ICHAUS IC-MSBTSSOP20-TP Sin/cos signal conditioner with 1vpp driver Datasheet

iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 1/29
FEATURES
APPLICATIONS
♦ PGA inputs to 500 kHz for differential and single-ended sensor
signals
♦ Selectable adaptation to voltage or current signals
♦ Flexible pin assignment due to signal path multiplexers
♦ Sine/Cosine signal conditioning for offset, amplitude and
phase
♦ Separate index signal conditioning
♦ Short-circuit-proof and reverse polarity tolerant output drivers
(1 Vpp to 100 Ω)
♦ Stabilized output signal levels due to sensor control
♦ Signal and system monitoring with configurable alarm output
♦ Supply voltage monitoring with integrated switches for
reversed-polarity-safe systems
♦ Excessive temperature protection with sensor calibration
♦ I2 C multimaster interface
♦ Supply from 4.3 to 5 V, operation within -25(-40) to +100 °C
♦ Suitable for SAFETY applications
♦ Verifyable chip release code
♦ Version iC-MSB2 with output multiplexer (not for SAFETY )
♦ Programmable sensor interface
for optical and magnetic position
sensors
♦ Linear gauges and incremental
encoders
♦ Linear scales
PACKAGES
TSSOP20, TSSOP20-TP
BLOCK DIAGRAM
Copyright © 2006, 2010 iC-Haus
http://www.ichaus.com
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 2/29
DESCRIPTION
iC-MSB is a signal conditioner with line drivers for
sine/cosine sensors which are used to determine positions in linear and angular encoders, for example.
Programmable instrumentation amplifiers with selectable gain levels permit differential or referenced
input signals; at the same time the modes of operation differentiate between high and low input
impedance. This adaptation of the iC to voltage or
current signals enables MR sensor bridges or photosensors to be directly connected up to the device.
The integrated signal conditioning unit allows signal
amplitudes and offset voltages to be calibrated accurately and also any phase error between the sine and
cosine signals to be corrected. Separate zero signal
conditioning settings can be made for the gain and
offset; data is then output either as an analog or a
differential square-wave signal (low/high level analogous to the sine/cosine amplitude).
For the stabilization of the sine and cosine output signal levels a control signal is generated from the conditioned and calibrated input signals which can power
the transmitting LED of optical systems via the integrated 50 mA driver stage (output ACO). If MR sensors are connected this driver stage also powers the
measuring bridges.
By tracking the sensor energy supply any signal variations and temperature and aging effects can be
compensated for and the set signal amplitude maintained with absolute accuracy. At the same time the
control circuitry monitors both whether the sensor is
functioning correctly and whether it is properly connected; signal loss due to wire breakage, short circuiting, dirt or aging, for example, is recognized when
control thresholds are reached and indicated at alarm
output ERR.
iC-MSB is protected against a reversed power supply
voltage; the integrated voltage switch for loads of up
to 20 mA extends this protection to cover the overall
system. The analog output drivers are directly cablecompatible and tolerant to false wiring; if supply voltage is connected up to these pins, the device is not
destroyed.
The device configuration and calibration parameters
are CRC protected and stored in an external EEPROM; they are loaded automatically via the I2C interface once the supply voltage has been connected
up.
A safety-technical analysis of iC-MSB on device level
with the inclusion of layout and internal/external circuitry has been carried out together with the BGIA,
St. Augustin. The result proved iC-MSB’s capability
for safety oriented applications with Siemens Sinumerik Controls.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 3/29
CONTENTS
PACKAGES
4
SIGNAL PATH MULTIPLEXING: iC-MSBSAFETY
18
ABSOLUTE MAXIMUM RATINGS
5
EXTENDED SIGNAL PATH MULTIPLEXING:
iC-MSB2 ( not for safety applications )
19
SIGNAL CONDITIONING CH1, CH2
Gain Settings CH1, CH2 . . . . . . . . . . . .
Offset Calibration CH1, CH2 . . . . . . . . .
Phase Correction CH1 vs. CH2 . . . . . . . .
21
21
22
22
SIGNAL CONDITIONING CH0
Gain Settings CH0 . . . . . . . . . . . . . . .
Offset Calibration CH0 . . . . . . . . . . . . .
23
23
23
SIGNAL LEVEL CONTROL and SIGNAL
MONITORING
24
ERROR MONITORING AND ALARM OUTPUT
Error Protocol . . . . . . . . . . . . . . . . . .
I/O pin ERR . . . . . . . . . . . . . . . . . . .
25
25
25
TEMPERATURE MONITORING
26
THERMAL DATA
5
ELECTRICAL CHARACTERISTICS
6
PROGRAMMING
10
SERIAL CONFIGURATION INTERFACE
(EEPROM)
13
Example of CRC Calculation Routine . . . . .
13
EEPROM Selection . . . . . . . . . . . . . .
13
2
I C Slave Mode (ENSL = 1) . . . . . . . . . .
14
BIAS SOURCE AND TEMPERATURE
SENSOR CALIBRATION
15
OPERATING MODES
16
Calibration Op. Modes . . . . . . . . . . . . .
16
Special Device Test Functions
. . . . . . . .
16
Signal Filter . . . . . . . . . . . . . . . . . . .
16
REVERSE POLARITY PROTECTION
26
TEST MODE
17
27
INPUT CONFIGURATIONS
18
APPLICATION HINTS
Connecting MR sensor bridges for
safety-related applications . . . . . . . .
PLC Operation . . . . . . . . . . . . . . . . .
Input Configurations . . . . . . . . . . . . . .
18
27
27
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 4/29
PACKAGES
PIN CONFIGURATION TSSOP20, TSSOP20-TP
PIN FUNCTIONS
No. Name Function
1
2
3
4
5
X1
X2
X3
X4
VDDS
Signal Input 1 (Index +)
Signal Input 2 (Index -)
Signal Input 3
Signal Inout 4
Switched Supply Output
(reverse polarity proof, load to 20 mA
max.)
6 GNDS Switched Ground
(reverse polarity proof)
7 X5
Signal Input 5
8 X6
Signal Input 6
9 ACO Signal Level Controller,
high-side current source output
10 SDA Serial Configuration Interface,
data line
11 SCL
Serial Configuration Interface,
clock line
12 NC
Neg. Cosine Output
13 PC
Pos. Cosine Output
14 NS
Neg. Sine Output
15 PS
Pos. Sine Output
16 GND Ground
17 VDD +4.5 to +5.5 V Supply Voltage
18 NZ
Neg. Index Output
19 PZ
Pos. Index Output
20 ERR Error Signal (In/Out),
Test Mode Trigger Input
To improve heat dissipation the thermal pad of the TSSOP20-TP package (bottom side) should be joined
to an extended copper area which must have GNDS potential.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 5/29
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Max.
G001 V()
Voltage at VDD, GND, PC, NC, PS, NS,
PZ, NZ, ACO
-6
6
V
G002 V()
Voltage at ERR
-6
8
V
G003 V()
Pin-To-Pin Voltage between VDD,
GND, PC, NC, PS, NS, PZ, NZ, ACO,
ERR
6
V
G004 V()
Voltage at X1...X6, SCL, SDA
-0.3
VDDS +
0.3
V
G005 I(VDD)
Current in VDD
-100
100
mA
G006 I()
Current in VDDS, GNDS
-50
50
mA
G007 I()
Current in X1...X6, SCL, SDA, ERR,
PC, NC, PS, NS, PZ, NZ
-20
20
mA
G008 I(ACO)
Current in ACO
-100
20
mA
G009 Vd()
G010 Ptot
ESD Susceptibility at all pins
HBM 100 pF discharged through 1.5 kΩ
Permissible Power Dissipation
TSSOP20
TSSOP20-TP
G011 Tj
Junction Temperature
G012 Ts
Storage Temperature Range
2
kV
300
400
mW
mW
-40
150
°C
-40
150
°C
THERMAL DATA
Item
No.
T01
Symbol
Parameter
Conditions
Unit
Min.
Typ.
Max.
Ta
Operating Ambient Temperature Range iC-MSB TSSOP20, iC-MSB2 TSSOP20
iC-MSB TSSOP20-TP
T02
Rthja
Thermal Resistance Chip to Ambient
TSSOP20 surface mounted to PCB
according to JEDEC 51
80
K/W
T03
Rthja
Thermal Resistance Chip to Ambient
TSSOP20-TP surface mounted to PCB
according to JEDEC 51
35
K/W
All voltages are referenced to Pin GNDS unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.
-25
-40
100
115
°C
°C
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 6/29
ELECTRICAL CHARACTERISTICS
Operating conditions: VDD = 4.3...5.5 V, Tj = -40...125 °C, IBN calibrated to 200 µA, reference point GNDS, unless otherwise stated.
