Renesas M16C623FG Single-chip 16-bit cmos microcomputer Datasheet

To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Mitsubishi microcomputers
Description
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
The M16C/62M (80-pin version) group (low voltage version) of single-chip microcomputers are built using
the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in
a 80-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions
featuring a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing instructions at high speed. They also feature a built-in multiplier and DMAC, making them ideal for
controlling office, communications, industrial equipment, and other high-speed processing applications.
The M16C/62M (80-pin version) group (low voltage version) includes a wide range of products with different
internal memory types and sizes and various package types.
Features
• Memory capacity .................................. ROM (See Figure 1.1.3. ROM Expansion)
RAM 10K to 20K bytes
• Shortest instruction execution time ...... 100ns (f(XIN)=10MHZ, VCC=2.7V to 3.6V)
142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V, with software one-wait)
• Supply voltage ..................................... 2.7V to 3.6V (f(XIN)=10MHZ, without software wait)
2.4V to 2.7V (f(XIN)= 7MHZ, without software wait)
2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait)
• Low power consumption ...................... 28.5mW ( f(XIN)=10MHZ, with software one-wait, VCC = 3V)
• Interrupts .............................................. 25 internal and 5 external interrupt sources, 4 software
interrupt sources; 7 levels (including key input interrupt)
• Multifunction 16-bit timer ...................... 5 output timers + 6 input timers (3 for timer function only)
• Serial I/O .............................................. 5 channels (2 for UART or clock synchronous, 1 for UART, 2 for clock synchronous)
• DMAC .................................................. 2 channels (trigger: 24 sources)
• A-D converter ....................................... 10 bits X 8 channels (Expandable up to 10 channels)
• D-A converter ....................................... 8 bits X 2 channels
• CRC calculation circuit ......................... 1 circuit
• Watchdog timer .................................... 1 line
• Programmable I/O ............................... 70 lines
_______
• Input port .............................................. 1 line (P85 shared with NMI pin)
• Clock generating circuit ....................... 2 built-in clock generation circuits
(built-in feedback resistor, and external ceramic or quartz oscillator)
Note: Memory expansion mode and microprocessor mode are not supported.
Applications
Audio, cameras, office equipment, communications equipment, portable equipment
1
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Description
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Pin Configuration
Figures 1.1.1 show the pin configurations (top view).
P33
P34
P35
P36
P37
P40
P41
P42
P22
P23
P24
P25
P26
P27
P30
P31
P32
P07
P20
P21
PIN CONFIGURATION (top view)
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P06
P05
P04
P03
61
40
P43
62
39
P50
63
38
64
37
P02
65
36
P01
P00
P107/AN7/KI3
P106/AN6/KI2
P105/AN5/KI1
P104/AN4/KI0
P103/AN3
P102/AN2
P101/AN1
AVSS
P100/AN0
VREF
AVcc
P97/ADTRG/SIN4
P96/ANEX1/SOUT4
66
35
67
34
68
33
P51
P52
P53
P54
P55
P56
P57/CLKOUT
P60/CTS0/RTS0
P61/CLK0
P62/RxD0
P63/TXD0
P64/CTS1/RTS1/CLKS1
P65/CLK1
P66/RxD1
P67/TXD1
32
69
M16C/62M (80-pin version) group
(low voltage version)
70
71
72
31
30
29
73
28
74
27
75
26
76
25
77
24
78
23
79
22
80
21
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20
P95/ANEX0/CLK4
P94/DA1/TB4IN
P93/DA0/TB3IN
P92/TB2IN/SOUT3
P90/TB0IN/CLK3
CNVss(BYTE)
P87/XCIN
P86/XCOUT
RESET
XOUT
VSS
XIN
VCC
P85/NMI
P84/INT2
P83/INT1
P82/INT0
P81/TA4IN
P80/TA4OUT
P77/TA3IN
1
P70/TxD2/SDA/TA0OUT
P71/RxD2/SCL/TA0IN/TB5IN
P76/TA3OUT
Package: 80P6S-A
Figure 1.1.1. Pin configuration (top view)
2
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Description
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Block Diagram
Figure 1.1.2 is a block diagram of the M16C/62M (80-pin version) group (low voltage version).
Block diagram of the M16C/62M (80-pin version) group (low voltage version)
8
I/O ports
Port P0
Port P2
8
4
Port P3
8
8
Port P4
Port P5
Port P6
UART/clock synchronous SI/O
Clock synchronous SI/O
(8 bits X 3 channels)(Note 3)
CRC arithmetic circuit (CCITT )
(Polynomial : X16+X12+X5+1)
M16C/60 series16-bit CPU core
Registers
(15 bits)
Flag register
FLG
RAM
(Note 2)
Multiplier
8
SB
Stack pointer
ISP
USP
ROM
(Note 1)
Port P10
D-A converter
(8 bits X 2 channels)
PC
Vector table
INTB
Memory
7
DMAC
(2 channels)
Program counter
AAAAAA
AAAAAA
AAAAAA
AAAAAA
AAAAAA
AAAA
AAAA
Port P9
Watchdog timer
R0H
R0L
R0H
R0L
R1H
R1L
R1H
R1L
R2
R2
R3
R3
A0
A0
A1
A1
FB
FB
(8 bits X 2 channels)
7
Expandable up to 10 channels)
4
Timer TA0 (16 bits)
Timer TA1 (16 bits)
Timer TA2 (16 bits)
Timer TA3 (16 bits)
Timer TA4 (16 bits)
Timer TB0 (16 bits)
Timer TB1 (16 bits)
Timer TB2 (16 bits)
Timer TB3 (16 bits)
Timer TB4 (16 bits)
Timer TB5 (16 bits)
System clock generator
XIN-XOUT
XCIN-XCOUT
A-D converter
Port P85
(10 bits X 8 channels
Port P8
Timer
Port P7
Internal peripheral functions
8
Note 1: ROM size depends on MCU type.
