REJ09B0027-0500 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 16 H8/3687Group Hardware Manual Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Tiny Series H8/3687N H8/3687F H8/3687 H8/3686 H8/3685 H8/3684F H8/3684 H8/3683 H8/3682 HD64N3687G, HD64F3687, HD6433687, HD6433686, HD6433685, HD64F3684, HD6433684, HD6433683, HD6433682, Rev.5.00 Revision Date: Nov. 02, 2005 HD6483687G, HD64F3687G, HD6433687G, HD6433686G, HD6433685G, HD64F3684G, HD6433684G, HD6433683G, HD6433682G Rev.5.00 Nov. 02, 2005 Page ii of xxxii Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. Rev.5.00 Nov. 02, 2005 Page iii of xxxii General Precautions on Handling of Product 1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product’s state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Addresses Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system’s operation is not guaranteed if they are accessed. Rev.5.00 Nov. 02, 2005 Page iv of xxxii Configuration of This Manual This manual comprises the following items: 1. 2. 3. 4. 5. 6. General Precautions on Handling of Product Configuration of This Manual Preface Contents Overview Description of Functional Modules • CPU and System-Control Modules • On-Chip Peripheral Modules The configuration of the functional description of each module differs according to the module. However, the generic style includes the following items: i) Feature ii) Input/Output Pin iii) Register Description iv) Operation v) Usage Note When designing an application system that includes this LSI, take notes into account. Each section includes notes in relation to the descriptions given, and usage notes are given, as required, as the final part of each section. 7. List of Registers 8. Electrical Characteristics 9. Appendix 10. Main Revisions and Additions in this Edition (only for revised versions) The list of revisions is a summary of points that have been revised or added to earlier versions. This does not include all of the revised contents. For details, see the actual locations in this manual. 11. Index Rev.5.00 Nov. 02, 2005 Page v of xxxii Preface The H8/3687 Group are single-chip microcomputers made up of the high-speed H8/300H CPU employing Renesas Technology original architecture as their cores, and the peripheral functions required to configure a system. The H8/300H CPU has an instruction set that is compatible with the H8/300 CPU. Target Users: This manual was written for users who will be using the H8/3687 Group in the design of application systems. Target users are expected to understand the fundamentals of electrical circuits, logical circuits, and microcomputers. Objective: This manual was written to explain the hardware functions and electrical characteristics of the H8/3687 Group to the target users. Refer to the H8/300H Series Software Manual for a detailed description of the instruction set. Notes on reading this manual: • In order to understand the overall functions of the chip Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system control functions, peripheral functions and electrical characteristics. • In order to understand the details of the CPU's functions Read the H8/300H Series Software Manual. • In order to understand the details of a register when its name is known Read the index that is the final part of the manual to find the page number of the entry on the register. The addresses, bits, and initial values of the registers are summarized in section 22, List of Registers. Example: Register name: Bit order: The following notation is used for cases when the same or a similar function, e.g. serial communication interface, is implemented on more than one channel: XXX_N (XXX is the register name and N is the channel number) The MSB is on the left and the LSB is on the right. Notes: When using the on-chip emulator (E7, E8) for H8/3687 program development and debugging, the following restrictions must be noted. Rev.5.00 Nov. 02, 2005 Page vi of xxxii 1. The NMI pin is reserved for the E7 or E8, and cannot be used. 2. Pins P85, P86, and P87 cannot be used. In order to use these pins, additional hardware must be provided on the user board. 3. Area H'D000 to H'DFFF is used by the E7 or E8, and is not available to the user. 4. Area H'F780 to H'FB7F must on no account be accessed. 5. When the E7 or E8 is used, address breaks can be set as either available to the user or for use by the E7 or E8. If address breaks are set as being used by the E7 or E8, the address break control registers must not be accessed. 6. When the E7 or E8 is used, NMI is an input/output pin (open-drain in output mode), P85 and P87 are input pins, and P86 is an output pin. 7. Use channel 1 of the SCI3 (P21/RXD, P22/TXD) in on-board programming mode by boot mode. Related Manuals: The latest versions of all related manuals are available from our web site. Please ensure you have the latest versions of all documents you require. http://www.renesas.com/ H8/3687 Group manuals: Document Title Document No. H8/3687 Group Hardware Manual This manual H8/300H Series Software Manual REJ09B0213 User's manuals for development tools: Document Title Document No. H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor User's Manual REJ10B0058 Microcomputer Development Environment System H8S, H8/300 Series Simulator/Debugger User's Manual ADE-702-282 H8S, H8/300 Series High-Performance Embedded Workshop 3, Tutorial REJ10B0024 H8S, H8/300 Series High-Performance Embedded Workshop 3, User's Manual REJ10B0026 Rev.5.00 Nov. 02, 2005 Page vii of xxxii Application notes: Document Title Document No. H8S, H8/300 Series C/C++ Compiler Package Application Note TM Single Power Supply F-ZTAT On-Board Programming Rev.5.00 Nov. 02, 2005 Page viii of xxxii REJ05B0464 ADE-502-055 Rev.5.00 Nov. 02, 2005 Page ix of xxxii Contents Section 1 Overview ............................................................................................... 1 1.1 1.2 1.3 1.4 Features.................................................................................................................................. 1 Internal Block Diagram.......................................................................................................... 3 Pin Arrangement .................................................................................................................... 5 Pin Functions ......................................................................................................................... 7 Section 2 CPU ..................................................................................................... 11 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Address Space and Memory Map ........................................................................................ 12 Register Configuration......................................................................................................... 15 2.2.1 General Registers.................................................................................................... 16 2.2.2 Program Counter (PC) ............................................................................................ 17 2.2.3 Condition-Code Register (CCR)............................................................................. 17 Data Formats........................................................................................................................ 19 2.3.1 General Register Data Formats............................................................................... 19 2.3.2 Memory Data Formats ............................................................................................ 21 Instruction Set ...................................................................................................................... 22 2.4.1 Table of Instructions Classified by Function .......................................................... 22 2.4.2 Basic Instruction Formats ....................................................................................... 32 Addressing Modes and Effective Address Calculation........................................................ 33 2.5.1 Addressing Modes .................................................................................................. 33 2.5.2 Effective Address Calculation ................................................................................ 36 Basic Bus Cycle ................................................................................................................... 38 2.6.1 Access to On-Chip Memory (RAM, ROM)............................................................ 38 2.6.2 On-Chip Peripheral Modules .................................................................................. 39 CPU States ........................................................................................................................... 40 Usage Notes ......................................................................................................................... 41 2.8.1 Notes on Data Access to Empty Areas ................................................................... 41 2.8.2 EEPMOV Instruction.............................................................................................. 41 2.8.3 Bit-Manipulation Instruction .................................................................................. 41 Section 3 Exception Handling ............................................................................. 47 3.1 3.2 Exception Sources and Vector Address ............................................................................... 48 Register Descriptions........................................................................................................... 49 3.2.1 Interrupt Edge Select Register 1 (IEGR1) .............................................................. 50 3.2.2 Interrupt Edge Select Register 2 (IEGR2) .............................................................. 51 3.2.3 Interrupt Enable Register 1 (IENR1) ...................................................................... 52 3.2.4 Interrupt Enable Register 2 (IENR2) ...................................................................... 53 Rev.5.00 Nov. 02, 2005 Page x of xxxii 3.3 3.4 3.5 3.2.5 Interrupt Flag Register 1 (IRR1)............................................................................. 53 3.2.6 Interrupt Flag Register 2 (IRR2)............................................................................. 55 3.2.7 Wakeup Interrupt Flag Register (IWPR) ................................................................ 55 Reset Exception Handling.................................................................................................... 57 Interrupt Exception Handling............................................................................................... 57 3.4.1 External Interrupts .................................................................................................. 57 3.4.2 Internal Interrupts ................................................................................................... 59 3.4.3 Interrupt Handling Sequence .................................................................................. 59 3.4.4 Interrupt Response Time......................................................................................... 60 Usage Notes ......................................................................................................................... 62 3.5.1 Interrupts after Reset............................................................................................... 62 3.5.2 Notes on Stack Area Use ........................................................................................ 62 3.5.3 Notes on Rewriting Port Mode Registers ............................................................... 62 Section 4 Address Break......................................................................................63 4.1 4.2 Register Descriptions ........................................................................................................... 63 4.1.1 Address Break Control Register (ABRKCR) ......................................................... 64 4.1.2 Address Break Status Register (ABRKSR) ............................................................ 65 4.1.3 Break Address Registers (BARH, BARL).............................................................. 65 4.1.4 Break Data Registers (BDRH, BDRL) ................................................................... 66 Operation ............................................................................................................................. 66 Section 5 Clock Pulse Generators........................................................................69 5.1 5.2 5.3 5.4 System Clock Generator ...................................................................................................... 70 5.1.1 Connecting Crystal Resonator ................................................................................ 70 5.1.2 Connecting Ceramic Resonator .............................................................................. 71 5.1.3 External Clock Input Method.................................................................................. 71 Subclock Generator.............................................................................................................. 72 5.2.1 Connecting 32.768-kHz Crystal Resonator............................................................. 72 5.2.2 Pin Connection when Not Using Subclock............................................................. 73 Prescalers ............................................................................................................................. 73 5.3.1 Prescaler S .............................................................................................................. 73 5.3.2 Prescaler W............................................................................................................. 73 Usage Notes ......................................................................................................................... 74 5.4.1 Note on Resonators................................................................................................. 74 5.4.2 Notes on Board Design ........................................................................................... 74 Section 6 Power-Down Modes ............................................................................75 6.1 Register Descriptions ........................................................................................................... 75 6.1.1 System Control Register 1 (SYSCR1) .................................................................... 76 Rev.5.00 Nov. 02, 2005 Page xi of xxxii 6.2 6.3 6.4 6.5 6.1.2 System Control Register 2 (SYSCR2) .................................................................... 78 6.1.3 Module Standby Control Register 1 (MSTCR1) .................................................... 79 6.1.4 Module Standby Control Register 2 (MSTCR2) .................................................... 80 Mode Transitions and States of LSI..................................................................................... 80 6.2.1 Sleep Mode ............................................................................................................. 84 6.2.2 Standby Mode......................................................................................................... 84 6.2.3 Subsleep Mode........................................................................................................ 84 6.2.4 Subactive Mode ...................................................................................................... 85 Operating Frequency in Active Mode.................................................................................. 85 Direct Transition .................................................................................................................. 86 6.4.1 Direct Transition from Active Mode to Subactive Mode ....................................... 86 6.4.2 Direct Transition from Subactive Mode to Active Mode ....................................... 86 Module Standby Function.................................................................................................... 87 Section 7 ROM .................................................................................................... 89 7.1 7.2 7.3 7.4 7.5 7.6 7.7 Block Configuration ............................................................................................................ 89 Register Descriptions........................................................................................................... 91 7.2.1 Flash Memory Control Register 1 (FLMCR1) ....................................................... 91 7.2.2 Flash Memory Control Register 2 (FLMCR2) ....................................................... 92 7.2.3 Erase Block Register 1 (EBR1) .............................................................................. 93 7.2.4 Flash Memory Power Control Register (FLPWCR)............................................... 94 7.2.5 Flash Memory Enable Register (FENR)................................................................. 94 On-Board Programming Modes........................................................................................... 95 7.3.1 Boot Mode .............................................................................................................. 95 7.3.2 Programming/Erasing in User Program Mode........................................................ 98 Flash Memory Programming/Erasing................................................................................ 100 7.4.1 Program/Program-Verify ...................................................................................... 100 7.4.2 Erase/Erase-Verify................................................................................................ 102 7.4.3 Interrupt Handling when Programming/Erasing Flash Memory........................... 103 Program/Erase Protection .................................................................................................. 105 7.5.1 Hardware Protection ............................................................................................. 105 7.5.2 Software Protection .............................................................................................. 105 7.5.3 Error Protection .................................................................................................... 105 Programmer Mode ............................................................................................................. 106 Power-Down States for Flash Memory.............................................................................. 106 Section 8 RAM .................................................................................................. 107 Section 9 I/O Ports............................................................................................. 109 9.1 Port 1.................................................................................................................................. 109 Rev.5.00 Nov. 02, 2005 Page xii of xxxii 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.1.1 Port Mode Register 1 (PMR1) .............................................................................. 110 9.1.2 Port Control Register 1 (PCR1) ............................................................................ 111 9.1.3 Port Data Register 1 (PDR1)................................................................................. 111 9.1.4 Port Pull-Up Control Register 1 (PUCR1)............................................................ 112 9.1.5 Pin Functions ........................................................................................................ 112 Port 2.................................................................................................................................. 115 9.2.1 Port Control Register 2 (PCR2) ............................................................................ 115 9.2.2 Port Data Register 2 (PDR2)................................................................................. 116 9.2.3 Port Mode Register 3 (PMR3) .............................................................................. 116 9.2.4 Pin Functions ........................................................................................................ 117 Port 3.................................................................................................................................. 119 9.3.1 Port Control Register 3 (PCR3) ............................................................................ 119 9.3.2 Port Data Register 3 (PDR3)................................................................................. 120 9.3.3 Pin Functions ........................................................................................................ 120 Port 5.................................................................................................................................. 122 9.4.1 Port Mode Register 5 (PMR5) .............................................................................. 123 9.4.2 Port Control Register 5 (PCR5) ............................................................................ 124 9.4.3 Port Data Register 5 (PDR5)................................................................................. 124 9.4.4 Port Pull-Up Control Register 5 (PUCR5)............................................................ 125 9.4.5 Pin Functions ........................................................................................................ 125 Port 6.................................................................................................................................. 128 9.5.1 Port Control Register 6 (PCR6) ............................................................................ 128 9.5.2 Port Data Register 6 (PDR6)................................................................................. 129 9.5.3 Pin Functions ........................................................................................................ 129 Port 7.................................................................................................................................. 134 9.6.1 Port Control Register 7 (PCR7) ............................................................................ 134 9.6.2 Port Data Register 7 (PDR7)................................................................................. 135 9.6.3 Pin Functions ........................................................................................................ 135 Port 8.................................................................................................................................. 137 9.7.1 Port Control Register 8 (PCR8) ............................................................................ 137 9.7.2 Port Data Register 8 (PDR8)................................................................................. 137 9.7.3 Pin Functions ........................................................................................................ 138 Port B ................................................................................................................................. 139 9.8.1 Port Data Register B (PDRB) ............................................................................... 139 Section 10 Realtime Clock (RTC) .....................................................................141 10.1 Features.............................................................................................................................. 141 10.2 Input/Output Pin................................................................................................................. 142 10.3 Register Descriptions ......................................................................................................... 143 10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) ............. 143 Rev.5.00 Nov. 02, 2005 Page xiii of xxxii 10.3.2 Minute Data Register (RMINDR) ........................................................................ 144 10.3.3 Hour Data Register (RHRDR) .............................................................................. 145 10.3.4 Day-of-Week Data Register (RWKDR) ............................................................... 146 10.3.5 RTC Control Register 1 (RTCCR1) ..................................................................... 147 10.3.6 RTC Control Register 2 (RTCCR2) ..................................................................... 148 10.3.7 Clock Source Select Register (RTCCSR)............................................................. 149 10.4 Operation ........................................................................................................................... 150 10.4.1 Initial Settings of Registers after Power-On ......................................................... 150 10.4.2 Initial Setting Procedure ....................................................................................... 150 10.4.3 Data Reading Procedure ....................................................................................... 151 10.5 Interrupt Source ................................................................................................................. 152 Section 11 Timer B1.......................................................................................... 153 11.1 Features.............................................................................................................................. 153 11.2 Input/Output Pin ................................................................................................................ 154 11.3 Register Descriptions......................................................................................................... 154 11.3.1 Timer Mode Register B1 (TMB1) ........................................................................ 155 11.3.2 Timer Counter B1 (TCB1).................................................................................... 155 11.3.3 Timer Load Register B1 (TLB1) .......................................................................... 156 11.4 Operation ........................................................................................................................... 156 11.4.1 Interval Timer Operation ...................................................................................... 156 11.4.2 Auto-Reload Timer Operation .............................................................................. 156 11.4.3 Event Counter Operation ...................................................................................... 157 11.5 Timer B1 Operating Modes ............................................................................................... 157 Section 12 Timer V ........................................................................................... 159 12.1 Features.............................................................................................................................. 159 12.2 Input/Output Pins............................................................................................................... 161 12.3 Register Descriptions......................................................................................................... 161 12.3.1 Timer Counter V (TCNTV).................................................................................. 161 12.3.2 Time Constant Registers A and B (TCORA, TCORB) ........................................ 161 12.3.3 Timer Control Register V0 (TCRV0) ................................................................... 162 12.3.4 Timer Control/Status Register V (TCSRV) .......................................................... 164 12.3.5 Timer Control Register V1 (TCRV1) ................................................................... 165 12.4 Operation ........................................................................................................................... 166 12.4.1 Timer V Operation................................................................................................ 166 12.5 Timer V Application Examples ......................................................................................... 170 12.5.1 Pulse Output with Arbitrary Duty Cycle............................................................... 170 12.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input .............. 171 12.6 Usage Notes ....................................................................................................................... 172 Rev.5.00 Nov. 02, 2005 Page xiv of xxxii Section 13 Timer Z ............................................................................................175 13.1 Features.............................................................................................................................. 175 13.2 Input/Output Pins ............................................................................................................... 180 13.3 Register Descriptions ......................................................................................................... 181 13.3.1 Timer Start Register (TSTR) ................................................................................ 182 13.3.2 Timer Mode Register (TMDR) ............................................................................. 183 13.3.3 Timer PWM Mode Register (TPMR) ................................................................... 184 13.3.4 Timer Function Control Register (TFCR)............................................................. 185 13.3.5 Timer Output Master Enable Register (TOER) .................................................... 187 13.3.6 Timer Output Control Register (TOCR)............................................................... 188 13.3.7 Timer Counter (TCNT)......................................................................................... 189 13.3.8 General Registers A, B, C, and D (GRA, GRB, GRC, and GRD)........................ 190 13.3.9 Timer Control Register (TCR).............................................................................. 191 13.3.10 Timer I/O Control Register (TIORA and TIORC)................................................ 192 13.3.11 Timer Status Register (TSR)................................................................................. 194 13.3.12 Timer Interrupt Enable Register (TIER) ............................................................... 196 13.3.13 PWM Mode Output Level Control Register (POCR) ........................................... 197 13.3.14 Interface with CPU ............................................................................................... 197 13.4 Operation ........................................................................................................................... 199 13.4.1 Counter Operation................................................................................................. 199 13.4.2 Waveform Output by Compare Match.................................................................. 203 13.4.3 Input Capture Function ......................................................................................... 207 13.4.4 Synchronous Operation......................................................................................... 210 13.4.5 PWM Mode .......................................................................................................... 211 13.4.6 Reset Synchronous PWM Mode ........................................................................... 217 13.4.7 Complementary PWM Mode................................................................................ 221 13.4.8 Buffer Operation ................................................................................................... 230 13.4.9 Timer Z Output Timing ........................................................................................ 237 13.5 Interrupts............................................................................................................................ 240 13.5.1 Status Flag Set Timing.......................................................................................... 240 13.5.2 Status Flag Clearing Timing ................................................................................. 242 13.6 Usage Notes ....................................................................................................................... 242 Section 14 Watchdog Timer ..............................................................................251 14.1 Features.............................................................................................................................. 251 14.2 Register Descriptions ......................................................................................................... 251 14.2.1 Timer Control/Status Register WD (TCSRWD)................................................... 252 14.2.2 Timer Counter WD (TCWD)................................................................................ 253 14.2.3 Timer Mode Register WD (TMWD) .................................................................... 253 14.3 Operation ........................................................................................................................... 254 Rev.5.00 Nov. 02, 2005 Page xv of xxxii Section 15 14-Bit PWM .................................................................................... 255 15.1 Features.............................................................................................................................. 255 15.2 Input/Output Pin ................................................................................................................ 256 15.3 Register Descriptions......................................................................................................... 256 15.3.1 PWM Control Register (PWCR) .......................................................................... 256 15.3.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................. 257 15.4 Operation ........................................................................................................................... 257 Section 16 Serial Communication Interface 3 (SCI3)....................................... 259 16.1 Features.............................................................................................................................. 259 16.2 Input/Output Pins............................................................................................................... 262 16.3 Register Descriptions......................................................................................................... 262 16.3.1 Receive Shift Register (RSR) ............................................................................... 263 16.3.2 Receive Data Register (RDR)............................................................................... 263 16.3.3 Transmit Shift Register (TSR) .............................................................................. 263 16.3.4 Transmit Data Register (TDR).............................................................................. 263 16.3.5 Serial Mode Register (SMR) ................................................................................ 264 16.3.6 Serial Control Register 3 (SCR3) ......................................................................... 265 16.3.7 Serial Status Register (SSR) ................................................................................. 267 16.3.8 Bit Rate Register (BRR) ....................................................................................... 269 16.4 Operation in Asynchronous Mode ..................................................................................... 276 16.4.1 Clock..................................................................................................................... 276 16.4.2 SCI3 Initialization................................................................................................. 277 16.4.3 Data Transmission ................................................................................................ 278 16.4.4 Serial Data Reception ........................................................................................... 280 16.5 Operation in Clocked Synchronous Mode ......................................................................... 284 16.5.1 Clock..................................................................................................................... 284 16.5.2 SCI3 Initialization................................................................................................. 284 16.5.3 Serial Data Transmission ...................................................................................... 285 16.5.4 Serial Data Reception (Clocked Synchronous Mode) .......................................... 288 16.5.5 Simultaneous Serial Data Transmission and Reception........................................ 290 16.6 Multiprocessor Communication Function.......................................................................... 292 16.6.1 Multiprocessor Serial Data Transmission ............................................................. 294 16.6.2 Multiprocessor Serial Data Reception .................................................................. 295 16.7 Interrupts............................................................................................................................ 299 16.8 Usage Notes ....................................................................................................................... 300 16.8.1 Break Detection and Processing ........................................................................... 300 16.8.2 Mark State and Break Sending ............................................................................. 300 16.8.3 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only) ..................................................................... 300 Rev.5.00 Nov. 02, 2005 Page xvi of xxxii 16.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode ............................................................................ 301 Section 17 I2C Bus Interface 2 (IIC2) ................................................................303 17.1 Features.............................................................................................................................. 303 17.2 Input/Output Pins ............................................................................................................... 305 17.3 Register Descriptions ......................................................................................................... 305 17.3.1 I2C Bus Control Register 1 (ICCR1)..................................................................... 306 17.3.2 I2C Bus Control Register 2 (ICCR2)..................................................................... 308 17.3.3 I2C Bus Mode Register (ICMR)............................................................................ 309 17.3.4 I2C Bus Interrupt Enable Register (ICIER) ........................................................... 311 17.3.5 I2C Bus Status Register (ICSR)............................................................................. 313 17.3.6 Slave Address Register (SAR).............................................................................. 316 17.3.7 I2C Bus Transmit Data Register (ICDRT)............................................................. 317 17.3.8 I2C Bus Receive Data Register (ICDRR).............................................................. 317 17.3.9 I2C Bus Shift Register (ICDRS)............................................................................ 317 17.4 Operation ........................................................................................................................... 318 17.4.1 I2C Bus Format...................................................................................................... 318 17.4.2 Master Transmit Operation ................................................................................... 319 17.4.3 Master Receive Operation..................................................................................... 321 17.4.4 Slave Transmit Operation ..................................................................................... 323 17.4.5 Slave Receive Operation....................................................................................... 325 17.4.6 Clocked Synchronous Serial Format..................................................................... 327 17.4.7 Noise Canceler...................................................................................................... 329 17.4.8 Example of Use..................................................................................................... 330 17.5 Interrupt Request................................................................................................................ 334 17.6 Bit Synchronous Circuit..................................................................................................... 335 17.7 Usage Notes ....................................................................................................................... 336 17.7.1 Issue (Retransmission) of Start/Stop Conditions .................................................. 336 17.7.2 WAIT Setting in I2C Bus Mode Register (ICMR) ................................................ 336 Section 18 A/D Converter..................................................................................337 18.1 Features.............................................................................................................................. 337 18.2 Input/Output Pins ............................................................................................................... 339 18.3 Register Descriptions ......................................................................................................... 340 18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 340 18.3.2 A/D Control/Status Register (ADCSR) ................................................................ 341 18.3.3 A/D Control Register (ADCR) ............................................................................. 342 18.4 Operation ........................................................................................................................... 343 18.4.1 Single Mode.......................................................................................................... 343 Rev.5.00 Nov. 02, 2005 Page xvii of xxxii 18.4.2 Scan Mode ............................................................................................................ 343 18.4.3 Input Sampling and A/D Conversion Time .......................................................... 344 18.4.4 External Trigger Input Timing.............................................................................. 345 18.5 A/D Conversion Accuracy Definitions .............................................................................. 346 18.6 Usage Notes ....................................................................................................................... 348 18.6.1 Permissible Signal Source Impedance .................................................................. 348 18.6.2 Influences on Absolute Accuracy ......................................................................... 348 Section 19 EEPROM......................................................................................... 349 19.1 Features.............................................................................................................................. 349 19.2 Input/Output Pins............................................................................................................... 351 19.3 Register Description .......................................................................................................... 351 19.3.1 EEPROM Key Register (EKR)............................................................................. 351 19.4 Operation ........................................................................................................................... 352 19.4.1 EEPROM Interface............................................................................................... 352 19.4.2 Bus Format and Timing ........................................................................................ 352 19.4.3 Start Condition...................................................................................................... 352 19.4.4 Stop Condition ...................................................................................................... 353 19.4.5 Acknowledge ........................................................................................................ 353 19.4.6 Slave Addressing .................................................................................................. 353 19.4.7 Write Operations................................................................................................... 354 19.4.8 Acknowledge Polling............................................................................................ 356 19.4.9 Read Operation ..................................................................................................... 356 19.5 Usage Notes ....................................................................................................................... 359 19.5.1 Data Protection at VCC On/Off............................................................................... 359 19.5.2 Write/Erase Endurance ......................................................................................... 359 19.5.3 Noise Suppression Time ....................................................................................... 359 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional).. 361 20.1 Features.............................................................................................................................. 361 20.2 Register Descriptions......................................................................................................... 362 20.2.1 Low-Voltage-Detection Control Register (LVDCR)............................................ 362 20.2.2 Low-Voltage-Detection Status Register (LVDSR)............................................... 364 20.3 Operation ........................................................................................................................... 365 20.3.1 Power-On Reset Circuit ........................................................................................ 365 20.3.2 Low-Voltage Detection Circuit............................................................................. 366 Section 21 Power Supply Circuit ...................................................................... 371 21.1 When Using Internal Power Supply Step-Down Circuit ................................................... 371 21.2 When Not Using Internal Power Supply Step-Down Circuit............................................. 372 Rev.5.00 Nov. 02, 2005 Page xviii of xxxii Section 22 List of Registers ...............................................................................373 22.1 Register Addresses (Address Order).................................................................................. 374 22.2 Register Bits....................................................................................................................... 381 22.3 Registers States in Each Operating Mode .......................................................................... 386 Section 23 Electrical Characteristics .................................................................391 23.1 Absolute Maximum Ratings .............................................................................................. 391 23.2 Electrical Characteristics (F-ZTAT™ Version, EEPROM Stacked F-ZTATTM Version).......................................... 391 23.2.1 Power Supply Voltage and Operating Ranges ...................................................... 391 23.2.2 DC Characteristics ................................................................................................ 394 23.2.3 AC Characteristics ................................................................................................ 400 23.2.4 A/D Converter Characteristics .............................................................................. 404 23.2.5 Watchdog Timer Characteristics........................................................................... 405 23.2.6 Flash Memory Characteristics .............................................................................. 406 23.2.7 EEPROM Characteristics...................................................................................... 408 23.2.8 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ................... 409 23.2.9 Power-On Reset Circuit Characteristics (Optional) .............................................. 409 23.3 Electrical Characteristics (Mask-ROM Version, EEPROM Stacked Mask-ROM Version)....................................... 410 23.3.1 Power Supply Voltage and Operating Ranges ...................................................... 410 23.3.2 DC Characteristics ................................................................................................ 413 23.3.3 AC Characteristics ................................................................................................ 420 23.3.4 A/D Converter Characteristics .............................................................................. 424 23.3.5 Watchdog Timer Characteristics........................................................................... 425 23.3.6 EEPROM Characteristics...................................................................................... 426 23.3.7 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ................... 427 23.3.8 Power-On Reset Circuit Characteristics (Optional) .............................................. 428 23.4 Operation Timing............................................................................................................... 428 23.5 Output Load Condition ...................................................................................................... 431 Appendix A Instruction Set ...............................................................................433 A.1 A.2 A.3 A.4 Instruction List................................................................................................................... 433 Operation Code Map.......................................................................................................... 448 Number of Execution States .............................................................................................. 451 Combinations of Instructions and Addressing Modes ....................................................... 462 Appendix B I/O Port Block Diagrams ...............................................................463 B.1 B.2 I/O Port Block Diagrams.................................................................................................... 463 Port States in Each Operating State ................................................................................... 485 Rev.5.00 Nov. 02, 2005 Page xix of xxxii Appendix C Product Code Lineup .................................................................... 486 Appendix D Package Dimensions ..................................................................... 488 Appendix E EEPROM Stacked-Structure Cross-Sectional View ..................... 490 Main Revisions and Additions in this Edition..................................................... 491 Index .................................................................................................................. 497 Rev.5.00 Nov. 02, 2005 Page xx of xxxii Figures Section 1 Overview Figure 1.1 Internal Block Diagram of H8/3687 Group of F-ZTAT TM and Mask-ROM Versions.............................................................................................. 3 Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Stacked Version) ............................ 4 Figure 1.3 Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions (FP-64E, FP-64A) ......................................................................................................... 5 Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Stacked Version) (FP-64E)....................... 6 Section 2 CPU Figure 2.1 Memory Map (1) ......................................................................................................... 12 Figure 2.1 Memory Map (2) ......................................................................................................... 13 Figure 2.1 Memory Map (3) ......................................................................................................... 14 Figure 2.2 CPU Registers ............................................................................................................. 15 Figure 2.3 Usage of General Registers ......................................................................................... 16 Figure 2.4 Relationship between Stack Pointer and Stack Area ................................................... 17 Figure 2.5 General Register Data Formats (1).............................................................................. 19 Figure 2.5 General Register Data Formats (2).............................................................................. 20 Figure 2.6 Memory Data Formats................................................................................................. 21 Figure 2.7 Instruction Formats...................................................................................................... 32 Figure 2.8 Branch Address Specification in Memory Indirect Mode ........................................... 36 Figure 2.9 On-Chip Memory Access Cycle.................................................................................. 38 Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)..................................... 39 Figure 2.11 CPU Operation States................................................................................................ 40 Figure 2.12 State Transitions ........................................................................................................ 41 Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same Address........................................................................................................ 42 Section 3 Figure 3.1 Figure 3.2 Figure 3.3 Figure 3.4 Exception Handling Reset Sequence............................................................................................................ 58 Stack Status after Exception Handling ........................................................................ 60 Interrupt Sequence....................................................................................................... 61 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure .............. 62 Section 4 Figure 4.1 Figure 4.2 Figure 4.2 Address Break Block Diagram of Address Break................................................................................ 63 Address Break Interrupt Operation Example (1)......................................................... 66 Address Break Interrupt Operation Example (2)......................................................... 67 Rev.5.00 Nov. 02, 2005 Page xxi of xxxii Section 5 Clock Pulse Generators Figure 5.1 Block Diagram of Clock Pulse Generators.................................................................. 69 Figure 5.2 Block Diagram of System Clock Generator ................................................................ 70 Figure 5.3 Typical Connection to Crystal Resonator.................................................................... 70 Figure 5.4 Equivalent Circuit of Crystal Resonator...................................................................... 70 Figure 5.5 Typical Connection to Ceramic Resonator.................................................................. 71 Figure 5.6 Example of External Clock Input ................................................................................ 71 Figure 5.7 Block Diagram of Subclock Generator ....................................................................... 72 Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator................................................ 72 Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator.................................................. 72 Figure 5.10 Pin Connection when not Using Subclock ................................................................ 73 Figure 5.11 Example of Incorrect Board Design .......................................................................... 74 Section 6 Power-Down Modes Figure 6.1 Mode Transition Diagram ........................................................................................... 81 Section 7 Figure 7.1 Figure 7.2 Figure 7.3 Figure 7.4 ROM Flash Memory Block Configuration............................................................................ 90 Programming/Erasing Flowchart Example in User Program Mode............................ 99 Program/Program-Verify Flowchart ......................................................................... 101 Erase/Erase-Verify Flowchart ................................................................................... 104 Section 9 Figure 9.1 Figure 9.2 Figure 9.3 Figure 9.4 Figure 9.5 Figure 9.6 Figure 9.7 Figure 9.8 I/O Ports Port 1 Pin Configuration............................................................................................ 109 Port 2 Pin Configuration............................................................................................ 115 Port 3 Pin Configuration............................................................................................ 119 Port 5 Pin Configuration............................................................................................ 122 Port 6 Pin Configuration............................................................................................ 128 Port 7 Pin Configuration............................................................................................ 134 Port 8 Pin Configuration............................................................................................ 137 Port B Pin Configuration........................................................................................... 139 Section 10 Figure 10.1 Figure 10.2 Figure 10.3 Figure 10.4 Realtime Clock (RTC) Block Diagram of RTC ........................................................................................... 142 Definition of Time Expression ................................................................................ 147 Initial Setting Procedure.......................................................................................... 150 Example: Reading of Inaccurate Time Data............................................................ 151 Section 11 Timer B1 Figure 11.1 Block Diagram of Timer B1.................................................................................... 153 Section 12 Timer V Figure 12.1 Block Diagram of Timer V ..................................................................................... 160 Rev.5.00 Nov. 02, 2005 Page xxii of xxxii Figure 12.2 Increment Timing with Internal Clock .................................................................... 167 Figure 12.3 Increment Timing with External Clock ................................................................... 167 Figure 12.4 OVF Set Timing ...................................................................................................... 167 Figure 12.5 CMFA and CMFB Set Timing ................................................................................ 168 Figure 12.6 TMOV Output Timing ............................................................................................ 168 Figure 12.7 Clear Timing by Compare Match............................................................................ 168 Figure 12.8 Clear Timing by TMRIV Input ............................................................................... 169 Figure 12.9 Pulse Output Example ............................................................................................. 170 Figure 12.10 Example of Pulse Output Synchronized to TRGV Input....................................... 171 Figure 12.11 Contention between TCNTV Write and Clear ...................................................... 172 Figure 12.12 Contention between TCORA Write and Compare Match ..................................... 173 Figure 12.13 Internal Clock Switching and TCNTV Operation ................................................. 173 Section 13 Figure 13.1 Figure 13.2 Figure 13.3 Figure 13.4 Timer Z Timer Z Block Diagram .......................................................................................... 177 Timer Z (Channel 0) Block Diagram ...................................................................... 178 Timer Z (Channel 1) Block Diagram ...................................................................... 179 Example of Outputs in Reset Synchronous PWM Mode and Complementary PWM Mode............................................................................ 186 Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits)) ........ 197 Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits))............. 198 Figure 13.7 Example of Counter Operation Setting Procedure .................................................. 199 Figure 13.8 Free-Running Counter Operation ............................................................................ 200 Figure 13.9 Periodic Counter Operation..................................................................................... 201 Figure 13.10 Count Timing at Internal Clock Operation............................................................ 201 Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected)...................... 202 Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match............ 203 Figure 13.13 Example of 0 Output/1 Output Operation ............................................................. 204 Figure 13.14 Example of Toggle Output Operation ................................................................... 205 Figure 13.15 Output Compare Timing........................................................................................ 206 Figure 13.16 Example of Input Capture Operation Setting Procedure ....................................... 207 Figure 13.17 Example of Input Capture Operation..................................................................... 208 Figure 13.18 Input Capture Signal Timing ................................................................................. 209 Figure 13.19 Example of Synchronous Operation Setting Procedure ........................................ 210 Figure 13.20 Example of Synchronous Operation...................................................................... 211 Figure 13.21 Example of PWM Mode Setting Procedure .......................................................... 212 Figure 13.22 Example of PWM Mode Operation (1) ................................................................. 213 Figure 13.23 Example of PWM Mode Operation (2) ................................................................. 214 Figure 13.24 Example of PWM Mode Operation (3) ................................................................. 215 Figure 13.25 Example of PWM Mode Operation (4) ................................................................. 216 Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure........................... 218 Rev.5.00 Nov. 02, 2005 Page xxiii of xxxii Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1) ...... 219 Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0) ...... 220 Figure 13.29 Example of Complementar y PWM Mode Setting Procedure............................... 222 Figure 13.30 Canceling Procedure of Complementary PWM Mode.......................................... 223 Figure 13.31 Example of Complementary PWM Mode Operation (1) ...................................... 224 Figure 13.32 (1) Example of Complementary PWM Mode Operation (TPSC2 = TPSC1 = TPSC0 = 0) (2) ................................................................ 225 Figure 13.32 (2) Example of Complementary PWM Mode Operation (TPSC2 = TPSC1 = TPSC0 ≠ 0) (3) ................................................................ 226 Figure 13.33 Timing of Overshooting ........................................................................................ 227 Figure 13.34 Timing of Undershooting ...................................................................................... 227 Figure 13.35 Compare Match Buffer Operation......................................................................... 230 Figure 13.36 Input Capture Buffer Operation............................................................................. 231 Figure 13.37 Example of Buffer Operation Setting Procedure................................................... 