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Total Device
001 VDD
Permissible Supply Voltage
Load current I(VDDS) < -10 mA
Tj = 27 °C, no load
Typ.
4.3
4.5
25
Max.
5.5
5.5
V
V
50
mA
0
mA
11
V
002
I(VDD)
Supply Current in VDD
003
I(VDDS)
Permissible Load Current VDDS
004
Vcz()hi
Clamp Voltage hi at all pins
005
Vc()hi
Clamp Voltage hi at inputs
SCL, SDA
Vc()hi = V() − V(VDDS), I() = 1 mA
0.4
1.5
V
006
Vc()hi
Clamp Voltage hi at inputs
X1...X6
Vc()hi = V() − V(VDDS), I() = 4 mA
0.3
1.2
V
007
Vc()lo
Clamp Voltage lo at all pins
I() = -4 mA
-1.2
-0.3
V
0.75
V
-20
Signal Conditioning, Inputs X3...X6
101 Vin()sig
Permissible Input Voltage Range RIN12(3:0) = 0x01
0
VDDS
− 1.5
VDDS
102
Iin()sig
Permissible Input Current Range RIN12(0) = 0, BIAS12 = 0
RIN12(0) = 0, BIAS12 = 1
-300
10
-10
300
µA
µA
103
104
Iin()
Input Current
RIN12(3:0) = 0x01
-10
10
µA
Rin()
Input Resistance vs. VREFin
Tj = 27 °C;
RIN12(3:0) = 0x09
RIN12(3:0) = 0x00
RIN12(3:0) = 0x02
RIN12(3:0) = 0x04
RIN12(3:0) = 0x06
16
1.1
1.6
2.2
3.2
24
2.1
3.0
4.2
6.0
kΩ
kΩ
kΩ
kΩ
kΩ
1.35
2.25
RIN12(3:0) = 0x09
Temperature Coefficient Rin
20
1.6
2.3
3.2
4.6
105
106
TCRin()
VREFin12 Reference Voltage
RIN12(0) = 0, BIAS12 = 1
RIN12(0) = 0, BIAS12 = 0
107
G12
RIN12(3:0) = 0x01, GR12 and GF12 = 0x0
RIN12(3:0) = 0x01, GR12 and GF12 = max.
2
100
RIN12(3:0) = 0x09, GR12 and GF12 = 0x0
RIN12(3:0) = 0x09, GR12 and GF12 = max.
0.5
25
Selectable Gain Factors
0.15
V
V
-0.5
0.5
LSB
-1
1
LSB
500
2000
mVpp
mVpp
∆Gdiff
Differential Gain Accuracy
calibration range 11 bit
109
110
∆Gabs
Absolute Gain Accuracy
calibration range 11 bit, guaranteed monotony
Vin()diff
Recommended Differential Input Vin()diff = V(CHPx) - V(CHNx),
RUIN12(3) = 0
Voltage
RUIN12(3) = 1
10
40
Vin()os
Input Offset Voltage
refered to side of input
0
VOScal
Offset Calibration Range
referenced to the selected source (VOS12);
ORx = 00
ORx = 01
ORx = 10
ORx = 11
111
112
%/K
1.65
2.75
108
1.5
2.5
V
20
µV
±100
±200
±600
±1200
%V()
%V()
%V()
%V()
113
∆VOSdiff
Differential Linearity Error of
Offset Correction
calibration range 11 bit
-0.5
0.5
LSB
114
∆VOSint
Integral Linearity Error of Offset
Correction
calibration range 11 bit
-1
1
LSB
115
PHIkorr
Phase Error Calibration Range
CH1 versus CH2
116
∆PHIdiff
Differential Linearity Error of
Phase Calibration
calibration range 10 bit
-0.5
0.5
LSB
117
∆PHIint
Integral Linearity Error of Phase
Calibration
calibration range 10 bit
-1
1
LSB
119
fin()max
Permissible Input Frequency
500
kHz
120
fhc()
Input Amplifier Cut-off Frequency
(-3dB)
250
kHz
±10.4
°
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 7/29
ELECTRICAL CHARACTERISTICS
Operating conditions: VDD = 4.3...5.5 V, Tj = -40...125 °C, IBN calibrated to 200 µA, reference point GNDS, unless otherwise stated.
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Signal Conditioning, Inputs X1, X2
201 Vin()sig
Permissible Input Voltage Range RIN0(3:0) = 0x01
Typ.
0
VDDS
− 1.5
VDDS
202
Iin()sig
Permissible Input Current Range RIN0(0) = 0, BIAS0 = 0
RIN0(0) = 0, BIAS0 = 1
-300
10
-10
300
µA
µA
203
Iin()
Input Current
RIN0(3:0) = 0x01
-10
10
µA
204
Vout(X2)
Output Voltage at X2
BIASEX = 10, I(X2) = 0, referenced to VREFin12
95
205
Vin(X2)
Permissible Input Voltage at X2
BIASEX = 11
0.5
206
Rin(X2)
Input Resistance at X2
BIASEX = 11, RIN0(3:0) = 0x01,
RIN12(3:0) = 0x01
20
207
Rin()
Input Resistance vs. VREFin
Tj = 27 °C;
RIN0(3:0) = 0x09
RIN0(3:0) = 0x00
RIN0(3:0) = 0x02
RIN0(3:0) = 0x04
RIN0(3:0) = 0x06
16
1.1
1.6
2.2
3.2
1.35
2.25
RIN0(3:0) = 0x09
0.75
Max.
100
V
105
%
VDDS
−2
V
27
30
kΩ
20
1.6
2.3
3.2
4.6
24
2.1
3.0
4.2
6.0
kΩ
kΩ
kΩ
kΩ
kΩ
208
209
TCRin()
Temperature Coefficient Rin
VREFin0
Reference Voltage
RIN0(0) = 0, BIAS0 = 1
RIN0(0) = 0, BIAS0 = 0
210
G0
Selectable Gain Factors
RIN0(3:0) = 0x01, GR0 and GF0 = 0x0
RIN0(3:0) = 0x01, GR0 and GF0 = max.
2
100
RIN0(3:0) = 0x09, GR0 and GF0 = 0x0
RIN0(3:0) = 0x09, GR0 and GF0 = max
0.5
25
0.15
V
V
-0.5
0.5
LSB
-1
1
LSB
500
2000
mVpp
mVpp
∆Gdiff
Differential Gain Accuracy
calibration range 5 bit
212
213
∆Gabs
Absolute Gain Accuracy
calibration range 5 bit, guaranteed monotony
Vin()diff
Recommended Differential Input Vin()diff = V(CHP0) - V(CHN0),
RIN0(3:0) = 0x01
Voltage
RIN0(3:0) = 0x09
10
40
Vin()os
Input Offset Voltage
referred to side of input
0
VOScal
Offset Calibration Range
referenced to the selected source (REFVOS);
OR0 = 00
OR0 = 01
OR0 = 10
OR0 = 11
1.5
2.5
%/K
1.65
2.75
211
214
215
V
75
µV
±100
±200
±600
±1200
%V()
%V()
%V()
%V()
216
∆VOSdiff
Differential Linearity Error of
Offset Correction
calibration range 6 bit
-0.5
0.5
LSB
217
∆VOSint
Integral Linearity Error of Offset
Correction
calibration range 6 bit
-1
1
LSB
4000
kHz
10
°
275
mV
Signal Filter
301 fg
Cut-off Frequency
302
phi
Phase Shift
Index Pulse Comparator Output PZ, NZ
fin 500 kHz for sine/cosine
401
Vpk()
Output Amplitude With Sensor
Tracking via ACO
EAZ = 1, ADJ(4:0) = 0x19
402
SR()
Output Slew Rate
EAZ = 1
Line Driver Outputs PS, NS, PC, NC, PZ, NZ
501 Vpk()max Permissible Output Amplitude
225
250
1
VDD = 4.5 V, DC level = VDD / 2,
RL = 50 Ω vs. VDD / 2
502
Vpk()
Output Amplitude With Sensor
Tracking via ACO
ADJ (8:0) = 0x19
225
503
fg
Cut-off Frequency
CL = 250 pF
500
504
Vos
Offset Voltage
505
Isc()
Short-circuit Current
pin shorten to VDD or GND
10
506
Ilk()
Tristate Leakage Current
tristate or reversed supply
-1
250
V/µs
300
mV
275
mV
kHz
±200
30
µV
50
mA
1
µA
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 8/29
ELECTRICAL CHARACTERISTICS
Operating conditions: VDD = 4.3...5.5 V, Tj = -40...125 °C, IBN calibrated to 200 µA, reference point GNDS, unless otherwise stated.
Item
No.
Symbol
Parameter
Unit
Min.