Note 2: RAM size depends on MCU type.
Note 3: One of three channels is used for UART and IIC mode only.
Figure 1.1.2. Block diagram of M16C/62M (80-pin version) group (low voltage version)
3
Mitsubishi microcomputers
Description
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Performance Outline
Table 1.1.1 is a performance outline of M16C/62M (80-pin version) group (low voltage version).
Table 1.1.1. Performance outline of M16C/62M (80-pin version) group (low voltage version)
Item
Performance
Number of basic instructions
91 instructions
Shortest instruction execution time
100ns(f(XIN)=10MHZ, VCC=2.7V to 3.6V)
142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V, with software onewait)
Memory
ROM
(See the figure 1.1.3. ROM Expansion)
capacity
RAM
10K to 20K bytes
I/O port
P0 to P10 (except P85)
8 bits x 6, 7 bits x 2, 4 bits x 2
Input port
P85
1 bit x 1
Multifunction TA0, TA3, TA4
16 bits x 3 (timer mode, internal/external event count,
timer
one-shot timer mode and pulse width measurement mode)
TB0, TB2, TB3, TB4, TB5
16 bits x 5 (timer mode, internal/external event count
and pulse period/pulse width measurement mode)
TA1, TA2
16 bits x 2 (timer mode, internal event count and
a trigger through one-shot timer mode occurs.)
TB1
16 bits x 1 (timer mode and internal event count)
Serial I/O
UART0, UART1, UART2
(UART or clock synchronous) x 2, UART x 1(UART2)
SI/O3, SI/O4
(Clock synchronous) x 2 (SI/O3 is output only)
A-D converter
10 bits x (8 + 2) channels
D-A converter
8 bits x 2
DMAC
2 channels (trigger: 24 sources)
CRC calculation circuit
CRC-CCITT
Watchdog timer
15 bits x 1 (with prescaler)
Interrupt
25 internal and 5 external sources, 4 software sources, 7 levels
Clock generating circuit
2 built-in clock generation circuits
(built-in feedback resistor, and external ceramic or quartz oscillator)
Supply voltage
2.7V to 3.6V (f(XIN)=10MHZ, without software wait)
2.4V to 2.7V (f(XIN)= 7MHZ, without software wait)
2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait)
Power consumption
28.5mW (f(XIN) = 10MHZ, VCC=3V with software one-wait)
I/O
I/O withstand voltage
3V
characteristics Output current
1mA
Device configuration
CMOS high performance silicon gate
Package
80-pin plastic mold QFP
Note : M16C/62M (80-pin version) group (low voltage version) does not support memory expansion or
microprocessor mode.
4
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Description
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Mitsubishi plans to release the following products in the M16C/62M (80-pin version) group (low voltage
version):
(1) Support for mask ROM version and flash memory version
(2) ROM capacity
(3) Package
80P6S-A
: Plastic molded QFP (mask ROM and flash memory versions)
ROM Size
(Byte)
External
ROM
256K
M30625MGM-XXXGP
M30625FGMGP
128K
M30621MCM-XXXGP
M30621FCMGP
96K
80K
64K
32K
Mask ROM version
Flash memory version
Figure 1.1.3. ROM expansion
The M16C/62M (80-pin version) group (low voltage version) products currently supported are listed in Table
1.1.2.
Table 1.1.2. M16C/62M (80-pin version) group (low voltage version)
As of April 2002
Type No
ROM capacity
RAM capacity
Package type
M30621MCM-XXXGP
128 Kbytes
10 Kbytes
80P6S-A
M30625MGM-XXXGP
256 Kbytes
20 Kbytes
80P6S-A
M30621FCMGP
128 Kbytes
10 Kbytes
80P6S-A
M30625FGMGP
256 Kbytes
20 Kbytes
80P6S-A
Remarks
mask ROM version
Flash memory 3V version
5
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Description
Type No.
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
M30623 M C M– XXX GP
Package type:
GP : Package
80P6S-A
ROM No.
Omitted for flash memory version
ROM capacity:
C : 128K bytes
G: 256K bytes
Memory type:
M : Mask ROM version
F : Flash memory version
Shows RAM capacity, pin count, etc
(The value itself has no specific meaning)
M16C/62 Group
M16C Family
Figure 1.1.4. Type No., memory size, and package
6
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Description
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
About the M16C/62M (80-pin version) group (low voltage version)
The M16C/62M (80-pin version) group (low voltage version) is packaged in a 80-pin plastic mold package. The number of pins in comparison with the 100-pin package products is decreased. So be careful
about the following.
