DESCRIPTION Equipped with a 8-bit CPU nX-U8/100, the ML610Q304 is a high-performance 8-bit CMOS microcontroller that integrates a wide variety of peripherals such as timer, synchronous serial port, and voice output function. The nX-U8/100 CPU is capable of executing instructions efficiently on a one-instruction-per-clock-pulse basis through parallel processing by the 3-stage pipelined architecture. The ML610Q304 is also equipped with a flash memory that has achieved low voltage and low power consumption (at read) equivalent to mask ROMs, so it is best suited to battery-driven applications such as alarm and portable devices. In addition, it has an on-chip debugging function, which allows software debugging/rewriting with the LSI mounted on the board. ■FEATURES •CPU − 8-bit RISC CPU (CPU name: nX-U8/100) − Instruction system: 16-bit instructions − Instruction set: Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic shift, and so on − On-Chip debug function − Minimum instruction execution time Approx 30.5 µs (@32.768kHz system clock) Approx 0.244 µs (@4.096 MHz system clock)@VDD=2.0 to 5.5V Approx 0.122 µs (@8.192 MHz system clock)@VDD=2.2 to 5.5V •Internal memory − Has 96-Kbyte flash ROM(48K × 16-bits) built in. (1 K byte of test domain that it cannot be used is included) − Has 2-Kbyte flash ROM built in. (area in which self rewriting is possible (512byte × 4)) − Internal 1Kbyte RAM (1K × 8 bits) •Interrupt controller − 2 non-maskable interrupt sources (Internal source: 1, External source: 1) − 24 maskable interrupt sources (Internal source: 16, External source: 8) •Time base counter − Low-speed time base counter × 1 channel − High-speed time base counter × 1 channel •Watchdog timer − Generates a non-maskable interrupt upon the first overflow and a system reset occurs upon the second − Free running − Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s) •Timers − 8 bits × 4ch (16-bit configuration available) •Voice output function − Voice synthesis method: 4-bit ADPCM2 / non-linear PCM / straight 8-bit PCM / straight 16-bit PCM − Sampling frequency: 8/16/32 kHz; 10.7/21.3 kHz; 6.4/12.8/25.6 kHz 1/28 FEDL610Q304-01 ML610Q304 •Successive approximation type A/D converter − 10-bit A/D converter − Input: 3ch (ch0-2:External input) − Conversion time: 24.4 µs per channel at 4.096MHz VDD≧2.2V − Conversion time: 12.2 µs per channel at 8.192MHz VDD≧2.5V •Synchronous serial port − 2ch − Master/slave selectable − LSB first/MSB first selectable − 8-bit length/16-bit length selectable •UART − Half-duplex × 1ch − TXD/RXD − Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits − Positive logic/negative logic selectable − Built-in baud rate generator •I2C bus interface − Slave function and Master function − Fast mode (400 kbps), standard mode (100 kbps) •General-purpose ports − Input-only port × 1ch − Output-only port × 3ch (including secondary functions) − Input/output × 11ch (including secondary functions)(P40 to P42 uses also as an A/D converter input port.) •Speaker amplifier(D-class) output power − 1.0W(at 5.0V)/0.45W(at 3.0V) − Disconnection detection circuit − Speaker pin short detection circuit − PLL oscillation stop detection reset •Reset − Reset through the RESET_N pin − Power-on reset generation