LINER LTC4240 Compactpci hot swap controller with i2c compatible interface Datasheet

LTC4240
CompactPCI Hot Swap
Controller with I2C Compatible Interface
U
FEATURES
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DESCRIPTIO
The LTC®4240 is a Hot SwapTM controller that allows a board
to be safely inserted and removed from a live CompactPCI
bus slot. The LTC4240 has a built-in 2-wire I2C compatible
interface to allow software control and monitoring of
device function and power supply status. Two external
N-channel transistors control the 3.3V and 5V supplies,
while two internal switches control the –12V and 12V
supplies. Electronic circuit breakers protect all four supplies
against overcurrent faults. The PWRGD output indicates
when all of the supply voltages are within tolerance. The
OFF/ON pin is used to cycle the board power or reset the
circuit breaker. The I2C interface allows the user to turn the
device off or on, set RESETOUT, turn on the status LED
driver and ignore 12V, –12V faults. It also allows the user
to read the status of the FAULT, RESETIN, RESETOUT,
PWRGD, PRSNT1# and PRSNT2# pins. Under a fault
condition, the I2C interface can also be used to determine
which of the four supplies generated the fault. The LTC4240
is available in a 28-pin narrow SSOP package.
Allows Safe Board Insertion and Removal from a
Live CompactPCITM Bus
I2CTM Compatible 2-Wire Interface
PRECHARGE Output Biases I/O Pins During Card
Insertion and Extraction
Controls 3.3V, 5V, 12V and –12V Supplies
Foldback Current Limit with Circuit Breaker
LOCAL_PCI_RST# Logic On-Board
QuickSwitch® Enable Output
Status LED Driver
User Programmable Supply Voltage Power-Up Rate
Registers Individual Supply Faults
Available in a 28-Pin Narrow SSOP Package
U
APPLICATIO S
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Hot Board Insertion into CompactPCI Bus
Electronic Circuit Breaker
, LTC and LT are registered trademarks of Linear Technology Corporation.
Hot Swap is a trademark of Linear Technology Corporation.
QuickSwitch is a registered trademark of Quality Semiconductor Corp.
CompactPCI is a trademark of the PCI Industrial Computer Manufacturers Group.
I2C is a trademark of Philips Electronics N.V.
U
TYPICAL APPLICATIO
CompactPCI
BACKPLANE
CONNECTOR
(MALE)
MEDIUM 5V
LONG 5V
MEDIUM 3.3V
LONG 3.3V
CompactPCI
BACKPLANE
CONNECTOR
(FEMALE)
C11
10nF
5VIN
3VIN
C10
10nF
LONG V(I/O)
R1
0.005Ω
R22, 2.74Ω
R21, 1.74Ω
C7
0.01µF
PER
PIN
R19
2.55k
1%
10k
SCL
SDA
R25, 1.2k
R28, 200Ω
+
–12V
5VIN
R17, 1.2k
BD_SEL#
Z1
EARLY
V(I/O)
R4
10Ω
3VIN
ADDRIN
SCL
SDA
PRSNT2#
PRSNT1#
3VSENSE GATE
3VOUT
5VIN
R5
1k
5VSENSE
C1
0.047µF
5VIN
5VOUT
R10
100Ω
DGND
LED
12VOUT
VEEIN
LTC4240
R29 R15
2k
10Ω
R14
10Ω
C5
0.01µF
R30
Z2 1k
C2
0.1µF
TO
QUICKSWITCH®
ENABLE
3VOUT
RESETOUT
PRECHARGE
R6
10k
DRIVE
R11
18Ω
C3, 4.7nF
R9
24Ω
R7, 12Ω
Q3
MMBT2222A
LOCAL_PCI_RST#
TO PCI BRIDGE
DEVICE OR
EQUIVALENT
R8, 1k
Z1, Z2: SMAJ12CA
Z3, Z4: IPMT5.0AT3
+
CLOAD (VEEOUT)
BE
R16
10k
PWRGD
RESETIN
GND
12VOUT
12V AT 500mA
CLOAD (12VOUT)
VEEOUT
–12V AT 100mA
TIMER
OFF/ON
C6
0.01µF
+
VEEOUT
FAULT
HEALTHY#
PCI_RST#
R13
10Ω
C4
0.01µF
R18
1k
3VOUT
3.3V AT 7.6A
CLOAD (3VOUT)
+
R3
10Ω
5VOUT
5V AT 5A
CLOAD (5VOUT)
12VIN
12V
GROUND
Q2
Si7880DP
Q1
Si7880DP
C8
0.01µF
PER
PIN
R20
1.91k
R12 1%
C9
10nF
R2
0.007Ω
Z3
Z4
3VIN
4240 TA01
4240f
1
LTC4240
W W
U
W
ABSOLUTE
AXI U RATI GS
U
W
U
PACKAGE/ORDER I FOR ATIO
(Notes 1, 2)
Supply Voltages
5VIN .................................................................... –0.3V to 12V
12VIN ................................................................. –0.3V to 14V
VEEIN ................................................................... 0.3V to –14V
Input Voltages
PRSNT1#, PRSNT2#, SCL, RESETIN,
OFF/ON .................................................. –0.3V to 12V
5VOUT, 5VSENSE, 3VIN,
3VSENSE, 3VOUT ............................ –0.3V to (5VIN + 0.3V)
ADDRIN, PRECHARGE ......................... –0.3V to 5VIN
Output Voltages
TIMER, FAULT, PWRGD, SDA, RESETOUT,
LED, DRIVE, GATE, 12VOUT ....................... –0.3V to 14V
VEEOUT ................................................................ –14V to 0.3V
BE ............................................. 0.3V to (5VIN + 0.3V)
Operating Temperature Range
LTC4240C ............................................... 0°C to 70°C
LTC4240I .............................................–40°C to 85°C
Storage Temperature Range .................... 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
ORDER PART
NUMBER
TOP VIEW
PRSNT1#
1
28 OFF/ON
PRSNT2#
2
27 RESETIN
12VIN
3
26 12VOUT
VEEIN
4
25 VEEOUT
TIMER
5
24 3VOUT
5VOUT
6
23 3VSENSE
FAULT
7
22 3VIN
PWRGD
8
21 5VIN
BE
9
20 5VSENSE
GND 10
ADDRIN 11
19 GATE
18 PRECHARGE
SDA 12
17 DRIVE
SCL 13
16 DGND
RESETOUT 14
LTC4240CGN
LTC4240IGN
15 LED
GN PACKAGE
28-LEAD PLASTIC SSOP
TJMAX = 140°C, θJA = 135°C/W
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. 12VIN = 12V, VEEIN = –12V, V3VIN = 3.3V, V5VIN = 5V unless otherwise noted.
SYMBOL
PARAMETER
MIN
TYP
IDD
V12VIN Supply Current
OFF/ON = 0V
●
VLKO
Undervoltage Lockout
12VIN
5VIN
3VIN
VEEIN
3
8
●
●
●
●
7.00
4.10
2.35
8.00
4.3
2.45
–9
10.80
4.45
2.55
–10.5
VFB
Foldback Current Limit Voltage
VFB = (V5VIN – V5VSENSE), V5VOUT = 0V, TIMER = 0V
VFB = (V5VIN – V5VSENSE), V5VOUT = 3V, TIMER = 0V
VFB = (V3VIN – V3VSENSE), V3VOUT = 0V, TIMER = 0V
VFB = (V3VIN – V3VSENSE), V3VOUT = 2V, TIMER = 0V
●
●
●
●
15
55
15
55
25
70
25
65
35
85
35
80
mV
mV
mV
mV
VCB
Circuit Breaker Trip Voltage
VTV = (V5VIN – V5VSENSE), V5VOUT = 5V, TIMER = Open
VTV = (V5VIN – V5VSENSE), V5VOUT = 0V, TIMER = Open
VTV = (V3VIN – V3VSENSE), V3VOUT = 3.3V, TIMER = Open
VTV = (V3VIN – V3VSENSE), V3VOUT = 0V, TIMER = Open
●
●
●
●
50
6
50
6
55
11
55
11
60
16
60
16
mV
mV
mV
mV
tOC
Overcurrent Fault Response Time
Overcurrent Fault Response Time
(V5VIN – V5VSENSE) = 100mV, TIMER = Open
(V3VIN – V3VSENSE) = 100mV, TIMER = Open
●
●
25
25
35
35
55
55
µs
µs
tSC
Short-Circuit Response Time
(V5VIN – V5VSENSE) = 200mV, TIMER = Open
(V3VIN – V3VSENSE) = 200mV, TIMER = Open
●
●
25
25
35
35
55
55
µs
µs
IGATE(UP)
GATE Pin Turn-On Current
IGATE(DN)
GATE Pin Turn-Off Current
IGATE(FAULT) GATE Pin Fault-Off Current
OFF/ON = 0V, VGATE = 0V, TIMER = 0V
VGATE = 5V, (Note 3)
OFF/ON = 0V, VGATE = 2V, TIMER = Open, FAULT = 0V
●
●
●
– 20
100
2.5
– 65
200
6
–100
300
8.5
µA
µA
mA
∆VGATE
∆VGATE = (V12VIN – VGATE), IGATE = 1µA
●
600
1000
mV
External Gate Voltage
CONDITIONS
MAX
UNITS
mA
V
V
V
V
4240f
2
LTC4240
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. 12VIN = 12V, VEEIN = –12V, V3VIN = 3.3V, V5VIN = 5V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
∆V12V
∆VVEE
12V Switch Voltage Drop
VEE Switch Voltage Drop
∆V12V = (V12VIN – V12VOUT), I = 500mA
∆VVEE = (VEEOUT – VEEIN), I = 100mA
●
●
ICL
Current Foldback
12VIN = 12V, 12VOUT = 0V
VEEIN = –12V, VEEOUT = 0V
●
●
ITH
Current Fault Threshold
12VIN = 12V
VEEIN = –12V
●
●
TTS
Thermal Shutdown Temperature
Note 4
VTH
Power Good Threshold Voltage
12VOUT
5VOUT
3VOUT
VEEOUT
●
●
●
●
VIL
Input Low Voltage
OFF/ON, RESETIN, SCL, SDA, PRSNT1#, PRSNT2#
●
VIH
Input High Voltage
OFF/ON, RESETIN, SCL, SDA, PRSNT1#, PRSNT2#
●
IIN
Input Current PRSNT1#, PRSNT2#,
OFF/ON, RESETIN, SDA, SCL
OFF/ON = RESETIN = SDA = SCL = 0V, 5V,
PRSNT1#, PRSNT2# = 0V, 5V
●
●
RESETOUT, FAULT Leakage Current
RESETOUT = FAULT = 12V, OFF/ON = 0V, RESETIN = 3.3V
PWRGD Leakage Current
5VSENSE Input Current
3VSENSE Input Current
TYP
MAX
UNITS
300
125
600
250
mV
mV
– 50
50
–350
250
– 800
350
mA
mA
–550
225
– 1250 – 1900
500
800
mA
mA
°C
150
10.8
4.50
2.8
– 10
11.1
4.65
2.9
– 10.5
11.4
4.75
3.0
– 10.8
V
V
V
V
0.8
V
±0.08
±0.08
±2
±2
µA
µA
●
±0.08
±2
µA
PWRGD = 12V, OFF/ON = 4V
●
±0.08
±2
µA
5VSENSE = 5V, 5VOUT = 0V, GATE = 0V
●
55
100
µA
3VSENSE = 3.3V, 3VOUT = 0V, GATE = 0V
●
55
100
µA
5VIN Input Current
5VIN = 5V, TIMER = 0V, OFF/ON = 0V
●
0.8
1.5
mA
3VIN Input Current
3VIN = 3.3V, TIMER = Open
3VIN = 3.3V, TIMER = 0V
●
●
250
250
600
500
µA
µA
5VOUT Input Current
5VOUT = 5V, OFF/ON = 0V, TIMER = 0V, GATE = 0V
●
237
400
µA
3VOUT Input Current
3VOUT = 3.3V, OFF/ON = 0V, TIMER = 0V, GATE = 0V
●
120
200
µA
VEEIN Input Current
TIMER = 0V, OFF/ON = 0V
●
–950
–1200
µA
Precharge Input Current
VPRECHARGE = 1V
●
10
µA
ADDRIN
ADDRIN = 0V, 5V
●
±0.1
µA
ITIMER
TIMER Pin Current
OFF/ON = 0V, TIMER = 0V
TIMER = 5V, OFF/ON = 2V
●
●
–6
15
– 11.5
28
–17
55
µA
mA
VTIMER
TIMER Threshold Voltages
●
5
5.5
6.5
V
RDIS
12VOUT Discharge Impedance
5VOUT Discharge Impedance
3VOUT Discharge Impedance
VEEOUT Discharge Impedance
●
●
●
●
430
50
150
650
1000
100
300
1000
Ω
Ω
Ω
Ω
VOH
CMOS Output High Voltage
BE, I = –100µA
● 5VIN – 0.4
VOL
CMOS Output Low Voltage
Output Low Voltage
Output Low Voltage
BE, I = 100µA
PWRGD, RESETOUT, FAULT, SDA(I = 3mA)
LED (I = 10mA)
●
●
●
VPXG
PRECHARGE Reference Voltage
V5VIN = 5V
●
2
0.9
V
V
1
0.4
0.4
0.8
V
V
V
1.1
V
100
kHz
I2C Timing (Note 4)
fSCL
SCL Clock Frequency
tSUSTA
Start Condition Setup Time
4.7
µs
tBUF
Bus Free Time Between Stop and Start
4.7
µs
tHDSTA
Start Condition Hold Time
4
µs
4240f
3
LTC4240
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. 12VIN = 12V, VEEIN = –12V, V3VIN = 3.3V, V5VIN = 5V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
tSUSTP
Stop Condition Setup Time
tHDDAT
tSUDAT
tLOW
Clock Low Period
4.7
tHIGH
Clock High Period
4.0
tf
Clock/Data Fall Time
300
ns
tr
Clock/Data Rise Time
1000
ns
4
µs
Data Hold Time
300
ns
Data Setup Time
250
ns
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All currents into device pins are positive; all currents out of
device␣ pins are negative. All voltages are referenced to ground unless
otherwise specified.