Signal Level Controller ACO
601 Vs()hi
Saturation Voltage hi
at ACO vs. VDD
602
Conditions
Isc()hi
Short-circuit Current hi in ACO
Typ.
Vs() = VDD - V();
ADJ(8:0) = 0x11F, I() = -5 mA
ADJ(8:0) = 0x13F, I() = -10 mA
ADJ(8:0) = 0x15F, I() = -25 mA
ADJ(8:0) = 0x17F, I() = -50 mA
V() = 0 ... VDD - 1 V;
ADJ(8:0) = 0x11F
ADJ(8:0) = 0x13F
ADJ(8:0) = 0x15F
ADJ(8:0) = 0x17F
603
tr()
Current Rise Time in ACO
I(ACO): 0 → 90 % setpoint
604
tset()
Current Settling Time in ACO
Square control active, I(ACO): 50 → 100 %
setpoint
605
It()min
Control Range Monitoring 1:
lower limit
606
It()max
607
608
-10
-20
-50
-100
Max.
1
1
1
1
V
V
V
V
-5
-10
-25
-50
mA
mA
mA
mA
1
ms
400
µs
referenced to range ADJ(6:5)
3
%Isc
Control Range Monitoring 2:
upper limit
referenced to range ADJ(6:5)
90
%Isc
Vt()min
Signal Level Monitoring 1:
lower limit
referenced to Vscq()
40
%Vpp
Vt()max
Signal Level Monitoring 2:
upper limit
referenced to Vscq()
130
%Vpp
Permissible Test Current
test mode activated
Test Current ERR
701
I(ERR)
0
1
mA
Bias Current Source and Reference Voltages
801
IBN()
Bias Current Source
MODE(3:0) = 0x01, I(NC) vs. VDDS
180
200
220
µA
802
VPAH
Reference Voltage VPAH
referenced to GND
45
50
55
%VDD
803
V05
Reference Voltage V05
450
500
550
804
V025
Reference Voltage V025
50
mV
%V05
Power-Down-Reset
901
VDDon
Turn-on Threshold
(power-on release)
increasing voltage at VDD vs. GND
3.7
4
4.3
V
902
VDDoff
Turn-off Threshold
(power-down reset)
decreasing voltage at VDD vs. GND
3.2
3.5
3.8
V
903
VDDhys
Threshold Hysteresis
VDDhys = VDDon − VDDoff
0.3
Internal Clock Frequency
MODE(3:0) = 0x0A, fclk(NS)
120
V
Clock Oscillator
A01
fclk()
160
200
kHz
Error Signal Input/Output, Pin ERR
B01
B02
Vs()lo
Saturation Voltage lo
vs. GND, I() = 4 mA
Isc()
Short-circuit Current lo
vs. GND; V(ERR) ≤ VDD
V(ERR) > VTMon
0.4
B03
Vt()hi
Input Threshold Voltage hi
vs. GND
B04
Vt()lo
Input Threshold Voltage lo
vs. GND
0.8
B05
Vt()hys
Input Hysteresis
Vt()hys = Vt()hi − Vt()lo
300
500
B06
Ipu()
Input Pull-up Current
V() = 0...VDD − 1 V, EPU = 1
-400
-300
B07
Rpu()
Input Pull-Up Resistor
EPU = 0
B08
Vpu()
Pull-up Voltage
Vpu() = VDD - V(), I() = -5 µA, EPU = 1
B09
VTMon
Test Mode Activation Threshold
increasing voltage at ERR
B10
VTMoff
Test Mode Disabling Threshold
decreasing voltage at ERR
B11
VTMhys
Test Mode Hysteresis
VTMhys = VTMon − VTMoff
B12
Ilk()
Leakage Current
tristate or reversed supply voltage
4
2
V
mA
mA
2
V
V
mV
-200
500
µA
kΩ
0.4
V
VDD +
1.5
V
VDD +
0.5
V
0.15
0.3
-1
-10
V
-50
µA
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 9/29
ELECTRICAL CHARACTERISTICS
Operating conditions: VDD = 4.3...5.5 V, Tj = -40...125 °C, IBN calibrated to 200 µA, reference point GNDS, unless otherwise stated.
Item
No.
Symbol
Parameter
Conditions
Unit
Min.
Typ.
Supply Switch and Reverse Polarity Protection VDDS, GNDS
C01 Vs()
Saturation Voltage
Vs(VDDS) = VDD − V(VDDS)
I(VDDS) = -10 mA...0 mA
VDDS vs. VDD
I(VDDS) = -20 mA...-10 mA
C02 Vs()
Saturation Voltage
Vs(GNDS) = V(GNDS) − GND
I(GNDS) = 0 mA...10 mA
GNDS vs. GND
I(GNDS) = 10 mA...20 mA
Max.
150
250
mV
mV
150
250
mV
mV
400
mV
80
mA
2
V
Serial Configuration Interface SCL, SDA
D01 Vs()lo
Saturation Voltage lo
D02 Isc()
Short-circuit Current lo
D03 Vt()hi
Input Threshold Voltage hi
D04 Vt()lo
Input Threshold Voltage lo
D05 Vt()hys
Input Hysteresis
Vt()hys = Vt()hi − Vt()lo
300
500
D06 Ipu()
Input Pull-up Current
V() = 0...VDDS − 1 V
-600
-300
D07 Vpu()
D08 fclk(SCL)
Input Pull-up Voltage
Vpu() = VDDS − V(), I() = -5 µA
Clock Frequency at SCL
ENFAST = 0
ENFAST = 1
D09 tbusy()cfg
Duration of Startup Configuration IBN not calibated, EEPROM access without
read failure, time to outputs operational;
ENFAST = 0
ENFAST = 1
D10 tbusy()err
D11 td()
D12 td()i2c
End Of I2C Communication;
Time Until I2C Slave Is Enabled
Start Of Master Activity On I2C
Protocol Error
I() = 4 mA
4
0.8
60
240
IBN not calibrated;
V(SDA) = 0 V
V(SCL) = 0 V or arbitration lost
no EEPROM
CRC ERROR
SCL without clock signal: V(SCL) = constant;
IBN not calibrated
IBN calibrated to 200 µA
25
64
Delay for I2C-Slave-Mode Enable no EEPROM, V(SDA) = 0 V
Temperature Monitoring
E01 VTs
Temperature Sensor Voltage
E02
TCs
Temp. Co. of Temperature Sensor Voltage
E03
VTth
Temperature Warning Activation
Threshold
E04
TCth
Temp. Co. Temperature Warning
Activation Threshold
E05
Thys
Temperature Warning Hysteresis
E06
∆T
Relative Shutdown Temperature
VTs() = VDDS − V(PS), Tj = 27 °C,
Calibration Mode 3, no load
600
V
mV
-60
V
80
320
100
400
kHz
kHz
40
25
55
35
ms
ms
4
indef.