when powered on − Reset by the watchdog timer (WDT) overflow − PLL oscillation stop detection reset •Clock − Low-speed clock Built-in RC oscillation (32.768 kHz) − High-speed clock Built-in PLL oscillation (4.096MHz,8.192MHz,etc) 2/28 FEDL610Q304-01 ML610Q304 •Power management − STOP mode: Stop of oscillation (Operations of CPU and peripheral circuits are stopped.) − HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states). − Clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation clock) − Block control function: Operation of an intact functional block circuit is powerd down. (register reset and clock stop) •Shipment − 28-pin QFN ML610Q304-xxxGD (blank product: ML610Q304-NNNGD) xxx: ROM code number •Guaranteed operating range − Operating temperature: −40°C to 85°C − Operating voltage: VDD = 2.0V to 5.5V, SPVDD = 2.0V to 5.5V 3/28 FEDL610Q304-01 ML610Q304 ■BLOCK DIAGRAM Figure 1 is a block diagram of the ML610Q304. CPU (nX-U8/100) EPSW1~3 GREG 0~15 PSW Timing Controller On-Chip ICE ALU ELR1~3 ECSR1~3 LR DSR/CSR EA PC SP Instruction Decoder VDD VSS Instruction Register Data-bus Program Memory (Flash) 96Kbyte BUS Controller INT 2 SSIO RESET_N TEST LSCLK* OUTCLK* RESET & TEST Interrupt Controller INT 4 VDDL INT 4 POWER VOICECNT SCK1* SIN1* SOUT1* RAM 1KByte OSC TBC 8bit Timer INT 1 INT 2 WDT SCK0* SIN0* SOUT0* INT 2 I2C Master/Slave INT 1 UART INT 9 SDA* SCL* RXD0* TXD0* NMI GPIO P20 to P22 P40 to P42*1 P80 to P87 VREF AIN0 to AIN2*1 SPVDD SPVSS INT 1 D-class Speaker 50 to P57 Amplifier 10bit-ADC SPP SPM * : Secondary or tertiary function *1: I/O port or A/D converter input terminal Figure 1-1 Block Diagram of ML610Q304 4/28 FEDL610Q304-01 ML610Q304 ■PIN CONFIGURATION VDD VDDL VSS P85/EXI5/SCK1 P84/EXI4/SIN1 SPVDD SPVSS 21 20 19 18 17 16 15 ● ML610Q304 QFN package product (Top View) 11 RESET_N P86/EXI6/RXD0/SOUT1 26 10 P83/EXI3 P87/EXI7/TXD0 27 9 P82/EXI2/SOUT0 NMI 28 8 TEST0 7 25 TEST1_N VREF 6 SPP P81/EXI1/SCL/SCK0 12 5 24 P80/EXI0/SDA/SIN0 P40/AIN0 4 SPM P20/LED0 13 3 23 VSS P41/AIN1 2 (NC) P21/LED1 14 1 22 P22/LED2 P42/AIN2 (NC): No Connection Figure 1-2 Pin Layout of ML610Q304 Package 5/28 FEDL610Q304-01 ML610Q304 ■LIST OF PINS In the I/O column, “—” denotes an input pin (for primary functions only), “I” an input pin, “O” an output pin, and “I/O” an input/output pin. Primary function PAD No Pin name I/O 12 SPP O 13 SPM O 15 SPVSS ⎯ 16 SPVDD ⎯ 3 VSS ⎯ 19 VSS ⎯ 20 VDDL ⎯ 21 VDD ⎯ 25 VREF ⎯ 11 RESET_N I 8 TEST0 I/O 7 TEST1_N I 28 NMI I 4 P20/LED0 2 Secondary function Tertiary function Description Positive output pin of the built-in speaker amplifier Negative output pin of the built-in speaker amplifier Negative power supply pin for built-in speaker amplifier Positive power supply pin for built-in speaker amplifier Negative power supply pin Negative power supply pin Power supply for internal logic (internally generated) Positive power supply pin Reference power supply pin for successive-approxima tion type ADC Reset input pin Input/output pin for testing Input pin for testing Input port, non-maskable interrupt Pin name I/O Description Pin name I/O Description ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ O Output port / LED port LSCLK O ⎯ ⎯ ⎯ P21/LED1 O Output port / LED