µs
µs
Note 3: OFF/ON pin pulled up to 5V by 1.2k resistor.
Note 4: Parameters guaranteed by design and not tested.
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Gate Pin Fault Current
vs Temperature
350
GATE PIN CURRENT (µA)
VGATE = 2V
FAULT = 0V
6
4
2
–25
0
25
50
TEMPERATURE (°C)
75
250
200
100
–50
100
–25
0
25
50
TEMPERATURE (°C)
75
4240 G01
280
–80
–100
–50
3.2
2.8
0
25
50
TEMPERATURE (°C)
75
100
4240 G04
–25
0
25
50
TEMPERATURE (°C)
75
5VIN Supply Current
vs Temperature
1.0
OFF/ON = 0V
260
240
220
–50
–25
100
4240 G03
5VIN SUPPLY CURRENT (mA)
3VIN SUPPLY CURRENT (µA)
OFF/ON = 0V
–25
–60
3VIN Supply Current
vs Temperature
4.0
2.4
–50
100
–40
4240 G02
12VIN Supply Current
vs Temperature
3.6
VGATE = 0V
OFF/ON = 0V
300
150
0
–50
12VIN SUPPLY CURRENT (mA)
–20
VGATE = 5V
OFF/ON = 2V
GATE PIN CURRENT (µA)
8
GATE PIN FAULT CURRENT (mA)
Gate Pin Turn-On Current
vs Temperature
Gate Pin Turn-Off Current
vs Temperature
0
25
50
TEMPERATURE (°C)
75
100
4240 G05
OFF/ON = 0V
0.9
0.8
0.7
0.6
0.5
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G06
4240f
4
LTC4240
U W
TYPICAL PERFOR A CE CHARACTERISTICS
VEEIN Supply Current
vs Temperature
–0.8
1.6
–0.9
–1.0
–1.1
–25
0
25
50
TEMPERATURE (°C)
75
0.7
12VOUT = 10V
1.2
0.8
12VOUT = 0V
0.4
0
–50
100
VEE FOLDBACK CURRENT LIMIT (A)
12VIN FOLDBACK CURRENT LIMIT (A)
VEEIN SUPPLY CURRENT (mA)
OFF/ON = 0V
–1.2
–50
VEEIN Foldback Current Limit
vs Temperature
12VIN Foldback Current Limit
vs Temperature
–25
0
25
50
TEMPERATURE (°C)
75
4240 G07
0
–50
11.1
0.2
11.0
10.9
0
–2
–4
–6
–8
OUTPUT VOLTAGE (V)
–10
10.8
–50
–12
3VOUT PWRGD Threshold Voltage
vs Temperature
0
25
50
TEMPERATURE (°C)
75
100
4240 G13
75
VEEOUT PWRGD THRESHOLD VOLTAGE (V)
–10.2
4.70
4.65
4.60
4.55
4.50
–50
100
VEEOUT PWRGD Threshold
Voltage vs Temperature
5VOUT PWRGD Threshold Voltage
vs Temperature
5VOUT PWRGD THRESHOLD VOLTAGE (V)
3VOUT PWRGD THRESHOLD VOLTAGE (V)
–25
0
25
50
TEMPERATURE (°C)
4240 G12
4.75
2.85
–25
4240 G11
4240 G10
3.00
100
11.2
0.3
12
2.90
75
4240 G09
0
0
2.95
0
25
50
TEMPERATURE (°C)
11.3
0.1
10
–25
12VOUT PWRGD THRESHOLD VOLTAGE (V)
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
0.4
2.80
–50
0.1
11.4
VEEIN = –12V
TA = 25°C
0.8
4
6
8
OUTPUT VOLTAGE (V)
VEEOUT = 0V
0.2
12VOUT PWRGD Threshold
Voltage vs Temperature
0.4
2
0.3
100
0.5
12VIN = 12V
TA = 25°C
0
0.4
–12V Output Current
1.2
VEEOUT = –10V
0.5
4240 G08
12V Output Current
1.6
0.6
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G14
–10.3
–10.4
–10.5
–10.6
–10.7
–10.8
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G15
4240f
5
LTC4240
U W
TYPICAL PERFOR A CE CHARACTERISTICS
3VSENSE Input Current
vs Temperature
5VSENSE Input Current
vs Temperature
Timer Pin Turn-Off Current
vs Temperature
65
65
34
5VSENSE = 5V
3VSENSE = 3.3V
OFF/ON = 2V
VTIMER = 5V
60
55
50
TIMER PIN CURRENT (mA)
5VSENSE INPUT CURRENT (µA)
3VSENSE INPUT CURRENT (µA)
32
60
55
50
30
28
26
24
22
20
45
–50
45
–25
0
25
50
TEMPERATURE (°C)
75
–50
100
–25
0
25
50
TEMPERATURE (°C)
75
–11.5
–12.0
–12.5
–13.0
–50
–25
0
25
50
TEMPERATURE (°C)
75
5.8
5.6
5.4
5.2
5.0
–50
100
–25
0
25
50
TEMPERATURE (°C)
75
4240 G19
8.0
7.5
75
34
32
30
–50
100
4240 G22
–25
0
25
50
TEMPERATURE (°C)
75
4240 G21
5VIN UVLO Threshold Voltage
vs Temperature
4.45
2.50
4.40
2.45
4.35
2.40
2.35
–50
100
5VIN UVLO THRESHOLD VOLTAGE (V)
3VIN UVLO THRESHOLD VOLTAGE (V)
12VIN UVLO THRESHOLD VOLTAGE (V)
8.5
0
25
50
TEMPERATURE (°C)
36
100
2.55
–25
38
3VIN UVLO Threshold Voltage
vs Temperature
9.0
7.0
–50
TIMER PIN FLOATING
VIN – VSENSE = 0.1V
4240 G20
12VIN UVLO Threshold Voltage
vs Temperature
100
40
CIRCUIT BREAKER RESPONSE TIME (µs)
TIMER THRESHOLD VOLTAGE (V)
TIMER PIN CURRENT (µA)
–11.0
75
4240 G18
6.0
–10.5
0
25
50
TEMPERATURE (°C)
5V/3.3V Circuit Breaker
Overcurrent Fault Response Time
vs Temperature
Timer Threshold Voltage
vs Temperature
Timer Pin Turn-On Current vs
Temperature
OFF/ON = 0V
VTIMER = 0V
–25
4240 G17
4240 G16
–10.0
18
–50
100
4.30
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G23
4.25
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G24
4240f
6
LTC4240
U W
TYPICAL PERFOR A CE CHARACTERISTICS
VEEIN UVLO Threshold Voltage
vs Temperature
12VIN Internal Switch Voltage
Drop vs Temperature
–8.0
–8.4
–8.8
–9.2
–9.6
–10.0
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
500
VEE INTERNAL SWITCH VOLTAGE DROP (mV)
12V INTERNAL SWITCH VOLTAGE DROP (mV)
VEEIN UVLO THRESHOLD VOLTAGE (V)
–7.6
I = 500mA
450
400
350
300
250
200
150
–50
–25
0
25
50
TEMPERATURE (°C)
75
3V Foldback Current Limit Voltage
vs Temperature
80
40
3VOUT = 0V
20
VTIMER = 0V
0
–50 –25
0
25
50
TEMPERATURE (°C)
75
120
80
40
–50
100
60
3VOUT = 3.3V
40
20
3VOUT = 0V
VTIMER = OPEN
0
–50 –25
0
25
50
TEMPERATURE (°C)
75
4240 G28
100
80
5VOUT = 3V
60
40
VTIMER = 0V
0
–50
VTIMER = OPEN
0
–50 –25
0
25
50
TEMPERATURE (°C)
75
100
4240 G32
0
25
50
TEMPERATURE (°C)
–25
75
300
140
120
100
80
–50
–25
100
5VOUT Input Current
vs Temperature
5VOUT INPUT CURRENT (µA)
3VOUT INPUT CURRENT (µA)
5VOUT = 0V
5VOUT = 0V
20
3VOUT = 3.3V
OFF/ON = 0V
20
100
4240 G31
160
80
40
75
100
3VOUT Input Current
vs Temperature
5VOUT = 5V
0
25
50
TEMPERATURE (°C)
4240 G29
5V Circuit Breaker Trip Voltage
vs Temperature
60
–25
4240 G27
5V FOLDBACK CURRENT LIMIT VOLTAGE (mV)
3VOUT = 2V
160
5V Foldback Current Limit Voltage
vs Temperature
80
60
I = 100mA
3V Circuit Breaker Trip Voltage
vs Temperature
3V CIRCUIT BREAKER TRIP VOLTAGE (mV)
3V FOLDBACK CURRENT LIMIT VOLTAGE (mV)
100
200
4240 G26
4240 G25
5V CIRCUIT BREAKER TRIP VOLTAGE (mV)
VEEIN Internal Switch Voltage Drop
vs Temperature
0
25
50
TEMPERATURE (°C)
75
100
4240 G33
5VOUT = 5V
OFF/ON = 0V
280
260
240
220
200
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
4240 G34
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PRSNT1# (Pin 1): PCI Present Detect Input 1. PRSNT1#
and PRSNT2# are readable over the I2C Bus. PRSNT1#
and PRSNT2# indicate the maximum power used by the
card. Do not float.