(a) The M16C/62M (80-pin version) group (low voltage version) supports single chip mode alone. It
supports neither memory expansion mode nor microprocessor mode.
(b) The input/output ports given below are absent from the M16C/62M (80-pin version) group (low
voltage version). To stabilize the internal state, set to output mode the direction register of each
input/output port. Failing in setting to output mode involves an increase in current consumption.
<Pins absent from the 80-pin version>
P10 to P17, P44 to P47, P72 to P75, P91
(c) INT3 to INT5 allocated to P15 to P17 cannot be used. Keep the INT3 interrupt control register
disabled for interrupts. The INT4 interrupt control register and the INT5 interrupt control register
are shared with SI/O3 and SI/O4. When the user don’t use them as SI/O3 and SI/4, set them
disabled for interrupts.
(d) The output pins of timers A1 and A2 - TA1IN, TA1OUT, TA2IN and TA2OUT - allocated to P72 to P75
cannot be used. In connection with this, the gate function and pulse outputting function of timers A1
and A2 cannot be used. Use timer mode and internal event count, or use as trigger signal generation in one-shot timer mode.
______
______
(e) The UART2 input/output pins - CLK2 and CTS/RTS - allocated to P72 and P73 cannot be used. In
connection with this, UART2 solely as UART of the internal clock can be used.
(f) The input pin TB1IN of timer B1 allocated to P91 cannot be used. With timer B1 under this state, use
only timer mode or the internal event count.
(g) The input pin SIN3 of serial I/O3 allocated to P91 cannot be used. In connection with this, use serial
I/O3 as a serial I/O exclusive to transmission.
(h) The output pins for three-phase motor control allocated to P72 to P75 cannot be used. So set to 0
(ordinary mode) the mode select bit (bit 2) of three-phase PWM control register 0.
7
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Electrical characteristics (Vcc = 3V)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Table 1.20.1. Absolute maximum ratings
Parameter
Symbol
Vcc
AVcc
VI
VO
Pd
Topr
Tstg
Supply voltage
Analog supply voltage
RESET, CNVSS (BYTE)
Input
P00 to P07, P20 to P27,
voltage
P30 to P37, P40 to P43, P50 to P57,
P60 to P67, P76 to P77, P80 to P87,
P90, P92 to P97, P100 to P107,
VREF, XIN
P70, P71
Output
P00 to P07, P20 to P27,
voltage
P30 to P37,P40 to P43, P50 to P57,
P60 to P67,P76 to P77, P80 to P84,
P86, P87, P90, P92 to P97,
P100 to P107, XOUT
P70, P71
Power dissipation
Operating ambient temperature
Storage temperature
Note: Specify a product of -40 to 85°C to use it.
8
Condition
Rated value
VCC=AVCC
VCC=AVCC
-0.3 to 4.6
Unit
V
-0.3 to 4.6
V
-0.3 to Vcc+0.3
V
-0.3 to 4.6
V
-0.3 to Vcc+0.3
V
-0.3 to 4.6
V
300
-20 to 85 / -40 to 85(Note)
-65 to 150
mW
C
C
Ta=25
C
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Electrical characteristics (Vcc = 3V)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Table 1.20.2. Recommended operating conditions (referenced to VCC = 2.2V to 3.6V at Ta = – 20oC
to 85oC / – 40oC to 85oC(Note3) unless otherwise specified)
Symbol
Parameter
Min.
2.2
Vcc
AVcc
Vss
Supply voltage
Analog supply voltage
Supply voltage
AVss
Analog supply voltage
P00 to P07, P20 to P27,
HIGH input
P30 to P37, P40 to P43, P50 to P57, P60 to P67,
voltage
P76, P77, P80 to P87,P90, P92 to P97, P100 to P107,
XIN, RESET, CNVSS (BYTE)
VIH
P70 , P71
I OH (peak)
I OH (avg)
I OL (peak)
I OL (avg)
f (XIN)
P00 to P07, P20 to P27, P30 to P37,
P40 to P43, P50 to P57, P60 to P67, P70, P71,P76, P77,
P80 to P87, P90, P92 to P97, P100 to P107,
XIN, RESET, CNVSS (BYTE)
P00 to P07, P20 to P27,P30 to P37,
HIGH peak output
current
P40 to P43, P50 to P57, P60 to P67, P76, P77,
P80 to P84, P86, P87, P90, P92 to P97, P100 to P107
HIGH average output P00 to P07, P20 to P27, P30 to P37,
current
P40 to P43, P50 to P57, P60 to P67, P76, P77,
P80 to P84, P86, P87, P90, P92 to P97, P100 to P107
P00 to P07, P20 to P27,P30 to P37,
LOW peak output
current
P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77
P80 to P84, P86, P87, P90, P92 to P97, P100 to P107
P00 to P07, P20 to P27,P30 to P37,
LOW average
output current
P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77
P80 to P84, P86, P87, P90, P92 to P97, P100 to P107
Main clock input
oscillation
frequency (Note 5)
f (XcIN)
Unit
V
V
V
V
0.8Vcc
Vcc
V
0.8Vcc
4.6
V
0
0.2Vcc
V
–10.0
mA
–5.0
mA
10.0
mA
5.0
mA
Vcc=2.7V to 3.6V
0
Vcc=2.4V to 2.7V
0
10
MHz
10 X Vcc
MHz
–17
17.5 X Vcc
MHz
–35
No wait
with wait
Max.