231 Figure 13.38 Example of Buffer Operation (1) (Buffer Operation for Output Compare Register) ................................................. 232 Figure 13.39 Example of Compare Match Timing for Buffer Operation ................................... 233 Figure 13.40 Example of Buffer Operation (2) (Buffer Operation for Input Capture Register) ...................................................... 234 Figure 13.41 Input Capture Timing of Buffer Operation............................................................ 235 Figure 13.42 Buffer Operation (3) (Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1) ........................................................................ 236 Figure 13.43 Buffer Operation (4) (Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1).............................................. 237 Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER .................. 238 Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger.................... 238 Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR ................... 239 Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR................... 239 Figure 13.48 IMF Flag Set Timing when Compare Match Occurs ............................................ 240 Figure 13.49 IMF Flag Set Timing at Input Capture .................................................................. 241 Figure 13.50 OVF Flag Set Timing ............................................................................................ 241 Figure 13.51 Status Flag Clearing Timing.................................................................................. 242 Figure 13.52 Contention between TCNT Write and Clear Operations....................................... 242 Figure 13.53 Contention between TCNT Write and Increment Operations ............................... 243 Figure 13.54 Contention between GR Write and Compare Match............................................. 244 Figure 13.55 Contention between TCNT Write and Overflow................................................... 245 Figure 13.56 Contention between GR Read and Input Capture.................................................. 246 Figure 13.57 Contention between Count Clearing and Increment Operations by Input Capture ................................................................................ 247 Figure 13.58 Contention between GR Write and Input Capture................................................. 248 Rev.5.00 Nov. 02, 2005 Page xxiv of xxxii Figure 13.59 When Compare Match and Bit Manipulation Instruction to TOCR Occur at the Same Timing..................................................................................... 250 Section 14 Watchdog Timer Figure 14.1 Block Diagram of Watchdog Timer ........................................................................ 251 Figure 14.2 Watchdog Timer Operation Example...................................................................... 254 Section 15 14-Bit PWM Figure 15.1 Block Diagram of 14-Bit PWM .............................................................................. 255 Figure 15.2 Waveform Output by 14-Bit PWM ......................................................................... 258 Section 16 Figure 16.1 Figure 16.2 Figure 16.3 Serial Communication Interface 3 (SCI3) Block Diagram of SCI3 ........................................................................................... 261 Data Format in Asynchronous Communication ...................................................... 276 Relationship between Output Clock and Transfer Data Phase (Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............. 276 Figure 16.4 Sample SCI3 Initialization Flowchart ..................................................................... 277 Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) ........................................................................... 278 Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode)...................... 279 Figure 16.7 Example of SCI3 Reception in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) ........................................................................... 280 Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (1)...................... 282 Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (2)...................... 283 Figure 16.9 Data Format in Clocked Synchronous Communication .......................................... 284 Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode........................... 286 Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................ 287 Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode................................ 288 Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)...................... 289 Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations (Clocked Synchronous Mode)............................................................................... 291 Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format (Transmission of Data H'AA to Receiving Station A) .......................................... 293 Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart ........................................ 294 Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1)........................................ 296 Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2)........................................ 297 Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format (Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit).............................. 298 Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode ...................................... 301 Section 17 I2C Bus Interface 2 (IIC2) Figure 17.1 Block Diagram of I2C Bus Interface 2..................................................................... 304 Rev.5.00 Nov. 02, 2005 Page xxv of xxxii Figure 17.2 External Circuit Connections of I/O Pins ................................................................ 305 Figure 17.3 I2C Bus Formats ...................................................................................................... 318 Figure 17.4 I2C Bus Timing........................................................................................................ 318 Figure 17.5 Master Transmit Mode Operation Timing (1)......................................................... 320 Figure 17.6 Master Transmit Mode Operation Timing (2)......................................................... 320 Figure 17.7 Master Receive Mode Operation Timing (1) .......................................................... 322 Figure 17.8 Master Receive Mode Operation Timing (2) .......................................................... 323 Figure 17.9 Slave Transmit Mode Operation Timing (1) ........................................................... 324 Figure 17.10 Slave Transmit Mode Operation Timing (2) ......................................................... 325 Figure 17.11 Slave Receive Mode Operation Timing (1)........................................................... 326 Figure 17.12 Slave Receive Mode Operation Timing (2)........................................................... 326 Figure 17.13 Clocked Synchronous Serial Transfer Format....................................................... 327 Figure 17.14 Transmit Mode Operation Timing......................................................................... 328 Figure 17.15 Receive Mode Operation Timing .......................................................................... 329 Figure 17.16 Block Diagram of Noise Conceler ........................................................................ 329 Figure 17.17 Sample Flowchart for Master Transmit Mode ...................................................... 330 Figure 17.18 Sample Flowchart for Master Receive Mode ........................................................ 331 Figure 17.19 Sample Flowchart for Slave Transmit Mode......................................................... 332 Figure 17.20 Sample Flowchart for Slave Receive Mode .......................................................... 333 Figure 17.21 The Timing of the Bit Synchronous Circuit .......................................................... 335 Section 18 Figure 18.1 Figure 18.2 Figure 18.3 Figure 18.4 Figure 18.5 Figure 18.6 A/D Converter Block Diagram of A/D Converter ........................................................................... 338 A/D Conversion Timing.......................................................................................... 344 External Trigger Input Timing ................................................................................ 345 A/D Conversion Accuracy Definitions (1).............................................................. 347 A/D Conversion Accuracy Definitions (2).............................................................. 347 Analog Input Circuit Example ................................................................................ 348 Section 19 Figure 19.1 Figure 19.2 Figure 19.3 Figure 19.4 Figure 19.5 Figure 19.6 Figure 19.7 EEPROM Block Diagram of EEPROM................................................................................... 350 EEPROM Bus Format and Bus Timing .................................................................. 352 Byte Write Operation .............................................................................................. 355 Page Write Operation .............................................................................................. 356 Current Address Read Operation............................................................................. 357 Random Address Read Operation ........................................................................... 358 Sequential Read Operation (when current address read is used)............................. 358 Section 20 Figure 20.1 Figure 20.2 Figure 20.3 Power-On Reset and Low-Voltage Detection Circuits (Optional) Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit.... 362 Operational Timing of Power-On Reset Circuit...................................................... 366 Operational Timing of LVDR Circuit ..................................................................... 367 Rev.5.00 Nov. 02, 2005 Page xxvi of xxxii Figure 20.4 Operational Timing of LVDI Circuit....................................................................... 368 Figure 20.5 Timing for Operation/Release of Low-Voltage Detection Circuit .......................... 369 Section 21 Power Supply Circuit Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used .................... 371 Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used ............. 372 Section 23 Figure 23.1 Figure 23.2 Figure 23.3 Figure 23.4 Figure 23.5 Figure 23.6 Figure 23.7 Figure 23.8 Electrical Characteristics System Clock Input Timing..................................................................................... 428 RES Low Width Timing.......................................................................................... 429 Input Timing............................................................................................................ 429 I2C Bus Interface Input/Output Timing ................................................................... 429 SCK3 Input Clock Timing....................................................................................... 430 SCI Input/Output Timing in Clocked Synchronous Mode ...................................... 430 EEPROM Bus Timing............................................................................................. 431 Output Load Circuit................................................................................................. 431 Appendix B I/O Port Block Diagrams Figure B.1 Port 1 Block Diagram (P17) ..................................................................................... 463 Figure B.2 Port 1 Block Diagram (P14, P16) ............................................................................. 464 Figure B.3 Port 1 Block Diagram (P15) ..................................................................................... 465 Figure B.4 Port 1 Block Diagram (P12) ..................................................................................... 466 Figure B.5 Port 2 Block Diagram (P11) ..................................................................................... 467 Figure B.6 Port 1 Block Diagram (P10) ..................................................................................... 468 Figure B.7 Port 2 Block Diagram (P24, P23) ............................................................................. 469 Figure B.8 Port 2 Block Diagram (P22) ..................................................................................... 470 Figure B.9 Port 2 Block Diagram (P21) ..................................................................................... 471 Figure B.10 Port 2 Block Diagram (P20) ................................................................................... 472 Figure B.11 Port 3 Block Diagram (P37 to P30) ........................................................................ 473 Figure B.12 Port 5 Block Diagram (P57, P56) ........................................................................... 474 Figure B.13 Port 5 Block Diagram (P55) ................................................................................... 475 Figure B.14 Port 5 Block Diagram (P54 to P50) ........................................................................ 476 Figure B.15 Port 6 Block Diagram (P67 to P60) ........................................................................ 477 Figure B.16 Port 7 Block Diagram (P76) ................................................................................... 478 Figure B.17 Port 7 Block Diagram (P75) ................................................................................... 479 Figure B.18 Port 7 Block Diagram (P74) ................................................................................... 480 Figure B.19 Port 7 Block Diagram (P72) ................................................................................... 481 Figure B.20 Port 7 Block Diagram (P71) ................................................................................... 482 Figure B.21 Port 7 Block Diagram (P70) ................................................................................... 482 Figure B.22 Port 8 Block Diagram (P87 to P85) ........................................................................ 483 Figure B.23 Port B Block Diagram (PB7 to PB0) ...................................................................... 484 Rev.5.00 Nov. 02, 2005 Page xxvii of xxxii Appendix D Package Dimensions Figure D.1 FP-64E Package Dimensions ................................................................................... 488 Figure D.2 FP-64A Package Dimensions ................................................................................... 489 Appendix E EEPROM Stacked-Structure Cross-Sectional View Figure E.1 EEPROM Stacked-Structure Cross-Sectional View ................................................. 490 Rev.5.00 Nov. 02, 2005 Page xxviii of xxxii Tables Section 1 Overview Table 1.1 Pin Functions ............................................................................................................ 7 Section 2 CPU Table 2.1 Operation Notation ................................................................................................. 22 Table 2.2 Data Transfer Instructions....................................................................................... 23 Table 2.3 Arithmetic Operations Instructions (1) ................................................................... 24 Table 2.3 Arithmetic Operations Instructions (2) ................................................................... 25 Table 2.4 Logic Operations Instructions................................................................................. 26 Table 2.5 Shift Instructions..................................................................................................... 26 Table 2.6 Bit Manipulation Instructions (1)............................................................................ 27 Table 2.6 Bit Manipulation Instructions (2)............................................................................ 28 Table 2.7 Branch Instructions ................................................................................................. 29 Table 2.8 System Control Instructions.................................................................................... 30 Table 2.9 Block Data Transfer Instructions ............................................................................ 31 Table 2.10 Addressing Modes .................................................................................................. 33 Table 2.11 Absolute Address Access Ranges ........................................................................... 35 Table 2.12 Effective Address Calculation (1)........................................................................... 36 Table 2.12 Effective Address Calculation (2)........................................................................... 37 Section 3 Exception Handling Table 3.1 Exception Sources and Vector Address .................................................................. 48 Table 3.2 Interrupt Wait States ............................................................................................... 60 Section 4 Address Break Table 4.1 Access and Data Bus Used ..................................................................................... 65 Section 5 Clock Pulse Generators Table 5.1 Crystal Resonator Parameters ................................................................................. 71 Section 6 Power-Down Modes Table 6.1 Operating Frequency and Waiting Time................................................................. 77 Table 6.2 Transition Mode after SLEEP Instruction Execution and Transition Mode due to Interrupt ..................................................................... 82 Table 6.3 Internal State in Each Operating Mode................................................................... 83 Section 7 ROM Table 7.1 Setting Programming Modes .................................................................................. 95 Table 7.2 Boot Mode Operation ............................................................................................. 97 Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is Possible ...................................................................................... 98 Rev.5.00 Nov. 02, 2005 Page xxix of xxxii Table 7.4 Table 7.5 Table 7.6 Table 7.7 Reprogram Data Computation Table .................................................................... 102 Additional-Program Data Computation Table ...................................................... 102 Programming Time ............................................................................................... 102 Flash Memory Operating States............................................................................ 106 Section 10 Realtime Clock (RTC) Table 10.1 Pin Configuration.................................................................................................. 142 Table 10.2 Interrupt Source .................................................................................................... 152 Section 11 Timer B1 Table 11.1 Pin Configuration.................................................................................................. 154 Table 11.2 Timer B1 Operating Modes .................................................................................. 157 Section 12 Timer V Table 12.1 Pin Configuration.................................................................................................. 161 Table 12.2 Clock Signals to Input to TCNTV and Counting Conditions ............................... 163 Section 13 Timer Z Table 13.1 Timer Z Functions ................................................................................................ 176 Table 13.2 Pin Configuration.................................................................................................. 180 Table 13.3 Initial Output Level of FTIOB0 Pin...................................................................... 212 Table 13.4 Output Pins in Reset Synchronous PWM Mode................................................... 217 Table 13.5 Register Settings in Reset Synchronous PWM Mode........................................... 217 Table 13.6 Output Pins in Complementary PWM Mode........................................................ 221 Table 13.7 Register Settings in Complementary PWM Mode................................................ 221 Table 13.8 Register Combinations in Buffer Operation ......................................................... 230 Section 15 14-Bit PWM Table 15.1 Pin Configuration.................................................................................................. 256 Section 16 Serial Communication Interface 3 (SCI3) Table 16.1 Channel Configuration.......................................................................................... 260 Table 16.2 Pin Configuration.................................................................................................. 262 Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) ...... 270 Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) ...... 271 Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) ...... 272 Table 16.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode) .......................... 273 Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1)......................................................................... 274 Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2)......................................................................... 275 Table 16.6 SSR Status Flags and Receive Data Handling ...................................................... 281 Table 16.7 SCI3 Interrupt Requests........................................................................................ 299 Rev.5.00 Nov. 02, 2005 Page xxx of xxxii Section 17 I2C Bus Interface 2 (IIC2) Table 17.1 I2C Bus Interface Pins........................................................................................... 305 Table 17.2 Transfer Rate ........................................................................................................ 307 Table 17.3 Interrupt Requests ................................................................................................. 334 Table 17.4 Time for Monitoring SCL..................................................................................... 335 Section 18 A/D Converter Table 18.1 Pin Configuration.................................................................................................. 339 Table 18.2 Analog Input Channels and Corresponding ADDR Registers .............................. 340 Table 18.3 A/D Conversion Time (Single Mode)................................................................... 345 Section 19 EEPROM Table 19.1 Pin Configuration.................................................................................................. 351 Table 19.2 Slave Addresses .................................................................................................... 354 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Table 20.1 LVDCR Settings and Select Functions................................................................. 364 Section 23 Electrical Characteristics Table 23.1 Absolute Maximum Ratings ................................................................................. 391 Table 23.2 DC Characteristics (1)........................................................................................... 394 Table 23.2 DC Characteristics (2)........................................................................................... 398 Table 23.2 DC Characteristics (3)........................................................................................... 399 Table 23.3 AC Characteristics ................................................................................................ 400 Table 23.4 I2C Bus Interface Timing ...................................................................................... 402 Table 23.5 Serial Communication Interface (SCI) Timing..................................................... 403 Table 23.6 A/D Converter Characteristics .............................................................................. 404 Table 23.7 Watchdog Timer Characteristics........................................................................... 405 Table 23.8 Flash Memory Characteristics .............................................................................. 406 Table 23.9 EEPROM Characteristics...................................................................................... 408 Table 23.10 Power-Supply-Voltage Detection Circuit Characteristics................................. 409 Table 23.11 Power-On Reset Circuit Characteristics............................................................ 409 Table 23.12 DC Characteristics (1)....................................................................................... 413 Table 23.12 DC Characteristics (2)....................................................................................... 418 Table 23.12 DC Characteristics (3)....................................................................................... 419 Table 23.13 AC Characteristics ............................................................................................ 420 Table 23.14 I2C Bus Interface Timing .................................................................................. 422 Table 23.15 Serial Communication Interface (SCI) Timing................................................. 423 Table 23.16 A/D Converter Characteristics .......................................................................... 424 Table 23.17 Watchdog Timer Characteristics....................................................................... 425 Table 23.18 EEPROM Characteristics.................................................................................. 426 Table 23.19 Power-Supply-Voltage Detection Circuit Characteristics................................. 427 Rev.5.00 Nov. 02, 2005 Page xxxi of xxxii Table 23.20 Appendix A Table A.1 Table A.2 Table A.2 Table A.2 Table A.3 Table A.4 Table A.5 Power-On Reset Circuit Characteristics ........................................................... 428 Instruction Set Instruction Set....................................................................................................... 435 Operation Code Map (1) ....................................................................................... 448 Operation Code Map (2) ....................................................................................... 449 Operation Code Map (3) ....................................................................................... 450 Number of Cycles in Each Instruction.................................................................. 452 Number of Cycles in Each Instruction.................................................................. 453 Combinations of Instructions and Addressing Modes .......................................... 462 Rev.5.00 Nov. 02, 2005 Page xxxii of xxxii Section 1 Overview Section 1 Overview 1.1 Features • High-speed H8/300H central processing unit with an internal 16-bit architecture Upward-compatible with H8/300 CPU on an object level Sixteen 16-bit general registers 62 basic instructions • Various peripheral functions RTC (can be used as a free running counter) Timer B1 (8-bit timer) Timer V (8-bit timer) Timer Z (16-bit timer) 14-bit PWM Watchdog timer SCI (Asynchronous or clocked synchronous serial communication interface) × 2 channels I2C Bus Interface (conforms to the I2C bus interface format that is advocated by Philips Electronics) 10-bit A/D converter Rev.5.00 Nov. 02, 2005 Page 1 of 500 REJ09B0027-0500 Section 1 Overview • On-chip memory Model Standard Version Product Classification On-Chip PowerOn Reset and Low-Voltage Detecting Circuit Version ROM RAM HD64F3687G 4 kbytes Flash memory version TM (F-ZTAT version) H8/3687F HD64F3687 H8/3684F HD64F3684 HD64F3684G 32 kbytes 4 kbytes Mask-ROM version H8/3687 HD6433687 HD6433687G 56 kbytes 3 kbytes H8/3686 HD6433686 HD6433686G 48 kbytes 3 kbytes H8/3685 HD6433685 HD6433685G 40 kbytes 3 kbytes H8/3684 HD6433684 HD6433684G 32 kbytes 3 kbytes H8/3683 HD6433683 HD6433683G 24 kbytes 3 kbytes H8/3682 HD6433682 HD6433682G 16 kbytes 3 kbytes H8/3687N HD64N3687G 56 kbytes 4 kbytes HD6483687G 56 kbytes 3 kbytes EEPROM stacked version (512 bytes) Flash memory version Mask-ROM version 56 kbytes Remarks • General I/O ports I/O pins: 45 I/O pins (43 I/O pins for H8/3687N), including 8 large current ports (IOL = 20 mA, @VOL = 1.5 V) Input-only pins: 8 input pins (also used for analog input) • EEPROM interface (only for H8/3687N) I2C bus interface (conforms to the I2C bus interface format that is advocated by Philips Electronics) • Supports various power-down states Note: F-ZTATTM is a trademark of Renesas Technology Corp. • Compact package Package Code LQFP-64 FP-64E QFP-64 FP-64A Only LQFP-64 (FP-64E) for H8/3687N package Rev.5.00 Nov. 02, 2005 Page 2 of 500 REJ09B0027-0500 Body Size Pin Pitch 10.0 × 10.0 mm 0.5 mm 14.0 × 14.0 mm 0.8 mm Section 1 Overview P57/SCL P56/SDA P55/WKP5/ADTRG P54/WKP4 P53/WKP3 P52/WKP2 P51/WKP1 P50/WKP0 NMI TEST RES VSS VCL VCC OSC1 OSC2 CPU H8/300H Port 6 P76/TMOV P75/TMCIV P74/TMRIV P72/TXD_2 P71/RXD_2 P70/SCK3_2 Port 1 P67/FTIOD1 P66/FTIOC1 P65/FTIOB1 P64/FTIOA1 P63/FTIOD0 P62/FTIOC0 P61/FTIOB0 P60/FTIOA0 Port 7 Data bus (lower) RAM ROM IIC2 RTC SCI3 14-bit PWM SCI3_2 Timer Z Watchdog timer Timer V Port 8 P30 P31 P32 P33 P34 P35 P36 P37 System clock generator Port 2 P20/SCK3 P21/RXD P22/TXD P23 P24 Subclock generator Port 3 P10/TMOW P11/PWM P12 P14/IRQ0 P15/IRQ1/TMIB1 P16/IRQ2 P17/IRQ3/TRGV X1 X2 Internal Block Diagram Port 5 1.2 Timer B1 P87 P86 P85 A/D converter Data bus (upper) Address bus AVCC PB0/AN0 PB1/AN1 PB2/AN2 PB3/AN3 PB4/AN4 PB5/AN5 PB6/AN6 PB7/AN7 Port B Figure 1.1 Internal Block Diagram of H8/3687 Group of F-ZTAT TM and Mask-ROM Versions Rev.5.00 Nov. 02, 2005 Page 3 of 500 REJ09B0027-0500 NMI TEST RES VSS VCC VCL OSC1 OSC2 Port 6 P76/TMOV P75/TMCIV P74/TMRIV P72/TXD_2 P71/RXD_2 P70/SCK3_2 Port 1 P67/FTIOD1 P66/FTIOC1 P65/FTIOB1 P64/FTIOA1 P63/FTIOD0 P62/FTIOC0 P61/FTIOB0 P60/FTIOA0 Port 7 Data bus (lower) RAM ROM Port 2 IIC2 RTC SCI3 14-bit PWM SCI3_2 Timer Z Watchdog timer Timer V Timer B1 A/D converter POR/LVD (optional) Port 8 P57/SCL P56/SDA P55/WKP5/ADTRG P54/WKP4 P53/WKP3 P52/WKP2 P51/WKP1 P50/WKP0 CPU H8/300H P87 P86 P85 I2C bus P30 P31 P32 P33 P34 P35 P36 P37 System clock generator Port 3 P20/SCK3 P21/RXD P22/TXD P23 P24 Subclock generator Port 5 P10/TMOW P11/PWM P12 P14/IRQ0 P15/IRQ1/TMIB1 P16/IRQ2 P17/IRQ3/TRGV X1 X2 Section 1 Overview SDA SCL Data bus (upper) Address bus EEPROM AVCC PB0/AN0 PB1/AN1 PB2/AN2 PB3/AN3 PB4/AN4 PB5/AN5 PB6/AN6 PB7/AN7 Port B Note: The HD64N3687G is a stacked-structure product in which an EEPROM chip is mounted on the HD64F3687G (F-ZTATTM version). The HD6483687G is a stacked-structure product in which an EEPROM chip is mounted on the HD6433687G (mask-ROM version). Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Stacked Version) Rev.5.00 Nov. 02, 2005 Page 4 of 500 REJ09B0027-0500 Section 1 Overview P62/FTIOC0 P61/FTIOB0 NMI P60/FTIOA0 P64/FTIOA1 P65/FTIOB1 P66/FTIOC1 P67/FTIOD1 P85 P86 P87 P20/SCK3 P21/RXD P22/TXD P23 Pin Arrangement P70/SCK3_2 1.3 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P71/RXD_2 49 32 P63/FTIOD0 P72/TXD_2 50 31 P24 P14/IRQ0 51 30 P76/TMOV P15/IRQ1/TMIB1 52 29 P75/TMCIV P16/IRQ2 53 28 P74/TMRIV P17/IRQ3/TRGV 54 27 P57/SCL P33 55 26 P56/SDA P32 56 25 P12 P31 57 24 P11/PWM P30 58 23 P10/TMOW PB3/AN3 59 22 P55/WKP5/ADTRG PB2/AN2 60 21 P54/WKP4 PB1/AN1 61 20 P53/WKP3 PB0/AN0 62 19 P52/WKP2 PB4/AN4 63 18 P37 PB5/AN5 64 17 P36 H8/3687 Group 8 9 10 11 12 13 14 15 16 PB7/AN7 AVcc X2 X1 VCL RES TEST Vss P35 7 P34 6 P51/WKP1 5 P50/WKP0 4 Vcc 3 OSC1 2 OSC2 1 PB6/AN6 Top View Figure 1.3 Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions (FP-64E, FP-64A) Rev.5.00 Nov. 02, 2005 Page 5 of 500 REJ09B0027-0500 P62/FTIOC0 P61/FTIOB0 NMI P60/FTIOA0 P64/FTIOA1 P65/FTIOB1 P66/FTIOC1 P67/FTIOD1 P85 P86 P87 P20/SCK3 P21/RXD P22/TXD P23 P70/SCK3_2 Section 1 Overview 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P71/RXD_2 49 32 P63/FTIOD0 P72/TXD_2 50 31 P24 P14/IRQ0 51 30 P76/TMOV P15/IRQ1/TMIB1 52 29 P75/TMCIV P16/IRQ2 53 28 P74/TMRIV P17/IRQ3/TRGV 54 27 SCL P33 55 26 SDA P32 56 25 P12 P31 57 24 P11/PWM P30 58 23 P10/TMOW PB3/AN3 59 22 P55/WKP5/ADTRG PB2/AN2 60 21 P54/WKP4 PB1/AN1 61 20 P53/WKP3 PB0/AN0 62 19 P52/WKP2 PB4/AN4 63 18 P37 PB5/AN5 64 17 P36 H8/3687N 8 9 10 11 12 13 14 15 16 PB7/AN7 AVcc X2 X1 VCL RES TEST Vss P35 7 P34 6 P51/WKP1 5 P50/WKP0 4 Vcc 3 OSC1 2 OSC2 1 PB6/AN6 Top View Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Stacked Version) (FP-64E) Rev.5.00 Nov. 02, 2005 Page 6 of 500 REJ09B0027-0500 Section 1 Overview 1.4 Pin Functions Table 1.1 Pin Functions Pin No. Type FP-64E FP-64A I/O Functions 12 Input Power supply pin. Connect this pin to the system power supply. VSS 9 Input Ground pin. Connect this pin to the system power supply (0V). AVCC 3 Input Analog power supply pin for the A/D converter. When the A/D converter is not used, connect this pin to the system power supply. VCL 6 Input Internal step-down power supply pin. Connect a capacitor of around 0.1 µF between this pin and the Vss pin for stabilization. OSC1 11 Input OSC2 10 Output These pins connect with crystal or ceramic resonator for the system clock, or can be used to input an external clock. Symbol Power VCC source pins Clock pins See section 5, Clock Pulse Generators, for a typical connection. X1 5 Input X2 4 Output RES 7 Input Reset pin. The pull-up resistor (typ. 150 kΩ) is incorporated. When driven low, the chip is reset. TEST 8 Input Test pin. Connect this pin to Vss. NMI 35 Input Non-maskable interrupt request input pin. Be sure to pull-up by a pull-up resistor. IRQ0 to IRQ3 51 to 54 Input External interrupt request input pins. Can select the rising or falling edge. WKP0 to WKP5 13, 14, 19 to 22 Input External interrupt request input pins. Can select the rising or falling edge. RTC TMOW 23 Output This is an output pin for divided clocks. Timer B1 TMIB1 52 Input External event input pin. System control Interrupt pins These pins connect with a 32.768 kHz crystal resonator for the subclock. See section 5, Clock Pulse Generators, for a typical connection. Rev.5.00 Nov. 02, 2005 Page 7 of 500 REJ09B0027-0500 Section 1 Overview Pin No. Type Symbol FP-64E FP-64A I/O Functions Timer V TMOV 30 Output This is an output pin for waveforms generated by the output compare function. TMCIV 29 Input External event input pin. TMRIV 28 Input Counter reset input pin. TRGV 54 Input Counter start trigger input pin. FTIOA0 36 I/O Output compare output/input capture input/external clock input pin FTIOB0 34 I/O Output compare output/input capture input/PWM output pin FTIOC0 33 I/O Output compare output/input capture input/PWM sync output pin (at a reset, complementary PWM mode) FTIOD0 32 I/O Output compare output/input capture input/PWM output pin FTIOA1 37 I/O Output compare output/input capture input/PWM output pin (at a reset, complementary PWM mode) FTIOB1 to FTIOD1 38 to 40 I/O Output compare output/input capture input/PWM output pin 14-bit PWM PWM 24 Output 14-bit PWM square wave output pin I2C bus interface (IIC) SDA*1 26 I/O IIC data I/O pin. Can directly drive a bus by NMOS open-drain output. When using this pin, external pull-up resistance is required. SCL*1 27 I/O IIC clock I/O pin. Can directly drive a bus by (EEPROM: NMOS open-drain output. When using this pin, Input) external pull-up resistance is required. TXD, TXD_2 46, 50 Output Transmit data output pin RXD, RXD_2 45, 49 Input Receive data input pin SCK3, SCK3_2 44, 48 I/O Clock I/O pin AN7 to AN0 1, 2, 59 to 64 Input Analog input pin ADTRG Input A/D converter trigger input pin. Timer Z Serial communication interface (SCI) A/D converter 22 Rev.5.00 Nov. 02, 2005 Page 8 of 500 REJ09B0027-0500 Section 1 Overview Pin No. Type Symbol I/O ports FP-64E FP-64A I/O Functions PB7 to PB0 1, 2, 59 to 64 Input 8-bit input port. P17 to P14, 51 to 54, P12 to P10 23 to 25 I/O 7-bit I/O port. P24 to P20 31, 44 to 47 I/O 5-bit I/O port. P37 to P30 15 to 18, 55 to 58 I/O 8-bit I/O port P57 to P50 13, 14, 19 to 22, 2 2 26* , 27* I/O 8-bit I/O port P67 to P60 32 to 34, I/O 36, 37 to 40 8-bit I/O port P76 to P74, 28 to 30, P72 to P70 48 to 50 I/O P87 to P85 I/O 41 to 43 6-bit I/O port 3-bit I/O port. 2 Notes: 1. These pins are only available for the I C bus interface in the H8/3687N. Since the I2C bus is disabled after canceling a reset, the ICE bit in ICCR1 must be set to 1 by using the program. 2. The P57 and P56 pins are not available in the H8/3687N. Rev.5.00 Nov. 02, 2005 Page 9 of 500 REJ09B0027-0500 Section 1 Overview Rev.5.00 Nov. 02, 2005 Page 10 of 500 REJ09B0027-0500 Section 2 CPU Section 2 CPU This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with the H8/300CPU, and supports only normal mode, which has a 64-kbyte address space. • Upward-compatible with H8/300 CPUs Can execute H8/300 CPUs object programs Additional eight 16-bit extended registers 32-bit transfer and arithmetic and logic instructions are added Signed multiply and divide instructions are added. • General-register architecture Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit registers, or eight 32-bit registers • Sixty-two basic instructions 8/16/32-bit data transfer and arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions • Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn] Absolute address [@aa:8, @aa:16, @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8,PC) or @(d:16,PC)] Memory indirect [@@aa:8] • 64-kbyte address space • High-speed operation All frequently-used instructions execute in one or two states 8/16/32-bit register-register add/subtract : 2 state 8 × 8-bit register-register multiply : 14 states 16 ÷ 8-bit register-register divide : 14 states 16 × 16-bit register-register multiply : 22 states 32 ÷ 16-bit register-register divide : 22 states • Power-down state Transition to power-down state by SLEEP instruction CPU30H2C_000120030300 Rev.5.00 Nov. 02, 2005 Page 11 of 500 REJ09B0027-0500 Section 2 CPU 2.1 Address Space and Memory Map The address space of this LSI is 64 kbytes, which includes the program area and the data area. Figures 2.1 show the memory map. HD64N3687G HD64F3687 HD64F3687G (Flash memory version) H'0000 H'0041 H'0042 Interrupt vector HD64F3684 HD64F3684G (Flash memory version) H'0000 H'0041 H'0042 Interrupt vector On-chip ROM (32 kbytes) HD6433682 HD6433682G (Mask-ROM version) H'0000 H'0041 H'0042 Interrupt vector HD6433683 HD6433683G (Mask-ROM version) H'0000 H'0041 H'0042 On-chip ROM (16 kbytes) Interrupt vector On-chip ROM (24 kbytes) H'3FFF H'5FFF H'7FFF On-chip ROM (56 kbytes) Not used Not used Not used H'DFFF Not used H'E800 H'E800 H'E800 On-chip RAM (2 kbytes) On-chip RAM (2 kbytes) Not used Not used H'F700 H'F77F H'F780 H'FB7F H'FB80 H'FF7F H'FF80 Internal I/O register (1 kbyte work area for flash memory programming) On-chip RAM (2 kbytes) (1 kbyte user area) H'F700 H'F77F H'F780 H'FB7F H'FB80 H'FF7F H'FF80 H'F700 H'F77F (1 kbyte work area for flash memory programming) On-chip RAM (2 kbytes) (1 kbyte user area) H'EFFF Internal I/O register H'FB80 On-chip RAM (1 kbytes) H'FF7F H'FF80 REJ09B0027-0500 Internal I/O register Not used H'FB80 On-chip RAM (1 kbytes) H'FF7F H'FF80 Internal I/O register Internal I/O register Figure 2.1 Memory Map (1) Rev.5.00 Nov. 02, 2005 Page 12 of 500 H'F700 H'F77F Not used H'FFFF H'FFFF Not used Not used Internal I/O register Internal I/O register H'FFFF Internal I/O register On-chip RAM (2 kbytes) On-chip RAM (2 kbytes) H'EFFF H'EFFF H'EFFF H'E800 H'FFFF Section 2 CPU HD6433684 HD6433684G (Mask-ROM version) H'0000 H'0041 H'0042 Interrupt vector H'0000 H'0041 H'0042 On-chip ROM (32 kbytes) H'7FFF Interrupt vector HD6483687G HD6433687 HD6433687G (Mask-ROM version) HD6433686 HD6433686G (Mask-ROM version) HD6433685 HD6433685G (Mask-ROM version) H'0000 H'0041 H'0042 On-chip ROM (40 kbytes) Interrupt vector H'0000 H'0041 H'0042 Interrupt vector On-chip ROM (48 kbytes) H'9FFF On-chip ROM (56 kbytes) H'BFFF Not used Not used Not used H'DFFF Not used H'E800 H'E800 On-chip RAM (2 kbytes) H'EFFF H'EFFF Internal I/O register Not used H'FB80 On-chip RAM (1 kbytes) H'FF7F H'FF80 Interrupt vector H'FB80 H'FF7F H'FF80 H'F700 H'F77F Not used Interrupt vector H'F700 H'F77F H'FF7F H'FF80 Interrupt vector Not used Not used H'FB80 On-chip RAM (1 kbytes) H'FF7F H'FF80 H'FFFF On-chip RAM (1 kbytes) Interrupt vector Interrupt vector Interrupt vector H'FFFF H'EFFF H'FB80 On-chip RAM (1 kbytes) On-chip RAM (2 kbytes) Not used Not used Internal I/O register H'FFFF H'EFFF Not used H'F700 H'F77F H'E800 On-chip RAM (2 kbytes) On-chip RAM (2 kbytes) Not used H'F700 H'F77F H'E800 H'FFFF Figure 2.1 Memory Map (2) Rev.5.00 Nov. 02, 2005 Page 13 of 500 REJ09B0027-0500 Section 2 CPU HD64N3687G HD6483687G (On-chip EEPROM module) H'0000 H'01FF User area (512 bytes) Not used H'FF09 Slave address register Not used Figure 2.1 Memory Map (3) Rev.5.00 Nov. 02, 2005 Page 14 of 500 REJ09B0027-0500 Section 2 CPU 2.2 Register Configuration The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers; general registers and control registers. The control registers are a 24-bit program counter (PC), and an 8-bit condition-code register (CCR). General Registers (ERn) 15 0 7 0 7 0 ER0 E0 R0H R0L ER1 E1 R1H R1L ER2 E2 R2H R2L ER3 E3 R3H R3L ER4 E4 R4H R4L ER5 E5 R5H R5L ER6 E6 R6H R6L ER7 E7 R7H R7L (SP) Control Registers (CR) 23 0 PC 7 6 5 4 3 2 1 0 CCR I UI H U N Z V C [Legend] SP: PC: CCR: I: UI: Stack pointer Program counter Condition-code register Interrupt mask bit User bit H: U: N: Z: V: C: Half-carry flag User bit Negative flag Zero flag Overflow flag Carry flag Figure 2.2 CPU Registers Rev.5.00 Nov. 02, 2005 Page 15 of 500 REJ09B0027-0500 Section 2 CPU 2.2.1 General Registers The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally identical and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates the usage of the general registers. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit registers. The usage of each register can be selected independently. • Address registers • 32-bit registers • 16-bit registers • 8-bit registers E registers (extended registers) (E0 to E7) ER registers (ER0 to ER7) RH registers (R0H to R7H) R registers (R0 to R7) RL registers (R0L to R7L) Figure 2.3 Usage of General Registers General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the relationship between the stack pointer and the stack area. Rev.5.00 Nov. 02, 2005 Page 16 of 500 REJ09B0027-0500 Section 2 CPU Empty area SP (ER7) Stack area Figure 2.4 Relationship between Stack Pointer and Stack Area 2.2.2 Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the start address is loaded by the vector address generated during reset exception-handling sequence. 2.2.3 Condition-Code Register (CCR) This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1 by reset exception-handling sequence, but other bits are not initialized. Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions. For the action of each instruction on the flag bits, see appendix A.1, Instruction List. Rev.5.00 Nov. 02, 2005 Page 17 of 500 REJ09B0027-0500 Section 2 CPU Bit Bit Name Initial Value R/W Description 7 I 1 R/W Interrupt Mask Bit Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence. 6 UI Undefined R/W User Bit Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. 5 H Undefined R/W Half-Carry Flag When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. 4 U Undefined R/W User Bit Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. 3 N Undefined R/W Negative Flag Stores the value of the most significant bit of data as a sign bit. 2 Z Undefined R/W Zero Flag Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. 1 V Undefined R/W Overflow Flag Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. 0 C Undefined R/W Carry Flag Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: • Add instructions, to indicate a carry • Subtract instructions, to indicate a borrow • Shift and rotate instructions, to indicate a carry The carry flag is also used as a bit accumulator by bit manipulation instructions. Rev.5.00 Nov. 02, 2005 Page 18 of 500 REJ09B0027-0500 Section 2 CPU 2.3 Data Formats The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.3.1 General Register Data Formats Figure 2.5 shows the data formats in general registers. Data Type General Register Data Format 7 RnH 1-bit data 0 Don't care 7 6 5 4 3 2 1 0 7 1-bit data RnL 4-bit BCD data RnH 4-bit BCD data RnL Byte data RnH Don't care 7 4 3 Upper 0 7 6 5 4 3 2 1 0 0 Lower Don't care 7 Don't care 7 4 3 Upper 0 Don't care MSB LSB 7 Byte data RnL 0 Lower 0 Don't care MSB LSB Figure 2.5 General Register Data Formats (1) Rev.5.00 Nov. 02, 2005 Page 19 of 500 REJ09B0027-0500 Section 2 CPU Data Type General Register Word data Rn Data Format 15 Word data MSB En 15 MSB Longword data 0 LSB 0 LSB ERn 31 16 15 MSB [Legend] ERn: General register ER En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit Figure 2.5 General Register Data Formats (2) Rev.5.00 Nov. 02, 2005 Page 20 of 500 REJ09B0027-0500 0 LSB Section 2 CPU 2.3.2 Memory Data Formats Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and longword data in memory, however word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, an address error does not occur, however the least significant bit of the address is regarded as 0, so access begins the preceding address. This also applies to instruction fetches. When ER7 (SP) is used as an address register to access the stack area, the operand size should be word or longword. Data Type Address Data Format 7 1-bit data Address L 7 Byte data Address L MSB Word data Address 2M MSB 0 6 5 4 3 2 Address 2N 0 LSB LSB Address 2M+1 Longword data 1 MSB Address 2N+1 Address 2N+2 LSB Address 2N+3 Figure 2.6 Memory Data Formats Rev.5.00 Nov. 02, 2005 Page 21 of 500 REJ09B0027-0500 Section 2 CPU 2.4 Instruction Set 2.4.1 Table of Instructions Classified by Function The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each functional category. The notation used in tables 2.2 to 2.9 is defined below. Table 2.1 Operation Notation Symbol Description Rd General register (destination)* Rs General register (source)* Rn General register* ERn General register (32-bit register or address register) (EAd) Destination operand (EAs) Source operand CCR Condition-code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR PC Program counter SP Stack pointer #IMM Immediate data disp Displacement + Addition – Subtraction × Multiplication ÷ Division ∧ Logical AND ∨ Logical OR ⊕ Logical XOR → Move ¬ NOT (logical complement) :3/:8/:16/:24 Note: * 3-, 8-, 16-, or 24-bit length General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7). Rev.5.00 Nov. 02, 2005 Page 22 of 500 REJ09B0027-0500 Section 2 CPU Table 2.2 Data Transfer Instructions Instruction Size* Function MOV B/W/L (EAs) → Rd, Rs → (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. MOVFPE B (EAs) → Rd Cannot be used in this LSI. MOVTPE B Rs → (EAs) Cannot be used in this LSI. POP W/L @SP+ → Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn. PUSH W/L Rn → @–SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev.5.00 Nov. 02, 2005 Page 23 of 500 REJ09B0027-0500 Section 2 CPU Table 2.3 Arithmetic Operations Instructions (1) Instruction Size* Function ADD SUB B/W/L Rd ± Rs → Rd, Rd ± #IMM → Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register (immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction.) ADDX SUBX B Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd Performs addition or subtraction with carry on byte data in two general registers, or on immediate data and data in a general register. INC DEC B/W/L Rd ± 1 → Rd, Rd ± 2 → Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) ADDS SUBS L Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. DAA DAS B Rd (decimal adjust) → Rd Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data. MULXU B/W Rd × Rs → Rd Performs unsigned multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. MULXS B/W Rd × Rs → Rd Performs signed multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. DIVXU B/W Rd ÷ Rs → Rd Performs unsigned division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16-bit remainder. Note: * efers to the operand size. B: Byte W: Word L: Longword Rev.5.00 Nov. 02, 2005 Page 24 of 500 REJ09B0027-0500 Section 2 CPU Table 2.3 Arithmetic Operations Instructions (2) Instruction Size* Function DIVXS B/W Rd ÷ Rs → Rd Performs signed division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16-bit remainder. CMP B/W/L Rd – Rs, Rd – #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result. NEG B/W/L 0 – Rd → Rd Takes the two's complement (arithmetic complement) of data in a general register. EXTU W/L Rd (zero extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left. EXTS W/L Rd (sign extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev.5.00 Nov. 02, 2005 Page 25 of 500 REJ09B0027-0500 Section 2 CPU Table 2.4 Logic Operations Instructions Instruction Size* Function AND B/W/L Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd Performs a logical AND operation on a general register and another general register or immediate data. OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd Performs a logical OR operation on a general register and another general register or immediate data. XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. NOT B/W/L ¬ (Rd) → (Rd) Takes the one's complement (logical complement) of general register contents. Note: * Refers to the operand size. B: Byte W: Word L: Longword Table 2.5 Shift Instructions Instruction Size* Function SHAL SHAR B/W/L Rd (shift) → Rd Performs an arithmetic shift on general register contents. SHLL SHLR B/W/L Rd (shift) → Rd Performs a logical shift on general register contents. ROTL ROTR B/W/L Rd (rotate) → Rd Rotates general register contents. ROTXL ROTXR B/W/L Rd (rotate) → Rd Rotates general register contents through the carry flag. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev.5.00 Nov. 02, 2005 Page 26 of 500 REJ09B0027-0500 Section 2 CPU Table 2.6 Bit Manipulation Instructions (1) Instruction Size* Function BSET B 1 → (<bit-No.> of <EAd>) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BCLR B 0 → (<bit-No.> of <EAd>) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BNOT B ¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BTST B ¬ (<bit-No.> of <EAd>) → Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BAND B C ∧ (<bit-No.> of <EAd>) → C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIAND B C ∧ ¬ (<bit-No.> of <EAd>) → C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BOR B C ∨ (<bit-No.> of <EAd>) → C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIOR B C ∨ ¬ (<bit-No.> of <EAd>) → C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. Note: * Refers to the operand size. B: Byte Rev.5.00 Nov. 02, 2005 Page 27 of 500 REJ09B0027-0500 Section 2 CPU Table 2.6 Bit Manipulation Instructions (2) Instruction Size* Function BXOR B C ⊕ (<bit-No.> of <EAd>) → C XORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIXOR B C ⊕ ¬ (<bit-No.> of <EAd>) → C XORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BLD B (<bit-No.> of <EAd>) → C Transfers a specified bit in a general register or memory operand to the carry flag. BILD B ¬ (<bit-No.> of <EAd>) → C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BST B C → (<bit-No.> of <EAd>) Transfers the carry flag value to a specified bit in a general register or memory operand. BIST B ¬ C → (<bit-No.> of <EAd>) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. Note: * Refers to the operand size. B: Byte Rev.5.00 Nov. 02, 2005 Page 28 of 500 REJ09B0027-0500 Section 2 CPU Table 2.7 Branch Instructions Instruction Size Function Bcc* Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic Description Condition BRA(BT) Always (true) Always BRN(BF) Never (false) Never BHI High C∨Z=0 BLS Low or same C∨Z=1 BCC(BHS) Carry clear (high or same) C=0 BCS(BLO) Carry set (low) C=1 BNE Not equal Z=0 BEQ Equal Z=1 BVC Overflow clear V=0 BVS Overflow set V=1 BPL Plus N=0 BMI Minus N=1 BGE Greater or equal N⊕V=0 BLT Less than N⊕V=1 BGT Greater than Z∨(N ⊕ V) = 0 BLE Less or equal Z∨(N ⊕ V) = 1 JMP Branches unconditionally to a specified address. BSR Branches to a subroutine at a specified address. JSR Branches to a subroutine at a specified address. RTS Returns from a subroutine Note: * Bcc is the general name for conditional branch instructions. Rev.5.00 Nov. 02, 2005 Page 29 of 500 REJ09B0027-0500 Section 2 CPU Table 2.8 System Control Instructions Instruction Size* Function TRAPA Starts trap-instruction exception handling. RTE Returns from an exception-handling routine. SLEEP Causes a transition to a power-down state. LDC B/W (EAs) → CCR Moves the source operand contents to the CCR. The CCR size is one byte, but in transfer from memory, data is read by word access. STC B/W CCR → (EAd) Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access. ANDC B CCR ∧ #IMM → CCR Logically ANDs the CCR with immediate data. ORC B CCR ∨ #IMM → CCR Logically ORs the CCR with immediate data. XORC B CCR ⊕ #IMM → CCR Logically XORs the CCR with immediate data. NOP PC + 2 → PC Only increments the program counter. Note: * Refers to the operand size. B: Byte W: Word Rev.5.00 Nov. 02, 2005 Page 30 of 500 REJ09B0027-0500 Section 2 CPU Table 2.9 Block Data Transfer Instructions Instruction Size Function EEPMOV.B if R4L ≠ 0 then Repeat @ER5+ → @ER6+, R4L–1 → R4L Until R4L = 0 else next; EEPMOV.W if R4 ≠ 0 then Repeat @ER5+ → @ER6+, R4–1 → R4 Until R4 = 0 else next; Transfers a data block. Starting from the address set in ER5, transfers data for the number of bytes set in R4L or R4 to the address location set in ER6. Execution of the next instruction begins as soon as the transfer is completed. Rev.5.00 Nov. 02, 2005 Page 31 of 500 REJ09B0027-0500 Section 2 CPU 2.4.2 Basic Instruction Formats H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op), a register field (r), an effective address extension (EA), and a condition field (cc). Figure 2.7 shows examples of instruction formats. • Operation Field Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields. • Register Field Specifies a general register. Address registers are specified by 3 bits, and data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. • Effective Address Extension 8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00). • Condition Field Specifies the branching condition of Bcc instructions. (1) Operation field only op NOP, RTS, etc. (2) Operation field and register fields op rm rn ADD.B Rn, Rm, etc. (3) Operation field, register fields, and effective address extension op rn rm MOV.B @(d:16, Rn), Rm EA(disp) (4) Operation field, effective address extension, and condition field op cc EA(disp) BRA d:8 Figure 2.7 Instruction Formats Rev.5.00 Nov. 02, 2005 Page 32 of 500 REJ09B0027-0500 Section 2 CPU 2.5 Addressing Modes and Effective Address Calculation The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the generated 24-bit address, so the effective address is 16 bits. 2.5.1 Addressing Modes The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses a subset of these addressing modes. Addressing modes that can be used differ depending on the instruction. For details, refer to appendix A.4, Combinations of Instructions and Addressing Modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit-manipulation instructions use register direct, register indirect, or the absolute addressing mode (@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2.10 Addressing Modes No. Addressing Mode Symbol 1 Register direct Rn 2 Register indirect @ERn 3 Register indirect with displacement @(d:16,ERn)/@(d:24,ERn) 4 Register indirect with post-increment Register indirect with pre-decrement @ERn+ @–ERn 5 Absolute address @aa:8/@aa:16/@aa:24 6 Immediate #xx:8/#xx:16/#xx:32 7 Program-counter relative @(d:8,PC)/@(d:16,PC) 8 Memory indirect @@aa:8 Register DirectRn The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. Rev.5.00 Nov. 02, 2005 Page 33 of 500 REJ09B0027-0500 Section 2 CPU Register Indirect@ERn The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand on memory. Register Indirect with Displacement@(d:16, ERn) or @(d:24, ERn) A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum the address of a memory operand. A 16-bit displacement is sign-extended when added. Register Indirect with Post-Increment or Pre-Decrement@ERn+ or @-ERn • Register indirect with post-increment@ERn+ The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word or longword access, the register value should be even. • Register indirect with pre-decrement@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result is the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For the word or longword access, the register value should be even. Absolute Address@aa:8, @aa:16, @aa:24 The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24) For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space. The access ranges of absolute addresses for the group of this LSI are those shown in table 2.11, because the upper 8 bits are ignored. Rev.5.00 Nov. 02, 2005 Page 34 of 500 REJ09B0027-0500 Section 2 CPU Table 2.11 Absolute Address Access Ranges Absolute Address Access Range 8 bits (@aa:8) H'FF00 to H'FFFF 16 bits (@aa:16) H'0000 to H'FFFF 24 bits (@aa:24) H'0000 to H'FFFF Immediate#xx:8, #xx:16, or #xx:32 The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a vector address. Program-Counter Relative@(d:8, PC) or @(d:16, PC) This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an even number. Memory Indirect@@aa:8 This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed by longword access. The first byte of the memory operand is ignored, generating a 24-bit branch address. Figure 2.8 shows how to specify branch address for in memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF). Note that the first part of the address range is also the exception vector area. Rev.5.00 Nov. 02, 2005 Page 35 of 500 REJ09B0027-0500 Section 2 CPU Specified by @aa:8 Dummy Branch address Figure 2.8 Branch Address Specification in Memory Indirect Mode 2.5.2 Effective Address Calculation Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address. Table 2.12 Effective Address Calculation (1) No 1 Addressing Mode and Instruction Format op 2 Effective Address Calculation Effective Address (EA) Register direct(Rn) rm Operand is general register contents. rn Register indirect(@ERn) 0 31 23 0 23 0 23 0 23 0 General register contents op 3 r Register indirect with displacement @(d:16,ERn) or @(d:24,ERn) 0 31 General register contents op r disp 0 31 Sign extension 4 Register indirect with post-increment or pre-decrement •Register indirect with post-increment @ERn+ op 31 0 General register contents r •Register indirect with pre-decrement @-ERn disp 1, 2, or 4 31 0 General register contents op r 1, 2, or 4 The value to be added or subtracted is 1 when the operand is byte size, 2 for word size, and 4 for longword size. Rev.5.00 Nov. 02, 2005 Page 36 of 500 REJ09B0027-0500 Section 2 CPU Table 2.12 Effective Address Calculation (2) No 5 Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA) Absolute address @aa:8 8 7 23 op abs 0 H'FFFF @aa:16 23 op abs 16 15 0 Sign extension @aa:24 op 0 23 abs 6 Immediate #xx:8/#xx:16/#xx:32 op 7 Operand is immediate data. IMM 0 23 Program-counter relative PC contents @(d:8,PC) @(d:16,PC) op disp 23 0 Sign extension 8 disp 23 0 Memory indirect @@aa:8 8 7 23 op abs 0 abs H'0000 15 0 Memory contents [Legend] r, rm,rn: op: disp: IMM: abs: 23 16 15 0 H'00 Register field Operation field Displacement Immediate data Absolute address Rev.5.00 Nov. 02, 2005 Page 37 of 500 REJ09B0027-0500 Section 2 CPU 2.6 Basic Bus Cycle CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). The period from a rising edge of φ or φSUB to the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle differs depending on whether access is to on-chip memory or to on-chip peripheral modules. 2.6.1 Access to On-Chip Memory (RAM, ROM) Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access in byte or word size. Figure 2.9 shows the on-chip memory access cycle. Bus cycle T1 state T2 state φ or φ SUB Internal address bus Address Internal read signal Internal data bus (read access) Read data Internal write signal Internal data bus (write access) Write data Figure 2.9 On-Chip Memory Access Cycle Rev.5.00 Nov. 02, 2005 Page 38 of 500 REJ09B0027-0500 Section 2 CPU 2.6.2 On-Chip Peripheral Modules On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits or 16 bits depending on the register. For description on the data bus width and number of accessing states of each register, refer to section 22.1, Register Addresses (Address Order). Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data bus width can be accessed by byte or word size. When a register with 8-bit data bus width is accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the same as that for on-chip memory. Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral module. Bus cycle T1 state T2 state T3 state φ or φ SUB Internal address bus Address Internal read signal Internal data bus (read access) Read data Internal write signal Internal data bus (write access) Write data Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access) Rev.5.00 Nov. 02, 2005 Page 39 of 500 REJ09B0027-0500 Section 2 CPU 2.7 CPU States There are four CPU states: the reset state, program execution state, program halt state, and exception-handling state. The program execution state includes active mode and subactive mode. For the program halt state, there are a sleep mode, standby mode, and sub-sleep mode. These states are shown in figure 2.11. Figure 2.12 shows the state transitions. For details on program execution state and program halt state, refer to section 6, Power-Down Modes. For details on exception processing, refer to section 3, Exception Handling. CPU state Reset state The CPU is initialized Program execution state Active (high speed) mode The CPU executes successive program instructions at high speed, synchronized by the system clock Subactive mode The CPU executes successive program instructions at reduced speed, synchronized by the subclock Program halt state A state in which some or all of the chip functions are stopped to conserve power Sleep mode Standby mode Subsleep mode Exceptionhandling state A transient state in which the CPU changes the processing flow due to a reset or an interrupt Figure 2.11 CPU Operation States Rev.5.00 Nov. 02, 2005 Page 40 of 500 REJ09B0027-0500 Power-down modes Section 2 CPU Reset cleared Reset state Exception-handling state Reset occurs Reset occurs Reset occurs Interrupt source Program halt state Interrupt source Exceptionhandling complete Program execution state SLEEP instruction executed Figure 2.12 State Transitions 2.8 Usage Notes 2.8.1 Notes on Data Access to Empty Areas The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip I/O registers areas available to the user. When data is transferred from CPU to empty areas, the transferred data will be lost. This action may also cause the CPU to malfunction. When data is transferred from an empty area to CPU, the contents of the data cannot be guaranteed. 2.8.2 EEPMOV Instruction EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L, which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the value of R6 must not change from H'FFFF to H'0000 during execution). 2.8.3 Bit-Manipulation Instruction The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in byte units, manipulate the data of the target bit, and write data to the same address again in byte units. Special care is required when using these instructions in cases where two registers are assigned to the same address, or when a bit is directly manipulated for a port or a register containing a write-only bit, because this may rewrite data of a bit other than the bit to be manipulated. Rev.5.00 Nov. 02, 2005 Page 41 of 500 REJ09B0027-0500 Section 2 CPU Bit manipulation for two registers assigned to the same address Example 1: Bit manipulation for the timer load register and timer counter (Applicable for timer B1 in the H8/3687 Group.) Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same address. When a bit-manipulation instruction accesses the timer load register and timer counter of a reloadable timer, since these two registers share the same address, the following operations takes place. 1. Data is read in byte units. 2. The CPU sets or resets the bit to be manipulated with the bit-manipulation instruction. 