PRSNT2# (Pin 2): PCI Present Detect Input 2. Do not float.
12VIN (Pin 3): 12V Supply Input. A 0.5Ω switch is internally connected between 12VIN and 12VOUT with foldback
current limit. An undervoltage lockout circuit prevents the
switches from turning on while the 12VIN pin is below 8V.
12VIN provides power to some of the LTC4240’s internal
circuitry. See Input Transient Protection section on how to
protect 12VIN from large voltage transients.
VEEIN (Pin 4): –12V Supply Input. A 1Ω internal switch is
connected between VEEIN and VEEOUT with foldback current limit. An undervoltage lockout circuit prevents the
switches from turning on while VEEIN is above – 9V. See
Connecting VEEIN section for more notes on VEEIN and
VEEOUT. Also refer to Input Transient Protection section.
TIMER/AUX 12VIN (Pin 5): Current Fault Inhibit Timing
Input. Connect a capacitor from TIMER to GND. With the
LTC4240 turned off (OFF/ON = HIGH), the TIMER pin is
internally held at GND. When the device is turned on, an
11.5µA pull-up current source is connected to TIMER.
Current limit faults will be ignored until the voltage at the
TIMER pin rises above 5.5V. The Timer capacitor also
serves as an auxiliary charge reservoir for internal VCC in
the event the 12VIN pin voltage glitches below the LTC4240
UVL threshold voltage.
5VOUT (Pin 6): 5V Output Sense. The PWRGD pin will not
pull low until the 5VOUT pin voltage exceeds 4.65V. When
the power switches are turned off, a 50Ω resistor pulls
5VOUT to ground.
FAULT (Pin 7): Open-Drain Fault Output . FAULT is pulled
low when a current limit fault is detected. Current limit
faults are ignored until the voltage at the TIMER pin is
above 5.5V. Once the TIMER cycle is complete, FAULT
pulls low and the LTC4240 turns off (in the event of an
overcurrent fault lasting longer than 35µs). The LTC4240
will remain in the off state until the OFF/ON pin is cycled
high then low or power is cycled. Note that the OFF/ON
cycling can also be performed using I2C bus.
PWRGD (Pin 8): Open-Drain Power Good Output. Connect the CPCI HEALTHY# signal to the PWRGD pin.
PWRGD remains low while V12VOUT ≥ 11.1V, V3VOUT ≥
2.9V, V5VOUT ≥ 4.65V and VEEOUT ≤ –10.5V. When any of
the supplies drops below its power good threshold voltage, PWRGD will go high after a 10µs deglitching time. The
switches will not be turned off when PWRGD goes high,
unless a fault has occurred. The CPCI specification calls
for a 0.01µF bypass capacitor on the backplane for
HEALTHY#.
BE (Pin 9): QuickSwitch Bus Enable Output. The BE output
remains high until power is good on all supplies. This
serves to isolate the I/O data lines during live
insertion. This is a CMOS output powered by 5VIN.
GND (Pin 10): Analog Ground. Connect to analog ground
plane.
ADDRIN (Pin 11): I2C Address Programming Input. The
I2C address is programmed by connecting the ADDRIN
pin to a resistor divider between the 5VIN pin and GND. See
Table 1 for 1% resistor values and corresponding addresses. Resistors must be placed close to the ADDRIN
pin to minimize errors due to stray capacitance and
resistance on the board trace. Connect this pin to ground
if I2C is not used.
SDA (Pin 12): I2C Data Input and Output. Note that TTL
levels are used. Connect this pin to ground if I2C is not
used.
SCL (Pin 13): I2C Clock Input, 100kHz Maximum. Note
that TTL levels are used. Do not float. Connect this pin to
ground if I2C is not used.
RESETOUT (Pin 14): Open-Drain Reset Output. Connect
the CPCI LOCAL_PCI_RST# signal to the RESETOUT pin.
RESETOUT is the logical combination of RESETIN, PWRGD,
and I2C RESETOUT latch output.
LED (Pin 15): CPCI Status LED. Pulls low to light LED
when RESETOUT is low or when the I2C LED latch is set.
DGND (Pin 16): Digital Ground. Connect to ground plane.
DRIVE (Pin 17): External transistor’s base drive output for
bus precharge. Connects to the base of an external NPN
emitter-follower which in turn biases the PRECHARGE
4240f
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LTC4240
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node. An external 1k resistor between the transistor’s base
and 3VIN is needed.
long pin must be connected to 3VIN to ensure precharge
output. See Input Transient Protection section.
PRECHARGE (Pin 18): Precharge Monitor Input. An internal error amplifier servos the DRIVE pin voltage to keep the
precharge node at 1V. Becomes valid when long 5V and
3.3V power pins make contact .Tie pins 17 and 18 together
if precharge function is unused.
3VSENSE (Pin 23): 3.3V Current Limit Sense. A sense
resistor placed between 3VIN and 3VSENSE determines the
current limit for this supply. A foldback feature makes the
current limit decrease as the voltage at the 3VOUT pin
approaches 0V. To disable current limit, 3VSENSE and 3VIN
must be tied together.
GATE (Pin 19): High Side Gate Drive for the External 3.3V
and 5V N-Channel Power Transistors. An external series
RC network is required for the current limit loop compensation and to set the maximum ramp-up rate. During
power-up, the slope of the voltage rise at the GATE pin is
set by the 65µA current source charging the external GATE
capacitor or by the 3.3V or 5V current limit and the
associated output capacitor. During power-down, a 200µA
current source pulls the GATE pin to GND.
The voltage at the GATE pin will be modulated to maintain
a constant current when either the 3.3V or 5V supply goes
into current limit and the TIMER pin is less than 5.5V. Once
the TIMER pin is above 5.5V, and in the event of a current
fault condition lasting for longer than 35µs, the GATE pin
is immediately pulled to GND.
5VSENSE (Pin 20): 5V Current Limit Sense. A sense resistor
placed between 5VIN and 5VSENSE determines the current
limit for this supply. A foldback current feature makes the
current limit decrease as the voltage at the 5VOUT pin
approaches 0V. To disable the current limit, 5VSENSE and
5VIN must be tied together.
5VIN (Pin 21): 5V Supply Sense Input. An undervoltage
lockout circuit prevents the switches from turning on
when the voltage at the 5VIN pin is less than 4.3V. At least
one long pin must be connected to 5VIN to ensure precharge
output. See Input Transient Protection section.
3VIN (Pin 22): 3.3V Supply Sense Input. An undervoltage
lockout circuit prevents the switches from turning on
when the voltage at the 3VIN pin is less than 2.45V. If no
3.3V input supply is available, connect two series diodes
between 5VIN and 3VIN (tie anode of first diode to 5VIN and
cathode of second diode to 3VIN, Figure 15). At least one
3VOUT (Pin 24): 3.3V Output Sense. The PWRGD pin
cannot pull low until the 3VOUT pin voltage exceeds 2.9V.
If no 3.3V input supply is available, tie the 3VOUT pin to the
5VOUT pin. When the power switches are turned off, a
150Ω resistor pulls 3VOUT to ground.
VEEOUT (Pin 25): –12V Supply Output. An internal 1Ω
switch is connected between VEEIN and VEEOUT. VEEOUT
must exceed –10.5V before the PWRGD pin pulls low.
When the power switches are turned off, a 650Ω resistor
pulls VEEOUT to ground.
12VOUT (Pin 26): 12V Supply Output. A 0.5Ω switch is
connected between 12VIN and 12VOUT. 12VOUT must
exceed 11.1V before the PWRGD pin can pull low. When
the power switches are turned off, a 430Ω resistor pulls
12VOUT to ground.
RESETIN (Pin 27): PCI Reset Input. Connect the CPCI
PCI_RST# signal to the RESETIN pin. Pulling RESETIN low
will cause RESETOUT to pull low. Note that the I2C
RESETIN latch output can also set RESETOUT. Do not
float.
OFF/ON (Pin 28): OFF/ON Input. Connect the CPCI
BD_SEL# signal to the OFF/ON pin. When the OFF/ON pin
is pulled low, the GATE pin is pulled high by a 65µA current
source and the internal 12V and –12V switches are turned
on. When the OFF/ON pin is pulled high, the GATE pin will
be pulled to ground by a 200µA current source and the 12V
and –12V switches turn off.
Cycling the OFF/ON pin high and low will reset a tripped
circuit breaker and start a new power-up sequence. The
I2C OFF/ON latch output can also be used to reset the
electronic circuit breaker. Do not float.
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LTC4240
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5VIN
5VSENSE
21
20
GATE
19
5VOUT
70mV,
TIMER LO
165mV,
TIMER HI
+–
65µA
Q1
3VOUT
24
65mV,
TIMER LO
165mV,
TIMER HI
A2
–
–+
–
200µA
+
5VOUT
6
1.2V
VCB
+
+
CP3
55mV
–
Q3
1.2V
+
–
Q2
–
CP2
CP1
55mV
+–
22
–+
+
A1
+–
3VIN
23
3VOUT
12Vin
+
3VSENSE
–
CP4
–+
VCB
2.45V
UVL
4.3V
UVL
12 SDA
Q4
OFF/ON 28
13 SCL
FAULT 7
11 ADDRIN
Q13
2 PRSNT2#
1 PRSNT1#
LOGIC
PWRGD 8
9 BE
DGND
16
Q12
RESETIN 27
15 LED
Q5
Q11
8V
UVL
Q8
12VIN
14 RESETOUT
1.2V
Q6
Q10
11.5µA
+
+
Q9
CP6
Q7
–
–
Q14
CP5
1V
A3
+
–
–9V
UVL
1.2V
3
26
5
4
25
12VIN
12VOUT
TIMER
VEEIN
VEEOUT
10
GND
17
18
DRIVE
PRECHARGE
4240 BD
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The LTC4240 is a Hot Swap controller that allows a board
to be safely inserted and removed from a CompactPCI bus
slot. The LTC4240 has built-in 2-wire I2C compatible
interface hardware to allow software control and monitoring of device function and power supply status.
