Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LPV811, LPV812 SNOSD33 – AUGUST 2016 1 Features 3 Description • • • • • • • • • • • • The LPV811/LPV812 is an ultra-low-power operational amplifier family for “Always ON” sensing applications in wireless and wired equipment. With 8 kHz of bandwidth from 425 nA of quiescent current and less than 300µV of input offset, the LPV811/LPV812 amplifiers provide the required precision while minimizing power consumption in equipment such as gas detectors and portable electronic devices where operational battery-life is critical. 1 Nanopower Supply Current: 425 nA/channel Offset Voltage: 300 µV (max) Good TcVos: 1.5 µV/°C Gain-Bandwidth: 8 kHz Unity-Gain Stable Low Input Bias Current : 100 fA Wide Supply Range: 1.6 V to 5.5 V Rail-to-Rail Output No Output Reversals EMI Protection Temperature Range: –40°C to 125°C Industry Standard Packages: – Single in 5-pin SOT-23 – Dual in 8-pin VSSOP 2 Applications • • • • • • • Gas Detectors such as CO and O2 Current Sensing Motion Detectors using PIR sensors Portable Medical Equipment Thermostats Remote Sensors, IoT Active RFID Readers and Tags In addition to being ultra-low-power, the LPV811/LPV812 amplifiers have CMOS input stages with fempto-amp bias current which reduces errors commonly introduced in transimpedance amplifier (TIA) configurations with megaohm feedback resistors and high source impedance applications. The LPV811/LPV812 amplifiers also feature a negative-rail sensing input stage and a rail-to-rail output stage that swings within millivolts of the rails, maintaining the widest dynamic range possible. Likewise, EMI protection is designed into the LPV811/LPV812 in order to reduce system sensitivity to unwanted RF signals from mobile phones, WiFi, radio transmitters, and tag readers. The LPV811/LPV812 amplifiers operate with a single supply voltage as low as 1.6V, ensuring continuous performance in low battery situations over the extended temperature range of -40ºC to 125ºC. The single and dual channel versions are available in industry standard 5-pin SOT-23 and 8-pin VSSOP packages respectively. Device Information (1) PART NUMBER BODY SIZE LPV811 SOT-23 (5) 2.90 mm x 1.60 mm LPV812 VSSOP (8) 3.00 mm × 3.00 mm (1) Nanopower Oxygen Sensor PACKAGE For all available packages, see the orderable addendum at the end of the data sheet. Nanopower CO Sensor 100 M 1M + V V 1M + RL + VOUT CO Sensor + VOUT RL OXYGEN SENSOR 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW LPV811/LPV812 Precision 425 nA Nanopower Operational Amplifiers LPV811, LPV812 SNOSD33 – AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 4 4 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... 7 Device and Documentation Support.................... 6 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 Device Support ........................................................ Documentation Support ........................................... Related Links ............................................................ Receiving Notification of Documentation Updates.... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 6 6 6 6 6 6 7 7 Mechanical, Packaging, and Orderable Information ............................................................. 7 4 Revision History DATE REVISION NOTES August 2016 * Initial release. PRODUCT PREVIEW 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated LPV811, LPV812 www.ti.com SNOSD33 – AUGUST 2016 5 Pin Configuration and Functions LPV812 8-Pin VSSOP DGK Package Top View LPV811 5-Pin SOT-23 DBV Package Top View OUT A OUTPUT 5 1 1 8 V+ 7 OUT B A + V -IN A 2 B V - + +IN +IN A 3 6 -IN B V- 4 5 +IN B 2 4 3 -IN Pin Functions: LPV811 DBV TYPE DESCRIPTION NAME NUMBER OUT 1 O Channel A Output -IN 2 I Channel A Inverting Input +IN 3 I Channel A Non-Inverting Input V- 4 P Negative (lowest) power supply V+ 5 P Positive (highest) power supply PRODUCT PREVIEW PIN Pin Functions: LPV812 DGK PIN TYPE DESCRIPTION NAME NUMBER OUT A 1 O Channel A Output -IN A 2 I Channel A Inverting Input +IN A 3 I Channel A Non-Inverting Input V- 4 P Negative (lowest) power supply +IN B 5 I Channel B Non-Inverting Input -IN B 6 I Channel B Inverting Input OUT B 7 O Channel B Output V+ 8 P Positive (highest) power supply Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback 3 LPV811, LPV812 SNOSD33 – AUGUST 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT –0.3 6 V Common mode (V-) - 0.3 (V+) + 0.3 V Differential (V-) - 0.3 (V+) + 0.3 V -10 10 mA Continuous Continuous Operating temperature –40 125 °C Storage temperature, Tstg –65 150 °C 150 °C Supply voltage, Vs = (V+) - (V-) Voltage Input pins Input pins (2) (3) Current Output short current (4) Junction temperature (1) (2) (3) PRODUCT PREVIEW (4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Not to exceed -0.3V or +6.0V on ANY pin, referred to VInput terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less. Short-circuit to Vs/2, one amplifer per package. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±1000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage (V+ – V–) 1.6 5.5 V Specified temperature -40 125 °C 6.4 Thermal Information THERMAL METRIC (1) LPV811 DBV (SOT23) 5 PINS LPV811 DGK (VSSOP) 5 PINS 184.2 θJA Junction-to-ambient thermal resistance 177.4 θJCtop Junction-to-case (top) thermal resistance 133.9 75.3 θJB Junction-to-board thermal resistance 36.3 105.5 ψJT Junction-to-top characterization parameter 23.6 13.5 ψJB Junction-to-board characterization parameter 35.7 103.9 (1) 4 UNIT ºC/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated LPV811, LPV812 www.ti.com SNOSD33 – AUGUST 2016 6.5 Electrical Characteristics TA = 25°C, VS = 1.8 V to 5 V, VCM = VOUT = VS/2, and RL≥ 10 MΩ to VS / 2, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX ±55 ±300 UNIT OFFSET VOLTAGE VOS Input offset voltage VS = 1.8 V and 3.3 V, VCM = V- ΔVOS/ΔT Input offset drift VCM = V- PSRR Power-supply rejection ratio VS = 1.8 V to 3.3 V, VCM = V- TA = –40°C to 125°C 1.5 1.6 µV µV/°C 60 µV/V 2.4 V INPUT VOLTAGE RANGE VCM Common-mode voltage range VS = 3.3V CMRR Common-mode rejection ratio (V–) ≤ VCM ≤ (V+) – 0.9 V, VS = 3.3V 0 80 98 dB INPUT BIAS CURRENT IB Input bias current VS = 1.8V 100 fA IOS Input offset current VS = 1.8V 100 fA Differential Common mode 8 pF 3.8 pF 25 µVp-p PRODUCT PREVIEW INPUT IMPEDANCE NOISE En Input voltage noise ƒ = 0.1 Hz to 10 Hz en Input voltage noise density ƒ = 100 Hz 340 ƒ = 1 kHz 420 Open-loop voltage gain (V–) + 0.3 V ≤ VO ≤ (V+) – 0.3 V, RL = 100 kΩ 135 VOH Voltage output swing from positive rail VS = 1.8V, RL = 100 kΩ to V+/2 VOL Voltage output swing from negative rail VS = 1.8V, RL = 100 kΩ to V+/2 ISC Short-circuit current Short to VS/2 ZO Open loop output impedance ƒ = 1 KHz, IO = 0 A nV/√Hz OPEN-LOOP GAIN AOL dB OUTPUT 10 6 mV 4 10 4.7 mA 94.5 kΩ 8 kHz FREQUENCY RESPONSE GBP SR Gain-bandwidth product Slew rate (10% to 90%) CL = 20 pF, RL = 10 MΩ, VS = 5V G = 1, Rising Edge, CL = 20 pF, VS = 5V 1.8 G = 1, Falling Edge, CL = 20 pF, VS = 5V 1.7 V/ms POWER SUPPLY IQ-LPV811 Quiescent Current, Per Channel VCM = V-, IO = 0, VS = 3.3V 450 540 IQ-LPV812 Quiescent Current, Per Channel VCM = V-, IO = 0, VS = 3.3V 425 495 nA Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback 5 LPV811, LPV812 SNOSD33 – AUGUST 2016 www.ti.com 7 Device and Documentation Support 7.1 Device Support 7.1.1 Development Support TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm TI FilterPro Filter Design software, http://www.ti.com/tool/filterpro 7.2 Documentation Support 7.2.1 Related Documentation PRODUCT PREVIEW For related documentation, see the following: • AN-1798 Designing with Electro-Chemical Sensors, SNOA514 • AN-1803 Design Considerations for a Transimpedance Amplifier, SNOA515 • AN-1852 Designing With pH Electrodes, SNOA529 • Compensate Transimpedance Amplifiers Intuitively, SBOA055 • Transimpedance Considerations for High-Speed Operational Amplifiers, SBOA112 • Noise Analysis of FET Transimpedance Amplifiers, SBOA060 • Circuit Board Layout Techniques, SLOA089 • Handbook of Operational Amplifier Applications, SBOA092 7.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LPV811 Click here Click here Click here Click here Click here LPV812 Click here Click here Click here Click here Click here 7.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 7.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 7.6 Trademarks E2E is a trademark of Texas Instruments. 6 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated LPV811, LPV812 www.ti.com SNOSD33 – AUGUST 2016 7.7 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 7.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 8 Mechanical, Packaging, and Orderable Information PRODUCT PREVIEW The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Aug-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LPV811DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 125 LPV811DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI -40 to 125 LPV812DGKR PREVIEW VSSOP DGK 8 2500 TBD Call TI Call TI -40 to 125 LPV812DGKT PREVIEW VSSOP DGK 8 250 TBD Call TI Call TI -40 to 125 PLPV811DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI -40 to 125 PLPV812DGKT PREVIEW VSSOP DGK 8 250 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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