TI1 LM317LID 3-terminal adjustable regulator Datasheet

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LM317L
SLCS144E – JULY 2004 – REVISED OCTOBER 2014
LM317L 3-Terminal Adjustable Regulator
1 Features
3 Description
•
The LM317L device is an adjustable, 3-terminal,
positive-voltage regulator capable of supplying
100 mA over an output-voltage range of 1.25 V to
32 V. It is exceptionally easy to use and requires only
two external resistors to set the output voltage.
1
•
•
•
•
•
Output Voltage Range Adjustable 1.25 V to 32 V
When Used With External Resistor Divider
Output Current Capability of 100 mA
Input Regulation Typically 0.01% Per InputVoltage Change
Output Regulation Typically 0.5%
Ripple Rejection Typically 80 dB
For Higher Output Current Requirements,
See LM317M (500 mA) and LM317 (1.5 A)
Device Information
PART NUMBER
PACKAGE
LM317L
2 Applications
•
•
•
•
•
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
TO-92 (3)
4.30 mm × 4.30 mm
SOT-89 (3)
4.50 mm × 2.50 mm
TSSOP (8)
3.00 mm × 4.40 mm
Electronic Points of Sale
Medical, Health, and Fitness Applications
Printers
Appliances and White Goods
TV Set-Top Boxes
4 Simplified Schematic
LM317L
VI
Input
VO
Output
Adjustment
R1
470 W
C2 = 1 µF
C1 = 0.1 µF
R2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM317L
SLCS144E – JULY 2004 – REVISED OCTOBER 2014
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
5
Absolute Maximum Ratings .....................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 6
8.1 Overview ................................................................... 6
8.2 Functional Block Diagram ......................................... 6
8.3 Feature Description................................................... 7
8.4 Device Functional Modes.......................................... 7
9
Application and Implementation .......................... 8
9.1 Application Information.............................................. 8
9.2 Typical Application ................................................... 8
9.3 General Configurations ........................................... 10
10 Power Supply Recommendations ..................... 14
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Example .................................................... 14
12 Device and Documentation Support ................. 15
12.1 Trademarks ........................................................... 15
12.2 Electrostatic Discharge Caution ............................ 15
12.3 Glossary ................................................................ 15
13 Mechanical, Packaging, and Orderable
Information ........................................................... 15
5 Revision History
Changes from Revision D (October 2011) to Revision E
Page
•
Added Device Information table, Pin Functions table, Handling Ratings table, Thermal Information table, Typical
Characteristics, Detailed Description, Application and Implementation, Power Supply Recommendations, Layout,
Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections .............................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
2
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6 Pin Configuration and Functions
D PACKAGE
(TOP VIEW)
INPUT
OUTPUT
OUTPUT
ADJUSTMENT
1
8
2
7
3
6
4
5
PW PACKAGE
(TOP VIEW)
NC
OUTPUT
OUTPUT
NC
INPUT
NC
NC
ADJUSTMENT
NC – No internal connection
OUTPUT terminals are all internally connected.