Hot Circuit Insertion
When a circuit board is inserted into a live CompactPCI
(CPCI) backplane slot, supply bypass capacitors on the
board can draw huge supply transient currents from the
CPCI backplane power bus. The transient currents can
cause glitches on the power bus, thus causing other
boards in the system to reset.
The LTC4240 is designed to turn a board’s supply voltages
on and off in a controlled manner, allowing the board to be
safely inserted or removed from a live CPCI slot without
disturbing the system power supplies. The device also
protects the supplies from shorts, precharges the bus I/O
pins during insertion and extraction and monitors the
supply voltages. The LTC4240 includes an I2C compatible
interface, which allows software control of device functions.
The LTC4240 is specifically designed for CPCI applications where it resides on the plug-in board. For best
results, a well bypassed backplane is recommended.
LTC4240 Feature Summary
• Allows safe board insertion and removal from a CPCI
backplane. Status LED visually identifies when a board
is ready for removal.
• Controls all four CPCI supplies: –12V, 12V, 3.3V and
5V.
• Foldback current limit: An analog current limit with a
value that depends on the output voltage. If the output
is shorted to ground, the current limit drops to keep
power dissipation and supply glitches to a minimum.
• 12V and –12V circuit breakers: if either supply remains
in current limit for more than 35µs, the circuit breaker
will trip, the supplies will turn off and the FAULT pin
pulls low.
• Adjustable 5V and 3.3V circuit breakers: if either supply
exceeds current limit for more than 35µs, the circuit
breaker will trip, the supplies will be turned off and the
FAULT pin will be pulled low. In addition, an analog loop
will servo the GATE pin to limit the current to three times
circuit breaker limit during transient conditions.
• I2C interface: software control allows user to both write
to and read from the device. The user can turn the
device off and on, set the status LED, set RESETOUT
and disable faults on 12VIN and VEEIN. The user can also
read the device status: FAULT, RESETIN, RESETOUT
PWRGD, PRSNT1#, PRSNT2#, FAULTCODE0 and
FAULTCODE1. If a fault occurs, the FAULTCODE bits
identify which supply generated the fault.
• Current limit during power-up: the supplies are allowed
to power-up in current limit. This allows the LTC4240 to
power-up boards with widely varying capacitive loads
without tripping the circuit breaker. The maximum
allowable power-up time is programmable using an
external capacitor connected to the TIMER pin. See
TIMER section
• Internal 12V and –12V power switches.
• PWRGD output: indicates the voltage status of the four
supply voltages.
• PCI_RST# is combined with HEALTHY# and
with the I 2 C RESETIN latch output to create
LOCAL_PCI_RST# output. If HEALTHY# asserts,
LOCAL_PCI_RST# is asserted independent of the other
two inputs.
• Precharge output: an internal reference and amplifier
provide 1V for biasing bus I/O connector pins during
CPCI card insertion and extraction.
• Space saving 28-pin SSOP package.
I2C Interface
The LTC4240 incorporates an I2C compatible 2-wire (clock
and data) interface that allows the user to easily query and
control the status of the LTC4240. A single analog input
pin selects 1 of 32 allowed addresses. The I2C bus can be
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used to turn off/on the power switches, turn on the status
LED (alerting the user that its safe to remove the plug-in
board), and assert the LOCAL_PCI_RST# signal. The I2C
bus is also used to read the logic signals of several device
pins: FAULT, PWRGD, RESETIN, and RESETOUT. Additionally, when a supply generates a current fault, the I2C
bus can be used to determine which supply generated the
fault. See Send Byte and Receive Byte sections for a full
description of all I2C features.
The LTC4240 supports Send Byte and Receive Byte protocols. Communication is achieved using the SCL and SDA
pins (TTL compatible input thresholds). The SCL pin is the
clock input from the I2C bus (host) to the LTC4240 (slave).
The maximum SCL frequency is 100kHz. SDA is the
bidirectional data transfer line between the I2C bus and the
LTC4240. Send Byte and Receive Byte protocols are both
comprised of 2 bytes. The first byte for both is the address
byte. All communication begins with a START command.
Programming the I2C Address
The voltage on the ADDRIN pin determines the I2C address. The ADDRIN voltage is set externally with a resistor
divider from 5VIN to ground (resistor placement must be
close to the pin, do not place a bypass capacitor on
ADDRIN). This voltage is fed to a 5-bit A/D and compared
against the address byte clocked in by the I2C bus. The 5bit A/D allows 32 unique LTC4240 devices to be connected
on the same I2C bus. 1% resistors should be used to place
the voltage at ADDRIN approximately 0.5 LSB away from
each code transition. Table 1 shows recommended resistor values for each of the address code segments. The
resistor ratio for each code segment has been optimized
for best performance over the specified temperature range.
The parallel resistance for the address setting resistors
should be kept under 10k.
Table 1. Suggested ADDRIN 1% Resistor Values
ADDR RECOMMENDED ALLOWED ADDRIN R19(TOP)
R20(BOT)
CODE ADDRIN VOLTAGE VOLTAGE RANGE RESISTOR RESISTOR
00
0.108125
0.080 to 0.136
8660
191
01
0.264375
0.236 to 0.293
2550
140
02
0.420625
0.393 to 0.449
2550
237
03
0.576875
0.549 to 0.605
2550
332
04
0.733125
0.705 to 0.761
2550
442
05
0.889375
0.861 to 0.918
2550
549
06
1.045625
1.018 to 1.074
3830
1020
07
1.201875
1.174 to 1.230
2550
806
08
1.358125
1.330 to 1.386
2550
953
09
1.514375
1.486 to 1.543
1150
499
10
1.670625
1.643 to 1.699
1020
511
11
1.826875
1.799 to 1.860
8660
4990
12
1.983125
1.955 to 2.021
2550
1690
13
2.139375
2.111 to 2.175
2550
1910
14
2.295625
2.268 to 2.330
1130
1130
15
2.451875
2.424 to 2.488
1370
1330
16
2.608125
2.580 to 2.644
2550
2800
17
2.764375
2.736 to 2.800
2550
3160
18
2.920625
2.888 to 2.950
2550
3570
19
3.076875
3.044 to 3.110
715
1150
20
3.233125
3.200 to 3.262
1150
2100
21
3.389375
3.356 to 3.421
1150
2430
22
3.545625
3.513 to 3.574
1150
2800
23
3.701875
3.669 to 3.731
357
1020
24
3.858125
3.825 to 3.886
2550
8660
25
4.014375
3.981 to 4.041
249
1020
26
4.170625
4.138 to 4.190
1070
5360
27
4.326875
4.294 to 4.349
178
1150
28
4.483125
4.450 to 4.499
133
1150
29
4.639375
4.606 to 4.651
102
1300
30
4.795625
4.763 to 4.805
105
2430
31
4.951875
4.919 to 4.962
100
10000
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START and STOP Commands
The START command is defined as a high to low transition
of the SDA line while the SCL line is high. It is an asynchronous event issued by the host, waking up all slave devices
and alerting them that a slave address is being written onto
the bus. Only the slave device that matches the address will
communicate with the host. The STOP command is defined as a low to high transition on the SDA line while SCL
is high. It is also an asynchronous event issued by the host
to signal the termination of the data transfer. Other than
START and STOP commands, the SDA line is allowed to
change states only when SCL is low.
Address Byte
Once the LTC4240 has detected a START command, it
clocks in the SDA line on the succeeding 9 SCL rising
edges. The first 7 bits clocked in contain the address of the
slave device targeted by the host. The first (MSB) address
bit must be set to low and the second bit must be set to
high. The next 5 bits are fed into a digital comparator and
compared against the output of an internal 5-bit A/D. If the
comparison is true, then there is an address match and the
LTC4240 continues to communicate with the host device.
The LTC4240 proceeds to acknowledge the address match
by pulling the SDA line low while SCL is low, just before the
9th SCL rising edge. Figures 1 and 3 show a timing
diagram of the START condition and address byte for both
the Send Byte and Receive Byte protocols. Note that the
SDA bit clocked in with the 8th SCL edge determines
whether the host is sending or receiving information to/
from the LTC4240.
Send Byte Protocol
The Send Byte protocol allows a host to write information
into the LTC4240 and command the LTC4240 to perform
certain predetermined functions. The host initiates communication with a START bit followed by 7 address bits.
The address bits are followed by the R/W bit, which is low
for Send Byte. The 9th bit is asserted low by the LTC4240
to acknowledge when there has been an address match.
The only time the LTC4240 writes data onto the SDA bus
during a send byte is to acknowledge the address and
command bytes. The first 8 bits are referred to collectively
as the address byte.
The command byte follows the address byte. The
command byte contains the information sent from the
host to the LTC4240. After the LTC4240 acknowledges the
address byte, each of the next 8 SCL rising edges shifts
SDA from the host into a shift register inside the LTC4240.
The first 2 bits clocked into the shift register (2 MSBs of the
command latch) are not used by the LTC4240. Only the 6
LSBs are stored in the command latch on the falling edge
of the 8th clock during the command byte. The output of
the command latch remains fixed until the next Send Byte
command overwrites it. Note that if power is turned off
(5VIN < 2V), the command and data latches will be cleared.
Figure 1 shows the timing diagram of the entire send byte
protocol. Transmission ends when the host issues a STOP
command. Table 2 defines the functions of the 6 command
bits. Note that some of these functions can override, or can
be overridden by, other circuitry and pins of the LTC4240.
Figure 2 shows the relationship between bits C1 to C3 and
other LTC4240 signals.
Receive Byte Protocol
The Receive Byte protocol is used by the host to read data
from the LTC4240 data latch. This protocol begins with a
START command, issued by the host, followed by 7
address bits. The address bits are followed by the R/W bit,
which is high for Receive Byte. The 9th bit is used by the
LTC4240 to acknowledge when there is an address match.
The data byte then follows the address byte. This byte
contains LTC4240 status information. After the LTC4240
acknowledges the address byte, it shifts 8 bits of data onto
the SDA line. Figure 3 shows the entire Receive Byte timing
diagram. Note that neither the host or the slave acknowledges the data byte (SDA line stays high during 9th clock
edge of the data byte).
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ADDRESS BYTE
SCL
LATCH
COMMAND BYTE
COMMAND BYTE
1
2
3
4
5
6
0
1
ADDR 4
ADDR 3
ADDR 2
ADDR 1
7
8
9
1
2
3
4
5
6
7
8
9
ACK
XX
XX
C5
C4
C3
C2
C1
XX
ACK
STOP
START
SDA
ADDR 0 R/WR=0
4240 F01
Figure 1. Send Byte Protocol
Table 2. Command Byte Definitions
HIGH
LOW
POWER-UP STATE
C7
Don’t care
Don’t care
N/A
C6
Don’t care
Don’t care
N/A
C5
Ignore VEEOUT faults
Don’t ignore VEEOUT faults
LOW
C4
Ignore 12VOUT faults
Don’t ignore 12VOUT faults
LOW
C3
Sets RESETOUT
Does not set RESETOUT low
LOW
C2
Turns OFF/ON to OFF
Overrides OFF/ON pin
Does not set OFF/ON
Does not override OFF/ON pin
LOW
C1
Turns on LED open drain
Does not turn on LED open drain
LOW
C0
Don’t care
Don’t care
N/A
LED
C2
C1
RESETOUT
GATE
OFF/ON
RESETOUT
C3
RESETIN
PWRGD
C1 TURNS ON THE EXTERNAL STATUS
LED INDEPENDENT OF RESETOUT.