3. The written data is written again in byte units to the timer load register. The timer is counting, so the value read is not necessarily the same as the value in the timer load register. As a result, bits other than the intended bit in the timer counter may be modified and the modified value may be written to the timer load register. Read Count clock Timer counter Reload Write Timer load register Internal data bus Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same Address Example 2: The BSET instruction is executed for port 5. P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level signal at P50 with a BSET instruction is shown below. Rev.5.00 Nov. 02, 2005 Page 42 of 500 REJ09B0027-0500 Section 2 CPU • Prior to executing BSET instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 • BSET instruction executed instruction BSET #0, @PDR5 The BSET instruction is executed for port 5. • After executing BSET instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 1 PDR5 0 1 0 0 0 0 0 1 • Description on operation 1. When the BSET instruction is executed, first the CPU reads port 5. Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level input). P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a value of H'80, but the value read by the CPU is H'40. 2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41. 3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction. As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem, store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the data in the work area, then write this data to PDR5. Rev.5.00 Nov. 02, 2005 Page 43 of 500 REJ09B0027-0500 Section 2 CPU • Prior to executing BSET instruction MOV.B MOV.B MOV.B #80, R0L, R0L, R0L @RAM0 @PDR5 The PDR5 value (H'80) is written to a work area in memory (RAM0) as well as to PDR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 RAM0 1 0 0 0 0 0 0 0 • BSET instruction executed BSET #0, @RAM0 The BSET instruction is executed designating the PDR5 work area (RAM0). • After executing BSET instruction MOV.B MOV.B @RAM0, R0L R0L, @PDR5 The work area (RAM0) value is written to PDR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 1 RAM0 1 0 0 0 0 0 0 1 Bit Manipulation in a Register Containing a Write-Only Bit Example 3: BCLR instruction executed designating port 5 control register PCR5 P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be input to this input pin. Rev.5.00 Nov. 02, 2005 Page 44 of 500 REJ09B0027-0500 Section 2 CPU • Prior to executing BCLR instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 • BCLR instruction executed BCLR #0, @PCR5 The BCLR instruction is executed for PCR5. • After executing BCLR instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Output Output Output Output Output Output Output Input Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 1 1 1 1 1 1 1 0 PDR5 1 0 0 0 0 0 0 0 • Description on operation 1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F. 2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. 3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends. As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However, bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins. To prevent this problem, store a copy of the PDR5 data in a work area in memory and manipulate data of the bit in the work area, then write this data to PDR5. Rev.5.00 Nov. 02, 2005 Page 45 of 500 REJ09B0027-0500 Section 2 CPU • Prior to executing BCLR instruction MOV.B MOV.B MOV.B #3F, R0L, R0L, R0L @RAM0 @PCR5 The PCR5 value (H'3F) is written to a work area in memory (RAM0) as well as to PCR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 RAM0 0 0 1 1 1 1 1 1 • BCLR instruction executed BCLR #0, @RAM0 The BCLR instructions executed for the PCR5 work area (RAM0). • After executing BCLR instruction MOV.B MOV.B @RAM0, R0L R0L, @PCR5 The work area (RAM0) value is written to PCR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 0 PDR5 1 0 0 0 0 0 0 0 RAM0 0 0 1 1 1 1 1 0 Rev.5.00 Nov. 02, 2005 Page 46 of 500 REJ09B0027-0500 Section 3 Exception Handling Section 3 Exception Handling Exception handling may be caused by a reset, a trap instruction (TRAPA), or interrupts. • Reset A reset has the highest exception priority. Exception handling starts as soon as the reset is cleared by the RES pin. The chip is also reset when the watchdog timer overflows, and exception handling starts. Exception handling is the same as exception handling by the RES pin. • Trap Instruction Exception handling starts when a trap instruction (TRAPA) is executed. The TRAPA instruction generates a vector address corresponding to a vector number from 0 to 3, as specified in the instruction code. Exception handling can be executed at all times in the program execution state, regardless of the setting of the I bit in CCR. • Interrupts External interrupts other than NMI and internal interrupts other than address break are masked by the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when the current instruction or exception handling ends, if an interrupt request has been issued. Rev.5.00 Nov. 02, 2005 Page 47 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.1 Exception Sources and Vector Address Table 3.1 shows the vector addresses and priority of each exception handling. When more than one interrupt is requested, handling is performed from the interrupt with the highest priority. Table 3.1 Exception Sources and Vector Address Relative Module Exception Sources Vector Number Vector Address Priority RES pin Watchdog timer Reset 0 H'0000 to H'0001 High Reserved for system use 1 to 6 H'0002 to H'000D External interrupt pin NMI 7 H'000E to H'000F CPU Trap instruction (#0) 8 H'0010 to H'0011 (#1) 9 H'0012 to H'0013 (#2) 10 H'0014 to H'0015 11 H'0016 to H'0017 Address break Break conditions satisfied (#3) 12 H'0018 to H'0019 CPU Direct transition by executing the SLEEP instruction 13 H'001A to H'001B External interrupt pin IRQ0 Low-voltage detection interrupt* 14 H'001C to H'001D IRQ1 15 H'001E to H'001F IRQ2 16 H'0020 to H'0021 IRQ3 17 H'0022 to H'0023 WKP 18 H'0024 to H'0025 RTC Overflow 19 H'0026 to H'0027 Reserved for system use 20 H'0028 to H'0029 Timer V Timer V compare match A Timer V compare match B Timer V overflow 22 H'002C to H'002D SCI3 SCI3 receive data full SCI3 transmit data empty SCI3 transmit end SCI3 receive error 23 H'002E to H'002F Rev.5.00 Nov. 02, 2005 Page 48 of 500 REJ09B0027-0500 Low Section 3 Exception Handling Vector Number Vector Address Priority Transmit data empty Transmit end Receive data full Arbitration lost/Overrun error NACK detection Stop conditions detected 24 H'0030 to H'0031 High A/D converter A/D conversion end 25 H'0032 to H'0033 Timer Z Compare match/input capture A0 to D0 Timer Z overflow 26 H'0034 to H'0035 Compare match/input capture A1 to D1 Timer Z overflow Timer Z underflow 27 H'0036 to H'0037 Timer B1 Timer B1 overflow 29 H'003A to H'003B SCI3_2 Receive data full Transmit data empty Transmit end Receive error 32 H'0040 to H'0041 Relative Module Exception Sources IIC2 Note: 3.2 * Low A low-voltage detection interrupt is enabled only in the product with an on-chip poweron reset and low-voltage detection circuit. Register Descriptions Interrupts are controlled by the following registers. • • • • • • • Interrupt edge select register 1 (IEGR1) Interrupt edge select register 2 (IEGR2) Interrupt enable register 1 (IENR1) Interrupt enable register 2 (IENR2) Interrupt flag register 1 (IRR1) Interrupt flag register 2 (IRR2) Wakeup interrupt flag register (IWPR) Rev.5.00 Nov. 02, 2005 Page 49 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.2.1 Interrupt Edge Select Register 1 (IEGR1) IEGR1 selects the direction of an edge that generates interrupt requests of pins NMI and IRQ3 to IRQ0. Bit Bit Name Initial Value R/W Description 7 NMIEG 0 R/W NMI Edge Select 0: Falling edge of NMI pin input is detected 1: Rising edge of NMI pin input is detected 6 to 4 All 1 Reserved These bits are always read as 1. 3 IEG3 0 R/W IRQ3 Edge Select 0: Falling edge of IRQ3 pin input is detected 1: Rising edge of IRQ3 pin input is detected 2 IEG2 0 R/W IRQ2 Edge Select 0: Falling edge of IRQ2 pin input is detected 1: Rising edge of IRQ2 pin input is detected 1 IEG1 0 R/W IRQ1 Edge Select 0: Falling edge of IRQ1 pin input is detected 1: Rising edge of IRQ1 pin input is detected 0 IEG0 0 R/W IRQ0 Edge Select 0: Falling edge of IRQ0 pin input is detected 1: Rising edge of IRQ0 pin input is detected Rev.5.00 Nov. 02, 2005 Page 50 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.2.2 Interrupt Edge Select Register 2 (IEGR2) IEGR2 selects the direction of an edge that generates interrupt requests of the pins ADTRG and WKP5 to WKP0. Bit Bit Name Initial Value R/W Description 7, 6 All 1 Reserved 5 WPEG5 0 R/W WKP5 Edge Select These bits are always read as 1. 0: Falling edge of WKP5(ADTRG) pin input is detected 1: Rising edge of WKP5(ADTRG) pin input is detected 4 WPEG4 0 R/W WKP4 Edge Select 0: Falling edge of WKP4 pin input is detected 1: Rising edge of WKP4 pin input is detected 3 WPEG3 0 R/W WKP3 Edge Select 0: Falling edge of WKP3 pin input is detected 1: Rising edge of WKP3 pin input is detected 2 WPEG2 0 R/W WKP2 Edge Select 0: Falling edge of WKP2 pin input is detected 1: Rising edge of WKP2 pin input is detected 1 WPEG1 0 R/W WKP1Edge Select 0: Falling edge of WKP1 pin input is detected 1: Rising edge of WKP1 pin input is detected 0 WPEG0 0 R/W WKP0 Edge Select 0: Falling edge of WKP0 pin input is detected 1: Rising edge of WKP0 pin input is detected Rev.5.00 Nov. 02, 2005 Page 51 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.2.3 Interrupt Enable Register 1 (IENR1) IENR1 enables direct transition interrupts, RTC interrupts, and external pin interrupts. Bit Bit Name Initial Value R/W Description 7 IENDT 0 R/W Direct Transfer Interrupt Enable When this bit is set to 1, direct transition interrupt requests are enabled. 6 IENTA 0 R/W RTC Interrupt Enable When this bit is set to 1, RTC interrupt requests are enabled. 5 IENWP 0 R/W Wakeup Interrupt Enable This bit is an enable bit, which is common to the pins WKP5 to WKP0. When the bit is set to 1, interrupt requests are enabled. 4 1 Reserved This bit is always read as 1. 3 IEN3 0 R/W IRQ3 Interrupt Enable When this bit is set to 1, interrupt requests of the IRQ3 pin are enabled. 2 IEN2 0 R/W IRQ2 Interrupt Enable When this bit is set to 1, interrupt requests of the IRQ2 pin are enabled. 1 IEN1 0 R/W IRQ1 Interrupt Enable When this bit is set to 1, interrupt requests of the IRQ1 pin are enabled. 0 IEN0 0 R/W IRQ0 Interrupt Enable When this bit is set to 1, interrupt requests of the IRQ0 pin are enabled. When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear operations are performed while I = 0, and as a result a conflict arises between the clear instruction and an interrupt request, exception handling for the interrupt will be executed after the clear instruction has been executed. Rev.5.00 Nov. 02, 2005 Page 52 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.2.4 Interrupt Enable Register 2 (IENR2) IENR2 enables, timer B1 overflow interrupts. Bit Bit Name Initial Value R/W Description 7, 6 All 0 Reserved These bits are always read as 0. 5 IENTB1 0 R/W Timer B1 Interrupt Enable When this bit is set to 1, timer B1 overflow interrupt requests are enabled. 4 to 0 All 1 Reserved These bits are always read as 1. When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear operations are performed while I = 0, and as a result a conflict arises between the clear instruction and an interrupt request, exception handling for the interrupt will be executed after the clear instruction has been executed. 3.2.5 Interrupt Flag Register 1 (IRR1) IRR1 is a status flag register for direct transition interrupts, RTC interrupts, and IRQ3 to IRQ0 interrupt requests. Bit Bit Name Initial Value R/W Description 7 IRRDT 0 R/W Direct Transfer Interrupt Request Flag [Setting condition] When a direct transfer is made by executing a SLEEP instruction while DTON in SYSCR2 is set to 1. [Clearing condition] When IRRDT is cleared by writing 0 6 IRRTA 0 R/W RTC Interrupt Request Flag [Setting condition] When the RTC counter value overflows [Clearing condition] When IRRTA is cleared by writing 0 Rev.5.00 Nov. 02, 2005 Page 53 of 500 REJ09B0027-0500 Section 3 Exception Handling Bit Bit Name Initial Value R/W Description 5, 4 All 1 Reserved These bits are always read as 1. 3 IRRI3 0 R/W IRQ3 Interrupt Request Flag [Setting condition] When IRQ3 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IRRI3 is cleared by writing 0 2 IRRI2 0 R/W IRQ2 Interrupt Request Flag [Setting condition] When IRQ2 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IRRI2 is cleared by writing 0 1 IRRI1 0 R/W IRQ1 Interrupt Request Flag [Setting condition] When IRQ1 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IRRI1 is cleared by writing 0 0 IRRl0 0 R/W IRQ0 Interrupt Request Flag [Setting condition] When IRQ0 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IRRI0 is cleared by writing 0 Rev.5.00 Nov. 02, 2005 Page 54 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.2.6 Interrupt Flag Register 2 (IRR2) IRR2 is a status flag register for timer B1 overflow interrupts. Bit Bit Name Initial Value R/W Description 7, 6 All 0 Reserved These bits are always read as 0. 5 IRRTB1 0 R/W Timer B1 Interrupt Request flag [Setting condition] When the timer B1 counter value overflows [Clearing condition] When IRRTB1 is cleared by writing 0 4 to 0 All 1 Reserved These bits are always read as 1. 3.2.7 Wakeup Interrupt Flag Register (IWPR) IWPR is a status flag register for WKP5 to WKP0 interrupt requests. Bit Bit Name Initial Value R/W Description 7, 6 All 1 Reserved 5 IWPF5 0 R/W WKP5 Interrupt Request Flag These bits are always read as 1. [Setting condition] When WKP5 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF5 is cleared by writing 0. 4 IWPF4 0 R/W WKP4 Interrupt Request Flag [Setting condition] When WKP4 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF4 is cleared by writing 0. Rev.5.00 Nov. 02, 2005 Page 55 of 500 REJ09B0027-0500 Section 3 Exception Handling Bit Bit Name Initial Value R/W Description 3 IWPF3 0 R/W WKP3 Interrupt Request Flag [Setting condition] When WKP3 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF3 is cleared by writing 0. 2 IWPF2 0 R/W WKP2 Interrupt Request Flag [Setting condition] When WKP2 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF2 is cleared by writing 0. 1 IWPF1 0 R/W WKP1 Interrupt Request Flag [Setting condition] When WKP1 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF1 is cleared by writing 0. 0 IWPF0 0 R/W WKP0 Interrupt Request Flag [Setting condition] When WKP0 pin is designated for interrupt input and the designated signal edge is detected. [Clearing condition] When IWPF0 is cleared by writing 0. Rev.5.00 Nov. 02, 2005 Page 56 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.3 Reset Exception Handling When the RES pin goes low, all processing halts and this LSI enters the reset. The internal state of the CPU and the registers of the on-chip peripheral modules are initialized by the reset. To ensure that this LSI is reset at power-up, hold the RES pin low until the clock pulse generator output stabilizes. To reset the chip during operation, hold the RES pin low for at least 10 system clock cycles. When the RES pin goes high after being held low for the necessary time, this LSI starts reset exception handling. The reset exception handling sequence is shown in figure 3.1. However, for the reset exception handling sequence of the product with on-chip power-on reset circuit, refer to section 20, Power-On Reset and Low-Voltage Detection Circuits (Optional). The reset exception handling sequence is as follows: 1. Set the I bit in the condition code register (CCR) to 1. 2. The CPU generates a reset exception handling vector address (from H'0000 to H'0001), the data in that address is sent to the program counter (PC) as the start address, and program execution starts from that address. 3.4 Interrupt Exception Handling 3.4.1 External Interrupts As the external interrupts, there are NMI, IRQ3 to IRQ0, and WKP5 to WKP0 interrupts. NMI Interrupt NMI interrupt is requested by input signal edge to pin NMI. This interrupt is detected by either rising edge sensing or falling edge sensing, depending on the setting of bit NMIEG in IEGR1. NMI is the highest-priority interrupt, and can always be accepted without depending on the I bit value in CCR. IRQ3 to IRQ0 Interrupts IRQ3 to IRQ0 interrupts are requested by input signals to pins IRQ3 to IRQ0. These four interrupts are given different vector addresses, and are detected individually by either rising edge sensing or falling edge sensing, depending on the settings of bits IEG3 to IEG0 in IEGR1. When pins IRQ3 to IRQ0 are designated for interrupt input in PMR1 and the designated signal edge is input, the corresponding bit in IRR1 is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by setting bits IEN3 to IEN0 in IENR1. Rev.5.00 Nov. 02, 2005 Page 57 of 500 REJ09B0027-0500 Section 3 Exception Handling WKP5 to WKP0 Interrupts WKP5 to WKP0 interrupts are requested by input signals to pins WKP5 to WKP0. These six interrupts have the same vector addresses, and are detected individually by either rising edge sensing or falling edge sensing, depending on the settings of bits WPEG5 to WPEG0 in IEGR2. When pins WKP5 to WKP0 are designated for interrupt input in PMR5 and the designated signal edge is input, the corresponding bit in IWPR is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by setting bit IENWP in IENR1. Reset cleared Initial program instruction prefetch Vector fetch Internal processing RES φ Internal address bus (1) (2) Internal read signal Internal write signal Internal data bus (16 bits) (2) (1) Reset exception handling vector address (H'0000) (2) Program start address (3) Initial program instruction Figure 3.1 Reset Sequence Rev.5.00 Nov. 02, 2005 Page 58 of 500 REJ09B0027-0500 (3) Section 3 Exception Handling 3.4.2 Internal Interrupts Each on-chip peripheral module has a flag to show the interrupt request status and the enable bit to enable or disable the interrupt. For RTC interrupt requests and direct transfer interrupt requests generated by execution of a SLEEP instruction, this function is included in IRR1, IRR2, IENR1, and IENR2. When an on-chip peripheral module requests an interrupt, the corresponding interrupt request status flag is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by writing 0 to clear the corresponding enable bit. 3.4.3 Interrupt Handling Sequence Interrupts are controlled by an interrupt controller. Interrupt operation is described as follows. 1. If an interrupt occurs while the NMI or interrupt enable bit is set to 1, an interrupt request signal is sent to the interrupt controller. 2. When multiple interrupt requests are generated, the interrupt controller requests to the CPU for the interrupt handling with the highest priority at that time according to table 3.1. Other interrupt requests are held pending. 3. The CPU accepts the NMI and address break without depending on the I bit value. Other interrupt requests are accepted, if the I bit is cleared to 0 in CCR; if the I bit is set to 1, the interrupt request is held pending. 4. If the CPU accepts the interrupt after processing of the current instruction is completed, interrupt exception handling will begin. First, both PC and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.2. The PC value pushed onto the stack is the address of the first instruction to be executed upon return from interrupt handling. 5. Then, the I bit of CCR is set to 1, masking further interrupts excluding the NMI and address break. Upon return from interrupt handling, the values of I bit and other bits in CCR will be restored and returned to the values prior to the start of interrupt exception handling. 6. Next, the CPU generates the vector address corresponding to the accepted interrupt, and transfers the address to PC as a start address of the interrupt handling-routine. Then a program starts executing from the address indicated in PC. Figure 3.3 shows a typical interrupt sequence where the program area is in the on-chip ROM and the stack area is in the on-chip RAM. Rev.5.00 Nov. 02, 2005 Page 59 of 500 REJ09B0027-0500 Section 3 Exception Handling SP – 4 SP (R7) CCR SP – 3 SP + 1 CCR*3 SP – 2 SP + 2 PCH SP – 1 SP + 3 PCL SP (R7) SP + 4 Even address Stack area Prior to start of interrupt exception handling PC and CCR saved to stack After completion of interrupt exception handling [Legend] PCH : Upper 8 bits of program counter (PC) PCL : Lower 8 bits of program counter (PC) CCR: Condition code register SP: Stack pointer Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt handling routine. 2. Register contents must always be saved and restored by word length, starting from an even-numbered address. 3. Ignored when returning from the interrupt handling routine. Figure 3.2 Stack Status after Exception Handling 3.4.4 Interrupt Response Time Table 3.2 shows the number of wait states after an interrupt request flag is set until the first instruction of the interrupt handling-routine is executed. Table 3.2 Interrupt Wait States Item States Total Waiting time for completion of executing instruction* 1 to 23 15 to 37 Saving of PC and CCR to stack 4 Vector fetch 2 Instruction fetch 4 Internal processing 4 Note: * Not including EEPMOV instruction. Rev.5.00 Nov. 02, 2005 Page 60 of 500 REJ09B0027-0500 (2) (1) (4) Instruction prefetch (3) Internal processing (5) (1) Stack access (6) (7) (9) Vector fetch (8) (1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.) (2)(4) Instruction code (not executed) (3) Instruction prefetch address (Instruction is not executed.) (5) SP – 2 (6) SP – 4 (7) CCR (8) Vector address (9) Starting address of interrupt-handling routine (contents of vector) (10) First instruction of interrupt-handling routine Internal data bus (16 bits) Internal write signal Internal read signal Internal address bus φ Interrupt request signal Interrupt level decision and wait for end of instruction Interrupt is accepted (10) (9) Prefetch instruction of Internal interrupt-handling routine processing Section 3 Exception Handling Figure 3.3 Interrupt Sequence Rev.5.00 Nov. 02, 2005 Page 61 of 500 REJ09B0027-0500 Section 3 Exception Handling 3.5 Usage Notes 3.5.1 Interrupts after Reset If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that this instruction initializes the stack pointer (example: MOV.W #xx: 16, SP). 3.5.2 Notes on Stack Area Use When word data is accessed, the least significant bit of the address is regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W @SP+, Rn) to save or restore register values. 3.5.3 Notes on Rewriting Port Mode Registers When a port mode register is rewritten to switch the functions of external interrupt pins, IRQ3 to IRQ0, and WKP5 to WKP0, the interrupt request flag may be set to 1. When switching a pin function, mask the interrupt before setting the bit in the port mode register. After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the interrupt request flag from 1 to 0. Figure 3.4 shows a port mode register setting and interrupt request flag clearing procedure. CCR I bit ← 1 Interrupts masked. (Another possibility is to disable the relevant interrupt in interrupt enable register 1.) Set port mode register bit Execute NOP instruction After setting the port mode register bit, first execute at least one instruction (e.g., NOP), then clear the interrupt request flag to 0. Clear interrupt request flag to 0 CCR I bit ← 0 Interrupt mask cleared Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure Rev.5.00 Nov. 02, 2005 Page 62 of 500 REJ09B0027-0500 Section 4 Address Break Section 4 Address Break The address break simplifies on-board program debugging. It requests an address break interrupt when the set break condition is satisfied. The interrupt request is not affected by the I bit of CCR. Break conditions that can be set include instruction execution at a specific address and a combination of access and data at a specific address. With the address break function, the execution start point of a program containing a bug is detected and execution is branched to the correcting program. Figure 4.1 shows a block diagram of the address break. Internal address bus Comparator BARL ABRKCR Interrupt generation control circuit ABRKSR BDRH Internal data bus BARH BDRL Comparator Interrupt [Legend] BARH, BARL: BDRH, BDRL: ABRKCR: ABRKSR: Break address register Break data register Address break control register Address break status register Figure 4.1 Block Diagram of Address Break 4.1 Register Descriptions Address break has the following registers. • Address break control register (ABRKCR) • Address break status register (ABRKSR) • Break address register (BARH, BARL) ABK0001A_000020020200 Rev.5.00 Nov. 02, 2005 Page 63 of 500 REJ09B0027-0500 Section 4 Address Break • Break address register (BARH, BARL) • Break data register (BDRH, BDRL) 4.1.1 Address Break Control Register (ABRKCR) ABRKCR sets address break conditions. Bit Bit Name Initial Value R/W Description 7 RTINTE 1 R/W RTE Interrupt Enable When this bit is 0, the interrupt immediately after executing RTE is masked and then one instruction must be executed. When this bit is 1, the interrupt is not masked. 6 CSEL1 0 R/W Condition Select 1 and 0 5 CSEL0 0 R/W These bits set address break conditions. 00: Instruction execution cycle 01: CPU data read cycle 10: CPU data write cycle 11: CPU data read/write cycle 4 ACMP2 0 R/W Address Compare Condition Select 2 to 0 3 ACMP1 0 R/W 2 ACMP0 0 R/W These bits set the comparison condition between the address set in BAR and the internal address bus. 000: Compares 16-bit addresses 001: Compares upper 12-bit addresses 010: Compares upper 8-bit addresses 011: Compares upper 4-bit addresses 1XX: Reserved (setting prohibited) 1 DCMP1 0 R/W Data Compare Condition Select 1 and 0 0 DCMP0 0 R/W These bits set the comparison condition between the data set in BDR and the internal data bus. 00: No data comparison 01: Compares lower 8-bit data between BDRL and data bus 10: Compares upper 8-bit data between BDRH and data bus 11: Compares 16-bit data between BDR and data bus Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 64 of 500 REJ09B0027-0500 Section 4 Address Break When an address break is set in the data read cycle or data write cycle, the data bus used will depend on the combination of the byte/word access and address. Table 4.1 shows the access and data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a byte access is generated twice. For details on data widths of each register, see section 22.1, Register Addresses (Address Order). Table 4.1 Access and Data Bus Used Word Access Byte Access Even Address Odd Address Even Address Odd Address ROM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits RAM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits I/O register with 8-bit data bus width Upper 8 bits Upper 8 bits Upper 8 bits Upper 8 bits I/O register with 16-bit data bus width Upper 8 bits Lower 8 bits 4.1.2 Address Break Status Register (ABRKSR) ABRKSR consists of the address break interrupt flag and the address break interrupt enable bit. Bit Bit Name Initial Value R/W Description 7 ABIF 0 R/W Address Break Interrupt Flag [Setting condition] When the condition set in ABRKCR is satisfied [Clearing condition] When 0 is written after ABIF=1 is read 6 ABIE 0 R/W Address Break Interrupt Enable When this bit is 1, an address break interrupt request is enabled. 5 to 0 All 1 Reserved These bits are always read as 1. 4.1.3 Break Address Registers (BARH, BARL) BARH and BARL are 16-bit read/write registers that set the address for generating an address break interrupt. When setting the address break condition to the instruction execution cycle, set the first byte address of the instruction. The initial value of this register is H'FFFF. Rev.5.00 Nov. 02, 2005 Page 65 of 500 REJ09B0027-0500 Section 4 Address Break 4.1.4 Break Data Registers (BDRH, BDRL) BDRH and BDRL are 16-bit read/write registers that set the data for generating an address break interrupt. BDRH is compared with the upper 8-bit data bus. BDRL is compared with the lower 8bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for even and odd addresses in the data transmission. Therefore, comparison data must be set in BDRH for byte access. For word access, the data bus used depends on the address. See section 4.1.1, Address Break Control Register (ABRKCR), for details. The initial value of this register is undefined. 4.2 Operation When the ABIF and ABIE bits in ABRKSR are set to 1, the address break function generates an interrupt request to the CPU. The ABIF bit in ABRKSR is set to 1 by the combination of the address set in BAR, the data set in BDR, and the conditions set in ABRKCR. When the interrupt request is accepted, interrupt exception handling starts after the instruction being executed ends. The address break interrupt is not masked by the I bit in CCR of the CPU. Figures 4.2 show the operation examples of the address break interrupt setting. When the address break is specified in instruction execution cycle Register setting • ABRKCR = H'80 • BAR = H'025A Program 0258 * 025A 025C 0260 0262 : NOP NOP MOV.W @H'025A,R0 NOP NOP : Underline indicates the address to be stacked. NOP NOP MOV MOV instruc- instruc- instruc- instruction tion tion 1 tion 2 Internal prefetch prefetch prefetch prefetch processing Stack save φ Address bus 0258 025A 025C 025E SP-2 SP-4 Interrupt request Interrupt acceptance Figure 4.2 Address Break Interrupt Operation Example (1) Rev.5.00 Nov. 02, 2005 Page 66 of 500 REJ09B0027-0500 Section 4 Address Break When the address break is specified in the data read cycle Register setting • ABRKCR = H'A0 • BAR = H'025A Program 0258 025A * 025C 0260 0262 : NOP NOP MOV.W @H'025A,R0 NOP Underline indicates the address NOP to be stacked. : MOV MOV NOP MOV NOP Next instruc- instruc- instruc- instruc- instruc- instrution 1 tion 2 tion tion tion ction Internal Stack prefetch prefetch prefetch execution prefetch prefetch processing save φ Address bus 025C 025E 0260 025A 0262 0264 SP-2 Interrupt request Interrupt acceptance Figure 4.2 Address Break Interrupt Operation Example (2) Rev.5.00 Nov. 02, 2005 Page 67 of 500 REJ09B0027-0500 Section 4 Address Break Rev.5.00 Nov. 02, 2005 Page 68 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators Section 5 Clock Pulse Generators Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a system clock pulse generator and a subclock pulse generator. The system clock pulse generator consists of a system clock oscillator, a duty correction circuit, and system clock dividers. The subclock pulse generator consists of a subclock oscillator circuit and a subclock divider. Figure 5.1 shows a block diagram of the clock pulse generators. OSC1 OSC2 System clock oscillator φOSC (fOSC) Duty correction circuit φOSC (fOSC) System clock divider φOSC φOSC/8 φOSC/16 φOSC/32 φOSC/64 System clock pulse generator X1 X2 Subclock oscillator φ Prescaler S (13 bits) φ/2 to φ/8192 φW/2 φW (fW) Subclock divider φW/4 φSUB φW/8 Prescaler W (5 bits) φW/8 to φW/128 Subclock pulse generator Figure 5.1 Block Diagram of Clock Pulse Generators The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φ SUB. The system clock is divided by prescaler S to become a clock signal from φ/8192 to φ/2, and the subclock is divided by prescaler W to become a clock signal from φw/128 to φw/8. Both the system clock and subclock signals are provided to the on-chip peripheral modules. CPG0200A_000020020200 Rev.5.00 Nov. 02, 2005 Page 69 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators 5.1 System Clock Generator Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic resonator, or by providing external clock input. Figure 5.2 shows a block diagram of the system clock generator. OSC 2 LPM OSC 1 LPM: Low-power mode (standby mode, subactive mode, subsleep mode) Figure 5.2 Block Diagram of System Clock Generator 5.1.1 Connecting Crystal Resonator Figure 5.3 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance crystal resonator should be used. Figure 5.4 shows the equivalent circuit of a crystal resonator. A resonator having the characteristics given in table 5.1 should be used. C1 OSC 1 C2 OSC 2 C1 = C 2 = 10 to 22 pF Figure 5.3 Typical Connection to Crystal Resonator LS RS CS OSC 1 OSC 2 C0 Figure 5.4 Equivalent Circuit of Crystal Resonator Rev.5.00 Nov. 02, 2005 Page 70 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators Table 5.1 Crystal Resonator Parameters Frequency (MHz) 2 4 8 10 16 20 RS (max) 500 Ω 120 Ω 80 Ω 60 Ω 50 Ω 40 Ω C0 (max) 7 pF 7 pF 7 pF 7 pF 7 pF 7 pF 5.1.2 Connecting Ceramic Resonator Figure 5.5 shows a typical method of connecting a ceramic resonator. C1 OSC1 C2 OSC2 C1 = 5 to 30 pF C2 = 5 to 30 pF Figure 5.5 Typical Connection to Ceramic Resonator 5.1.3 External Clock Input Method Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 5.6 shows a typical connection. The duty cycle of the external clock signal must be 45 to 55%. OSC1 OSC 2 External clock input Open Figure 5.6 Example of External Clock Input Rev.5.00 Nov. 02, 2005 Page 71 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators 5.2 Subclock Generator Figure 5.7 shows a block diagram of the subclock generator. X2 8MΩ X1 Note : Registance is a reference value. Figure 5.7 Block Diagram of Subclock Generator 5.2.1 Connecting 32.768-kHz Crystal Resonator Clock pulses can be supplied to the subclock divider by connecting a 32.768-kHz crystal resonator, as shown in figure 5.8. Figure 5.9 shows the equivalent circuit of the 32.768-kHz crystal resonator. C1 X1 C2 X2 C1 = C 2 = 15 pF (typ.) Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator LS CS RS X1 X2 CO CO = 1.5 pF (typ.) RS = 14 kΩ (typ.) fW = 32.768 kHz Note: Constants are reference values. Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator Rev.5.00 Nov. 02, 2005 Page 72 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators 5.2.2 Pin Connection when Not Using Subclock When the subclock is not used, connect pin X1 to VCL or VSS and leave pin X2 open, as shown in figure 5.10. VCL or VSS X1 X2 Open Figure 5.10 Pin Connection when not Using Subclock 5.3 Prescalers 5.3.1 Prescaler S Prescaler S is a 13-bit counter using the system clock (ø) as its input clock. It is incremented once per clock period. Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from the reset state. In standby mode, subactive mode, and subsleep mode, the system clock pulse generator stops. Prescaler S also stops and is initialized to H'0000. The CPU cannot read or write prescaler S. The output from prescaler S is shared by the on-chip peripheral modules. The divider ratio can be set separately for each on-chip peripheral function. In active mode and sleep mode, the clock input to prescaler S is determined by the division factor designated by MA2 to MA0 in SYSCR2. 5.3.2 Prescaler W Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (øW/4) as its input clock. The divided output is used for clock time base operation of timer A. Prescaler W is initialized to H'00 by a reset, and starts counting on exit from the reset state. Even in standby mode, subactive mode, or subsleep mode, prescaler W continues functioning so long as clock signals are supplied to pins X1 and X2. Rev.5.00 Nov. 02, 2005 Page 73 of 500 REJ09B0027-0500 Section 5 Clock Pulse Generators 5.4 Usage Notes 5.4.1 Note on Resonators Resonator characteristics are closely related to board design and should be carefully evaluated by the user, referring to the examples shown in this section. Resonator circuit constants will differ depending on the resonator element, stray capacitance in its interconnecting circuit, and other factors. Suitable constants should be determined in consultation with the resonator element manufacturer. Design the circuit so that the resonator element never receives voltages exceeding its maximum rating. 5.4.2 Notes on Board Design When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as close as possible to the OSC1 and OSC2 pins. Other signal lines should be routed away from the resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11). Signal A Avoid Signal B C1 OSC1 C2 OSC2 Figure 5.11 Example of Incorrect Board Design Rev.5.00 Nov. 02, 2005 Page 74 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Section 6 Power-Down Modes This LSI has six modes of operation after a reset. These include a normal active mode and four power-down modes, in which power consumption is significantly reduced. Module standby mode reduces power consumption by selectively halting on-chip module functions. • Active mode The CPU and all on-chip peripheral modules are operable on the system clock. The system clock frequency can be selected from φosc, φosc/8, φosc/16, φosc/32, and φosc/64. • Subactive mode The CPU and all on-chip peripheral modules are operable on the subclock. The subclock frequency can be selected from φw/2, φw/4, and φw/8. • Sleep mode The CPU halts. On-chip peripheral modules are operable on the system clock. • Subsleep mode The CPU halts. On-chip peripheral modules are operable on the subclock. • Standby mode The CPU and all on-chip peripheral modules halt. When the clock time-base function is selected, the RTC is operable. • Module standby mode Independent of the above modes, power consumption can be reduced by halting on-chip peripheral modules that are not used in module units. 6.1 Register Descriptions The registers related to power-down modes are listed below. • • • • System control register 1 (SYSCR1) System control register 2 (SYSCR2) Module standby control register 1 (MSTCR1) Module standby control register 2 (MSTCR2) LPW3002A_000120030300 Rev.5.00 Nov. 02, 2005 Page 75 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.1.1 System Control Register 1 (SYSCR1) SYSCR1 controls the power-down modes, as well as SYSCR2. Bit Bit Name Initial Value R/W Description 7 SSBY 0 R/W Software Standby This bit selects the mode to transit after the execution of the SLEEP instruction. 0: Enters sleep mode or subsleep mode. 1: Enters standby mode. For details, see table 6.2. 6 STS2 0 R/W Standby Timer Select 2 to 0 5 STS1 0 R/W 4 STS0 0 R/W These bits designate the time the CPU and peripheral modules wait for stable clock operation after exiting from standby mode, subactive mode, or subsleep mode to active mode or sleep mode due to an interrupt. The designation should be made according to the clock frequency so that the waiting time is at least 6.5 ms. The relationship between the specified value and the number of wait states is shown in table 6.1. When an external clock is to be used, the minimum value (STS2 = STS1 = STS0 =1) is recommended. 3 NESEL 0 R/W Noise Elimination Sampling Frequency Select The subclock pulse generator generates the watch clock signal (φW) and the system clock pulse generator generates the oscillator clock (φOSC). This bit selects the sampling frequency of the oscillator clock when the watch clock signal (φW) is sampled. When φOSC = 4 to 20 MHz, clear NESEL to 0. 0: Sampling rate is φOSC/16 1: Sampling rate is φOSC/4 2 to 0 All 0 Reserved These bits are always read as 0. Rev.5.00 Nov. 02, 2005 Page 76 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Table 6.1 Operating Frequency and Waiting Time Bit Name Operating Frequency STS2 STS1 STS0 Waiting Time 0 0 1 1 0 1 20 MHz 16 MHz 10 MHz 8 MHz 4 MHz 2 MHz 1 MHz 0.5 MHz 0 8,192 states 0.4 0.5 0.8 1.0 2.0 4.1 8.1 16.4 1 16,384 states 0.8 1.0 1.6 2.0 4.1 8.2 16.4 32.8 0 32,768 states 1.6 2.0 3.3 4.1 8.2 16.4 32.8 65.5 1 65,536 states 3.3 4.1 6.6 8.2 16.4 32.8 65.5 131.1 0 131,072 states 6.6 8.2 13.1 16.4 32.8 65.5 131.1 262.1 1 1,024 states 0.05 0.06 0.10 0.13 0.26 0.51 1.02 2.05 0 128 states 0.00 0.00 0.01 0.02 0.03 0.06 0.13 0.26 1 16 states 0.00 0.00 0.00 0.00 0.00 0.01 0.02 0.03 Note: Time unit is ms. Rev.5.00 Nov. 02, 2005 Page 77 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.1.2 System Control Register 2 (SYSCR2) SYSCR2 controls the power-down modes, as well as SYSCR1. Bit Bit Name Initial Value R/W Description 7 SMSEL 0 R/W Sleep Mode Selection 6 LSON 0 R/W Low Speed on Flag 5 DTON 0 R/W Direct Transfer on Flag These bits select the mode to enter after the execution of a SLEEP instruction, as well as bit SSBY of SYSCR1. For details, see table 6.2. 4 MA2 0 R/W Active Mode Clock Select 2 to 0 3 MA1 0 R/W 2 MA0 0 R/W These bits select the operating clock frequency in active and sleep modes. The operating clock frequency changes to the set frequency after the SLEEP instruction is executed. 0XX: φOSC 100: φOSC/8 101: φOSC/16 110: φOSC/32 111: φOSC/64 1 SA1 0 R/W Subactive Mode Clock Select 1 and 0 0 SA0 0 R/W These bits select the operating clock frequency in subactive and subsleep modes. The operating clock frequency changes to the set frequency after the SLEEP instruction is executed. 00: φW/8 01: φW/4 1X: φW/2 Legend: Don't care. Rev.5.00 Nov. 02, 2005 Page 78 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.1.3 Module Standby Control Register 1 (MSTCR1) MSTCR1 allows the on-chip peripheral modules to enter a standby state in module units. Bit Bit Name Initial Value R/W Description 7 0 Reserved This bit is always read as 0. 6 MSTIIC 0 R/W IIC2 Module Standby IIC2 enters standby mode when this bit is set to 1 5 MSTS3 0 R/W SCI3 Module Standby 4 MSTAD 0 R/W A/D Converter Module Standby SCI3 enters standby mode when this bit is set to 1 A/D converter enters standby mode when this bit is set to 1 3 MSTWD 0 R/W Watchdog Timer Module Standby Watchdog timer enters standby mode when this bit is set to 1.When the internal oscillator is selected for the watchdog timer clock, the watchdog timer operates regardless of the setting of this bit 2 0 Reserved This bit is always read as 0. 1 MSTTV 0 R/W Timer V Module Standby Timer V enters standby mode when this bit is set to 1 0 MSTTA 0 R/W RTC Module Standby RTC enters standby mode when this bit is set to 1 Rev.5.00 Nov. 02, 2005 Page 79 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.1.4 Module Standby Control Register 2 (MSTCR2) MSTCR2 allows the on-chip peripheral modules to enter a standby state in module units. Bit Bit Name Initial Value R/W Description 7 MSTS3_2 0 R/W SCI3_2 Module Standby SCI3_2 enters standby mode when this bit is set to1 6, 5 All 0 Reserved These bits are always read as 0. 4 MSTTB1 0 R/W Timer B1 Module Standby 3, 2 All 0 Reserved Timer B1 enters standby mode when this bit is set to1 These bits are always read as 0. 1 MSTTZ 0 R/W Timer Z Module Standby Timer Z enters standby mode when this bit is set to1 0 MSTPWM 0 R/W PWM Module Standby PWM enters standby mode when this bit is set to1 6.2 Mode Transitions and States of LSI Figure 6.1 shows the possible transitions among these operating modes. A transition is made from the program execution state to the program halt state by executing a SLEEP instruction. Interrupts allow for returning from the program halt state to the program execution state. A direct transition between active mode and subactive mode, which are both program execution states, can be made without halting the program. The operating frequency can also be changed in the same modes by making a transition directly from active mode to active mode, and from subactive mode to subactive mode. RES input enables transitions from a mode to the reset state. Table 6.2 shows the transition conditions of each mode after the SLEEP instruction is executed and a mode to return by an interrupt. Table 6.3 shows the internal states of the LSI in each mode. Rev.5.00 Nov. 02, 2005 Page 80 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Reset state Program halt state Program execution state SLEEP instruction Direct transition interrupt SLEEP instruction Sleep mode Active mode Standby mode Program halt state Interrupt Interrupt SLEEP instruction Direct transition interrupt Direct transition interrupt Interrupt SLEEP instruction SLEEP instruction Interrupt SLEEP instruction Subactive mode Subsleep mode Interrupt Direct transition interrupt Notes: 1. To make a transition to another mode by an interrupt, make sure interrupt handling is after the interrupt is accepted. 2. Details on the mode transition conditions are given in table 6.2. Figure 6.1 Mode Transition Diagram Rev.5.00 Nov. 02, 2005 Page 81 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Table 6.2 Transition Mode after SLEEP Instruction Execution and Transition Mode due to Interrupt DTON SSBY SMSEL LSON Transition Mode after SLEEP Instruction Execution 0 0 0 0 Sleep mode 1 1 0 Legend: * Active mode Subactive mode Subsleep mode 1 1 Transition Mode due to Interrupt Active mode Subactive mode 1 X X Standby mode Active mode X 0* 0 Active mode (direct transition) X X 1 Subactive mode (direct transition) X: Don’t care. When a state transition is performed while SMSEL is 1, timer V, SCI3, SCI3_2 and the A/D converter are reset, and all registers are set to their initial values. To use these functions after entering active mode, reset the registers. Rev.5.00 Nov. 02, 2005 Page 82 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Table 6.3 Internal State in Each Operating Mode Function Active Mode Sleep Mode Subactive Mode Subsleep Mode Standby Mode System clock oscillator Functioning Functioning Halted Halted Halted Subclock oscillator Functioning Functioning Functioning Functioning Functioning CPU operations Instructions Functioning Halted Functioning Halted Halted Registers Functioning Retained Functioning Retained Retained RAM Functioning Retained Functioning Retained Retained IO ports Functioning Retained Functioning Retained Register contents are retained, but output is the highimpedance state. IRQ3 to IRQ0 Functioning Functioning Functioning Functioning Functioning WKP5 to WKP0 Functioning Functioning Functioning Functioning Functioning RTC Functioning Functioning Functioning if the timekeeping time-base function is selected, and retained if not selected Timer V Functioning Functioning Reset Watchdog timer Functioning Functioning Retained (functioning if the internal oscillator is selected as a count clock*) SCI3, SCI3_2 Functioning Functioning Reset External interrupts Peripheral functions Note: * Reset Reset Reset Reset IIC2 Functioning Functioning Retained* Retained Retained Timer B1 Functioning Functioning Retained* Retained Retained Timer Z Functioning Functioning Retained (the counter increments according to subclocks if the internal clock (φ) is selected as a count clock*) A/D converter Functioning Functioning Reset Reset Reset Registers can be read or written in subactive mode. Rev.5.00 Nov. 02, 2005 Page 83 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.2.1 Sleep Mode In sleep mode, CPU operation is halted but the on-chip peripheral modules function at the clock frequency set by the MA2, MA1, and MA0 bits in SYSCR2. CPU register contents are retained. When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts. Sleep mode is not cleared if the I bit of the condition code register (CCR) is set to 1 or the requested interrupt is disabled in the interrupt enable register. After sleep mode is cleared, a transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is made to subactive mode when the bit is 1. When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared. 6.2.2 Standby Mode In standby mode, the clock pulse generator stops, so the CPU and on-chip peripheral modules stop functioning. However, as long as the rated voltage is supplied, the contents of CPU registers, onchip RAM, and some on-chip peripheral module registers are retained. On-chip RAM contents will be retained as long as the voltage set by the RAM data retention voltage is provided. The I/O ports go to the high-impedance state. Standby mode is cleared by an interrupt. When an interrupt is requested, the system clock pulse generator starts. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, and interrupt exception handling starts. Standby mode is not cleared if the I bit of CCR is set to 1 or the requested interrupt is disabled in the interrupt enable register. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. 6.2.3 Subsleep Mode In subsleep mode, operation of the CPU and on-chip peripheral modules other than RTC is halted. As long as a required voltage is applied, the contents of CPU registers, the on-chip RAM, and some registers of the on-chip peripheral modules are retained. I/O ports keep the same states as before the transition. Subsleep mode is cleared by an interrupt. When an interrupt is requested, subsleep mode is cleared and interrupt exception handling starts. Subsleep mode is not cleared if the I bit of CCR is set to 1 or the requested interrupt is disabled in the interrupt enable register. After subsleep mode is Rev.5.00 Nov. 02, 2005 Page 84 of 500 REJ09B0027-0500 Section 6 Power-Down Modes cleared, a transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is made to subactive mode when the bit is 1. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, a transition is made to active mode. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. 6.2.4 Subactive Mode The operating frequency of subactive mode is selected from φW/2, φW/4, and φW/8 by the SA1 and SA0 bits in SYSCR2. After the SLEEP instruction is executed, the operating frequency changes to the frequency which is set before the execution. When the SLEEP instruction is executed in subactive mode, a transition to sleep mode, subsleep mode, standby mode, active mode, or subactive mode is made, depending on the combination of SYSCR1 and SYSCR2. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. 6.3 Operating Frequency in Active Mode Operation in active mode is clocked at the frequency designated by the MA2, MA1, and MA0 bits in SYSCR2. The operating frequency changes to the set frequency after SLEEP instruction execution. Rev.5.00 Nov. 02, 2005 Page 85 of 500 REJ09B0027-0500 Section 6 Power-Down Modes 6.4 Direct Transition The CPU can execute programs in two modes: active and subactive modes. A direct transition is a transition between these two modes without stopping program execution. A direct transition can be made by executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. The direct transition also enables operating frequency modification in active or subactive mode. After the mode transition, direct transition interrupt exception handling starts. If the direct transition interrupt is disabled in interrupt enable register 1, a transition is made instead to sleep or subsleep mode. Note that if a direct transition is attempted while the I bit in CCR is set to 1, sleep or subsleep mode will be entered, and the resulting mode cannot be cleared by means of an interrupt. 6.4.1 Direct Transition from Active Mode to Subactive Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (1). Direct transition time = {(number of SLEEP instruction execution states) + (number of internal processing states)}× (tcyc before transition) + (number of interrupt exception handling states) × (tsubcyc after transition) (1) Example Direct transition time = (2 + 1) × tosc + 14 × 8tw = 3tosc + 112tw (when the CPU operating clock of φosc → φw/8 is selected) Legend tosc: OSC clock cycle time tw: Watch clock cycle time tcyc: System clock (φ) cycle time tsubcyc: Subclock (φSUB) cycle time 6.4.2 Direct Transition from Subactive Mode to Active Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (2). Direct transition time = {(number of SLEEP instruction execution states) + (number of internal processing states)} × (tsubcyc before transition) + {(waiting time set in bits STS2 to STS0) + (number of interrupt exception handling states)} × (tcyc after transition) (2) Rev.5.00 Nov. 02, 2005 Page 86 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Example Direct transition time = (2 + 1) × 8tw + (8192 + 14) × tosc = 24tw + 8206tosc (when the CPU operating clock of φw/8 → φosc and a waiting time of 8192 states are selected) Legend tosc: OSC clock cycle time tw: Watch clock cycle time tcyc: System clock (φ) cycle time tsubcyc: Subclock (φSUB) cycle time 6.5 Module Standby Function The module-standby function can be set to any peripheral module. In module standby mode, the clock supply to modules stops to enter the power-down mode. Module standby mode enables each on-chip peripheral module to enter the standby state by setting a bit that corresponds to each module to 1 and cancels the mode by clearing the bit to 0. Rev.5.00 Nov. 02, 2005 Page 87 of 500 REJ09B0027-0500 Section 6 Power-Down Modes Rev.5.00 Nov. 02, 2005 Page 88 of 500 REJ09B0027-0500 Section 7 ROM Section 7 ROM The features of the 56-kbyte or 32-kbyte flash memories built into the flash memory (F-ZTAT) version are summarized below. • Programming/erase methods The flash memory is programmed 128 bytes at a time. Erase is performed in single-block units. The flash memory is configured as follows: 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes × 1 block, and 8 kbytes × 1 block for H8/3687F and 1 kbyte × 4 blocks and 28 kbytes × 1 block for H8/3684F. To erase the entire flash memory, each block must be erased in turn. • Reprogramming capability The flash memory can be reprogrammed up to 1,000 times. • On-board programming On-board programming/erasing can be done in boot mode, in which the boot program built into the chip is started to erase or program of the entire flash memory. In normal user program mode, individual blocks can be erased or programmed. • Programmer mode Flash memory can be programmed/erased in programmer mode using a PROM programmer, as well as in on-board programming mode. • Automatic bit rate adjustment For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match the transfer bit rate of the host. • Programming/erasing protection Sets software protection against flash memory programming/erasing. • Power-down mode Operation of the power supply circuit can be partly halted in subactive mode. As a result, flash memory can be read with low power consumption. 7.1 Block Configuration Figure 7.1 shows the block configuration of flash memory. The thick lines indicate erasing units, the narrow lines indicate programming units, and the values are addresses. The 56-kbyte flash memory is divided into 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes × 1 block, and 8 kbytes × 1 block. The 32-kbyte flash memory is divided into 1 kbyte × 4 blocks and 28 kbytes × 1 blocks. Erasing is performed in these units. Programming is performed in 128-byte units starting from an address with lower eight bits H'00 or H'80. ROM3560A_000120030300 Rev.5.00 Nov. 02, 2005 Page 89 of 500 REJ09B0027-0500 Section 7 ROM Erase unit H'0000 H'0001 H'0002 H'0080 H'0081 H'0082 H'0380 H'0381 H'0382 H'0400 H'0401 H'0402 H'0480 H'0481 H'0481 H'0780 H'0781 H'0782 H'0800 H'0801 H'0802 H'0880 H'0881 H'0882 H'0B80 H'0B81 H'0B82 H'0C00 H'0C01 H'0C02 H'0C80 H'0C81 H'0C82 H'0F80 H'0F81 H'0F82 H'1000 H'1001 H'1002 H'1080 H'1081 H'1082 H'7F80 H'7F81 H'7F82 H'8000 H'8001 H'8002 H'8080 H'8081 H'8082 Programming unit: 128 bytes H'007F H'00FF 1 kbyte Erase unit H'03FF Programming unit: 128 bytes H'047F H'04FF 1 kbyte Erase unit H'07FF Programming unit: 128 bytes H'087F H'08FF 1 kbyte Erase unit H'0BFF Programming unit: 128 bytes H'0C7F H'0CFF 1 kbyte Erase unit H'0FFF Programming unit: 128 bytes H'107F H'10FF 28 kbytes Erase unit H'7FFF Programming unit: 128 bytes H'807F H'80FF 16 kbytes Erase unit H'BF80 H'BF81 H'BF82 H'C000 H'C001 H'C002 H'C080 H'C081 H'C082 H'C0FF HDF80 H'DF81 H'DF82 H'DFFF H'BFFF Programming unit: 128 bytes H'C07F 8 kbytes Figure 7.1 Flash Memory Block Configuration Rev.5.00 Nov. 02, 2005 Page 90 of 500 REJ09B0027-0500 Section 7 ROM 7.2 Register Descriptions The flash memory has the following registers. • • • • • Flash memory control register 1 (FLMCR1) Flash memory control register 2 (FLMCR2) Erase block register 1 (EBR1) Flash memory power control register (FLPWCR) Flash memory enable register (FENR) 7.2.1 Flash Memory Control Register 1 (FLMCR1) FLMCR1 is a register that makes the flash memory change to program mode, program-verify mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash Memory Programming/Erasing. Bit Bit Name Initial Value R/W Description 7 0 Reserved This bit is always read as 0. 6 SWE 0 R/W Software Write Enable When this bit is set to 1, flash memory programming/erasing is enabled. When this bit is cleared to 0, other FLMCR1 register bits and all EBR1 bits cannot be set. 5 ESU 0 R/W Erase Setup When this bit is set to 1, the flash memory changes to the erase setup state. When it is cleared to 0, the erase setup state is cancelled. Set this bit to 1 before setting the E bit to 1 in FLMCR1. 4 PSU 0 R/W Program Setup When this bit is set to 1, the flash memory changes to the program setup state. When it is cleared to 0, the program setup state is cancelled. Set this bit to 1 before setting the P bit in FLMCR1. 3 EV 0 R/W Erase-Verify When this bit is set to 1, the flash memory changes to erase-verify mode. When it is cleared to 0, erase-verify mode is cancelled. Rev.5.00 Nov. 02, 2005 Page 91 of 500 REJ09B0027-0500 Section 7 ROM Bit Bit Name Initial Value R/W Description 2 PV 0 R/W Program-Verify When this bit is set to 1, the flash memory changes to program-verify mode. When it is cleared to 0, programverify mode is cancelled. 1 E 0 R/W Erase When this bit is set to 1 while SWE=1 and ESU=1, the flash memory changes to erase mode. When it is cleared to 0, erase mode is cancelled. 0 P 0 R/W Program When this bit is set to 1 while SWE=1 and PSU=1, the flash memory changes to program mode. When it is cleared to 0, program mode is cancelled. 7.2.2 Flash Memory Control Register 2 (FLMCR2) FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a read-only register, and should not be written to. Bit Bit Name Initial Value R/W Description 7 FLER 0 R Flash Memory Error Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the error-protection state. See section 7.5.3, Error Protection, for details. 6 to 0 All 0 Reserved These bits are always read as 0. Rev.5.00 Nov. 02, 2005 Page 92 of 500 REJ09B0027-0500 Section 7 ROM 7.2.3 Erase Block Register 1 (EBR1) EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to be automatically cleared to 0. Bit Bit Name Initial Value R/W Description 7 0 Reserved This bit is always read as 0. 6 EB6 0 R/W When this bit is set to 1, 8 bytes of H'C000 to H'DFFF will be erased. 5 EB5 0 R/W When this bit is set to 1, 16 bytes of H'8000 to H'BFFF will be erased. 4 EB4 0 R/W When this bit is set to 1, 28 kbytes of H'1000 to H'7FFF will be erased. 3 EB3 0 R/W When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF will be erased. 2 EB2 0 R/W When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF will be erased. 1 EB1 0 R/W When this bit is set to 1, 1 kbyte of H'0400 to H'07FF will be erased. 0 EB0 0 R/W When this bit is set to 1, 1 kbyte of H'0000 to H'03FF will be erased. Rev.5.00 Nov. 02, 2005 Page 93 of 500 REJ09B0027-0500 Section 7 ROM 7.2.4 Flash Memory Power Control Register (FLPWCR) FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode. There are two modes: mode in which operation of the power supply circuit of flash memory is partly halted in power-down mode and flash memory can be read, and mode in which even if a transition is made to subactive mode, operation of the power supply circuit of flash memory is retained and flash memory can be read. Bit Bit Name Initial Value R/W Description 7 PDWND 0 R/W Power-Down Disable When this bit is 0 and a transition is made to subactive mode, the flash memory enters the power-down mode. When this bit is 1, the flash memory remains in the normal mode even after a transition is made to subactive mode. 6 to 0 All 0 Reserved These bits are always read as 0. 7.2.5 Flash Memory Enable Register (FENR) Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers, FLMCR1, FLMCR2, EBR1, and FLPWCR. Bit Bit Name Initial Value R/W Description 7 FLSHE 0 R/W Flash Memory Control Register Enable Flash memory control registers can be accessed when this bit is set to 1. Flash memory control registers cannot be accessed when this bit is set to 0. 6 to 0 All 0 Reserved These bits are always read as 0. Rev.5.00 Nov. 02, 2005 Page 94 of 500 REJ09B0027-0500 Section 7 ROM 7.3 On-Board Programming Modes There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed with a PROM programmer. On-board programming/erasing can also be performed in user program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level of each pin must be defined four states before the reset ends. When changing to boot mode, the boot program built into this LSI is initiated. The boot program transfers the programming control program from the externally-connected host to on-chip RAM via SCI3. After erasing the entire flash memory, the programming control program is executed. This can be used for programming initial values in the on-board state or for a forcible return when programming/erasing can no longer be done in user program mode. In user program mode, individual blocks can be erased and programmed by branching to the user program/erase control program prepared by the user. Table 7.1 Setting Programming Modes TEST NMI P85 PB0 PB1 PB2 LSI State after Reset End 0 1 X X X X User Mode 0 0 1 X X X Boot Mode 1 X X 0 0 0 Programmer Mode Legend: X : Don’t care. 7.3.1 Boot Mode Table 7.2 shows the boot mode operations between reset end and branching to the programming control program. 1. When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. Prepare a programming control program in accordance with the description in section 7.4, Flash Memory Programming/Erasing. 2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop bit, and no parity. 3. When the boot program is initiated, the chip measures the low-level period of asynchronous SCI communication data (H'00) transmitted continuously from the host. The chip then calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be Rev.5.00 Nov. 02, 2005 Page 95 of 500 REJ09B0027-0500 Section 7 ROM 4. 5. 6. 7. 8. pulled up on the board if necessary. After the reset is complete, it takes approximately 100 states before the chip is ready to measure the low-level period. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the completion of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could not be performed normally, initiate boot mode again by a reset. Depending on the host's transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit rate and system clock frequency of this LSI within the ranges listed in table 7.3. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to H'FEEF is the area to which the programming control program is transferred from the host. The boot program area cannot be used until the execution state in boot mode switches to the programming control program. Before branching to the programming control program, the chip terminates transfer operations by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value remains set in BRR. Therefore, the programming control program can still use it for transfer of program data or verify data with the host. The TxD pin is high (PCR22 = 1, P22 = 1). The contents of the CPU general registers are undefined immediately after branching to the programming control program. These registers must be initialized at the beginning of the programming control program, as the stack pointer (SP), in particular, is used implicitly in subroutine calls, etc. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at least 20 states, and then setting the NMI pin. Boot mode is also cleared when a WDT overflow occurs. Do not change the TEST pin and NMI pin input levels in boot mode. Rev.5.00 Nov. 02, 2005 Page 96 of 500 REJ09B0027-0500 Section 7 ROM Boot Mode Operation Host Operation Communication Contents Processing Contents Transfer of number of bytes of programming control program Flash memory erase Bit rate adjustment Boot mode initiation Item Table 7.2 LSI Operation Processing Contents Branches to boot program at reset-start. Boot program initiation Continuously transmits data H'00 at specified bit rate. Transmits data H'55 when data H'00 is received error-free. H'00, H'00 . . . H'00 H'00 H'55 Boot program erase error H'AA reception Transmits number of bytes (N) of programming control program to be transferred as 2-byte data (low-order byte following high-order byte) Transmits 1-byte of programming control program (repeated for N times) H'AA reception H'FF H'AA Upper bytes, lower bytes Echoback H'XX Echoback H'AA • Measures low-level period of receive data H'00. • Calculates bit rate and sets BRR in SCI3. • Transmits data H'00 to host as adjustment end indication. H'55 reception. Checks flash memory data, erases all flash memory blocks in case of written data existing, and transmits data H'AA to host. (If erase could not be done, transmits data H'FF to host and aborts operation.) Echobacks the 2-byte data received to host. Echobacks received data to host and also transfers it to RAM. (repeated for N times) Transmits data H'AA to host. Branches to programming control program transferred to on-chip RAM and starts execution. Rev.5.00 Nov. 02, 2005 Page 97 of 500 REJ09B0027-0500 Section 7 ROM Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is Possible Host Bit Rate System Clock Frequency Range of LSI 19,200 bps 16 to 20 MHz 9,600 bps 8 to 16 MHz 4,800 bps 4 to 16 MHz 2,400 bps 2 to 16 MHz 7.3.2 Programming/Erasing in User Program Mode On-board programming/erasing of an individual flash memory block can also be performed in user program mode by branching to a user program/erase control program. The user must set branching conditions and provide on-board means of supplying programming data. The flash memory must contain the user program/erase control program or a program that provides the user program/erase control program from external memory. As the flash memory itself cannot be read during programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode. Prepare a user program/erase control program in accordance with the description in section 7.4, Flash Memory Programming/Erasing. Rev.5.00 Nov. 02, 2005 Page 98 of 500 REJ09B0027-0500 Section 7 ROM Reset-start No Program/erase? Yes Transfer user program/erase control program to RAM Branch to flash memory application program Branch to user program/erase control program in RAM Execute user program/erase control program (flash memory rewrite) Branch to flash memory application program Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode Rev.5.00 Nov. 02, 2005 Page 99 of 500 REJ09B0027-0500 Section 7 ROM 7.4 Flash Memory Programming/Erasing A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify mode. The programming control program in boot mode and the user program/erase control program in user program mode use these operating modes in combination to perform programming/erasing. Flash memory programming and erasing should be performed in accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2, Erase/Erase-Verify, respectively. 