port OUTCLK O ⎯ ⎯ ⎯ 1 P22/LED2 O ⎯ ⎯ ⎯ ⎯ ⎯ 24 P40/AIN0 I/O Output port / LED port Input port/Output port /Successive-approxi mation type ADC input Input port/Output port /Successive-approxi mation type ADC input Input port/Output port /Successive-approxi mation type ADC input Low-speed clock output high-speed clock output ⎯ ⎯ ⎯ ⎯ SIN0 I SSIO0 data input 23 P41/AIN1 I/O 22 P42/AIN2 I/O 5 P80/EXI0 I/O Input port/Output port / External interrupt ⎯ ⎯ ⎯ SCK0 I/O SSIO0 synchronous clock input/output ⎯ ⎯ ⎯ SOUT0 O SSIO0 data output I/O I2C synchronous data input/output SIN0 I SSIO0 data input SDA 6/28 FEDL610Q304-01 ML610Q304 Primary function Secondary function PAD No Pin name I/O Description Pin name I/O 6 P81/EXI1 I/O Input port/Output port / External interrupt SCL I/O 9 P82/EXI2 I/O ⎯ 10 P83/EXI3 I/O ⎯ 17 P84/EXI4 I/O 18 P85/EXI5 I/O 26 P86/EXI6 I/O 27 P87/EXI7 I/O Input port/Output port / External interrupt Input port/Output port / External interrupt Input port/Output port / External interrupt Input port/Output port / External interrupt Input port/Output port / External interrupt Input port/Output port / External interrupt Tertiary function Description I2C synchronous clock input/output Pin name I/O SCK0 I/O ⎯ ⎯ SOUT0 O ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ SIN1 I ⎯ ⎯ ⎯ SCK1 I/O RXD0 I SOUT1 O TXD0 O ⎯ ⎯ UART0 data input UART0 data output Description SSIO0 synchronous clock input/output SSIO0 data output ⎯ SSIO1 data input SSIO1 synchronous clock input/output SSIO1 data output ⎯ Note: The function which is not chosen is lost when either a secondary function or a tertiary function is chosen. However, when using it as an input, read-out of an input data is possible at a PnD 7/28 FEDL610Q304-01 ML610Q304 ■PIN DESCRIPTION In the I/O column, “—” denotes an input pin, “I” an input pin, “O” an output pin, and “I/O” an input/output pin. Pin name I/O Description — — — — — — Negative power supply pin Positive power supply pin Positive power supply pin for internal logic (internally generated) Negative power supply pin for built-in speaker amplifier Positive power supply pin for built-in speaker amplifier Primary/ Secondary/ Tertiary Logic — — — — — — — — — — — — — — Negative — Negative Secondary — Secondary — Primary Positive Primary Positive Primary Positive Power supply VSS VDD VDDL SPVSS SPVDD VREF Reference power supply pin for successive-approximation type ADC Test TEST0 TEST1_N I/O Input/output pin for testing. Has a pull-down resistor built in. I Input pin for testing. Has a pull-up resistor built in. Positive System RESET_N I LSCLK O OUTCLK O Reset input pin. When this pin is set to a “L” level, the device is placed in system reset mode and the internal circuit is initialized. If after that this pin is set to a “H” level, program execution starts. This pin has a pull-up resistor built in. Low-speed clock output. This function is allocated to the secondary function of the P20 pin. High-speed clock output. This function is allocated to the secondary function of the P21 pin. General-purpose Output port General-purpose output ports. P20 to P22 O Provided with a secondary function. Cannot be used as ports if their secondary function is used. General-purpose Input/output port General-purpose