C2 PULLS DOWN THE GATE OF THE
EXTERNAL N-CHANNEL SWITCHES. IT
ALSO TURNS OFF THE 12VIN AND VEEIN
INTERNAL POWER SWITCHES.
C3 IS USED TO SET
LOCAL_PCI_RST# (RESETOUT).
4240 F02
Figure 2. Send Byte Command Latch and Logic
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Table 3 shows the definition for each data bit. PWRGD,
FAULT, RESETIN, and RESETOUT external pins can be
monitored. PRSNT1# and PRSNT2# are PCI signals that
provide information on the power requirements of the
board. Refer to PCI local bus specifications for a detailed
description. FAULTCODE1 and FAULTCODE0 are two internal binary encoded signals that, along with FAULT,
indicate which of the four supplies generated a fault. Note
that the FAULTCODE signals are valid only when FAULT
has been asserted low. See Table 4 for description.
to the LTC4240 before back-end power is allowed to ramp
(BD_SEL# asserted low). The long pins, which include 5V,
3.3V, V(I/O) and GND mate first. The short pins, which
includes BD_SEL# (OFF/ON), mate last. At least one long
5V power pin must be connected to the LTC4240 in order
for the PRECHARGE voltage to be available during Early
Power. The external components connected to the
precharge pin require long 3.3V.
The following is a typical hot plug sequence:
1. ESD clips make contact.
Status LED
2. Long power and ground pins make contact and Early
Power is established (see Early Power section). The 1V
PRECHARGE voltage becomes valid at this stage. Power
is applied to the pull-up resistors connected to FAULT,
PWRGD and OFF/ON pins. The status LED is lit, indicating that the plug-in board is in the process of being
connected (LOCAL_PCI_RST# is asserted). All power
switches are off.
The main function of the LED is to alert the user when it is
permissible to physically extract the board. The LED
output of the LTC4240 is an open drain N-channel device
capable of sinking 10mA from an externally connected
LED. This LED lights up when RESETOUT
(LOCAL_PCI_RST#) is asserted. Upon application of Early
Power, the long 5V pins will power up the LTC4240 and
light up the Status LED. It will remain on until PWRGD
(HEALTHY#) is asserted and RESETIN (PCI_RST#) is deasserted, and the board enters normal operation. Note that
this LED can also be turned on via the I2C 2-wire interface.
3. Medium length pins make contact. There are six 5V and
eight 3.3V medium length power pins, bringing the 5V
total to 8 pins and the 3.3V total to 10 pins. The
maximum DC current for the 3.3V and 5V supplies is
10A and 8A, respectively. The I2C command latch is
initialized to allow seamless CPCI Hot Swap operation.
The LTC4240 can be used as a Hot Swap controller
without ever establishing I2C communication. Both
FAULT and PWRGD continue to be pulled up high at this
CPCI Connection Pin Sequence
The staggered length of the CPCI male connector pins
ensures that all power supplies are physically connected
Table 3. STATUS Byte Definitions
S7
Logic state of the PRSNT2# pin
S6
Logic state of the PRSNT1# pin
S5
Logic state of the PWRGD pin
S4
S3
Table 4. FAULTCODE Encoding Description for Receive Byte
FAULTCODE0
FAULTCODE1
FAULT
Supply Causing Fault
Logic state of the RESETOUT pin
LO
LO
LO
3VIN
Logic state of the RESETIN pin
LO
HI
LO
5VIN
S2
FAULTCODE1 (see Table 4)
HI
LO
LO
12VIN
S1
FAULTCODE0 (see Table 4)
HI
HI
LO
VEEIN
S0
Logic state of the FAULT pin
X
X
HI
None
ADDRESS BYTE
SCL
DATA BYTE
1
2
3
4
5
6
0
1
ADDR 4
ADDR 3
ADDR 2
ADDR 1
7
8
9
1
2
3
4
5
6
7
8
9
ACK
S7
S6
S5
S4
S3
S2
S1
S0
ACK
STOP
START
SDA
ADDR 0 R/WR=1
4240 F03
Figure 3. Receive Byte Protocol
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stage in the hot plug sequence, indicating that the
LTC4240 is in reset mode with all power switches off
(BD_SEL# is still pulled high to long 5V).
The 12V and –12V supplies make contact at this stage.
Zener clamps Z1 and Z2 plus shunt RC snubbers R13C4 and R14-C5 help protect the 12VIN and VEEIN pins,
respectively, from large transient voltages during hot
insertion and short-circuit conditions.
The signal pins also connect at this point. This includes
the HEALTHY# signal connecting to the PWRGD pin
and the PCI_RST# signal connecting to the RESETIN
pin. The PWRGD and RESETIN signals are combined
internally with Bit 3 (C3) of the I2C command latch (see
Send Byte protocol) to generate the LOCAL_PCI_RST#
signal, which is available at the RESETOUT pin.
4. Short pins make contact. BD_SEL# signal connects to
the OFF/ON pin. This starts the electrical part of the
connection process. If the BD_SEL# signal is grounded
on the backplane, then the electrical connection process starts immediately. Note that the electrical connection process can be interrupted with the Send Byte
protocol of the I2C serial interface.
System backplanes that do not ground the BD_SEL#
signal will instead have circuitry that detects when
BD_SEL# has made contact with the plug-in board. The
backplane logic can then control the power up process
by pulling BD_SEL# low. Figure 4 illustrates the power
up sequence. The mating of BD_SEL# is represented by
the high to low transition of the BD_SEL# signal.
Power-Up Sequence
Two external N-channel power MOSFETs isolate the 3.3V
and 5V power paths, while two internal MOS switches
isolate the 12V and –12V power paths. (See front page
Application Circuit). Sense resistors R1 and R2 provide
current limit and fault detection for the 3VIN and 5VIN
supplies, while R5 and C1 provide current control loop
compensation. Current fault detection for the 12V and
–12V supplies is done internally.
A high to low transition on BD_SEL# causes the voltages
on the TIMER, GATE, 3VOUT, 5VOUT, 12VOUT and VEEOUT
pins to begin ramping (see Figure 4). The TIMER pin
capacitance is charged by an 11.5µA current source while
the GATE capacitance is charged by a 65µA current source.
Concurrently, an internal charge pump turns on the gates
of the internal power switches that isolate the 12V and
–12V supplies. All faults are ignored during the time that
the voltage at the TIMER pin remains below 5.5V. In order
to avoid faults due to the charging of the bulk output
capacitors, all output voltages must settle before the
TIMER pin reaches 5.5V. See TIMER section for more
details.
The 5VOUT and 3VOUT supply outputs will ramp up according to the slowest of the following slew rates:
ILIMIT (5 V)– ILOAD(5 V)
dV 65µA
=
, or =
,
C LOAD(5 VOUT )
dt
C1
or =
ILIMIT (3 V)– ILOAD(3 V)
C LOAD(3 VOUT )
(1a )
(1b)
TIMER
10V/DIV
GATE
10V/DIV
12VOUT
10V/DIV
5VOUT
10V/DIV
3VOUT
10V/DIV
VEEOUT
10V/DIV
BD_SEL#
5V/DIV
LCL_PCI_RST#
5V/DIV
HEALTHY#
5V/DIV
10ms/DIV
4240 F04
Figure 4. Normal Power-Up Sequence
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Note that capacitor C1 performs dual functions. In addition to controlling the ramp up rates of the 5V and 3.3V
outputs, it also compensates the current limit loop.
Current limit faults are ignored while the TIMER voltage is
less than 5.5V.
Once all four supplies are within tolerance, the PWRGD pin
(HEALTHY#) will be pulled low and LOCAL_PCI_RESET#
(RESETOUT) is free to follow PCI_RST#. Bit 3 of the I2C
command latch powers up low, thus not asserting
LOCAL_PCI_RST#.
Power-Down Sequence
When either BD_SEL# (OFF/ON) or Bit 2 of the command
latch (C2) is set high, a power-down sequence begins
(Figure 5).
The TIMER pin is immediately pulled low. The GATE pin
(Pin 19) is pulled down by a 200µA current source to
prevent the load currents on the 3.3V and 5V supplies from
going to zero instantaneously and glitching the power
TIMER
10V/DIV
supply voltages. Internal switches are connected to each
of the output supply voltage pins to discharge the output
bulk capacitors to ground. When any one of the output
voltages drops below its PWRGD threshold, the HEALTHY#
signal pulls high, LOCAL_PCI_RST# (RESETOUT) is asserted low, and the external status LED turns on.
Once the power-down sequence is complete the status
LED will light up and the CPCI card may be removed from
the slot. During extraction, the precharge circuit will
continue to bias the bus I/O pins at 1V until the long
connector pin connections are broken.
Early Power
Early Power usage is restricted by the CompactPCI (CPCI)
specification. It is intended to power up the precharge
circuit and I/O cells. The CPCI specification allows any of
the long power pins (5V, 3.3V, V(I/O)) to be used for Early
Power. Since Early Power is not isolated, a resistor should
be placed in series with each CPCI connector pin. Note that
if any Early Power pin is shorted on the inserted card, the
current limiting resistor will dissipate the power.
In order to maximize the DC current available from the 5V
supply, all eight 5V connector pins should be tied together
on the inserted card. The same applies to the ten 3.3V CPCI
connector pins. Early Power should then be drawn from
either or both of the two V(I/O) long pins. If either or both
of 5V and 3.3V is used for Early Power, then the 5V and
3.3V sense resistor values must be chosen such that the
1A/pin CPCI rule is not violated.
GATE
10V/DIV
12VOUT
10V/DIV
5VOUT
10V/DIV
3VOUT
10V/DIV
VEEOUT
10V/DIV
BD_SEL#
5V/DIV
Connecting VEEIN
LCL_PCI_RST#
5V/DIV
HEALTHY#
5V/DIV
10ms/DIV
4240 F05
To lessen the likelihood of faulting on power up, the VEEOUT
output pin should be bypassed with a capacitor that is only
as large as necessary. A value of 10µF to 47µF is recommended. If a large value bypass capacitor is used (e.g.
≥100µF) on VEEOUT, current limit faults may occur during
power-up or during recovery from power failures.
Figure 5. Normal Power-Down Sequence
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Timer
During a power-up sequence, an 11.5µA current source is
connected to the TIMER pin (Pin 5) and charges up the
external TIMER pin capacitor. Current limit faults are
ignored until the TIMER voltage ramps to 5.5V. This feature
allows the LTC4240 to power-up CPCI boards with widely
varying capacitive loads on the back end supplies. The
power-up time for either of the two outputs under current
limit conditions is given by the slower of:
tON (XVOUT ) = 2 •
tON (GATE) =
C LOAD(XVOUT) • XVOUT
ILIMIT (XVOUT) – ILOAD(XVOUT)
C1(XVOUT + VTH )
65µA
or (2a )
(2b)
Where XVOUT = 5VOUT or 3VOUT. The timer period should
be set longer than the maximum supply turn-on time but
short enough to not exceed the maximum safe operating
area of the pass transistor during a short-circuit. VTH is the
threshold voltage of the external power FET (2V – 3V). The
timer period will be:
tTIMER =
C TIMER • 5.5V
11.5µA
switches will be latched off and the FAULT pin (Pin␣ 7) will
be pulled low. Since there is no automatic retry, power will
have to be cycled with the OFF/ON pin or the I2C command
latch.