3.6
0
LOW input
voltage
VIL
Standard
Typ.
3.0
Vcc
0
Vcc=2.2V to 2.4V
0
Vcc=2.7V to 3.6V
0
Vcc=2.2V to 2.7V
0
Subclock oscillation frequency
32.768
10
6 X Vcc
–6.2
MHz
50
kHz
MHz
Note 1: The mean output current is the mean value within 100ms.
Note 2: The total IOL (peak) for all ports must be 80mA max. The total IOH (peak) for all ports must be 80mA max.
Note 3: Specify a product of –40°C to 85°C to use it.
Note 4: Relationship between main clock oscillation frequency and supply voltage.
10.0
7.0
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
10 X VCC –17MHZ
17.5 X VCC
–35MHZ
3.5
0.0
2.2
2.4
2.7
Supply voltage[V]
(BCLK: no division)
3.6
Main clock input oscillation frequency
(With wait)
Operating maximum frequency [MHZ]
Operating maximum frequency [MHZ]
Main clock input oscillation frequency
(No wait)
10.0
7.0
0.0
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
AAAAAAA
6 X VCC –6.2MHZ
2.2
2.4
2.7
Flash memory version program voltage and read
operation voltage characteristics
Flash program voltage
Flash read operation voltage
VCC=2.7V to 3.6V
VCC=2.4V to 3.6V
VCC=2.7V to 3.4V
VCC=2.2V to 2.4V
3.6
Supply voltage[V]
(BCLK: no division)
Note 5: Execute case without wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 6.25 MHz.
Execute case with wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 10.0 MHz.
9
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Electrical characteristics (Vcc = 3V)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
Table 1.20.3. A-D conversion characteristics (referenced to VCC = AVCC = VREF = 2.4V to 3.6V, VSS =
AVSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless otherwise
specified)
Symbol
Parameter
Resolution
Absolute accuracy, sample & hold function not available (8 bit)
VREF = VCC
10
10
±2
40
9.8
VCC
µs
0.3
2.4
VCC
µs
V
0
VREF
V
Ladder resistance
VREF = VCC
tCONV
Conversion time(8bit), sample & hold
function not available
Sampling time
Reference voltage
Analog input voltage
VREF = VCC = 3V, φAD =
f(XIN) =fAD/2 = 5MHz
VREF
VIA
Unit
VREF = VCC = 3V, φAD = f(X IN)/2
R LADDER
tSAMP
Standard
Min. Typ. Max
Measuring condition
Bits
LSB
kΩ
Note 1: Connect AV CC pin to V CC pin and apply the same electric potential.
Note 2: Specify a product of -40°C to 85°C to use it.
Table 1.20.4. D-A conversion characteristics (referenced to VCC = 2.4V to 3.6V, VSS = AVSS = 0V,
VREF = 3V, at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless
otherwise specified)
Symbol
tsu
RO
IVREF
Parameter
Measuring condition
Resolution
Absolute accuracy
Setup time
Output resistance
Reference power supply input current
Min.
4
Standard
Typ. Max.
10
(Note )
8
1.0
3
20
1.5
Unit
Bits
%
µs
kΩ
mA
Note 1: This applies when using one D-A converter, with the D-A register for the unused D-A converter set to
“0016”.
The A-D converter's ladder resistance is not included.
Also, when DA register contents are not “00”, the current I VREF always flows even though Vref may have
been set to be unconnected by the A-D control register.
Note 2: Specify a product of -40°C to 85°C to use it.
Table 1.20.5. Flash memory version electrical characteristics
(referenced to VCC = 2.7V to 3.6V, at Ta =0oC to 60oC unless otherwise specified)
Parameter
Min.
Page program time
Block erase time
Erase all unlocked blocks time
Standard
Typ.
Unit
6
120
ms
50
600
ms
50 X n (Note)
600 X n (Note)
ms
120
ms
6
Lock bit program time
Max
Note : n denotes the number of block erases.