45
95
12
135
285
ms
ms
ms
ms
80
80
240
120
µs
µs
4
6.2
ms
650
700
mV
-1.8
VTth() = VDDS − V(NS), Tj = 27 °C,
Calibration Mode 3, no load;
CFGTA(3:0) = 0x00
CFGTA(3:0) = 0x0F
260
470
310
550
mV/K
360
630
0.06
∆T = Toff − Twarn
µA
0.4
mV
mV
%/K
4
12
20
°C
4
12
20
°C
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 10/29
PROGRAMMING
Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 11
Configuration Interface . . . . . . . . . . . . . . . . . . . Page 13
ENFAST:
I2 C Fast Mode Enable
ENSL:
I2 C Slave Mode Enable
DEVID:
Device ID of EEPROM providing the
chip configuration data (e.g. 0x50)
CHKSUM:
CRC of chip configuration data
(address range 0x00 to 0x1E)
CHPREL:
Chip Release
NTRI:
Tristate Function and
Op. Mode Change
Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 15
CFGIBN:
Bias Calibration
CFGTA:
Temperature Sensor Calibration
Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . Page 16
MODE:
Operation Mode
ENF:
Signal Filtering
Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Seite 17
TMODE:
Test Mode Functions
TMEM:
Test Mode Memory Selection
Input Configuration and
Signal Path Multiplexer . . . . . . . . . . . . . . . . . . . Page 18
INMODE:
Diff./Single-Ended Input Mode
RIN12:
I/V Mode and Input Resistance CH1,
CH2
BIAS12:
Reference Voltage CH1, CH2
RIN0:
I/V Mode and Input Resistance CH0
BIAS0:
Reference Voltage CH0
MUXIN:
Input-To-Channel Assignment:
X3...X6 to CH1, CH2
INVZ:
Index Signal Inversion
EAZ:
Index Comparator Enable
MUXOUT:
Output Multiplexer (iC-MSB2 only)
BIASEX:
Input Reference Selection
BYP
Input-to-output Feedthrough
Signal Conditioning CH1, CH2 (X3...X6) . . Page 21
GR12:
Gain Range CH1, CH2 (coarse)
GF1:
Gain Factor CH1 (fine)
GF2:
Gain Factor CH2 (fine)
VOS12:
Offset Reference Source CH1, CH2
VDC1:
Intermediate Voltage CH1
VDC2:
Intermediate Voltage CH2
OR1:
Offset Range CH1 (coarse)
OF1:
Offset Factor CH1 (fine)
OR2:
Offset Range CH2 (coarse)
OF2:
Offset Factor CH2 (fine)
PH12:
Phase Correction CH1 vs. CH2
Signal Conditioning CH0 (X1, X2) . . . . . . . . . Page 23
GR0:
Gain Range CH0 (coarse)
GF0:
Gain Factor CH0 (fine)
VOS0:
Offset Reference Source CH0
OR0:
Offset Range CH0 (coarse)
OF0:
Offset Factor CH0 (fine)
Signal Level Controller . . . . . . . . . . . . . . . . . . . . Page 24
ADJ:
Setup of ACO Output Function
Error Monitoring and Alarm Output . . . . . . Page 25
EMTD:
Minimal Alarm Indication Time
EPH:
Alarm Input/Output Logic
EPU:
Alarm Output Pull-Up Enable
EMASKA:
Error Mask For Alarm Indication (pin
ERR)
EMASKE:
Error Mask For Protocol (EEPROM)
EMASKO:
Error Mask For Driver Shutdown
ERR1:
ERR2:
ERR3:
Error Protocol: First Error
Error Protocol: Last Error
Error Protocol: History
PDMODE:
Driver Activation After Cycling Power
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 11/29
OVERVIEW
Adr
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Configuration Interface
0x00
ENFAST
DEVID(6:0)
Calibration
0x01
CFGIBN(3:0)
CFGTA(3:0)
Operation Modes
0x02
NTRI
1
0
–
MODE(3:0)
Input Configuration and Signal Path Multiplexer: iC-MSB
0x03
EAZ
0
0
0
INVZ
INMODE
MUXIN(1:0)
INVZ
INMODE
MUXIN(1:0)
Input Configuration and Signal Path Multiplexer: iC-MSB2
0x03
EAZ
MUXOUT(2:0)
Signal Conditioning CH1, CH2
0x04
GF2(4:0)
GR12(2:0)
0x05
GF1(7:0)
0x06
VDC1(4:0)
0x07
0x08
GF1(10:8)
VDC2(2:0)
VDC1(9:5)
OR1(0)
VDC2(9:3)
0x09
OF1(6:0)
0x0A
OF2(1:0)
OR2(1:0)
OF1(10:7)
0x0B
OF2(9:2)
0x0C
PH12(6:0)
0x0D
0x0E
OR1(1)
BIASEX(1:0)
ENF
BYP
BIAS12
OF2(10)
1
1
PH12(9:7)
VOS12(1:0)
RIN12(3:0)
Signal Level Controller
0x0F
ADJ(0)
–
0
1
0x10
0
0
0
0
ADJ(8:1)
Signal Conditioning CH0
0x11
GF0(4:0)
0x12
0x13
GR0(2:0)
OF0(5:0)
0
BIAS0
OR0(1:0)
VOS0(1:0)
RIN0(3:0)
Error Monitoring and Alarm Output
0x14
–
0x15
0x16
EMASKA(6:0)
TMODE(1:0)
EMASKE(3:0)
TMEM
EPH
–
–
EPU
–
–
EMASKO(6:0)
0x17
0x18
EMTD(2:0)
–
PDMODE
–
ENSL
–
–
0x19..
0x1A
not defined
0x1B..
0x1E
OEM Data
Check Sum / Chip Release
0x1F
EEPROM: CHKSUM(7:0) / ROM: CHPREL(7:0)
EMASKE(6:4)
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 12/29
OVERVIEW
Adr
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Error Register
0x20
–
ERR1(6:0)
0x21
ERR2(5:0)
0x22
0x23
ERR3(3:0)
–
–
–
–
–
–
Table 4: Register layout
–
–
–
–
ERR2(6)
ERR3(6:4)
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 13/29
SERIAL CONFIGURATION INTERFACE (EEPROM)
The serial configuration interface consists of the two
pins SCL and SDA and enables read and write access
to an EEPROM with I2 C interface. The readout speed
can be adjusted using register bit ENFAST.
ENFAST
Code
Adr 0x00, bit 7
Function
0
1
Regular clock rate, f(SCL) approx. 80 kHz
High clock rate, f(SCL) approx. 320 kHz
Notes
For in-circuit programming bus lines SCL and SDA
require pull-up resistors.
For line capacitances to 170 pF, adequate values
are:
4.7 kΩ with clock frequency 80 kHz
2 kΩ with clock frequency 320 kHz
The pull-up resistors may not be less than 1.5 kΩ.
To separate the signals a ground line between SCL
and SDA is recommended.
iC-MSB requires a supply voltage during EEPROM
programming (5 V to VDD).
Table 5: Config. Interface Clock Frequency
Once the supply has been switched on (power down
reset) the iC-MSB outputs are high impedance (tristate) until a valid configuration is read out from the
EEPROM using device ID 0x50.
Bit errors in the 0x00 to 0x1E memory section are
pinpointed by the CRC deposited in register CHKSUM(7:0) (address 0x1F; the CRC polynomial used is
"1 0001 1101").
Should no valid configuration data being available (incorrect CRC value or EEPROM missing), the readin
process is repeated; the system aborts following a
fourth faulty attempt and iC-MSB switches to I2 C slave
mode.
For devices loading valid configuration data from the
EEPROM, the register bit ENSL decides for enabling
the I2 C slave function.
ENSL
Code
Adr 0x17, bit 3
Function
0
1
Normal operation
I2 C Slave Mode Enable (Device ID 0x55)
Table 6: Config. Interface Mode
The device ID for the EEPROM can be entered in register DEVID(6:0) (address 0x00), from which iC-MSB
will take its configuration after exiting test mode (see
page 17). The DEVID(6:0) stored therein is then accepted.
Example of CRC Calculation Routine
unsigned char ucDataStream = 0 ;
i n t iCRCPoly = 0x11D ;
unsigned char ucCRC=0;
int i = 0;
ucCRC = 1 ; / / s t a r t v a l u e ! ! !
f o r ( iReg = 0 ; iReg <31; iReg ++)
{
ucDataStream = ucGetValue ( iReg ) ;
f o r ( i =0; i <=7; i ++) {
i f ( ( ucCRC & 0x80 ) ! = ( ucDataStream & 0x80 ) )
ucCRC = (ucCRC << 1 ) ^ iCRCPoly ;
else
ucCRC = (ucCRC << 1 ) ;
ucDataStream = ucDataStream << 1 ;
}
}
EEPROM Selection
The following minimal requirements must be fulfilled:
• Operation from 3.3 to 5 V, I2 C interface
• Minimal 512 bit, 64x8
(address range used is 0x00 to 0x3F)
• Support of Page Write with Pages of at least 4
bytes. Otherwise error events can not be saved
to the EEPROM (EMASKE(9:0) = 0x000).
• Device ID 0x50 "1010 000", no occupation of
0x55 (A2...A0 = 0). Otherwise iC-MSB is not accessible in I2 C slave mode via 0x55 (ENSL = 0).
Device recommendation: Atmel AT24C01B, 128x8
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 14/29
I2 C Slave Mode (ENSL = 1)
In this mode iC-MSB behaves like an I2 C slave with the
device ID 0x55 and the configuration interface permits
write and read accesses to iC-MSB’s internal registers.
For chip release verification purposes an identification
value is stored under ROM address 0x1F; a write access to this address is not permitted.
CHPREL
Adr 0x1F, bit 7:0 (ROM)
Code
Chip Release
0x00
0x04
Not available
iC-MSB SAFETY v4
0x05
0x25
SAFETY
iC-MSB
iC-MSB2 v5
v5
Register
Address
Read access in I2 C slave mode (ENSL = 1)
Content
0x00-0x18
0x19-0x1A
0x1B-0x1E
0x1F
Configuration: register addresses 0x00-0x18
Not available
OEM data: register addresses 0x1B-0x1E
Chip release (ROM)
0x20-0x23
0x24-0x37
0x38
0x39-0x3A
0x3B-0x3E
0x3F
Configuration: register addresses 0x20-0x23
Not available
Configuration: register address 0x18
Not available
OEM data: register addresses 0x1B-0x1E
Chip release (ROM)
0x40-0x43
0x44-0x7F
Current error memory
Not available
Table 9: RAM Read Access
Table 7: Chip Release
Register
Address
Write access in I2 C slave mode (ENSL = 1)
Access and conditions
NTRI
Code
Adr 0x02, bit 7
Function
0x00
Changes possible, no restrictions
0
1
Output drivers disabled
Setting the operating mode, output drivers active
0x01
Notes
NTRI is evaluated only during I2 C slave mode.