Short-Circuit Protection
In order to lower power dissipation in the pass transistors
and to mitigate voltage spikes on the supplies during
short-circuit conditions, the current limit on each supply
is designed to be a function of the output voltage. As the
output voltage drops, the current limit decreases. Unlike a
traditional circuit breaker function where huge currents
can flow before the breaker trips, the current foldback
feature lowers short-circuit current by at least 50% when
powering up into a short.
If any supply is in current limit after the TIMER pin voltage
has ramped to 5.5V, then all four pass transistors will be
immediately turned off and FAULT will be asserted low
(Figure 6).
TIMER
5V/DIV
(3)
The TIMER pin is immediately pulled low when either
OFF/ON (Pin 28) or Bit 2 of command latch (C2) goes high.
The TIMER pin also functions as a temporary auxiliary
supply for 12VIN. In the event of a large (greater than 1V)
glitch on 12VIN, the energy stored on the timer capacitor
is used as substitute 12VIN power. This improves the
glitch immunity of the LTC4240.
GATE
5V/DIV
12VOUT
10V/DIV
5VOUT
10V/DIV
3VOUT
10V/DIV
VEEOUT
10V/DIV
BD_SEL#
5V/DIV
FAULT
5V/DIV
Thermal Shutdown
The internal switches for the 12V and –12V supplies are
protected by current limit and thermal shutdown circuits.
When the temperature of the die reaches 150°C, all four
10ms/DIV
4240 F06
Figure 6. Power-Up into a Short on 3.3V Output
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Once the TIMER voltage has reached 5.5V, all of the
supplies will be latched off if any supply enters current
limit for at least 35µs. The 35µs delay prevents quick
current spikes—for example, from a fan turning on—
from causing false trips of the circuit breaker.
During normal operation, the 5V and 3.3V supplies are
protected from overcurrent and short-circuit conditions
by dual-level circuit breakers. In the event that either
supply current exceeds the nominal limit, an internal timer
is started. If the supply is still overcurrent after 35µs, the
circuit breaker trips and all the supplies are turned off
(Figure 7). If a short-circuit occurs on 5VOUT or 3VOUT and
the supply current exceeds three times the set limit, an
analog loop will limit the current to 3 times the value set
by RSENSE and 55mV. If the short persists for more than
35µs, the LTC4240 latches off (Figure 8). It will stay in the
latched off state until it is reset using the OFF/ON pin or by
using the I2C interface. The LTC4240 can also be reset by
cycling any of the power supplies.
The current limit and the foldback current level for the 5V
and 3.3V outputs are both a function of the external sense
resistor (R1 for 3VOUT and R2 for 5VOUT, see front page).
A sense resistor is connected between 5VIN (Pin 21) and
5VSENSE (Pin 20) for the 5V supply. For the 3.3V supply, a
sense resistor is connected between 3VIN (Pin 22) and
3VSENSE (Pin 23). The current limit and the current foldback
current level are given by Equations 4 and␣ 5:
ILIMIT (XVOUT) =
55mV
RSENSE(XVOUT)
IFOLDBACK(XVOUT) =
11mV
RSENSE(XVOUT)
(4)
(5)
where XVOUT = 5VOUT or 3VOUT.
Equation 4 is the current limit for XVOUT ≈ XVIN. Equation
5 shows the ILIMIT for shorted outputs. Both equations
assume voltage on TIMER pin is greater than 5.5V.
XVOUT = 3VOUT or 5VOUT. Note that since there are only 8
pins connecting 5VIN, RSENSE ≥ 0.007Ω for 5VIN.
5VIN–5VSENSE
100mV/DIV
The current limit for the internal 12V switch is set at
–1200mA folding back to –350mA and the –12V switch at
500mA folding back to 250mA.
GATE
5V/DIV
Selecting RSENSE
FAULT
5V/DIV
20µs/DIV
4240 F07
Figure 7. Overcurrent Fault on 5V
5VIN–5VSENSE
100mV/DIV
GATE
5V/DIV
FAULT
5V/DIV
20µs/DIV
Figure 8. Short-Circuit Fault on 5V
4240 F08
An equivalent circuit for the 5V and 3.3V circuit breakers
is shown in Figure 9. The sense resistor and the circuit
breaker threshold voltage determine the fault current that
turns off the external FETs. Sense resistors with a 1%
tolerance are recommended. Due to part to part and
temperature variations for both the sense resistor value
and the circuit breaker threshold voltage, the actual current limit threshold will exhibit some variation. To calculate the smallest value of current that will trip the fault
comparator, use the largest value of the sense resistor and
the smallest value of the threshold voltage. A 0.005Ω 1%
sense resistor (on the 3.3V supply, for example) with
typical temperature coefficients would increase to approximately 0.0051Ω (nominal value multiplied by the 1%
tolerance and the TC at 70°C). Since the minimum value of
the threshold voltage is 50mV, this implies a current limit
of 9.8A. To arrive at the largest value of the current limit
that will turn off the external FETs, the nominal value of the
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sense resistor drops to 0.0049Ω and the largest value of
threshold voltage increases to 60mV. This results in a trip
current of 12.2A.
ILOAD(MAX)
RSENSE
5VIN
21
5VIN
+
–
–
20
5VSENSE
VCB
LTC4240*
+
VCB(MAX) = 60mV
VCB(NOM) = 55mV
VCB(MIN) = 50mV
*ADDITIONAL DETAILS
OMITTED FOR CLARITY
4240 F09
Figure 9. Circuit Breaker Equivalent
Circuit for Calculating RSENSE
Plug-in board designers are thus limited to using less than
9.8A when a nominal 0.005Ω resistor is used. Using more
than 9.8A runs the risk of turning off the external FET.
Since the CompactPCI specification allows a maximum
1A/pin, at least 10 pins must be used to supply 9.8A. This
implies that only the 3.3V supply can use a 0.005Ω
resistor, since the 5V supply has a maximum of 8 pins
available. To adhere to the 1A/pin specification, the 5V
sense resistor should be larger than the 3.3V sense
resistor. Typical applications show a nominal 0.007Ω
resistor, which results in a 7.04A maximum deliverable
current to the plug-in board loads. The 7.04A current
implies at least 7 pins on the 5V connector. Note that the
thermal considerations of the external FET will also place
limitations on the maximum allowable current.
5V and 3.3V External FET Selection
The LTC4240 uses external power FETs to limit and
modulate the current delivered by the 3.3V and 5V supplies. There are several parameters to consider when
selecting the FET:
On Resistance
The CompactPCI specification limits the total IR drop of
the FET plus the IR drop of the sense resistor to 100mV.
For a nominal sense resistor of 0.005Ω, if the user limits
the 3.3V supply load current to 8.7A, then the maximum
FET resistance should be less than 0.0063Ω. Similarly, for
a 6.2A load current on the 5V supply and a 0.007Ω sense
resistor, the maximum 5V FET resistance should be
0.0088Ω. Note that above values of FET resistance are
worst case over temperature (on the FET’s datasheet, find
the resistance vs temperature curve and de-rate the room
temperature maximum value).
Breakdown Voltage
The maximum DC voltage that can appear across the
drain/source of the external power FET is 5V +10%. During
transient events and hot swap conditions, parasitic inductances could cause ringing up to 3 times the supply
voltage. The use of voltage transient suppressors at the 5V
and 3.3V inputs can limit these voltage swings to less than
10V (see front page schematic). Similarly, the largest DC
voltage that is likely to appear across the gate is 12V
+10%. Voltage suppressors on the 12VIN node will also
limit the transient spikes on that node. Additionally, the
total capacitance on the GATE node will serve to filter fast
voltage noise spikes. FETs with a minimum rating of ±20V
on both the drain/source and the gate/source are recommended.
Steady State Power Dissipation
For a user selected maximum load current of 8.7A on the
3.3V power supply and a 0.0063Ω maximum FET resistance, the DC power dissipation is:
(IMAX)2(RDSON,MAX) = (8.7)(8.7)(0.0063) = 0.477W
This is within the SOA limits of most power FETs.
1. On resistance.
2. Gate and drain breakdown voltage.
3. Steady state and transient power dissipation.
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Transient Power Dissipation
There are certain transient events that can significantly
increase the power dissipated by the external FET. If the
LTC4240 5V supply (at 5V + 10%) powers up into a 1.5V
short (potentially manifested as a short to two diodes in
series), then the FET can potentially have 4V across it with
8.8A flowing. This implies a power dissipation of 35.1W.
The amount of time the FET will dissipate 35.1W will
depend on the relative values of the TIMER and GATE
capacitances. For the values specified on the front page
application circuit, the GATE pin will ramp high significantly faster than the TIMER pin, hence transient power
dissipation will be set by the TIMER pin capacitance.
The dissipated 35.1W, the ramp time of the TIMER pin
(50ms will be used for this example), and the FET thermal
resistance will determine the internal junction temperature of the FET. Most FETs will specify a maximum internal
junction temperature of 150°C. The FET datasheets should
have a transient thermal impedance graph. This graph has
a family of curves listing the FET transient thermal impedance as a function of duty cycle. The duty cycle refers to
what percentage of the time the FET is in the short circuit
condition. If we choose the Si7880DP FET and assume
that the board on which the FET is placed has minimal heat
sinking capability, and further assume that the user will
turn on the board every 2.5 seconds (0.02 duty cycle:
50ms on, 2450ms off), then by looking at the junction-toambient curve we note that with a 70°C ambient temperature, the Si7880DP internal junction temperature will be
172°C. This is above the absolute maximum rating of the
FET, and although operating at this temperature will not
damage the FET immediately, it does affect its long term
reliability. Conversely, if we assume that there is a perfect
heat sink for the Si7880DP package, then we would use the
junction-to-case curve and calculate a value of 117°C with
a 70°C ambient temperature. The Si7880DP comes in a
thermally enhanced package whose drain lead is a large
piece of metal that can conduct heat away from the internal
junction of the FET. To achieve best performance, the drain
of the Si7880DP should be connected to a piece of copper
(as large as possible) on the board. Note that if the output
is shorted to ground, the current foldback feature will cut
the power dissipation by at least a factor of two.
When the LTC4240 is turned on and the large 5VOUT
output capacitor (2000µF or more) is charged, it is possible that the 5V FET will dissipate as much as the 35.1W
described above. If there is no DC load at 5VOUT, then 8.8A
will charge the 2000µF in less than 2ms, which should not
pose any thermal problems for the Si7880DP. If the DC
load at 5VOUT approaches the current limit, then the above
analysis should be used to calculate the internal junction
temperature of the FET.