Table 1.20.6. Flash memory version program voltage and read operation voltage characteristics
(Ta =0oC to 60oC)
10
Flash program voltage
Flash read operation voltage
VCC=2.7V to 3.6V
VCC=2.4V to 3.6V
VCC=2.7V to 3.4V
VCC=2.2V to 2.4V
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Electrical characteristics (Vcc = 3V)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
Table 1.20.7. Electrical characteristics (referenced to VCC = 2.7V to 3.6V, VSS = 0V at Ta = – 20oC
to 85oC / – 40oC to 85oC(Note 1), f(XIN) = 10MHz without wait unless otherwise
specified)
Symbol
VOH
VOH
Parameter
Measuring condition
P00 to P07, P20 to P27, P30 to P37,
HIGH output P40 to P43, P50 to P57, P60 to P67,
voltage
P76, P77, P80 to P84, P86, P87,
P90, P92 to P97, P100 to P107
HIGH output XOUT
voltage
HIGH output XCOUT
voltage
IOH=–1mA
2 .5
HIGHPOWER
IOH=–0.1mA
2 .5
LOWPOWER
IOH=–50µA
2 .5
HIGHPOWER
LOWPOWER
VOL
P00 to P07, P20 to P27, P30 to P37,
LOW output P40 to P43, P50 to P57, P60 to P67,
P70, P71, P76, P77, P80 to P84, P86,
voltage
P87, P90, P92 to P97, P100 to P107
VOL
LOW output XOUT
voltage
LOW output XCOUT
voltage
V
3 .0
1.6
V
HIGHPOWER
IOL=0.1mA
0 .5
LOWPOWER
IOL=50µA
0 .5
HIGHPOWER
With no load applied
0
LOWPOWER
With no load applied
0
TA0IN, TA3IN, TA4IN,
TB0IN, TB2IN to TB5IN, INT0 to INT2,
ADTRG,CTS0,CTS1 CLK0,CLK1,CLK3,
CLK4, TA3OUT, TA4OUT, NMI, KI0 to KI3,
SIN4, RXD0 to RXD2
VT+-VT-
Hysteresis
RESET
HIGH input
current
P00 to P07, P20 to P27, P30 to P37,
P40 to P43, P50 to P57, P60 to P67,
P70, P71, P76, P77, P80 to P87,
P90, P92 to P97, P100 to P107,
XIN, RESET, CNVss (BYTE)
I IL
Pull-up
RPULLUP resistance
Unit
V
0 .5
Hysteresis
LOW input
current
With no load applied
With no load applied
Standard
Typ.
Max.
IOL=1mA
VT+-VT-
II H
Min.
V
V
V
0 .2
0 .8
V
0 .2
1 .8
V
VI=3V
4 .0
µA
P00 to P07, P20 to P27, P30 to P37,
P40 to P43, P50 to P57, P60 to P67,
P70, P71, P76, P77, P80 to P87,
P90, P92 to P97, P100 to P107,
XIN, RESET, CNVss (BYTE)
VI=0V
–4.0
µA
P00 to P07, P20 to P27, P30 to P37,
P40 to P43, P50 to P57, P60 to P67,
P76, P77, P80 to P84, P86,P87,
P90, P92 to P97, P100 to P107
VI=0V
20
75
300
KΩ
RfXIN
Feedback resistance XIN
3.0
MΩ
RfXCIN
Feedback resistance XCIN
10.0
MΩ
VRAM
RAM retention voltage
Icc
When clock is stopped
The output pins Mask ROM version
are open and
other pins are
Flash memory 3V
VSS
version
f(XIN)=10MHz
Mask ROM version
Flash memory 3V
version
f(XCIN)=32kHz
Flash memory 3V
version
Program
f(XIN)=10MHz
Flash memory 3V
version
Erase
f(XIN)=10MHz
Mask ROM version
Flash memory 3V
version
f(XCIN)=32kHz
Power supply current
V
2 .0
Square wave, no division
f(XIN)=10MHz
Square wave, no division
Square wave
Square wave, division by 2
Square wave, division by 2
When a WAIT instruction
is executed.
Oscillation capacity High
(Note2)
9.5
21.25
mA
12.0
21.25
mA
45.0
µA
14.0
mA
17.0
mA
2.8
µA
0.9
µA
f(XCIN)=32kHz
When a WAIT instruction
is executed.
Oscillation capacity Low
(Note2)
Ta=25°C
when clock is stopped
1 .0
Ta=85°C
when clock is stopped
20.0
µA
Note 1: Specify a product of -40°C to 85°C to use it.
Note 2: With one timer operated using fC32.
11
Mitsubishi microcomputers
Electrical characteristics (Vcc = 3V)
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*)
unless otherwise specified)
* : Specify a product of -40°C to 85°C to use it.
Table 1.20.8. External clock input
Symbol
12
Parameter
tc
External clock input cycle time
tw(H)
Standard
Min.
Max.
Unit
100
ns
External clock input HIGH pulse width
40
ns
tw(L)
External clock input LOW pulse width
40
ns
tr
External clock rise time
18
ns
tf
External clock fall time
18
ns
Mitsubishi microcomputers
Electrical characteristics (Vcc = 3V)
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*)
unless otherwise specified)
* : Specify a product of -40°C to 85°C to use it.
Table 1.20.9. Timer A input (counter input in event counter mode)
Symbol
Parameter
Standard
Min.
Max.
150
Unit
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
60
ns
ns
tw(TAL)
TAiIN input LOW pulse width
60
ns
Table 1.20.10. Timer A input (gating input in timer mode)
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(TA)
TAiIN input cycle time
600
ns
tw(TAH)
TAiIN input HIGH pulse width
300
ns
tw(TAL)
TAiIN input LOW pulse width
300
ns
Table 1.20.11. Timer A input (external trigger input in one-shot timer mode)
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(TA)
TAiIN input cycle time
300
ns
tw(TAH)
TAiIN input HIGH pulse width
150
ns
tw(TAL)
TAiIN input LOW pulse width
150
ns
Table 1.20.12. Timer A input (external trigger input in pulse width modulation mode)
Symbol
Parameter
Standard
Min.