0x02
Changes possible (wrong entries for CFGIBN can
limit functions)
Bit 7 = 0 (NTRI): changes to bits (6:0) permitted
A change of operating mode follows only on writing
Bit 7 = 1 (NTRI); when doing so changes to bits
(6:0) are not permitted.
Changes possible, no restrictions
Bit 3 = 1 (ENSL):
changes to bits (7:4) and (2:0) permitted
Changes possible, no restrictions
Not available
Changes possible, no restrictions
No changes permitted
Table 8: Tristate Function And Op. Mode Change
0x03-0x16
0x17
0x18
0x19-0x1A
0x1B-0x1E
others
Table 10: RAM Write Access
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 15/29
BIAS SOURCE AND TEMPERATURE SENSOR CALIBRATION
Bias Source Calibration
The calibration of the bias current source in operation
mode Calibration 1 (Tab. 13) is prerequisite for adherence to the given electrical characteristics and also instrumental in the determination of the chip timing (e.g.
SCL clock frequency). For setup purposes the IBN
value is measured using a 10 kΩ resistor by pin VDDS
connected to pin NC. The setpoint is 200 µA which is
equivalent to a measurement voltage of 2 V.
CFGIBN
Code k
Adr 0x01, bit 7:4
31
IBN ∼ 39−k
Code k
IBN ∼
0x0
0x1
0x2
0x3
79 %
81 %
84 %
86 %
0x8
0x9
0xA
0xB
100 %
103 %
107 %
111 %
0x4
0x5
0x6
0x7
88 %
91 %
94 %
97 %
0xC
0xD
0xE
0xF
115 %
119 %
124 %
129 %
31
39−k
Table 11: Bias Current Source Calibration
Temperature Sensor
The temperature monitor is calibrated in operating
mode Calibration Mode 3.
To set the required warning temperature T2 the temperature sensor voltage VTs at which the warning is
generated is first determined. To this end a voltage ramp from VDDS towards GNDS is applied to
pin PS until pin ERR triggers an error message (for
EMASKA = 0x20 and EMTD = 0x00).
Example: VTs(T1 ) is ca. 650 mV, measured from
VDDS versus PS, with T1 = 25 °C;
The necessary activation threshold voltage VTth(T1 ) is
then calculated. The required warning temperature T2 ,
temperature coefficients TCs and TCth (see Electrical
Characteristics, Section E) and measurement value
VTs(T1 ) are entered into this calculation:
VTth(T1 ) =
VTs(T1 ) + TCs · (T2 − T1 )
1 + TCth · (T2 − T1 )
Example: For T2 = T1 + 100 K, VTth(T1 ) must be programmed to 443 mV.
Activation threshold voltage VTth(T1 ) is provided for a
high impedance measurement (10 MΩ) at output pin
NS (measurement versus VDDS) and must be set by
programming CFGTA(3:0) to the calculated value.
Example: Altering VTth(T1 ) from 310 mV (measured
with CFGTA(3:0)= 0x0) to 443 mV is equivalent to
143 %, the closest value for CFGTA is 0x9;
CFGTA
Code k
Adr 0x01, bit 3:0
VTth ∼ 65+3k
65
Code k
VTth ∼
0x0
0x1
0x2
100 %
105 %
110 %
0x8
0x9
0xA
140 %
145 %
150 %
0x3
0x4
0x5
0x6
0x7
115 %
120 %
125 %
130 %
135 %
0xB
0xC
0xD
0xE
0xF
155 %
160 %
165 %
170 %
175 %
Notes
With CFGTA = 0xF Toff is 80 °C typ.,
with CFGTA = 0x0 Toff is 155 °C typ.
65+3k
65
Table 12: Calibration of Temperature Monitoring
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 16/29
OPERATING MODES
In order to calibrate iC-MSB, compensate for the input
signals and test iC-MSB the mode of operation must
be changed. The output function changes according
MODE(3:0)
BYP
to the various operating modes; the line drivers and
protection against reverse polarity facility are only active in normal mode.
Addr. 0x02; bit 3:0
Addr. 0x0D; bit 5
Code
Operating Mode
Pin PS
Pin NS
Pin PC
Pin NC
Pin PZ
Pin NZ
Pin ERR
0x00
Normal operation
PS
NS
PC
NC
PZ
NZ
ERR
0x01
Calibration 1
TANA0(2)
VREFI0
VREFI12
IBN
PZI
NZI
ERR
0x02
Calibration 2
PCH1
NCH1
PCH2
NCH2
VDC1
VDC2
—
0x03
iC-Haus Test 1
VPAH
VPD
—
CGUCK
IPF
V05
IERR
0x04
iC-Haus Test 2
PS_out
NS_out
PC_out
NC_out
PZ_out
NZ_out
IERR
0x05
iC-Haus Test 3
PS_out
NS_out
PC_out
NC_out
PZ_out
NZ_out
ERR
0x06
iC-Haus Test 4, BYP = 0
iC-Haus Test 4, BYP = 1
TANA12(0)
X4
TANA12(1)
X6
TANA12(2)
X3
TANA12(3)
X5
TANA12(4)
X1
TANA12(5)
X2
IERR
0x07
Calibration 3
VTs
VTth
—
—
—
—
ERR
0x08
Saturation low
0x09
—
—
—
—
—
—
—
—
0x0A
iC-Haus Test 5
TP
CLK6
—
—
—
—
—
0x0B
—
—
—
—
—
—
—
—
0x0C
—
—
—
—
—
—
—
—
0x0D
—
—
—
—
—
—
—
—
0x0E
IDDQ-Test
0x0F
—
SCL, SDA and ERR low
All PU/PD resistors, oscillator and supply voltage deactivated
—
—
—
—
—
—
—
Table 13: Selection of Operating Modes
Calibration Op. Modes
In Calibration Mode 1 the user can measure the BIAS
current (IBN), input amplifier reference potential VREFI
and the analog signals from channel 0 following signal
conditioning (PCH0 and NCH0).
In Calibration Mode 2 the conditioned signals from
channels 1 and 2 are output (PCH1, NCH1, PCH2
and NCH2). In addition the intermediate potentials of
the compensating circuits are also available for CH1
(VDC1) and CH2 (VDC2).
In Calibration Mode 3 the internal temperature monitoring signals are provided.
Special Device Test Functions
IDDQ-Test, Saturation Low, Saturation High, and Test
1 to 5 are test modes for iC-Haus device tests. With an
activated bypass (BYP = 1), mode iC-Haus Test 4 permits the direct feedthrough of X1 - X6 input signals to
the output pins; in this instance the output impedance
is high-ohmic. Furthermore, if the input voltage divider
is selected (by RINx = 1- -1), it reduces the signal amplitudes to approx. 7/8.
Signal Filter
iC-MSB has a noise limiting signal filter to filter the conditioned analog signals. This can be activated using
ENF.
ENF
Code
Adr 0x0E, bit 7
Function
0
1
Noise limiter deactivated
Noise limiter activated
Table 14: Signal Filtering
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 17/29
TEST MODE
iC-MSB switches to test mode when a voltage greater
than VTMon is applied to pin ERR (precondition:
TMODE(0) = 1). In response iC-MSB transmits its configuration settings as current-modulated data using error signal I/O pin ERR either directly from the RAM
(for TMEM = 1) or after re-reading the EEPROM (for
TMEM = 0).
TMEM
0
1
Adr 0x18, bit 7
EEPROM contents
iC-MSB RAM contents
When test mode is quit with TMODE > 0, then iCMSB again reads out its configuration from the EEPROM, accessible at the device ID filed to DEVID(6:0)
of adr 0x00. In TMODE = 0x00 the EEPROM is read
completely; in all other cases only the address range
0x00 to 0x21 is read to keep the configuration time
for device testing short. When test mode is quit with
TMODE = 0x00 iC-MSB continues operation without
any interruption.
TMODE
Code
Adr 0x15, bit 7:6
Function during test
mode
00
01
Normal operation
TMEM = 0:
Transmission of
EEPROM data, address
range 0x1B-0x7F
TMEM = 1:
Transmission of RAM
data, address range
0x3B-0x43
Normal operation
Table 15: Test Mode Memory Selection
Should the voltage at the ERR pin fall below
VTMoff test mode is terminated and data transmission
aborted.
The clock rate for the data output is determined by
ENFAST. Two clock rates can be selected: 780 ns for
ENFAST = 1 or 3.125 µs for ENFAST = 0 (see Electrical Characteristics, D08, for clock frequency and tolerances).