7.4.1 Program/Program-Verify When writing data or programs to the flash memory, the program/program-verify flowchart shown in figure 7.3 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to the flash memory without subjecting the chip to voltage stress or sacrificing program data reliability. 1. Programming must be done to an empty address. Do not reprogram an address to which programming has already been performed. 2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the extra addresses. 3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform reprogramming data computation according to table 7.4, and additional programming data computation according to table 7.5. 4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or additional-programming data area to the flash memory. The program address and 128-byte data are latched in the flash memory. The lower 8 bits of the start address in the flash memory destination area must be H'00 or H'80. 5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the allowable programming times. 6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. An overflow cycle of approximately 6.6 ms is allowed. 7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2 bits are B'00. Verify data can be read in words or in longwords from the address to which a dummy write was performed. Rev.5.00 Nov. 02, 2005 Page 100 of 500 REJ09B0027-0500 Section 7 ROM 8. The maximum number of repetitions of the program/program-verify sequence of the same bit is 1,000. Write pulse application subroutine START Apply Write Pulse Set SWE bit in FLMCR1 WDT enable Wait 1 µs Set PSU bit in FLMCR1 Store 128-byte program data in program data area and reprogram data area * Wait 50 µs n= 1 Set P bit in FLMCR1 m= 0 Wait (Wait time=programming time) Write 128-byte data in RAM reprogram data area consecutively to flash memory Clear P bit in FLMCR1 Wait 5 µs Apply Write pulse Clear PSU bit in FLMCR1 Set PV bit in FLMCR1 Wait 4 µs Wait 5 µs Disable WDT Set block start address as verify address End Sub H'FF dummy write to verify address n←n+1 Wait 2 µs * Read verify data Increment address No Verify data = write data? m=1 Yes n≤6? No Yes Additional-programming data computation Reprogram data computation No 128-byte data verification completed? Yes Clear PV bit in FLMCR1 Wait 2 µs n ≤ 6? No Yes Successively write 128-byte data from additionalprogramming data area in RAM to flash memory Sub-Routine-Call Apply Write Pulse m= 0 ? Yes Clear SWE bit in FLMCR1 No n ≤ 1000 ? Yes No Clear SWE bit in FLMCR1 Wait 100 µs Wait 100 µs End of programming Programming failure Notes: * The RTS instruction must not be used during the following 1. and 2. periods. 1. A period between 128-byte data programming to flash memory and the P bit clearing 2. A period between dummy writing of H'FF to a verify address and verify data reading Figure 7.3 Program/Program-Verify Flowchart Rev.5.00 Nov. 02, 2005 Page 101 of 500 REJ09B0027-0500 Section 7 ROM Table 7.4 Reprogram Data Computation Table Program Data Verify Data Reprogram Data Comments 0 0 1 Programming completed 0 1 0 Reprogram bit 1 0 1 1 1 1 Remains in erased state Table 7.5 Additional-Program Data Computation Table Reprogram Data Verify Data Additional-Program Data Comments 0 0 0 Additional-program bit 0 1 1 No additional programming 1 0 1 No additional programming 1 1 1 No additional programming Comments Table 7.6 Programming Time n (Number of Writes) Programming Time In Additional Programming 1 to 6 30 10 7 to 1,000 200 Note: Time shown in µs. 7.4.2 Erase/Erase-Verify When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be followed. 1. Prewriting (setting erase block data to all 0s) is not necessary. 2. Erasing is performed in block units. Make only a single-bit specification in the erase block register (EBR1). To erase multiple blocks, each block must be erased in turn. 3. The time during which the E bit is set to 1 is the flash memory erase time. 4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An overflow cycle of approximately 19.8 ms is allowed. Rev.5.00 Nov. 02, 2005 Page 102 of 500 REJ09B0027-0500 Section 7 ROM 5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two bits are B'00. Verify data can be read in longwords from the address to which a dummy write was performed. 6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is 100. 7.4.3 Interrupt Handling when Programming/Erasing Flash Memory All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed or erased, or while the boot program is executing, for the following three reasons: 1. Interrupt during programming/erasing may cause a violation of the programming or erasing algorithm, with the result that normal operation cannot be assured. 2. If interrupt exception handling starts before the vector address is written or during programming/erasing, a correct vector cannot be fetched and the CPU malfunctions. 3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be carried out. Rev.5.00 Nov. 02, 2005 Page 103 of 500 REJ09B0027-0500 Section 7 ROM Erase start SWE bit ← 1 Wait 1 µs n←1 Set EBR1 Enable WDT ESU bit ← 1 Wait 100 µs E bit ← 1 Wait 10 ms E bit ← 0 Wait 10 µs ESU bit ← 10 10 µs Disable WDT EV bit ← 1 Wait 20 µs Set block start address as verify address H'FF dummy write to verify address Wait 2 µs * n←n+1 Read verify data No Verify data + all 1s ? Increment address Yes No Last address of block ? Yes No EV bit ← 0 EV bit ← 0 Wait 4 µs Wait 4µs All erase block erased ? n ≤100 ? Yes Yes No Yes SWE bit ← 0 SWE bit ← 0 Wait 100 µs Wait 100 µs End of erasing Erase failure Note: *The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading. Figure 7.4 Erase/Erase-Verify Flowchart Rev.5.00 Nov. 02, 2005 Page 104 of 500 REJ09B0027-0500 Section 7 ROM 7.5 Program/Erase Protection There are three kinds of flash memory program/erase protection; hardware protection, software protection, and error protection. 7.5.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted because of a transition to reset, subactive mode, subsleep mode, or standby mode. Flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), and erase block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. 7.5.2 Software Protection Software protection can be implemented against programming/erasing of all flash memory blocks by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase block register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to H'00, erase protection is set for all blocks. 7.5.3 Error Protection In error protection, an error is detected when CPU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. When the following errors are detected during programming/erasing of flash memory, the FLER bit in FLMCR2 is set to 1, and the error protection state is entered. When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) Immediately after exception handling excluding a reset during programming/erasing When a SLEEP instruction is executed during programming/erasing The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be reRev.5.00 Nov. 02, 2005 Page 105 of 500 REJ09B0027-0500 Section 7 ROM entered by re-setting the P or E bit. However, PV and EV bit settings are retained, and a transition can be made to verify mode. Error protection can be cleared only by a reset. 7.6 Programmer Mode In programmer mode, a PROM programmer can be used to perform programming/erasing via a socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU device type with the on-chip 64-kbyte flash memory (FZTAT64V5). 7.7 Power-Down States for Flash Memory In user mode, the flash memory will operate in either of the following states: • Normal operating mode The flash memory can be read and written to at high speed. • Power-down operating mode The power supply circuit of flash memory can be partly halted. As a result, flash memory can be read with low power consumption. • Standby mode All flash memory circuits are halted. Table 7.7 shows the correspondence between the operating modes of this LSI and the flash memory. In subactive mode, the flash memory can be set to operate in power-down mode with the PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from power-down mode or standby mode, a period to stabilize operation of the power supply circuits that were stopped is needed. When the flash memory returns to its normal operating state, bits STS2 to STS0 in SYSCR1 must be set to provide a wait time of at least 20 µs, even when the external clock is being used. Table 7.7 Flash Memory Operating States Flash Memory Operating State LSI Operating State PDWND = 0 (Initial Value) PDWND = 1 Active mode Normal operating mode Normal operating mode Subactive mode Power-down mode Normal operating mode Sleep mode Normal operating mode Normal operating mode Subsleep mode Standby mode Standby mode Standby mode Standby mode Standby mode Rev.5.00 Nov. 02, 2005 Page 106 of 500 REJ09B0027-0500 Section 8 RAM Section 8 RAM This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit data bus, enabling two-state access by the CPU to both byte data and word data. Product Classification Flash memory version RAM Size RAM Address H8/3687F 4 kbytes H'E800 to H'EFFF, H'F780 to H'FF7F* (F-ZTAT version) H8/3684F 4 kbytes H'E800 to H'EFFF, H'F780 to H'FF7F* Mask-ROM version H8/3687 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3686 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3685 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3684 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3683 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3682 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F H8/3687N 4 kbytes H'E800 to H'EFFF, H'F780 to H'FF7F* 3 kbytes H'E800 to H'EFFF, H'FB80 to H'FF7F TM EEPROM stacked version Flash memory version Mask-ROM version Note: * When the E7 or E8 is used, area H'F780 to H'FB7F must not be accessed. RAM0500A_000120030300 Rev.5.00 Nov. 02, 2005 Page 107 of 500 REJ09B0027-0500 Section 8 RAM Rev.5.00 Nov. 02, 2005 Page 108 of 500 REJ09B0027-0500 Section 9 I/O Ports Section 9 I/O Ports The group of this LSI has forty-five general I/O ports (forty-three general I/O ports in the H8/3687N) and eight general input-only ports. Port 6 is a large current port, which can drive 20 mA (@VOL = 1.5 V) when a low level signal is output. Any of these ports can become an input port immediately after a reset. They can also be used as I/O pins of the on-chip peripheral modules or external interrupt input pins, and these functions can be switched depending on the register settings. The registers for selecting these functions can be divided into two types: those included in I/O ports and those included in each on-chip peripheral module. General I/O ports are comprised of the port control register for controlling inputs/outputs and the port data register for storing output data and can select inputs/outputs in bit units. For functions in each port, see appendix B.1, I/O Port Block Diagrams. For the execution of bitmanipulation instructions to the port control register and port data register, see section 2.8.3, Bit Manipulation Instruction. 9.1 Port 1 Port 1 is a general I/O port also functioning as IRQ interrupt input pins, an RTC output pin, a 14bit PWM output pin, a timer B1 input pin, and a timer V input pin. Figure 9.1 shows its pin configuration. P17/IRQ3/TRGV P16/IRQ2 P15/IRQ1/TMIB1 Port 1 P14/IRQ0 P12 P11/PWM P10/TMOW Figure 9.1 Port 1 Pin Configuration Port 1 has the following registers. • • • • Port mode register 1 (PMR1) Port control register 1 (PCR1) Port data register 1 (PDR1) Port pull-up control register 1 (PUCR1) Rev.5.00 Nov. 02, 2005 Page 109 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.1.1 Port Mode Register 1 (PMR1) PMR1 switches the functions of pins in port 1 and port 2. Bit Bit Name Initial Value R/W Description 7 IRQ3 0 R/W This bit selects the function of pin P17/IRQ3/TRGV. 0: General I/O port 1: IRQ3/TRGV input pin 6 IRQ2 0 R/W This bit selects the function of pin P16/IRQ2. 0: General I/O port 1: IRQ2 input pin 5 IRQ1 0 R/W This bit selects the function of pin P15/IRQ1/TMIB1. 0: General I/O port 1: IRQ1/TMIB1 input pin 4 IRQ0 0 R/W This bit selects the function of pin P14/IRQ0. 0: General I/O port 1: IRQ0 input pin 3 TXD2 0 R/W This bit selects the function of pin P72/TXD_2. 0: General I/O port 1: TXD_2 output pin 2 PWM 0 R/W This bit selects the function of pin P11/PWM. 0: General I/O port 1: PWM output pin 1 TXD 0 R/W This bit selects the function of pin P22/TXD. 0: General I/O port 1: TXD output pin 0 TMOW 0 R/W This bit selects the function of pin P10/TMOW. 0: General I/O port 1: TMOW output pin Rev.5.00 Nov. 02, 2005 Page 110 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.1.2 Port Control Register 1 (PCR1) PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1. Bit Bit Name Initial Value R/W Description 7 PCR17 0 W 6 PCR16 0 W 5 PCR15 0 W When the corresponding pin is designated in PMR1 as a general I/O pin, setting a PCR1 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 PCR14 0 W Bit 3 is a reserved bit. 3 2 PCR12 0 W 1 PCR11 0 W 0 PCR10 0 W 9.1.3 Port Data Register 1 (PDR1) PDR1 is a general I/O port data register of port 1. Bit Bit Name Initial Value R/W Description 7 P17 0 R/W PDR1 stores output data for port 1 pins. 6 P16 0 R/W 5 P15 0 R/W 4 P14 0 R/W If PDR1 is read while PCR1 bits are set to 1, the value stored in PDR1 are read. If PDR1 is read while PCR1 bits are cleared to 0, the pin states are read regardless of the value stored in PDR1. 3 1 Bit 3 is a reserved bit. This bit is always read as 1. 2 P12 0 R/W 1 P11 0 R/W 0 P10 0 R/W Rev.5.00 Nov. 02, 2005 Page 111 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.1.4 Port Pull-Up Control Register 1 (PUCR1) PUCR1 controls the pull-up MOS in bit units of the pins set as the input ports. Bit Bit Name Initial Value R/W Description 7 PUCR17 0 R/W 6 PUCR16 0 R/W 5 PUCR15 0 R/W Only bits for which PCR1 is cleared are valid. The pull-up MOS of P17 to P14 and P12 to P10 pins enter the onstate when these bits are set to 1, while they enter the off-state when these bits are cleared to 0. 4 PUCR14 0 R/W Bit 3 is a reserved bit. This bit is always read as 1. 3 1 2 PUCR12 0 R/W 1 PUCR11 0 R/W 0 PUCR10 0 R/W 9.1.5 Pin Functions The correspondence between the register specification and the port functions is shown below. P17/IRQ3/TRGV pin Register PMR1 PCR1 Bit Name IRQ3 PCR17 Pin Function Setting value 0 0 P17 input pin 1 P17 output pin X IRQ3 input/TRGV input pin 1 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 112 of 500 REJ09B0027-0500 Section 9 I/O Ports P16/IRQ2 pin Register PMR1 PCR1 Bit Name IRQ2 PCR16 Pin Function Setting value 0 0 P16 input pin 1 P16 output pin X IRQ2 input pin 1 Legend: X: Don't care. P15/IRQ1/TMIB1 pin Register PMR1 PCR1 Bit Name IRQ1 PCR15 Pin Function Setting value 0 0 P15 input pin 1 P15 output pin X IRQ1 input/TMIB1 input pin 1 Legend: X: Don't care. P14/IRQ0 pin Register PMR1 PCR1 Bit Name IRQ0 PCR14 Pin Function Setting value 0 0 P14 input pin 1 P14 output pin X IRQ0 input pin 1 Legend: X: Don't care. P12 pin Register PCR1 Bit Name PCR12 Pin Function Setting value 0 P12 input pin 1 P12 output pin Rev.5.00 Nov. 02, 2005 Page 113 of 500 REJ09B0027-0500 Section 9 I/O Ports P11/PWM pin Register PMR1 PCR1 Bit Name PWM PCR11 Pin Function Setting value 0 0 P11 input pin 1 P11 output pin X PWM output pin 1 Legend: X: Don't care. P10/TMOW pin Register PMR1 PCR1 Bit Name TMOW PCR10 Pin Function Setting value 0 0 P10 input pin 1 P10 output pin X TMOW output pin 1 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 114 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.2 Port 2 Port 2 is a general I/O port also functioning as SCI3 I/O pins. Each pin of the port 2 is shown in figure 9.2. The register settings of PMR1and SCI3 have priority for functions of the pins for both uses. P24 P23 Port 2 P22/TXD P21/RXD P20/SCK3 Figure 9.2 Port 2 Pin Configuration Port 2 has the following registers. • Port control register 2 (PCR2) • Port data register 2 (PDR2) • Port mode register 3 (PMR3) 9.2.1 Port Control Register 2 (PCR2) PCR2 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 2. Bit Bit Name Initial Value R/W Description 7 to 5 Reserved 4 PCR24 0 W 3 PCR23 0 W 2 PCR22 0 W When each of the port 2 pins P24 to P20 functions as a general I/O port, setting a PCR2 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 1 PCR21 0 W 0 PCR20 0 W Rev.5.00 Nov. 02, 2005 Page 115 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.2.2 Port Data Register 2 (PDR2) PDR2 is a general I/O port data register of port 2. Bit Bit Name Initial Value R/W Description 7 to 5 All 1 Reserved These bits are always read as 1. 4 P24 0 R/W PDR2 stores output data for port 2 pins. 3 P23 0 R/W 2 P22 0 R/W 1 P21 0 R/W If PDR2 is read while PCR2 bits are set to 1, the value stored in PDR2 is read. If PDR2 is read while PCR2 bits are cleared to 0, the pin states are read regardless of the value stored in PDR2. 0 P20 0 R/W 9.2.3 Port Mode Register 3 (PMR3) PMR3 selects the CMOS output or NMOS open-drain output for port 2. Bit Bit Name Initial Value R/W Description 7 to 5 All 0 Reserved These bits are always read as 0. 4 POF24 0 R/W 3 POF23 0 R/W When the bit is set to 1, the corresponding pin is cut off by PMOS and it functions as the NMOS open-drain output. When cleared to 0, the pin functions as the CMOS output. 2 to 0 All 1 Reserved These bits are always read as 1. Rev.5.00 Nov. 02, 2005 Page 116 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.2.4 Pin Functions The correspondence between the register specification and the port functions is shown below. P24 pin Register PCR2 Bit Name PCR24 Pin Function Setting Value 0 P24 input pin 1 P24 output pin P23 pin Register PCR2 Bit Name PCR23 Pin Function Setting Value 0 P23 input pin 1 P23 output pin Register PMR1 PCR2 Bit Name TXD PCR22 Pin Function Setting Value 0 0 P22 input pin 1 P22 output pin X TXD output pin P22/TXD pin 1 Legend: X: Don't care. P21/RXD pin Register SCR3 PCR2 Bit Name RE PCR21 Pin Function Setting Value 0 0 P21 input pin 1 P21 output pin X RXD input pin 1 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 117 of 500 REJ09B0027-0500 Section 9 I/O Ports P20/SCK3 pin Register SCR3 Bit Name CKE1 Setting Value 0 SMR PCR2 CKE0 COM PCR20 Pin Function 0 0 0 P20 input pin 1 P20 output pin 0 0 1 X SCK3 output pin 0 1 X X SCK3 output pin 1 X X X SCK3 input pin Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 118 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.3 Port 3 Port 3 is a general I/O port. Each pin of the port 3 is shown in figure 9.3. P37 P36 P35 P34 Port 3 P33 P32 P31 P30 Figure 9.3 Port 3 Pin Configuration Port 3 has the following registers. • Port control register 3 (PCR3) • Port data register 3 (PDR3) 9.3.1 Port Control Register 3 (PCR3) PCR3 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 3. Bit Bit Name Initial Value R/W Description 7 PCR37 0 W 6 PCR36 0 W 5 PCR35 0 W Setting a PCR3 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 PCR34 0 W 3 PCR33 0 W 2 PCR32 0 W 1 PCR31 0 W 0 PCR30 0 W Rev.5.00 Nov. 02, 2005 Page 119 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.3.2 Port Data Register 3 (PDR3) PDR3 is a general I/O port data register of port 3. Bit Bit Name Initial Value R/W Description 7 P37 0 R/W PDR3 stores output data for port 3 pins. 6 P36 0 R/W 5 P35 0 R/W 4 P34 0 R/W If PDR3 is read while PCR3 bits are set to 1, the value stored in PDR3 is read. If PDR3 is read while PCR3 bits are cleared to 0, the pin states are read regardless of the value stored in PDR3. 3 P33 0 R/W 2 P32 0 R/W 1 P31 0 R/W 0 P30 0 R/W 9.3.3 Pin Functions The correspondence between the register specification and the port functions is shown below. P37 pin Register PCR3 Bit Name PCR37 Pin Function Setting Value 0 P37 input pin 1 P37 output pin P36 pin Register PCR3 Bit Name PCR36 Pin Function Setting Value 0 P36 input pin 1 P36 output pin Rev.5.00 Nov. 02, 2005 Page 120 of 500 REJ09B0027-0500 Section 9 I/O Ports P35 pin Register PCR3 Bit Name PCR35 Pin Function Setting Value 0 P35 input pin 1 P35 output pin P34 pin Register PCR3 Bit Name PCR34 Pin Function Setting Value 0 P34 input pin 1 P34 output pin P33 pin Register PCR3 Bit Name PCR33 Pin Function Setting Value 0 P33 input pin 1 P33 output pin P32 pin Register PCR3 Bit Name PCR32 Pin Function Setting Value 0 P32 input pin 1 P32 output pin P31 pin Register PCR3 Bit Name PCR31 Pin Function Setting Value 0 P31 input pin 1 P31 output pin Rev.5.00 Nov. 02, 2005 Page 121 of 500 REJ09B0027-0500 Section 9 I/O Ports P30 pin Register PCR3 Bit Name PCR30 Pin Function Setting Value 0 P30 input pin 1 P30 output pin 9.4 Port 5 Port 5 is a general I/O port also functioning as an I2C bus interface I/O pin, an A/D trigger input pin, and wakeup interrupt input pin. Each pin of the port 5 is shown in figure 9.4. The register setting of the I2C bus interface register has priority for functions of the pins P57/SCL and P56/SDA. Since the output buffer for pins P56 and P57 has the NMOS push-pull structure, it differs from an output buffer with the CMOS structure in the high-level output characteristics (see section 23, Electrical Characteristics). H8/3687 Port 5 H8/3687N P57/SCL SCL P56/SDA SDA P55/WKP5/ADTRG P55/WKP5/ADTRG P54/WKP4 Port 5 P53/WKP3 P52/WKP2 P52/WKP2 P51/WKP1 P51/WKP1 P50/WKP0 P50/WKP0 Figure 9.4 Port 5 Pin Configuration Port 5 has the following registers. • • • • Port mode register 5 (PMR5) Port control register 5 (PCR5) Port data register 5 (PDR5) Port pull-up control register 5 (PUCR5) Rev.5.00 Nov. 02, 2005 Page 122 of 500 REJ09B0027-0500 P54/WKP4 P53/WKP3 Section 9 I/O Ports 9.4.1 Port Mode Register 5 (PMR5) PMR5 switches the functions of pins in port 5. Bit Bit Name Initial Value R/W Description 7 POF57 0 R/W 6 POF56 0 R/W When the bit is set to 1, the corresponding pin is cut off by PMOS and it functions as the NMOS open-drain output. When cleared to 0, the pin functions as the CMOS output. 5 WKP5 0 R/W This bit selects the function of pin P55/WKP5/ADTRG. 0: General I/O port 1: WKP5/ADTRG input pin 4 WKP4 0 R/W This bit selects the function of pin P54/WKP4. 0: General I/O port 1: WKP4 input pin 3 WKP3 0 R/W This bit selects the function of pin P53/WKP3. 0: General I/O port 1: WKP3 input pin 2 WKP2 0 R/W This bit selects the function of pin P52/WKP2. 0: General I/O port 1: WKP2 input pin 1 WKP1 0 R/W This bit selects the function of pin P51/WKP1. 0: General I/O port 1: WKP1 input pin 0 WKP0 0 R/W This bit selects the function of pin P50/WKP0. 0: General I/O port 1: WKP0 input pin Rev.5.00 Nov. 02, 2005 Page 123 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.4.2 Port Control Register 5 (PCR5) PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5. Bit Bit Name Initial Value R/W Description 7 PCR57 0 W 6 PCR56 0 W 5 PCR55 0 W When each of the port 5 pins P57 to P50 functions as a general I/O port, setting a PCR5 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 PCR54 0 W 3 PCR53 0 W 2 PCR52 0 W 1 PCR51 0 W 0 PCR50 0 W 9.4.3 Port Data Register 5 (PDR5) Note: The PCR57 and PCR56 bits should not be set to 1 in the H8/3687N. PDR5 is a general I/O port data register of port 5. Bit Bit Name Initial Value R/W Description 7 P57 0 R/W Stores output data for port 5 pins. 6 P56 0 R/W 5 P55 0 R/W 4 P54 0 R/W If PDR5 is read while PCR5 bits are set to 1, the value stored in PDR5 are read. If PDR5 is read while PCR5 bits are cleared to 0, the pin states are read regardless of the value stored in PDR5. 3 P53 0 R/W 2 P52 0 R/W 1 P51 0 R/W 0 P50 0 R/W Rev.5.00 Nov. 02, 2005 Page 124 of 500 REJ09B0027-0500 Note: The P57 and P56 bits should not be set to 1 in the H8/3687N. Section 9 I/O Ports 9.4.4 Port Pull-Up Control Register 5 (PUCR5) PUCR5 controls the pull-up MOS in bit units of the pins set as the input ports. Bit Bit Name Initial Value R/W Description 7, 6 All 0 Reserved These bits are always read as 0. 5 PUCR55 0 R/W 4 PUCR54 0 R/W 3 PUCR53 0 R/W 2 PUCR52 0 R/W 1 PUCR51 0 R/W 0 PUCR50 0 R/W 9.4.5 Pin Functions Only bits for which PCR5 is cleared are valid. The pull-up MOS of the corresponding pins enter the on-state when these bits are set to 1, while they enter the off-state when these bits are cleared to 0. The correspondence between the register specification and the port functions is shown below. P57/SCL pin Register ICCR1 PCR5 Bit Name ICE PCR57 Pin Function Setting Value 0 0 P57 input pin 1 P57 output pin X SCL I/O pin 1 Legend: X: Don't care. SCL performs the NMOS open-drain output, that enables a direct bus drive. Rev.5.00 Nov. 02, 2005 Page 125 of 500 REJ09B0027-0500 Section 9 I/O Ports P56/SDA pin Register ICCR1 PCR5 Bit Name ICE PCR56 Pin Function Setting Value 0 0 P56 input pin 1 P56 output pin X SDA I/O pin 1 Legend: X: Don't care. SDA performs the NMOS open-drain output, that enables a direct bus drive. P55/WKP5/ADTRG pin Register PMR5 PCR5 Bit Name WKP5 PCR55 Pin Function Setting Value 0 0 P55 input pin 1 P55 output pin X WKP5/ADTRG input pin 1 Legend: X: Don't care. P54/WKP4 pin Register PMR5 PCR5 Bit Name WKP4 PCR54 Pin Function Setting Value 0 0 P54 input pin 1 P54 output pin X WKP4 input pin 1 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 126 of 500 REJ09B0027-0500 Section 9 I/O Ports P53/WKP3 pin Register PMR5 PCR5 Bit Name WKP3 PCR53 Pin Function Setting Value 0 0 P53 input pin 1 P53 output pin X WKP3 input pin 1 Legend: X: Don't care. P52/WKP2 pin Register PMR5 PCR5 Bit Name WKP2 PCR52 Pin Function Setting Value 0 0 P52 input pin 1 P52 output pin X WKP2 input pin 1 Legend: X: Don't care. P51/WKP1 pin Register PMR5 PCR5 Bit Name WKP1 PCR51 Pin Function Setting Value 0 0 P51 input pin 1 P51 output pin X WKP1 input pin 1 Legend: X: Don't care. P50/WKP0 pin Register PMR5 PCR5 Bit Name WKP0 PCR50 Pin Function Setting Value 0 0 P50 input pin 1 P50 output pin X WKP0 input pin 1 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 127 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.5 Port 6 Port 6 is a general I/O port also functioning as a timer Z I/O pin. Each pin of the port 6 is shown in figure 9.5. The register setting of the timer Z has priority for functions of the pins for both uses. P67/FTIOD1 P66/FTIOC1 P65/FTIOB1 P64/FTIOA1 Port 6 P63/FTIOD0 P62/FTIOC0 P61/FTIOB0 P60/FTIOA0 Figure 9.5 Port 6 Pin Configuration Port 6 has the following registers. • Port control register 6 (PCR6) • Port data register 6 (PDR6) 9.5.1 Port Control Register 6 (PCR6) PCR6 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 6. Bit Bit Name Initial Value R/W Description 7 PCR67 0 W 6 PCR66 0 W 5 PCR65 0 W When each of the port 6 pins P67 to P60 functions as a general I/O port, setting a PCR6 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 PCR64 0 W 3 PCR63 0 W 2 PCR62 0 W 1 PCR61 0 W 0 PCR60 0 W Rev.5.00 Nov. 02, 2005 Page 128 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.5.2 Port Data Register 6 (PDR6) PDR6 is a general I/O port data register of port 6. Bit Bit Name Initial Value R/W Description 7 P67 0 R/W Stores output data for port 6 pins. 6 P66 0 R/W 5 P65 0 R/W 4 P64 0 R/W If PDR6 is read while PCR6 bits are set to 1, the value stored in PDR6 are read. If PDR6 is read while PCR6 bits are cleared to 0, the pin states are read regardless of the value stored in PDR6. 3 P63 0 R/W 2 P62 0 R/W 1 P61 0 R/W 0 P60 0 R/W 9.5.3 Pin Functions The correspondence between the register specification and the port functions is shown below. P67/FTIOD1 pin Register TOER TFCR Bit Name ED1 CMD1 and IOD2 to CMD0 PWMD1 IOD0 PCR67 Pin Function 00 0 P67 input/FTIOD1 input pin 1 P67 output pin X FTIOD1 output pin Setting Value 1 0 00 TPMR 0 TIORC1 000 or 1XX 0 001 or 01X 1 XXX Other than X 00 XXX PCR6 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 129 of 500 REJ09B0027-0500 Section 9 I/O Ports P66/FTIOC1 pin Register TOER TFCR Bit Name EC1 CMD1 and IOC2 to CMD0 PWMC1 IOC0 PCR66 Pin Function 00 0 P66 input/FTIOC1 input pin 1 P66 output pin X FTIOC1 output pin Setting Value 1 0 00 TPMR 0 TIORC1 000 or 1XX 0 001 or 01X 1 XXX Other than X 00 XXX TIORA1 PCR6 Legend: X: Don't care. P65/FTIOB1 pin Register TOER TFCR TPMR Bit Name EB1 CMD1 to CMD0 IOB2 to PWMB1 IOB0 PCR65 Pin Function 00 0 0 P65 input/FTIOB1 input pin 1 P65 output pin X FTIOB1 output pin Setting Value 1 0 00 0 001 or 01X 1 XXX Other than X 00 XXX Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 130 of 500 REJ09B0027-0500 000 or 1XX PCR6 Section 9 I/O Ports P64/FTIOA1 pin Register TOER TFCR TIORA1 PCR6 Bit Name EB1 CMD1 to CMD0 IOA2 to IOA0 PCR64 Pin Function XX 000 or 0 P64 input/FTIOA1 input pin 1XX 1 P64 output pin 00 001 or 01X X FTIOA1 output pin TIORC0 PCR6 Setting Value 1 0 Legend: X: Don't care. P63/FTIOD0 pin Register TOER TFCR TPMR Bit Name ED0 CMD1 to CMD0 IOD2 to PWMD0 IOD0 PCR63 Pin Function 00 0 0 P63 input/FTIOD0 input pin 1 P63 output pin X FTIOD0 output pin Setting Value 1 0 00 000 or 1XX 0 001 or 01X 1 XXX Other than X 00 XXX Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 131 of 500 REJ09B0027-0500 Section 9 I/O Ports P62/FTIOC0 pin Register TOER TFCR TPMR Bit Name EC0 CMD1 to CMD0 IOC2 to PWMC0 IOC0 PCR62 Pin Function 00 0 0 P62 input/FTIOC0 input pin 1 P62 output pin X FTIOC0 output pin Setting Value 1 0 00 TIORC0 000 or 1XX 0 001 or 01X 1 XXX Other than X 00 XXX TIORA0 PCR6 Legend: X: Don't care. P61/FTIOB0 pin Register TOER TFCR TPMR Bit Name EB0 CMD1 to CMD0 IOB2 to PWMB0 IOB0 PCR61 Pin Function 00 0 0 P61 input/FTIOB0 input pin 1 P61 output pin X FTIOB0 output pin Setting Value 1 0 00 0 001 or 01X 1 XXX Other than X 00 XXX Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 132 of 500 REJ09B0027-0500 000 or 1XX PCR6 Section 9 I/O Ports P60/FTIOA0 pin Register TOER TFCR TFCR TIORA0 PCR6 Bit Name EA0 CMD1 to CMD0 STCLK IOA2 to IOA0 PCR60 Pin Function XX X 000 or 0 P60 input/FTIOA0 input pin 1XX 1 P60 output pin 001 or 01X X FTIOA0 output pin Setting Value 1 0 00 0 Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 133 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.6 Port 7 Port 7 is a general I/O port also functioning as a timer V I/O pin and SCI3_2 I/O pin. Each pin of the port 7 is shown in figure 9.6. The register settings of the timer V and SCI3_2 have priority for functions of the pins for both uses. P76/TMOV P75/TMCIV P74/TMRIV Port 7 P72/TXD_2 P71/RXD_2 P70/SCK3_2 Figure 9.6 Port 7 Pin Configuration Port 7 has the following registers. • Port control register 7 (PCR7) • Port data register 7 (PDR7) 9.6.1 Port Control Register 7 (PCR7) PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7. Bit Bit Name Initial Value R/W Description 7 6 PCR76 0 W 5 PCR75 0 W When each of the port 7 pins P76 to P74 and P72 to P70 functions as a general I/O port, setting a PCR7 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 PCR74 0 W Bits 7 and 3 are reserved bits. 3 2 PCR72 0 W 1 PCR71 0 W 0 PCR70 0 W Rev.5.00 Nov. 02, 2005 Page 134 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.6.2 Port Data Register 7 (PDR7) PDR7 is a general I/O port data register of port 7. Bit Bit Name Initial Value R/W Description 7 1 Stores output data for port 7 pins. 6 P76 0 R/W 5 P75 0 R/W 4 P74 0 R/W If PDR7 is read while PCR7 bits are set to 1, the value stored in PDR7 are read. If PDR7 is read while PCR7 bits are cleared to 0, the pin states are read regardless of the value stored in PDR7. 3 1 2 P72 0 R/W 1 P71 0 R/W 0 P70 0 R/W 9.6.3 Pin Functions Bits 7 and 3 are reserved bits. These bits are always read as 1. The correspondence between the register specification and the port functions is shown below. P76/TMOV pin Register TCSRV Bit Name OS3 to OS0 PCR76 Pin Function Setting Value 0000 0 P76 input pin 1 P76 output pin X TMOV output pin Other than the above values PCR7 Legend: X: Don't care. P75/TMCIV pin Register PCR7 Bit Name PCR75 Pin Function Setting Value 0 P75 input/TMCIV input pin 1 P75 output/TMCIV input pin Rev.5.00 Nov. 02, 2005 Page 135 of 500 REJ09B0027-0500 Section 9 I/O Ports P74/TMRIV pin Register PCR7 Bit Name PCR74 Pin Function Setting Value 0 P74 input/TMRIV input pin 1 P74 output/TMRIV input pin P72/TXD_2 pin Register PMR1 PCR7 Bit Name TXD2 PCR72 Pin Function Setting Value 0 0 P72 input pin 1 P72 output pin X TXD_2 output pin 1 Legend: X: Don't care. P71/RXD_2 pin Register SCR3_2 PCR7 Bit Name RE PCR71 Pin Function Setting Value 0 0 P71 input pin 1 P71 output pin X RXD_2 input pin 1 Legend: X: Don't care. P70/SCK3_2 pin Register SCR3_2 Bit Name CKE1 Setting Value 0 SMR2 PCR7 CKE0 COM PCR70 Pin Function 0 0 0 P70 input pin 1 P70 output pin 0 0 1 X SCK3_2 output pin 0 1 X X SCK3_2 output pin 1 X X X SCK3_2 input pin Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 136 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.7 Port 8 Port 8 is a general I/O port. Each pin of the port 8 is shown in figure 9.7. P87 Port 8 P86 P85 Figure 9.7 Port 8 Pin Configuration Port 8 has the following registers. • Port control register 8 (PCR8) • Port data register 8 (PDR8) 9.7.1 Port Control Register 8 (PCR8) PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8. Bit Bit Name Initial Value R/W Description 7 PCR87 0 W 6 PCR86 0 W 5 PCR85 0 W When each of the port 8 pins P87 to P85 functions as a general I/O port, setting a PCR8 bit to 1 makes the corresponding pin an output port, while clearing the bit to 0 makes the pin an input port. 4 to 0 9.7.2 Port Data Register 8 (PDR8) Reserved PDR8 is a general I/O port data register of port 8. Bit Bit Name Initial Value R/W Description 7 P87 0 R/W PDR8 stores output data for port 8 pins. 6 P86 0 R/W 5 P85 0 R/W If PDR8 is read while PCR8 bits are set to 1, the value stored in PDR8 is read. If PDR8 is read while PCR8 bits are cleared to 0, the pin states are read regardless of the value stored in PDR8. 4 to 0 All 1 Reserved These bits are always read as 1. Rev.5.00 Nov. 02, 2005 Page 137 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.7.3 Pin Functions The correspondence between the register specification and the port functions is shown below. P87 pin Register PCR8 Bit Name PCR87 Pin Function Setting Value 0 P87 input pin 1 P87 output pin P86 pin Register PCR8 Bit Name PCR86 Pin Function Setting Value 0 P86 input pin 1 P86 output pin P85 pin Register PCR8 Bit Name PCR85 Pin Function Setting Value 0 P85 input pin 1 P85 output pin Rev.5.00 Nov. 02, 2005 Page 138 of 500 REJ09B0027-0500 Section 9 I/O Ports 9.8 Port B Port B is an input port also functioning as an A/D converter analog input pin. Each pin of the port B is shown in figure 9.8. PB7/AN7 PB6/AN6 PB5/AN5 Port B PB4/AN4 PB3/AN3 PB2/AN2 PB1/AN1 PB0/AN0 Figure 9.8 Port B Pin Configuration Port B has the following register. • Port data register B (PDRB) 9.8.1 Port Data Register B (PDRB) PDRB is a general input-only port data register of port B. Bit Bit Name Initial Value R/W Description 7 PB7 R 6 PB6 R The input value of each pin is read by reading this register. 5 PB5 R 4 PB4 R 3 PB3 R 2 PB2 R 1 PB1 R 0 PB0 R However, if a port B pin is designated as an analog input channel by ADCSR in A/D converter, 0 is read. Rev.5.00 Nov. 02, 2005 Page 139 of 500 REJ09B0027-0500 Section 9 I/O Ports Rev.5.00 Nov. 02, 2005 Page 140 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) Section 10 Realtime Clock (RTC) The realtime clock (RTC) is a timer used to count time ranging from a second to a week. Figure 10.1 shows the block diagram of the RTC. 10.1 • • • • • • • Features Counts seconds, minutes, hours, and day-of-week Start/stop function Reset function Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes Periodic (seconds, minutes, hours, days, and weeks) interrupts 8-bit free running counter Selection of clock source RTC3000A_000120030300 Rev.5.00 Nov. 02, 2005 Page 141 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) RTCCSR PSS RSECDR 1/4 RMINDR RHRDR TMOW Clock count control circuit RWKDR Internal data bus 32-kHz oscillator circuit RTCCR1 RTCCR2 Interrupt control circuit [Legend] RTCCSR: RSECDR: RMINDR: RHRDR: RWKDR: RTCCR1: RTCCR2: PSS: Clock source select register Second date register/free running counter data register Minute date register Hour date register Day-of-week date register RTC control register 1 RTC control register 2 Prescaler S Figure 10.1 Block Diagram of RTC 10.2 Input/Output Pin Table 10.1 shows the RTC input/output pin. Table 10.1 Pin Configuration Name Abbreviation I/O Function Clock output TMOW RTC divided clock output Output Rev.5.00 Nov. 02, 2005 Page 142 of 500 REJ09B0027-0500 Interrupt Section 10 Realtime Clock (RTC) 10.3 Register Descriptions The RTC has the following registers. • • • • • • • Second data register/free running counter data register (RSECDR) Minute data register (RMINDR) Hour data register (RHRDR) Day-of-week data register (RWKDR) RTC control register 1 (RTCCR1) RTC control register 2 (RTCCR2) Clock source select register (RTCCSR) 10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) RSECDR counts the BCD-coded second value. The setting range is decimal 00 to 59. It is an 8-bit read register used as a counter, when it operates as a free running counter. For more information on reading seconds, minutes, hours, and day-of-week, see section 10.4.3, Data Reading Procedure. Bit Bit Name Initial Value R/W Description 7 BSY — R RTC busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 SC12 — R/W Counting ten’s position of seconds 5 SC11 — R/W Counts on 0 to 5 for 60-second counting. 4 SC10 — R/W 3 SC03 — R/W Counting one’s position of seconds 2 SC02 — R/W 1 SC01 — R/W Counts on 0 to 9 once per second. When a carry is generated, 1 is added to the ten’s position. 0 SC00 — R/W Rev.5.00 Nov. 02, 2005 Page 143 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.2 Minute Data Register (RMINDR) RMINDR counts the BCD-coded minute value on the carry generated once per minute by the RSECDR counting. The setting range is decimal 00 to 59. Bit Bit Name Initial Value R/W Description 7 BSY — R RTC busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 MN12 — R/W Counting ten’s position of minutes 5 MN11 — R/W Counts on 0 to 5 for 60-minute counting. 4 MN10 — R/W 3 MN03 — R/W Counting one’s position of minutes 2 MN02 — R/W 1 MN01 — R/W Counts on 0 to 9 once per minute. When a carry is generated, 1 is added to the ten’s position. 0 MN00 — R/W Rev.5.00 Nov. 02, 2005 Page 144 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.3 Hour Data Register (RHRDR) RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR. The setting range is either decimal 00 to 11 or 00 to 23 by the selection of the 12/24 bit in RTCCR1. Bit Bit Name Initial Value R/W Description 7 BSY — R RTC busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 — 0 — Reserved This bit is always read as 0. 5 HR11 — R/W Counting ten’s position of hours 4 HR10 — R/W Counts on 0 to 2 for ten’s position of hours. 3 HR03 — R/W Counting one’s position of hours 2 HR02 — R/W 1 HR01 — R/W Counts on 0 to 9 once per hour. When a carry is generated, 1 is added to the ten’s position. 0 HR00 — R/W Rev.5.00 Nov. 02, 2005 Page 145 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.4 Day-of-Week Data Register (RWKDR) RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by RHRDR. The setting range is decimal 0 to 6 using bits WK2 to WK0. Bit Bit Name Initial Value R/W Description 7 BSY — R RTC busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 to 3 — All 0 — Reserved These bits are always read as 0. 2 WK2 — R/W Day-of-week counting 1 WK1 — R/W Day-of-week is indicated with a binary code 0 WK0 — R/W 000: Sunday 001: Monday 010: Tuesday 011: Wednesday 100: Thursday 101: Friday 110: Saturday 111: Reserved (setting prohibited) Rev.5.00 Nov. 02, 2005 Page 146 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.5 RTC Control Register 1 (RTCCR1) RTCCR1 controls start/stop and reset of the clock timer. For the definition of time expression, see figure 10.2. Bit Bit Name Initial Value R/W Description 7 RUN — R/W RTC operation start 0: Stops RTC operation 1: Starts RTC operation 6 12/24 — R/W Operating mode 0: RTC operates in 12-hour mode. RHRDR counts on 0 to 11. 1: RTC operates in 24-hour mode. RHRDR counts on 0 to 23. 5 PM — R/W A.m./p.m. 0: Indicates a.m. when RTC is in the 12-hour mode. 1: Indicates p.m. when RTC is in the 12-hour mode. 4 RST 0 R/W Reset 0: Normal operation 1: Resets registers and control circuits except RTCCSR and this bit. Clear this bit to 0 after having been set to 1. 3 to 0 — All 0 — Reserved These bits are always read as 0. Noon 24-hour count 0 12-hour count 0 PM 1 1 2 2 3 3 4 4 5 6 7 5 6 7 0 (Morning) 8 8 9 10 11 12 13 14 15 16 17 9 10 11 0 1 2 3 4 5 1 (Afternoon) 24-hour count 18 19 20 21 22 23 0 12-hour count 6 7 8 9 10 11 0 1 (Afternoon) 0 PM Figure 10.2 Definition of Time Expression Rev.5.00 Nov. 02, 2005 Page 147 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.6 RTC Control Register 2 (RTCCR2) RTCCR2 controls RTC periodic interrupts of weeks, days, hours, minutes, and seconds. Enabling interrupts of weeks, days, hours, minutes, and seconds sets the IRRTA flag to 1 in the interrupt flag register 1 (IRR1) when an interrupt occurs. It also controls an overflow interrupt of a free running counter when RTC operates as a free running counter. Bit Bit Name Initial Value R/W Description 7, 6 — All 0 — Reserved These bits are always read as 0. 5 FOIE — R/W Free Running Counter Overflow Interrupt Enable 0: Disables an overflow interrupt 1: Enables an overflow interrupt 4 WKIE — R/W Week Periodic Interrupt Enable 0: Disables a week periodic interrupt 1: Enables a week periodic interrupt 3 DYIE — R/W Day Periodic Interrupt Enable 0: Disables a day periodic interrupt 1: Enables a day periodic interrupt 2 HRIE — R/W Hour Periodic Interrupt Enable 0: Disables an hour periodic interrupt 1: Enables an hour periodic interrupt 1 MNIE — R/W Minute Periodic Interrupt Enable 0: Disables a minute periodic interrupt 1: Enables a minute periodic interrupt 0 SEIE — R/W Second Periodic Interrupt Enable 0: Disables a second periodic interrupt 1: Enables a second periodic interrupt Rev.5.00 Nov. 02, 2005 Page 148 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.3.7 Clock Source Select Register (RTCCSR) RTCCSR selects clock source. A free running counter controls start/stop of counter operation by the RUN bit in RTCCR1. When a clock other than 32.768 kHz is selected, the RTC is disabled and operates as an 8-bit free running counter. When the RTC operates as an 8-bit free running counter, RSECDR enables counter values to be read. An interrupt can be generated by setting 1 to the FOIE bit in RTCCR2 and enabling an overflow interrupt of the free running counter. A clock in which the system clock is divided by 32, 16, 8, or 4 is output in active or sleep mode. Bit Bit Name Initial Value R/W Description 7 — 0 — Reserved 6 RCS6 0 R/W Clock output selection 5 RCS5 0 R/W Selects a clock output from the TMOW pin when setting TMOW in PMR1 to 1. This bit is always read as 0. 00: φ/4 01: φ/8 10: φ/16 11: φ/32 4 — 0 — Reserved 3 RCS3 1 R/W Clock source selection 2 RCS2 0 R/W 0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 1 RCS1 0 R/W 0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 0 RCS0 0 R/W 0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation This bit is always read as 0. 0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation 1XXX: 32.768 kHz⋅⋅⋅⋅⋅RTC operation Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 149 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.4 Operation 10.4.1 Initial Settings of Registers after Power-On The RTC registers that store second, minute, hour, and day-of week data are not reset by a RES input. Therefore, all registers must be set to their initial values after power-on. Once the register setting are made, the RTC provides an accurate time as long as power is supplied regardless of a RES input. 10.4.2 Initial Setting Procedure Figure 10.3 shows the procedure for the initial setting of the RTC. To set the RTC again, also follow this procedure. RUN in RTCCR1 = 0 RTC operation is stopped. RST in RTCCR1 = 1 RST in RTCCR1 = 0 Set RTCCSR, RSECDR, RMINDR, RHRDR, RWKDR, 12/24 in RTCCR1, and PM RUN in RTCCR1 = 1 RTC registers and clock count controller are reset. Clock output and clock source are selected and second, minute, hour, day-of-week, operating mode, and a.m/p.m are set. RTC operation is started. Figure 10.3 Initial Setting Procedure Rev.5.00 Nov. 02, 2005 Page 150 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.4.3 Data Reading Procedure When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read, the data obtained may not be correct, and so the time data must be read again. Figure 10.4 shows an example in which correct data is not obtained. In this example, since only RSECDR is read after data update, about 1-minute inconsistency occurs. To avoid reading in this timing, the following processing must be performed. 1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY bit is set to 1, the registers are updated, and the BSY bit is cleared to 0. 2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after the IRRTA flag in IRR1 is set to 1 and the BSY bit is confirmed to be 0. 3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is no change in the read data, the read data is used. Before update RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59 Processing flow BSY bit = 0 (1) Day-of-week data register read H'03 (2) Hour data register read H'13 (3) Minute data register read H'46 BSY bit -> 1 (under data update) After update RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00 BSY bit -> 0 (4) Second data register read H'00 Figure 10.4 Example: Reading of Inaccurate Time Data Rev.5.00 Nov. 02, 2005 Page 151 of 500 REJ09B0027-0500 Section 10 Realtime Clock (RTC) 10.5 Interrupt Source There are five kinds of RTC interrupts: week interrupts, day interrupts, hour interrupts, minute interrupts, and second interrupts. When using an interrupt, initiate the RTC last after other registers are set. Do not set multiple interrupt enable bits in RTCCR2 simultaneously to 1. When an interrupt request of the RTC occurs, the IRRTA flag in IRR1 is set to 1. When clearing the flag, write 0. Table 10.2 Interrupt Source Interrupt Name Interrupt Source Interrupt Enable Bit Overflow interrupt Occurs when the free running counter is overflown. FOIE Week periodic interrupt Occurs every week when the day-of-week date WKIE register value becomes 0. Day periodic interrupt Occurs every day when the day-of-week date register is counted. Hour periodic interrupt Occurs every hour when the hour date register HRIE is counted. Minute periodic interrupt Occurs every minute when the minute date register is counted. MNIE Second periodic interrupt Occurs every second when the second date register is counted. SCIE Rev.5.00 Nov. 02, 2005 Page 152 of 500 REJ09B0027-0500 DYIE Section 11 Timer B1 Section 11 Timer B1 Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two operating modes, interval and auto reload. Figure 11.1 shows a block diagram of timer B1. 11.1 Features • Selection of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, and φ/4) or an external clock (can be used to count external events). • An interrupt is generated when the counter overflows. φ PSS TCB1 TMIB1 Internal data bus TMB1 TLB1 [Legend] TMB1: TCB1: TLB1: IRRTB1: PSS: TMIB1: Timer mode register B1 Timer counter B1 Timer load register B1 Timer B1 interrupt request flag Prescaler S Timer B1 event input IRRTB1 Figure 11.1 Block Diagram of Timer B1 TIM08B0A_000020020200 Rev.5.00 Nov. 02, 2005 Page 153 of 500 REJ09B0027-0500 Section 11 Timer B1 11.2 Input/Output Pin Table 11.1 shows the timer B1 pin configuration. Table 11.1 Pin Configuration Name Abbreviation I/O Function Timer B1 event input TMIB1 Input Event input to TCB1 11.3 Register Descriptions The timer B1 has the following registers. • Timer mode register B1 (TMB1) • Timer counter B1 (TCB1) • Timer load register B1 (TLB1) Rev.5.00 Nov. 02, 2005 Page 154 of 500 REJ09B0027-0500 Section 11 Timer B1 11.3.1 Timer Mode Register B1 (TMB1) TMB1 selects the auto-reload function and input clock. Bit Bit Name Initial Value R/W Description 7 TMB17 0 R/W Auto-reload function select 0: Interval timer function selected 1: Auto-reload function selected 6 to 3 All 1 Reserved These bits are always read as 1. 2 TMB12 0 R/W Clock select 1 TMB11 0 R/W 000: Internal clock: φ/8192 0 TMB10 0 R/W 001: Internal clock: φ/2048 010: Internal clock: φ/512 011: Internal clock: φ/256 100: Internal clock: φ/64 101: Internal clock: φ/16 110: Internal clock: φ/4 111: External event (TMIB1): rising or falling edge* Note: * The edge of the external event signal is selected by bit IEG1 in the interrupt edge select register 1 (IEGR1). See section 3.2.1, Interrupt Edge Select Register 1 (IEGR1), for details. Before setting TMB12 to TMB10 to 1, IRQ1 in the port mode register 1 (PMR1) should be set to 1. 11.3.2 Timer Counter B1 (TCB1) TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock source for input to this counter is selected by bits TMB12 to TMB10 in TMB1. TCB1 values can be read by the CPU at any time. When TCB1 overflows from H'FF to H'00 or to the value set in TLB1, the IRRTB1 flag in IRR2 is set to 1. TCB1 is allocated to the same address as TLB1. TCB1 is initialized to H'00. Rev.5.00 Nov. 02, 2005 Page 155 of 500 REJ09B0027-0500 Section 11 Timer B1 11.3.3 Timer Load Register B1 (TLB1) TLB1 is an 8-bit write-only register for setting the reload value of TCB1. When a reload value is set in TLB1, the same value is loaded into TCB1 as well, and TCB1 starts counting up from that value. When TCB1 overflows during operation in auto-reload mode, the TLB1 value is loaded into TCB1. Accordingly, overflow periods can be set within the range of 1 to 256 input clocks. TLB1 is allocated to the same address as TCB1. TLB1 is initialized to H'00. 11.4 Operation 11.4.1 Interval Timer Operation When bit TMB17 in TMB1 is cleared to 0, timer B1 functions as an 8-bit interval timer. Upon reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval timing resume immediately. The operating clock of timer B1 is selected from seven internal clock signals output by prescaler S, or an external clock input at pin TMB1. The selection is made by bits TMB12 to TMB10 in TMB1. After the count value in TMB1 reaches H'FF, the next clock signal input causes timer B1 to overflow, setting flag IRRTB1 in IRR2 to 1. If IENTB1 in IENR2 is 1, an interrupt is requested to the CPU. At overflow, TCB1 returns to H'00 and starts counting up again. During interval timer operation (TMB17 = 0), when a value is set in TLB1, the same value is set in TCB1. 11.4.2 Auto-Reload Timer Operation Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as an 8-bit auto-reload timer. When a reload value is set in TLB1, the same value is loaded into TCB1, becoming the value from which TCB1 starts its count. After the count value in TCB1 reaches H'FF, the next clock signal input causes timer B1 to overflow. The TLB1 value is then loaded into TCB1, and the count continues from that value. The overflow period can be set within a range from 1 to 256 input clocks, depending on the TLB1 value. The clock sources and interrupts in auto-reload mode are the same as in interval mode. In autoreload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also loaded into TCB1. Rev.5.00 Nov. 02, 2005 Page 156 of 500 REJ09B0027-0500 Section 11 Timer B1 11.4.3 Event Counter Operation Timer B1 can operate as an event counter in which TMIB1 is set to an event input pin. External event counting is selected by setting bits TMB12 to TMB10 in TMB1 to 1. TCB1 counts up at rising or falling edge of an external event signal input at pin TMB1. When timer B1 is used to count external event input, bit IRQ1 in PMR1 should be set to 1 and IEN1 in IENR1 should be cleared to 0 to disable IRQ1 interrupt requests. 11.5 Timer B1 Operating Modes Table 11.2 shows the timer B1 operating modes. Table 11.2 Timer B1 Operating Modes Operating Mode Reset Active Interval TCB1 TMB1 Sleep Subactive Subsleep Standby Reset Functions Functions Halted Halted Halted Auto-reload Reset Functions Functions Halted Halted Halted Reset Functions Retained Retained Retained Retained Rev.5.00 Nov. 02, 2005 Page 157 of 500 REJ09B0027-0500 Section 11 Timer B1 Rev.5.00 Nov. 02, 2005 Page 158 of 500 REJ09B0027-0500 Section 12 Timer V Section 12 Timer V Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Comparematch signals with two registers can also be used to reset the counter, request an interrupt, or output a pulse signal with an arbitrary duty cycle. Counting can be initiated by a trigger input at the TRGV pin, enabling pulse output control to be synchronized to the trigger, with an arbitrary delay from the trigger input. Figure 12.1 shows a block diagram of timer V. 12.1 Features • Choice of seven clock signals is available. Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock. • Counter can be cleared by compare match A or B, or by an external reset signal. If the count stop function is selected, the counter can be halted when cleared. • Timer output is controlled by two independent compare match signals, enabling pulse output with an arbitrary duty cycle, PWM output, and other applications. • Three interrupt sources: compare match A, compare match B, timer overflow • Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or both edges of the TRGV input can be selected. TIM08V0A_000120030300 Rev.5.00 Nov. 02, 2005 Page 159 of 500 REJ09B0027-0500 Section 12 Timer V TCRV1 TCORB Trigger control TRGV Comparator TCNTV Internal data bus Clock select TMCIV Comparator φ PSS TCORA TMRIV Clear control TCRV0 Interrupt request control TMOV [Legend] TCORA: TCORB: TCNTV: TCSRV: TCRV0: TCRV1: PSS: CMIA: CMIB: OVI: Output control TCSRV Time constant register A Time constant register B Timer counter V Timer control/status register V Timer control register V0 Timer control register V1 Prescaler S Compare-match interrupt A Compare-match interrupt B Overflow interupt Figure 12.1 Block Diagram of Timer V Rev.5.00 Nov. 02, 2005 Page 160 of 500 REJ09B0027-0500 CMIA CMIB OVI Section 12 Timer V 12.2 Input/Output Pins Table 12.1 shows the timer V pin configuration. Table 12.1 Pin Configuration Name Abbreviation I/O Function Timer V output TMOV Output Timer V waveform output Timer V clock input TMCIV Input Clock input to TCNTV Timer V reset input TMRIV Input External input to reset TCNTV Trigger input TRGV Input Trigger input to initiate counting 12.3 Register Descriptions Time V has the following registers. • • • • • • Timer counter V (TCNTV) Timer constant register A (TCORA) Timer constant register B (TCORB) Timer control register V0 (TCRV0) Timer control/status register V (TCSRV) Timer control register V1 (TCRV1) 12.3.1 Timer Counter V (TCNTV) TCNTV is an 8-bit up-counter. The clock source is selected by bits CKS2 to CKS0 in timer control register V0 (TCRV0). The TCNTV value can be read and written by the CPU at any time. TCNTV can be cleared by an external reset input signal, or by compare match A or B. The clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0. When TCNTV overflows, OVF is set to 1 in timer control/status register V (TCSRV). TCNTV is initialized to H'00. 12.3.2 Time Constant Registers A and B (TCORA, TCORB) TCORA and TCORB have the same function. TCORA and TCORB are 8-bit read/write registers. Rev.5.00 Nov. 02, 2005 Page 161 of 500 REJ09B0027-0500 Section 12 Timer V TCORA and TCNTV are compared at all times. When the TCORA and TCNTV contents match, CMFA is set to 1 in TCSRV. If CMIEA is also set to 1 in TCRV0, a CPU interrupt is requested. Note that they must not be compared during the T3 state of a TCORA write cycle. Timer output from the TMOV pin can be controlled by the identifying signal (compare match A) and the settings of bits OS3 to OS0 in TCSRV. TCORA and TCORB are initialized to H'FF. 12.3.3 Timer Control Register V0 (TCRV0) TCRV0 selects the input clock signals of TCNTV, specifies the clearing conditions of TCNTV, and controls each interrupt request. Bit Bit Name Initial Value R/W Description 7 CMIEB 0 R/W Compare Match Interrupt Enable B When this bit is set to 1, interrupt request from the CMFB bit in TCSRV is enabled. 6 CMIEA 0 R/W Compare Match Interrupt Enable A When this bit is set to 1, interrupt request from the CMFA bit in TCSRV is enabled. 5 OVIE 0 R/W Timer Overflow Interrupt Enable When this bit is set to 1, interrupt request from the OVF bit in TCSRV is enabled. 4 CCLR1 0 R/W Counter Clear 1 and 0 3 CCLR0 0 R/W These bits specify the clearing conditions of TCNTV. 00: Clearing is disabled 01: Cleared by compare match A 10: Cleared by compare match B 11: Cleared on the rising edge of the TMRIV pin. The operation of TCNTV after clearing depends on TRGE in TCRV1. 2 CKS2 0 R/W Clock Select 2 to 0 1 CKS1 0 R/W 0 CKS0 0 R/W These bits select clock signals to input to TCNTV and the counting condition in combination with ICKS0 in TCRV1. Refer to table 12.2. Rev.5.00 Nov. 02, 2005 Page 162 of 500 REJ09B0027-0500 Section 12 Timer V Table 12.2 Clock Signals to Input to TCNTV and Counting Conditions TCRV0 TCRV1 Bit 2 Bit 1 Bit 0 Bit 0 CKS2 CKS1 CKS0 ICKS0 Description 0 0 0 Clock input prohibited 1 0 Internal clock: counts on φ/4, falling edge 1 Internal clock: counts on φ/8, falling edge 0 Internal clock: counts on φ/16, falling edge 1 Internal clock: counts on φ/32, falling edge 0 Internal clock: counts on φ/64, falling edge 1 Internal clock: counts on φ/128, falling edge 1 0 1 1 0 0 Clock input prohibited 1 External clock: counts on rising edge 1 0 External clock: counts on falling edge 1 External clock: counts on rising and falling edge Rev.5.00 Nov. 02, 2005 Page 163 of 500 REJ09B0027-0500 Section 12 Timer V 12.3.4 Timer Control/Status Register V (TCSRV) TCSRV indicates the status flag and controls outputs by using a compare match. Bit Bit Name Initial Value R/W Description 7 CMFB 0 R/W Compare Match Flag B Setting condition: When the TCNTV value matches the TCORB value Clearing condition: After reading CMFB = 1, cleared by writing 0 to CMFB 6 CMFA 0 R/W Compare Match Flag A Setting condition: When the TCNTV value matches the TCORA value Clearing condition: After reading CMFA = 1, cleared by writing 0 to CMFA 5 OVF 0 R/W Timer Overflow Flag Setting condition: When TCNTV overflows from H'FF to H'00 Clearing condition: After reading OVF = 1, cleared by writing 0 to OVF 4 1 3 OS3 0 R/W Output Select 3 and 2 2 OS2 0 R/W These bits select an output method for the TMOV pin by the compare match of TCORB and TCNTV. Reserved This bit is always read as 1. 00: No change 01: 0 output 10: 1 output 11: Output toggles 1 OS1 0 R/W Output Select 1 and 0 0 OS0 0 R/W These bits select an output method for the TMOV pin by the compare match of TCORA and TCNTV. 00: No change 01: 0 output 10: 1 output 11: Output toggles Rev.5.00 Nov. 02, 2005 Page 164 of 500 REJ09B0027-0500 Section 12 Timer V OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level for compare match A. The two output levels can be controlled independently. After a reset, the timer output is 0 until the first compare match. 12.3.5 Timer Control Register V1 (TCRV1) TCRV1 selects the edge at the TRGV pin, enables TRGV input, and selects the clock input to TCNTV. Bit Bit Name Initial Value R/W Description 7 to 5 All 1 Reserved These bits are always read as 1. 4 TVEG1 0 R/W TRGV Input Edge Select 3 TVEG0 0 R/W These bits select the TRGV input edge. 00: TRGV trigger input is prohibited 01: Rising edge is selected 10: Falling edge is selected 11: Rising and falling edges are both selected 2 TRGE 0 R/W TCNT starts counting up by the input of the edge which is selected by TVEG1 and TVEG0. 0: Disables starting counting-up TCNTV by the input of the TRGV pin and halting counting-up TCNTV when TCNTV is cleared by a compare match. 1: Enables starting counting-up TCNTV by the input of the TRGV pin and halting counting-up TCNTV when TCNTV is cleared by a compare match. 1 1 Reserved This bit is always read as 1. 0 ICKS0 0 R/W Internal Clock Select 0 This bit selects clock signals to input to TCNTV in combination with CKS2 to CKS0 in TCRV0. Refer to table 12.2. Rev.5.00 Nov. 02, 2005 Page 165 of 500 REJ09B0027-0500 Section 12 Timer V 12.4 Operation 12.4.1 Timer V Operation 1. According to table 12.2, six internal/external clock signals output by prescaler S can be selected as the timer V operating clock signals. When the operating clock signal is selected, TCNTV starts counting-up. Figure 12.2 shows the count timing with an internal clock signal selected, and figure 12.3 shows the count timing with both edges of an external clock signal selected. 2. When TCNTV overflows (changes from H'FF to H'00), the overflow flag (OVF) in TCRV0 will be set. The timing at this time is shown in figure 12.4. An interrupt request is sent to the CPU when OVIE in TCRV0 is 1. 3. TCNTV is constantly compared with TCORA and TCORB. Compare match flag A or B (CMFA or CMFB) is set to 1 when TCNTV matches TCORA or TCORB, respectively. The compare-match signal is generated in the last state in which the values match. Figure 12.5 shows the timing. An interrupt request is generated for the CPU when CMIEA or CMIEB in TCRV0 is 1. 4. When a compare match A or B is generated, the TMOV responds with the output value selected by bits OS3 to OS0 in TCSRV. Figure 12.6 shows the timing when the output is toggled by compare match A. 5. When CCLR1 or CCLR0 in TCRV0 is 01 or 10, TCNTV can be cleared by the corresponding compare match. Figure 12.7 shows the timing. 6. When CCLR1 or CCLR0 in TCRV0 is 11, TCNTV can be cleared by the rising edge of the input of TMRIV pin. A TMRIV input pulse-width of at least 1.5 system clocks is necessary. Figure 12.8 shows the timing. 7. When a counter-clearing source is generated with TRGE in TCRV1 set to 1, the counting-up is halted as soon as TCNTV is cleared. TCNTV resumes counting-up when the edge selected by TVEG1 or TVEG0 in TCRV1 is input from the TGRV pin. Rev.5.00 Nov. 02, 2005 Page 166 of 500 REJ09B0027-0500 Section 12 Timer V φ Internal clock TCNTV input clock TCNTV N–1 N N+1 Figure 12.2 Increment Timing with Internal Clock φ TMCIV (External clock input pin) TCNTV input clock TCNTV N–1 N N+1 Figure 12.3 Increment Timing with External Clock φ TCNTV H'FF H'00 Overflow signal OVF Figure 12.4 OVF Set Timing Rev.5.00 Nov. 02, 2005 Page 167 of 500 REJ09B0027-0500 Section 12 Timer V φ TCNTV N TCORA or TCORB N N+1 Compare match signal CMFA or CMFB Figure 12.5 CMFA and CMFB Set Timing φ Compare match A signal Timer V output pin Figure 12.6 TMOV Output Timing φ Compare match A signal TCNTV N H'00 Figure 12.7 Clear Timing by Compare Match Rev.5.00 Nov. 02, 2005 Page 168 of 500 REJ09B0027-0500 Section 12 Timer V φ TMRIV (External counter reset input pin) TCNTV reset signal TCNTV N–1 N H'00 Figure 12.8 Clear Timing by TMRIV Input Rev.5.00 Nov. 02, 2005 Page 169 of 500 REJ09B0027-0500 Section 12 Timer V 12.5 Timer V Application Examples 12.5.1 Pulse Output with Arbitrary Duty Cycle Figure 12.9 shows an example of output of pulses with an arbitrary duty cycle. 1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with TCORA. 2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA and to 0 at compare match with TCORB. 3. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source. 4. With these settings, a waveform is output without further software intervention, with a period determined by TCORA and a pulse width determined by TCORB. TCNTV value H'FF Counter cleared TCORA TCORB H'00 Time TMOV Figure 12.9 Pulse Output Example Rev.5.00 Nov. 02, 2005 Page 170 of 500 REJ09B0027-0500 Section 12 Timer V 12.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input The trigger function can be used to output a pulse with an arbitrary pulse width at an arbitrary delay from the TRGV input, as shown in figure 12.10. To set up this output: 1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with TCORB. 2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA and to 0 at compare match with TCORB. 3. Set bits TVEG1 and TVEG0 in TCRV1 and set TRGE to select the falling edge of the TRGV input. 4. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source. 5. After these settings, a pulse waveform will be output without further software intervention, with a delay determined by TCORA from the TRGV input, and a pulse width determined by (TCORB – TCORA). TCNTV value H'FF Counter cleared TCORB TCORA H'00 Time TRGV TMOV Compare match A Compare match B clears TCNTV and halts count-up Compare match A Compare match B clears TCNTV and halts count-up Figure 12.10 Example of Pulse Output Synchronized to TRGV Input Rev.5.00 Nov. 02, 2005 Page 171 of 500 REJ09B0027-0500 Section 12 Timer V 12.6 Usage Notes The following types of contention or operation can occur in timer V operation. 