Max.
Unit
tw(TAH)
TAiIN input HIGH pulse width
150
ns
tw(TAL)
TAiIN input LOW pulse width
150
ns
Table 1.20.13. Timer A input (up/down input in event counter mode)
tc(UP)
TAiOUT input cycle time
Standard
Min.
Max.
3000
tw(UPH)
TAiOUT input HIGH pulse width
1500
tw(UPL)
TAiOUT input LOW pulse width
1500
ns
tsu(UP-TIN)
TAiOUT input setup time
600
ns
th(TIN-UP)
TAiOUT input hold time
600
ns
Symbol
Parameter
Unit
ns
ns
13
Mitsubishi microcomputers
Electrical characteristics (Vcc = 3V)
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*)
unless otherwise specified)
* : Specify a product of -40°C to 85°C to use it.
Table 1.20.14. Timer B input (counter input in event counter mode)
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(TB)
TBiIN input cycle time (counted on one edge)
tw(TBH)
TBiIN input HIGH pulse width (counted on one edge)
60
ns
ns
tw(TBL)
TBiIN input LOW pulse width (counted on one edge)
60
ns
150
tc(TB)
TBiIN input cycle time (counted on both edges)
300
ns
tw(TBH)
TBiIN input HIGH pulse width (counted on both edges)
160
ns
tw(TBL)
TBiIN input LOW pulse width (counted on both edges)
160
ns
Table 1.20.15. Timer B input (pulse period measurement mode)
Symbol
Parameter
Standard
Max.
Unit
tc(TB)
TBiIN input cycle time
Min.
600
tw(TBH)
TBiIN input HIGH pulse width
300
ns
tw(TBL)
TBiIN input LOW pulse width
300
ns
Standard
Min.
Max.
Unit
ns
Table 1.20.16. Timer B input (pulse width measurement mode)
Symbol
Parameter
tc(TB)
TBiIN input cycle time
600
ns
tw(TBH)
TBiIN input HIGH pulse width
300
ns
tw(TBL)
TBiIN input LOW pulse width
300
ns
Table 1.20.17. A-D trigger input
Symbol
Parameter
tc(AD)
ADTRG input cycle time (trigger able minimum)
tw(ADL)
ADTRG input LOW pulse width
Standard
Min.
Max.
Unit
1500
ns
200
ns
Table 1.20.18. Serial I/O
Symbol
Parameter
Standard
Min.
300
tc(CK)
CLKi input cycle time
tw(CKH)
CLKi input HIGH pulse width
150
tw(CKL)
CLKi input LOW pulse width
150
td(C-Q)
TxDi output delay time
th(C-Q)
TxDi hold time
tsu(D-C)
th(C-D)
Max.
Unit
ns
ns
ns
160
ns
0
ns
RxDi input setup time
50
ns
RxDi input hold time
90
ns
_______
Table 1.20.19. External interrupt INTi inputs
Symbol
14
Parameter
Standard
tw(INH)
INTi input HIGH pulse width
Min.
380
tw(INL)
INTi input LOW pulse width
380
Max.
Unit
ns
ns
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Electrical characteristics (Vcc = 3V)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
VCC = 3V
tc(TA)
tw(TAH)
TAiIN input
tw(TAL)
tc(UP)
tw(UPH)
TAiOUT input
tw(UPL)
TAiOUT input
(Up/down input)
During event counter mode
TAiIN input
th(TIN–UP)
(When count on falling
edge is selected)
tsu(UP–TIN)
TAiIN input
(When count on rising
edge is selected)
tc(TB)
tw(TBH)
TBiIN input
tw(TBL)
tc(AD)
tw(ADL)
ADTRG input
tc(CK)
tw(CKH)
CLKi
tw(CKL)
th(C–Q)
TxDi
td(C–Q)
tsu(D–C)
th(C–D)
RxDi
tw(INL)
INTi input
tw(INH)
Figure 1.20.2. Vcc=3V timing diagram
15
Mitsubishi microcomputers
Usage precaution
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Usage Precaution
Timer A (timer mode)
(1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the
value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16”. Reading the
timer Ai register after setting a value in the timer Ai register with a count halted but before the counter
starts counting gets a proper value.
Timer A (event counter mode)
(1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the
value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16” by underflow
or “000016” by overflow. Reading the timer Ai register after setting a value in the timer Ai register with
a count halted but before the counter starts counting gets a proper value.
(2) When stop counting in free run type, set timer again.
Timer A (one-shot timer mode)
(1) Setting the count start flag to “0” while a count is in progress causes as follows:
• The counter stops counting and a content of reload register is reloaded.
• The TAiOUT pin outputs “L” level.
• The interrupt request generated and the timer Ai interrupt request bit goes to “1”.
(2) The timer Ai interrupt request bit goes to “1” if the timer's operation mode is set using any of the
following procedures:
• Selecting one-shot timer mode after reset.
• Changing operation mode from timer mode to one-shot timer mode.
• Changing operation mode from event counter mode to one-shot timer mode.
Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0”
after the above listed changes have been made.