1
8
2
7
3
6
4
5
NC
NC
OUTPUT
NC
NC – No internal connection
PK PACKAGE
(TOP VIEW)
LP PACKAGE
(TOP VIEW)
INPUT
INPUT
OUTPUT
OUTPUT
ADJUSTMENT
ADJUSTMENT
Pin Functions
NAME
D, PW
LP, PK
TYPE
ADJUSTMENT
4
√
I
Output feedback voltage
INPUT
1
√
I
Input supply voltage
√
—
No connect
√
O
Regulated output voltage
NC
5
8
DESCRIPTION
2
OUTPUT
3
6
7
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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating temperature range (unless otherwise noted)
MIN
Vl – VO
Input-to-output differential voltage
TJ
Operating virtual-junction temperature
(1)
MAX
UNIT
35
V
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
(2)
Electrostatic discharge
MIN
MAX
UNIT
°C
–65
150
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
0
3000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
0
2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VO
Output voltage
1.25
32
VI – VO
Input-to-output voltage differential
2.5
32
V
IO
Output current
2.5
100
mA
TJ
Operating virtual-junction temperature
0
125
–40
125
LM317LC
LM317LI
V
°C
7.4 Thermal Information
LM317L
THERMAL METRIC (1)
RθJA Junction-to-ambient thermal resistance
(1)
4
D
8 PINS
LP
3 PINS
PK
3 PINS
PW
8 PINS
UNIT
97.1
139.5
51.5
149.4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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7.5 Electrical Characteristics
over recommended operating virtual-junction temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
Input voltage regulation (2)
VI – VO = 5 V to 35 V
VO = 10 V,
Ripple regulation
MIN
TYP
MAX
TJ = 25°C
0.01
0.02
IO = 2.5 mA to 100 mA
0.02
0.05
f = 120 Hz
66
dB
80
VI = 5 V to 35 V, TJ = 25°C,
IO = 2.5 mA to 100 mA,
VO ≤ 5 V
25
mV
VO ≥ 5 V
5
mV/V
VI = 5 V to 35 V,
IO = 2.5 mA to 100 mA
VO ≤ 5 V
50
mV
VO ≥ 5 V
10
mV/V
Output voltage change with temperature
TJ = 0°C to 125°C
Output voltage long-term drift
After 1000 hours at TJ = 125°C and VI – VO = 35 V
Output noise voltage
f = 10 Hz to 10 kHz,
Minimum output current to maintain regulation
VI – VO = 35 V
Peak output current
VI – VO ≤ 35 V
10
3
TJ = 25°C
mV/V
10
100
Change in ADJUSTMENT current
VI – VO = 2.5 V to 35 V,
IO = 2.5 mA to 100 mA
Reference voltage (output to ADJUSTMENT)
VI – VO = 5 V to 35 V,
P ≤ rated dissipation
IO = 2.5 mA to 100 mA,
1.2
mV/V
μV/V
30
1.5
ADJUSTMENT current
(2)
%V
65
VO = 10 V,
10-μF capacitor between ADJUSTMENT and ground
Output voltage regulation
(1)
UNIT
2.5
200
mA
mA
50
100
μA
0.2
5
μA
1.25
1.3
V
Unless otherwise noted, these specifications apply for the following test conditions: VI – VO = 5 V and IO = 40 mA. Pulse-testing
techniques must be used that maintain the junction temperature as close to the ambient temperature as possible. All characteristics are
measured with a 0.1-μF capacitor across the input and a 1-μF capacitor across the output.
Input voltage regulation is expressed here as the percentage change in output voltage per 1-V change at the input.
7.6 Typical Characteristics
Change in adjustment current (A)
2
ûIADJ
1
0
±40
±15
10
35
60
Operating temperature (ƒC)
85
110
C001
Figure 1. Change in Adjustment Current Over Temperature
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8 Detailed Description
8.1 Overview
The LM317L device is a 100-mA linear regulator with high voltage tolerance up to 35 V. The device has a
feedback voltage that is relative to the output instead of ground. This ungrounded design allows the LM317L
device to have superior line and load regulation. This design also allows the LM317L device to be used as a
current source or current sink using a single resistor. Any output voltage from 1.25 to 32 V can be obtained by
using two resistors. The bias current of the device, up to 2.5 mA, flows to the output; this current must be used
by the load or the feedback resistors. The power dissipation is the product of pass-element voltage and current,
which is calculated as shown in Equation 1.
PD = (VIN – VOUT) × IOUT
(1)
The application heat sink must be able to absorb the power calculated in Equation 1.
In addition to higher performance than fixed regulators, this regulator offers full overload protection, available
only in integrated circuits. Included on the chip are current-limiting and thermal-overload protection. All overloadprotection circuitry remains fully functional even when ADJUSTMENT is disconnected. Normally, no capacitors
are needed unless the device is situated far from the input filter capacitors, in which case an input bypass is
needed. An optional output capacitor can be added to improve transient response. ADJUSTMENT can be
bypassed to achieve very high ripple rejection, which is difficult to achieve with standard three-terminal
regulators.