input/output ports. P40 to P42 I/O Provided with a tertiary function. Cannot be used as ports if their tertiary function is used. General-purpose input/output ports. Provided with a secondary function or a tertiary function. Cannot P80 to P87 I/O be used as ports if their secondary function or tertiary function is used. 8/28 FEDL610Q304-01 ML610Q304 Pin name I/O Description Primary/ Secondary/ Tertiary Logic Tertiary Positive Tertiary — Tertiary Positive Tertiary Positive Tertiary — Tertiary Positive Secondary Positive Secondary Positive Secondary Positive Secondary Positive Primary Positive/ Negative Primary Positive/ Negative Primary Positive/ Negative — — — — Primary Positive/ Negative Synchronous serial (SSIO) SIN0 SCK0 SOUT0 SIN1 SCK1 SOUT1 Synchronous serial data input pin. Allocated to the tertiary function of the P40 pin and P80 pin. Synchronous serial clock input/output pin. Allocated to the I/O tertiary function of the P41 pin and P81 pin. Synchronous serial data output pin. Allocated to the tertiary O function of the P42 pin and P82 pin. Synchronous serial data input pin. Allocated to the tertiary I function of the P84 pin. Synchronous serial clock input/output pin. Allocated to the I/O tertiary function of the P85 pin. Synchronous serial data output pin. Allocated to the tertiary O function of the P86 pin. I 2 I C bus interface 2 SDA SCL I C data input/output pin. This pin is used as the secondary function of the P80 pin. This pin has an NMOS open drain I/O 2 output. When using this pin as a function of the I C, externally connect a pull-up resistor. 2 I C clock output pin. This pin is used as the secondary function of the P81 pin. This pin has an NMOS open drain output. When I/O 2 using this pin as a function of the I C, externally connect a pull-up resistor. UART TXD0 O RXD0 I UART0 data output pin. Allocated to the secondary function of the P87 pin. UART0 data input pin. Allocated to the the secondary function of the P86 pin. External interrupt NMI I EXI0 to 7 I External non-maskable interrupt input pin. The interrupt occurs on both the rising and falling edges. External maskable interrupt input pins. It is possible, for each bit, to specify whether the interrupt is enabled and select the interrupt edge by software. Allocated to the primary function of the P80 to P87 pins. LED drive LED0 to 2 O Pins for LED driving. Allocated to the primary function of the P20 to P22 pins. Voice output function SPP O Positive output pin of the internal speaker amplifier. SPM O Negative output pin of the internal speaker amplifier. Successive-approximation type A/D converter Analog inputs to Ch0 to Ch2 of the successive-approximation AIN0 to 2 I type A/D converter. Allocated to the primary function of the P40 to P42 pins. 9/28 FEDL610Q304-01 ML610Q304 ■TERMINATION OF UNUSED PINS ●How to Terminate Unused Pins Pin RESET_N TEST0 TEST1_N VREF P40 to P42 (AIN0 to AIN2) SPVDD SPVSS SPP SPM P20 to P22 P80 to P87 NMI Recommended pin termination Open Open Open Connect to VDD Open Connect to VDD Connect to VSS Open Open Open Open Open Note: For unused input ports or unused input/output ports, if the corresponding pins are configured as high-impedance inputs and left open, the supply current may become excessively large. Therefore, it is recommended to configure those pins as either inputs with a pull-down resistor/pull-up resistor or outputs. 