Timer A (pulse width modulation mode)
(1) The timer Ai interrupt request bit becomes “1” if setting operation mode of the timer in compliance with
any of the following procedures:
• Selecting PWM mode after reset.
• Changing operation mode from timer mode to PWM mode.
• Changing operation mode from event counter mode to PWM mode.
Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0”
after the above listed changes have been made.
(2) Setting the count start flag to “0” while PWM pulses are being output causes the counter to stop
counting. If the TAiOUT pin is outputting an “H” level in this instance, the output level goes to “L”, and
the timer Ai interrupt request bit goes to “1”. If the TAiOUT pin is outputting an “L” level in this instance,
the level does not change, and the timer Ai interrupt request bit does not becomes “1”.
Timer B (timer mode, event counter mode)
(1) Reading the timer Bi register while a count is in progress allows reading , with arbitrary timing, the
value of the counter. Reading the timer Bi register with the reload timing gets “FFFF16”. Reading the
timer Bi register after setting a value in the timer Bi register with a count halted but before the counter
starts counting gets a proper value.
16
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
Usage precaution
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timer B (pulse period/pulse width measurement mode)
(1) If changing the measurement mode select bit is set after a count is started, the timer Bi interrupt
request bit goes to “1”.
(2) When the first effective edge is input after a count is started, an indeterminate value is transferred to
the reload register. At this time, timer Bi interrupt request is not generated.
A-D Converter
(1) Write to each bit (except bit 6) of A-D control register 0, to each bit of A-D control register 1, and to bit
0 of A-D control register 2 when A-D conversion is stopped (before a trigger occurs).
In particular, when the Vref connection bit is changed from “0” to “1”, start A-D conversion after an
elapse of 1 µs or longer.
(2) When changing A-D operation mode, select analog input pin again.
(3) Using one-shot mode or single sweep mode
Read the correspondence A-D register after confirming A-D conversion is finished. (It is known by AD conversion interrupt request bit.)
(4) Using repeat mode, repeat sweep mode 0 or repeat sweep mode 1
Use the undivided main clock as the internal CPU clock.
Stop Mode and Wait Mode
____________
(1) When returning from stop mode by hardware reset, RESET pin must be set to “L” level until main clock
oscillation is stabilized.
(2) When switching to either wait mode or stop mode, instructions occupying four bytes either from the
WAIT instruction or from the instruction that sets the every-clock stop bit to “1” within the instruction
queue are prefetched and then the program stops. So put at least four NOPs in succession either to
the WAIT instruction or to the instruction that sets the every-clock stop bit to “1”.
Interrupts
(1) Reading address 0000016
• When maskable interrupt is occurred, CPU read the interrupt information (the interrupt number
and interrupt request level) in the interrupt sequence.
The interrupt request bit of the certain interrupt written in address 0000016 will then be set to “0”.
Reading address 0000016 by software sets enabled highest priority interrupt source request bit to “0”.
Though the interrupt is generated, the interrupt routine may not be executed.
Do not read address 0000016 by software.
(2) Setting the stack pointer
• The value of the stack pointer immediately after reset is initialized to 000016. Accepting an
interrupt before setting a value in the stack pointer may become a factor of runaway. Be sure to
set a value in the stack pointer before accepting an interrupt.
_______
When using the NMI interrupt, initialize the stack point at the beginning of a program. Concerning
_______
the first instruction immediately after reset, generating any interrupts including the NMI interrupt is
prohibited.
_______
(3) The NMI interrupt
_______
_______
• The NMI interrupt can not be disabled. Be sure to connect NMI pin to Vcc via a pull-up resistor if
unused.
_______
• Do not get either into stop mode with the NMI pin set to “L”.
17
Mitsubishi microcomputers
Usage precaution
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
(4) External interrupt
_______
________
• When the polarity of the INT0 to INT2 pins is changed, the interrupt request bit is sometimes set
to "1". After changing the polarity, set the interrupt request bit to "0".
(5) Rewrite the interrupt control register
• To rewrite the interrupt control register, do so at a point that does not generate the interrupt
request for that register. If there is possibility of the interrupt request occur, rewrite the interrupt
control register after the interrupt is disabled. The program examples are described as follow:
Example 1:
INT_SWITCH1:
FCLR
I
; Disable interrupts.
AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit.
NOP
NOP
FSET
I
; Enable interrupts.
Example 2:
INT_SWITCH2:
FCLR
I
AND.B #00h, 0055h
MOV.W MEM, R0
FSET
I
; Disable interrupts.
; Clear TA0IC int. priority level and int. request bit.
; Dummy read.
; Enable interrupts.
Example 3:
INT_SWITCH3:
PUSHC FLG
FCLR
I
AND.B #00h, 0055h
POPC FLG
; Push Flag register onto stack
; Disable interrupts.
; Clear TA0IC int. priority level and int. request bit.
; Enable interrupts.
The reason why two NOP instructions or dummy read are inserted before FSET I in Examples 1 and 2 is
to prevent the interrupt enable flag I from being set before the interrupt control register is rewritten due to
effects of the instruction queue.
• When a instruction to rewrite the interrupt control register is executed but the interrupt is disabled,
the interrupt request bit is not set sometimes even if the interrupt request for that register has
been generated. This will depend on the instruction. If this creates problems, use the below
instructions to change the register.