In addition to replacing fixed regulators, the LM317L regulator is useful in a wide variety of other applications.
Since the regulator is floating and sees only the input-to-output differential voltage, supplies of several hundred
volts can be regulated as long as the maximum input-to-output differential is not exceeded. Its primary
application is that of a programmable output regulator, but by connecting a fixed resistor between ADJUSTMENT
and OUTPUT, this device can be used as a precision current regulator. Supplies with electronic shutdown can be
achieved by clamping ADJUSTMENT to ground, programming the output to 1.25 V, where most loads draw little
current.
The LM317LC device is characterized for operation over the virtual junction temperature range of 0°C to 125°C.
The LM317LI device is characterized for operation over the virtual junction temperature range of –40°C to 125°C.
8.2 Functional Block Diagram
Input
Iadj
+
1.25V
Adj.
Over Temp &
Over Current
Protection
Output
6
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8.3 Feature Description
8.3.1 NPN Darlington Output Drive
NPN Darlington output topology provides naturally low output impedance and an output capacitor is optional. To
support maximum current and lowest temperature, 2.5-V headroom is recommended (VI – VO).
8.3.2 Overload Block
Over-current and over-temperature shutdown protects the device against overload or damage from operating in
excessive heat.
8.3.3 Programmable Feedback
Op amp with 1.25-V offset input at the ADJUST pin provides easy output voltage or current (not both)
programming. For current regulation applications, a single resistor whose resistance value is 1.25 V / IOUT and
power rating is greater than (1.25 V)2 / R should be used. For voltage regulation applications, two resistors set
the output voltage. See Typical Application for a schematic and the resistor formula.
8.4 Device Functional Modes
8.4.1 Normal operation
The device OUTPUT pin will source current necessary to make OUTPUT pin 1.25 V greater than ADJUST
terminal to provide output regulation.
8.4.2 Operation With Low Input Voltage
The device requires up to 2.5-V headroom (VI – VO) to operate in regulation. With less headroom, the device
may drop out and OUTPUT voltage will be INPUT voltage minus drop out voltage.
8.4.3 Operation at Light Loads
The device passes its bias current to the OUTPUT pin. The load or feedback must consume this minimum
current for regulation or the output may be too high.
8.4.4 Operation In Self Protection
When an overload occurs the device will shut down Darlington NPN output stage or reduce the output current to
prevent device damage. The device will automatically reset from the overload. The output may be reduced or
alternate between on and off until the overload is removed.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The two output resistors are the only components required to adjust VOUT.
9.2 Typical Application
LM317L
VI
Input
VO
Output
Adjustment
R1
470 W
C2 = 1 µF
C1 = 0.1 µF
R2
9.2.1 Design Requirements
1. Use of an input bypass capacitor is recommended if regulator is far from the filter capacitors.
2. For this design example, use the parameters listed in Table 1.
3. Use of an output capacitor improves transient response, but is optional.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
(Output Voltage + 2.5 V) to 32 V
Output voltage
VREF × (1 + R2 / R1) + IADJ × R2
9.2.2 Detailed Design Procedure
9.2.2.1 Input Capacitor
An input capacitor is not required, but it is recommended, particularly if the regulator is not in close proximity to
the power-supply filter capacitors. A 0.1-µF ceramic or 1-µF tantalum provides sufficient bypassing for most
applications, especially when adjustment and output capacitors are used.
9.2.2.2 Output Capacitor
An output capacitor improves transient response, but it not needed for stability.
9.2.2.3 Feedback Resistors
The feedback resistor set the output voltage using Equation 2.
8
VREF × (1 + R2 / R1) + IADJ × R2
(2)
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9.2.2.4 Adjustment Terminal Capacitor
The optional adjustment pin capacitor will improve ripple rejection by preventing the amplification of the ripple.
When capacitor is used and VOUT > 6 V, a protection diode from adjust to output is recommended.
9.2.2.5 Design Options and Parameters
Common Linear Regulator designs are concerned with the following parameters:
• Input voltage range
• Input capacitor range
• Output voltage
• Output current rating
• Output capacitor range
• Input short protection
• Stability
• Ripple rejection
9.2.2.6 Output Voltage
VO is calculated as shown in Equation 3.