10
11
Function following test
mode
Normal operation
Repeated read out of
EEPROM
Repeated read out of
EEPROM
Repeated read out of
EEPROM
Transmission of
EEPROM data, address
range 0x0-0x7F
Data is output in Manchester code via two clock pulses
per bit. To this end the lowside current source switches
between a Z state (OFF = 0 mA) and an L state (ON =
2 mA).
Table 16: Test Mode Functions
VP
VP
The bit information lies in the direction of the current
source switch:
Zero bit: change of state Z → L (OFF to ON)
One bit: Change of state L → Z (ON to OFF)
C21
100nF
ERR
7
VP
C22
U22-S 100nF
AD8029
VN
4
JP4
U23-B
LM393
VP
8
VP
U23-S
LM393
GND
4
6
-
5
+
7
R24
470
M22
IRLML6401
max. 5V
VDD
C24
VP
R26
100pF
100k
Transmission consists of a start bit (a one bit), 8 data
bits and a pause interval in Z state (the timing is identical with an EEPROM access via the I2 C interface).
Decoding of the data stream:
ZZZZZZ LZ LZ ZL ZL ZL LZ ZL LZ ZL ZZZZZZ
Pause 1 1 0 0 0 1 0 1 0 Pause
D21
LL4148
M21
2N7002
DATA_ON
R27
100k
U22-A
2
3
R21
475k
8
5
R22
365k
Example: byte value = 1000 1010
Transmission including the start bit: 1 1000 1010
In Manchester code: LZ LZZL ZLZL LZZL LZZL
R23
2K
R28
51k
U23-A
LM393
-
AD8029
+ NDIS
8
U21
LM285
6
2
-
3
+
R25
2k
1
C26
100nF
DATA_OUT
VP
C25
100nF
4
VDD
C23
100nF
dra_mq1d_error_schem
Figure 1: Example circuit for the decoding and conversion of the current-modulated signals
to logic levels.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 18/29
INPUT CONFIGURATIONS
Input Configurations
All input stages are configured as instrumentation amplifiers and thus directly suitable for differential input
signals. Referenced input signals can be processed as
an option; in this mode input X2 acts as a reference.
INMODE
Code
Adr 0x03, bit 2
Function
0
Differential input signals
1
Single-ended input signals *
Note
* Input X2 is reference for all inputs.
RIN12
RIN0
Code
Adr 0x0E, bit 3:0
Adr 0x13, bit 3:0
Nominal Rin() Intern Rui()
I/V Mode
–000
–010
–100
–110
1.7 kΩ
2.5 kΩ
3.5 kΩ
4.9 kΩ
1.6 kΩ
2.3 kΩ
3.2 kΩ
4.6 kΩ
current input
current input
current input
current input
1—1
0—1
20 kΩ
high
impedance
5 kΩ
1 MΩ
voltage input
voltage input
Table 18: I/V Mode and Input Resistance
Table 17: Input Signal Mode
Both current and voltage signals can be processed as
input signals, selected using RIN12(0) and RIN0(0).
In I Mode an input resistor Rin() becomes active at
each input pin, converting the current signal into a voltage signal. Input resistance Rin() consists of a pad
wiring resistor and resistor Rui() which is linked to the
adjustable bias voltage source VREFin(). The following table shows the possible selections, with Rin() giving the typical resulting input resistance (see Electrical Characteristics for tolerances). The input resistor
should be set in such a way that intermediate potentials VDC1 and VDC2 lie between 125 mV and 250 mV
(verifiable in Calibration Mode 2).
In V Mode an optional voltage divider can be selected
which reduces unacceptably large input amplitudes to
ca. 25%. The circuitry is equivalent to the resistor
chain in I Mode; the pad wiring resistor is considerably
larger here, however.
BIAS12
BIAS0
Code
Adr 0x0E, bit 6
Adr 0x13, bit 6
VREFin()
Type of sensor
0
1
2.5 V)
1.5 V)
Lowside sink current (I Mode)
Highside current source (I Mode)
Table 19: Reference Voltage
BIASEX
Code
Adr 0x0D, bit 7:6
VREFin()
Signal at X2
0-
internal
Neg. Zero Signal (Index -), input
10
11
internal *
external *
Ref. Voltage VREFin12, output
Ref. Voltage VREFin, input
Note
*) The voltage at X2 is reference for all inputs.
Table 20: Input Reference Selection
Figure 2: Input instrumentation amplifier and signal conditioning
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 19/29
SIGNAL PATH MULTIPLEXING: iC-MSBSAFETY
Figure 3: Multiplexer Schematics
The signals for index channel CH0 are connected up to
pins X1 and X2. Pins X3 to X6 are allocated to internal
channels CH1 and CH2 via MUXIN. INMODE can be
activated for referenced input signals; this then selects
X2 as the reference input. For output purposes INVZ
allows the index signal phase to be inverted.
MUXIN
0x03, bit 1:0
Code
PCH1i
NCH1i
PCH2i
NCH2i
00
X4
X6
X3
X5
01
X4
X6
X5
X5
10
X4
X5
X3
X6
11
X4
X3
X5
X6
Table 21: Input Multiplexer for INMODE = 0
MUXIN
0x03, bit 1:0
Code
PCH1i
NCH1i
PCH2i
NCH2i
-0
X4
X2
X3
X2
-1
X4
X2
X5
X2
Table 22: Input Multiplexer for INMODE = 1
EAZ
Adr 0x03, bit 7
Code
Function
0
1
Comparator bypass
Comparator active
Table 23: Index Output
EAZ permits the activation of an analog comparator for
index channel CH0.
INVZ
Code
Adr 0x03, bit 3
PZ_out
NZ_out
0
1
PCH0o
NCH0o
NCH0o
PCH0o
Table 24: Index Signal Inversion
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 20/29
EXTENDED SIGNAL PATH MULTIPLEXING: iC-MSB2
( not for safety applications )
Figure 4: Multiplexer Schematics
The signals for index channel CH0 are connected up to
pins X1 and X2. Pins X3 to X6 are allocated to internal
channels CH1 and CH2 via MUXIN. INMODE can be
activated for referenced input signals; this then selects
X2 as the reference input. For output purposes INVZ
allows the index signal phase to be inverted.
EAZ permits the activation of an analog comparator for
index channel CH0.
EAZ
Code
Adr 0x03, bit 7
Function
0
1
Comparator bypass
Comparator active
MUXIN
0x03, bit 1:0
Code
PCH1i
NCH1i
PCH2i
NCH2i
00
X4
X6
X3
X5
01
X4
X6
X5
X5
MUXOUT
Adr 0x03, bit 6:4
10
X4
X5
X3
X6
Code
PS_Out
11
X4
X3
X5
X6
000
Table 28: Index Output
NS_Out
PC_Out
NC_Out
Channel 1
Channel 2
010
Channel 1
Channel 2 inverted
100
Channel 1 inverted
Channel 2
110
Channel 1 inverted
Channel 2 inverted
0x03, bit 1:0
001
Channel 2
Channel 1
Code
PCH1i
NCH1i
PCH2i
NCH2i
011
Channel 2
Channel 1 inverted
-0
X4
X2
X3
X2
101
Channel 2 inverted
Channel 1
X2
111
Channel 2 inverted
Channel 1 inverted
Table 25: Input Multiplexer for INMODE = 0
MUXIN
-1
X4
X2
X5
Table 26: Input Multiplexer for INMODE = 1
INVZ
Adr 0x03, bit 3
Code
PZ_out
NZ_out
0
1
PCH0o
NCH0o
NCH0o
PCH0o
Table 27: Index Signal Inversion
Table 29: Output Multiplexer
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 21/29
SIGNAL CONDITIONING CH1, CH2
The voltage signals necessary for the conditioning of
channels 1 and 2 can be measured in operation mode
Calibration 2.
Gain Settings CH1, CH2
The gain is set in four stages:
1. The sensor supply tracking is shut down and the
constant current source for the ACO output set to a
suitable output current (register ADJ; current value
close to the later operating point).
GR12
Code
Adr 0x04, bit 2:0
Range with RIN12=0x9
Range with RIN126=0x9
0x0
0x1
0x2
0x3
0x4
0x5
0.5
1.0
1.3
1.7
2.2
2.6
2.0
4.1
5.3
6.7
8.7
10.5
0x6
0x7
3.3
4.0
13.2
16.0
Table 30: Gain Range CH1, CH2
2. The coarse gain is selected so that the differential
signal amplitudes of ca. 1 Vpp are produced (signal Px
vs. Nx, see Figure below).
3. Using fine gain factor GF2 the CH2 signal amplitude
is then adjusted to 1 Vpp.
GF2
Code
Adr 0x04, bit 7:3
Factor
0x00
0x01
1.00
1.06
...