Output Voltage Monitor
The DC level of all four supply outputs is monitored by the
power good circuitry. When any of the four supply outputs
falls below its specified level (see DC electrical specifications) for longer than 10µs, the PWRGD (HEALTHY#)
open drain pin will be deasserted and the LOCAL_PCI_RST#
signal will be asserted low. This does not generate a fault
condition.
The LOCAL_PCI_RST# signal (RESETOUT pin) is derived
from the HEALTHY# (PWRGD pin), PCI_RST# (RESETIN
pin), and Bit 3 of the command latch (see Table 5).
Table 5. LOCAL_PCI_RST# Truth Table
HEALTHY#
Bit 3 (C3 )
Command Latch
LOCAL_PCI_RST#
LO
X
X
LO
X
HI
X
LO
X
X
HI
LO
HI
LO
LO
HI
PCI_RST#
Precharge
The PRECHARGE input and DRIVE output pins are used to
generate the 1V precharge voltage that biases the bus I/O
connector pins during board insertion and extraction
(Figure 10). The LTC4240 is capable of generating
precharge voltages other than 1V. Figure 11 shows a
circuit that can be used in applications requiring a precharge
voltage less than 1V. The circuit in Figure 12 can be used
for applications that need precharge voltages greater than
1V. Table 6 lists suggested resistor values for R11A and
R11B vs precharge voltage for the application circuits
shown in Figures 11 and 12.
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Table 6. R1 and R2 Resistor Values vs Precharge Voltages
VPRECHARGE
R11A
R11B
VPRECHARGE
R11A
R11B
1.5V
18Ω
9.09Ω
0.9V
16.2Ω
1.78Ω
1.4V
18Ω
7.15Ω
0.8V
14.7Ω
3.65Ω
1.3V
18Ω
5.36Ω
0.7V
12.1Ω
5.11Ω
1.2V
18Ω
3.65Ω
0.6V
11Ω
7.15Ω
1.1V
18Ω
1.78Ω
0.5V
9.09Ω
9.09Ω
1V
18Ω
0Ω
CompactPCI
BACKPLANE
CONNECTOR
(MALE)
CompactPCI
BACKPLANE
CONNECTOR
(FEMALE)
MEDIUM 5V
5VIN
21
R22
2.74Ω
LONG 5V
3VIN
3.3V
Precharge resistors are used to connect the 1V bias
voltage to the CompactPCI connector I/O lines. This allows
live insertion of the I/O lines with minimal disturbance.
Figure 13 shows the precharge application circuit for 5V
signaling environments. The precharge resistor requirements are more stringent for 3.3V and Universal Hot Swap
signaling. If the total leakage current on the I/O line is less
5VIN
LTC4240*
22
R21
1.74Ω
LONG 3.3V
3VIN
GND
PRECHARGE
10
R11
18Ω, 5%
GROUND
RI01
10Ω, 5%
DRIVE
18
PRECHARGE OUT
1V ±20%
IOUT = ±55mA
17
C3
4.7nF
R9
24Ω, 5%
Q3
R7
MMBT2222A
RPRE128
12Ω, 5%
10k
5%
I/O
RPRE1
10k
5%
I/O PIN 1
UP TO 128
I/O LINES
• • •
• • •
• • •
• • •
DATA BUS
R8
1k, 5%
I/O PIN 128
RI0128
10Ω, 5%
I/O
3VIN
PCI
BRIDGE
(21154)
*ADDITIONAL DETAILS OMITTED FOR CLARITY
4240 F10
Figure 10. Precharge Application Circuit
LTC4240*
LTC4240*
GND
10
PRECHARGE
18
C3
4.7nF
R9
24Ω, 5%
R11A
R11B
PRECHARGE OUT
R11A
• 1V
VPRECHARGE =
R11A + R11B
DRIVE
17
GND PRECHARGE
10
18
R8
1k, 5%
R9
C3
24Ω, 5%
4.7nF
R7
12Ω, 5%
Q3
MMBT2222A
*ADDITIONAL DETAILS
OMITTED FOR CLARITY
Figure 11. Precharge Voltage Less Than 1V
DRIVE
17
4240 F11
R7
12Ω, 5%
Q3
MMBT2222A
PRECHARGE OUT
*ADDITIONAL DETAILS
VPRECHARGE = R11A + R11B • 1V
OMITTED FOR CLARITY
R11A
R11A
3VIN
R8
1k, 5%
R11B
3VIN
4240 F12
Figure 12. Precharge Voltage Greater Than 1V
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than 2µA, then a 50K resistor can be connected directly
from the 1V bias voltage to the I/O line. However, many ICs
connected to the I/O lines can have leakage currents up to
10µA. For these applications, a 10k resistor is used but
must be disconnected when the board has been seated as
determined by the state of the BD_SEL# signal. Figure 14
shows a precharge circuit that uses a bus switch to
CompactPCI
BACKPLANE
CONNECTOR
(MALE)
CompactPCI
BACKPLANE
CONNECTOR
(FEMALE)
MEDIUM 5V
5VIN
21 5V
IN
R22
2.74Ω
LONG 5V
connect the individual 10k precharge resistors to the
LTC4240 1V PRECHARGE pin. The electrical connection is
made (bus switches close) when the voltage on the
BD_SEL# pin of the plug-in card is above 4.4V, which
occurs just after the long pins have made contact. The bus
switches are subsequently electrically disconnected when
the board connector makes contact with the BD_SEL# pin
(bus switch OE pin is pulled high by Q4).
R18
1k, 5% 28
OFF/ON
R17
GND
1.2k
5%
BD_SEL#
Z4
PRECHARGE
DRIVE
18
RI01
10Ω
5%
RPRE128
10k
5%
I/O PIN 1
3VIN
Q3
PRECHARGE OUT MMBT2222A
R7
1V ±10%
12Ω, 5%
IOUT = ±55mA
I/O
UP TO 128 I/O LINES
• • •
• • •
• • •
RI0128
10Ω
5%
DATA BUS
R9
24Ω
C3, 4.7nF
RPRE1
10k
5%
R8
1k, 5%
17
R11
18Ω, 5%
LONG
5V
GROUND
LTC4240*
PCI
BRIDGE
CHIP
I/O
I/O PIN 128
Z4: 1PMT5.0AT3
*ADDITIONAL DETAILS OMITTED FOR CLARITY
4240 F13
Figure 13.Precharge Application Circuit for 5V Signaling Systems
CompactPCI
BACKPLANE
CONNECTOR
(MALE)
MEDIUM 5V
CompactPCI
BACKPLANE
CONNECTOR
(FEMALE)
5VIN
R22
2.74Ω
21 5V
IN
R17
1.2k
5%
LONG 5V
BD_SEL#
R18
1k, 5% 28
OFF/ON
GND
LTC4240*
PRECHARGE
10
Z4
R26
51.1k, 5%
LONG
5V
100Ω
Q4
MMBT3906 0.1µF
R27
75k
5%
OE
RI01
10Ω
5%
I/O PIN 1
Q3
R7
MMBT2222A 12Ω, 5%
PRECHARGE OUT
1V ±10%
IOUT = ±55mA
UP TO 128 I/O LINES
3VIN
I/O
• • •
RI0128
10Ω
5%
R8
1k, 5%
C3, 4.7nF
IN
VDD
BUS SWITCH
OUT
OUT
RPRE1 RPRE128
10k
10k
5%
5%
• • •
• • •
DATA BUS
17
R9
24Ω
R11
18Ω, 5%
GROUND
DRIVE
18
I/O PIN 128
Z4: 1PMT5.0AT3
*ADDITIONAL DETAILS OMITTED FOR CLARITY
I/O
PCI
BRIDGE
CHIP
4240 F14
Figure 14. Precharge Bus Switch Application Circuit for 3.3V and Universal Hot Swap Boards
4240f
23
LTC4240
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APPLICATIO S I FOR ATIO
The assumption by the CompactPCI specification is that
there is a diode to 3.3V on the circuit that is driving the
BD_SEL# pin. The 1.2k resistor pull up to 5VIN on the plugin card will thus be clamped by the diode to 3.3V. If the
BD_SEL# pin is being driven high, the actual voltage on the
pin will be approximately 3.9V. This is still above the high
TTL threshold of the LTC4240 OFF/ON pin, but low enough
for Q4 to disable the bus switches and thus remove the 10k
resistors from the I/O lines. Note that BD_SEL# is ordinarily connected to V(I/O), which in turn is allowed to be
driven by either 3.3V or 5V. For applications such as
shown in Figure 14, the pull up on BD_SEL# is restricted
to the long 5V pins. A bus switch with no internal diode to
VDD is preferred. Since the power to the bus switch is
derived from one of the unswitched power planes, a 100Ω
resistor plus a 0.1µF bypass capacitor should be placed in
series with its power supply.
When the plug-in card is removed from the connector, the
BD_SEL# connection is broken first, and the BD_SEL#
voltage pulls up to 5V. This causes Q4 to turn off, which reenables the bus switch, and the precharge resistors are
again connected to the LTC4240 PRECHARGE pin for the
remainder of the board extraction process.
The LTC4240 BE pin can alternatively be used to drive the
enable input of the bus switch. The BE signal would then
keep the I/O lines precharged until all supplies reached
power good status. The resistor in series with the
PRECHARGE pin protects the internal circuitry from large
voltage transients during live insertion.
PRSNT1#, PRSNT2#
PRSNT1# and PRSNT2# are PCI signals that convey the
plug-in board’s power consumption information. These
pins should either be shorted to ground or be connected
to Early Power with a 10k resistor. The voltage levels (TTL)
at the PRSNT#1, 2 pins can be read using the I2C 2-wire
interface.
PRSNT1#
PRSNT2#
Expansion Configuration
Open
Open
No plug in board present
Ground
10k Pull-Up
Plug-in board present,
maximum power consumption
10k Pull-Up
Ground
Plug-in board present,
nominal power consumption
Ground
Ground
Plug-in board present,
minimum power consumption
Other CompactPCI Applications
If no 3.3V supply input is required, Figure 15 illustrates
how the LTC4240 should be configured.
For applications where the BD_SEL# connector pin is
grounded on the backplane, the circuit in Figure␣ 16 allows
the LTC4240 to be reset simply by pressing a pushbutton
switch on the CPCI plug-in board. This arrangement
allows for manual resetting of the LTC4240’s circuit breakers.
Input Transient Protection
Hot-plugging a board into a backplane generates inrush
currents from the backplane power supplies. This is due to
the charging of the plug-in board bulk capacitance. To
reduce this transient current to a safe level, the CPCI Hot
Swap specification restricts the amount of unswitched
capacitance used on the input side of the plug-in board.
Each pin connected to the CPCI female connector on the
plug-in board is allowed at most 0.01µF/pin. Bulk capacitors are only allowed on the switched output side of the
LTC4240 (5VOUT, 3VOUT, 12VOUT, VEEOUT). Some bulk
capacitance is allowed on the Early Power planes, but only
because a current limiting resistor is assumed to separate
the connector from the bulk capacitor. Circuits normally
placed on the unswitched Early Power (PCI Bridge, for
example) need to have a current limiting resistor.