æ
R ö
VOUT = VREF ´ ç 1 + 2 ÷ + (IADJ ´ R2 )
R1 ø
è
(3)
Because IADJ typically is 50 µA, it is negligible in most applications.
9.2.2.7 Ripple Rejection
CADJ is used to improve ripple rejection; it prevents amplification of the ripple as the output voltage is adjusted
higher. If CADJ is used, it is best to include protection diodes.
9.2.2.8 Input Short Protection
If the input is shorted to ground during a fault condition, protection diodes provide measures to prevent the
possibility of external capacitors discharging through low-impedance paths in the IC. By providing low-impedance
discharge paths for CO and CADJ, respectively, D1 and D2 prevent the capacitors from discharging into the output
of the regulator.
9.2.3 Application Curves
1.3
40qC
0qC
25qC
125qC
VADJUSTMENT (V)
1.28
1.26
1.24
1.22
1.2
0
6.25
12.5
18.75
25
VI VO (V)
31.25
37.5
42.5
D001
Figure 2. Adjustment Voltage Relative to Output Over Temperature
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9.3 General Configurations
9.3.1 Regulator Circuit With Improved Ripple Rejection
C2 helps to stabilize the voltage at the adjustment pin, which will help reject noise. Diode D1 exists to discharge
C2 in case the output is shorted to ground.
LM317L
Input
VI
Output
VO
R1 =
470 W
Adjustment
C1 =
0.1 µF
D1†
1N4002
+
R2 =
10 kW
+
−
−
C2 = 10 µF
C3 = 1 µF
Figure 3. Regulator Circuit With Improved Ripple Rejection
9.3.2 0-V to 30-V Regulator Circuit
In the 0-V to 30-V regulator circuit application, the output voltage is determined by Equation 4.
æ
R + R3 ö
VOUT = VREF ç 1 + 2
÷ - 10 V
R1 ø
è
(4)
LM317L
35 V
Input
Output
Adjustment
VO
R1 = 120 W
−10 V
C1 = 0.1 µF
R3 =
820 W
R2 = 3 kW
1N4002
Figure 4. 0-V to 30-V Regulator Circuit
9.3.3 Precision Current-Limiter Circuit
This application will limit the output current to the ILIMIT shown in Figure 5.
LM317L
VI
Input
Output
Adjustment
R1
Ilimit = 1.25
R1
Figure 5. Precision Current-Limiter Circuit
10
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General Configurations (continued)
9.3.4 Tracking Preregulator Circuit
The tracking preregulator circuit application keeps a constant voltage across the second LM317L in the circuit.
R2 = 1.5 kΩ
R1 = 470 Ω
Adjustment
Input
VI
Output
LM317L
LM317L
Input
VO
Output
Adjustment
C1 = 0.1 µF
R3 = 240 Ω
C2 = 1 µF
Output
Adjust
R4 = 2 kΩ
Figure 6. Tracking Preregulator Circuit
9.3.5 Slow-Turn On 15-V Regulator Circuit
The capacitor C1, in combination with the PNP transistor, helps the circuit to slowly start supplying voltage. In the
beginning, the capacitor is not charged. Therefore, output voltage will start at 1.9 V, as determined by
Equation 5. As the capacitor voltage rises, VOUT will rise at the same rate. When the output voltage reaches the
value determined by R1 and R2, the PNP will be turned off.
VC1 + VBE + 1.25 V = 0 V + 0.65 V + 1.25 V = 1.9 V
(5)
LM317L
VI
Input
VO = 15 V
Output
Adjustment
R1 =
470 Ω
1N4002
R3 = 50 kΩ
R2 = 5.1 kΩ
2N2905
C1 = 25 µF
Figure 7. Slow-Turn On 15-V Regulator Circuit
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General Configurations (continued)
9.3.6 50-mA Constant-Current Battery-Charger Circuit
The current-limit operation mode can be used to trickle charge a battery at a fixed current as determined by
Equation 6. VI should be greater than VBAT + 3.75 V.