10/28 FEDL610Q304-01 ML610Q304 ■ELECTRICAL CHARACTERISTICS ●Absolute Maximum Ratings (VSS= SPVSS=0V) Parameter Symbol Condition Rating Unit Power supply voltage 1 VDD Ta=25°C −0.3 to +7.0 V Power supply voltage 2 SPVDD Ta=25°C −0.3 to +7.0 V Power supply voltage 3 VDDL Ta=25°C −0.3 to +3.6 V Reference supply voltage VREF Ta=25°C −0.3 to VDD+0.3 V VIN Ta=25°C −0.3 to VDD+0.3 V Output voltage VOUT Ta=25°C −0.3 to VDD+0.3 V Output current 1 IOUT1 Port 4,8, Ta=25°C −12 to +11 mA Output current 2 Input voltage IOUT2 Port 2, Ta=25°C −12 to +20 mA Power dissipation PD Ta=25°C 1.0 W Storage temperature TSTG ― −55 to +150 °C ●Recommended Operating Conditions (VSS= SPVSS=0V) Parameter Operating temperature Operating voltage Reference supply voltage Operating frequency (CPU) Capacitor externally connected to VDDL pin Symbol Condition Range Unit °C TOP ― −40 to +85 VDD ― 2.0 to 5.5 SPVDD ― 2.0 to 5.5 VREF ― 2.2 to VDD V fOP VDD = 2.0 to 5.5V VDD = 2.2 to 5.5V 27k to 4.2M 4.2M to 8.4M Hz CL ― 10±30% µF V 11/28 FEDL610Q304-01 ML610Q304 ●Operating Conditions of Flash Memory Parameter Symbol Operating temperature TOP Operating voltage VDD CEPD CEPP YDR Maximum rewrite count Write cycles Condition At write/erase (Data flash area) At write/erase (Program code area) At write/erase Data flash area(512Byte x 4) Program code area ― (VSS= SPVSS=0V) Unit Range -40 to +85 °C 0 to +40 2.2 to 5.5 6,000 100 10 V cycles years ●DC Characteristics (1 of 5) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) (1/5) Measuring Rating Parameter Symbol Condition Unit circuit Min. Typ. Max. High-speed oscillation start time ― ― 1.0 3.0 ms TXTH Typ Typ Ta = −10 to +50°C -1.5% +1.5% Built-in RC oscillation frequency kHz 32.768 fLCR Typ Typ Ta = −40 to +85°C 1 +3.0% -3.0% Typ Typ 4.098 Ta = −10 to +50°C -1.5% +1.5% Source oscillation frequency MHz or fHPLL Typ Typ 8.192 Ta = −40 to +85°C +3.0% -3.0% ●DC Characteristics (2 of 5) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) (2/5) Rating Symbol Condition Unit Parameter Min. Typ. Max. SPM, SPP output load resistance RLSP ― 8 — — Ω PSPO1 SPVDD=3.0V, f=1kHz RSPO=8Ω, THD≥10% — 0.45 — W PSPO2 SPVDD=5.0V, f=1kHz RSPO=8Ω, THD≥10% — 1.0 — W Speaker amp output power 12/28 FEDL610Q304-01 ML610Q304 ●DC Characteristics (3 of 5) Parameter Supply current 1 Supply current 2 Supply current 3 Supply current 4 Supply current 5 (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) (3/5) Rating Measuring Symbol Condition Unit circuit Min. Typ. Max. CPU: In STOP state. Ta≦+50°C ― 0.5 3.0 high-speed oscillation: IDD1 Ta≦+85°C ― 0.5 8.0 stopped IDD2 IDD3 IDD4 IDD5 CPU: In HALT state Ta≦+50°C (LTBC,WDT: Operating) High-speed oscillation: Ta≦+85°C Stopped 1 CPU: Running at 32.768 kHz* High-speed oscillation: Stopped VDD=SPVDD= 3.0V CPU: Running at 4.096MHz CR oscillating mode VDD=SPVDD= 5.0V VDD=SPVDD= 3.0V CPU: Running at 8.192MHz CR oscillating mode VDD=SPVDD= 5.0V CPU: Running at 4.096MHz CR oscillating mode During voice playback of 1KHz,0db,SIN-wave (no output load) CPU: Running at 8.192MHz CR oscillating mode During voice playback of 1KHz,0db,SIN-wave (no output load) ― 2.7 5.0 ― 2.7 10 ― 20 30 ― 3.0 5.0 ― 3.0 5.0 ― 4.0 6.0 ― 4.0 6.0 VDD=SPVDD= 3.0V ― 4.0 7.0 VDD=SPVDD= 5.0V ― 6.0 10 VDD=SPVDD= 3.0V ― 5.0 8.0 ― 7.0 11 VDD=SPVDD= 5.0V *1: Case when the CPU operating rate is 100% (no HALT state). µA 1 mA 13/28 FEDL610Q304-01 ML610Q304 ●DC Characteristics (4 of 5) Parameter Output voltage 1 (P20 to P22) (P40 to P42) (P80 to P87) Output voltage 2 (P20 to P22) Output voltage 3 (P80 to P81) Output leakage (P20 to P22) (P40 to P42) (P80 to P87) Input current 1 (RESET_N) (TEST1_N) Input current 2 (NMI) (P40 to P42) (P80 to P87) Input current 3 (TEST0) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) (4/5) Rating Measuring Symbol Condition Unit circuit Min. Typ. Max. VOH1 IOH1=−0.5mA VDD −0.5 ― ― VOL1 IOL1=+0.5mA ― ― 0.5 ― ― 0.5 ― ― 0.5 VOL2 (when LED drive mode is selected) IOL2=+5mA VDD≧2.2V IOL2=+8mA VDD≧2.3V VOL3 IOL3=+3mA 2 ( I C bus input/output mode) ― ― 0.4 IOOH VOH=VDD (in high-impedance state) ― ― 1.0 IOOL VOL=VSS (in high-impedance state) −1.0 ― ― IIH1 VIH1=VDD 0 ― 1.0 IIL1 VIL1=VSS −1500 −300 −20 IIH2 VIH2=VDD (when pulled-down) 2 30 250 IIL2 VIL2=VSS (when pulled-up) −250 −30 −2 IIH2Z VIH2=VDD (in high-impedance state) ― ― 1.0 IIL2Z VIL2=VSS (in high-impedance state) −1.0 ― ― IIH3 VIH3=VDD 20 300 1500 IIL3 VIL3=VSS −1.0 ― ― V 2 µA 3 µA 4 14/28 FEDL610Q304-01 ML610Q304 ●DC Characteristics (5 of 5) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) (5/5) Rating Measuring Symbol Condition Unit circuit Min. Typ. Max. Parameter Input voltage 1 (RESET_N) (TEST0) (TEST1_N) (NMI) (P40 to P42) (P80 to P87) Hysteresis width (RESET_N) (TEST0) (TEST1_N) (NMI) (P40 to P42) (P80 to P87) Input pin capacitance (NMI) (P40 to P42) (P80 to P87) VIH1 ― 0.7×VDD ― VDD VIL1 ― 0 ― 0.3×VDD ⊿VT ― 0.05×VDD ― 0.4×VDD CIN f=10kHz Vrms=50mV Ta=25°C ― ― 10 V 5 pF ― ●Hysteresis Width Input signal ⊿VT VDD VSS Internal signal VDDL VSS 15/28 FEDL610Q304-01 ML610Q304 ●Measuring Circuits ・Measuring circuit 1 VDD VREF SPVDD VDDL SPVSS CL CAV CSV A VSS CV CSV CAV CL CV :0.1µF :0.1µF :1.0µF : 10µF ・Measuring circuit 2 (* 2) VIH Output pins VIL Input pins (* 1) VDD VDDL VREF SPVDD VSS V SPVSS (* 1) Input logic circuit to determine the specified measuring conditions. (* 2) Measured at the specified output pins. 16/28 FEDL610Q304-01 ML610Q304 ・Measuring circuit 3 (* 2) VIH Output pins Input pins (* 1) VIL VDD VDDL VREF SPVDD VSS A SPVSS (* 1) Input logic circuit to determine the specified measuring conditions. (* 2) Measured at the specified output pins. ・Measuring circuit 4 (* 3) Output pins Input pins A VDD VDDL VREF SPVDD VSS SPVSS (* 3) Measured at the specified output pins. ・Measuring circuit 5 Output pins VIL Input pins (* 1) VDD VDDL VREF SPVDD VSS Waveform monitoring VIH SPVSS (* 1) Input logic circuit to determine the specified measuring conditions. 