1. 2. 3. 4. Writing to registers is performed in the T3 state of a TCNTV write cycle. If a TCNTV clear signal is generated in the T3 state of a TCNTV write cycle, as shown in figure 12.11, clearing takes precedence and the write to the counter is not carried out. If counting-up is generated in the T3 state of a TCNTV write cycle, writing takes precedence. If a compare match is generated in the T3 state of a TCORA or TCORB write cycle, the write to TCORA or TCORB takes precedence and the compare match signal is inhibited. Figure 12.12 shows the timing. If compare matches A and B occur simultaneously, any conflict between the output selections for compare match A and compare match B is resolved by the following priority: toggle output > output 1 > output 0. Depending on the timing, TCNTV may be incremented by a switch between different internal clock sources. When TCNTV is internally clocked, an increment pulse is generated from the falling edge of an internal clock signal, that is divided system clock (φ). Therefore, as shown in figure 12.3 the switch is from a high clock signal to a low clock signal, the switchover is seen as a falling edge, causing TCNTV to increment. TCNTV can also be incremented by a switch between internal and external clocks. TCNTV write cycle by CPU T2 T1 T3 φ Address TCNTV address Internal write signal Counter clear signal TCNTV N H'00 Figure 12.11 Contention between TCNTV Write and Clear Rev.5.00 Nov. 02, 2005 Page 172 of 500 REJ09B0027-0500 Section 12 Timer V TCORA write cycle by CPU T2 T1 T3 φ Address TCORA address Internal write signal TCNTV N N+1 TCORA N M TCORA write data Compare match signal Inhibited Figure 12.12 Contention between TCORA Write and Compare Match Clock before switching Clock after switching Count clock TCNTV N N+1 N+2 Write to CKS1 and CKS0 Figure 12.13 Internal Clock Switching and TCNTV Operation Rev.5.00 Nov. 02, 2005 Page 173 of 500 REJ09B0027-0500 Section 12 Timer V Rev.5.00 Nov. 02, 2005 Page 174 of 500 REJ09B0027-0500 Section 13 Timer Z Section 13 Timer Z The timer Z has a 16-bit timer with two channels. Figures 13.1, 13.2, and 13.3 show the block diagrams of entire timer Z, its channel 0, and its channel 1, respectively. For details on the timer Z functions, refer to table 13.1. 13.1 Features • Capability to process up to eight inputs/outputs • Eight general registers (GR): four registers for each channel Independently assignable output compare or input capture functions • Selection of five counter clock sources: four internal clocks (φ, φ/2, φ/4, and φ/8) and an external clock • Seven selectable operating modes Output compare function Selection of 0 output, 1 output, or toggle output Input capture function Rising edge, falling edge, or both edges Synchronous operation Timer counters_0 and _1 (TCNT_0 and TCNT_1) can be written simultaneously. Simultaneous clearing by compare match or input capture is possible. PWM mode Up to six-phase PWM output can be provided with desired duty ratio. Reset synchronous PWM mode Three-phase PWM output for normal and counter phases Complementary PWM mode Three-phase PWM output for non-overlapped normal and counter phases The A/D conversion start trigger can be set for PWM cycles. Buffer operation The input capture register can be consisted of double buffers. The output compare register can automatically be modified. • High-speed access by the internal 16-bit bus 16-bit TCNT and GR registers can be accessed in high speed by a 16-bit bus interface • Any initial timer output value can be set • Output of the timer is disabled by external trigger TIM08Z0A_000120030300 Rev.5.00 Nov. 02, 2005 Page 175 of 500 REJ09B0027-0500 Section 13 Timer Z • Eleven interrupt sources Four compare match/input capture interrupts and an overflow interrupt are available for each channel. An underflow interrupt can be set for channel 1. Table 13.1 Timer Z Functions Item Channel 0 Channel 1 Count clock Internal clocks: φ, φ/2, φ/4, φ/8 External clock: FTIOA0 (TCLK) General registers (output compare/input capture registers) GRA_0, GRB_0, GRC_0, GRD_0 GRA_1, GRB_1, GRC_1, GRD_1 Buffer register GRC_0, GRD_0 GRC_1, GRD_1 I/O pins FTIOA0, FTIOB0, FTIOC0, FTIOD0 FTIOA1, FTIOB1, FTIOC1, FTIOD1 Counter clearing function Compare match/input capture of GRA_0, GRB_0, GRC_0, or GRD_0 Compare match/input capture of GRA_1, GRB_1, GRC_1, or GRD_1 Compare match output 0 output Yes Yes 1 output Yes Yes output Yes Yes Input capture function Yes Yes Synchronous operation Yes Yes PWM mode Yes Yes Reset synchronous PWM mode Yes Yes Complementary PWM mode Yes Yes Buffer function Yes Yes Interrupt sources Compare match/input capture A0 to D0 Overflow Compare match/input capture A1 to D1 Overflow Underflow Rev.5.00 Nov. 02, 2005 Page 176 of 500 REJ09B0027-0500 Section 13 Timer Z ITMZ0 FTIOA0 ITMZ1 FTIOB0 FTIOC0 FTIOD0 Control logic FTIOA1 FTIOB1 FTIOC1 FTIOD1 φ, φ/2, φ/4, φ/8 ADTRG Channel 0 timer Channel 1 timer TSTR TMDR TPMR TFCR TOER TOCR Module data bus [Legend] TSTR : Timer start register (8 bits) TMDR : Timer mode register (8 bits) TPMR : Timer PWM mode register (8 bits) TFCR : Timer function control register (8 bits) TOER : Timer output master enable register (8 bits) TOCR : Timer output control register (8 bits) ADTRG : A/D conversion start trigger output signal ITMZ0 : Channel 0 interrupt ITMZ1 : Channel 1 interrupt Figure 13.1 Timer Z Block Diagram Rev.5.00 Nov. 02, 2005 Page 177 of 500 REJ09B0027-0500 Section 13 Timer Z FTIOA0 FTIOB0 φ, φ/2, φ/4, φ/8 FTIOC0 Clock select FTIOD0 Control logic ITMZ0 Module data bus [Legend] TCNT_0 : GRA_0, GRB_0: GRC_0, GRD_0 : TCR_0 : TIORA_0 : TIORC_0 : TSR_0 : TIER_0 : POCR_0 : ITMZ0 : Timer counter_0 (16 bits) General registers A_0, B_0, C_0, and D_0 (input capture/output compare registers: 16 bits × 4) Timer control register_0 (8 bits) Timer I/O control register A_0 (8 bits) Timer I/O control register C_0 (8 bits) Timer status register_0 (8 bits) Timer interrupt enable register_0 (8 bits) PWM mode output level control register_0 (8 bits) Channel 0 interrupt Figure 13.2 Timer Z (Channel 0) Block Diagram Rev.5.00 Nov. 02, 2005 Page 178 of 500 REJ09B0027-0500 POCR_0 TIER_0 TSR_0 TIORC_0 TIORA_0 TCR_0 GRD_0 GRC_0 GRB_0 GRA_0 TCNT_0 Comparator Section 13 Timer Z FTIOA1 FTIOB1 φ, φ/2, φ/4, φ/8 FTIOC1 Clock select FTIOD1 Control logic ITMZ1 POCR_1 TIER_1 TSR_1 TIORC_1 TIORA_1 TCR_1 GRD_1 GRC_1 GRB_1 GRA_1 TCNT_1 Comparator Module data bus [Legend] TCNT_1 : GRA_1, GRB_1: GRC_1, GRD_1 : TCR_1 : TIORA_1 : TIORC_1 : TSR_1 : TIER_1 : POCR_1 : ITMZ1 : Timer counter_1 (16 bits) General registers A_1, B_1, C_1, and D_1 (input capture/output compare registers: 16 bits × 4) Timer control register_1 (8 bits) Timer I/O control register A_1 (8 bits) Timer I/O control register C_1 (8 bits) Timer status register_1 (8 bits) Timer interrupt enable register_1 (8 bits) PWM mode output level control register_1 (8 bits) Channel 1 interrupt Figure 13.3 Timer Z (Channel 1) Block Diagram Rev.5.00 Nov. 02, 2005 Page 179 of 500 REJ09B0027-0500 Section 13 Timer Z 13.2 Input/Output Pins Table 13.2 summarizes the timer Z pins. Table 13.2 Pin Configuration Name Abbreviation Input/Output Function Input capture/output compare A0 FTIOA0 Input/output GRA_0 output compare output, GRA_0 input capture input, or external clock input (TCLK) Input capture/output compare B0 FTIOB0 Input/output GRB_0 output compare output, GRB_0 input capture input, or PWM output Input capture/output compare C0 FTIOC0 Input/output GRC_0 output compare output, GRC_0 input capture input, or PWM synchronous output (in reset synchronous PWM and complementary PWM modes) Input capture/output compare D0 FTIOD0 Input/output GRD_0 output compare output, GRD_0 input capture input, or PWM output Input capture/output compare A1 FTIOA1 Input/output GRA_1 output compare output, GRA_1 input capture input, or PWM output (in reset synchronous PWM and complementary PWM modes) Input capture/output compare B1 FTIOB1 Input/output GRB_1 output compare output, GRB_1 input capture input, or PWM output Input capture/output compare C1 FTIOC1 Input/output GRC_1 output compare output, GRC_1 input capture input, or PWM output Input capture/output compare D1 FTIOD1 Input/output GRD_1 output compare output, GRD_1 input capture input, or PWM output Rev.5.00 Nov. 02, 2005 Page 180 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3 Register Descriptions The timer Z has the following registers. Common • • • • • • Timer start register (TSTR) Timer mode register (TMDR) Timer PWM mode register (TPMR) Timer function control register (TFCR) Timer output master enable register (TOER) Timer output control register (TOCR) Channel 0 • • • • • • • • • • • Timer control register_0 (TCR_0) Timer I/O control register A_0 (TIORA_0) Timer I/O control register C_0 (TIORC_0) Timer status register_0 (TSR_0) Timer interrupt enable register_0 (TIER_0) PWM mode output level control register_0 (POCR_0) Timer counter_0 (TCNT_0) General register A_0 (GRA_0) General register B_0 (GRB_0) General register C_0 (GRC_0) General register D_0 (GRD_0) Channel 1 • • • • • • • • • Timer control register_1 (TCR_1) Timer I/O control register A_1 (TIORA_1) Timer I/O control register C_1 (TIORC_1) Timer status register_1 (TSR_1) Timer interrupt enable register_1 (TIER_1) PWM mode output level control register_1 (POCR_1) Timer counter_1 (TCNT_1) General register A_1 (GRA_1) General register B_1 (GRB_1) Rev.5.00 Nov. 02, 2005 Page 181 of 500 REJ09B0027-0500 Section 13 Timer Z • General register C_1 (GRC_1) • General register D_1 (GRD_1) 13.3.1 Timer Start Register (TSTR) TSTR selects the operation/stop for the TCNT counter. Bit Bit Name Initial Value R/W Description 7 to 2 All 1 Reserved These bits are always read as 1, and cannot be modified. 1 STR1 0 R/W Channel 1 Counter Start 0: TCNT_1 halts counting 1: TCNT_1 starts counting 0 STR0 0 R/W Channel 0 Counter Start 0: TCNT_0 halts counting 1: TCNT_0 starts counting Rev.5.00 Nov. 02, 2005 Page 182 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.2 Timer Mode Register (TMDR) TMDR selects buffer operation settings and synchronized operation. Bit Bit Name Initial Value R/W Description 7 BFD1 0 R/W Buffer Operation D1 0: GRD_1 operates normally 1: GRB_1 and GRD_1 are used together for buffer operation 6 BFC1 0 R/W Buffer Operation C1 0: GRC_1 operates normally 1: GRA_1 and GRD_1 are used together for buffer operation 5 BFD0 0 R/W Buffer Operation D0 0: GRD_0 operates normally 1: GRB_0 and GRD_0 are used together for buffer operation 4 BFC0 0 R/W Buffer Operation C0 0: GRC_0 operates normally 1: GRA_0 and GRC_0 are used together for buffer operation 3 to 1 All 1 Reserved These bits are always read as 1, and cannot be modified. 0 SYNC 0 R/W Timer Synchronization 0: TCNT_1 and TCNT_0 operate as a different timer 1: TCNT_1 and TCNT_0 are synchronized TCNT_1 and TCNT_0 can be pre-set or cleared synchronously Rev.5.00 Nov. 02, 2005 Page 183 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.3 Timer PWM Mode Register (TPMR) TPMR sets the pin to enter PWM mode. Bit Bit Name Initial Value R/W Description 7 1 Reserved This bit is always read as 1, and cannot be modified. 6 PWMD1 0 R/W PWM Mode D1 0: FTIOD1 operates normally 1: FTIOD1 operates in PWM mode 5 PWMC1 0 R/W PWM Mode C1 0: FTIOC1 operates normally 1: FTIOC1 operates in PWM mode 4 PWMB1 0 R/W PWM Mode B1 0: FTIOB1 operates normally 1: FTIOB1 operates in PWM mode 3 1 Reserved This bit is always read as 1, and cannot be modified. 2 PWMD0 0 R/W PWM Mode D0 0: FTIOD0 operates normally 1: FTIOD0 operates in PWM mode 1 PWMC0 0 R/W PWM Mode C0 0: FTIOC0 operates normally 1: FTIOC0 operates in PWM mode 0 PWMB0 0 R/W PWM Mode B0 0: FTIOB0 operates normally 1: FTIOB0 operates in PWM mode Rev.5.00 Nov. 02, 2005 Page 184 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.4 Timer Function Control Register (TFCR) TFCR selects the settings and output levels for each operating mode. Bit Bit Name Initial Value R/W Description 7 1 Reserved This bit is always read as 1. 6 STCLK 0 R/W External Clock Input Select 0: External clock input is disabled 1: External clock input is enabled 5 ADEG 0 R/W A/D Trigger Edge Select A/D module should be set to start an A/D conversion by the external trigger 0: A/D trigger at the crest in complementary PWM mode 1: A/D trigger at the trough in complementary PWM mode 4 ADTRG 0 R/W External Trigger Disable 0: A/D trigger for PWM cycles is disabled in complementary PWM mode 1: A/D trigger for PWM cycles is enabled in complementary PWM mode 3 OLS1 0 R/W Output Level Select 1 Selects the counter-phase output levels in reset synchronous PWM mode or complementary PWM mode. 0: Initial output is high and the active level is low. 1: Initial output is low and the active level is high. 2 OLS0 0 R/W Output Level Select 0 Selects the normal-phase output levels in reset synchronous PWM mode or complementary PWM mode. 0: Initial output is high and the active level is low. 1: Initial output is low and the active level is high. Figure 13.4 shows an example of outputs in reset synchronous PWM mode and complementary PWM mode when OLS1 = 0 and OLS0 = 0. Rev.5.00 Nov. 02, 2005 Page 185 of 500 REJ09B0027-0500 Section 13 Timer Z Bit Bit Name Initial Value R/W Description 1 CMD1 0 R/W Combination Mode 1 and 0 0 CMD0 0 R/W 00: Channel 0 and channel 1 operate normally 01: Channel 0 and channel 1 are used together to operate in reset synchronous PWM mode 10: Channel 0 and channel 1 are used together to operate in complementary PWM mode (transferred at the trough) 11: Channel 0 and channel 1 are used together to operate in complementary PWM mode (transferred at the crest) Note: When reset synchronous PWM mode or complementary PWM mode is selected by these bits, this setting has the priority to the settings for PWM mode by each bit in TPMR. Stop TCNT_0 and TCNT_1 before making settings for reset synchronous PWM mode or complementary PWM mode. TCNT_0 TCNT_1 Normal phase Normal phase Active level Active level Counter phase Counter phase Initial output Active level Reset synchronous PWM mode Initial output Active level Complementary PWM mode Note: Write H'00 to TOCR to start initial outputs after stopping the counter. Figure 13.4 Example of Outputs in Reset Synchronous PWM Mode and Complementary PWM Mode Rev.5.00 Nov. 02, 2005 Page 186 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.5 Timer Output Master Enable Register (TOER) TOER enables/disables the outputs for channel 0 and channel 1. When WKP4 is selected for inputs, if a low level signal is input to WKP4, the bits in TOER are set to 1 to disable the output for timer Z. Bit Bit Name Initial Value R/W Description 7 ED1 1 R/W Master Enable D1 0: FTIOD1 pin output is enabled according to the TPMR, TFCR, and TIORC_1 settings 1: FTIOD1 pin output is disabled regardless of the TPMR, TFCR, and TIORC_1 settings (FTIOD1 pin is operated as an I/O port). 6 EC1 1 R/W Master Enable C1 0: FTIOC1 pin output is enabled according to the TPMR, TFCR, and TIORC_1 settings 1: FTIOC1 pin output is disabled regardless of the TPMR, TFCR, and TIORC_1 settings (FTIOC1 pin is operated as an I/O port). 5 EB1 1 R/W Master Enable B1 0: FTIOB1 pin output is enabled according to the TPMR, TFCR, and TIORA_1 settings 1: FTIOB1 pin output is disabled regardless of the TPMR, TFCR, and TIORA_1 settings (FTIOB1 pin is operated as an I/O port). 4 EA1 1 R/W Master Enable A1 0: FTIOA1 pin output is enabled according to the TPMR, TFCR, and TIORA_1 settings 1: FTIOA1 pin output is disabled regardless of the TPMR, TFCR, and TIORA_1 settings (FTIOA1 pin is operated as an I/O port). 3 ED0 1 R/W Master Enable D0 0: FTIOD0 pin output is enabled according to the TPMR, TFCR, and TIORC_0 settings 1: FTIOD0 pin output is disabled regardless of the TPMR, TFCR, and TIORC_0 settings (FTIOD0 pin is operated as an I/O port). Rev.5.00 Nov. 02, 2005 Page 187 of 500 REJ09B0027-0500 Section 13 Timer Z Bit Bit Name Initial Value R/W Description 2 EC0 1 R/W Master Enable C0 0: FTIOC0 pin output is enabled according to the TPMR, TFCR, and TIORC_0 settings 1: FTIOC0 pin output is disabled regardless of the TPMR, TFCR, and TIORC_0 settings (FTIOC0 pin is operated as an I/O port). 1 EB0 1 R/W Master Enable B0 0: FTIOB0 pin output is enabled according to the TPMR, TFCR, and TIORA_0 settings 1: FTIOB0 pin output is disabled regardless of the TPMR, TFCR, and TIORA_0 settings (FTIOB0 pin is operated as an I/O port). 0 EA0 1 R/W Master Enable A0 0: FTIOA0 pin output is enabled according to the TPMR, TFCR, and TIORA_0 settings 1: FTIOA0 pin output is disabled regardless of the TPMR, TFCR, and TIORA_0 settings (FTIOA0 pin is operated as an I/O port). 13.3.6 Timer Output Control Register (TOCR) TOCR selects the initial outputs before the first occurrence of a compare match. Note that bits OLS1 and OLS0 in TFCR set these initial outputs in reset synchronous PWM mode and complementary PWM mode. Bit Bit Name Initial Value R/W Description 7 TOD1 0 R/W Output Level Select D1 0: 0 output at the FTIOD1 pin* 1: 1 output at the FTIOD1 pin* 6 TOC1 0 R/W Output Level Select C1 0: 0 output at the FTIOC1 pin* 1: 1 output at the FTIOC1 pin* 5 TOB1 0 R/W Output Level Select B1 0: 0 output at the FTIOB1 pin* 1: 1 output at the FTIOB1 pin* Rev.5.00 Nov. 02, 2005 Page 188 of 500 REJ09B0027-0500 Section 13 Timer Z Bit Bit Name Initial Value R/W Description 4 TOA1 0 R/W Output Level Select A1 0: 0 output at the FTIOA1 pin* 1: 1 output at the FTIOA1 pin* 3 TOD0 0 R/W Output Level Select D0 0: 0 output at the FTIOD0 pin* 1: 1 output at the FTIOD0 pin* 2 TOC0 0 R/W Output Level Select C0 0: 0 output at the FTIOC0 pin* 1: 1 output at the FTIOC0 pin* 1 TOB0 0 R/W Output Level Select B0 0: 0 output at the FTIOB0 pin* 1: 1 output at the FTIOB0 pin* 0 TOA0 0 R/W Output Level Select A0 0: 0 output at the FTIOA0 pin* 1: 1 output at the FTIOA0 pin* Note: 13.3.7 * The change of the setting is immediately reflected in the output value. Timer Counter (TCNT) The timer Z has two TCNT counters (TCNT_0 and TCNT_1), one for each channel. The TCNT counters are 16-bit readable/writable registers that increment/decrement according to input clocks. Input clocks can be selected by bits TPSC2 to TPSC0 in TCR. TCNT0 and TCNT 1 increment/decrement in complementary PWM mode, while they only increment in other modes. The TCNT counters are initialized to H'0000 by compare matches with corresponding GRA, GRB, GRC, or GRD, or input captures to GRA, GRB, GRC, or GRD (counter clearing function). When the TCNT counters overflow, an OVF flag in TSR for the corresponding channel is set to 1. When TCNT_1 underflows, an UDF flag in TSR is set to 1. The TCNT counters cannot be accessed in 8bit units; they must always be accessed as a 16-bit unit. Rev.5.00 Nov. 02, 2005 Page 189 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.8 General Registers A, B, C, and D (GRA, GRB, GRC, and GRD) GR are 16-bit registers. Timer Z has eight general registers (GR), four for each channel. The GR registers are dual function 16-bit readable/writable registers, functioning as either output compare or input capture registers. Functions can be switched by TIORA and TIORC. The values in GR and TCNT are constantly compared with each other when the GR registers are used as output compare registers. When the both values match, the IMFA to IMFD flags in TSR are set to 1. Compare match outputs can be selected by TIORA and TIORC. When the GR registers are used as input capture registers, the TCNT value is stored after detecting external signals. At this point, IMFA to IMFD flags in the corresponding TSR are set to 1. Detection edges for input capture signals can be selected by TIORA and TIORC. When PWM mode, complementary PWM mode, or reset synchronous PWM mode is selected, the values in TIORA and TIORC are ignored. Upon reset, the GR registers are set as output compare registers (no output) and initialized to H'FFFF. The GR registers cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit. Rev.5.00 Nov. 02, 2005 Page 190 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.9 Timer Control Register (TCR) The TCR registers select a TCNT counter clock, an edge when an external clock is selected, and counter clearing sources. Timer Z has a total of two TCR registers, one for each channel. Bit Bit Name Initial value R/W Description 7 CCLR2 0 R/W Counter Clear 2 to 0 6 CCLR1 0 R/W 000: Disables TCNT clearing 5 CCLR0 0 R/W 001: Clears TCNT by GRA compare match/input 1 capture* 010: Clears TCNT by GRB compare match/input capture*1 011: Synchronization clear; Clears TCNT in synchronous 2 with counter clearing of the other channel’s timer* 100: Disables TCNT clearing 101: Clears TCNT by GRC compare match/input 1 capture* 110: Clears TCNT by GRD compare match/input capture*1 111: Synchronization clear; Clears TCNT in synchronous 2 with counter clearing of the other channel’s timer* 4 CKEG1 0 R/W Clock Edge 1 and 0 3 CKEG0 0 R/W 00: Count at rising edge 01: Count at falling edge 1X: Count at both edges 2 TPSC2 0 R/W Time Prescaler 2 to 0 1 TPSC1 0 R/W 000: Internal clock: count by φ 0 TPSC0 0 R/W 001: Internal clock: count by φ/2 010: Internal clock: count by φ/4 011: Internal clock: count by φ/8 1XX: External clock: count by FTIOA0 (TCLK) pin input Notes: 1. When GR functions as an output compare register, TCNT is cleared by compare match. When GR functions as input capture, TCNT is cleared by input capture. 2. Synchronous operation is set by TMDR. 3. X: Don’t care Rev.5.00 Nov. 02, 2005 Page 191 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.10 Timer I/O Control Register (TIORA and TIORC) The TIOR registers control the general registers (GR). Timer Z has four TIOR registers (TIORA_0, TIORA_1, TIORC_0, and TIORC_1), two for each channel. In PWM mode including complementary PWM mode and reset synchronous PWM mode, the settings of TIOR are invalid. TIORA: TIORA selects whether GRA or GRB is used as an output compare register or an input capture register. When an output compare register is selected, the output setting is selected. When an input capture register is selected, an input edge of an input capture signal is selected. TIORA also selects the function of FTIOA or FTIOB pin. Bit Bit Name Initial value R/W Description 7 1 Reserved This bit is always read as 1. 6 IOB2 0 R/W I/O Control B2 to B0 5 IOB1 0 R/W GRB is an output compare register: 4 IOB0 0 R/W 000: Disables pin output by compare match 001: 0 output by GRB compare match 010: 1 output by GRB compare match 011: Toggle output by GRB compare match GRB is an input capture register: 100: Input capture to GRB at the rising edge 101: Input capture to GRB at the falling edge 11X: Input capture to GRB at both rising and falling edges 3 1 Reserved This bit is always read as 1. 2 IOA2 0 R/W I/O Control A2 to A0 1 IOA1 0 R/W GRA is an output compare register: 0 IOA0 0 R/W 000: Disables pin output by compare match 001: 0 output by GRA compare match 010: 1 output by GRA compare match 011: Toggle output by GRA compare match GRA is an input capture register: 100: Input capture to GRA at the rising edge 101: Input capture to GRA at the falling edge 11X: Input capture to GRA at both rising and falling edges Legend: X: Don't care Rev.5.00 Nov. 02, 2005 Page 192 of 500 REJ09B0027-0500 Section 13 Timer Z TIORC: TIORC selects whether GRC or GRD is used as an output compare register or an input capture register. When an output compare register is selected, the output setting is selected. When an input capture register is selected, an input edge of an input capture signal is selected. TIORC also selects the function of FTIOC or FTIOD pin. Bit Bit Name Initial value R/W Description 7 1 Reserved This bit is always read as 1. 6 IOD2 0 R/W I/O Control D2 to D0 5 IOD1 0 R/W GRD is an output compare register: 4 IOD0 0 R/W 000: Disables pin output by compare match 001: 0 output by GRD compare match 010: 1 output by GRD compare match 011: Toggle output by GRD compare match GRD is an input capture register: 100: Input capture to GRD at the rising edge 101: Input capture to GRD at the falling edge 11X: Input capture to GRD at both rising and falling edges 3 1 Reserved This bit is always read as 1. 2 IOC2 0 R/W I/O Control C2 to C0 1 IOC1 0 R/W GRC is an output compare register: 0 IOC0 0 R/W 000: Disables pin output by compare match 001: 0 output by GRC compare match 010: 1 output by GRC compare match 011: Toggle Output by GRC compare match GRC is an input capture register: 100: Input capture to GRC at the rising edge 101: Input capture to GRC at the falling edge 11X: Input capture to GRC at both rising and falling edges Legend: X: Don't care Rev.5.00 Nov. 02, 2005 Page 193 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.11 Timer Status Register (TSR) TSR indicates generation of an overflow/underflow of TCNT and a compare match/input capture of GRA, GRB, GRC, and GRD. These flags are interrupt sources. If an interrupt is enabled by a corresponding bit in TIER, TSR requests an interrupt for the CPU. Timer Z has two TSR registers, one for each channel. Bit Bit Name Initial value R/W Description 7, 6 All 1 Reserved 5 UDF* 0 R/W These bits are always read as 1. Underflow Flag [Setting condition] • When TCNT_1 underflows [Clearing condition] • 4 OVF 0 R/W When 0 is written to UDF after reading UDF = 1 Overflow Flag [Setting condition] • When the TCNT value underflows [Clearing condition] • 3 IMFD 0 R/W When 0 is written to OVF after reading OVF = 1 Input Capture/Compare Match Flag D [Setting conditions] • When TCNT = GRD and GRD is functioning as output compare register • When TCNT value is transferred to GRD by input capture signal and GRD is functioning as input capture register [Clearing condition] • Rev.5.00 Nov. 02, 2005 Page 194 of 500 REJ09B0027-0500 When 0 is written to IMFD after reading IMFD = 1 Section 13 Timer Z Bit Bit Name Initial value R/W Description 2 IMFC 0 R/W Input Capture/Compare Match Flag C [Setting conditions] • When TCNT = GRC and GRC is functioning as output compare register • When TCNT value is transferred to GRC by input capture signal and GRC is functioning as input capture register [Clearing condition] • 1 IMFB 0 R/W When 0 is written to IMFC after reading IMFC = 1 Input Capture/Compare Match Flag B [Setting conditions] • When TCNT = GRB and GRB is functioning as output compare register • When TCNT value is transferred to GRB by input capture signal and GRB is functioning as input capture register [Clearing condition] • 0 IMFA 0 R/W When 0 is written to IMFB after reading IMFB = 1 Input Capture/Compare Match Flag A [Setting conditions] • When TCNT = GRA and GRA is functioning as output compare register • When TCNT value is transferred to GRA by input capture signal and GRA is functioning as input capture register [Clearing condition] • When 0 is written to IMFA after reading IMFA = 1 Note: Bit 5 is not the UDF flag in TSR_0. It is a reserved bit. It is always read as 1. Rev.5.00 Nov. 02, 2005 Page 195 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.12 Timer Interrupt Enable Register (TIER) TIER enables or disables interrupt requests for overflow or GR compare match/input capture. Timer Z has two TIER registers, one for each channel. Bit Bit Name Initial value R/W Description 7 to 5 All 1 Reserved 4 OVIE 0 R/W Overflow Interrupt Enable These bits are always read as 1. 0: Interrupt requests (OVI) by OVF or UDF flag are disabled 1: Interrupt requests (OVI) by OVF or UDF flag are enabled 3 IMIED 0 R/W Input Capture/Compare Match Interrupt Enable D 0: Interrupt requests (IMID) by IMFD flag are disabled 1: Interrupt requests (IMID) by IMFD flag are enabled 2 IMIEC 0 R/W Input Capture/Compare Match Interrupt Enable C 0: Interrupt requests (IMIC) by IMFC flag are disabled 1: Interrupt requests (IMIC) by IMFC flag are enabled 1 IMIEB 0 R/W Input Capture/Compare Match Interrupt Enable B 0: Interrupt requests (IMIB) by IMFB flag are disabled 1: Interrupt requests (IMIB) by IMFB flag are enabled 0 IMIEA 0 R/W Input Capture/Compare Match Interrupt Enable A 0: Interrupt requests (IMIA) by IMFA flag are disabled 1: Interrupt requests (IMIA) by IMFA flag are enabled Rev.5.00 Nov. 02, 2005 Page 196 of 500 REJ09B0027-0500 Section 13 Timer Z 13.3.13 PWM Mode Output Level Control Register (POCR) POCR control the active level in PWM mode. Timer Z has two POCR registers, one for each channel. Bit Bit Name Initial value R/W Description 7 to 3 All 1 Reserved 2 POLD 0 R/W These bits are always read as 1. PWM Mode Output Level Control D 0: The output level of FTIOD is low-active 1: The output level of FTIOD is high-active 1 POLC 0 R/W PWM Mode Output Level Control C 0: The output level of FTIOC is low-active 1: The output level of FTIOC is high-active 0 POLB 0 R/W PWM Mode Output Level Control B 0: The output level of FTIOB is low-active 1: The output level of FTIOB is high-active 13.3.14 Interface with CPU 1. 16-bit register TCNT and GR are 16-bit registers. Reading/writing in a 16-bit unit is enabled but disabled in an 8-bit unit since the data bus with the CPU is 16-bit width. These registers must always be accessed in a 16-bit unit. Figure 13.5 shows an example of accessing the 16-bit registers. Internal data bus H C P L Module data bus Bus interface U TCNTH TCNTL Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits)) Rev.5.00 Nov. 02, 2005 Page 197 of 500 REJ09B0027-0500 Section 13 Timer Z 2. 8-bit register Registers other than TCNT and GR are 8-bit registers that are connected internally with the CPU in an 8-bit width. Figure 13.6 shows an example of accessing the 8-bit registers. Internal data bus H C P L Module data bus Bus interface U TSTR Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits)) Rev.5.00 Nov. 02, 2005 Page 198 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4 Operation 13.4.1 Counter Operation When one of bits STR0 and STR1 in TSTR is set to 1, the TCNT counter for the corresponding channel begins counting. TCNT can operate as a free-running counter, periodic counter, for example. Figure 13.7 shows an example of the counter operation setting procedure. Operation selection Select counter clock [1] Periodic counter Free-running counter Select counter clearing source [2] Select output compare register [3] Set period Start count operation [4] [5] [1] Select the counter clock with bits TPSC2 to TPSC0 in TCR. When an external clock is selected, select the external clock edge with bits CKEG1 and CKEG0 in TCR. [2] For periodic counter operation, select the TCNT clearing source with bits CCLR2 to CCLR0 in TCR. [3] Designate the general register selected in [2] as an output compare register by means of TIOR. [4] Set the periodic counter cycle in the general register selected in [2]. [5] Set the STR bit in TSTR to 1 to start the counter operation. Figure 13.7 Example of Counter Operation Setting Procedure 1. Free-running count operation and periodic count operation Immediately after a reset, the TCNT counters for channels 0 and 1 are all designated as freerunning counters. When the relevant bit in TSTR is set to 1, the corresponding TCNT counter starts an increment operation as a free-running counter. When TCNT overflows, the OVF flag in TSR is set to 1. If the value of the OVIE bit in the corresponding TIER is 1 at this point, timer Z requests an interrupt. After overflow, TCNT starts an increment operation again from H'0000. Rev.5.00 Nov. 02, 2005 Page 199 of 500 REJ09B0027-0500 Section 13 Timer Z Figure 13.8 illustrates free-running counter operation. TCNT value H'FFFF H'0000 Time STR0, STR1 OVF Figure 13.8 Free-Running Counter Operation When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant channel performs periodic count operation. The GR registers for setting the period are designated as output compare registers, and counter clearing by compare match is selected by means of bits CCLR1 and CCLR0 in TCR. After the settings have been made, TCNT starts an increment operation as a periodic counter when the corresponding bit in TSTR is set to 1. When the count value matches the value in GR, the IMFA, IMFB, IMFC, or IMFD flag in TSR is set to 1 and TCNT is cleared to H'0000. If the value of the corresponding IMIEA, IMIEB, IMIEC, or IMIED bit in TIER is 1 at this point, the timer Z requests an interrupt. After a compare match, TCNT starts an increment operation again from H'0000. Figure 13.9 illustrates periodic counter operation. Rev.5.00 Nov. 02, 2005 Page 200 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT value Counter cleared by GR compare match GR value H'0000 Time STR IMF Figure 13.9 Periodic Counter Operation 2. TCNT count timing A. Internal clock operation A system clock (φ) or three types of clocks (φ/2, φ/4, or φ/8) that divides the system clock can be selected by bits TPSC2 to TPSC0 in TCR. Figure 13.10 illustrates this timing. φ Internal clock TCNT input TCNT N-1 N N+1 Figure 13.10 Count Timing at Internal Clock Operation Rev.5.00 Nov. 02, 2005 Page 201 of 500 REJ09B0027-0500 Section 13 Timer Z B. External clock operation An external clock input pin (TCLK) can be selected by bits TPSC2 to TPSC0 in TCR, and a detection edge can be selected by bits CKEG1 and CKEG0. To detect an external clock, the rising edge, falling edge, or both edges can be selected. The pulse width of the external clock needs two or more system clocks. Note that an external clock does not operate correctly with the lower pulse width. Figure 13.11 illustrates the detection timing of the rising and falling edges. φ External clock input pin TCNT input TCNT N-1 N N+1 Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected) Rev.5.00 Nov. 02, 2005 Page 202 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.2 Waveform Output by Compare Match Timer Z can perform 0, 1, or toggle output from the corresponding FTIOA, FTIOB, FTIOC, or FTIOD output pin using compare match A, B, C, or D. Figure 13.12 shows an example of the setting procedure for waveform output by compare match. Output selection Select waveform output mode [1] Set output timing [2] Enable waveform output [3] Start count operation [4] [1] Select 0 output, 1 output, or toggle output as a compare much output, by means of TIOR. The initial values set in TOCR are output unit the first compare match occurs. [2] Set the timing for compare match generation in GRA/GRB/GRC/GRD. [3] Enable or disable the timer output by TOER. [4] Set the STR bit in TSTR to 1 to start the TCNT count operation. <Waveform output> Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match Rev.5.00 Nov. 02, 2005 Page 203 of 500 REJ09B0027-0500 Section 13 Timer Z 1. Examples of waveform output operation Figure 13.13 shows an example of 0 output/1 output. In this example, TCNT has been designated as a free-running counter, and settings have been made such that 0 is output by compare match A, and 1 is output by compare match B. When the set level and the pin level coincide, the pin level does not change. TCNT value H'FFFF Time H'0000 FTIOB No change FTIOA No change No change No change Figure 13.13 Example of 0 Output/1 Output Operation Figure 13.14 shows an example of toggle output. In this example, TCNT has been designated as a periodic counter (with counter clearing on compare match B), and settings have been made such that the output is toggled by both compare match A and compare match B. Rev.5.00 Nov. 02, 2005 Page 204 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT value GRB GRA Time H'0000 Toggle output FTIOB FTIOA Toggle output Figure 13.14 Example of Toggle Output Operation Rev.5.00 Nov. 02, 2005 Page 205 of 500 REJ09B0027-0500 Section 13 Timer Z 2. Output compare timing The compare match signal is generated in the last state in which TCNT and GR match (when TCNT changes from the matching value to the next value). When the compare match signal is generated, the output value selected in TIOR is output at the compare match output pin (FTIOA, FTIOB, FTIOC, or FTIOD). When TCNT matches GR, the compare match signal is generated only after the next TCNT input clock pulse is input. Figure 13.15 shows an example of the output compare timing. φ TCNT input TCNT N GR N N+1 Compare match signal FTIOA to FTIOD Figure 13.15 Output Compare Timing Rev.5.00 Nov. 02, 2005 Page 206 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.3 Input Capture Function The TCNT value can be transferred to GR on detection of the input edge of the input capture/output compare pin (FTIOA, FTIOB, FTIOC, or FTIOD). Rising edge, falling edge, or both edges can be selected as the detected edge. When the input capture function is used, the pulse width or period can be measured. Figure 13.16 shows an example of the input capture operation setting procedure. Input selection Select input edge of input capture [1] Start counter operation [2] [1] Designate GR as an input capture register by means of TIOR, and select rising edge, falling edge, or both edges as the input edge of the input capture signal. [2] Set the STR bit in TSTR to 1 to start the TCNT counter operation. <Input capture operation> Figure 13.16 Example of Input Capture Operation Setting Procedure Rev.5.00 Nov. 02, 2005 Page 207 of 500 REJ09B0027-0500 Section 13 Timer Z 1. Example of input capture operation Figure 13.17 shows an example of input capture operation. In this example, both rising and falling edges have been selected as the FTIOA pin input capture input edge, the falling edge has been selected as the FTIOB pin input capture input edge, and counter clearing by GRB input capture has been designated for TCNT. Counter cleared by FTIOB input (falling edge) TCNT value H'0180 H'0160 H'0005 H'0000 Time FTIOB FTIOA GRA H'0005 GRB H'0160 H'0180 Figure 13.17 Example of Input Capture Operation Rev.5.00 Nov. 02, 2005 Page 208 of 500 REJ09B0027-0500 Section 13 Timer Z 2. Input capture signal timing Input capture on the rising edge, falling edge, or both edges can be selected through settings in TIOR. Figure 13.18 shows the timing when the rising edge is selected. The pulse width of the input capture signal must be at least two system clock (φ) cycles. φ Input capture input Input capture signal TCNT GR N N Figure 13.18 Input Capture Signal Timing Rev.5.00 Nov. 02, 2005 Page 209 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.4 Synchronous Operation In synchronous operation, the values in a number of TCNT counters can be rewritten simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous operation enables GR to be increased with respect to a single time base. Figure 13.19 shows an example of the synchronous operation setting procedure. Synchronous operation selection Set synchronous operation [1] Synchronous presetting Set TCNT Synchronous clearing [2] Clearing source generation channel? No Yes <Synchronous presetting> Select counter clearing source [3] Select counter clearing source [4] Start counter operation [5] Start counter operation [5] <Counter clearing> <Synchronous clearing> [1] Set the SYNC bits in TMDR to 1. [2] When a value is written to either of the TCNT counters, the same value is simultaneously written to the other TCNT counter. [3] Set bits CCLR1 and CCLR0 in TCR to specify counter clearing by compare match/input capture. [4] Set bits CCLR1 and CCLR0 in TCR to designate synchronous clearing for the counter clearing source. [5] Set the STR bit in TSTR to 1 to start the count operation. Figure 13.19 Example of Synchronous Operation Setting Procedure Rev.5.00 Nov. 02, 2005 Page 210 of 500 REJ09B0027-0500 Section 13 Timer Z Figure 13.20 shows an example of synchronous operation. In this example, synchronous operation has been selected, FTIOB0 and FTIOB1 have been designated for PWM mode, GRA_0 compare match has been set as the channel 0 counter clearing source, and synchronous clearing has been set for the channel 1 counter clearing source. In addition, the same input clock has been set as the counter input clock for channel 0 and channel 1. Two-phase PWM waveforms are output from pins FTIOB0 and FTIOB1. At this time, synchronous presetting and synchronous operation by GRA_0 compare match are performed by TCNT counters. For details on PWM mode, see section 13.4.5, PWM Mode. TCNT values Synchronous clearing by GRA_0 compare match GRA_0 GRA_1 GRB_0 GRB_1 H'0000 Time FTIOB0 FTIOB1 Figure 13.20 Example of Synchronous Operation 13.4.5 PWM Mode In PWM mode, PWM waveforms are output from the FTIOB, FTIOC, and FTIOD output pins with GRA as a cycle register and GRB, GRC, and GRD as duty registers. The initial output level of the corresponding pin depends on the setting values of TOCR and POCR. Table 13.3 shows an example of the initial output level of the FTIOB0 pin. The output level is determined by the POLB to POLD bits corresponding to POCR. When POLB is 0, the FTIOB output pin is set to 0 by compare match B and set to 1 by compare match A. When POLB is 1, the FTIOB output pin is set to 1 by compare match B and cleared to 0 by compare match A. In PWM mode, maximum 6-phase PWM outputs are possible. Figure 13.21 shows an example of the PWM mode setting procedure. Rev.5.00 Nov. 02, 2005 Page 211 of 500 REJ09B0027-0500 Section 13 Timer Z Table 13.3 Initial Output Level of FTIOB0 Pin TOB0 POLB Initial Output Level 0 0 1 0 1 0 1 0 0 1 1 1 PWM mode Select counter clock [1] Select counter clearing source [2] Set PWM mode [3] Set initial output level [4] Select output level [5] Set GR [6] Enable waveform output [7] Start counter operation [8] [1] Select the counter clock with bits TPSC2 to TOSC0 in TCR. When an external clock is selected, select the external clock edge with bits CKEG1 and CKEG0 in TCR. [2] Use bits CCLR1 and CCLR0 in TCR to select the counter clearing source. [3] Select the PWM mode with bits PWMB0 to PWMD0 and PWMB1 to PWMD1 in TPMR. [4] Set the initial output value with bits TOB0 to TOD0 and TOB1 to TOD1 in TOCR. [5] Set the output level with bits POLB to POLD in POCR. [6] Set the cycle in GRA, and set the duty in the other GR. [7] Enable or disable the timer output by TOER. [8] Set the STR bit in TSTR to 1 and start the counter operation. <PWM mode> Figure 13.21 Example of PWM Mode Setting Procedure Rev.5.00 Nov. 02, 2005 Page 212 of 500 REJ09B0027-0500 Section 13 Timer Z Figure 13.22 shows an example of operation in PWM mode. The output signals go to 1 and TCNT is reset at compare match A, and the output signals go to 0 at compare match B, C, and D (TOB, TOC, and TOD = 1, POLB, POLC, and POLD = 0). Counter cleared by GRA compare match TCNT value GRA GRB GRC GRD H'0000 Time FTIOB FTIOC FTIOD Figure 13.22 Example of PWM Mode Operation (1) Figure 13.23 shows another example of operation in PWM mode. The output signals go to 0 and TCNT is reset at compare match A, and the output signals go to 1 at compare match B, C, and D (TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1). Rev.5.00 Nov. 02, 2005 Page 213 of 500 REJ09B0027-0500 Section 13 Timer Z Counter cleared by GRA compare match TCNT value GRA GRB GRC GRD H'0000 Time FTIOB FTIOC FTIOD Figure 13.23 Example of PWM Mode Operation (2) Figures 13.24 (when TOB, TOC, and TOD = 1, POLB, POLC, and POLD = 0) and 13.25 (when TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1) show examples of the output of PWM waveforms with duty cycles of 0% and 100% in PWM mode. Rev.5.00 Nov. 02, 2005 Page 214 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT value GRB rewritten GRA GRB GRB rewritten Time H'0000 0% duty FTIOB TCNT value GRB rewritten When cycle register and duty register compare matches occur simultaneously, duty register compare match has priority. GRA GRB rewritten GRB rewritten GRB H'0000 Time FTIOB 100% duty TCNT value GRB rewritten When cycle register and duty register compare matches occur simultaneously, duty register compare match has priority. GRB rewritten GRA GRB rewritten GRB H'0000 FTIOB Time 100% duty 0% duty Figure 13.24 Example of PWM Mode Operation (3) Rev.5.00 Nov. 02, 2005 Page 215 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT value GRB rewritten GRA GRB GRB rewritten H'0000 Time FTIOB 0% duty TCNT value GRB rewritten When cycle register and duty register compare matches occur simultaneously, duty register compare match has priority. GRA GRB rewritten GRB rewritten GRB Time H'0000 100% duty FTIOB When cycle register and duty register compare matches occur simultaneously, duty register compare match has priority. TCNT value GRB rewritten GRB rewritten GRA GRB rewritten GRB Time H'0000 100% duty FTIOB 0% duty Figure 13.25 Example of PWM Mode Operation (4) Rev.5.00 Nov. 02, 2005 Page 216 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.6 Reset Synchronous PWM Mode Three normal- and counter-phase PWM waveforms are output by combining channels 0 and 1 that one of changing points of waveforms will be common. In reset synchronous PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become PWM-output pins automatically. TCNT_0 performs an increment operation. Tables 13.4 and 13.5 show the PWM-output pins used and the register settings, respectively. Figure 13.26 shows the example of reset synchronous PWM mode setting procedure. Table 13.4 Output Pins in Reset Synchronous PWM Mode Channel Pin Name Input/Output Pin Function 0 FTIOC0 Output Toggle output in synchronous with PWM cycle 0 FTIOB0 Output PWM output 1 0 FTIOD0 Output PWM output 1 (counter-phase waveform of PWM output 1) 1 FTIOA1 Output PWM output 2 1 FTIOC1 Output PWM output 2 (counter-phase waveform of PWM output 2) 1 FTIOB1 Output PWM output 3 1 FTIOD1 Output PWM output 3 (counter-phase waveform of PWM output 3) Table 13.5 Register Settings in Reset Synchronous PWM Mode Register Description TCNT_0 Initial setting of H'0000 TCNT_1 Not used (independently operates) GRA_0 Sets counter cycle of TCNT_0 GRB_0 Set a changing point of the PWM waveform output from pins FTIOB0 and FTIOD0. GRA_1 Set a changing point of the PWM waveform output from pins FTIOA1 and FTIOC1. GRB_1 Set a changing point of the PWM waveform output from pins FTIOB1 and FTIOD1. Rev.5.00 Nov. 02, 2005 Page 217 of 500 REJ09B0027-0500 Section 13 Timer Z Reset synchronous PWM mode Stop counter operation [1] Select counter clock [2] Select counter clearing source [3] Set reset synchronous PWM mode [4] Initialize the output pin [5] Set TCNT [6] Set GR [7] Enable waveform output [8] Start counter operation [9] [1] Clear bit STR0 in TSTR to 0 and stop the counter operation of TCNT_0. Set reset synchronous PWM mode after TCNT_0 stops. [2] Select the counter clock with bits TPSC2 to TOSC0 in TCR. When an external clock is selected, select the external clock edge with bits CKEG1 and CKEG0 in TCR. [3] Use bits CCLR1 and CCLR0 in TCR to select counter clearing source GRA_0. [4] Select the reset synchronous PWM mode with bits CMD1 and CMD0 in TFCR. FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 become PWM output pins automatically. [5] Set H'00 to TOCR. [6] Set TCNT_0 as H'0000. TCNT1 does not need to be set. [7] GRA_0 is a cycle register. Set a cycle for GRA_0. Set the changing point timing of the PWM output waveform for GRB_0, GRA_1, and GRB_1. [8] Enable or disable the timer output by TOER. [9] Set the STR bit in TSTR to 1 and start the counter operation. <Reset synchronous PWM mode> Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure Rev.5.00 Nov. 02, 2005 Page 218 of 500 REJ09B0027-0500 Section 13 Timer Z Figures 13.27 and 13.28 show examples of operation in reset synchronous PWM mode. Counter cleared by GRA compare match TCNT value GRA_0 GRB_0 GRA_1 GRB_1 H'0000 Time FTIOB0 FTIOD0 FTIOA1 FTIOC1 FTIOB1 FTIOD1 FTIOC0 Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1) Rev.5.00 Nov. 02, 2005 Page 219 of 500 REJ09B0027-0500 Section 13 Timer Z Counter cleared by GRA compare match TCNT value GRA_0 GRB_0 GRA_1 GRB_1 H'0000 Time FTIOB0 FTIOD0 FTIOA1 FTIOC1 FTIOB1 FTIOD1 FTIOC0 Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0) In reset synchronous PWM mode, TCNT_0 and TCNT_1 perform increment and independent operations, respectively. However, GRA_1 and GRB_1 are separated from TCNT_1. When a compare match occurs between TCNT_0 and GRA_0, a counter is cleared and an increment operation is restarted from H'0000. The PWM pin outputs 0 or 1 whenever a compare match between GRB_0, GRA_1, GRB_1 and TCNT_0 or counter clearing occur. For details on operations when reset synchronous PWM mode and buffer operation are simultaneously set, refer to section 13.4.8, Buffer Operation. Rev.5.00 Nov. 02, 2005 Page 220 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.7 Complementary PWM Mode Three PWM waveforms for non-overlapped normal and counter phases are output by combining channels 0 and 1. In complementary PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become PWM-output pins automatically. TCNT_0 and TCNT_1 perform an increment or decrement operation. Tables 13.6 and 13.7 show the output pins and register settings in complementary PWM mode, respectively. Figure 13.29 shows the example of complementary PWM mode setting procedure. Table 13.6 Output Pins in Complementary PWM Mode Channel Pin Name Input/Output Pin Function 0 FTIOC0 Output Toggle output in synchronous with PWM cycle 0 FTIOB0 Output PWM output 1 0 FTIOD0 Output PWM output 1 (counter-phase waveform nonoverlapped with PWM output 1) 1 FTIOA1 Output PWM output 2 1 FTIOC1 Output PWM output 2 (counter-phase waveform nonoverlapped with PWM output 2) 1 FTIOB1 Output PWM output 3 1 FTIOD1 Output PWM output 3 (counter-phase waveform nonoverlapped with PWM output 3) Table 13.7 Register Settings in Complementary PWM Mode Register Description TCNT_0 Initial setting of non-overlapped periods (non-overlapped periods are differences with TCNT_1) TCNT_1 Initial setting of H'0000 GRA_0 Sets (upper limit value – 1) of TCNT_0 GRB_0 Set a changing point of the PWM waveform output from pins FTIOB0 and FTIOD0. GRA_1 Set a changing point of the PWM waveform output from pins FTIOA1 and FTIOC1. GRB_1 Set a changing point of the PWM waveform output from pins FTIOB1 and FTIOD1. Rev.5.00 Nov. 02, 2005 Page 221 of 500 REJ09B0027-0500 Section 13 Timer Z Complementary PWM mode Stop counter operation [1] Initialize output pin [2] Select counter clock [3] Set complementary PWM mode [4] Initialize output pin [5] Set TCNT [6] Set GR [7] Enable waveform output [8] Start counter operation [9] [1] Clear bits STR0 and STR1 in TSTR to 0, and stop the counter operation of TCNT_0. Stop TCNT_0 and TCNT_1 and set complementary PWM mode. [2] Write H'00 to TOCR. [3] Use bits TPSC2 to TPSC0 in TCR to select the same counter clock for channels 0 and 1. When an external clock is selected, select the edge of the external clock by bits CKEG1 and CKEG0 in TCR. Do not use bits CCLR1 and CCLR0 in TCR to clear the counter. [4] Use bits CMD1 and CMD0 in TFCR to set complementary PWM mode. FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 automatically become PWM output pins. [5] Set H'00 to TOCR. [6] TCNT_1 must be H'0000. Set a nonoverlapped period to TCNT_0. [7] GRA_0 is a cycle register. Set the cycle to GRA_0. Set the timing to change the PWM output waveform to GRB_0, GRA_1, and GRB_1. Note that the timing must be set within the range of compare match carried out for TCNT_0 and TCNT_1. For GR settings, see 3. Setting GR Value in Complementary PWM Mode in section 13.4.7. [8] Use TOER to enable or disable the timer output. [9] Set the STR0 and STR1 bits in TSTR to 1 to start the count operation. <Complementary PWM mode> Note: To re-enter complementary PWM mode, first, enter a mode other than the complementary PWM mode. After that, repeat the setting procedures from step [1]. For settings of waveform outputs with a duty cycle of 0% and 100%, see the settings shown in 2. Examples of Complementary PWM Mode Operation and 3. Setting GR Value in Complementary PWM Mode in section 13.4.7. Figure 13.29 Example of Complementar y PWM Mode Setting Procedure Rev.5.00 Nov. 02, 2005 Page 222 of 500 REJ09B0027-0500 Section 13 Timer Z 1. Canceling Procedure of Complementary PWM Mode: Figure 13.30 shows the complementary PWM mode canceling procedure. Complementary PWM mode Stop counter operation [1] Cancel complementary PWM mode [2] [1] Clear bit CMD1 in TFCR to 0, and set channels 0 and 1 to normal operation. [2] After setting channels 0 and 1 to normal operation, clear bits STR0 and STR1 in TSTR to 0 and stop TCNT0 and TCNT1. <Normal operation> Figure 13.30 Canceling Procedure of Complementary PWM Mode 2. Examples of Complementary PWM Mode Operation: Figure 13.31 shows an example of complementary PWM mode operation. In complementary PWM mode, TCNT_0 and TCNT_1 perform an increment or decrement operation. When TCNT_0 and GRA_0 are compared and their contents match, the counter is decremented, and when TCNT_1 underflows, the counter is incremented. In GRA_0, GRA_1, and GRB_1, compare match is carried out in the order of TCNT_0 → TCNT_1 → TCNT_1 → TCNT_0 and PWM waveform is output, during one cycle of a up/down counter. In this mode, the initial setting will be TCNT_0 > TCNT_1. Rev.5.00 Nov. 02, 2005 Page 223 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT_0 and GRA_0 are compared and their contents match TCNT values GRA_0 GRB_0 GRA_1 GRB_1 H'0000 Time FTIOB0 FTIOD0 FTIOA1 FTIOC1 FTIOB1 FTIOD1 FTIOC0 Figure 13.31 Example of Complementary PWM Mode Operation (1) Figure 13.32 (1) and (2) show examples of PWM waveform output with 0% duty and 100% duty in complementary PWM mode (for one phase). • TPSC2 = TPSC1 = TPSC0 = 0 Set GRB_0 to H'0000 or a value equal to or more than GRA_0. The waveform with a duty cycle of 0% and 100% can be output. When buffer operation is used together, the duty cycles can easily be changed, including the above settings, during operation. For details on buffer operation, refer to section 13.4.8, Buffer Operation. • Other than TPSC2 = TPSC1 = TPSC0 = 0 Set GRB_0 to satisfy the following expression: GRA_0 + 1 < GRB_0 < H'FFFF. The waveform with a duty cycle of 0% and 100% can be output. For details on 0%- and 100%-duty cycle waveform output, see 3. C., Outputting a waveform with a duty cycle of 0% and 100% in section 13.4.7. Rev.5.00 Nov. 02, 2005 Page 224 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT values GRA0 GRB0 H'0000 Time FTIOB0 FTIOD0 0% duty (a) When duty is 0% TCNT values GRA0 GRB0 H'0000 Time FTIOB0 FTIOD0 100% duty (b) When duty is 100% Figure 13.32 (1) Example of Complementary PWM Mode Operation (TPSC2 = TPSC1 = TPSC0 = 0) (2) Rev.5.00 Nov. 02, 2005 Page 225 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT values GRA0 GRB0 H'0000 Time FTIOB0 FTIOD0 0% duty (a) When duty is 0% TCNT values GRA0 GRB0 H'0000 Time FTIOB0 FTIOD0 100% duty (b) When duty is 100% Figure 13.32 (2) Example of Complementary PWM Mode Operation (TPSC2 = TPSC1 = TPSC0 ≠ 0) (3) Rev.5.00 Nov. 02, 2005 Page 226 of 500 REJ09B0027-0500 Section 13 Timer Z In complementary PWM mode, when the counter switches from up-counter to down-counter or vice versa, TCNT_0 and TCNT_1 overshoots or undershoots, respectively. In this case, the conditions to set the IMFA flag in channel 0 and the UDF flag in channel 1 differ from usual settings. Also, the transfer conditions in buffer operation differ from usual settings. Such timings are shown in figures 13.33 and 13.34. TCNT N-1 N N N+1 N-1 N GRA_0 IMFA Set to 1 Flag is not set Buffer transfer signal GR Transferred to buffer Not transferred to buffer Figure 13.33 Timing of Overshooting TCNT H'0001 H'0000 H'FFFF H'0000 H'0001 Flag is not set UDF Set to 1 Buffer transfer signal GR Transferred to buffer Not transferred to buffer Figure 13.34 Timing of Undershooting Rev.5.00 Nov. 02, 2005 Page 227 of 500 REJ09B0027-0500 Section 13 Timer Z When the counter is incremented or decremented, the IMFA flag of channel 0 is set to 1, and when the register is underflowed, the UDF flag of channel 0 is set to 1. After buffer operation has been designated for BR, BR is transferred to GR when the counter is incremented by compare match A0 or when TCNT_1 is underflowed. If the φ or φ/2 clock is selected by TPSC2 to TPSC0 bits, the OVF flag is not set to 1 at the timing that the counter value changes from H'FFFF to H'0000. If the φ/4 or φ/8 clock is selected by TPSC2 to TPSC0 bits, the OVF flag is set to 1. 3. Setting GR Value in Complementary PWM Mode: To set the general register (GR) or modify GR during operation in complementary PWM mode, refer to the following notes. A. Initial value a. When other than TPSC2 = TPSC1 = TPSC0 = 0, the GRA_0 value must be equal to H'FFFC or less. When TPSC2 = TPSC1 = TPSC0 = 0, the GRA_0 value can be set to H'FFFF or less. b. H'0000 to T – 1 (T: Initial value of TCNT0) must not be set for the initial value. c. GRA_0 – (T – 1) or more must not be set for the initial value. d. When using buffer operation, the same values must be set in the buffer registers and corresponding general registers. B. Modifying the setting value a. Writing to GR directly must be performed while the TCNT_1 and TCNT_0 values should satisfy the following expression: H'0000 ≤ TCNT_1 < previous GR value, and previous GR value < TCNT_0 ≤ GRA_0. Otherwise, a waveform is not output correctly. For details on outputting a waveform with a duty cycle of 0% and 100%, see C., Outputting a waveform with a duty cycle of 0% and 100%. b. Do not write the following values to GR directly. When writing the values, a waveform is not output correctly. H'0000 ≤ GR ≤ T − 1 and GRA_0 − (T − 1) ≤ GR < GRA_0 when TPSC2 = TPSC1 = TPSC0 = 0 H'0000 < GR ≤ T − 1 and GRA_0 − (T − 1) ≤ GR < GRA_0 + 1 when TPSC2 = TPSC1 = TPSC0 = 0 c. Do not change settings of GRA_0 during operation. C. Outputting a waveform with a duty cycle of 0% and 100% a. Buffer operation is not used and TPSC2 = TPSC1 = TPSC0 = 0 Write H'0000 or a value equal to or more than the GRA_0 value to GR directly at the timing shown below. • To output a 0%-duty cycle waveform, write a value equal to or more than the GRA_0 value while H'0000 ≤ TCNT_1 < previous GR value • To output a 100%-duty cycle waveform, write H'0000 while previous GR value< TCNT_0 ≤ GRA_0 Rev.5.00 Nov. 02, 2005 Page 228 of 500 REJ09B0027-0500 Section 13 Timer Z • • b. • • c. • • To change duty cycles while a waveform with a duty cycle of 0% or 100% is being output, make sure the following procedure. To change duty cycles while a 0%-duty cycle waveform is being output, write to GR while H'0000 ≤ TCNT_1 < previous GR value To change duty cycles while a 100%-duty cycle waveform is being output, write to GR while previous GR value< TCNT_0 ≤ GRA_0 Note that changing from a 0%-duty cycle waveform to a 100%-duty cycle waveform and vice versa is not possible. Buffer operation is used and TPSC2 = TPSC1 = TPSC0 = 0 Write H'0000 or a value equal to or more than the GRA_0 value to the buffer register. To output a 0%-duty cycle waveform, write a value equal to or more than the GRA_0 value to the buffer register To output a 100%-duty cycle waveform, write H'0000 to the buffer register For details on buffer operation, see section 13.4.8, Buffer Operation. Buffer operation is not used and other than TPSC2 = TPSC1 = TPSC0 = 0 Write a value which satisfies GRA_0 + 1 < GR < H'FFFF to GR directly at the timing shown below. To output a 0%-duty cycle waveform, write the value while H'0000 ≤ TCNT_1 < previous GR value To output a 100%-duty cycle waveform, write the value while previous GR value< TCNT_0 ≤ GRA_0 To change duty cycles while a waveform with a duty cycle of 0% and 100% is being output, the following procedure must be followed. • To change duty cycles while a 0%-duty cycle waveform is being output, write to GR while H'0000 ≤ TCNT_1 < previous GR value • To change duty cycles while a 100%-duty cycle waveform is being output, write to GR while previous GR value< TCNT_0 ≤ GRA_0 Note that changing from a 0%-duty cycle waveform to a 100%-duty cycle waveform and vice versa is not possible. d. Buffer operation is used and other than TPSC2 = TPSC1 = TPSC0 = 0 Write a value which satisfies GRA_0 + 1 < GR < H'FFFF to the buffer register. A waveform with a duty cycle of 0% can be output. However, a waveform with a duty cycle of 100% cannot be output using the buffer operation. Also, the buffer operation cannot be used to change duty cycles while a waveform with a duty cycle of 100% is being output. For details on buffer operation, see section 13.4.8, Buffer Operation. Rev.5.00 Nov. 02, 2005 Page 229 of 500 REJ09B0027-0500 Section 13 Timer Z 13.4.8 Buffer Operation Buffer operation differs depending on whether GR has been designated for an input capture register or an output compare register, or in reset synchronous PWM mode or complementary PWM mode. Table 13.8 shows the register combinations used in buffer operation. Table 13.8 Register Combinations in Buffer Operation General Register Buffer Register GRA GRC GRB GRD 1. When GR is an output compare register When a compare match occurs, the value in the buffer register of the corresponding channel is transferred to the general register. This operation is illustrated in figure 13.35. Compare match signal General register Buffer register Comparator TCNT Figure 13.35 Compare Match Buffer Operation 2. When GR is an input capture register When an input capture occurs, the value in TCNT is transferred to the general register and the value previously stored in the general register is transferred to the buffer register. This operation is illustrated in figure 13.36. Rev.5.00 Nov. 02, 2005 Page 230 of 500 REJ09B0027-0500 Section 13 Timer Z Input capture signal General register Buffer register TCNT Figure 13.36 Input Capture Buffer Operation 3. Complementary PWM Mode When the counter switches from counting up to counting down or vice versa, the value of the buffer register is transferred to the general register. Here, the value of the buffer register is transferred to the general register in the following timing: A. When TCNT_0 and GRA_0 are compared and their contents match B. When TCNT_1 underflows 4. Reset Synchronous PWM Mode The value of the buffer register is transferred from compare match A0 to the general register. 5. Example of Buffer Operation Setting Procedure Figure 13.37 shows an example of the buffer operation setting procedure. Buffer operation Select GR function [1] Set buffer operation [2] Start count operation [3] [1] Designate GR as an input capture register or output compare register by means of TIOR. [2] Designate GR for buffer operation with bits BFD1, BFC1, BFD0, or BFC0 in TMDR. [3] Set the STR bit in TSTR to 1 to start the count operation of TCNT. <Buffer operation> Figure 13.37 Example of Buffer Operation Setting Procedure Rev.5.00 Nov. 02, 2005 Page 231 of 500 REJ09B0027-0500 Section 13 Timer Z 6. Examples of Buffer Operation Figure 13.38 shows an operation example in which GRA has been designated as an output compare register, and buffer operation has been designated for GRA and GRC. This is an example of TCNT operating as a periodic counter cleared by compare match B. Pins FTIOA and FTIOB are set for toggle output by compare match A and B. As buffer operation has been set, when compare match A occurs, the FTIOA pin performs toggle outputs and the value in buffer register is simultaneously transferred to the general register. This operation is repeated each time that compare match A occurs. The timing to transfer data is shown in figure 13.39. Counter is cleared by GBR compare match TCNT value GRB H'0250 H'0200 H'0100 Time H'0000 GRC H'0200 H'0100 GRA H'0250 H'0200 H'0200 H'0100 H'0200 FTIOB FTIOA Compare match A Figure 13.38 Example of Buffer Operation (1) (Buffer Operation for Output Compare Register) Rev.5.00 Nov. 02, 2005 Page 232 of 500 REJ09B0027-0500 Section 13 Timer Z φ n TCNT n+1 Compare match signal Buffer transfer signal GRC GRA N n N Figure 13.39 Example of Compare Match Timing for Buffer Operation Figure 13.40 shows an operation example in which GRA has been designated as an input capture register, and buffer operation has been designated for GRA and GRC. Counter clearing by input capture B has been set for TCNT, and falling edges have been selected as the FIOCB pin input capture input edge. And both rising and falling edges have been selected as the FIOCA pin input capture input edge. As buffer operation has been set, when the TCNT value is stored in GRA upon the occurrence of input capture A, the value previously stored in GRA is simultaneously transferred to GRC. The transfer timing is shown in figure 13.41. Rev.5.00 Nov. 02, 2005 Page 233 of 500 REJ09B0027-0500 Section 13 Timer Z Counter is cleared by the input capture B TCNT value H'0180 H'0160 H'0005 H'0000 Time FTIOB FTIOA GRA H'0005 H'0160 GRC H'0005 GRB H'0160 H'0180 Input capture A Figure 13.40 Example of Buffer Operation (2) (Buffer Operation for Input Capture Register) Rev.5.00 Nov. 02, 2005 Page 234 of 500 REJ09B0027-0500 Section 13 Timer Z φ FTIO pin Input capture signal TCNT n n+1 N N+1 GRA M n n N GRC m M M n Figure 13.41 Input Capture Timing of Buffer Operation Figures 13.42 and 13.43 show the operation examples when buffer operation has been designated for GRB_0 and GRD_0 in complementary PWM mode. These are examples when a PWM waveform of 0% duty is created by using the buffer operation and performing GRD_0 ≥ GRA_0. Data is transferred from GRD_0 to GRB_0 according to the settings of CMD_0 and CMD_1 when TCNT_0 and GRA_0 are compared and their contents match or when TCNT_1 underflows. However, when GRD_0 ≥ GRA_0, data is transferred from GRD_0 to GRB_0 when TCNT_1 underflows regardless of the setting of CMD_0 and CMD_1. When GRD_0 = H'0000, data is transferred from GRD_0 to GRB_0 when TCNT_0 and GRA_0 are compared and their contents match regardless of the settings of CMD_0 and CMD_1. Rev.5.00 Nov. 02, 2005 Page 235 of 500 REJ09B0027-0500 Section 13 Timer Z TCNT values GRB_0 (When restored, data will be transferred to the saved location regardless of the CMD1 and CMD0 values) TCNT_0 GRA_0 TCNT_1 H'0999 H'0000 Time GRD_0 H'0999 GRB_0 H'0999 H'1FFF H'0999 H'1FFF H'0999 H'0999 FTIOB0 FTIOD0 Figure 13.42 Buffer Operation (3) (Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1) Rev.5.00 Nov. 02, 2005 Page 236 of 500 REJ09B0027-0500 Section 13 Timer Z GRB_0 (When restored, data will be transferred to the saved location regardless of the CMD1 and CMD0 values) TCNT values TCNT_0 GRA_0 TCNT_1 H'0999 H'0000 Time GRB_0 GRD_0 H'0999 GRB_0 H'0999 H'0000 H'0999 H'0000 H'0999 FTIOC0 FTIOD0 Figure 13.43 Buffer Operation (4) (Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1) 13.4.9 Timer Z Output Timing The outputs of channels 0 and 1 can be disabled or inverted by the settings of TOER and TOCR and the external level. 