ICHG = 1.25 V ÷ 24 Ω
(1.25 V [VREF] + 2.5 V [headroom])
(6)
(7)
LM317L
VI
Input
24 Ω
Output
Adjustment
Figure 8. 50-mA Constant-Current Battery-Charger Circuit
9.3.7 Current-Limited 6-V Charger
As the charge current increases, the voltage at the bottom resistor increases until the NPN starts sinking current
from the adjustment pin. The voltage at the adjustment pin will drop, and consequently the output voltage will
decrease until the NPN stops conducting.
LM317L
VI
Input
Output
Adjustment
240 Ω
1.1 kΩ
VBE
ICHG
R =
VBE
I CHG
V−
Figure 9. Current-Limited 6-V Charger
12
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General Configurations (continued)
9.3.8 High-Current Adjustable Regulator
This application allows higher currents at VOUT than the LM317L device can provide, while still keeping the output
voltage at levels determined by the adjustment-pin resistor divider of the LM317L.
TIP73
2N2905
VI
500 W
5 kW
LM317L
22 W
Input
Output
Adjustment
VO
120 W
10 µF
1N4002
47 µF
RL
5 kW
10 µF
Figure 10. High-Current Adjustable Regulator
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10 Power Supply Recommendations
The LM317L device is designed to operate from an input voltage supply range between 2.5 V to 32 V greater
than the output voltage. If the device is more than six inches from the input filter capacitors, an input bypass
capacitor, 0.1 µF or greater, of any type is needed for stability.
11 Layout
11.1 Layout Guidelines
•
•
•
It is recommended that the input pin be bypassed to ground with a bypass-capacitor.
The optimum placement is closest to the VIN of the device and GND of the system. Care must be taken to
minimize the loop area formed by the bypass-capacitor connection, the VIN pin, and the GND pin of the
system.
For operation at full-rated load, it is recommended to use wide trace lengths to eliminate IR drop and heat
dissipation.
11.2 Layout Example
OUTPUT
Ground
COUT
R2
Power
INPUT
OUTPUT
R1
ADJ/GND
Cadj
High
Frequency
Bypass
Capacitor
0.1μF
10μF
High Input
Bypass
Capacitor
Ground
Figure 11. Layout Diagram
14
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12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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22-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM317LCD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCDRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCLP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 125
L317LC
LM317LCLPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 125
L317LC
LM317LCLPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 125
L317LC
LM317LCPK
ACTIVE
SOT-89
PK
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LA
LM317LCPKG3
ACTIVE
SOT-89
PK
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LA
LM317LCPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCPWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LCPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 125
L317LC
LM317LID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LIDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
L317LI
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM317LIDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LILP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
-40 to 125
L317LI
LM317LILPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
-40 to 125
L317LI
LM317LILPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
-40 to 125
L317LI
LM317LIPK
ACTIVE
SOT-89
PK
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LB
LM317LIPKG3
ACTIVE
SOT-89
PK
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LB
LM317LIPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LIPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LIPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
LM317LIPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L317LI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM317LCDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM317LCDR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM317LCDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM317LCPK
SOT-89
PK
3
1000
180.0
12.4
4.91
4.52
1.9
8.0
12.0
Q3
LM317LCPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM317LIDR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM317LIDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM317LIDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM317LIPK
SOT-89
PK
3
1000
180.0
12.4
4.91
4.52
1.9
8.0
12.0
Q3
LM317LIPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM317LCDR
SOIC
D
8
2500
340.5
338.1
20.6
LM317LCDR
SOIC
D
8
2500
364.0
364.0
27.0
LM317LCDRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM317LCPK
SOT-89
PK
3
1000
340.0
340.0
38.0
LM317LCPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM317LIDR
SOIC
D
8
2500
364.0
364.0
27.0
LM317LIDR
SOIC
D
8
2500
340.5
338.1
20.6
LM317LIDRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM317LIPK
SOT-89
PK
3
1000
340.0
340.0
38.0
LM317LIPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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