0x1F
6.25
6.25
4. The CH1 signal amplitude can then be adjusted to
the CH2 signal amplitude via fine gain factor GF1.
0.25 Vp
0.25 Vp
1 Vpp
GF 2
31
Table 31: Fine Gain Factor CH2
GF1
Adr 0x06, bit 2:0, Adr 0x05, bit 7:0
Code
Factor
0x000
0x001
1.0
1.0009
...
0x7FF
6.25 1984
6.6245
GF 1
iC-MSB
Px
Table 32: Fine Gain Factor CH1
R0
Vpk(Px)
Vpeak-to-peak
Nx
Vpk(Nx)
GND
Figure 5: Definition of 1 Vpp signal. Termination R0
must be high-ohmic during all Test and
Calibration modes.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 22/29
Offset Calibration CH1, CH2
In order to calibrate the offset the reference source
must first be selected using VOS12. Two fixed voltages
and two dependent sources are available for this purpose. The fixed voltage sources should be selected for
external sensors which provide stable, self-regulating
signals.
So that photosensors can be operated in optical encoders iC-MSB tracks changes in offset voltages via
the signal-dependent source VDC when used in conjunction with the controlled sensor current source for
LED supply (pin ACO). The VDC potential automatically tracks higher DC photocurrents. To this end intermediate potentials VDC1 and VDC2 must be adjusted
to a minimal AC ripple using the selectable k factor (this
calibration must be repeated when the gain setting is
altered).
The feedback of pin voltage V(ACO) fulfills the same
task as source VDC when MR bridge sensors are supplied by the controlled power supply output. In this
instance the VDC intermediate voltages do not need
adjusting.
VOS12
Code
Adr 0x0E, bit 5:4
Type of source
0x0
0x1
0x2
0x3
0.05 · V(ACO)
0.5 V
0.25 V
VDC (ie. VDC1, VDC2)
Table 33: Offset Reference Source CH1, CH2
The calibration range for the CH1/CH2 offset is dependent on the selected VOS12 source and is set using
OR1 and OR2. Both sine and cosine signals are then
calibrated using factors OF1 and OF2. The calibration
target is reached when the DC fraction of the differential signals PCHx versus NCHx is zero.
OR1
Adr 0x09, bit 0; Adr 0x08, bit 7
OR2
Code
Adr 0x0A, bit 5:4
Range
0x0
x1
0x1
0x2
0x3
x2
x6
x12
Table 35: Offset Range CH1, CH2
OF1
Adr 0xA, bit 3:0; Adr 0x9, bit 7:1
OF2
Code
Adr 0xC, bit 0; Adr 0xB, bit 7:0; Adr 0xA, bit 7:6
Factor
Code
Factor
0x000
0x001
...
0x3FF
0
0.00098
0.00098 · OFx
1
0x400
0x401
...
0x7FF
0
−0.00098
−0.00098 · OFx
−1
Table 36: Offset Factors CH1, CH2
Phase Correction CH1 vs. CH2
The phase shift between CH1 and CH2 can be adjusted using parameter PH12. Following phase calibration other calibration parameters may have to be
adjusted again (those as amplitude compensation, intermediate potentials and offset voltages).
VDC1
VDC2
Code
Adr 0x07, bit 4:0; Adr 0x06, bit 7:3
Adr 0x08, bit 6:0; Adr 0x07, bit 7:5
VDC = k · VPi + (1 − k) · VNi
PH12
Code
Adr 0xD, bit 2:0; Adr 0xC, bit 7:1
Correction angle
Code
Correction angle
0x000
0x001
...
0x3FF
k
k
k
k
0x000
0x001
...
0x1FF
+0
+0.0204
+0.0204 · PH12
+10.42
=
=
=
=
0.33
0.33032
0.33 + MP2 · 0.00032
0.66
Table 34: Intermediate Voltages CH1, CH2
0x200
0x201
...
0x3FF
−0
−0.0204
−0.0204 · PH12
−10.42
Table 37: Phase Correction CH1 vs. CH2
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 23/29
SIGNAL CONDITIONING CH0
The voltage signals needed to calibrate channel 0 are
available in Calibration Mode 1.
Gain Settings CH0
Parallel to the conditioning process for the CH1 and
CH2 signals the CH0 gain is set in the following stages:
1. The sensor supply tracking unit is shut down and the
constant current source for the ACO output set to the
same output current as in the compensation of CH1
and CH2 (register ADJ; current value close to the later
operating point).
2. The coarse gain is selected so that a differential signal amplitude of ca. 1 Vpp is produced internally (signal PCHx versus NCHx).
3. GF0 then permits fine gain adjustment to 1 Vpp.
GR0
Code
Adr 0x11, bit 2:0
Range with RIN0=0x9
Range with RIN06=0x9
0x0
0x1
0x2
0.5
1.0
1.3
2.0
4.1
5.3
0x3
0x4
0x5
0x6
0x7
1.7
2.2
2.6
3.3
4.0
6.7
8.7
10.5
13.2
16.0
Table 38: Gain Range CH0
Offset Calibration CH0
To calibrate the offset the source of supply must first
be selected using VOS0 (see Offset Calibration CH1
and CH2 for further information). For the CH0 path the
dependent source VDC is identical to source VDC1.
VOSZ
Code
Adr 0x13, bit 5:4
Source
0x0
0.05 · V(ACO)
0x1
0x2
0x3
0.5 V
0.25 V
VDC (ie. VDC1)
Table 40: Offset Reference Source CH0
OR0
Code
Adr 0x12, bit 1:0
Range
0x0
0x1
0x2
0x3
x1
x2
x6
x12
Table 41: Offser Range CH0
OF0
Code
Adr 0x12, bit 7:2
Factor
Code
Factor
0x00
0x01
...
0x1F
0
0.0322
0.0322 · OFZ
1
0x20
0x21
...
0x3F
0
-0.0322
-0.0322 · OFZ
-1
Table 42: Offset Factor CH0
GF0
Code
Adr 0x11, bit 7:3
Factor
0x00
0x01
1.00
1.06
...
0x1F
6.25
6.25
GFZ
31
Table 39: Fine Gain Factor CH0
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 24/29
SIGNAL LEVEL CONTROL and SIGNAL MONITORING
Via the controlled sensor current source (pin ACO)
iC-MSB can keep the output signals for the ensuing
sine/digital converter constant regardless of temperature and aging effects by tracking the sensor supply.
Both the controller operating range and input signal
amplitude for the controller are monitored and can
be enabled for error messaging. A constant current
source can be selected for the ACO output when setting the signal conditioning; the current range for the
highside current source is adjusted using ADJ(6:5).
ADJ (6:5)
Code
Adr 0x10, bit 5:4
Function
00
01
10
11
5 mA - Range
10 mA - Range
25 mA - Range
50 mA - Range
Table 44: ACO Output Current Range (applies for control modes and constant current source)
ADJ (4:0)
Code
Adr 0x10, bit 3:0; Adr 0x0F, bit 7
Square control ADJ(8:7) = 00
0x00
0x01
Vpp() ca. 300 mV (60 %)
Vpp() ca. 305 mV (61 %)
...
77
Vpp() ≈ 300 mV 77−(1.25∗Code)
0x19
...
0x1F
Vpp() ca. 500 mV (98 %)
...
Vpp() ca. 600 mV (120 %)
Table 45: Vpp Setpoint For Square Control
Figure 6: Signal level monitoring with square control
(example for ADJ(8:0) = 0x19; see Elec.
Char. Nos.607 and 608 regarding Vt()min
resp. Vt()max)
ADJ (4:0)
Code
Adr 0x10, bit 3:0; Adr 0x0F, bit 7
Sum control ADJ(8:7) = 01
0x00
0x01
VDC1 + VDC2 ca. 245 mV
VDC1 + VDC2 ca. 249 mV
...
77
VDC1 + VDC2 ≈ 245mV 77−(1.25∗Code)
0x1F
VDC1 + VDC2 ca. 490 mV
Table 46: DC Setpoint For Sum Control
ADJ (4:0)
Code
Adr 0x10, bit 3:0; Adr 0x0F, bit 7
Constant current source ADJ(8:7) = 10
0x00
0x01
I(ACO) ca. 3.125% Isc(ACO)
I(ACO) ca. 6.25% Isc(ACO)
ADJ (8:7)
Code
Adr 0x10, bit 7:6
Function
00
01
10
Sine/cosine square control
Sum control
Constant current source
...
I(ACO) ≈ 3.125% ∗ (Code + 1) ∗ Isc(ACO)
0x1F
I(ACO) ca. 100% Isc(ACO)
11
Not permitted (device test only)
Notes
See Elec. Char. No. 602 for Isc(ACO)
Table 43: Controller Operating Modes
Table 47: I(ACO) With Constant Current Source
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 25/29
ERROR MONITORING AND ALARM OUTPUT
The following table gives the errors which can both
be recognized by iC-MSB and enabled either for messaging, output shutdown or protocol in the EEPROM.