17/28 FEDL610Q304-01 ML610Q304 ●AC Characteristics (Reset) ・Reset (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Measuring Rating Parameter Symbol Condition Unit circuit Min. Typ. Max. Time until it starts SPVDD after ― ― 0 tVDD ― ns starting VDD Reset pulse width PRST ― 100 ― ― µs 1 Reset noise elimination pulse width PNRST ― ― ― 0.4 Power-on reset activation TPOR ― ― ― 10 ms power rise time VIL1 RESET_N VIL1 PRST RESET_N Pin Reset 0.9×VDD VDD 0.1×VDD TPOR Power on reset 18/28 FEDL610Q304-01 ML610Q304 ・AC Characteristics (Oscillation stable time after STOP release) Parameter (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Symbol Condition Unit Min. Typ. Max. Oscillation stable time after STOP release TPUP1 ― High-speed oscillation waveform 2 High-speed oscillation waveform ― ― ms High-speed oscillation waveform TPUP1 OSCLK, HSCLK SYSCLK OSCLK, HSCLK waveform OSCLK, HSCLK waveform HSCLK waveform HSCLK waveform Interruput request Program operation mode STOP mode Program operation mode ・AC Characteristics (External Interrupt) Parameter (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Symbol Condition Unit Min. Typ. Max. External interrupt disable period TNUL Interrupt: Enabled (MIE=1) CPU: NOP operation 2.5×sysclk ― 3.5×sysclk µs P80 to P87 (Rising-edge interrupt) tNUL P80 to P87 (Falling-edge interrupt) tNUL NMI, P80 to P87 (Both-edge interrupt) tNUL 19/28 FEDL610Q304-01 ML610Q304 ・AC Characteristics (Synchronous Serial Port) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. When high-speed oscillation is not 10 ― ― µs SCLK input cycle active tSCYC (slave mode) When high-speed oscillation is active 500 ― ― ns VDD≧2.4V ― 4 ― SCLK output cycle MHz tSCYC (master mode) VDD≧2.0V ― 2 ― When high-speed oscillation is not 4 ― ― µs SCLK input pulse width active tSW (slave mode) When high-speed oscillation is active 200 ― ― ns 1 1 1 SCLK* SCLK* SCLK* SCLK output pulse width s ― tSW (master mode) ×0.4 ×0.5 ×0.6 SOUT output delay time tSD ― ― ― 180 ns (slave mode) SOUT output delay time tSD ― ― ― 80 ns (master mode) SIN input setup time tSS ― 50 ― ― ns (slave mode) SIN input tSH ― 50 ― ― ns hold time *1: Clock period selected with S0CK3–0 of the serial port 0 mode register (SIO0MOD1) tSCYC tSW tSW SCK0* tSD tSD SOUT0* tSS tSH SIN0* *: Indicates the secondary function of the port. 20/28 FEDL610Q304-01 ML610Q304 ・AC Characteristics (I2C Bus Interface: Standard Mode 100kHz) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. SCL clock frequency ⎯ 0 ⎯ 100 kHz fSCL SCL hold time tHD:STA ⎯ 4.0 ⎯ ⎯ µs (start/restart condition) SCL ”L” level time tLOW ⎯ 4.7 ⎯ ⎯ µs SCL ”H” level time tHIGH ⎯ 4.0 ⎯ ⎯ µs SCL setup time tSU:STA ⎯ 4.7 ⎯ ⎯ µs (restart condition) SDA hold time tHD:DAT ⎯ 0 ⎯ ⎯ µs SDA setup time tSU:DAT ⎯ 0.25 ⎯ ⎯ µs SDA setup time tSU:STO ⎯ 4.0 ⎯ ⎯ µs (stop condition) Bus-free time tBUF ⎯ 4.7 ⎯ ⎯ µs ・AC Characteristics (I2C Bus Interface: Fast Mode 400kHz) (VDD= 2.0 to 5.5V, SPVDD=2.0 to 5.5V, VSS= SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. SCL clock frequency fSCL ⎯ 0 ⎯ 400 kHz SCL hold time tHD:STA ⎯ 0.6 ⎯ ⎯ µs (start/restart condition) SCL ”L” level time tLOW ⎯ 1.3 ⎯ ⎯ µs SCL ”H” level time ⎯ 0.6 ⎯ ⎯ µs tHIGH SCL setup time tSU:STA ⎯ 0.6 ⎯ ⎯ µs (restart condition) SDA hold time tHD:DAT ⎯ 0 ⎯ ⎯ µs SDA setup time tSU:DAT ⎯ 0.1 ⎯ ⎯ µs SDA setup time tSU:STO ⎯ 0.6 ⎯ ⎯ µs (stop condition) Bus-free time tBUF ⎯ 1.3 ⎯ ⎯ µs Start condition Restart condition Stop condition P80/SDA P81/SCL tHD:STA tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO tBUF 21/28 FEDL610Q304-01 ML610Q304 ●Electrical Characteristics of Successive Approximation Type A/D Converter (DVDD=SPVDD=2.2 to 