4240f
24
LTC4240
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APPLICATIO S I FOR ATIO
Disallowing bulk capacitors on the input power pins
mitigates the inrush current during hot plug. However, it
also tends to create a resonant circuit formed by the
inductance of the backplane power supply trace and the
parasitic capacitance of the plug-in board (mainly due to
the large power FET). Upon board insertion, the ringing of
this circuit will exhibit peak overshoot as high as 2.5 times
the steady state voltage (>30V for 12V).
networks. Snubbers are RC networks whose time
constants are large enough to damp the inductance of the
parasitic resonant circuit. The snubber capacitor should
be 10X to 100X the value of the plug-in board parasitic
capacitance. The value of the series snubber resistor
should be large enough to damp the resulting
R-L-C circuit and is typically between 1Ω and 50Ω. These
protection networks should be mounted very close to the
LTC4240 in order to minimize parasitic inductance. This is
shown in Figure 17 for the 3.3V and 5V supplies.
There are two methods for abating the effects of these high
voltage transients: using zener clamps, and using snubber
CompactPCI CompactPCI
BACKPLANE BACKPLANE
CONNECTOR CONNECTOR
(FEMALE)
(MALE)
R2
0.007Ω
5VIN
MEDIUM 5V
5VOUT
Z4
LONG
5V
CL(5VOUT)
D1
R22
2.74Ω
C1
R5 0.047µF
1k
R4
10Ω
D2
22
3VIN
10
GND
D1, D2: BAV99
Q2
Si7880DP
21
23
3VSENSE
5VIN
19
20
6
5VSENSE GATE
24
5VOUT 3VOUT
LTC4240*
GND
4240 F15
Z4: 1PMT5.0AT3
*ADDITIONAL DETAILS OMITTED FOR CLARITY
Figure 15. 5V Supply Only Application Circuit
V(I/O)
CompactPCI CompactPCI
BACKPLANE BACKPLANE
CONNECTOR CONNECTOR
(FEMALE) PUSHBUTTON
(MALE)
SWITICH
1.2k
100Ω
BD_SEL#
1k 28
OFF/ON
LTC4240*
GND
10
GND
4240 F16
*ADDITIONAL DETAILS OMITTED FOR CLARITY
Figure 16. BD_SEL# Pushbutton Toggle Switch
R2
0.007Ω
Q2
Si7880DP
5VOUT
AT 5A
MEDIUM 5V
R22, 2.74Ω
LONG 5V
R1
0.005Ω
Q1
Si7880DP
3VOUT
AT 7.6A
MEDIUM 3.3V
R21, 1.74Ω
LONG 3.3V
R3
10Ω
R23
2.7Ω
22
3VIN
23
19
3VSENSE GATE
R4
10Ω
24
21
5VIN
3VOUT
Z3
LTC4240*
C7
0.1µF
GND
Z3, Z4: 1PMT5.0AT3
*ADDITIONAL DETAILS OMITTED FOR CLARITY
10
20
5VSENSE
R5
1k
C1
0.047µF
6
5VOUT
2.7Ω
Z4
0.1µF
1644 F17
Figure 17. Place Transient Protection Device Close to the LTC4240
4240f
25
LTC4240
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APPLICATIO S I FOR ATIO
Note (see front page schematic) that the 12V and –12V
show 0.01µF snubber capacitors. This is consistent with
the CPCI specification since we also recommend a 10Ω
snubber resistor. The 12VIN pin is the most sensitive to
high energy large voltage transients. A transient voltage
suppressor with a breakdown voltage between 13.2V and
15V is advisable. The TVS should also be able to dissipate
at least 150W. The SMAJ12CA can be used for both 12VIN
and VEEIN. Place the TVS close to the LTC4240. See front
page schematic.
CURRENT FLOW
TO LOAD
5VIN
5V
CURRENT FLOW
TO LOAD
POWER
MOSFET
SENSE
RESISTOR
W
D
G
D
S
D
S
D
S
VIA/PATH
TO GND
R4
TRACK WIDTH W:
0.03" PER AMPERE
ON 1OZ Cu FOIL
5VOUT
5V
W
GATE
R5
15
16
17
18
19
20
21
22
23
24
25
26
27
28
C1
LTC4240CGN*
14
13
12
11
10
9
8
7
CURRENT FLOW
TO SOURCE
CTIMER
GND
6
5
4
3
2
1
SIMILAR LAYOUT
FOR 3.3V RAIL
NOT SHOWN
VIA TO
GND PLANE
PCB Layout Considerations
For proper operation of the LTC4240’s circuit breaker
function, a 4-wire Kelvin connection to the sense resistors
is highly recommended. A recommended PCB layout for
the sense resistor, the power MOSFET, and the GATE drive
components around the LTC4240 is illustrated in
Figure␣ 18. The drawing is not to scale and is only intended
to show the low resistance, external high current path. In
hot swap applications where load currents can reach 10A,
narrow PCB tracks exhibit more resistance than wider
tracks and operate at more elevated temperatures. Since
the sheet resistance of 1 ounce copper is approximately
0.5mΩ/square, track resistances add up quickly in highcurrent applications. Thus, to keep PCB track resistance
and temperature rise to a minimum, the suggested trace
width in these applications for 1 ounce copper is 0.03" for
each ampere of DC current.
In order to help dissipate the heat generated by the power
MOSFET, the copper trace connected to the drain should
be made as large as possible.
In the majority of applications, it will be necessary to use
plated-through vias to make circuit connections from
component layers to power and ground layers internal to
the PC board. For 1 ounce copper plating, a general rule is
1A of DC current per via, making sure the via is properly
dimensioned so that solder completely fills any void. For
other plating thicknesses, check with your PCB fabrication
facility.
GND
W
Power MOSFET and Sense Resistor Selection
*ADDITIONAL DETAILS OMITTED FOR CLARITY. DRAWING IS NOT TO SCALE!
4240 F18
Figure 18. Recommended Layout for Power MOSFET,
Sense Resistor and GATE Components for the 5V Rail.
Similar Layout for 3.3V Rail Not Shown
Table 7 lists some current MOSFET transistors that are
available. Table 8 lists some current sense resistors that
can be used with the LTC4240’s circuit breakers. Table␣ 9
lists supplier web site addresses for discrete components
mentioned throughout the LTC4240 data sheet. High
current applications should select a MOSFET with very
low on-resistance and good transient thermal characteristics.
4240f
26
LTC4240
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Table 7. N-Channel Power MOSFET Selection Guide
CURRENT LEVEL (A)
PART NUMBER
DESCRIPTION
MANUFACTURER
0 to 2
MMDF3N02HD
Dual N-Channel SO-8
RDS(ON) = 0.1Ω
ON Semiconductor
2 to 5
MMSF5N02HD
Single N-Channel SO-8
RDS(ON) = 0.025Ω
ON Semiconductor
5 to 10
MTB50N06V
Single N-Channel DD-Pak
RDS(ON) = 0.028Ω
ON Semiconductor
5 to 10
IRF7457
Single N-Channel SO-8
RDS(ON) = 0.007Ω
International Rectifier
5 to 10
Si7880DP
Single N-Channel PowerPAKTM
RDS(ON) = 0.003Ω
Vishay-Siliconix
Table 8. Sense Resistor Selection Guide
CURRENT LIMIT VALUE
PART NUMBER
DESCRIPTION
MANUFACTURER
1A
LR120601R055F
WSL1206R055
0.055Ω, 0.5W, 1% Resistor
IRC-TT
Vishay-Dale
2A
LR120601R028F
WSL1206R028
0.028Ω, 0.5W, 1% Resistor
IRC-TT
Vishay-Dale
5A
LR120601R011F
WSL2010R011
0.011Ω, 0.5W, 1% Resistor
IRC-TT
Vishay-Dale
7.9A
WSL2512R007
0.007Ω, 1W, 1% Resistor
Vishay-Dale
11A
WSL2512R005
0.005Ω, 1W, 1% Resistor
Vishay-Dale
PowerPAK is a trademark of Vishay-Siliconix
Table 9. Manufacturers’ Web Site
MANUFACTURER
WEB SITE
International Rectifier
www.irf.com
ON Semiconductor
www.onsemi.com
IRC-TT
www.irctt.com
Vishay-Dale
www.vishay.com
Vishay-Siliconix
www.vishay.com
Diodes, Inc.
www.diodes.com
4240f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC4240
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PACKAGE DESCRIPTIO
GN Package
28-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.386 – .393*
(9.804 – 9.982)
.045 ±.005
28 27 26 25 24 23 22 21 20 19 18 17 1615
.254 MIN
.033
(0.838)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.0165 ± .0015
.150 – .157**
(3.810 – 3.988)
.0250 TYP
1
RECOMMENDED SOLDER PAD LAYOUT
.015 ± .004
× 45°
(0.38 ± 0.10)
.0075 – .0098
(0.191 – 0.249)
2 3
4
5 6
7
8
9 10 11 12 13 14
.053 – .069
(1.351 – 1.748)
.004 – .009
(0.102 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
.008 – .012
(0.203 – 0.305)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
.0250
(0.635)
BSC
GN28 (SSOP) 0502
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1421
Hot Swap Controller
Dual Supplies for 3V to 12V, Additionally –12V
LTC1422
Hot Swap Controller in SO-8
Single Supply from 3V to 12V
LT1641-1/LT1641-2
Positive Voltage Hot Swap Controller in SO-8
Supplies from 9V to 80V, Latched Off/Auto Retry
LTC1642
Fault Protected Hot Swap Controller
3V to 15V, Overvoltage Protection Up to 33V
LTC1643AL/LTC1643AL-1/ PCI Bus Hot Swap Controllers
LTC1643AH
3.3V, 5V, 12V, –12V Supplies for PCI Bus
LTC1644
CompactPCI Hot Swap Controller
3.3V, 5V, ±12V, I/O Precharge and Local Reset Logic
LTC1645
2-Channel Hot Swap Controller
Operates from 1.2V to 12V, Power Sequencing
LTC1646
CompactPCI Hot Swap Controller for 3.3V and 5V
3.3V and 5V only, I/O Precharge and Local Reset Logic
LTC1647
Dual Hot Swap Controller
Dual ON Pins for Supplies from 3V to 15V
LTC4211
Single Hot Swap Controller with Multifunction Current Control 2.5V to 16.5V, Dual Level Circuit Breaker, No Gate Capacitor
LTC4230
Triple Hot Swap Controller with Multifunction Current Control
1.7V to 16.5V, Dual Level Circuit Breaker, No Gate Capacitor
LTC4241
PCI Hot Swap Controller with 3.3V Auxiliary
3.3V, 5V, ±12V and 3.3VAux Supplies for PCI Bus
LT4250L/LT4250H
–48 Hot Swap Controllers in SO-8
Active Current Limiting, Supplies from –20V to –80V
LTC4251
–48 Hot Swap Controller in SOT-23
Floating Topology, Active Current Limiting
LTC4252
–48 Hot Swap Controller in MSOP
Floating Topology, Active Current Limiting, PWRGD Output
LTC4350
Hot Swappable Load Share Controller
Eliminates ORing Diodes, Identifies and Localizes Faults
4240f
28
Linear Technology Corporation
LT/TP 0403 2K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2003
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