Mask EMASKA stipulates that errors should be signaled at pin ERR, mask EMASKO determines whether
the line driver outputs are to be shutdown or not
(with PDMODE setting a renewed power-on) and mask
EMASKE governs the storage of error events in the
EEPROM.
I/O pin ERR
Pin ERR is operated by a current-limited open drain
output driver and has an internal pull-up which can be
shutdown. The ERR pin also acts as an input for external system error messaging and for switching iCMSB to test mode for which a voltage of greater than
VTMon must be applied. Interpretation of external
system error messaging and the phase length of the
message output can be set using EPH; the minimum
signaling duration for internal errors is adjusted using
EMTD(2:0).
EMASKA
EMASKO
Adr 0x14, bit 6:0
Adr 0x16, bit 6:0
EMASKE
Bit
Adr 0x18, bit 2:0; Adr 0x17, bit 7:4
Error Event
EPU
Code
Adr 0x17, bit 2
Function
6
Configuration error*: SDA or SCL pin error, no Ack
signal from EEPROM or invalid check sum
Excessive temperature warning
External system error
0
without internal pull-up at ERR
1
internal pull-up at ERR active
5
4
3
2
1
0
Level controller out of range (max. limit)
Level controller out of range (min. limit)
Signal clipping (excessive input level)
Loss of signal (poor input level or CH1/CH2 phase
out of range)
Note
*) The line drivers remain high impedance (tristate)
when cycling power.
Table 50: Alarm Output Pull-up Enable
PDMODE
Adr 0x18, bit 6
Code
Function
0
1
Line driver active when no error persists
Line driver active after power-on
Table 51: Driver Activation
Table 48: Error Event Masks
Error Protocol
Out of the errors pinpointed by EMASKE both the first
(ERR1) and last error (ERR2) which occur after the
iC-MSB is turned on are stored in the EEPROM. The
EEPROM also has a memory area in which all occurring errors can be stored (ERR3). Only the fact that an
error has occurred can be recorded, with no information as to the time and frequency of that error given.
The EEPROM memory can be used to statistically
evaluate the causes of system failure, for example.
ERR1
ERR2
ERR3
Bit
Adr 0x20, bit 6:0
Adr 0x22, bit 0; Adr 0x21, bit 7:2
Adr 0x23, bit 2:0; Adr 0x22, bit 7:4
Error Event
9:0
Assignation according to EMASKE
Code
Function
0
1
No event
Registered error event
Table 49: Error Protocol
EPH
Adr 0x15, bit 2
Code
ERR pin function
Ext. error message
0
with error low,
otherwise Z
with error Z,
otherwise low
with error low,
otherwise pull-up active
with error pull-up active,
otherwise low
1
Table 52: Alarm Input/Output Logic
EMTD
Adr 0x15, bit 5:3
Code
Indication Time
Code
Indication Time
0x0
0x1
0 ms
12.5 ms
0x4
0x5
50 ms
62.5 ms
0x2
0x3
25 ms
37.5 ms
0x6
0x7
75 ms
87.5 ms
Table 53: Minimum Alarm Indication Time
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 26/29
TEMPERATURE MONITORING
iC-MSB has an integrated temperature monitor. If the
temperature threshold is exceeded an excessive temperature message is generated which is processed in
the temperature monitor block. The warning threshold
can be signaled at pin ERR or used to shut down the
line drivers. If temperature Toff = Twarn + ∆T is exceeded the line drivers are shut down independent of
EMASKO(6:0).
REVERSE POLARITY PROTECTION
The line drivers in iC-MSB are protected against reverse polarity and short-circuiting. A defective device
cable or one wrongly connected cause damage neither
to iC-MSB nor to the components protected against reverse polarity by VDDS and GNDS. The following pins
are also reverse polarity protected: PC, NC, PS, NS,
PZ, NZ, ERR, VDD, GND and ACO (as long as GNDS
is only loaded versus VDDS). The maximum voltage
difference between the pins should not be greater than
6 V, the exception here being pin ERR.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 27/29
APPLICATION HINTS
Connecting MR sensor bridges for safety-related applications
For safety-related applications iC-MSBSAFETY requires an external overvoltage protection of supply VDD (Zener
diode with fuse, for instance) and external pull-down resistors at the inputs X3 to X6 towards GNDS (of up to
100 kΩ).
F1
R5
2.2kS
VP
SCL
R6
2.2kS
C1
100nF
C2
100nF
VDDS
SCL
24xx
ACO
MR0
X1
X2
D1
5.6V
VDD
ERR
I2C
SDA
SDA
VN
+5V
ERR
iC-MSB
SIGNAL
LEVEL
CONTROL
PZ
RL
100S
+
NZ
PC
INPUT ZERO
MR1
X3
X5
R1
100kS
R2
100kS
RL
100S
+
NC
INPUT COS
PS
MR2
X4
X6
R3
100kS
R4
100kS
+
RL
100S
-
NS
INPUT SIN
GNDS
GND
0V
TVS diode array
Figure 7: Example circuit for safety-related applications with iC-MSBSAFETY .
PLC Operation
There are PLCs with a remote sense supply which require longer for the voltage regulation to settle. At the
same time the PLC inputs can have high-impedance
resistances versus an internal, negative supply voltage
which define the input potential for open inputs.
In this instance iC-MSB’s reverse polarity protection
feature can be activated as the outputs are tristate during the start phase and the resistances in the PLC determine the pin potential. During the start phase nei-
ther the supply VDD nor the output pins, which are
also monitored, must fall to below ground potential (pin
GND); otherwise the device is not configured and the
outputs remain permanently set to tristate.
In order to ensure that iC-MSB starts with the PLCs
mentioned above pull-up resistors can be used in the
encoder. Values of 100 kΩ are usually sufficient; it
is, however, recommended that PLC specifications be
specifically referred to here.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 28/29
iC-Haus expressly reserves the right to change its products and/or specifications. An Infoletter gives details as to any amendments and additions made to the
relevant current specifications on our internet website www.ichaus.de/infoletter; this letter is generated automatically and shall be sent to registered users by
email.
Copying – even as an excerpt – is only permitted with iC-Haus approval in writing and precise reference to source.
iC-Haus does not warrant the accuracy, completeness or timeliness of the specification on this site and does not assume liability for any errors or omissions
in the materials. The data specified is intended solely for the purpose of product description. No representations or warranties, either express or implied, of
merchantability, fitness for a particular purpose or of any other nature are made hereunder with respect to information/specification or the products to which
information refers and no guarantee with respect to compliance to the intended use is given. In particular, this also applies to the stated possible applications or
areas of applications of the product.
iC-Haus conveys no patent, copyright, mask work right or other trade mark right to this product. iC-Haus assumes no liability for any patent and/or other trade
mark rights of a third party resulting from processing or handling of the product and/or any other use of the product.
As a general rule our developments, IPs, principle circuitry and range of Integrated Circuits are suitable and specifically designed for appropriate use in technical
applications, such as in devices, systems and any kind of technical equipment, in so far as they do not infringe existing patent rights. In principle the range of
use is limitless in a technical sense and refers to the products listed in the inventory of goods compiled for the 2008 and following export trade statistics issued
annually by the Bureau of Statistics in Wiesbaden, for example, or to any product in the product catalogue published for the 2007 and following exhibitions in
Hanover (Hannover-Messe).
We understand suitable application of our published designs to be state-of-the-art technology which can no longer be classed as inventive under the stipulations
of patent law. Our explicit application notes are to be treated only as mere examples of the many possible and extremely advantageous uses our products can
be put to.
iC-MSBSAFETY, iC-MSB2
SIN/COS SIGNAL CONDITIONER WITH 1Vpp DRIVER
Rev D2, Page 29/29
ORDERING INFORMATION
Type
Package
Order Designation
iC-MSBSAFETY
TSSOP20
TSSOP20 with thermal pad
iC-MSB TSSOP20
iC-MSB TSSOP20-TP
iC-MSB EVAL MSB1D
TSSOP20
iC-MSB2 TSSOP20
iC-MSB2 EVAL MSB1D
Evaluation Board iC-MSBSAFETY
iC-MSB2
Evaluation Board iC-MSB2
For technical support, information about prices and terms of delivery please contact:
iC-Haus GmbH
Am Kuemmerling 18
D-55294 Bodenheim
GERMANY
Tel.: +49 (61 35) 92 92-0
Fax: +49 (61 35) 92 92-192
Web: http://www.ichaus.com
E-Mail: [email protected]
Appointed local distributors: http://www.ichaus.com/sales_partners
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