5.5V, VREF=2.2 to 5.5V, VSS=SPVSS=0V, Ta=−40 to +85°C, unless otherwise specified) Rating Parameter Symbol Condition Unit Min. Typ. Max. Resolution n ― ― ― 10 bit 2.7V≦VREF≦5.5V −4 ― +4 Integral non-linearity error IDL 2.2V≦VREF≦2.7V −5 ― +5 2.7V≦VREF≦5.5V −3 ― +3 Differential non-linearity error LSB DNL 2.2V≦VREF≦2.7V −4 ― +4 Zero-scale error VOFF RI≦5kΩ −4 ― +4 Full-scale error FSE RI≦5kΩ −4 ― +4 Input impedance RI ― ― ― 5k Ω Reference supply voltage VREF ― 2.2 VDD V Conversion time tCONV HSCLK=4M to 8.4MHz ― 102 ― φ/CH φ: Period of high-speed clock (HSCLK) Reference supply voltage VREF VDD VDDL 1µF 10µF A − 0.1µF Analog input RI≦5kΩ + 0.1µF AIN0 to AIN2 VSS 22/28 FEDL610Q304-01 ML610Q304 ●Power-on/Shutdown Sequence ・When the power rise time is 10 ms or less Upon power-on Upon shutdown VDD 0V SPVDD 0V tVDD ・When the power rise time is more than 10 ms Upon power-on VDD Upon shutdown 90% tVDD SPVDD RESET_N 0V 90% 10 ms (min.) 0V VIL Recommended power-on/shutdown sequence 1 Turn on VDD and SPVDD simultaneously, or turn on SPVDD after turning on VDD. 2 Turn off VDD and SPVDD simultaneously, or turn off VDD after turning on SPVDD. 23/28 FEDL610Q304-01 ML610Q304 ■Example of Application Circuit Supply voltage SPVDD uEASE I/F SPVss VDD UVDD_O VTref RESET_N TEST Vss CSV CV TEST1_N TEST0 Speaker SPP ML610Q304 SPM RESET_N CL VDDL NMI RXD0 P86 TXD0 P87 P40/AIN0 to P42/AIN2 ANALOG VREF CAV VSS VSS P20 to P22 LED CV CL CAV CSV : 0.1uF : 10uF : 1uF : 0.1uF 24/28 FEDL610Q304-01 ML610Q304 ■ PACKAGE DIMENSIONS [Unit:mm] Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact our responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). The heat resistance (example) of this LSI is shown below. Heat resistance (θJa) changes with the size and the number of layers of a substrate. PCB W/L/t=60 / 62 / 1.6(mm) PCB Layer 1 Layers Air cooling conditions Calm(0m/sec) Heat resistance(θJa) 56.6[℃/W]( back diepad contact) Power consumption of Chip PMax 0.351[W] TjMax of this LSI is 125℃. TjMax is expressed with the following formulas. TjMax = TaMax + θJa × PMax 25/28 FEDL610Q304-01 ML610Q304 ■Figure pf soldering department terminal existence range Reference drawing [Unit:mm] Attention of the layout of a mounting board Please take into consideration enough that there are not ease of a mounting, the reliability of contact, leading about of a wiring, and a solder bridge generate in the case of layout of the foot pattern of a mounting board. The optimal layout of a foot pattern changes by the board quality of material, the solder paste category to be used, thickness, the soldering methodology, etc. Therefore, since the span where the terminator of this package may exist is shown as a "soldering part terminator extent drawing", please give as reference data of a foot pattern design. 26/28 FEDL610Q304-01 ML610Q304 ■Revision History Page Document No. Date FEDL610Q304-01 Jul 16,2014 Previous Edition ― Current Edition ― Description Final edition 1 27/28 FEDL610Q304-01 ML610Q304 NOTES No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd. The content specified herein is subject to change for improvement without notice. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. 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