1. Output Disable/Enable Timing of Timer Z by TOER: Setting the master enable bit in TOER to 1 disables the output of timer Z. By setting the PCR and PDR of the corresponding I/O port beforehand, any value can be output. Figure 13.44 shows the timing to enable or disable the output of timer Z by TOER. Rev.5.00 Nov. 02, 2005 Page 237 of 500 REJ09B0027-0500 Section 13 Timer Z T1 T2 φ Address bus TOER address TOER Timer Z output pin I/O port Timer output Timer Z output I/O port Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER 2. Output Disable Timing of Timer Z by External Trigger: When P54/WKP4 is set as a WKP4 input pin, and low level is input to WKP4, the master enable bit in TOER is set to 1 and the output of timer Z will be disabled. φ WKP4 TOER Timer Z output pin N H'FF I/O port Timer Z output Timer Z output I/O port Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger Rev.5.00 Nov. 02, 2005 Page 238 of 500 REJ09B0027-0500 Section 13 Timer Z 3. Output Inverse Timing by TFCR: The output level can be inverted by inverting the OLS1 and OLS0 bits in TFCR in reset synchronous PWM mode or complementary PWM mode. Figure 13.46 shows the timing. T1 T2 φ Address bus TOER address TFCR Timer Z output pin Inverted Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR 4. Output Inverse Timing by POCR: The output level can be inverted by inverting the POLD, POLC, and POLB bits in POCR in PWM mode. Figure 13.47 shows the timing. T1 T2 φ Address bus POCR address TFCR Timer Z output pin Inverted Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR Rev.5.00 Nov. 02, 2005 Page 239 of 500 REJ09B0027-0500 Section 13 Timer Z 13.5 Interrupts There are three kinds of timer Z interrupt sources; input capture/compare match, overflow, and underflow. An interrupt is requested when the corresponding interrupt request flag is set to 1 while the corresponding interrupt enable bit is set to 1. 13.5.1 1. Status Flag Set Timing IMF Flag Set Timing: The IMF flag is set to 1 by the compare match signal that is generated when the GR matches with the TCNT. The compare match signal is generated at the last state of matching (timing to update the counter value when the GR and TCNT match). Therefore, when the TCNT and GR matches, the compare match signal will not be generated until the TCNT input clock is generated. Figure 13.48 shows the timing to set the IMF flag. φ TCNT input clock TCNT N N+1 N GR Compare match signal IMF ITMZ Figure 13.48 IMF Flag Set Timing when Compare Match Occurs Rev.5.00 Nov. 02, 2005 Page 240 of 500 REJ09B0027-0500 Section 13 Timer Z 2. IMF Flag Set Timing at Input Capture: When an input capture signal is generated, the IMF flag is set to 1 and the value of TCNT is simultaneously transferred to corresponding GR. Figure 13.49 shows the timing. φ Input capture signal IMF TCNT N GR N ITMZ Figure 13.49 IMF Flag Set Timing at Input Capture 3. Overflow Flag (OVF) Set Timing: The overflow flag is set to 1 when the TCNT overflows. Figure 13.50 shows the timing. φ TCNT H'FFFF H'0000 Overflow signal OVF ITMZ Figure 13.50 OVF Flag Set Timing Rev.5.00 Nov. 02, 2005 Page 241 of 500 REJ09B0027-0500 Section 13 Timer Z 13.5.2 Status Flag Clearing Timing The status flag can be cleared by writing 0 after reading 1 from the CPU. Figure 13.51 shows the timing in this case. φ Address TSR address WTSR (internal write signal) IMF, OVF ITMZ Figure 13.51 Status Flag Clearing Timing 13.6 Usage Notes 1. Contention between TCNT Write and Clear Operations: If a counter clear signal is generated in the T2 state of a TCNT write cycle, TCNT clearing has priority and the TCNT write is not performed. Figure 13.52 shows the timing in this case. TCNT write cycle T1 T2 φ TCNT address WTCNT (internal write signal) Counter clear signal TCNT N H'0000 Clearing has priority. Figure 13.52 Contention between TCNT Write and Clear Operations Rev.5.00 Nov. 02, 2005 Page 242 of 500 REJ09B0027-0500 Section 13 Timer Z 2. Contention between TCNT Write and Increment Operations: If incrementation is done in T2 state of a TCNT write cycle, TCNT writing has priority. Figure 13.53 shows the timing in this case. TCNT write cycle T1 T2 φ TCNT address WTCNT (internal write signal) TCNT input clock TCNT N M TCNT write data Figure 13.53 Contention between TCNT Write and Increment Operations Rev.5.00 Nov. 02, 2005 Page 243 of 500 REJ09B0027-0500 Section 13 Timer Z 3. Contention between GR Write and Compare Match: If a compare match occurs in the T2 state of a GR write cycle, GR write has priority and the compare match signal is disabled. Figure 13.54 shows the timing in this case. GR write cycle T1 T2 φ GR address WGR (internal write signal) TCNT N GR N N+1 M GR write data Compare match signal Disabled Figure 13.54 Contention between GR Write and Compare Match Rev.5.00 Nov. 02, 2005 Page 244 of 500 REJ09B0027-0500 Section 13 Timer Z 4. Contention between TCNT Write and Overflow/Underflow: If overflow/underflow occurs in the T2 state of a TCNT write cycle, TCNT write has priority without an increment operation. At this time, the OVF flag is set to 1. Figure 13.55 shows the timing in this case. TCNT write cycle T1 T2 φ TCNT address WTCNT (internal write signal) TCNT input clock Overflow signal TCNT H'FFFF M TCNT write data OVF Figure 13.55 Contention between TCNT Write and Overflow Rev.5.00 Nov. 02, 2005 Page 245 of 500 REJ09B0027-0500 Section 13 Timer Z 5. Contention between GR Read and Input Capture: If an input capture signal is generated in the T1 state of a GR read cycle, the data that is read will be transferred before input capture transfer. Figure 13.56 shows the timing in this case. GR read cycle T1 T2 φ GR address Internal read signal Input capture signal GR X Internal data bus M X Figure 13.56 Contention between GR Read and Input Capture Rev.5.00 Nov. 02, 2005 Page 246 of 500 REJ09B0027-0500 Section 13 Timer Z 6. Contention between Count Clearing and Increment Operations by Input Capture: If an input capture and increment signals are simultaneously generated, count clearing by the input capture operation has priority without an increment operation. The TCNT contents before clearing counter are transferred to GR. Figure 13.57 shows the timing in this case. φ Input capture signal Counter clear signal TCNT input clock TCNT GR N H'0000 N Clearing has priority. Figure 13.57 Contention between Count Clearing and Increment Operations by Input Capture Rev.5.00 Nov. 02, 2005 Page 247 of 500 REJ09B0027-0500 Section 13 Timer Z 7. Contention between GR Write and Input Capture: If an input capture signal is generated in the T2 state of a GR write cycle, the input capture operation has priority and the write to GR is not performed. Figure 13.58 shows the timing in this case. GR write cycle T1 T2 φ Address bus GR address WGR (internal write signal) Input capture signal TCNT N GR M GR write data Figure 13.58 Contention between GR Write and Input Capture Rev.5.00 Nov. 02, 2005 Page 248 of 500 REJ09B0027-0500 Section 13 Timer Z 8. Notes on Setting Reset Synchronous PWM Mode/Complementary PWM Mode: When bits CMD1 and CMD0 in TFCR are set, note the following: A. Write bits CMD1 and CMD0 while TCNT_1 and TCNT_0 are halted. B. Changing the settings of reset synchronous PWM mode to complementary PWM mode or vice versa is disabled. Set reset synchronous PWM mode or complementary PWM mode after the normal operation (bits CMD1 and CMD0 are cleared to 0) has been set. 9. Note on Clearing TSR Flag: When a specific flag in TSR is cleared, a combination of the BCLR or MOV instructions is used to read 1 from the flag and then write 0 to the flag. However, if another bit is set during this processing, the bit may also be cleared simultaneously. To avoid this, the following processing that does not use the BCLR instruction must be executed. Note that this note is only applied to the F-ZTAT version. This problem has already been solved in the mask ROM version. Example: When clearing bit 4 (OVF) in TSR MOV.B @TSR,R0L MOV.B #B'11101111, R0L Only the bit to be cleared is 0 and the other bits are all set to 1. MOV.B R0L,@TSR 10. Note on Writing to the TOA0 to TOD0 Bits and the TOA1 to TOD1 Bits in TOCR: The TOA0 to TOD0 bits and the TOA1 to TOD1 bits in TOCR decide the value of the FTIO pin, which is output until the first compare match occurs. Once a compare match occurs and this compare match changes the values of FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 output, the values of the FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 pin output and the values read from the TOA0 to TOD0 and TOA1 to TOD1 bits may differ. Moreover, when the writing to TOCR and the generation of the compare match A0 to D0 and A1 to D1 occur at the same timing, the writing to TOCR has the priority. Thus, output change due to the compare match is not reflected to the FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 pins. Therefore, when bit manipulation instruction is used to write to TOCR, the values of the FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 pin output may result in an unexpected result. When TOCR is to be written to while compare match is operating, stop the counter once before accessing to TOCR, read the port 6 state to reflect the values of FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 output, to TOA0 to TOD0 and TOA1 to TOD1, and then restart the counter. Figure 13.59 shows an example when the compare match and the bit manipulation instruction to TOCR occur at the same timing. Rev.5.00 Nov. 02, 2005 Page 249 of 500 REJ09B0027-0500 Section 13 Timer Z TOCR has been set to H'06. Compare match B0 and compare match C0 are used. The FTIOB0 pin is in the 1 output state, and is set to the toggle output or the 0 output by compare match B0. When BCLR#2, @TOCR is executed to clear the TOC0 bit (the FTIOC0 signal is low) and compare match B0 occurs at the same timing as shown below, the H'02 writing to TOCR has priority and compare match B0 does not drive the FTIOB0 signal low; the FTIOB0 signal remains high. 7 6 5 4 3 2 1 0 TOD1 0 TOC1 0 TOB1 0 TOA1 0 TOD0 0 TOC0 1 TOB0 1 TOA0 0 Bit TOCR Set value BCLR#2, @TOCR (1) TOCR read operation: Read H'06 (2) Modify operation: Modify H'06 to H'02 (3) Write operation to TOCR: Write H'02 φ TOCR write signal Compare match signal B0 FTIOB0 pin Expected output Remains high because the 1 writing to TOB has priority Figure 13.59 When Compare Match and Bit Manipulation Instruction to TOCR Occur at the Same Timing Rev.5.00 Nov. 02, 2005 Page 250 of 500 REJ09B0027-0500 Section 14 Watchdog Timer Section 14 Watchdog Timer The watchdog timer is an 8-bit timer that can generate an internal reset signal for this LSI if a system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow. The block diagram of the watchdog timer is shown in figure 14.1. φ CLK TCSRWD PSS TCWD Internal data bus Internal oscillator TMWD [Legend] TCSRWD: TCWD: PSS: TMWD: Timer control/status register WD Timer counter WD Prescaler S Timer mode register WD Internal reset signal Figure 14.1 Block Diagram of Watchdog Timer 14.1 Features • Selectable from nine counter input clocks. Eight clock sources (φ/64, φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, and φ/8192) or the internal oscillator can be selected as the timer-counter clock. When the internal oscillator is selected, it can operate as the watchdog timer in any operating mode. • Reset signal generated on counter overflow An overflow period of 1 to 256 times the selected clock can be set. 14.2 Register Descriptions The watchdog timer has the following registers. • Timer control/status register WD (TCSRWD) • Timer counter WD (TCWD) • Timer mode register WD (TMWD) WDT0110A_000020020200 Rev.5.00 Nov. 02, 2005 Page 251 of 500 REJ09B0027-0500 Section 14 Watchdog Timer 14.2.1 Timer Control/Status Register WD (TCSRWD) TCSRWD performs the TCSRWD and TCWD write control. TCSRWD also controls the watchdog timer operation and indicates the operating state. TCSRWD must be rewritten by using the MOV instruction. The bit manipulation instruction cannot be used to change the setting value. Bit Bit Name Initial Value R/W Description 7 B6WI 1 R/W Bit 6 Write Inhibit The TCWE bit can be written only when the write value of the B6WI bit is 0. 6 TCWE 0 R/W Timer Counter WD Write Enable TCWD can be written when the TCWE bit is set to 1. When writing data to this bit, the value for bit 7 must be 0. 5 B4WI 1 R/W Bit 4 Write Inhibit The TCSRWE bit can be written only when the write value of the B4WI bit is 0. This bit is always read as 1. 4 TCSRWE 0 R/W Timer Control/Status Register WD Write Enable The WDON and WRST bits can be written when the TCSRWE bit is set to 1. 3 B2WI 1 R/W Bit 2 Write Inhibit This bit can be written to the WDON bit only when the write value of the B2WI bit is 0. This bit is always read as 1. 2 WDON 0 R/W Watchdog Timer On TCWD starts counting up when WDON is set to 1 and halts when WDON is cleared to 0. [Setting condition] When 1 is written to the WDON bit while writing 0 to the B2WI bit when the TCSRWE bit=1 [Clearing conditions] This bit is always read as 1. When writing data to this bit, the value for bit 5 must be 0. 1 B0WI 1 R/W Rev.5.00 Nov. 02, 2005 Page 252 of 500 REJ09B0027-0500 • Reset by RES pin • When 0 is written to the WDON bit while writing 0 to the B2WI when the TCSRWE bit=1 Bit 0 Write Inhibit This bit can be written to the WRST bit only when the write value of the B0WI bit is 0. This bit is always read as 1. Section 14 Watchdog Timer Bit Bit Name 0 WRST 0 Initial Value R/W R/W Description Watchdog Timer Reset [Setting condition] When TCWD overflows and an internal reset signal is generated [Clearing conditions] 14.2.2 • Reset by RES pin • When 0 is written to the WRST bit while writing 0 to the B0WI bit when the TCSRWE bit=1 Timer Counter WD (TCWD) TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the internal reset signal is generated and the WRST bit in TCSRWD is set to 1. TCWD is initialized to H'00. 14.2.3 Timer Mode Register WD (TMWD) TMWD selects the input clock. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1. 3 CKS3 1 R/W Clock Select 3 to 0 2 CKS2 1 R/W Select the clock to be input to TCWD. 1 CKS1 1 R/W 1000: Internal clock: counts on φ/64 0 CKS0 1 R/W 1001: Internal clock: counts on φ/128 1010: Internal clock: counts on φ/256 1011: Internal clock: counts on φ/512 1100: Internal clock: counts on φ/1024 1101: Internal clock: counts on φ/2048 1110: Internal clock: counts on φ/4096 1111: Internal clock: counts on φ8192 0XXX: Internal oscillator For the internal oscillator overflow periods, see section 23, Electrical Characteristics. Legend: X: Don't care. Rev.5.00 Nov. 02, 2005 Page 253 of 500 REJ09B0027-0500 Section 14 Watchdog Timer 14.3 Operation The watchdog timer is provided with an 8-bit counter. If 1 is written to WDON while writing 0 to B2WI when the TCSRWE bit in TCSRWD is set to 1, TCWD begins counting up. (To operate the watchdog timer, two write accesses to TCSRWD are required.) When a clock pulse is input after the TCWD count value has reached H'FF, the watchdog timer overflows and an internal reset signal is generated. The internal reset signal is output for a period of 256 φosc clock cycles. TCWD is a writable counter, and when a value is set in TCWD, the count-up starts from that value. An overflow period in the range of 1 to 256 input clock cycles can therefore be set, according to the TCWD set value. Figure 14.2 shows an example of watchdog timer operation. Example: With 30ms overflow period when φ = 4 MHz 4 × 106 8192 × 30 × 10–3 = 14.6 Therefore, 256 – 15 = 241 (H'F1) is set in TCW. TCWD overflow H'FF H'F1 TCWD count value H'00 Start H'F1 written to TCWD H'F1 written to TCWD Reset generated Internal reset signal 256 φosc clock cycles Figure 14.2 Watchdog Timer Operation Example Rev.5.00 Nov. 02, 2005 Page 254 of 500 REJ09B0027-0500 Section 15 14-Bit PWM Section 15 14-Bit PWM The 14-bit PWM is a pulse division type PWM that can be used for electronic tuner control, etc. Figure 15.1 shows a block diagram of the 14-bit PWM. 15.1 Features • Choice of two conversion periods A conversion period of 32768/φ with a minimum modulation width of 2/φ, or a conversion period of 16384/φ with a minimum modulation width of 1/φ, can be selected. • Pulse division method for less ripple PWDRL PWDRU φ/4 PWM waveform generator φ/2 Internal data bus PWCR PWM [Legend] PWCR: PWDRL: PWDRU: PWM: PWM control register PWM data register L PWM data register U PWM output pin Figure 15.1 Block Diagram of 14-Bit PWM PWM1400A_000120030300 Rev.5.00 Nov. 02, 2005 Page 255 of 500 REJ09B0027-0500 Section 15 14-Bit PWM 15.2 Input/Output Pin Table 15.1 shows the 14-bit PWM pin configuration. Table 15.1 Pin Configuration Name Abbreviation I/O Function 14-bit PWM square-wave output PWM 14-bit PWM square-wave output pin 15.3 Output Register Descriptions The 14-bit PWM has the following registers. • PWM control register (PWCR) • PWM data register U (PWDRU) • PWM data register L (PWDRL) 15.3.1 PWM Control Register (PWCR) PWCR selects the conversion period. Bit Bit Name Initial Value R/W Description 7 to 1 All 1 Reserved These bits are always read as 1, and cannot be modified. 0 PWCR0 0 R/W Clock Select 0: The input clock is φ/2 (tφ = 2/φ) The conversion period is 16384/φ, with a minimum modulation width of 1/φ 1: The input clock is φ/4 (tφ = 4/φ) The conversion period is 32768/φ, with a minimum modulation width of 2/φ Legend: tφ: Period of PWM clock input Rev.5.00 Nov. 02, 2005 Page 256 of 500 REJ09B0027-0500 Section 15 14-Bit PWM 15.3.2 PWM Data Registers U and L (PWDRU, PWDRL) PWDRU and PWDRL indicate high level width in one PWM waveform cycle. PWDRU and PWDRL are 14-bit write-only registers, with the upper 6 bits assigned to PWDRU and the lower 8 bits to PWDRL. When read, all bits are always read as 1. Both PWDRU and PWDRL are accessible only in bytes. Note that the operation is not guaranteed if word access is performed. When 14-bit data is written in PWDRU and PWDRL, the contents are latched in the PWM waveform generator and the PWM waveform generation data is updated. When writing the 14-bit data, the order is as follows: PWDRL to PWDRU. PWDRU and PWDRL are initialized to H'C000. 15.4 Operation When using the 14-bit PWM, set the registers in this sequence: 1. Set the PWM bit in the port mode register 1 (PMR1) to set the P11/PWM pin to function as a PWM output pin. 2. Set the PWCR0 bit in PWCR to select a conversion period of either. 3. Set the output waveform data in PWDRU and PWDRL. Be sure to write byte data first to PWDRL and then to PWDRU. When the data is written in PWDRU, the contents of these registers are latched in the PWM waveform generator, and the PWM waveform generation data is updated in synchronization with internal signals. One conversion period consists of 64 pulses, as shown in figure 15.2. The total high-level width during this period (TH) corresponds to the data in PWDRU and PWDRL. This relation can be expressed as follows: TH = (data value in PWDRU and PWDRL + 64) × tφ/2 where tφ is the period of PWM clock input: 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1). If the data value in PWDRU and PWDRL is from H'FFC0 to H'FFFF, the PWM output stays high. When the data value is H'C000, TH is calculated as follows: TH = 64 × tφ/2 = 32 tφ Rev.5.00 Nov. 02, 2005 Page 257 of 500 REJ09B0027-0500 Section 15 14-Bit PWM Conversion period t f1 t H1 t f2 t H2 t f63 t H3 t H63 t f64 t H64 T H = t H1 + t H2 + t H3 + ... + t H64 t f1 = t f2 = t f3 = ... = t f64 Figure 15.2 Waveform Output by 14-Bit PWM Rev.5.00 Nov. 02, 2005 Page 258 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Section 16 Serial Communication Interface 3 (SCI3) This LSI includes a serial communication interface 3 (SCI3), which has independent two channels. The SCI3 can handle both asynchronous and clocked synchronous serial communication. In asynchronous mode, serial data communication can be carried out using standard asynchronous communication chips such as a Universal Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication Interface Adapter (ACIA). A function is also provided for serial communication between processors (multiprocessor communication function). Table 16.1 shows the SCI3 channel configuration and figure 16.1 shows a block diagram of the SCI3. Since pin functions are identical for each of the two channels (SCI3 and SCI3_2), separate explanations are not given in this section. 16.1 Features • Choice of asynchronous or clocked synchronous serial communication mode • Full-duplex communication capability The transmitter and receiver are mutually independent, enabling transmission and reception to be executed simultaneously. Double-buffering is used in both the transmitter and the receiver, enabling continuous transmission and continuous reception of serial data. • On-chip baud rate generator allows any bit rate to be selected • External clock or on-chip baud rate generator can be selected as a transfer clock source. • Six interrupt sources Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity error. Asynchronous mode • • • • • Data length: 7 or 8 bits Stop bit length: 1 or 2 bits Parity: Even, odd, or none Receive error detection: Parity, overrun, and framing errors Break detection: Break can be detected by reading the RxD pin level directly in the case of a framing error SCI0011A_000020020200 Rev.5.00 Nov. 02, 2005 Page 259 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Clocked synchronous mode • Data length: 8 bits • Receive error detection: Overrun errors Table 16.1 Channel Configuration Channel Abbreviation Pin Register Register Address Channel 1 SCI3* SCK3 RXD TXD SMR H'FFA8 BRR H'FFA9 SCR3 H'FFAA TDR H'FFAB SSR H'FFAC RDR H'FFAD RSR TSR SMR_2 H'F740 BRR_2 H'F741 SCR3_2 H'F742 TDR_2 H'F743 SSR_2 H'F744 RDR_2 H'F745 RSR_2 TSR_2 Channel 2 Note: * SCI3_2 SCK3_2 RXD_2 TXD_2 The channel 1 of the SCI3 is used in on-board programming mode by boot mode. Rev.5.00 Nov. 02, 2005 Page 260 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) SCK3 External clock Internal clock (φ/64, φ/16, φ/4, φ) Baud rate generator BRC BRR Clock Transmit/receive control circuit Internal data bus SMR SCR3 SSR TXD TSR TDR RXD RSR RDR Interrupt request (TEI, TXI, RXI, ERI) [Legend] Receive shift register RSR: Receive data register RDR: Transmit shift register TSR: Transmit data register TDR: Serial mode register SMR: SCR3: Serial control register 3 Serial status register SSR: Bit rate register BRR: Bit rate counter BRC: Figure 16.1 Block Diagram of SCI3 Rev.5.00 Nov. 02, 2005 Page 261 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.2 Input/Output Pins Table 16.2 shows the SCI3 pin configuration. Table 16.2 Pin Configuration Pin Name Abbreviation I/O Function SCI3 clock SCK3 I/O SCI3 clock input/output SCI3 receive data input RXD Input SCI3 receive data input SCI3 transmit data output TXD Output SCI3 transmit data output 16.3 Register Descriptions The SCI3 has the following registers for each channel. • • • • • • • • Receive Shift Register (RSR) Receive Data Register (RDR) Transmit Shift Register (TSR) Transmit Data Register (TDR) Serial Mode Register (SMR) Serial Control Register 3 (SCR3) Serial Status Register (SSR) Bit Rate Register (BRR) Rev.5.00 Nov. 02, 2005 Page 262 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.3.1 Receive Shift Register (RSR) RSR is a shift register that is used to receive serial data input from the RxD pin and convert it into parallel data. When one frame of data has been received, it is transferred to RDR automatically. RSR cannot be directly accessed by the CPU. 16.3.2 Receive Data Register (RDR) RDR is an 8-bit register that stores received data. When the SCI3 has received one frame of serial data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only once. RDR cannot be written to by the CPU. RDR is initialized to H'00. 16.3.3 Transmit Shift Register (TSR) TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI3 first transfers transmit data from TDR to TSR automatically, then sends the data that starts from the LSB to the TXD pin. TSR cannot be directly accessed by the CPU. 16.3.4 Transmit Data Register (TDR) TDR is an 8-bit register that stores data for transmission. When the SCI3 detects that TSR is empty, it transfers the transmit data written in TDR to TSR and starts transmission. The doublebuffered structure of TDR and TSR enables continuous serial transmission. If the next transmit data has already been written to TDR during transmission of one-frame data, the SCI3 transfers the written data to TSR to continue transmission. To achieve reliable serial transmission, write transmit data to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is initialized to H'FF. Rev.5.00 Nov. 02, 2005 Page 263 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.3.5 Serial Mode Register (SMR) SMR is used to set the SCI3’s serial transfer format and select the baud rate generator clock source. Bit Bit Name Initial Value R/W Description 7 COM 0 R/W Communication Mode 0: Asynchronous mode 1: Clocked synchronous mode 6 CHR 0 R/W Character Length (enabled only in asynchronous mode) 0: Selects 8 bits as the data length. 1: Selects 7 bits as the data length. 5 PE 0 R/W Parity Enable (enabled only in asynchronous mode) When this bit is set to 1, the parity bit is added to transmit data before transmission, and the parity bit is checked in reception. 4 PM 0 R/W Parity Mode (enabled only when the PE bit is 1 in asynchronous mode) 0: Selects even parity. 1: Selects odd parity. 3 STOP 0 R/W Stop Bit Length (enabled only in asynchronous mode) Selects the stop bit length in transmission. 0: 1 stop bit 1: 2 stop bits For reception, only the first stop bit is checked, regardless of the value in the bit. If the second stop bit is 0, it is treated as the start bit of the next transmit character. 2 MP 0 R/W Multiprocessor Mode When this bit is set to 1, the multiprocessor communication function is enabled. The PE bit and PM bit settings are invalid in multiprocessor mode. In clocked synchronous mode, clear this bit to 0. Rev.5.00 Nov. 02, 2005 Page 264 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Bit Bit Name Initial Value R/W Description 1 CKS1 0 R/W Clock Select 0 and 1 0 CKS0 0 R/W These bits select the clock source for the baud rate generator. 00: φ clock (n = 0) 01: φ/4 clock (n = 1) 10: φ/16 clock (n = 2) 11: φ/64 clock (n = 3) For the relationship between the bit rate register setting and the baud rate, see section 16.3.8, Bit Rate Register (BRR). n is the decimal representation of the value of n in BRR (see section 16.3.8, Bit Rate Register (BRR)). 16.3.6 Serial Control Register 3 (SCR3) SCR3 is a register that enables or disables SCI3 transfer operations and interrupt requests, and is also used to select the transfer clock source. For details on interrupt requests, refer to section 16.7, Interrupts. Bit Bit Name Initial Value R/W Description 7 TIE 0 R/W Transmit Interrupt Enable When this bit is set to 1, the TXI interrupt request is enabled. 6 RIE 0 R/W Receive Interrupt Enable When this bit is set to 1, RXI and ERI interrupt requests are enabled. 5 TE 0 R/W Transmit Enable 4 RE 0 R/W Receive Enable When this bit s set to 1, transmission is enabled. When this bit is set to 1, reception is enabled. Rev.5.00 Nov. 02, 2005 Page 265 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Bit Bit Name Initial Value R/W Description 3 MPIE 0 R/W Multiprocessor Interrupt Enable (enabled only when the MP bit in SMR is 1 in asynchronous mode) When this bit is set to 1, receive data in which the multiprocessor bit is 0 is skipped, and setting of the RDRF, FER, and OER status flags in SSR is disabled. On receiving data in which the multiprocessor bit is 1, this bit is automatically cleared and normal reception is resumed. For details, refer to section 16.6, Multiprocessor Communication Function. 2 TEIE 0 R/W Transmit End Interrupt Enable When this bit is set to 1, TEI interrupt request is enabled. 1 CKE1 0 R/W Clock Enable 0 and 1 0 CKE0 0 R/W Selects the clock source. • Asynchronous mode 00: On-chip baud rate generator 01: On-chip baud rate generator Outputs a clock of the same frequency as the bit rate from the SCK3 pin. 10: External clock Inputs a clock with a frequency 16 times the bit rate from the SCK3 pin. 11: Reserved • Clocked synchronous mode 00: On-chip clock (SCK3 pin functions as clock output) 01: Reserved 10: External clock (SCK3 pin functions as clock input) 11: Reserved Rev.5.00 Nov. 02, 2005 Page 266 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.3.7 Serial Status Register (SSR) SSR is a register containing status flags of the SCI3 and multiprocessor bits for transfer. 1 cannot be written to flags TDRE, RDRF, OER, PER, and FER; they can only be cleared. Bit Bit Name Initial Value R/W Description 7 TDRE 1 R/W Transmit Data Register Empty Indicates whether TDR contains transmit data. [Setting conditions] • When the TE bit in SCR3 is 0 • When data is transferred from TDR to TSR [Clearing conditions] 6 RDRF 0 R/W • When 0 is written to TDRE after reading TDRE = 1 • When the transmit data is written to TDR Receive Data Register Full Indicates that the received data is stored in RDR. [Setting condition] • When serial reception ends normally and receive data is transferred from RSR to RDR [Clearing conditions] 5 OER 0 R/W • When 0 is written to RDRF after reading RDRF = 1 • When data is read from RDR Overrun Error [Setting condition] • When an overrun error occurs in reception [Clearing condition] • 4 FER 0 R/W When 0 is written to OER after reading OER = 1 Framing Error [Setting condition] • When a framing error occurs in reception [Clearing condition] • When 0 is written to FER after reading FER = 1 Rev.5.00 Nov. 02, 2005 Page 267 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Bit Bit Name Initial Value R/W Description 3 PER 0 R/W Parity Error [Setting condition] • When a parity error is detected during reception [Clearing condition] • 2 TEND 1 R When 0 is written to PER after reading PER = 1 Transmit End [Setting conditions] • When the TE bit in SCR3 is 0 • When TDRE = 1 at transmission of the last bit of a 1frame serial transmit character [Clearing conditions] 1 MPBR 0 R • When 0 is written to TDRE after reading TDRE = 1 • When the transmit data is written to TDR Multiprocessor Bit Receive MPBR stores the multiprocessor bit in the receive character data. When the RE bit in SCR3 is cleared to 0, its state is retained. 0 MPBT 0 R/W Multiprocessor Bit Transfer MPBT stores the multiprocessor bit to be added to the transmit character data. Rev.5.00 Nov. 02, 2005 Page 268 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.3.8 Bit Rate Register (BRR) BRR is an 8-bit register that adjusts the bit rate. The initial value of BRR is H'FF. Table 16.3 shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 of SMR in asynchronous mode. Table 16.4 shows the maximum bit rate for each frequency in asynchronous mode. The values shown in both tables 16.3 and 16.4 are values in active (highspeed) mode. Table 16.5 shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 of SMR in clocked synchronous mode. The values shown in table 16.5 are values in active (high-speed) mode. The N setting in BRR and error for other operating frequencies and bit rates can be obtained by the following formulas: [Asynchronous Mode] N= φ 64 × 22n–1 ×B × 106 – 1 φ × 106 – 1 × 100 (N + 1) × B × 64 × 22n–1 Error (%) = [Clocked Synchronous Mode] N= φ × 106 – 1 8 × 22n–1 × B Legend B: Bit rate (bit/s) N: BRR setting for baud rate generator (0 ≤ N ≤ 255) φ: Operating frequency (MHz) n: CSK1 and CSK0 settings in SMR (0 ≤ n ≤ 3) Rev.5.00 Nov. 02, 2005 Page 269 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) Operating Frequency φ (MHz) 2 2.097152 2.4576 3 Bit Rate (bits/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 1 141 0.03 1 148 –0.04 1 174 –0.26 1 212 0.03 150 1 103 0.16 1 108 0.21 1 127 0.00 1 155 0.16 300 0 207 0.16 0 217 0.21 0 255 0.00 1 77 0.16 600 0 103 0.16 0 108 0.21 0 127 0.00 0 155 0.16 1200 0 51 0.16 0 54 –0.70 0 63 0.00 0 77 0.16 2400 0 25 0.16 0 26 1.14 0 31 0.00 0 38 0.16 4800 0 12 0.16 0 13 –2.48 0 15 0.00 0 19 –2.34 9600 0 6 –6.99 0 6 –2.48 0 7 0.00 0 9 –2.34 19200 0 2 8.51 0 2 13.78 0 3 0.00 0 4 –2.34 31250 0 1 0.00 0 1 4.86 0 1 22.88 0 2 0.00 38400 0 1 –18.62 0 1 –14.67 0 1 0.00 — — — Operating Frequency φ (MHz) 3.6864 Error (%) 4 Bit Rate (bits/s) n N 110 2 64 0.70 150 1 191 0.00 300 1 95 0.00 1 4.9152 N Error (%) 2 70 0.03 1 207 0.16 103 0.16 1 n 5 N Error (%) n N Error (%) 2 86 0.31 2 88 –0.25 1 255 0.00 2 64 0.16 127 0.00 1 129 0.16 n 600 0 191 0.00 0 207 0.16 0 255 0.00 1 64 0.16 1200 0 95 0.00 0 103 0.16 0 127 0.00 0 129 0.16 2400 0 47 0.00 0 51 0.16 0 63 0.00 0 64 0.16 4800 0 23 0.00 0 25 0.16 0 31 0.00 0 32 –1.36 9600 0 11 0.00 0 12 0.16 0 15 0.00 0 15 1.73 19200 0 5 0.00 0 6 –6.99 0 7 0.00 0 7 1.73 31250 — — — 0 3 0.00 0 4 –1.70 0 4 0.00 38400 0 2 0.00 0 2 8.51 0 3 0.00 0 3 1.73 Legend: : A setting is available but error occurs Rev.5.00 Nov. 02, 2005 Page 270 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) Operating Frequency φ (MHz) 6 6.144 7.3728 Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) 110 2 106 –0.44 2 108 0.08 2 130 –0.07 150 2 77 0.16 2 79 0.00 2 95 0.00 300 1 155 0.16 1 159 0.00 1 191 0.00 600 1 77 0.16 1 79 0.00 1 95 0.00 1200 0 155 0.16 0 159 0.00 0 191 0.00 2400 0 77 0.16 0 79 0.00 0 95 0.00 4800 0 38 0.16 0 39 0.00 0 47 0.00 9600 0 19 –2.34 0 19 0.00 0 23 0.00 19200 0 9 –2.34 0 9 0.00 0 11 0.00 31250 0 5 0.00 0 5 2.40 0 6 5.33 38400 0 4 –2.34 0 4 0.00 0 5 0.00 Operating Frequency φ (MHz) 8 9.8304 10 12 Bit Rate (bit/s) n N Error (%) n N Error (%) 110 2 141 0.03 2 174 –0.26 2 177 –0.25 2 212 0.03 150 2 103 0.16 2 127 0.00 2 129 0.16 2 155 0.16 300 1 207 0.16 1 255 0.00 2 64 0.16 2 77 0.16 n N Error (%) n N Error (%) 600 1 103 0.16 1 127 0.00 1 129 0.16 1 155 0.16 1200 0 207 0.16 0 255 0.00 1 64 0.16 1 77 0.16 2400 0 103 0.16 0 127 0.00 0 129 0.16 0 155 0.16 4800 0 51 0.16 0 63 0.00 0 64 0.16 0 77 0.16 9600 0 25 0.16 0 31 0.00 0 32 –1.36 0 38 0.16 19200 0 12 0.16 0 15 0.00 0 15 1.73 0 19 –2.34 31250 0 7 0.00 0 9 –1.70 0 9 0.00 0 11 0.00 38400 0 6 -6.99 0 7 0.00 0 7 1.73 0 9 –2.34 Legend: : A setting is available but error occurs. Rev.5.00 Nov. 02, 2005 Page 271 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) Operating Frequency φ (MHz) 12.888 14 14.7456 16 Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 2 217 0.08 2 248 –0.17 3 64 0.70 3 70 0.03 150 2 159 0.00 2 181 0.16 2 191 0.00 2 207 0.16 300 2 79 0.00 2 90 0.16 2 95 0.00 2 103 0.16 600 1 159 0.00 1 181 0.16 1 191 0.00 1 207 0.16 1200 1 79 0.00 1 90 0.16 1 95 0.00 1 103 0.16 2400 0 159 0.00 0 181 0.16 0 191 0.00 0 207 0.16 4800 0 79 0.00 0 90 0.16 0 95 0.00 0 103 0.16 9600 0 39 0.00 0 45 –0.93 0 47 0.00 0 51 0.16 19200 0 19 0.00 0 22 –0.93 0 23 0.00 0 25 0.16 31250 0 11 2.40 0 13 0.00 0 14 –1.70 0 15 0.00 38400 0 9 0.00 — — — 0 11 0.00 0 12 0.16 Operating Frequency φ (MHz) 18 20 Bit Rate (bit/s) n N Error (%) n N Error (%) 110 3 79 –0.12 3 88 –0.25 150 2 233 0.16 3 64 0.16 300 2 116 0.16 2 129 0.16 600 1 233 0.16 2 64 0.16 1200 1 116 0.16 1 129 0.16 2400 0 233 0.16 1 64 0.16 4800 0 116 0.16 0 129 0.16 9600 0 58 –0.96 0 64 0.16 19200 0 28 1.02 0 32 –1.36 31250 0 17 0.00 0 19 0.00 38400 0 14 –2.34 0 15 1.73 Legend: —: A setting is available but error occurs. Rev.5.00 Nov. 02, 2005 Page 272 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode) φ (MHz) Maximum Bit Rate (bit/s) n N φ (MHz) Maximum Bit Rate (bit/s) n N 2 62500 0 0 8 250000 0 0 2.097152 65536 0 0 9.8304 307200 0 0 2.4576 76800 0 0 10 312500 0 0 3 93750 0 0 12 375000 0 0 3.6864 115200 0 0 12.288 384000 0 0 4 125000 0 0 14 437500 0 0 4.9152 153600 0 0 14.7456 460800 0 0 5 156250 0 0 16 500000 0 0 6 187500 0 0 17.2032 537600 0 0 6.144 192000 0 0 18 562500 0 0 7.3728 230400 0 0 20 625000 0 0 Rev.5.00 Nov. 02, 2005 Page 273 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1) Operating Frequency φ (MHz) 2 4 8 10 Bit Rate (bit/s) n N n N n N n N 110 3 70 — — — — — — 250 2 124 2 249 3 124 — 16 n N — 3 249 500 1 249 2 124 2 249 — — 3 124 1k 1 124 1 249 2 124 — — 2 249 2.5k 0 199 1 99 1 199 1 249 2 99 5k 0 99 0 199 1 99 1 124 1 199 10k 0 49 0 99 0 199 0 249 1 99 25k 0 19 0 39 0 79 0 99 0 159 50k 0 9 0 19 0 39 0 49 0 79 100k 0 4 0 9 0 19 0 24 0 39 250k 0 1 0 3 0 7 0 9 0 15 500k 0 0* 0 1 0 3 0 4 0 7 0 0* 0 1 — — 0 3 0 0* — — 0 1 0 0* — — 0 0* 1M 2M 2.5M 4M Legend: Blank : No setting is available. — : A setting is available but error occurs. * : Continuous transfer is not possible. Rev.5.00 Nov. 02, 2005 Page 274 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2) Operating Frequency φ (MHz) 18 20 Bit Rate (bit/s) n N n N 110 — — — — 250 — — — — 500 3 140 3 155 1k 3 69 3 77 2.5k 2 112 2 124 5k 1 224 1 249 10k 1 112 1 124 25k 0 179 0 199 50k 0 89 0 99 100k 0 44 0 49 250k 0 17 0 19 500k 0 8 0 9 1M 0 4 0 4 2M — — — — 2.5M — — 0 1 4M — — — — Legend: Blank : No setting is available. — : A setting is available but error occurs. * : Continuous transfer is not possible. Rev.5.00 Nov. 02, 2005 Page 275 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.4 Operation in Asynchronous Mode Figure 16.2 shows the general format for asynchronous serial communication. One character (or frame) consists of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or low level), and finally stop bits (high level). Inside the SCI3, the transmitter and receiver are independent units, enabling full-duplex. Both the transmitter and the receiver also have a doublebuffered structure, so data can be read or written during transmission or reception, enabling continuous data transfer. LSB MSB Serial Start data bit Transmit/receive data 7 or 8 bits 1 bit 1 Parity bit Stop bit Mark state 1 or 2 bits 1 bit, or none One unit of transfer data (character or frame) Figure 16.2 Data Format in Asynchronous Communication 16.4.1 Clock Either an internal clock generated by the on-chip baud rate generator or an external clock input at the SCK3 pin can be selected as the SCI3’s serial clock, according to the setting of the COM bit in SMR and the CKE0 and CKE1 bits in SCR3. When an external clock is input at the SCK3 pin, the clock frequency should be 16 times the bit rate used. When the SCI3 is operated on an internal clock, the clock can be output from the SCK3 pin. The frequency of the clock output in this case is equal to the bit rate, and the phase is such that the rising edge of the clock is in the middle of the transmit data, as shown in figure 16.3. Clock Serial data 0 D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1 1 character (frame) Figure 16.3 Relationship between Output Clock and Transfer Data Phase (Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) Rev.5.00 Nov. 02, 2005 Page 276 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.4.2 SCI3 Initialization Before transmitting and receiving data, you should first clear the TE and RE bits in SCR3 to 0, then initialize the SCI3 as described below. When the operating mode, or transfer format, is changed for example, the TE and RE bits must be cleared to 0 before making the change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and OER flags, or the contents of RDR. When the external clock is used in asynchronous mode, the clock must be supplied even during initialization. [1] Start initialization When the clock output is selected in asynchronous mode, clock is output immediately after CKE1 and CKE0 settings are made. When the clock output is selected at reception in clocked synchronous mode, clock is output immediately after CKE1, CKE0, and RE are set to 1. Clear TE and RE bits in SCR3 to 0 [1] Set CKE1 and CKE0 bits in SCR3 Set data transfer format in SMR [2] Set value in BRR [3] Wait [2] Set the data transfer format in SMR. [3] Write a value corresponding to the bit rate to BRR. Not necessary if an external clock is used. [4] Wait at least one bit interval, then set the TE bit or RE bit in SCR3 to 1. RE settings enable the RXD pin to be used. For transmission, set the TXD bit in PMR1 to 1 to enable the TXD output pin to be used. Also set the RIE, TIE, TEIE, and MPIE bits, depending on whether interrupts are required. In asynchronous mode, the bits are marked at transmission and idled at reception to wait for the start bit. No 1-bit interval elapsed? Yes Set TE and RE bits in SCR3 to 1, and set RIE, TIE, TEIE, and MPIE bits. For transmit (TE=1), also set the TxD bit in PMR1. <Initialization completion> [4] Set the clock selection in SCR3. Be sure to clear bits RIE, TIE, TEIE, and MPIE, and bits TE and RE, to 0. Figure 16.4 Sample SCI3 Initialization Flowchart Rev.5.00 Nov. 02, 2005 Page 277 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.4.3 Data Transmission Figure 16.5 shows an example of operation for transmission in asynchronous mode. In transmission, the SCI3 operates as described below. 1. The SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI3 recognizes that data has been written to TDR, and transfers the data from TDR to TSR. 2. After transferring data from TDR to TSR, the SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit is set to 1 at this time, a TXI interrupt request is generated. Continuous transmission is possible because the TXI interrupt routine writes next transmit data to TDR before transmission of the current transmit data has been completed. 3. The SCI3 checks the TDRE flag at the timing for sending the stop bit. 4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then serial transmission of the next frame is started. 5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark state” is entered, in which 1 is output. If the TEIE bit in SCR3 is set to 1 at this time, a TEI interrupt request is generated. 6. Figure 16.6 shows a sample flowchart for transmission in asynchronous mode. Start bit Serial data 1 0 Transmit data D0 D1 D7 1 frame Parity Stop Start bit bit bit 0/1 1 0 Transmit data D0 D1 D7 Parity Stop bit bit 0/1 Mark state 1 1 1 frame TDRE TEND LSI TXI interrupt operation request generated User processing TDRE flag cleared to 0 TXI interrupt request generated TEI interrupt request generated Data written to TDR Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) Rev.5.00 Nov. 02, 2005 Page 278 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start transmission [1] Read TDRE flag in SSR No TDRE = 1 Yes Write transmit data to TDR [2] Yes All data transmitted? [1] Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automaticaly cleared to 0. [2] To continue serial transmission, read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR. When data is written to TDR, the TDRE flag is automaticaly cleared to 0. [3] To output a break in serial transmission, after setting PCR to 1 and PDR to 0, clear TxD in PMR1 to 0, then clear the TE bit in SCR3 to 0. No Read TEND flag in SSR No TEND = 1 Yes [3] No Break output? Yes Clear PDR to 0 and set PCR to 1 Clear TE bit in SCR3 to 0 <End> Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode) Rev.5.00 Nov. 02, 2005 Page 279 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.4.4 Serial Data Reception Figure 16.7 shows an example of operation for reception in asynchronous mode. In serial reception, the SCI3 operates as described below. 1. The SCI3 monitors the communication line. If a start bit is detected, the SCI3 performs internal synchronization, receives receive data in RSR, and checks the parity bit and stop bit. 2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated. Receive data is not transferred to RDR. 3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated. 4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated. 5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is generated. Continuous reception is possible because the RXI interrupt routine reads the receive data transferred to RDR before reception of the next receive data has been completed. Start bit Serial data 1 0 Receive data D0 D1 D7 Parity Stop Start bit bit bit 0/1 1 0 1 frame Receive data D0 D1 Parity Stop bit bit D7 0/1 0 Mark state (idle state) 1 1 frame RDRF FER LSI operation RXI request RDRF cleared to 0 0 stop bit detected RDR data read User processing ERI request in response to framing error Framing error processing Figure 16.7 Example of SCI3 Reception in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) Table 16.6 shows the states of the SSR status flags and receive data handling when a receive error is detected. If a receive error is detected, the RDRF flag retains its state before receiving data. Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER, Rev.5.00 Nov. 02, 2005 Page 280 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.8 shows a sample flow chart for serial data reception. Table 16.6 SSR Status Flags and Receive Data Handling SSR Status Flag RDRF* OER FER PER Receive Data 1 1 0 0 Lost Overrun error 0 0 1 0 Transferred to RDR Framing error 0 0 0 1 Transferred to RDR Parity error 1 1 1 0 Lost Overrun error + framing error 1 1 0 1 Lost Overrun error + parity error 0 0 1 1 Transferred to RDR Framing error + parity error 1 1 1 1 Lost Overrun error + framing error + parity error Note: * Receive Error Type The RDRF flag retains the state it had before data reception. Rev.5.00 Nov. 02, 2005 Page 281 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start reception Read OER, PER, and FER flags in SSR [1] Yes OER+PER+FER = 1 [4] No Error processing (Continued on next page) Read RDRF flag in SSR [2] No RDRF = 1 Yes Read receive data in RDR [1] Read the OER, PER, and FER flags in SSR to identify the error. If a receive error occurs, performs the appropriate error processing. [2] Read SSR and check that RDRF = 1, then read the receive data in RDR. The RDRF flag is cleared automatically. [3] To continue serial reception, before the stop bit for the current frame is received, read the RDRF flag and read RDR. The RDRF flag is cleared automatically. [4] If a receive error occurs, read the OER, PER, and FER flags in SSR to identify the error. After performing the appropriate error processing, ensure that the OER, PER, and FER flags are all cleared to 0. Reception cannot be resumed if any of these flags are set to 1. In the case of a framing error, a break can be detected by reading the value of the input port corresponding to the RxD pin. Yes All data received? [3] No (A) Clear RE bit in SCR3 to 0 <End> Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (1) Rev.5.00 Nov. 02, 2005 Page 282 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) [4] Error processing No OER = 1 Yes Overrun error processing No FER = 1 Yes Yes Break? No Framing error processing No PER = 1 Yes Parity error processing (A) Clear OER, PER, and FER flags in SSR to 0 <End> Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (2) Rev.5.00 Nov. 02, 2005 Page 283 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.5 Operation in Clocked Synchronous Mode Figure 16.9 shows the general format for clocked synchronous communication. In clocked synchronous mode, data is transmitted or received synchronous with clock pulses. A single character in the transmit data consists of the 8-bit data starting from the LSB. In clocked synchronous serial communication, data on the transmission line is output from one falling edge of the synchronization clock to the next. In clocked synchronous mode, the SCI3 receives data in synchronous with the rising edge of the synchronization clock. After 8-bit data is output, the transmission line holds the MSB state. In clocked synchronous mode, no parity or multiprocessor bit is added. Inside the SCI3, the transmitter and receiver are independent units, enabling fullduplex communication through the use of a common clock. Both the transmitter and the receiver also have a double-buffered structure, so data can be read or written during transmission or reception, enabling continuous data transfer. 8-bit One unit of transfer data (character or frame) * * Synchronization clock LSB Bit 0 Serial data MSB Bit 1 Don’t care Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Don’t care Note: * High except in continuous transfer Figure 16.9 Data Format in Clocked Synchronous Communication 16.5.1 Clock Either an internal clock generated by the on-chip baud rate generator or an external synchronization clock input at the SCK3 pin can be selected, according to the setting of the COM bit in SMR and CKE0 and CKE1 bits in SCR3. When the SCI3 is operated on an internal clock, the synchronization clock is output from the SCK3 pin. Eight synchronization clock pulses are output in the transfer of one character, and when no transfer is performed the clock is fixed high. 16.5.2 SCI3 Initialization Before transmitting and receiving data, the SCI3 should be initialized as described in a sample flowchart in figure 16.4. Rev.5.00 Nov. 02, 2005 Page 284 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.5.3 Serial Data Transmission Figure 16.10 shows an example of SCI3 operation for transmission in clocked synchronous mode. In serial transmission, the SCI3 operates as described below. 1. The SCI3 monitors the TDRE flag in SSR, and if the flag is 0, the SCI3 recognizes that data has been written to TDR, and transfers the data from TDR to TSR. 2. The SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR3 is set to 1 at this time, a transmit data empty interrupt (TXI) is generated. 3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock mode has been specified, and synchronized with the input clock when use of an external clock has been specified. Serial data is transmitted sequentially from the LSB (bit 0), from the TxD pin. 4. The SCI3 checks the TDRE flag at the timing for sending the MSB (bit 7). 5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission of the next frame is started. 6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the output state of the last bit. If the TEIE bit in SCR3 is set to 1 at this time, a TEI interrupt request is generated. 7. The SCK3 pin is fixed high at the end of transmission. Figure 16.11 shows a sample flow chart for serial data transmission. Even if the TDRE flag is cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1. Make sure that the receive error flags are cleared to 0 before starting transmission. Rev.5.00 Nov. 02, 2005 Page 285 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Serial clock Serial data Bit 0 Bit 1 1 frame Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 1 frame TDRE TEND LSI TXI interrupt operation request generated TDRE flag cleared to 0 User processing Data written to TDR TXI interrupt request generated TEI interrupt request generated Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode Rev.5.00 Nov. 02, 2005 Page 286 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start transmission [1] [1] Read TDRE flag in SSR No TDRE = 1 Yes [2] Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0 and clocks are output to start the data transmission. To continue serial transmission, be sure to read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. Write transmit data to TDR [2] All data transmitted? Yes No Read TEND flag in SSR No TEND = 1 Yes Clear TE bit in SCR3 to 0 <End> Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) Rev.5.00 Nov. 02, 2005 Page 287 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.5.4 Serial Data Reception (Clocked Synchronous Mode) Figure 16.12 shows an example of SCI3 operation for reception in clocked synchronous mode. In serial reception, the SCI3 operates as described below. 1. The SCI3 performs internal initialization synchronous with a synchronization clock input or output, starts receiving data. 2. The SCI3 stores the receive data in RSR. 3. If an overrun error occurs (when reception of the next data is completed while the RDRF flag in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the RDRF flag remains to be set to 1. 4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is generated. Serial clock Serial data Bit 7 Bit 0 Bit 7 1 frame Bit 0 Bit 1 Bit 6 Bit 7 1 frame RDRF OER LSI operation RXI interrupt request generated User processing RDRF flag cleared to 0 RDR data read RXI interrupt request generated RDR data has not been read (RDRF = 1) ERI interrupt request generated by overrun error Overrun error processing Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.13 shows a sample flow chart for serial data reception. Rev.5.00 Nov. 02, 2005 Page 288 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start reception [1] [1] Read OER flag in SSR [2] Yes OER = 1 [4] No Error processing [3] (Continued below) Read RDRF flag in SSR [2] [4] No RDRF = 1 Yes Read the OER flag in SSR to determine if there is an error. If an overrun error has occurred, execute overrun error processing. Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR. When data is read from RDR, the RDRF flag is automatically cleared to 0. To continue serial reception, before the MSB (bit 7) of the current frame is received, reading the RDRF flag and reading RDR should be finished. When data is read from RDR, the RDRF flag is automatically cleared to 0. If an overrun error occurs, read the OER flag in SSR, and after performing the appropriate error processing, clear the OER flag to 0. Reception cannot be resumed if the OER flag is set to 1. Read receive data in RDR Yes All data received? [3] No Clear RE bit in SCR3 to 0 <End> [4] Error processing Overrun error processing Clear OER flag in SSR to 0 <End> Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode) Rev.5.00 Nov. 02, 2005 Page 289 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.5.5 Simultaneous Serial Data Transmission and Reception Figure 16.14 shows a sample flowchart for simultaneous serial transmit and receive operations. The following procedure should be used for simultaneous serial data transmit and receive operations. To switch from transmit mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished reception, clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER, and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction. Rev.5.00 Nov. 02, 2005 Page 290 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start transmission/reception Read TDRE flag in SSR [1] [1] No TDRE = 1 Yes Write transmit data to TDR Read OER flag in SSR OER = 1 No Read RDRF flag in SSR Yes [4] Error processing [2] No RDRF = 1 Yes Read receive data in RDR Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. [2] Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR. When data is read from RDR, the RDRF flag is automatically cleared to 0. [3] To continue serial transmission/ reception, before the MSB (bit 7) of the current frame is received, finish reading the RDRF flag, reading RDR. Also, before the MSB (bit 7) of the current frame is transmitted, read 1 from the TDRE flag to confirm that writing is possible. Then write data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. When data is read from RDR, the RDRF flag is automatically cleared to 0. [4] If an overrun error occurs, read the OER flag in SSR, and after performing the appropriate error processing, clear the OER flag to 0. Transmission/reception cannot be resumed if the OER flag is set to 1. For overrun error processing, see figure 16.13. Yes All data received? [3] No Clear TE and RE bits in SCR to 0 <End> Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations (Clocked Synchronous Mode) Rev.5.00 Nov. 02, 2005 Page 291 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.6 Multiprocessor Communication Function Use of the multiprocessor communication function enables data transfer between a number of processors sharing communication lines by asynchronous serial communication using the multiprocessor format, in which a multiprocessor bit is added to the transfer data. When multiprocessor communication is performed, each receiving station is addressed by a unique ID code. The serial communication cycle consists of two component cycles; an ID transmission cycle that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to differentiate between the ID transmission cycle and the data transmission cycle. If the multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the cycle is a data transmission cycle. Figure 16.15 shows an example of inter-processor communication using the multiprocessor format. The transmitting station first sends the ID code of the receiving station with which it wants to perform serial communication as data with a 1 multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added. When data with a 1 multiprocessor bit is received, the receiving station compares that data with its own ID. The station whose ID matches then receives the data sent next. Stations whose IDs do not match continue to skip data until data with a 1 multiprocessor bit is again received. The SCI3 uses the MPIE bit in SCR3 to implement this function. When the MPIE bit is set to 1, transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags, RDRF, FER, and OER, to 1, are inhibited until data with a 1 multiprocessor bit is received. On reception of a receive character with a 1 multiprocessor bit, the MPBR bit in SSR is set to 1 and the MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt is generated. When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit settings are the same as those in normal asynchronous mode. The clock used for multiprocessor communication is the same as that in normal asynchronous mode. Rev.5.00 Nov. 02, 2005 Page 292 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Transmitting station Serial transmission line Receiving station A Receiving station B Receiving station C Receiving station D (ID = 01) (ID = 02) (ID = 03) (ID = 04) Serial data H'01 H'AA (MPB = 1) (MPB = 0) ID transmission cycle = Data transmission cycle = receiving station Data transmission to specification receiving station specified by ID [Legend] MPB: Multiprocessor bit Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format (Transmission of Data H'AA to Receiving Station A) Rev.5.00 Nov. 02, 2005 Page 293 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.6.1 Multiprocessor Serial Data Transmission Figure 16.16 shows a sample flowchart for multiprocessor serial data transmission. For an ID transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI3 operations are the same as those in asynchronous mode. Start transmission [1] [1] Read TDRE flag in SSR No TDRE = 1 [2] Yes Set MPBT bit in SSR [3] Write transmit data to TDR Yes [2] Read SSR and check that the TDRE flag is set to 1, set the MPBT bit in SSR to 0 or 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. To continue serial transmission, be sure to read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. To output a break in serial transmission, set the port PCR to 1, clear PDR to 0, then clear the TE bit in SCR3 to 0. All data transmitted? No Read TEND flag in SSR No TEND = 1 Yes No Break output? [3] Yes Clear PDR to 0 and set PCR to 1 Clear TE bit in SCR3 to 0 <End> Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart Rev.5.00 Nov. 02, 2005 Page 294 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.6.2 Multiprocessor Serial Data Reception Figure 16.17 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in SCR3 is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is generated at this time. All other SCI3 operations are the same as those in asynchronous mode. Figure 16.18 shows an example of SCI3 operation for multiprocessor format reception. Rev.5.00 Nov. 02, 2005 Page 295 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) [1] [2] Start reception Set MPIE bit in SCR3 to 1 [1] Read OER and FER flags in SSR [2] [3] Yes FER+OER = 1 No Read RDRF flag in SSR [3] No [4] [5] RDRF = 1 Yes Read receive data in RDR No This station’s ID? Set the MPIE bit in SCR3 to 1. Read OER and FER in SSR to check for errors. Receive error processing is performed in cases where a receive error occurs. Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR and compare it with this station’s ID. If the data is not this station’s ID, set the MPIE bit to 1 again. When data is read from RDR, the RDRF flag is automatically cleared to 0. Read SSR and check that the RDRF flag is set to 1, then read the data in RDR. If a receive error occurs, read the OER and FER flags in SSR to identify the error. After performing the appropriate error processing, ensure that the OER and FER flags are all cleared to 0. Reception cannot be resumed if either of these flags is set to 1. In the case of a framing error, a break can be detected by reading the RxD pin value. Yes Read OER and FER flags in SSR Yes FER+OER = 1 No Read RDRF flag in SSR [4] No RDRF = 1 [5] Error processing Yes Read receive data in RDR (Continued on next page) Yes All data received? No [A] Clear RE bit in SCR3 to 0 <End> Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1) Rev.5.00 Nov. 02, 2005 Page 296 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) [5] Error processing No OER = 1 Yes Overrun error processing No FER = 1 Yes Yes Break? No [A] Framing error processing Clear OER, and FER flags in SSR to 0 <End> Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2) Rev.5.00 Nov. 02, 2005 Page 297 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Start bit Serial data 1 0 Receive data (ID1) D0 D1 D7 MPB 1 Stop Start bit bit 1 0 Receive data (Data1) D0 1 frame D1 D7 MPB Stop bit Mark state (idle state) 0 1 1 1 frame MPIE RDRF RDR value ID1 LSI operation User processing RXI interrupt request is not generated, and RDR retains its state RDRF flag cleared to 0 RXI interrupt request MPIE cleared to 0 RDR data read When data is not this station's ID, MPIE is set to 1 again (a) When data does not match this receiver's ID Start bit Serial data 1 0 Receive data (ID2) D0 D1 D7 MPB 1 Stop Start bit bit 1 0 Receive data (Data2) D0 1 frame D1 D7 MPB Stop bit Mark state (idle state) 0 1 1 1 frame MPIE RDRF RDR value ID1 LSI operation User processing ID2 RXI interrupt request MPIE cleared to 0 RDRF flag cleared to 0 RDR data read Data2 RXI interrupt request When data is this station's ID, reception is continued RDRF flag cleared to 0 RDR data read MPIE set to 1 again (b) When data matches this receiver's ID Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format (Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit) Rev.5.00 Nov. 02, 2005 Page 298 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.7 Interrupts SCI3 creates the following six interrupt requests: transmission end, transmit data empty, receive data full, and receive errors (overrun error, framing error, and parity error). Table 16.7 shows the interrupt sources. Table 16.7 SCI3 Interrupt Requests Interrupt Requests Abbreviation Interrupt Sources Receive Data Full RXI Setting RDRF in SSR Transmit Data Empty TXI Setting TDRE in SSR Transmission End TEI Setting TEND in SSR Receive Error ERI Setting OER, FER, and PER in SSR The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR3 is set to 1 before transferring the transmit data to TDR, a TXI interrupt request is generated even if the transmit data is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit in SCR3 is set to 1 before transferring the transmit data to TDR, a TEI interrupt request is generated even if the transmit data has not been sent. It is possible to make use of the most of these interrupt requests efficiently by transferring the transmit data to TDR in the interrupt routine. To prevent the generation of these interrupt requests (TXI and TEI), set the enable bits (TIE and TEIE) that correspond to these interrupt requests to 1, after transferring the transmit data to TDR. Rev.5.00 Nov. 02, 2005 Page 299 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.8 Usage Notes 16.8.1 Break Detection and Processing When framing error detection is performed, a break can be detected by reading the RxD pin value directly. In a break, the input from the RxD pin becomes all 0s, setting the FER flag, and possibly the PER flag. Note that as the SCI3 continues the receive operation after receiving a break, even if the FER flag is cleared to 0, it will be set to 1 again. 16.8.2 Mark State and Break Sending When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are determined by PCR and PDR. This can be used to set the TxD pin to mark state (high level) or send a break during serial data transmission. To maintain the communication line at mark state until TE is set to 1, set both PCR and PDR to 1. As TE is cleared to 0 at this point, the TxD pin becomes an I/O port, and 1 is output from the TxD pin. To send a break during serial transmission, first set PCR to 1 and clear PDR to 0, and then clear TE to 0. When TE is cleared to 0, the transmitter is initialized regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is output from the TxD pin. 16.8.3 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only) Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0. Rev.5.00 Nov. 02, 2005 Page 300 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) 16.