Instructions : AND, OR, BCLR, BSET
Noise
(1) Insert bypass capacitor between VCC and VSS pin for noise and latch up countermeasure.
• Insert bypass capacitor (about 0.1 µF) and connect short and wide line between VCC and VSS
lines.
18
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-96B<02A0>
Mask ROM number
Date :
Receipt
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30621MCM-XXXGP
MASK ROM CONFIRMATION FORM
Section head
signature
Supervisor
signature
Company
name
❈ Customer
Date
issued
TEL
(
Issuance
signature
Note : Please complete all items marked ❈ .
)
Date :
Submitted by
Supervisor
❈1. Check sheet
Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on
the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that
there is any discrepancy between the contents of these mask files and the ROM data to be burned into
products we produce. Check thoroughly the contents of the mask files you give in.
Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk.
Microcomputer type No. :
M30621MCM-XXXGP
File code :
(hex)
Mask file name :
.MSK (alpha-numeric 8-digit)
❈2. Mark specification
The mark specification differs according to the type of package. After entering the mark specification on
the separate mark specification sheet (for each package), attach that sheet to this masking check sheet
for submission to Mitsubishi.
For the M30621MCM-XXXGP, submit the 80P6S mark specification sheet.
❈3. Usage Conditions
For our reference when of testing our products, please reply to the following questions about the usage
of the products you ordered.
(1) Which kind of XIN-XOUT oscillation circuit is used?
Ceramic resonator
Quartz-crystal oscillator
External clock input
Other (
)
What frequency do not use?
f(XIN) =
MHZ
19
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-96B<02A0>
Mask ROM number
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30621MCM-XXXGP
MASK ROM CONFIRMATION FORM
(2) Which kind of XCIN-XCOUT oscillation circuit is used?
Ceramic resonator
Quartz-crystal oscillator
External clock input
Other (
)
What frequency do not use?
f(XCIN) =
kHZ
(3) Which operating supply voltage do you use?
(Circle the operating voltage range of use)
2.2
2.4
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
(V)
(4) Which operating ambient temperature do you use?
(Circle the operating temperature range of use)
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
(°C)
(5) Do you use I2C (Inter IC) bus function?
Not use
Use
(6) Do you use IE (Inter Equipment) bus function?
Not use
Use
Thank you cooperation.
❈4. Special item (Indicate none if there is not specified item)
20
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-49B<98A1>
Mask ROM number
Date :
Receipt
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30625MGM-XXXGP
MASK ROM CONFIRMATION FORM
Section head
signature
Supervisor
signature
Company
name
❈ Customer
Date
issued
TEL
(
Issuance
signature
Note : Please complete all items marked ❈ .
)
Date :
Submitted by
Supervisor
❈1. Check sheet
Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on
the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that
there is any discrepancy between the contents of these mask files and the ROM data to be burned into
products we produce. Check thoroughly the contents of the mask files you give in.
Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk.
Microcomputer type No. :
M30625MGM-XXXGP
File code :
(hex)
Mask file name :
.MSK (alpha-numeric 8-digit)
❈2. Mark specification
The mark specification differs according to the type of package. After entering the mark specification on
the separate mark specification sheet (for each package), attach that sheet to this masking check sheet
for submission to Mitsubishi.
For the M30625MGM-XXXGP, submit the 80P6S mark specification sheet.
❈3. Usage Conditions
For our reference when of testing our products, please reply to the following questions about the usage
of the products you ordered.
(1) Which kind of XIN-XOUT oscillation circuit is used?
Ceramic resonator
Quartz-crystal oscillator
External clock input
Other (
)
What frequency do not use?
f(XIN) =
MHZ
21
Mitsubishi microcomputers
M16C / 62M (80-pin version) Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-49B<98A1>
Mask ROM number
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30625MGM-XXXGP
MASK ROM CONFIRMATION FORM
(2) Which kind of XCIN-XCOUT oscillation circuit is used?
Ceramic resonator
Quartz-crystal oscillator
External clock input
Other (
)
What frequency do not use?
f(XCIN) =
kHZ
(3) Which operating supply voltage do you use?
(Circle the operating voltage range of use)
2.2
2.4
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
(V)
(4) Which operating ambient temperature do you use?
(Circle the operating temperature range of use)
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
(°C)
(5) Do you use I2C (Inter IC) bus function?
Not use
Use
(6) Do you use IE (Inter Equipment) bus function?
Not use
Use
Thank you cooperation.
❈4. Special item (Indicate none if there is not specified item)
22
REVISION HISTORY
Rev.
M16C/62M(80-PIN VERSION) GROUP DATA SHEET
Date
Description
Summary
Page
A1
02/04/02
5
Figure 1.1.3 is revised.
Table 1.1.2 is revised.
(1/1)
Keep safety first in your circuit designs!
•
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable
material or (iii) prevention against any malfunction or mishap.
•
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property
rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples
contained in these materials.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by
Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com).
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision
on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
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The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.
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Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
Notes regarding these materials
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© 2002 MITSUBISHI ELECTRIC CORP.
Printed in Japan (ROD) II
New publication, effective Apr. 2002.
Specifications subject to change without notice.