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode In asynchronous mode, the SCI3 operates on a basic clock with a frequency of 16 times the transfer rate. In reception, the SCI3 samples the falling edge of the start bit using the basic clock, and performs internal synchronization. Receive data is latched internally at the rising edge of the 8th pulse of the basic clock as shown in figure 16.19. Thus, the reception margin in asynchronous mode is given by formula (1) below. 1 D – 0.5 M = (0.5 – )– – (L – 0.5) F × 100(%) 2N N ... Formula (1) Legend N D L F : Ratio of bit rate to clock (N = 16) : Clock duty (D = 0.5 to 1.0) : Frame length (L = 9 to 12) : Absolute value of clock rate deviation Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in formula (1), the reception margin can be given by the formula. M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875% However, this is only the computed value, and a margin of 20% to 30% should be allowed for in system design. 16 clocks 8 clocks 0 7 15 0 7 15 0 Internal basic clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode Rev.5.00 Nov. 02, 2005 Page 301 of 500 REJ09B0027-0500 Section 16 Serial Communication Interface 3 (SCI3) Rev.5.00 Nov. 02, 2005 Page 302 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Section 17 I2C Bus Interface 2 (IIC2) The I2C bus interface 2 conforms to and provides a subset of the Philips I2C bus (inter-IC bus) interface functions. The register configuration that controls the I2C bus differs partly from the Philips configuration, however. Figure 17.1 shows a block diagram of the I2C bus interface 2. Figure 17.2 shows an example of I/O pin connections to external circuits. 17.1 Features • Selection of I2C format or clocked synchronous serial format • Continuous transmission/reception Since the shift register, transmit data register, and receive data register are independent from each other, the continuous transmission/reception can be performed. I2C bus format • Start and stop conditions generated automatically in master mode • Selection of acknowledge output levels when receiving • Automatic loading of acknowledge bit when transmitting • Bit synchronization/wait function In master mode, the state of SCL is monitored per bit, and the timing is synchronized automatically. If transmission/reception is not yet possible, set the SCL to low until preparations are completed. • Six interrupt sources Transmit data empty (including slave-address match), transmit end, receive data full (including slave-address match), arbitration lost, NACK detection, and stop condition detection • Direct bus drive Two pins, SCL and SDA pins, function as NMOS open-drain outputs when the bus drive function is selected. Clocked synchronous format • Four interrupt sources Transmit-data-empty, transmit-end, receive-data-full, and overrun error IFIIC10A_000020020200 Rev.5.00 Nov. 02, 2005 Page 303 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Transfer clock generation circuit SCL Transmission/ reception control circuit Output control ICCR1 ICCR2 ICMR Internal data bus Noise canceler ICDRT SDA Output control ICDRS SAR Address comparator Noise canceler ICDRR Bus state decision circuit Arbitration decision circuit ICSR ICIER Interrupt generator [Legend] 2 ICCR1 : I C bus control register 1 ICCR2 : I2C bus control register 2 ICMR : I2C bus mode register ICSR : I2C bus status register ICIER : I2C bus interrupt enable register ICDRT : I2C bus transmit data register ICDRR : I2C bus receive data register ICDRS : I2C bus shift register SAR : Slave address register Figure 17.1 Block Diagram of I2C Bus Interface 2 Rev.5.00 Nov. 02, 2005 Page 304 of 500 REJ09B0027-0500 Interrupt request 2 Section 17 I C Bus Interface 2 (IIC2) Vcc SCL in Vcc SCL SCL SDA SDA SCL out SDA in SCL in SCL out SCL SDA (Master) SCL SDA SDA out SCL in SCL out SDA in SDA in SDA out SDA out (Slave 1) (Slave 2) Figure 17.2 External Circuit Connections of I/O Pins 17.2 Input/Output Pins Table 17.1 summarizes the input/output pins used by the I2C bus interface 2. Table 17.1 I2C Bus Interface Pins Name Abbreviation I/O Function Serial clock SCL I/O IIC serial clock input/output Serial data SDA I/O IIC serial data input/output 17.3 Register Descriptions The I2C bus interface 2 has the following registers: • • • • • • • I2C bus control register 1 (ICCR1) I2C bus control register 2 (ICCR2) I2C bus mode register (ICMR) I2C bus interrupt enable register (ICIER) I2C bus status register (ICSR) I2C bus slave address register (SAR) I2C bus transmit data register (ICDRT) Rev.5.00 Nov. 02, 2005 Page 305 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) • I2C bus receive data register (ICDRR) • I2C bus shift register (ICDRS) 17.3.1 I2C Bus Control Register 1 (ICCR1) ICCR1 enables or disables the I2C bus interface 2, controls transmission or reception, and selects master or slave mode, transmission or reception, and transfer clock frequency in master mode. Bit Bit Name Initial Value R/W Description 7 ICE 0 R/W I C Bus Interface Enable 2 0: This module is halted. (SCL and SDA pins are set to port function.) 1: This bit is enabled for transfer operations. (SCL and SDA pins are bus drive state.) 6 RCVD 0 R/W Reception Disable This bit enables or disables the next operation when TRS is 0 and ICDRR is read. 0: Enables next reception 1: Disables next reception 5 MST 0 R/W Master/Slave Select 4 TRS 0 R/W Transmit/Receive Select In master mode with the I2C bus format, when arbitration is lost, MST and TRS are both reset by hardware, causing a transition to slave receive mode. Modification of the TRS bit should be made between transfer frames. After data receive has been started in slave receive mode, when the first seven bits of the receive data agree with the slave address that is set to SAR and the eighth bit is 1, TRS is automatically set to 1. If an overrun error occurs in master mode with the clock synchronous serial format, MST is cleared to 0 and slave receive mode is entered. Operating modes are described below according to MST and TRS combination. When clocked synchronous serial format is selected and MST is 1, clock is output. 00: Slave receive mode 01: Slave transmit mode 10: Master receive mode 11: Master transmit mode Rev.5.00 Nov. 02, 2005 Page 306 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 3 CKS3 0 R/W Transfer Clock Select 3 to 0 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W These bits should be set according to the necessary transfer rate (see table 17.2) in master mode. In slave mode, these bits are used for reservation of the setup time in transmit mode. The time is 10 tcyc when CKS3 = 0 and 20 tcyc when CKS3 = 1. Table 17.2 Transfer Rate Bit 3 Bit 2 Bit 1 Bit 0 Transfer Rate φ = 5 MHz φ = 8 MHz φ = 10 MHz φ = 16 MHz φ = 20 MHz 0 φ/28 179 kHz 286 kHz 357 kHz 571 kHz 714 kHz 1 φ/40 125 kHz 200 kHz 250 kHz 400 kHz 500 kHz 0 φ/48 104 kHz 167 kHz 208 kHz 333 kHz 417 kHz 1 φ/64 78.1 kHz 125 kHz 156 kHz 250 kHz 313 kHz 0 φ/80 62.5 kHz 100 kHz 125 kHz 200 kHz 250 kHz 1 φ/100 50.0 kHz 80.0 kHz 100 kHz 160 kHz 200 kHz 0 φ/112 44.6 kHz 71.4 kHz 89.3 kHz 143 kHz 179 kHz 1 φ/128 39.1 kHz 62.5 kHz 78.1 kHz 125 kHz 156 kHz 0 0 φ/56 89.3 kHz 143 kHz 179 kHz 286 kHz 357 kHz 1 φ/80 62.5 kHz 100 kHz 125 kHz 200 kHz 250 kHz 1 0 φ/96 52.1 kHz 83.3 kHz 104 kHz 167 kHz 208 kHz 1 φ/128 39.1 kHz 62.5 kHz 78.1 kHz 125 kHz 156 kHz 0 0 φ/160 31.3 kHz 50.0 kHz 62.5 kHz 100 kHz 125 kHz 1 φ/200 25.0 kHz 40.0 kHz 50.0 kHz 80.0 kHz 100 kHz 1 0 φ/224 22.3 kHz 35.7 kHz 44.6 kHz 71.4 kHz 89.3 kHz 1 φ/256 19.5 kHz 31.3 kHz 39.1 kHz 62.5 kHz 78.1 kHz CKS3 CKS2 CKS1 CKS0 Clock 0 0 0 1 1 0 1 1 0 1 Rev.5.00 Nov. 02, 2005 Page 307 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.3.2 I2C Bus Control Register 2 (ICCR2) ICCR1 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls reset in the control part of the I2C bus interface 2. Bit Bit Name Initial Value R/W Description 7 BBSY 0 R/W Bus Busy 2 This bit enables to confirm whether the I C bus is occupied or released and to issue start/stop conditions in master mode. With the clocked synchronous serial 2 format, this bit has no meaning. With the I C bus format, this bit is set to 1 when the SDA level changes from high to low under the condition of SCL = high, assuming that the start condition has been issued. This bit is cleared to 0 when the SDA level changes from low to high under the condition of SCL = high, assuming that the stop condition has been issued. Write 1 to BBSY and 0 to SCP to issue a start condition. Follow this procedure when also retransmitting a start condition. Write 0 in BBSY and 0 in SCP to issue a stop condition. To issue start/stop conditions, use the MOV instruction. 6 SCP 1 W Start/Stop Issue Condition Disable The SCP bit controls the issue of start/stop conditions in master mode. To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, write 0 in BBSY and 0 in SCP. This bit is always read as 1. If 1 is written, the data is not stored. 5 SDAO 1 R/W SDA Output Value Control This bit is used with SDAOP when modifying output level of SDA. This bit should not be manipulated during transfer. 0: When reading, SDA pin outputs low. When writing, SDA pin is changed to output low. 1: When reading, SDA pin outputs high. When writing, SDA pin is changed to output Hi-Z (outputs high by external pull-up resistance). Rev.5.00 Nov. 02, 2005 Page 308 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W 4 SDAOP 1 R/W Description SDAO Write Protect This bit controls change of output level of the SDA pin by modifying the SDAO bit. To change the output level, clear SDAO and SDAOP to 0 or set SDAO to 1 and clear SDAOP to 0 by the MOV instruction. This bit is always read as 1. 3 SCLO 1 R This bit monitors SCL output level. When SCLO is 1, SCL pin outputs high. When SCLO is 0, SCL pin outputs low. 2 1 Reserved 1 IICRST 0 R/W IIC Control Part Reset This bit is always read as 1, and cannot be modified. This bit resets the control part except for I2C registers. If this bit is set to 1 when hang-up occurs because of 2 2 communication failure during I C operation, I C control part can be reset without setting ports and initializing registers. 0 1 Reserved This bit is always read as 1, and cannot be modified. 17.3.3 I2C Bus Mode Register (ICMR) ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control, and selects the transfer bit count. Bit Bit Name Initial Value R/W Description 7 MLS 0 R/W MSB-First/LSB-First Select 0: MSB-first 1: LSB-first Set this bit to 0 when the I2C bus format is used. 6 WAIT 0 R/W Wait Insertion Bit In master mode with the I2C bus format, this bit selects whether to insert a wait after data transfer except the acknowledge bit. When WAIT is set to 1, after the fall of the clock for the final data bit, low period is extended for two transfer clocks. If WAIT is cleared to 0, data and acknowledge bits are transferred consecutively with no wait inserted. 2 The setting of this bit is invalid in slave mode with the I C bus format or with the clocked synchronous serial format. Rev.5.00 Nov. 02, 2005 Page 309 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 5, 4 All 1 Reserved 3 BCWP 1 R/W These bits are always read as 1, and cannot be modified. BC Write Protect This bit controls the BC2 to BC0 modifications. When modifying BC2 to BC0, this bit should be cleared to 0 and use the MOV instruction. In clock synchronous serial mode, BC should not be modified. 0: When writing, values of BC2 to BC0 are set. 1: When reading, 1 is always read. When writing, settings of BC2 to BC0 are invalid. 2 BC2 0 R/W Bit Counter 2 to 0 1 BC1 0 R/W 0 BC0 0 R/W These bits specify the number of bits to be transferred next. When read, the remaining number of transfer bits is indicated. With the I2C bus format, the data is transferred with one addition acknowledge bit. Bit BC2 to BC0 settings should be made during an interval between transfer frames. If bits BC2 to BC0 are set to a value other than 000, the setting should be made while the SCL pin is low. The value returns to 000 at the end of a data transfer, including the acknowledge bit. With the clock synchronous serial format, these bits should not be modified. 2 Rev.5.00 Nov. 02, 2005 Page 310 of 500 REJ09B0027-0500 I C Bus Format Clock Synchronous Serial Format 000: 9 bits 000: 8 bits 001: 2 bits 001: 1 bits 010: 3 bits 010: 2 bits 011: 4 bits 011: 3 bits 100: 5 bits 100: 4 bits 101: 6 bits 101: 5 bits 110: 7 bits 110: 6 bits 111: 8 bits 111: 7 bits 2 Section 17 I C Bus Interface 2 (IIC2) 17.3.4 I2C Bus Interrupt Enable Register (ICIER) ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be transferred, and confirms acknowledge bits to be received. Bit Bit Name Initial Value R/W Description 7 TIE 0 R/W Transmit Interrupt Enable When the TDRE bit in ICSR is set to 1, this bit enables or disables the transmit data empty interrupt (TXI). 0: Transmit data empty interrupt request (TXI) is disabled. 1: Transmit data empty interrupt request (TXI) is enabled. 6 TEIE 0 R/W Transmit End Interrupt Enable This bit enables or disables the transmit end interrupt (TEI) at the rising of the ninth clock while the TDRE bit in ICSR is 1. TEI can be canceled by clearing the TEND bit or the TEIE bit to 0. 0: Transmit end interrupt request (TEI) is disabled. 1: Transmit end interrupt request (TEI) is enabled. 5 RIE 0 R/W Receive Interrupt Enable This bit enables or disables the receive data full interrupt request (RXI) and the overrun error interrupt request (ERI) with the clocked synchronous format, when a receive data is transferred from ICDRS to ICDRR and the RDRF bit in ICSR is set to 1. RXI can be canceled by clearing the RDRF or RIE bit to 0. 0: Receive data full interrupt request (RXI) and overrun error interrupt request (ERI) with the clocked synchronous format are disabled. 1: Receive data full interrupt request (RXI) and overrun error interrupt request (ERI) with the clocked synchronous format are enabled. 4 NAKIE 0 R/W NACK Receive Interrupt Enable This bit enables or disables the NACK receive interrupt request (NAKI) and the overrun error (setting of the OVE bit in ICSR) interrupt request (ERI) with the clocked synchronous format, when the NACKF and AL bits in ICSR are set to 1. NAKI can be canceled by clearing the NACKF, OVE, or NAKIE bit to 0. 0: NACK receive interrupt request (NAKI) is disabled. 1: NACK receive interrupt request (NAKI) is enabled. Rev.5.00 Nov. 02, 2005 Page 311 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 3 STIE 0 R/W Stop Condition Detection Interrupt Enable 0: Stop condition detection interrupt request (STPI) is disabled. 1: Stop condition detection interrupt request (STPI) is enabled. 2 ACKE 0 R/W Acknowledge Bit Judgement Select 0: The value of the receive acknowledge bit is ignored, and continuous transfer is performed. 1: If the receive acknowledge bit is 1, continuous transfer is halted. 1 ACKBR 0 R Receive Acknowledge In transmit mode, this bit stores the acknowledge data that are returned by the receive device. This bit cannot be modified. 0: Receive acknowledge = 0 1: Receive acknowledge = 1 0 ACKBT 0 R/W Transmit Acknowledge In receive mode, this bit specifies the bit to be sent at the acknowledge timing. 0: 0 is sent at the acknowledge timing. 1: 1 is sent at the acknowledge timing. Rev.5.00 Nov. 02, 2005 Page 312 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.3.5 I2C Bus Status Register (ICSR) ICSR performs confirmation of interrupt request flags and status. Bit Bit Name Initial Value R/W 7 TDRE 0 R/W Description Transmit Data Register Empty [Setting conditions] • When data is transferred from ICDRT to ICDRS and ICDRT becomes empty • When TRS is set • When a start condition (including re-transfer) has been issued • When transmit mode is entered from receive mode in slave mode [Clearing conditions] 6 TEND 0 R/W • When 0 is written in TDRE after reading TDRE = 1 • When data is written to ICDRT with an instruction Transmit End [Setting conditions] • When the ninth clock of SCL rises with the I C bus format while the TDRE flag is 1 • When the final bit of transmit frame is sent with the clock synchronous serial format 2 [Clearing conditions] 5 RDRF 0 R/W • When 0 is written in TEND after reading TEND = 1 • When data is written to ICDRT with an instruction Receive Data Register Full [Setting condition] • When a receive data is transferred from ICDRS to ICDRR [Clearing conditions] • When 0 is written in RDRF after reading RDRF = 1 • When ICDRR is read with an instruction Rev.5.00 Nov. 02, 2005 Page 313 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 4 NACKF 0 R/W No Acknowledge Detection Flag [Setting condition] • When no acknowledge is detected from the receive device in transmission while the ACKE bit in ICIER is 1 [Clearing condition] • 3 STOP 0 R/W When 0 is written in NACKF after reading NACKF = 1 Stop Condition Detection Flag [Setting Conditions] • In master mode, when a stop condition is detected after frame transfer • In slave mode, when a stop condition is detected after the general call address or the first byte slave address, next to detection of start condition, accords with the address set in SAR [Clearing Condition] • Rev.5.00 Nov. 02, 2005 Page 314 of 500 REJ09B0027-0500 When 0 is written in STOP after reading STOP = 1 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 2 AL/OVE 0 R/W Arbitration Lost Flag/Overrun Error Flag This flag indicates that arbitration was lost in master 2 mode with the I C bus format and that the final bit has been received while RDRF = 1 with the clocked synchronous format. When two or more master devices attempt to seize the 2 bus at nearly the same time, if the I C bus interface detects data differing from the data it sent, it sets AL to 1 to indicate that the bus has been taken by another master. [Setting conditions] • If the internal SDA and SDA pin disagree at the rise of SCL in master transmit mode • When the SDA pin outputs high in master mode while a start condition is detected • When the final bit is received with the clocked synchronous format while RDRF = 1 [Clearing condition] • 1 AAS 0 R/W When 0 is written in AL/OVE after reading AL/OVE=1 Slave Address Recognition Flag In slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVA6 to SVA0 in SAR. [Setting conditions] • When the slave address is detected in slave receive mode • When the general call address is detected in slave receive mode. [Clearing condition] • When 0 is written in AAS after reading AAS=1 Rev.5.00 Nov. 02, 2005 Page 315 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 0 ADZ 0 R/W General Call Address Recognition Flag 2 This bit is valid in I C bus format slave receive mode. [Setting condition] • When the general call address is detected in slave receive mode [Clearing condition] • 17.3.6 When 0 is written in ADZ after reading ADZ=1 Slave Address Register (SAR) SAR selects the communication format and sets the slave address. When the chip is in slave mode with the I2C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device. Initial Value R/W Description SVA6 to SVA0 All 0 R/W Slave Address 6 to 0 FS 0 Bit Bit Name 7 to 1 0 These bits set a unique address in bits SVA6 to SVA0, differing form the addresses of other slave devices 2 connected to the I C bus. R/W Format Select 2 0: I C bus format is selected. 1: Clocked synchronous serial format is selected. Rev.5.00 Nov. 02, 2005 Page 316 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.3.7 I2C Bus Transmit Data Register (ICDRT) ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to ICDRS and starts transferring data. If the next transfer data is written to ICDRT during transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1 and when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of ICDRT is H’FF. 17.3.8 I2C Bus Receive Data Register (ICDRR) ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR is H’FF. 17.3.9 I2C Bus Shift Register (ICDRS) ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the CPU. Rev.5.00 Nov. 02, 2005 Page 317 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.4 Operation The I2C bus interface can communicate either in I2C bus mode or clocked synchronous serial mode by setting FS in SAR. 17.4.1 I2C Bus Format Figure 17.3 shows the I2C bus formats. Figure 17.4 shows the I2C bus timing. The first frame following a start condition always consists of 8 bits. (a) I2C bus format (FS = 0) S SLA R/W A DATA A A/A P 1 7 1 1 n 1 1 1 1 n: Transfer bit count (n = 1 to 8) m: Transfer frame count (m ≥ 1) m (b) I2C bus format (Start condition retransmission, FS = 0) S SLA R/W A DATA A/A S SLA R/W A DATA A/A P 1 7 1 1 n1 1 1 7 1 1 n2 1 1 1 m1 1 m2 n1 and n2: Transfer bit count (n1 and n2 = 1 to 8) m1 and m2: Transfer frame count (m1 and m2 ≥ 1) Figure 17.3 I2C Bus Formats SDA SCL S 1-7 8 9 SLA R/W A 1-7 DATA 8 9 A 1-7 DATA 8 9 A P Figure 17.4 I2C Bus Timing Legend S: SLA: Start condition. The master device drives SDA from high to low while SCL is high. Slave address Rev.5.00 Nov. 02, 2005 Page 318 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) R/W: Indicates the direction of data transfer: from the slave device to the master device when R/W is 1, or from the master device to the slave device when R/W is 0. A: Acknowledge. The receive device drives SDA to low. DATA: Transfer data P: Stop condition. The master device drives SDA from low to high while SCL is high. 17.4.2 Master Transmit Operation In master transmit mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. For master transmit mode operation timing, refer to figures 17.5 and 17.6. The transmission procedure and operations in master transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV instruction. (Start condition issued) This generates the start condition. 3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0, and data is transferred from ICDRT to ICDRS. TDRE is set again. 4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1 at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1, the slave device has not been acknowledged, so issue the stop condition. To issue the stop condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the transmit data is prepared or the stop condition is issued. 5. The transmit data after the second byte is written to ICDRT every time TDRE is set. 6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or NACKF. 7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode. Rev.5.00 Nov. 02, 2005 Page 319 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) SCL (Master output) 1 2 3 4 5 6 SDA (Master output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 7 8 Bit 1 Slave address 9 1 Bit 0 Bit 7 2 Bit 6 R/W SDA (Slave output) A TDRE TEND Address + R/W ICDRT ICDRS User processing Data 1 Address + R/W [2] Instruction of start condition issuance Data 2 Data 1 [4] Write data to ICDRT (second byte) [5] Write data to ICDRT (third byte) [3] Write data to ICDRT (first byte) Figure 17.5 Master Transmit Mode Operation Timing (1) SCL (Master output) 9 SDA (Master output) SDA (Slave output) 1 2 3 4 5 6 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 A 7 Bit 1 8 9 Bit 0 A/A TDRE TEND Data n ICDRT ICDRS Data n User [5] Write data to ICDRT processing [6] Issue stop condition. Clear TEND. [7] Set slave receive mode Figure 17.6 Master Transmit Mode Operation Timing (2) Rev.5.00 Nov. 02, 2005 Page 320 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.4.3 Master Receive Operation In master receive mode, the master device outputs the receive clock, receives data from the slave device, and returns an acknowledge signal. For master receive mode operation timing, refer to figures 17.7 and 17.8. The reception procedure and operations in master receive mode are shown below. 1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master transmit mode to master receive mode. Then, clear the TDRE bit to 0. 2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output, and data received, in synchronization with the internal clock. The master device outputs the level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse. 3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF is cleared to 0. 4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is fixed low until ICDRR is read. 5. If next frame is the last receive data, set the RCVD bit in ICCR1 to 1 before reading ICDRR. This enables the issuance of the stop condition after the next reception. 6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, issue the stage condition. 7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0. 8. The operation returns to the slave receive mode. Rev.5.00 Nov. 02, 2005 Page 321 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Master transmit mode SCL (Master output) Master receive mode 9 1 2 3 4 5 6 7 8 SDA (Master output) 9 1 A SDA (Slave output) A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 TDRE TEND TRS RDRF ICDRS Data 1 ICDRR User processing Data 1 [3] Read ICDRR [1] Clear TDRE after clearing TEND and TRS [2] Read ICDRR (dummy read) Figure 17.7 Master Receive Mode Operation Timing (1) Rev.5.00 Nov. 02, 2005 Page 322 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) SCL (Master output) 9 SDA (Master output) A SDA (Slave output) 1 2 3 4 5 6 7 8 9 A/A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RDRF RCVD ICDRS Data n Data n-1 ICDRR Data n Data n-1 User processing [5] Read ICDRR after setting RCVD [7] Read ICDRR, and clear RCVD [6] Issue stop condition [8] Set slave receive mode Figure 17.8 Master Receive Mode Operation Timing (2) 17.4.4 Slave Transmit Operation In slave transmit mode, the slave device outputs the transmit data, while the master device outputs the receive clock and returns an acknowledge signal. For slave transmit mode operation timing, refer to figures 17.9 and 17.10. The transmission procedure and operations in slave transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive mode, and wait until the slave address matches. 2. When the slave address matches in the first frame following detection of the start condition, the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are set to 1, and the mode changes to slave transmit mode automatically. The continuous transmission is performed by writing transmit data to ICDRT every time TDRE is set. 3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1, with TDRE = 1. When TEND is set, clear TEND. 4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free. 5. Clear TDRE. Rev.5.00 Nov. 02, 2005 Page 323 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Slave receive mode Slave transmit mode SCL (Master output) 9 1 2 3 4 5 6 7 8 9 SDA (Master output) 1 A SCL (Slave output) SDA (Slave output) A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 TDRE TEND TRS Data 1 ICDRT ICDRS Data 2 Data 1 Data 3 Data 2 ICDRR User processing [2] Write data to ICDRT (data 1) [2] Write data to ICDRT (data 2) [2] Write data to ICDRT (data 3) Figure 17.9 Slave Transmit Mode Operation Timing (1) Rev.5.00 Nov. 02, 2005 Page 324 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Slave receive mode Slave transmit mode SCL (Master output) 9 SDA (Master output) A 1 2 3 4 5 6 7 8 9 A SCL (Slave output) SDA (Slave output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TDRE TEND TRS ICDRT ICDRS Data n ICDRR User processing [3] Clear TEND [4] Read ICDRR (dummy read) after clearing TRS [5] Clear TDRE Figure 17.10 Slave Transmit Mode Operation Timing (2) 17.4.5 Slave Receive Operation In slave receive mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. For slave receive mode operation timing, refer to figures 17.11 and 17.12. The reception procedure and operations in slave receive mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive mode, and wait until the slave address matches. 2. When the slave address matches in the first frame following detection of the start condition, the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the read data show the slave address and R/W, it is not used.) Rev.5.00 Nov. 02, 2005 Page 325 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be returned to the master device, is reflected to the next transmit frame. 4. The last byte data is read by reading ICDRR. SCL (Master output) 9 SDA (Master output) 1 2 3 4 5 6 7 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 1 Bit 7 SCL (Slave output) SDA (Slave output) A A RDRF ICDRS Data 1 Data 2 ICDRR User processing Data 1 [2] Read ICDRR [2] Read ICDRR (dummy read) Figure 17.11 Slave Receive Mode Operation Timing (1) SCL (Master output) 9 SDA (Master output) 1 2 3 4 5 6 7 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 SCL (Slave output) SDA (Slave output) A A RDRF ICDRS Data 2 Data 1 ICDRR Data 1 User processing [3] Set ACKBT [3] Read ICDRR [4] Read ICDRR Figure 17.12 Slave Receive Mode Operation Timing (2) Rev.5.00 Nov. 02, 2005 Page 326 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.4.6 Clocked Synchronous Serial Format This module can be operated with the clocked synchronous serial format, by setting the FS bit in SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When MST is 0, the external clock input is selected. Data Transfer Format Figure 17.13 shows the clocked synchronous serial transfer format. The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the SDAO bit in ICCR2. SCL SDA Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Figure 17.13 Clocked Synchronous Serial Transfer Format Transmit Operation In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For transmit mode operation timing, refer to figure 17.14. The transmission procedure and operations in transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set. 3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous transmission is performed by writing data to ICDRT every time TDRE is set. When changing from transmit mode to receive mode, clear TRS while TDRE is 1. Rev.5.00 Nov. 02, 2005 Page 327 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) SCL 1 2 7 8 1 7 8 1 SDA (Output) Bit 0 Bit 1 Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 Bit 0 TRS TDRE Data 1 ICDRT Data 1 ICDRS User processing Data 2 [3] Write data [3] Write data to ICDRT to ICDRT [2] Set TRS Data 3 Data 2 Data 3 [3] Write data to ICDRT [3] Write data to ICDRT Figure 17.14 Transmit Mode Operation Timing Receive Operation In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to figure 17.15. The reception procedure and operations in receive mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. When the transfer clock is output, set MST to 1 to start outputting the receive clock. 3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is continually output. The continuous reception is performed by reading ICDRR every time RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR. 4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is fixed high after receiving the next byte data. Rev.5.00 Nov. 02, 2005 Page 328 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) SCL 1 2 7 8 1 7 8 SDA (Input) Bit 0 Bit 1 Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 1 2 Bit 0 MST TRS RDRF Data 2 Data 1 ICDRS Data 3 Data 1 ICDRR User processing [2] Set MST (when outputting the clock) [3] Read ICDRR Data 2 [3] Read ICDRR Figure 17.15 Receive Mode Operation Timing 17.4.7 Noise Canceler The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched internally. Figure 17.16 shows a block diagram of the noise canceler circuit. The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA) input signal is sampled on the system clock, but is not passed forward to the next circuit unless the outputs of both latches agree. If they do not agree, the previous value is held. Sampling clock C SCL or SDA input signal D C Q Latch Q D Latch March detector Internal SCL or SDA signal System clock period Sampling clock Figure 17.16 Block Diagram of Noise Conceler Rev.5.00 Nov. 02, 2005 Page 329 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.4.8 Example of Use Flowcharts in respective modes that use the I2C bus interface are shown in figures 17.17 to 17.20. Start Initialize [1] Test the status of the SCL and SDA lines. [2] Set master transmit mode. [3] Issue the start candition. [2] [4] Set the first byte (slave address + R/W) of transmit data. Write 1 to BBSY and 0 to SCP. [3] [5] Wait for 1 byte to be transmitted. Write transmit data in ICDRT [4] [6] Test the acknowledge transferred from the specified slave device. [7] Set the second and subsequent bytes (except for the final byte) of transmit data. [8] Wait for ICDRT empty. [9] Set the last byte of transmit data. Read BBSY in ICCR2 [1] No BBSY=0 ? Yes Set MST and TRS in ICCR1 to 1. Read TEND in ICSR [5] No TEND=1 ? Yes Read ACKBR in ICIER [6] ACKBR=0 ? [10] Wait for last byte to be transmitted. No [11] Clear the TEND flag. Yes Transmit mode? Yes No Write transmit data in ICDRT Mater receive mode [7] [13] Issue the stop condition. Read TDRE in ICSR No [8] TDRE=1 ? Yes No [12] Clear the STOP flag. [14] Wait for the creation of stop condition. [15] Set slave receive mode. Clear TDRE. Last byte? [9] Yes Write transmit data in ICDRT Read TEND in ICSR No [10] TEND=1 ? Yes Clear TEND in ICSR [11] Clear STOP in ICSR [12] Write 0 to BBSY and SCP [13] Read STOP in ICSR [14] No STOP=1 ? Yes Set MST to 1 and TRS to 0 in ICCR1 [15] Clear TDRE in ICSR End Figure 17.17 Sample Flowchart for Master Transmit Mode Rev.5.00 Nov. 02, 2005 Page 330 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Mater receive mode [1] Clear TEND, select master receive mode, and then clear TDRE.* [2] Set acknowledge to the transmit device.* [3] Dummy-read ICDDR.* [4] Wait for 1 byte to be received [5] Check whether it is the (last receive - 1). [6] Read the receive data last. [7] Set acknowledge of the final byte. Disable continuous reception (RCVD = 1). [8] Read the (final byte - 1) of receive data. [9] Wait for the last byte to be receive. Clear TEND in ICSR Clear TRS in ICCR1 to 0 [1] Clear TDRE in ICSR Clear ACKBT in ICIER to 0 [2] Dummy-read ICDRR [3] Read RDRF in ICSR No [4] RDRF=1 ? Yes Last receive - 1? No Read ICDRR Yes [5] [10] Clear the STOP flag. [6] [11] Issue the stop condition. [12] Wait for the creation of stop condition. Set ACKBT in ICIER to 1 [7] Set RCVD in ICCR1 to 1 Read ICDRR [13] Read the last byte of receive data. [14] Clear RCVD. [8] [15] Set slave receive mode. Read RDRF in ICSR No RDRF=1 ? [9] Yes Clear STOP in ICSR. Write 0 to BBSY and SCP [10] [11] Read STOP in ICSR No [12] STOP=1 ? Yes Read ICDRR [13] Clear RCVD in ICCR1 to 0 [14] Clear MST in ICCR1 to 0 [15] End Note: Do not activate an interrupt during the execution of steps [1] to [3]. Supplementary explanation: When one byte is received, steps [2] to [6] are skipped after step [1], before jumping to step [7]. The step [8] is dummy-read in ICDRR. Figure 17.18 Sample Flowchart for Master Receive Mode Rev.5.00 Nov. 02, 2005 Page 331 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) [1] Clear the AAS flag. Slave transmit mode Clear AAS in ICSR [1] Write transmit data in ICDRT [2] [3] Wait for ICDRT empty. [4] Set the last byte of transmit data. Read TDRE in ICSR [5] Wait for the last byte to be transmitted. [3] No TDRE=1 ? Yes Yes [6] Clear the TEND flag . [7] Set slave receive mode. Last byte? No [2] Set transmit data for ICDRT (except for the last data). [8] Dummy-read ICDRR to release the SCL line. [4] [9] Clear the TDRE flag. Write transmit data in ICDRT Read TEND in ICSR [5] No TEND=1 ? Yes Clear TEND in ICSR [6] Clear TRS in ICCR1 to 0 [7] Dummy read ICDRR [8] Clear TDRE in ICSR [9] End Figure 17.19 Sample Flowchart for Slave Transmit Mode Rev.5.00 Nov. 02, 2005 Page 332 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) Slave receive mode [1] Clear the AAS flag. Clear AAS in ICSR [1] Clear ACKBT in ICIER to 0 [2] Dummy-read ICDRR [3] [2] Set acknowledge to the transmit device. [3] Dummy-read ICDRR. [5] Check whether it is the (last receive - 1). Read RDRF in ICSR No [4] RDRF=1 ? [6] Read the receive data. [7] Set acknowledge of the last byte. Yes Last receive - 1? [4] Wait for 1 byte to be received. Yes No Read ICDRR [5] [8] Read the (last byte - 1) of receive data. [9] Wait the last byte to be received. [6] [10] Read for the last byte of receive data. Set ACKBT in ICIER to 1 [7] Read ICDRR [8] Read RDRF in ICSR No [9] RDRF=1 ? Yes Read ICDRR [10] End Supplementary explanation: When one byte is received, steps [2] to [6] are skipped after step [1], before jumping to step [7]. The step [8] is dummy-read in ICDRR. Figure 17.20 Sample Flowchart for Slave Receive Mode Rev.5.00 Nov. 02, 2005 Page 333 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.5 Interrupt Request There are six interrupt requests in this module; transmit data empty, transmit end, receive data full, NACK receive, STOP recognition, and arbitration lost/overrun error. Table 17.3 shows the contents of each interrupt request. Table 17.3 Interrupt Requests Interrupt Request Abbreviation Interrupt Condition I2C Mode Clocked Synchronous Mode Transmit Data Empty TXI (TDRE=1) • (TIE=1) { { Transmit End TEI (TEND=1) • (TEIE=1) { { Receive Data Full RXI (RDRF=1) • (RIE=1) { { STOP Recognition STPI (STOP=1) • (STIE=1) { × NACK Receive NAKI {(NACKF=1)+(AL=1)} • (NAKIE=1) { × { { Arbitration Lost/Overrun Error When interrupt conditions described in table 17.3 are 1 and the I bit in CCR is 0, the CPU executes an interrupt exception processing. Interrupt sources should be cleared in the exception processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive data of one byte may be transmitted. Rev.5.00 Nov. 02, 2005 Page 334 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.6 Bit Synchronous Circuit In master mode, this module has a possibility that high level period may be short in the two states described below. • When SCL is driven to low by the slave device • When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pullup resistance) Therefore, it monitors SCL and communicates by bit with synchronization. Figure 17.21 shows the timing of the bit synchronous circuit and table 17.4 shows the time when SCL output changes from low to Hi-Z then SCL is monitored. SCL monitor timing reference clock VIH SCL Internal SCL Figure 17.21 The Timing of the Bit Synchronous Circuit Table 17.4 Time for Monitoring SCL CKS3 CKS2 Time for Monitoring SCL 0 0 7.5 tcyc 1 19.5 tcyc 0 17.5 tcyc 1 41.5 tcyc 1 Rev.5.00 Nov. 02, 2005 Page 335 of 500 REJ09B0027-0500 2 Section 17 I C Bus Interface 2 (IIC2) 17.7 Usage Notes 17.7.1 Issue (Retransmission) of Start/Stop Conditions In master mode, when the start/stop conditions are issued (retransmitted) at the specific timing under the following condition 1 or 2, such conditions may not be output successfully. To avoid this, issue (retransmit) the start/stop conditions after the fall of the ninth clock is confirmed. Check the SCLO bit in the I2C control register 2 (IICR2) to confirm the fall of the ninth clock. 1. When the rising of SCL falls behind the time specified in section 17.6, Bit Synchronous Circuit, by the load of the SCL bus (load capacitance or pull-up resistance) 2. When the bit synchronous circuit is activated by extending the low period of eighth and ninth clocks, that is driven by the slave device 17.7.2 WAIT Setting in I2C Bus Mode Register (ICMR) If the WAIT bit is set to 1, and the SCL signal is driven low for two or more transfer clocks by the slave device at the eighth and ninth clocks, the high period of ninth clock may be shortened. To avoid this, set the WAIT bit in ICMR to 0. Rev.5.00 Nov. 02, 2005 Page 336 of 500 REJ09B0027-0500 Section 18 A/D Converter Section 18 A/D Converter This LSI includes a successive approximation type 10-bit A/D converter that allows up to eight analog input channels to be selected. The block diagram of the A/D converter is shown in figure 18.1. 18.1 • • • • • • • • Features 10-bit resolution Eight input channels Conversion time: at least 3.5 µs per channel (at 20-MHz operation) Two operating modes Single mode: Single-channel A/D conversion Scan mode: Continuous A/D conversion on 1 to 4 channels Four data registers Conversion results are held in a data register for each channel Sample-and-hold function Two conversion start methods Software External trigger signal Interrupt request An A/D conversion end interrupt request (ADI) can be generated ADCMS32A_000020020200 Rev.5.00 Nov. 02, 2005 Page 337 of 500 REJ09B0027-0500 Section 18 A/D Converter Module data bus AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 Analog multiplexer 10-bit D/A Bus interface Successive approximations register AVCC Internal data bus A D D R A A D D R B A D D R C A D D R D A D C S R A D C R + φ/4 Control circuit Comparator Sample-andhold circuit ADTRG [Legend] ADCR: ADCSR: ADDRA: ADDRB: ADDRC: ADDRD: A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D Figure 18.1 Block Diagram of A/D Converter Rev.5.00 Nov. 02, 2005 Page 338 of 500 REJ09B0027-0500 φ/8 ADI interrupt Section 18 A/D Converter 18.2 Input/Output Pins Table 18.1 summarizes the input pins used by the A/D converter. The 8 analog input pins are divided into two groups; analog input pins 0 to 3 (AN0 to AN3) comprising group 0, analog input pins 4 to 7 (AN4 to AN7) comprising group 1. The AVcc pin is the power supply pin for the analog block in the A/D converter. Table 18.1 Pin Configuration Pin Name Abbreviation I/O Function Analog power supply pin AVCC Input Analog block power supply Analog input pin 0 AN0 Input Group 0 analog input Analog input pin 1 AN1 Input Analog input pin 2 AN2 Input Analog input pin 3 AN3 Input Analog input pin 4 AN4 Input Analog input pin 5 AN5 Input Analog input pin 6 AN6 Input Analog input pin 7 AN7 Input A/D external trigger input pin ADTRG Input Group 1 analog input External trigger input for starting A/D conversion Rev.5.00 Nov. 02, 2005 Page 339 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.3 Register Descriptions The A/D converter has the following registers. • • • • • • A/D data register A (ADDRA) A/D data register B (ADDRB) A/D data register C (ADDRC) A/D data register D (ADDRD) A/D control/status register (ADCSR) A/D control register (ADCR) 18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of A/D conversion. The ADDR registers, which store a conversion result for each analog input channel, are shown in table 18.2. The converted 10-bit data is stored in bits 15 to 6. The lower 6 bits are always read as 0. The data bus width between the CPU and the A/D converter is 8 bits. The upper byte can be read directly from the CPU, however the lower byte should be read via a temporary register. The temporary register contents are transferred from the ADDR when the upper byte data is read. Therefore byte access to ADDR should be done by reading the upper byte first then the lower one. Word access is also possible. ADDR is initialized to H'0000. Table 18.2 Analog Input Channels and Corresponding ADDR Registers Analog Input Channel Group 0 Group 1 A/D Data Register to Be Stored Results of A/D Conversion AN0 AN4 ADDRA AN1 AN5 ADDRB AN2 AN6 ADDRC AN3 AN7 ADDRD Rev.5.00 Nov. 02, 2005 Page 340 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.3.2 A/D Control/Status Register (ADCSR) ADCSR consists of the control bits and conversion end status bits of the A/D converter. Bit Bit Name Initial Value R/W Description 7 ADF 0 R/W A/D End Flag [Setting conditions] • When A/D conversion ends in single mode • When A/D conversion ends once on all the channels selected in scan mode [Clearing condition] • 6 ADIE 0 R/W When 0 is written after reading ADF = 1 A/D Interrupt Enable A/D conversion end interrupt request (ADI) is enabled by ADF when this bit is set to 1 5 ADST 0 R/W A/D Start Setting this bit to 1 starts A/D conversion. In single mode, this bit is cleared to 0 automatically when conversion on the specified channel is complete. In scan mode, conversion continues sequentially on the specified channels until this bit is cleared to 0 by software, a reset, or a transition to standby mode. 4 SCAN 0 R/W Scan Mode Selects single mode or scan mode as the A/D conversion operating mode. 0: Single mode 1: Scan mode 3 CKS 0 R/W Clock Select Selects the A/D conversions time. 0: Conversion time = 134 states (max.) 1: Conversion time = 70 states (max.) Clear the ADST bit to 0 before switching the conversion time. Rev.5.00 Nov. 02, 2005 Page 341 of 500 REJ09B0027-0500 Section 18 A/D Converter Bit Bit Name Initial Value R/W Description 2 CH2 0 R/W Channel Select 2 to 0 1 CH1 0 R/W Select analog input channels. 0 CH0 0 R/W When SCAN = 0 When SCAN = 1 000: AN0 000: AN0 001: AN1 001: AN0 and AN1 010: AN2 010: AN0 to AN2 011: AN3 011: AN0 to AN3 100: AN4 100: AN4 101: AN5 101: AN4 and AN5 110: AN6 110: AN4 to AN6 111: AN7 111: AN4 to AN7 18.3.3 A/D Control Register (ADCR) ADCR enables A/D conversion started by an external trigger signal. Bit Bit Name Initial Value R/W Description 7 TRGE 0 R/W Trigger Enable A/D conversion is started at the falling edge and the rising edge of the external trigger signal (ADTRG) when this bit is set to 1. The selection between the falling edge and rising edge of the external trigger pin (ADTRG) conforms to the WPEG5 bit in the interrupt edge select register 2 (IEGR2) 6 to 1 — All 1 — Reserved These bits are always read as 1. 0 — 0 R/W Reserved Do not set this bit to 1, though the bit is readable/writable. Rev.5.00 Nov. 02, 2005 Page 342 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.4 Operation The A/D converter operates by successive approximation with 10-bit resolution. It has two operating modes; single mode and scan mode. When changing the operating mode or analog input channel, in order to prevent incorrect operation, first clear the bit ADST in ADCSR to 0. The ADST bit can be set at the same time as the operating mode or analog input channel is changed. 18.4.1 Single Mode In single mode, A/D conversion is performed once for the analog input of the specified single channel as follows: 1. A/D conversion is started when the ADST bit in ADCSR is set to 1, according to software or external trigger input. 2. When A/D conversion is completed, the result is transferred to the corresponding A/D data register of the channel. 3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt request is generated. 4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADST bit is automatically cleared to 0 and the A/D converter enters the wait state. 18.4.2 Scan Mode In scan mode, A/D conversion is performed sequentially for the analog input of the specified channels (four channels maximum) as follows: 1. When the ADST bit in ADCSR is set to 1 by software or external trigger input, A/D conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). 2. When A/D conversion for each channel is completed, the result is sequentially transferred to the A/D data register corresponding to each channel. 3. When conversion of all the selected channels is completed, the ADF flag in ADCSR is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt requested is generated. A/D conversion starts again on the first channel in the group. 4. The ADST bit is not automatically cleared to 0. Steps [2] and [3] are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. Rev.5.00 Nov. 02, 2005 Page 343 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.4.3 Input Sampling and A/D Conversion Time The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then starts conversion. Figure 18.2 shows the A/D conversion timing. Table 18.3 shows the A/D conversion time. As indicated in figure 18.2, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 18.3. In scan mode, the values given in table 18.3 apply to the first conversion time. In the second and subsequent conversions, the conversion time is 128 states (fixed) when CKS = 0 and 66 states (fixed) when CKS = 1. (1) φ Address (2) Write signal Input sampling timing ADF tD tSPL tCONV [Legend] ADCSR write cycle (1) : ADCSR address (2) : A/D conversion start delay time tD : tSPL : Input sampling time tCONV : A/D conversion time Figure 18.2 A/D Conversion Timing Rev.5.00 Nov. 02, 2005 Page 344 of 500 REJ09B0027-0500 Section 18 A/D Converter Table 18.3 A/D Conversion Time (Single Mode) CKS = 0 Item Symbol Min A/D conversion start delay time tD Input sampling time tSPL A/D conversion time tCONV CKS = 1 Typ Max Min Typ Max 6 — 9 — 31 — 4 — 5 — 15 — 131 — 134 69 — 70 Note: All values represent the number of states. 18.4.4 External Trigger Input Timing A/D conversion can also be started by an external trigger input. When the TRGE bit in ADCR is set to 1, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG input pin sets the ADST bit in ADCSR to 1, starting A/D conversion. Other operations, in both single and scan modes, are the same as when the bit ADST has been set to 1 by software. Figure 18.3 shows the timing. φ ADTRG Internal trigger signal ADST A/D conversion Figure 18.3 External Trigger Input Timing Rev.5.00 Nov. 02, 2005 Page 345 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.5 A/D Conversion Accuracy Definitions This LSI's A/D conversion accuracy definitions are given below. • Resolution The number of A/D converter digital output codes • Quantization error The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 18.4). • Offset error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from the minimum voltage value 0000000000 to 0000000001 (see figure 18.5). • Full-scale error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from 1111111110 to 1111111111 (see figure 18.5). • Nonlinearity error The deviation from the ideal A/D conversion characteristic as the voltage changes from zero to full scale. This does not include the offset error, full-scale error, or quantization error. • Absolute accuracy The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error. Rev.5.00 Nov. 02, 2005 Page 346 of 500 REJ09B0027-0500 Section 18 A/D Converter Digital output Ideal A/D conversion characteristic 111 110 101 100 011 010 Quantization error 001 000 1 8 2 8 3 8 4 8 5 8 6 8 7 FS 8 Analog input voltage Figure 18.4 A/D Conversion Accuracy Definitions (1) Full-scale error Digital output Ideal A/D conversion characteristic Nonlinearity error Actual A/D conversion characteristic Offset error FS Analog input voltage Figure 18.5 A/D Conversion Accuracy Definitions (2) Rev.5.00 Nov. 02, 2005 Page 347 of 500 REJ09B0027-0500 Section 18 A/D Converter 18.6 Usage Notes 18.6.1 Permissible Signal Source Impedance This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be possible to guarantee A/D conversion accuracy. However, for A/D conversion in single mode with a large capacitance provided externally, the input load will essentially comprise only the internal input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a large differential coefficient (e.g., 5 mV/µs or greater) (see figure 18.6). When converting a high-speed analog signal or converting in scan mode, a low-impedance buffer should be inserted. 18.6.2 Influences on Absolute Accuracy Adding capacitance results in coupling with GND, and therefore noise in GND may adversely affect absolute accuracy. Be sure to make the connection to an electrically stable GND. Care is also required to ensure that filter circuits do not interfere with digital signals or act as antennas on the mounting board. This LSI Sensor output impedance up to 5 kΩ A/D converter equivalent circuit 10 kΩ Sensor input Low-pass filter C to 0.1 µF Cin = 15 pF Figure 18.6 Analog Input Circuit Example Rev.5.00 Nov. 02, 2005 Page 348 of 500 REJ09B0027-0500 20 pF Section 19 EEPROM Section 19 EEPROM The H8/3687N has an on-chip 512-byte EEPROM. The block diagram of the EEPROM is shown in figure 19.1. 19.1 Features • Two writing methods: 1-byte write Page write: Page size 8 bytes • Three reading methods: Current address read Random address read Sequential read • Acknowledge polling possible • Write cycle time: 10 ms (power supply voltage Vcc = 2.7 V or more) • Write/Erase endurance: 104 cycles/byte (byte write mode), 105 cycles/page (page write mode) • Data retention: 10 years after the write cycle of 104 cycles (page write mode) • Interface with the CPU I2C bus interface (complies with the standard of Philips Corporation) Device code 1010 Sleep address code can be changed (initial value: 000) The I2C bus is open to the outside, so the EEPROM can be directly accessed from the outside. Rev.5.00 Nov. 02, 2005 Page 349 of 500 REJ09B0027-0500 Section 19 EEPROM EEPROM Data bus Y decoder H'FF10 SDA SCL I2C bus interface control circuit Y-select/ Sense amp. Memory array User area (512 bytes) X decoder Key control circuit Address bus EEPROM Key register (EKR) Slave address register ESAR Power-on reset Booster circuit EEPROM module [Legend] ESAR: Register for referring the slave address (specifies the slave address of the memory array) Figure 19.1 Block Diagram of EEPROM Rev.5.00 Nov. 02, 2005 Page 350 of 500 REJ09B0027-0500 H'0000 H'01FF H'FF09 Section 19 EEPROM 19.2 Input/Output Pins Pins used in the EEPROM are listed in table 19.1. Table 19.1 Pin Configuration Pin name Symbol Input/Output Function Serial clock pin SCL Input The SCL pin is used to control serial input/output data timing. The data is input at the rising edge of the clock and output at the falling edge of the clock. The SCL pin needs to be pulled up by resistor as that pin 2 is open-drain driven structure of the I C pin. Use proper resistor value for your system by considering VOL, IOL, and the CIN pin capacitance in section 23.2.2, DC Characteristics and in section 23.2.3, AC Characteristics. Maximum clock frequency is 400 kHz. Serial data pin SDA Input/Output The SDA pin is bidirectional for serial data transfer. The SDA pin needs to be pulled up by resistor as that pin is open-drain driven structure. Use proper resistor value for your system by considering VOL, IOL, and the CIN pin capacitance in section 23.2.2, DC Characteristics and in section 23.2.3, AC Characteristics. Except for a start condition and a stop condition which will be discussed later, the highto-low and low-to-high change of SDA input should be done during SCL low periods. 19.3 Register Description The EEPROM has a following register. • EEPROM key register (EKR) 19.3.1 EEPROM Key Register (EKR) EKR is an 8-bit readable/writable register, which changes the slave address code written in the EEPROM. The slave address code is changed by writing H'5F in EKR and then writing either of H'00 to H'07 as an address code to the H'FF09 address in the EEPROM by the byte write method. EKR is initialized to H'FF. Rev.5.00 Nov. 02, 2005 Page 351 of 500 REJ09B0027-0500 Section 19 EEPROM 19.4 Operation 19.4.1 EEPROM Interface The HD64N3687G has a multi-chip structure with two internal chips of the HD64F3687G (FZTAT™ version) and 512-byte EEPROM. The HD6483687G has a multi-chip structure with two internal chips of the HD6433687G (mask-ROM version) and 512-byte EEPROM. The EEPROM interface is the I2C bus interface. This I2C bus is open to the outside, so the communication with the external devices connected to the I2C bus can be made. 19.4.2 Bus Format and Timing The I2C bus format and the I2C bus timing follow section 17.4.1, I2C Bus Format. The bus formats specific for the EEPROM are the following two. 1. The EEPROM address is configured of two bytes, the write data is transferred in the order of upper address and lower address from each MSB side. 2. The write data is transmitted from the MSB side. The bus format and bus timing of the EEPROM are shown in figure 19.2. Stop conditon Start condition Slave address SCL 1 2 3 4 5 R/W ACK 6 7 8 SDA 9 Upper memory lower memory ACK ACK address address 1 8 A15 A8 9 1 8 A7 A0 9 Data Data ACK 1 8 D7 D0 9 ACK 1 8 D7 D0 9 [Legend] R/W: R/W code (0 is for a write and 1 is for a read), ACK: acknowledge Figure 19.2 EEPROM Bus Format and Bus Timing 19.4.3 Start Condition A high-to-low transition of the SDA input with the SCL input high is needed to generate the start condition for starting read, write operation. Rev.5.00 Nov. 02, 2005 Page 352 of 500 REJ09B0027-0500 Section 19 EEPROM 19.4.4 Stop Condition A low-to-high transition of the SDA input with the SCL input high is needed to generate the stop condition for stopping read, write operation. The standby operation starts after a read sequence by a stop condition. In the case of write operation, a stop condition terminates the write data inputs and place the device in an internallytimed write cycle to the memories. After the internally-timed write cycle (tWC) which is specified as tWC, the device enters a standby mode. 19.4.5 Acknowledge All address data and serial data such as read data and write data are transmitted to and from in 8bit unit. The acknowledgement is the signal that indicates that this 8-bit data is normally transmitted to and from. In the write operation, EEPROM sends "0" to acknowledge in the ninth cycle after receiving the data. In the read operation, EEPROM sends a read data following the acknowledgement after receiving the data. After sending read data, the EEPROM enters the bus open state. If the EEPROM receives "0" as an acknowledgement, it sends read data of the next address. If the EEPROM does not receive acknowledgement "0" and receives a following stop condition, it stops the read operation and enters a standby mode. If the EEPROM receives neither acknowledgement "0" nor a stop condition, the EEPROM keeps bus open without sending read data. 19.4.6 Slave Addressing The EEPROM device receives a 7-bit slave address and a 1-bit R/W code following the generation of the start conditions. The EEPROM enables the chip for a read or a write operation with this operation. The slave address consists of a former 4-bit device code and latter 3-bit slave address as shown in table 19.2. The device code is used to distinguish device type and this LSI uses "1010" fixed code in the same manner as in a general-purpose EEPROM. The slave address code selects one device out of all devices with device code 1010 (8 devices in maximum) which are connected to the I2C bus. This means that the device is selected if the inputted slave address code received in the order of A2, A1, A0 is equal to the corresponding slave address reference register (ESAR). The slave address code is stored in the address H'FF09 in the EEPROM. It is transferred to ESAR from the slave address register in the memory array during 10 ms after the reset is released. An access to the EEPROM is not allowed during transfer. Rev.5.00 Nov. 02, 2005 Page 353 of 500 REJ09B0027-0500 Section 19 EEPROM The initial value of the slave address code written in the EEPROM is H'00. It can be written in the range of H'00 to H'07. Be sure to write the data by the byte write method. The next one bit of the slave address is the R/W code. 0 is for a write and 1 is for a read. The EEPROM turns to a standby state if the device code is not "1010" or slave address code doesn’t coincide. Table 19.2 Slave Addresses Bit Bit name Initial Value Setting Value Remarks 7 Device code D3 1 6 Device code D2 0 5 Device code D1 1 4 Device code D0 0 3 Slave address code A2 0 A2 The initial value can be changed 2 Slave address code A1 0 A1 The initial value can be changed 1 Slave address code A0 0 A0 The initial value can be changed 19.4.7 Write Operations There are two types write operations; byte write operation and page write operation. To initiate the write operation, input 0 to R/W code following the slave address. 1. Byte Write A write operation requires an 8-bit data of a 7-bit slave address with R/W code = "0". Then the EEPROM sends acknowledgement "0" at the ninth bit. This enters the write mode. Then, two bytes of the memory address are received from the MSB side in the order of upper and lower. Upon receipt of one-byte memory address, the EEPROM sends acknowledgement "0" and receives a following a one-byte write data. After receipt of write data, the EEPROM sends acknowledgement "0". If the EEPROM receives a stop condition, the EEPROM enters an internally controlled write cycle and terminates receipt of SCL and SDA inputs until completion of the write cycle. The EEPROM returns to a standby mode after completion of the write cycle. The byte write operation is shown in figure 19.3. Rev.5.00 Nov. 02, 2005 Page 354 of 500 REJ09B0027-0500 Section 19 EEPROM SCL 1 2 3 4 5 6 7 8 9 SDA R/W ACK Slave address 1 8 A15 A8 Upper memory address 9 ACK 1 8 A7 A0 lower memory address 9 ACK 1 8 D7 D0 Write Data 9 ACK Stop conditon Start condition [Legend] R/W: R/W code (0 is for a write and 1 is for a read) ACK: acknowledge Figure 19.3 Byte Write Operation 2. Page Write This LSI is capable of the page write operation which allows any number of bytes up to 8 bytes to be written in a single write cycle. The write data is input in the same sequence as the byte write in the order of a start condition, slave address + R/W code, memory address (n), and write data (Dn) with every ninth bit acknowledgement "0" output. The EEPROM enters the page write operation if the EEPROM receives more write data (Dn+1) is input instead of receiving a stop condition after receiving the write data (Dn). LSB 3 bits (A2 to A0) in the EEPROM address are automatically incremented to be the (n+1) address upon receiving write data (Dn+1). Thus the write data can be received sequentially. Addresses in the page are incremented at each receipt of the write data and the write data can be input up to 8 bytes. If the LSB 3 bits (A2 to A0) in the EEPROM address reach the last address of the page, the address will roll over to the first address of the same page. When the address is rolled over, write data is received twice or more to the same address, however, the last received data is valid. At the receipt of the stop condition, write data reception is terminated and the write operation is entered. The page write operation is shown in figure 19.4. Rev.5.00 Nov. 02, 2005 Page 355 of 500 REJ09B0027-0500 Section 19 EEPROM SCL 1 2 3 4 5 6 7 8 9 SDA Slave address R/W ACK 1 8 A15 A8 9 1 8 A7 A0 9 1 8 D7 D0 Upper memory lower memory ACK ACK Write Data address address 9 D7 ACK D0 Write Data ACK Stop conditon Start condition [Legend] R/W: R/W code (0 is for a write and 1 is for a read), ACK: acknowledge Figure 19.4 Page Write Operation 19.4.8 Acknowledge Polling Acknowledge polling feature is used to show if the EEPROM is in an internally-timed write cycle or not. This feature is initiated by the input of the 8-bit slave address + R/W code following the start condition during an internally-timed write cycle. Acknowledge polling will operate R/W code = "0". The ninth acknowledgement judges if the EEPROM is an internally-timed write cycle or not. Acknowledgement "1" shows the EEPROM is in a internally-timed write cycle and acknowledgement "0" shows the internally-timed write cycle has been completed. The acknowledge polling starts to function after a write data is input, i.e., when the stop condition is input. 19.4.9 Read Operation There are three read operations; current address read, random address read, and sequential read. Read operations are initiated in the same way as write operations with the exception of R/W = 1. 1. Current Address Read The internal address counter maintains the (n+1) address that is made by the last address (n) accessed during the last read or write operation, with incremented by one. Current address read accesses the (n+1) address kept by the internal address counter. After receiving in the order of a start condition and the slave address + R/W code (R/W = 1), the EEPROM outputs the 1-byte data of the (n+1) address from the most significant bit following acknowledgement "0". If the EEPROM receives in the order of acknowledgement "1" and a following stop condition, the EEPROM stops the read operation and is turned to a standby state. Rev.5.00 Nov. 02, 2005 Page 356 of 500 REJ09B0027-0500 Section 19 EEPROM In case the EEPROM has accessed the last address H'01FF at previous read operation, the current address will roll over and returns to zero address. In case the EEPROM has accessed the last address of the page at previous write operation, the current address will roll over within page addressing and returns to the first address in the same page. The current address is valid while power is on. The current address after power on will be undefined. After power is turned on, define the address by the random address read operation described below is necessary. The current address read operation is shown in figure 19.5. SCL 1 2 3 4 5 6 7 8 9 SDA Slave address R/W ACK 1 8 D7 D0 Read Data 9 ACK Stop conditon Start condition [Legend] R/W: R/W code (0 is for a write and 1 is for a read) ACK: acknowledge Figure 19.5 Current Address Read Operation 2. Random Address Read This is a read operation with defined read address. A random address read requires a dummy write to set read address. The EEPROM receives a start condition, slave address + R/W code (R/W = 0), memory address (upper) and memory address (lower) sequentially. The EEPROM outputs acknowledgement "0" after receiving memory address (lower) then enters a current address read with receiving a start condition again. The EEPROM outputs the read data of the address which was defined in the dummy write operation. After receiving acknowledgement "1" and a following stop condition, the EEPROM stops the random read operation and returns to a standby state. The random address read operation is shown in figure 19.6. Rev.5.00 Nov. 02, 2005 Page 357 of 500 REJ09B0027-0500 Section 19 EEPROM SCL 1 2 3 4 5 6 7 8 9 SDA Slave address R/W ACK 1 8 A15 A8 9 1 8 A7 A0 9 1 Upper memory lower memory ACK ACK address address Start condition 2 3 4 5 6 7 8 Slave address 9 R ACK 1 8 D7 D0 9 Read Data ACK Start condition Stop conditon [Legend] R/W: R/W code (0 is for a write and 1 is for a read), ACK: acknowledge Figure 19.6 Random Address Read Operation 3. Sequential Read This is a mode to read the data sequentially. Data is sequential read by either a current address read or a random address read. If the EEPROM receives acknowledgement "0" after 1-byte read data is output, the read address is incremented and the next 1-byte read data are coming out. Data is output sequentially by incrementing addresses as long as the EEPROM receives acknowledgement "0" after the data is output. The address will roll over and returns address zero if it reaches the last address H'01FF. The sequential read can be continued after roll over. The sequential read is terminated if the EEPROM receives acknowledgement "1" and a following stop condition as the same manner as in the random address read. The condition of a sequential read when the current address read is used is shown in figure 19.7. SCL 1 2 3 4 5 6 7 8 9 SDA Slave address R/W ACK 1 8 D7 D0 9 Read Data ACK · · · · 1 8 D7 D0 Read Data 9 ACK Start condition [Legend] R/W: R/W code (0 is for a write and 1 is for a read) ACK: acknowledge Figure 19.7 Sequential Read Operation (when current address read is used) Rev.5.00 Nov. 02, 2005 Page 358 of 500 REJ09B0027-0500 Stop conditon Section 19 EEPROM 19.5 Usage Notes 19.5.1 Data Protection at VCC On/Off When VCC is turned on or off, the data might be destroyed by malfunction. Be careful of the notices described below to prevent the data to be destroyed. 1. SCL and SDA should be fixed to VCC or VSS during VCC on/off. 2. VCC should be turned off after the EEPROM is placed in a standby state. 3. When VCC is turned on from the intermediate level, malfunction is caused, so VCC should be turned on from the ground level (VSS). 4. VCC turn on speed should be longer than 10 us. 19.5.2 Write/Erase Endurance The endurance is 105 cycles/page (1% cumulative failure rate) in case of page programming and 104 cycles/byte in case of byte programming. The data retention time is more than 10 years when a device is page-programmed less than 104 cycles. 19.5.3 Noise Suppression Time This EEPROM has a noise suppression function at SCL and SDA inputs, that cuts noise of width less than 50 ns. Be careful not to allow noise of width more than 50 ns because the noise of with more than 50 ms is recognized as an active pulse. Rev.5.00 Nov. 02, 2005 Page 359 of 500 REJ09B0027-0500 Section 19 EEPROM Rev.5.00 Nov. 02, 2005 Page 360 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) This LSI can include a power-on reset circuit and low-voltage detection circuit as optional circuits. The low-voltage detection circuit consists of two circuits: LVDI (interrupt by low voltage detect) and LVDR (reset by low voltage detect) circuits. This circuit is used to prevent abnormal operation (runaway execution) from occurring due to the power supply voltage fall and to recreate the state before the power supply voltage fall when the power supply voltage rises again. Even if the power supply voltage falls, the unstable state when the power supply voltage falls below the guaranteed operating voltage can be removed by entering standby mode when exceeding the guaranteed operating voltage and during normal operation. Thus, system stability can be improved. If the power supply voltage falls more, the reset state is automatically entered. If the power supply voltage rises again, the reset state is held for a specified period, then active mode is automatically entered. Figure 20.1 is a block diagram of the power-on reset circuit and the low-voltage detection circuit. 20.1 Features • Power-on reset circuit Uses an external capacitor to generate an internal reset signal when power is first supplied. • Low-voltage detection circuit LVDR: Monitors the power-supply voltage, and generates an internal reset signal when the voltage falls below a specified value. LVDI: Monitors the power-supply voltage, and generates an interrupt when the voltage falls below or rises above respective specified values. Two pairs of detection levels for reset generation voltage are available: when only the LVDR circuit is used, or when the LVDI and LVDR circuits are both used. LVI0000A_000020030300 Rev.5.00 Nov. 02, 2005 Page 361 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) φ CK R OVF PSS R RES Internal reset signal Q Noise canceler S CRES Power-on reset circuit Noise canceler Ladder resistor Vcc Internal data bus LVDCR Vreset + − Vint LVDRES + − LVDINT Interrupt control circuit LVDSR Reference voltage generator Interrupt request Low-voltage detection circuit [Legend] PSS: LVDCR: LVDSR: LVDRES: LVDINT: Vreset: Vint: Prescaler S Low-voltage-detection control register Low-voltage-detection status register Low-voltage-detection reset signal Low-voltage-detection interrupt signal Reset detection voltage Power-supply fall/rise detection voltage Figure 20.1 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit 20.2 Register Descriptions The low-voltage detection circuit has the following registers. • Low-voltage-detection control register (LVDCR) • Low-voltage-detection status register (LVDSR) 20.2.1 Low-Voltage-Detection Control Register (LVDCR) LVDCR is used to enable or disable the low-voltage detection circuit, set the detection levels for the LVDR function, enable or disable the LVDR function, and enable or disable generation of an interrupt when the power-supply voltage rises above or falls below the respective levels. Rev.5.00 Nov. 02, 2005 Page 362 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Table 20.1 shows the relationship between the LVDCR settings and select functions. LVDCR should be set according to table 20.1. Bit Bit Name Initial Value R/W Description 7 LVDE 0* R/W LVD Enable 0: The low-voltage detection circuit is not used (In standby mode) 1: The low-voltage detection circuit is used 6 to 4 All 1 Reserved These bits are always read as 1, and cannot be modified. 3 LVDSEL 0* R/W LVDR Detection Level Select 0: Reset detection voltage is 2.3 V (typ.) 1: Reset detection voltage is 3.6 V (typ.) When the falling or rising voltage detection interrupt is used, reset detection voltage of 2.3 V (typ.) should be used. When only a reset detection interrupt is used, reset detection voltage of 3.6 V (typ.) should be used. 2 LVDRE 0* R/W LVDR Enable 0: Disables the LVDR function 1: Enables the LVDR function 1 LVDDE 0 R/W Voltage-Fall-Interrupt Enable 0: Interrupt on the power-supply voltage falling below the selected detection level disabled 1: Interrupt on the power-supply voltage falling below the selected detection level enabled 0 LVDUE 0 R/W Voltage-Rise-Interrupt Enable 0: Interrupt on the power-supply voltage rising above the selected detection level disabled 1: Interrupt on the power-supply voltage rising above the selected detection level enabled Note: * Not initialized by LVDR but initialized by a power-on reset or WDT reset. Rev.5.00 Nov. 02, 2005 Page 363 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Table 20.1 LVDCR Settings and Select Functions LVDCR Settings Select Functions LVDE LVDSEL LVDRE LVDDE LVDUE Power-On Reset LVDR Low-VoltageDetection Falling Interrupt 0 * * * * O 1 1 1 0 0 O O 1 0 0 1 0 O O 1 0 0 1 1 O O O 1 0 1 1 1 O O O O Legend: *: means invalid. 20.2.2 Low-Voltage-Detection Status Register (LVDSR) Low-VoltageDetection Rising Interrupt LVDSR indicates whether the power-supply voltage falls below or rises above the respective specified values. Bit Bit Name Initial Value R/W Description 7 to 2 All 1 Reserved These bits are always read as 1, and cannot be modified. 1 LVDDF 0* R/W LVD Power-Supply Voltage Fall Flag [Setting condition] When the power-supply voltage falls below Vint (D) (typ. = 3.7 V) [Clearing condition] Writing 0 to this bit after reading it as 1 0 LVDUF 0* R/W LVD Power-Supply Voltage Rise Flag [Setting condition] When the power supply voltage falls below Vint (D) while the LVDUE bit in LVDCR is set to 1, then rises above Vint (U) (typ. = 4.0 V) before falling below Vreset1 (typ. = 2.3 V) [Clearing condition] Writing 0 to this bit after reading it as 1 Note: * Initialized by LVDR. Rev.5.00 Nov. 02, 2005 Page 364 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) 20.3 Operation 20.3.1 Power-On Reset Circuit Figure 20.2 shows the timing of the operation of the power-on reset circuit. As the power-supply voltage rises, the capacitor which is externally connected to the RES pin is gradually charged via the on-chip pull-up resistor (typ. 150 kΩ). Since the state of the RES pin is transmitted within the chip, the prescaler S and the entire chip are in their reset states. When the level on the RES pin reaches the specified value, the prescaler S is released from its reset state and it starts counting. The OVF signal is generated to release the internal reset signal after the prescaler S has counted 131,072 clock (φ) cycles. The noise cancellation circuit of approximately 100 ns is incorporated to prevent the incorrect operation of the chip by noise on the RES pin. To achieve stable operation of this LSI, the power supply needs to rise to its full level and settles within the specified time. The maximum time required for the power supply to rise and settle after power has been supplied (tPWON) is determined by the oscillation frequency (fOSC) and capacitance which is connected to RES pin (CRES). If tPWON means the time required to reach 90 % of power supply voltage, the power supply circuit should be designed to satisfy the following formula. tPWON (ms) ≤ 90 × CRES (µF) + 162/fOSC (MHz) (tPWON ≤ 3000 ms, CRES ≥ 0.22 µF, and fOSC = 10 in 2-MHz to 10-MHz operation) Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV and rise after charge on the RES pin is removed. To remove charge on the RES pin, it is recommended that the diode should be placed near Vcc. If the power supply voltage (Vcc) rises from the point above Vpor, a power-on reset may not occur. Rev.5.00 Nov. 02, 2005 Page 365 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) tPWON Vcc Vpor Vss RES Vss PSS-reset signal OVF Internal reset signal 131,072 cycles PSS counter starts Reset released Figure 20.2 Operational Timing of Power-On Reset Circuit 20.3.2 Low-Voltage Detection Circuit LVDR (Reset by Low Voltage Detect) Circuit: Figure 20.3 shows the timing of the LVDR function. The LVDR enters the module-standby state after a power-on reset is canceled. To operate the LVDR, set the LVDE bit in LVDCR to 1, wait for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have stabilized by a software timer, etc., then set the LVDRE bit in LVDCR to 1. After that, the output settings of ports must be made. To cancel the low-voltage detection circuit, first the LVDRE bit should be cleared to 0 and then the LVDE bit should be cleared to 0. The LVDE and LVDRE bits must not be cleared to 0 simultaneously because incorrect operation may occur. When the power-supply voltage falls below the Vreset voltage (typ. = 2.3 V or 3.6 V), the LVDR clears the LVDRES signal to 0, and resets the prescaler S. The low-voltage detection reset state remains in place until a power-on reset is generated. When the power-supply voltage rises above the Vreset voltage again, the prescaler S starts counting. It counts 131,072 clock (φ) cycles, and then releases the internal reset signal. In this case, the LVDE, LVDSEL, and LVDRE bits in LVDCR are not initialized. Note that if the power supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises from that point, the low-voltage detection reset may not occur. If the power supply voltage (Vcc) falls below Vpor = 100 mV, a power-on reset occurs. Rev.5.00 Nov. 02, 2005 Page 366 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) VCC Vreset VLVDRmin VSS LVDRES PSS-reset signal OVF Internal reset signal 131,072 cycles PSS counter starts Reset released Figure 20.3 Operational Timing of LVDR Circuit LVDI (Interrupt by Low Voltage Detect) Circuit: Figure 20.4 shows the timing of LVDI functions. The LVDI enters the module-standby state after a power-on reset is canceled. To operate the LVDI, set the LVDE bit in LVDCR to 1, wait for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have stabilized by a software timer, etc., then set the LVDDE and LVDUE bits in LVDCR to 1. After that, the output settings of ports must be made. To cancel the low-voltage detection circuit, first the LVDDE and LVDUE bits should all be cleared to 0 and then the LVDE bit should be cleared to 0. The LVDE bit must not be cleared to 0 at the same timing as the LVDDE and LVDUE bits because incorrect operation may occur. When the power-supply voltage falls below Vint (D) (typ. = 3.7 V) voltage, the LVDI clears the LVDINT signal to 0 and the LVDDF bit in LVDSR is set to 1. If the LVDDE bit is 1 at this time, an IRQ0 interrupt request is simultaneously generated. In this case, the necessary data must be saved in the external EEPROM, etc, and a transition must be made to standby mode or subsleep mode. Until this processing is completed, the power supply voltage must be higher than the lower limit of the guaranteed operating voltage. When the power-supply voltage does not fall below Vreset1 (typ. = 2.3 V) voltage but rises above Vint (U) (typ. = 4.0 V) voltage, the LVDI sets the LVDINT signal to 1. If the LVDUE bit is 1 at Rev.5.00 Nov. 02, 2005 Page 367 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) this time, the LVDUF bit in LVDSR is set to 1 and an IRQ0 interrupt request is simultaneously generated. If the power supply voltage (Vcc) falls below Vreset1 (typ. = 2.3 V) voltage, the LVDR function is performed. Vint (U) Vint (D) Vcc Vreset1 VSS LVDINT LVDDE LVDDF LVDUE LVDUF IRQ0 interrupt generated IRQ0 interrupt generated Figure 20.4 Operational Timing of LVDI Circuit Rev.5.00 Nov. 02, 2005 Page 368 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Procedures for Clearing Settings when Using LVDR and LVDI: To operate or release the low-voltage detection circuit normally, follow the procedure described below. Figure 20.5 shows the timing for the operation and release of the low-voltage detection circuit. 1. To operate the low-voltage detection circuit, set the LVDE bit in LVDCR to 1. 2. Wait for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have stabilized by a software timer, etc. Then, clear the LVDDF and LVDUF bits in LVDSR to 0 and set the LVDRE, LVDDE, and LVDUE bits in LVDCR to 1, as required. 3. To release the low-voltage detection circuit, start by clearing all of the LVDRE, LVDDE, and LVDUE bits to 0. Then clear the LVDE bit to 0. The LVDE bit must not be cleared to 0 at the same timing as the LVDRE, LVDDE, and LVDUE bits because incorrect operation may occur. LVDE LVDRE LVDDE LVDUE tLVDON Figure 20.5 Timing for Operation/Release of Low-Voltage Detection Circuit Rev.5.00 Nov. 02, 2005 Page 369 of 500 REJ09B0027-0500 Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) Rev.5.00 Nov. 02, 2005 Page 370 of 500 REJ09B0027-0500 Section 21 Power Supply Circuit Section 21 Power Supply Circuit This LSI incorporates an internal power supply step-down circuit. Use of this circuit enables the internal power supply to be fixed at a constant level of approximately 3.0 V, independently of the voltage of the power supply connected to the external VCC pin. As a result, the current consumed when an external power supply is used at 3.0 V or above can be held down to virtually the same low level as when used at approximately 3.0 V. If the external power supply is 3.0 V or below, the internal voltage will be practically the same as the external voltage. It is, of course, also possible to use the same level of external power supply voltage and internal power supply voltage without using the internal power supply step-down circuit. 21.1 When Using Internal Power Supply Step-Down Circuit Connect the external power supply to the VCC pin, and connect a capacitance of approximately 0.1 µF between VCL and VSS, as shown in figure 21.1. The internal step-down circuit is made effective simply by adding this external circuit. In the external circuit interface, the external power supply voltage connected to VCC and the GND potential connected to VSS are the reference levels. For example, for port input/output levels, the VCC level is the reference for the high level, and the VSS level is that for the low level. The A/D converter analog power supply is not affected by the internal step-down circuit. VCC Step-down circuit Internal logic VCC = 3.0 to 5.5 V VCL Stabilization capacitance (approx. 0.1 µF) Internal power supply VSS Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used PSCKT00A_000020020200 Rev.5.00 Nov. 02, 2005 Page 371 of 500 REJ09B0027-0500 Section 21 Power Supply Circuit 21.2 When Not Using Internal Power Supply Step-Down Circuit When the internal power supply step-down circuit is not used, connect the external power supply to the VCL pin and VCC pin, as shown in figure 21.2. The external power supply is then input directly to the internal power supply. The permissible range for the power supply voltage is 3.0 V to 3.6 V. Operation cannot be guaranteed if a voltage outside this range (less than 3.0 V or more than 3.6 V) is input. VCC Step-down circuit Internal logic VCC = 3.0 to 3.6 V VCL Internal power supply VSS Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used Rev.5.00 Nov. 02, 2005 Page 372 of 500 REJ09B0027-0500 Section 22 List of Registers Section 22 List of Registers The register list gives information on the on-chip I/O register addresses, how the register bits are configured, and the register states in each operating mode. The information is given as shown below. 1. Register addresses (address order) • Registers are listed from the lower allocation addresses. • The symbol in the register-name column represents a reserved address or range of reserved addresses. Do not attempt to access reserved addresses. • When the address is 16-bit wide, the address of the upper byte is given in the list. • Registers are classified by functional modules. • The data bus width is indicated. • The number of access states is indicated. 2. • • • Register bits Bit configurations of the registers are described in the same order as the register addresses. Reserved bits are indicated by in the bit name column. When registers consist of 16 bits, bits are described from the MSB side. 3. Register states in each operating mode • Register states are described in the same order as the register addresses. • The register states described here are for the basic operating modes. If there is a specific reset for an on-chip peripheral module, refer to the section on that on-chip peripheral module. Rev.5.00 Nov. 02, 2005 Page 373 of 500 REJ09B0027-0500 Section 22 List of Registers 22.1 Register Addresses (Address Order) The data-bus width column indicates the number of bits. The access-state column shows the number of states of the selected basic clock that is required for access to the register. Note: Access to undefined or reserved addresses should not take place. Correct operation of the access itself or later operations is not guaranteed when such a register is accessed. Register Abbreviation Bit No — — — Data Bus Width Access State — — — Module Address Name H'F000 to H'F6FF Timer control register_0 TCR_0 8 H'F700 Timer Z 8 2 Timer I/O control register A_0 TIORA_0 8 H'F701 Timer Z 8 2 Timer I/O control register C_0 TIORC_0 8 H'F702 Timer Z 8 2 Timer status register_0 TSR_0 8 H'F703 Timer Z 8 2 Timer interrupt enable register_0 TIER_0 8 H'F704 Timer Z 8 2 PWM mode output level control register_0 POCR_0 8 H'F705 Timer Z 8 2 Timer counter_0 TCNT_0 16 H'F706 Timer Z 16 2 General register A_0 GRA_0 16 H'F708 Timer Z 16 2 General register B_0 GRB_0 16 H'F70A Timer Z 16 2 General register C_0 GRC_0 16 H'F70C Timer Z 16 2 General register D_0 GRD_0 16 H'F70E Timer Z 16 2 Timer control register_1 TCR_1 8 H'F710 Timer Z 8 2 Timer I/O control register A_1 TIORA_1 8 H'F711 Timer Z 8 2 Timer I/O control register C_1 TIORC_1 8 H'F712 Timer Z 8 2 Timer status register_1 TSR_1 8 H'F713 Timer Z 8 2 Timer interrupt enable register_1 TIER_1 8 H'F714 Timer Z 8 2 PWM mode output level control register_1 POCR_1 8 H'F715 Timer Z 8 2 Timer counter_1 TCNT_1 16 H'F716 Timer Z 16 2 General register A_1 GRA_1 16 H'F718 Timer Z 16 2 General register B_1 GRB_1 16 H'F71A Timer Z 16 2 Rev.5.00 Nov. 02, 2005 Page 374 of 500 REJ09B0027-0500 Section 22 List of Registers Bit No Module Address Name Data Bus Width Access State GRC_1 16 H'F71C Timer Z 16 2 General register D_1 GRD_1 16 H'F71E Timer Z 16 2 Timer start register TSTR 8 H'F720 Timer Z 8 2 Timer mode register TMDR 8 H'F721 Timer Z 8 2 Timer PWM mode register TPMR 8 H'F722 Timer Z 8 2 Timer Z, for common use TFCR 8 H'F723 Timer Z 8 2 Timer output master enable register TOER 8 H'F724 Timer Z 8 2 Timer output control register TOCR 8 H'F725 Timer Z 8 2 — — — H'F726, H'F727 Timer Z — — Second data register/free running counter data register RSECDR 8 H'F728 RTC 8 2 Minute data register RMINDR 8 H'F729 RTC 8 2 Hour data register RHRDR 8 H'F72A RTC 8 2 Day-of-week data register RWKDR 8 H'F72B RTC 8 2 RTC control register 1 RTCCR1 8 H'F72C RTC 8 2 Register Abbreviation General register C_1 RTC control register 2 RTCCR2 8 H'F72D RTC 8 2 — — H'F72E RTC — — Clock source select register RTCCSR 8 H'F72F RTC — 8 2 1 Low-voltage-detection control register LVDCR 8 H'F730 LVDC* 8 2 Low-voltage-detection status register LVDSR 8 H'F731 LVDC*1 8 2 — — — H'F732 to H'F73F — — — Serial mode register_2 SMR_2 8 H'F740 SCI3_2 8 3 Bit rate register_2 BRR_2 8 H'F741 SCI3_2 8 3 Serial control register 3_2 SCR3_2 8 H'F742 SCI3_2 8 3 Transmit data register_2 TDR_2 8 H'F743 SCI3_2 8 3 Serial status register_2 SSR_2 8 H'F744 SCI3_2 8 3 Rev.5.00 Nov. 02, 2005 Page 375 of 500 REJ09B0027-0500 Section 22 List of Registers Bit No Module Address Name Data Bus Width Access State RDR_2 8 H'F745 SCI3_2 8 3 — — — H'F746, H'F747 SCI3_2 — — I2C bus control register 1 ICCR1 8 H'F748 IIC2 8 2 I2C bus control register 2 ICCR2 8 H'F749 IIC2 8 2 I2C bus mode register ICMR 8 H'F74A IIC2 8 2 I2C bus interrupt enable register ICIER 8 H'F74B IIC2 8 2 I2C status register ICSR 8 H'F74C IIC2 8 2 Slave address register SAR 8 H'F74D IIC2 8 2 Register Abbreviation Receive data register_2 I2C bus transmit data register ICDRT 8 H'F74E IIC2 8 2 I2C bus receive data register ICDRR 8 H'F74F IIC2 8 2 — — — H'F750 to H'F75F — — — Timer mode register B1 TMB1 8 H'F760 Timer B1 8 2 Timer counter B1 TCB1 8 H'F761 Timer B1 8 2 — — — H'F762 to — — — H'FF8F Flash memory control register 1 FLMCR1 8 H'FF90 ROM 8 2 Flash memory control register 2 FLMCR2 8 H'FF91 ROM 8 2 Flash memory power control register FLPWCR 8 H'FF92 ROM 8 2 Erase block register 1 EBR1 8 H'FF93 ROM 8 2 — — — H'FF94 to H'FF9A ROM — — Flash memory enable register FENR 8 H'FF9B ROM 8 2 — — — H'FF9C to ROM — — H'FF9F Timer control register V0 TCRV0 8 H'FFA0 Timer V 8 3 Timer control/status register V TCSRV 8 H'FFA1 Timer V 8 3 Rev.5.00 Nov. 02, 2005 Page 376 of 500 REJ09B0027-0500 Section 22 List of Registers Bit No Module Address Name Data Bus Width Access State TCORA 8 H'FFA2 Timer V 8 3 TCORB 8 H'FFA3 Timer V 8 3 Register Abbreviation Time constant register A Time constant register B Timer counter V TCNTV 8 H'FFA4 Timer V 8 3 Timer control register V1 TCRV1 8 H'FFA5 Timer V 8 3 — — — H'FFA6, — H'FFA7 — — Serial mode register SMR 8 H'FFA8 SCI3 8 3 Bit rate register BRR 8 H'FFA9 SCI3 8 3 Serial control register 3 SCR3 8 H'FFAA SCI3 8 3 Transmit data register TDR 8 H'FFAB SCI3 8 3 Serial status register SSR 8 H'FFAC SCI3 8 3 Receive data register RDR 8 H'FFAD SCI3 8 3 — — — H'FFAE, SCI3 H'FFAF — — A/D data register ADDRA 16 H'FFB0 A/D converter 8 3 A/D data register ADDRB 16 H'FFB2 A/D converter 8 3 A/D data register ADDRC 16 H'FFB4 A/D converter 8 3 A/D data register ADDRD 16 H'FFB6 A/D converter 8 3 A/D control/status register ADCSR 8 H'FFB8 A/D converter 8 3 A/D control register ADCR 8 H'FFB9 A/D converter 8 3 — — — H'FFBA, — H'FFBB — — PWM data register L PWDRL 8 H'FFBC 14-bit PWM 8 2 PWM data register U PWDRU 8 H'FFBD 14-bit PWM 8 2 PWM control register PWCR 8 H'FFBE 14-bit PWM 8 2 — — — H'FFBF 14-bit PWM — — Rev.5.00 Nov. 02, 2005 Page 377 of 500 REJ09B0027-0500 Section 22 List of Registers Register Abbreviation Bit No Module Address Name Data Bus Width Access State Timer control/status register WD TCSRW D 8 H'FFC0 WDT*2 8 2 Timer counter WD TCWD 8 H'FFC1 WDT*2 8 2 H'FFC2 2 8 2 2 Timer mode register WD TMWD 8 WDT* — — — H'FFC3 WDT* — — — — — H'FFC4 to H'FFC7 — — — Address break control register ABRKCR 8 H'FFC8 Address break 8 2 Address break status register ABRKSR 8 H'FFC9 Address break 8 2 Break address register H BARH 8 H'FFCA Address break 8 2 Break address register L BARL 8 H'FFCB Address break 8 2 Break data register H BDRH 8 H'FFCC Address break 8 2 Break data register L BDRL 8 H'FFCD Address break 8 2 Port pull-up control register 1 PUCR1 8 H'FFD0 I/O port 8 2 Port pull-up control register 5 PUCR5 8 H'FFD1 I/O port 8 2 — — — H'FFD2, I/O port H'FFD3 — — Port data register 1 PDR1 8 H'FFD4 I/O port 8 2 Port data register 2 PDR2 8 H'FFD5 I/O port 8 2 Port data register 3 PDR3 8 H'FFD6 I/O port 8 2 — — — H'FFD7 I/O port — — Port data register 5 PDR5 8 H'FFD8 I/O port 8 2 Port data register 6 PDR6 8 H'FFD9 I/O port 8 2 Port data register 7 PDR7 8 H'FFDA I/O port 8 2 Port data register 8 PDR8 8 H'FFDB I/O port 8 2 — — — H'FFDC I/O port — — Rev.5.00 Nov. 02, 2005 Page 378 of 500 REJ09B0027-0500 Section 22 List of Registers Bit No Module Address Name Data Bus Width Access State PDRB 8 H'FFDD 8 2 — — — H'FFDE, I/O port H'FFDF — — Port mode register 1 PMR1 8 H'FFE0 I/O port 8 2 Port mode register 5 PMR5 8 H'FFE1 I/O port 8 2 Port mode register 3 PMR3 8 H'FFE2 I/O port 8 2 — — — H'FFD3 I/O port — — Port control register 1 PCR1 8 H'FFE4 I/O port 8 2 Port control register 2 PCR2 8 H'FFE5 I/O port 8 2 Port control register 3 PCR3 8 H'FFE6 I/O port 8 2 — — — H'FFE7 I/O port — — Port control register 5 PCR5 8 H'FFE8 I/O port 8 2 Port control register 6 PCR6 8 H'FFE9 I/O port 8 2 Port control register 7 PCR7 8 H'FFEA I/O port 8 2 Port control register 8 PCR8 8 H'FFEB I/O port 8 2 — — — H'FFEC to H'FFEF I/O port — — System control register 1 SYSCR1 8 H'FFF0 Low power 8 2 System control register 2 SYSCR2 8 H'FFF1 Low power 8 2 Interrupt edge select register 1 IEGR1 8 H'FFF2 Interrupt 8 2 Interrupt edge select register 2 IEGR2 8 H'FFF3 Interrupt 8 2 Interrupt enable register 1 IENR1 8 H'FFF4 Interrupt 8 2 Register Abbreviation Port data register B I/O port Interrupt enable register 2 IENR2 8 H'FFF5 Interrupt 8 2 Interrupt flag register 1 IRR1 8 H'FFF6 Interrupt 8 2 Interrupt flag register 2 IRR2 8 H'FFF7 Interrupt 8 2 Wakeup interrupt flag register IWPR 8 H'FFF8 Interrupt 8 2 Module standby control register 1 MSTCR1 8 H'FFF9 Low power 8 2 Module standby control register 2 MSTCR2 8 H'FFFA Low power 8 2 — — H'FFEB Low power — — — Rev.5.00 Nov. 02, 2005 Page 379 of 500 REJ09B0027-0500 Section 22 List of Registers Register Abbreviation Bit No — — — Module Address Name H'FFFC to H'FFFF — Data Bus Width Access State — — • EEPROM Data Bus Width Register Name Abbreviation Bit No Address Module Name EEPROM slave address register — 8 H'FF09 EEPROM — — EEPROM key register EKR 8 H'FF10 EEPROM 8 2 Notes: 1. LVDC: Low-voltage detection circuits (optional) 2. WDT: Watchdog timer Rev.5.00 Nov. 02, 2005 Page 380 of 500 REJ09B0027-0500 Access State Section 22 List of Registers 22.2 Register Bits The addresses and bit names of the registers in the on-chip peripheral modules are listed below. The 16-bit register is indicated in two rows, 8 bits for each row. Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name — — — — — — — — — — TCR_0 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 Timer Z TIORA_0 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 TIORC_0 — IOD2 IOD1 IOD0 — IOC2 IOC1 IOC0 TSR_0 — — — OVF IMFD IMFC IMFB IMFA TIER_0 — — — OVIE IMIED IMIEC IMIEB IMIEA POCR_0 — — — — — POLD POLC POLB TCNT_0 TCNT0H7 TCNT0H6 TCNT0H5 TCNT0H4 TCNT0H3 TCNT0H2 TCNT0H1 TCNT0H0 TCNT0L7 TCNT0L6 TCNT0L5 TCNT0L4 TCNT0L3 TCNT0L2 TCNT0L1 TCNT0L0 GRA_0 GRA0H7 GRA0H6 GRA0H5 GRA0H4 GRA0H3 GRA0H2 GRA0H1 GRA0H0 GRA0L7 GRA0L6 GRA0L5 GRA0L4 GRA0L3 GRA0L2 GRA0L1 GRA0L0 GRB_0 GRB0H7 GRB0H6 GRB0H5 GRB0H4 GRB0H3 GRB0H2 GRB0H1 GRB0H0 GRB0L7 GRB0L6 GRB0L5 GRB0L4 GRB0L3 GRB0L2 GRB0L1 GRB0L0 GRC0H7 GRC0H6 GRC0H5 GRC0H4 GRC0H3 GRC0H2 GRC0H1 GRC0H0 GRC0L7 GRC0L6 GRC0L5 GRC0L4 GRC0L3 GRC0L2 GRC0L1 GRC0L0 GRD0H7 GRD0H6 GRD0H5 GRD0H4 GRD0H3 GRD0H2 GRD0H1 GRD0H0 GRD0L7 GRD0L6 GRD0L5 GRD0L4 GRD0L3 GRD0L2 GRD0L1 GRD0L0 TCR_1 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TIORA_1 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 TIORC_1 — IOD2 IOD1 IOD0 — IOC2 IOC1 IOC0 TSR_1 — — UDF OVF IMFD IMFC IMFB IMFA TIER_1 — — — OVIE IMIED IMIEC IMIEB IMIEA POCR_1 — — — — — POLD POLC POLB TCNT_1 TCNT1H7 TCNT1H6 TCNT1H5 TCNT1H4 TCNT1H3 TCNT1H2 TCNT1H1 TCNT1H0 GRC_0 GRD_0 GRA_1 TCNT1L7 TCNT1L6 TCNT1L5 TCNT1L4 TCNT1L3 TCNT1L2 TCNT1L1 TCNT1L0 GRA1H7 GRA1H6 GRA1H5 GRA1H4 GRA1H3 GRA1H2 GRA1H1 GRA1H0 GRA1L7 GRA1L6 GRA1L5 GRA1L4 GRA1L3 GRA1L2 GRA1L1 GRA1L0 Rev.5.00 Nov. 02, 2005 Page 381 of 500 REJ09B0027-0500 Section 22 List of Registers Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name GRB_1 GRB1H7 GRB1H6 GRB1H5 GRB1H4 GRB1H3 GRB1H2 GRB1H1 GRB1H0 Timer Z GRB1L7 GRB1L6 GRB1L5 GRB1L4 GRB1L3 GRB1L2 GRB1L1 GRB1L0 GRC1H7 GRC1H6 GRC1H5 GRC1H4 GRC1H3 GRC1H2 GRC1H1 GRC1H0 GRC1L7 GRC1L6 GRC1L5 GRC1L4 GRC1L3 GRC1L2 GRC1L1 GRC1L0 GRD1H7 GRD1H6 GRD1H5 GRD1H4 GRD1H3 GRD1H2 GRD1H1 GRD1H0 GRD1L7 GRD1L6 GRD1L5 GRD1L4 GRD1L3 GRD1L2 GRD1L1 GRD1L0 TSTR — — — — — — STR1 STR0 TMDR BFD1 BFC1 BFD0 BFC0 — — — SYNC TPMR — PWMD1 PWMC1 PWMB1 — PWMD0 PWMC0 PWMB0 TFCR — STCLK ADEG ADTRG OLS1 OLS0 CMD1 CMD0 TOER ED1 EC1 EB1 EA1 ED0 EC0 EB0 EA0 TOCR TOD1 TOC1 TOB1 TOA1 TOD0 TOC0 TOB0 TOA0 RSECDR BSY SC12 SC11 SC10 SC03 SC02 SC01 SC00 RMINDR BSY MN12 MN11 MN10 MN03 MN02 MN01 MN00 RHRDR BSY — HR11 HR10 HR03 HR02 HR01 HR00 RWKDR BSY — — — — WK2 WK1 WK0 RTCCR1 RUN 12/24 PM RST — — — — RTCCR2 — — FOIE WKIE DYIE HRIE MNIE SEIE RTCCSR — RCS6 RCS5 — RCS3 RCS2 RCS1 RCS0 LVDCR LVDE — — — LVDSEL LVDRE LVDDE LVDUE LVDC LVDSR — — — — — — LVDDF LVDUF (optional)* — — — — — — — — — — SMR_2 COM CHR PE PM STOP MP CKS1 CKS0 SCI3_2 BRR_2 BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0 SCR3_2 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDR_2 TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR_2 TDRE RDRF OER FER PER TEND MPBR MPBT RDR_2 RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 ICCR1 ICE RCVD MST TRS CKS3 CKS2 CKS1 CKS0 ICCR2 BBSY SCP SDAO SDAOP SCLO — IICRST — ICMR MLS WAIT — — BCWP BC2 BC1 BC0 GRC_1 GRD_1 Rev.5.00 Nov. 02, 2005 Page 382 of 500 REJ09B0027-0500 RTC 1 IIC2 Section 22 List of Registers Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name ICIER TIE TEIE RIE NAKIE STIE ACKE ACKBR ACKBT IIC2 ICSR TDRE TEND RDRF NACKF STOP AL/OVE AAS ADZ SAR SVA6 SVA5 SVA4 SVA3 SVA2 SVA1 SVA0 FS ICDRT ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0 ICDRR ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0 — — — — — — — — — — TMB1 TMB17 — — — — TMB12 TMB11 TMB10 Timer B1 TCB1 TCB17 TCB16 TCB15 TCB14 TCB13 TCB12 TCB11 TCB10 — — — — — — — — — — FLMCR1 — SWE ESU PSU EV PV E P ROM FLMCR2 FLER — — — — — — — FLPWCR PDWND — — — — — — — EBR1 — EB6 EB5 EB4 EB3 EB2 EB1 EB0 FENR FLSHE — — — — — — — TCRV0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 TCSRV CMFB CMFA OVF — OS3 OS2 OS1 OS0 TCORA TCORA7 TCORA6 TCORA5 TCORA4 TCORA3 TCORA2 TCORA1 TCORA0 TCORB TCORB7 TCORB6 TCORB5 TCORB4 TCORB3 TCORB2 TCORB1 TCORB0 TCNTV TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0 TCRV1 — — — TVEG1 TVEG0 TRGE — ICKS0 — — — — — — — — — — SMR COM CHR PE PM STOP MP CKS1 CKS0 SCI3 BRR BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0 SCR3 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDR TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR TDRE RDRF OER FER PER TEND MPBR MPBT RDR RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 ADDRA AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 A/D AD1 AD0 — — — — — — converter Timer V Rev.5.00 Nov. 02, 2005 Page 383 of 500 REJ09B0027-0500 Section 22 List of Registers Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name ADDRB AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 A/D AD1 AD0 — — — — — — converter AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 — — — — — — ADDRC ADDRD AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 — — — — — — ADCSR ADF ADIE ADST SCAN CKS CH2 CH1 CH0 ADCR TRGE — — — — — — — — — — — — — — — — — PWDRL PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0 14-bit PWM PWDRU — — PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0 PWCR — — — — — — — PWCR0 TCSRWD B6WI TCWE B4WI TCSRWE B2WI WDON B0WI WRST TCWD TCWD7 TCWD6 TCWD5 TCWD4 TCWD3 TCWD2 TCWD1 TCWD0 TMWD — — — — CKS3 CKS2 CKS1 CKS0 — — — — — — — — — ABRKCR RTINTE CSEL1 CSEL0 ACMP2 ACMP1 ACMP0 DCMP1 DCMP0 Address ABRKSR ABIF ABIE — — — — — — break BARH BARH7 BARH6 BARH5 BARH4 BARH3 BARH2 BARH1 BARH0 BARL BARL7 BARL6 BARL5 BARL4 BARL3 BARL2 BARL1 BARL0 WDT*2 — BDRH BDRH7 BDRH6 BDRH5 BDRH4 BDRH3 BDRH2 BDRH1 BDRH0 BDRL BDRL7 BDRL6 BDRL5 BDRL4 BDRL3 BDRL2 BDRL1 BDRL0 — — — — — — — — — — PUCR1 PUCR17 PUCR16 PUCR15 PUCR14 — PUCR12 PUCR11 PUCR10 I/O port PUCR5 — — PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50 PDR1 P17 P16 P15 P14 — P12 P11 P10 PDR2 — — — P24 P23 P22 P21 P20 PDR3 P37 P35 P34 P33 P32 P31 P30 P36 3 3 PDR5 P57* P56* P55 P54 P53 P52 P51 P50 PDR6 P67 P66 P65 P64 P63 P62 P61 P60 PDR7 — P76 P75 P74 — P72 P71 P70 Rev.5.00 Nov. 02, 2005 Page 384 of 500 REJ09B0027-0500 Section 22 List of Registers Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name PDR8 P87 P86 P85 — — — — — I/O port PDRB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 PMR1 IRQ3 IRQ2 IRQ1 IRQ0 TXD2 PWM TXD TMOW PMR5 POF57 POF56 WKP5 WKP4 WKP3 WKP2 WKP1 WKP0 PMR3 — — — POF24 POF23 — — — PCR1 PCR17 PCR16 PCR15 PCR14 — PCR12 PCR11 PCR10 PCR2 — — — PCR24 PCR23 PCR22 PCR21 PCR20 PCR3 PCR37 PCR35 PCR34 PCR33 PCR32 PCR31 PCR30 PCR36 3 3 PCR5 PCR57* PCR56* PCR55 PCR54 PCR53 PCR52 PCR51 PCR50 PCR6 PCR67 PCR66 PCR65 PCR64 PCR63 PCR62 PCR61 PCR60 PCR7 — PCR76 PCR75 PCR74 — PCR72 PCR71 PCR70 PCR8 PCR87 PCR86 PCR85 — — — — — SYSCR1 SSBY STS2 STS1 STS0 NESEL — — — SYSCR2 SMSEL LSON DTON MA2 MA1 MA0 SA1 SA0 IEGR1 NMIEG — — — IEG3 IEG2 IEG1 IEG0 IEGR2 — — WPEG5 WPEG4 WPEG3 WPEG2 WPEG1 WPEG0 IENR1 IENDT IENTA IENWP — IEN3 IEN2 IEN1 IEN0 IENR2 — — IENTB1 — — — — — IRR1 IRRDT IRRTA — — IRRI3 IRRI2 IRRI1 IRRI0 IRR2 — — IRRTB1 — — — — — IWPR — — IWPF5 IWPF4 IWPF3 IWPF2 IWPF1 IWPF0 Interrupt MSTCR1 — MSTIIC MSTS3 MSTAD MSTWD — MSTTV MSTTA Low power MSTCR2 MSTS3_2 — — MSTTB1 — — MSTTZ MSTPWM — — — — — — — — — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Low power Interrupt — • EEPROM Register Name Bit 7 EKR Module Name EEPROM Notes: 1. LVDC: Low-voltage detection circuits (optional) 2. WDT: Watchdog timer TM 3. These bits are reserved in the EEPROM stacked F-ZTAT and mask-ROM versions. Rev.5.00 Nov. 02, 2005 Page 385 of 500 REJ09B0027-0500 Section 22 List of Registers 22.3 Registers States in Each Operating Mode Register Name Reset Active Sleep Subactive Subsleep Standby Module TCR_0 Initialized — — — — — Timer Z TIORA_0 Initialized — — — — — TIORC_0 Initialized — — — — — TSR_0 Initialized — — — — — TIER_0 Initialized — — — — — POCR_0 Initialized — — — — — TCNT_0 Initialized — — — — — GRA_0 Initialized — — — — — GRB_0 Initialized — — — — — GRC_0 Initialized — — — — — GRD_0 Initialized — — — — — TCR_1 Initialized — — — — — TIORA_1 Initialized — — — — — TIORC_1 Initialized — — — — — TSR_1 Initialized — — — — — TIER_1 Initialized — — — — — POCR_1 Initialized — — — — — TCNT_1 Initialized — — — — — GRA_1 Initialized — — — — — GRB_1 Initialized — — — — — GRC_1 Initialized — — — — — GRD_1 Initialized — — — — — TSTR Initialized — — — — — TMDR Initialized — — — — — TPMR Initialized — — — — — TFCR Initialized — — — — — TOER Initialized — — — — — TOCR Initialized — — — — — RSECDR — — — — — — Rev.5.00 Nov. 02, 2005 Page 386 of 500 REJ09B0027-0500 RTC Section 22 List of Registers Register Name Reset Active Sleep Subactive Subsleep Standby Module RMINDR — — — — — — RTC RHRDR — — — — — — RWKDR — — — — — — RTCCR1 — — — — — — RTCCR2 — — — — — — RTCCSR Initialized — — — — — LVDCR Initialized — — — — — LVDC LVDSR Initialized — — — — — (optional)*1 SMR_2 Initialized — — Initialized Initialized Initialized SCI3_2 BRR_2 Initialized — — Initialized Initialized Initialized SCR3_2 Initialized — — Initialized Initialized Initialized TDR_2 Initialized — — Initialized Initialized Initialized SSR_2 Initialized — — Initialized Initialized Initialized RDR_2 Initialized — — Initialized Initialized Initialized ICCR1 Initialized — — — — — ICCR2 Initialized — — — — — ICMR Initialized — — — — — ICIER Initialized — — — — — ICSR Initialized — — — — — SAR Initialized — — — — — ICDRT Initialized — — — — — ICDRR Initialized — — — — — TMB1 Initialized — — — — — TCB1 Initialized — — — — — FLMCR1 Initialized — — Initialized Initialized Initialized FLMCR2 Initialized — — — — — FLPWCR Initialized — — — — — EBR1 Initialized — — Initialized Initialized Initialized FENR Initialized — — — — — TCRV0 Initialized — — Initialized Initialized Initialized TCSRV Initialized — — Initialized Initialized Initialized IIC2 Timer B1 ROM Timer V Rev.5.00 Nov. 02, 2005 Page 387 of 500 REJ09B0027-0500 Section 22 List of Registers Register Name Reset Active Sleep Subactive Subsleep Standby Module TCORA Initialized — — Initialized Initialized Initialized Timer V TCORB Initialized — — Initialized Initialized Initialized TCNTV Initialized — — Initialized Initialized Initialized TCRV1 Initialized — — Initialized Initialized Initialized SMR Initialized — — Initialized Initialized Initialized BRR Initialized — — Initialized Initialized Initialized SCR3 Initialized — — Initialized Initialized Initialized TDR Initialized — — Initialized Initialized Initialized SSR Initialized — — Initialized Initialized Initialized RDR Initialized — — Initialized Initialized Initialized ADDRA Initialized — — Initialized Initialized Initialized ADDRB Initialized — — Initialized Initialized Initialized ADDRC Initialized — — Initialized Initialized Initialized ADDRD Initialized — — Initialized Initialized Initialized ADCSR Initialized — — Initialized Initialized Initialized ADCR Initialized — — Initialized Initialized Initialized PWDRL Initialized — — — — — PWDRU Initialized — — — — — PWCR Initialized — — — — — TCSRWD Initialized — — — — — TCWD Initialized — — — — — TMWD Initialized — — — — — ABRKCR Initialized — — — — — ABRKSR Initialized — — — — — BARH Initialized — — — — — BARL Initialized — — — — — BDRH Initialized — — — — — BDRL Initialized — — — — — PUCR1 Initialized — — — — — PUCR5 Initialized — — — — — PDR1 Initialized — — — — — Rev.5.00 Nov. 02, 2005 Page 388 of 500 REJ09B0027-0500 SCI3 A/D converter 14bit PWM WDT*2 Address break I/O port Section 22 List of Registers Register Name Reset Active Sleep Subactive Subsleep Standby Module PDR2 Initialized — — — — — I/O port PDR3 Initialized — — — — — PDR5 Initialized — — — — — PDR6 Initialized — — — — — PDR7 Initialized — — — — — PDR8 Initialized — — — — — PDRB Initialized — — — — — PMR1 Initialized — — — — — PMR5 Initialized — — — — — PMR3 Initialized — — — — — PCR1 Initialized — — — — — PCR2 Initialized — — — — — PCR3 Initialized — — — — — PCR5 Initialized — — — — — PCR6 Initialized — — — — — PCR7 Initialized — — — — — PCR8 Initialized — — — — — SYSCR1 Initialized — — — — — SYSCR2 Initialized — — — — — IEGR1 Initialized — — — — — IEGR2 Initialized — — — — — IENR1 Initialized — — — — — IENR2 Initialized — — — — — IRR1 Initialized — — — — — IRR2 Initialized — — — — — IWPR Initialized — — — — — MSTCR1 Initialized — — — — — MSTCR2 Initialized — — — — — Low power Interrupt Low power Rev.5.00 Nov. 02, 2005 Page 389 of 500 REJ09B0027-0500 Section 22 List of Registers • EEPROM Register Name Reset EKR — Active Sleep Subactive Subsleep Standby Module — — — EEPROM Notes: is not initialized 1. LVDC: Low-voltage detection circuits (optional) 2. WDT: Watchdog timer Rev.5.00 Nov. 02, 2005 Page 390 of 500 REJ09B0027-0500 — — Section 23 Electrical Characteristics Section 23 Electrical Characteristics 23.1 Absolute Maximum Ratings Table 23.1 Absolute Maximum Ratings Item Symbol Value Unit Note Power supply voltage VCC –0.3 to +7.0 V * Analog power supply voltage AVCC –0.3 to +7.0 V Input voltage VIN –0.3 to VCC +0.3 V Port B –0.3 to AVCC +0.3 V X1 –0.3 to 4.3 V Ports other than ports B and X1 Operating temperature Topr –20 to +75 °C Storage temperature Tstg –55 to +125 °C Note: * Permanent damage may result if maximum ratings are exceeded. Normal operation should be under the conditions specified in Electrical Characteristics. Exceeding these values can result in incorrect operation and reduced reliability. 23.2 Electrical Characteristics (F-ZTAT™ Version, EEPROM Stacked F-ZTATTM Version) 23.2.1 Power Supply Voltage and Operating Ranges Power Supply Voltage and Oscillation Frequency Range φOSC (MHz) φW (kHz) 20.0 32.768 10.0 2.0 3.0 4.0 • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode 5.5 VCC (V) 3.0 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • All operating modes Rev.5.00 Nov. 02, 2005 Page 391 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Power Supply Voltage and Operating Frequency Range φ (MHz) φSUB (kHz) 20.0 16.384 10.0 8.192 4.096 1.0 3.0 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode (When MA2 in SYSCR2 = 0 ) φ (kHz) 2500 1250 78.125 3.0 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode (When MA2 in SYSCR2 = 1 ) Rev.5.00 Nov. 02, 2005 Page 392 of 500 REJ09B0027-0500 3.0 4.0 • AVCC = 3.3 to 5.5 V • Subactive mode • Subsleep mode 5.5 VCC (V) Section 23 Electrical Characteristics Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range φ (MHz) 20.0 10.0 2.0 3.3 4.0 AVCC (V) 5.5 • VCC = 3.0 to 5.5 V • Active mode • Sleep mode Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection Circuit is Used φosc (MHz) 20.0 16.0 2.0 Vcc(V) 3.0 4.5 5.5 Operation guarantee range Operation guarantee range except A/D conversion accuracy Rev.5.00 Nov. 02, 2005 Page 393 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.2 DC Characteristics Table 23.2 DC Characteristics (1) VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Input high VIH voltage Applicable Pins Test Condition Min Typ Max Unit RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG, TMIB1, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1,SCK3, SCK3_2, TRGV VCC = 4.0 to 5.5 V VCC × 0.8 — VCC + 0.3 V VCC × 0.9 — VCC + 0.3 RXD, RXD_2, SCL, SDA, P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P60 to P67, P70 to P72 P74 to P76, P85 to P87 VCC = 4.0 to 5.5 V VCC × 0.7 — VCC + 0.3 VCC × 0.8 — VCC + 0.3 PB0 to PB7 VCC = 4.0 to 5.5 V VCC × 0.7 — AVCC + 0.3 V VCC × 0.8 — AVCC + 0.3 VCC – 0.5 — VCC + 0.3 VCC – 0.3 — VCC + 0.3 –0.3 — VCC × 0.2 –0.3 — VCC × 0.1 OSC1 Input low voltage VIL RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG, TMIB1, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1, SCK3, SCK3_2, TRGV Note: Connect the TEST pin to Vss. Rev.5.00 Nov. 02, 2005 Page 394 of 500 REJ09B0027-0500 VCC = 4.0 to 5.5 V VCC = 4.0 to 5.5 V V V V Notes Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Input low voltage VIL RXD, RXD_2, SCL, SDA, P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P60 to P67, P70 to P72, P74 to P76, P85 to P87, PB0 to PB7 VCC = 4.0 to 5.5 V –0.3 — VCC × 0.3 V –0.3 — VCC × 0.2 V OSC1 VCC = 4.0 to 5.5 V V Output high voltage Output low voltage VOH VOL –0.3 — 0.5 –0.3 — 0.3 VCC – 1.0 — — P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P55, P60 to P67, P70 to P72, P74 to P76, P85 to P87, VCC = 4.0 to 5.5 V –IOH = 0.1 mA VCC – 0.5 — — P56, P57 VCC = 4.0 to 5.5 V –IOH = 0.1 mA VCC – 2.5 — — VCC = 3.0 to 4.0 V –IOH = 0.1 mA VCC – 2.0 — — VCC = 4.0 to 5.5 V IOL = 1.6 mA — — 0.6 IOL = 0.4 mA — — 0.4 VCC = 4.0 to 5.5 V IOL = 20.0 mA — — 1.5 VCC = 4.0 to 5.5 V IOL = 10.0 mA — — 1.0 VCC = 4.0 to 5.5 V IOL = 1.6 mA — — 0.4 IOL = 0.4 mA — — 0.4 P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P70 to P72, P74 to P76, P85 to P87 P60 to P67 Notes V –IOH = 1.5 mA V V V Rev.5.00 Nov. 02, 2005 Page 395 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Output low voltage VOL SCL, SDA Input/ output leakage current | IIL | Typ Max Unit Notes VCC = 4.0 to 5.5 V — IOL = 6.0 mA — 0.6 V IOL = 3.0 mA — — 0.4 OSC1, TMIB1, RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG, TRGV, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1 RXD, SCK3, RXD_2, SCK3_2, SCL, SDA VIN = 0.5 V to (VCC – 0.5 V) — — 1.0 µA P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P60 to P67, P70 to P72, P74 to P76, P85 to P87, VIN = 0.5 V to (VCC – 0.5 V) — — 1.0 µA PB0 to PB7 VIN = 0.5 V to (AVCC – 0.5 V) — — 1.0 µA P10 to P12, P14 to P17, P50 to P55 VCC = 5.0 V, VIN = 0.0 V 50.0 — 300.0 µA VCC = 3.0 V, VIN = 0.0 V — 60.0 — All input pins except power supply pins f = 1 MHz, VIN = 0.0 V, Ta = 25°C — — 15.0 pF IOPE1 Active mode current consumption VCC Active mode 1 VCC = 5.0 V, fOSC = 20 MHz — 21.0 30.0 mA Active mode 1 VCC = 3.0 V, fOSC = 10 MHz — 9.0 — IOPE2 VCC Active mode 2 VCC = 5.0 V, fOSC = 20 MHz — 1.8 3.0 Active mode 2 VCC = 3.0 V, fOSC = 10 MHz — 1.2 — Pull-up MOS current –Ip Input capacitance Cin Rev.5.00 Nov. 02, 2005 Page 396 of 500 REJ09B0027-0500 Min Reference value * * Reference value mA * * Reference value Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Notes ISLEEP1 Sleep mode current consumption VCC Sleep mode 1 VCC = 5.0 V, fOSC = 20 MHz — 17.5 22.5 mA * Sleep mode 1 VCC = 3.0 V, fOSC = 10 MHz — 7.5 — ISLEEP2 VCC Sleep mode 2 VCC = 5.0 V, fOSC = 20 MHz — 1.7 2.7 Sleep mode 2 VCC = 3.0 V, fOSC = 10 MHz — 1.1 — VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/2) — 35.0 70.0 VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/8) — 25.0 — * Reference value mA * * Reference value µA Subactive ISUB mode current consumption VCC Subsleep ISUBSP mode current consumption VCC VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/2) — 25.0 50.0 µA * ISTBY Standby mode current consumption VCC 32-kHz crystal resonator not used — — 5.0 µA * RAM data VRAM retaining voltage VCC 2.0 — — V Note: * * * Reference value Pin states during current consumption measurement are given below (excluding current in the pull-up MOS transistors and output buffers). Rev.5.00 Nov. 02, 2005 Page 397 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Mode RES Pin Internal State Other Pins Oscillator Pins Active mode 1 VCC Operates VCC Active mode 2 Main clock: ceramic or crystal resonator Operates (φOSC/64) Sleep mode 1 VCC Sleep mode 2 Subclock: Pin X1 = VSS Only timers operate VCC Only timers operate (φOSC/64) Subactive mode VCC Operates VCC Main clock: ceramic or crystal resonator Subsleep mode VCC Only timers operate VCC Subclock: crystal resonator Standby mode VCC CPU and timers both stop VCC Main clock: ceramic or crystal resonator Subclock: Pin X1 = VSS Table 23.2 DC Characteristics (2) VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated. Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Notes EEPROM current consumption IEEW VCC VCC = 5.0 V, tSCL = 2.5 µs (when writing) — — 2.0 mA * IEER VCC VCC = 5.0 V, tSCL = 2.5 µs (when reading) — — 0.3 mA IEESTBY VCC VCC = 5.0 V, tSCL = 2.5 µs (at standby) — — 3.0 µA Note: * The current consumption of the EEPROM chip is shown. For the current consumption of H8/3687N, add the above current values to the current consumption of H8/3687F. Rev.5.00 Nov. 02, 2005 Page 398 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.2 DC Characteristics (3) VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Allowable output low current (per pin) IOL Output pins except port 6, SCL, and SDA VCC = 4.0 to 5.5 V — — 2.0 mA Port 6 — — 20.0 Output pins except port 6, SCL, and SDA — — 0.5 Port 6 — — 10.0 SCL, SDA — — 6.0 — — 40.0 Port 6, SCL, and SDA — — 80.0 Output pins except port 6, SCL, and SDA — — 20.0 Port 6, SCL, and SDA — — 40.0 — — 2.0 — — 0.2 — — 30.0 — — 8.0 Allowable output low current (total) ∑IOL Output pins except port 6, SCL, and SDA VCC = 4.0 to 5.5 V Allowable output high –IOH current (per pin) All output pins VCC = 4.0 to 5.5 V Allowable output high –∑IOH current (total) All output pins VCC = 4.0 to 5.5 V mA mA mA Rev.5.00 Nov. 02, 2005 Page 399 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.3 AC Characteristics Table 23.3 AC Characteristics VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Applicable Pins Item Symbol System clock oscillation frequency fOSC System clock (φ) cycle time tcyc Subclock oscillation frequency fW X1, X2 Watch clock (φW) cycle time tW X1, X2 Subclock (φSUB) cycle time tsubcyc OSC1, OSC2 Values Test Condition Min Typ Max Unit Reference Figure VCC = 4.0 to 5.5 V 2.0 — 20.0 MHz * 2.0 — 10.0 1 — 64 tOSC * — — 12.8 — 32.768 — kHz — 30.5 — µs 2 — 8 tW 2 — — tcyc tsubcyc Instruction cycle time OSC1, OSC2 — — 10.0 ms trc Oscillation stabilization time (ceramic resonator) OSC1, OSC2 — — 5.0 ms Oscillation stabilization time trcx X1, X2 — — 2.0 s External clock high width tCPH OSC1 20.0 — — ns 40.0 — — External clock low width tCPL 20.0 — — 40.0 — — External clock rise time tCPr OSC1 VCC = 4.0 to 5.5 V — — 10.0 — — 15.0 External clock fall time tCPf OSC1 VCC = 4.0 to 5.5 V — — 10.0 — — 15.0 OSC1 Rev.5.00 Nov. 02, 2005 Page 400 of 500 REJ09B0027-0500 VCC = 4.0 to 5.5 V VCC = 4.0 to 5.5 V 2 µs trc Oscillation stabilization time (crystal resonator) 1 ns ns ns 2 * Figure 23.1 Section 23 Electrical Characteristics Item Symbol Applicable Pins RES pin low width tREL RES Values Typ Max Unit Reference Figure At power-on and in trc modes other than those below — — ms Figure 23.2 In active mode and 200 sleep mode operation — — ns Test Condition Min Input pin high width tIH NMI, TMIB1, IRQ0 to IRQ3, WKP0 to WKP5, TMCIV, TMRIV, TRGV, ADTRG, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1 2 — — tcyc tsubcyc Input pin low width tIL NMI, TMIB1, IRQ0 to IRQ3, WKP0 to WKP5, TMCIV, TMRIV, TRGV, ADTRG, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1 2 — — tcyc tsubcyc Figure 23.3 Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is 1.0 MHz. 2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2). Rev.5.00 Nov. 02, 2005 Page 401 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.4 I2C Bus Interface Timing VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Max Unit Reference Figure 12tcyc + 600 — — ns Figure 23.4 tSCLH 3tcyc + 300 — — ns tSCLL 5tcyc + 300 — — ns SCL and SDA input fall time tSf — — 300 ns SCL and SDA input spike pulse removal time tSP — — 1tcyc ns SDA input bus-free time tBUF 5tcyc — — ns Start condition input hold time tSTAH 3tcyc — — ns Retransmission start condition input setup time tSTAS 3tcyc — — ns Setup time for stop condition input tSTOS 3tcyc — — ns Item Symbol SCL input cycle time tSCL SCL input high width SCL input low width Test Condition Min Typ Data-input setup time tSDAS 1tcyc+20 — — ns Data-input hold time tSDAH 0 — — ns Capacitive load of SCL and SDA cb 0 — 400 pF SCL and SDA output fall time tSf VCC = 4.0 to — 5.5 V — 250 ns — — 300 Rev.5.00 Nov. 02, 2005 Page 402 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.5 Serial Communication Interface (SCI) Timing VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Input clock cycle Asynchronous Symbol Applicable Pins tScyc SCK3 Values Test Condition Clocked synchronous Input clock pulse width tSCKW SCK3 Transmit data delay time (clocked synchronous) tTXD TXD Receive data setup time (clocked synchronous) tRXS Receive data hold time (clocked synchronous) tRXH RXD RXD VCC = 4.0 to 5.5 V VCC = 4.0 to 5.5 V VCC = 4.0 to 5.5 V Min Typ Max Unit Reference Figure 4 — — Figure 23.5 6 — — 0.4 — 0.6 tScyc — — 1 tcyc — — 1 50.0 — — 100.0 — — 50.0 — — 100.0 — — tcyc Figure 23.6 ns ns Rev.5.00 Nov. 02, 2005 Page 403 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.4 A/D Converter Characteristics Table 23.6 A/D Converter Characteristics VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Symbol Applicable Pins Test Condition Values Min Typ Max Unit Reference Figure V * Analog power supply AVCC voltage AVCC 3.3 VCC 5.5 Analog input voltage AVIN AN0 to AN7 VSS – 0.3 — AVCC + 0.3 V Analog power supply AIOPE current AVCC — 2.0 mA AVCC = 5.0 V — 1 fOSC = 20 MHz 2 AISTOP1 AVCC — 50 — µA * Reference value AISTOP2 AVCC — — 5.0 µA * Analog input capacitance CAIN AN0 to AN7 — — 30.0 pF Allowable signal source impedance RAIN AN0 to AN7 — — 5.0 kΩ 10 10 10 bit — — tcyc Resolution (data length) Conversion time (single mode) AVCC = 3.3 to 134 5.5 V Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±8.0 LSB AVCC = 4.0 to 70 5.5 V — — tcyc Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±8.0 LSB Conversion time (single mode) Rev.5.00 Nov. 02, 2005 Page 404 of 500 REJ09B0027-0500 3 Section 23 Electrical Characteristics Item Symbol Applicable Pins Conversion time (single mode) Test Condition Values Min AVCC = 4.0 to 134 5.5 V Typ Max Unit — — tcyc Nonlinearity error — — ±3.5 LSB Offset error — — ±3.5 LSB Full-scale error — — ±3.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Referenc e Figure Notes: 1. Set AVCC = VCC when the A/D converter is not used. 2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the A/D converter is idle. 23.2.5 Watchdog Timer Characteristics Table 23.7 Watchdog Timer Characteristics VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Symbol On-chip oscillator overflow time tOVF Note: * Applicable Pins Test Condition Values Min Typ Max Unit Reference Figure 0.2 0.4 — s * Shows the time to count from 0 to 255, at which point an internal reset is generated, when the internal oscillator is selected. Rev.5.00 Nov. 02, 2005 Page 405 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.6 Flash Memory Characteristics Table 23.8 Flash Memory Characteristics VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol 1 2 4 Programming time (per 128 bytes)* * * Test Condition Min Typ Max Unit tP — 7 200 ms Erase time (per block) * * * tE — 100 1200 ms Reprogramming count NWEC 1000 10000 — Times Programming Wait time after SWE 1 bit setting* x 1 — — µs Wait time after PSU 1 bit setting* y 50 — — µs Wait time after P bit setting z1 1≤n≤6 28 30 32 µs z2 7 ≤ n ≤ 1000 198 200 202 µs z3 Additionalprogramming 8 10 12 µs 1 3 6 1 4 ** Wait time after P bit clear* α 5 — — µs Wait time after PSU 1 bit clear* β 5 — — µs Wait time after PV 1 bit setting* γ 4 — — µs Wait time after 1 dummy write* ε 2 — — µs Wait time after PV bit clear* η 2 — — µs Wait time after SWE 1 bit clear* θ 100 — — µs Maximum programming 1 4 5 count * * * N — — 1000 Times 1 1 Rev.5.00 Nov. 02, 2005 Page 406 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Values Item Erasing Symbol Test Condition Min Typ Max Unit Wait time after SWE 1 bit setting* x 1 — — µs Wait time after ESU 1 bit setting* y 100 — — µs Wait time after E bit 1 6 setting* * z 10 — 100 ms Wait time after E bit clear* α 10 — — µs Wait time after ESU 1 bit clear* β 10 — — µs Wait time after EV 1 bit setting* γ 20 — — µs Wait time after 1 dummy write* ε 2 — — µs Wait time after EV bit clear* η 4 — — µs Wait time after SWE 1 bit clear* θ 100 — — µs N — — 120 Times 1 1 1 6 7 Maximum erase count * * * Notes: 1. Make the time settings in accordance with the program/erase algorithms. 2. The programming time for 128 bytes. (Indicates the total time for which the P bit in flash memory control register 1 (FLMCR1) is set. The program-verify time is not included.) 3. The time required to erase one block. (Indicates the time for which the E bit in flash memory control register 1 (FLMCR1) is set. The erase-verify time is not included.) 4. Programming time maximum value (tP(max.)) = wait time after P bit setting (z) × maximum programming count (N) 5. Set the maximum programming count (N) according to the actual set values of z1, z2, and z3, so that it does not exceed the programming time maximum value (tP(max.)). The wait time after P bit setting (z1, z2) should be changed as follows according to the value of the programming count (n). Programming count (n) 1≤n≤6 z1 = 30 µs 7 ≤ n ≤ 1000 z2 = 200 µs 6. Erase time maximum value (tE(max.)) = wait time after E bit setting (z) × maximum erase count (N) 7. Set the maximum erase count (N) according to the actual set value of (z), so that it does not exceed the erase time maximum value (tE(max.)). Rev.5.00 Nov. 02, 2005 Page 407 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.7 EEPROM Characteristics Table 23.9 EEPROM Characteristics VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified. Values Item Test Symbol Condition Min Typ SCL input cycle time tSCL 2500 SCL input high pulse width tSCLH 600 µs SCL input low pulse width tSCLL 1200 ns SCL, SDA input spike pulse removal time tSP 50 ns SDA input bus-free time tBUF 1200 ns Start condition input hold time tSTAH 600 ns Retransmit start condition input setup time tSTAS 600 ns Stop condition input setup time tSTOS 600 ns Data input setup time tSDAS 160 ns Data input hold time tSDAH 0 ns SCL, SDA input fall time tSf 300 ns SDA input rise time tSr 300 ns Data output hold time tDH 50 ns SCL, SDA capacitive load Cb 0 400 pF Access time tAA 100 900 ns Cycle time at writing* tWC 10 ms Reset release time tRES 13 ms Note: * Max Unit Reference Figure ns Figure 23.7 Cycle time at writing is a time from the stop condition to write completion (internal control). Rev.5.00 Nov. 02, 2005 Page 408 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.2.8 Power-Supply-Voltage Detection Circuit Characteristics (Optional) Table 23.10 Power-Supply-Voltage Detection Circuit Characteristics VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Test Condition Min Typ Max Unit Power-supply falling detection voltage Power-supply rising detection voltage Reset detection voltage 1*1 Reset detection voltage 2*2 Lower-limit voltage of LVDR operation*3 Vint (D) LVDSEL = 0 3.3 3.7 — V Vint (U) LVDSEL = 0 — 4.0 4.5 V Vreset1 LVDSEL = 0 — 2.3 2.7 V Vreset2 LVDSEL = 1 3.0 3.6 4.2 V VLVDRmin 1.0 — — V tLVDON 50 — — µs LVDE = 1, Vcc = 5.0 V, When a 32-kHz crystal resonator is not used — 350 µA LVD stabilization time Current consumption in standby mode ISTBY Notes: 1. This voltage should be used when the falling and rising voltage detection function is used. 2. Select the low-voltage reset 2 when only the low-voltage detection reset is used. 3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset may not occur. Therefore sufficient evaluation is required. 23.2.9 Power-On Reset Circuit Characteristics (Optional) Table 23.11 Power-On Reset Circuit Characteristics VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Pull-up resistance of RES pin Power-on reset start voltage* Note: * Test Condition Min Typ Max Unit RRES 100 150 — kΩ Vpor — — 100 mV The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after charge of the RES pin is removed completely. In order to remove charge of the RES pin, it is recommended that the diode be placed in the Vcc side. If the power-supply voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur. Rev.5.00 Nov. 02, 2005 Page 409 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3 Electrical Characteristics (Mask-ROM Version, EEPROM Stacked Mask-ROM Version) 23.3.1 Power Supply Voltage and Operating Ranges Power Supply Voltage and Oscillation Frequency Range φOSC (MHz) φW (kHz) 20.0 32.768 10.0 2.0 2.7 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode Power Supply Voltage and Operating Frequency Range Rev.5.00 Nov. 02, 2005 Page 410 of 500 REJ09B0027-0500 2.7 4.0 • AVCC = 3.3 to 5.5 V • All operating modes 5.5 VCC (V) Section 23 Electrical Characteristics φ (MHz) φSUB (kHz) 20.0 16.384 10.0 8.192 4.096 1.0 2.7 φ (kHz) 4.0 5.5 VCC (V) 2.7 • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode (When MA2 in SYSCR2 = 0) 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • Subactive mode • Subsleep mode 2500 1250 78.125 2.7 4.0 5.5 VCC (V) • AVCC = 3.3 to 5.5 V • Active mode • Sleep mode (When MA2 in SYSCR2 = 1) Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range φ (MHz) 20.0 10.0 2.0 3.3 4.0 5.5 AVCC (V) • VCC = 2.7 to 5.5 V • Active mode • Sleep mode Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection Circuit is Used Rev.5.00 Nov. 02, 2005 Page 411 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics φosc (MHz) 20.0 16.0 2.0 Vcc(V) 3.0 4.5 5.5 Operation guarantee range Operation guarantee range except A/D conversion accuracy Rev.5.00 Nov. 02, 2005 Page 412 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.2 DC Characteristics Table 23.12 DC Characteristics (1) VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Input high VIH voltage Applicable Pins Test Condition Min Typ Max Unit RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG,TMIB1, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1, SCK3, SCK3_2, TRGV VCC = 4.0 to 5.5 V VCC × 0.8 — VCC + 0.3 V VCC × 0.9 — VCC + 0.3 RXD, RXD_2 SCL, SDA, P10 to P12, P14 to P17, P20 to P24, P30 to P37 P50 to P57, P60 to P67, P70 to P72, P74 to P76, P85 to P87 VCC = 4.0 to 5.5 V VCC × 0.7 — VCC + 0.3 VCC × 0.8 — VCC + 0.3 PB0 to PB7 VCC = 4.0 to 5.5 V OSC1 VCC = 4.0 to 5.5 V Notes V VCC × 0.7 — AVCC + 0.3 V VCC × 0.8 — AVCC + 0.3 VCC – 0.5 — VCC + 0.3 VCC – 0.3 — VCC + 0.3 V Note: Connect the TEST pin to Vss. Rev.5.00 Nov. 02, 2005 Page 413 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Input low voltage VIL RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG, TMIB1, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1, SCK3, SCK3_2, TRGV VCC = 4.0 to 5.5 V –0.3 — VCC × 0.2 V –0.3 — VCC × 0.1 RXD, RXD_2, SCL, SDA, P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P60 to P67,. P70 to P72, P74 to P76, P85 to P87, PB0 to PB7 VCC = 4.0 to 5.5 V –0.3 — VCC × 0.3 –0.3 — VCC × 0.2 OSC1 VCC = 4.0 to 5.5 V Output high voltage VOH VCC = 4.0 to 5.5 V –0.3 — 0.5 –0.3 — 0.3 VCC – 1.0 — — P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P55, P60 to P67, P70 to P72, P74 to P76, P85 to P87 –IOH = 0.1 mA VCC – 0.5 — — P56, P57 VCC = 4.0 to 5.5 V VCC – 2.5 — — VCC – 2.0 — — VCC =2.7 to 4.0 V –IOH = 0.1 mA REJ09B0027-0500 V V –IOH = 1.5 mA –IOH = 0.1 mA Rev.5.00 Nov. 02, 2005 Page 414 of 500 V V Notes Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Output low voltage VOL P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P70 to P72, P74 to P76, P85 to P87 VCC = 4.0 to 5.5 V — — 0.6 V — — 0.4 P60 to P67 VCC = 4.0 to 5.5 V — — 1.5 — 1.0 — 0.4 — — 0.4 VCC = 4.0 to 5.5 V — — 0.6 Notes IOL = 1.6 mA IOL = 0.4 mA V IOL = 20.0 mA VCC = 4.0 to 5.5 V — IOL = 10.0 mA VCC = 4.0 to 5.5 V — IOL = 1.6 mA IOL = 0.4 mA SCL, SDA V IOL = 6.0 mA Input/ output leakage current | IIL | IOL = 3.0 mA — — 0.4 OSC1, TMIB1, RES, NMI, WKP0 to WKP5, IRQ0 to IRQ3, ADTRG, TRGV, TMRIV, TMCIV, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1, RXD, SCK3, RXD_2, SCK3_2, SCL, SDA VIN = 0.5 V to (VCC – 0.5 V) — — 1.0 µA P10 to P12, P14 to P17, P20 to P24, P30 to P37, P50 to P57, P60 to P67, P70 to P72, P74 to P76, P85 to P87, VIN = 0.5 V to (VCC – 0.5 V) — — 1.0 µA PB0 to PB7 VIN = 0.5 V to (AVCC – 0.5 V) — — 1.0 µA Rev.5.00 Nov. 02, 2005 Page 415 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Pull-up MOS current –Ip P10 to P12, P14 to P17, P50 to P55 VCC = 5.0 V, VIN = 0.0 V 50.0 — 300.0 µA VCC = 3.0 V, VIN = 0.0 V — 60.0 — Input capacitance Cin Reference value All input pins except power supply pins f = 1 MHz, VIN = 0.0 V, Ta = 25°C — — 15.0 pF IOPE1 Active mode current consumption VCC Active mode 1 VCC = 5.0 V, fOSC = 20 MHz — 21.0 30.0 mA Active mode 1 VCC = 3.0 V, fOSC = 10 MHz — 9.0 — IOPE2 VCC Active mode 2 VCC = 5.0 V, fOSC = 20 MHz — 1.8 3.0 Active mode 2 VCC = 3.0 V, fOSC = 10 MHz — 1.2 — Sleep mode 1 VCC = 5.0 V, fOSC = 20 MHz — 17.5 22.5 Sleep mode 1 VCC = 3.0 V, fOSC = 10 MHz — 7.5 — Sleep mode 2 VCC = 5.0 V, fOSC = 20 MHz — 1.7 2.7 Sleep mode 2 VCC = 3.0 V, fOSC = 10 MHz — 1.1 — VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/2) — 35.0 70.0 VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/8) — 25.0 — VCC = 3.0 V 32-kHz crystal resonator (φSUB = φW/2) — 25.0 50.0 Sleep ISLEEP1 mode current consumption VCC ISLEEP2 VCC Subactive ISUB mode current consumption VCC Subsleep ISUBSP mode current consumption VCC Rev.5.00 Nov. 02, 2005 Page 416 of 500 REJ09B0027-0500 Notes * * Reference value mA * * Reference value mA * * Reference value mA * * Reference value µA * * Reference value µA * Section 23 Electrical Characteristics Values Item Applicable Pins Test Condition Min Typ Max Unit Notes ISTBY Standby mode current consumption VCC 32-kHz crystal resonator not used — — 5.0 µA * RAM data VRAM retaining voltage VCC 2.0 — — V Note: Symbol * Pin states during current consumption measurement are given below (excluding current in the pull-up MOS transistors and output buffers). Mode RES Pin Internal State Other Pins Oscillator Pins Active mode 1 VCC Operates VCC Main clock: ceramic or crystal resonator Active mode 2 Sleep mode 1 Operates (φOSC/64) VCC Sleep mode 2 Only timers operate Subclock: Pin X1 = VSS VCC Only timers operate (φOSC/64) Subactive mode VCC Operates VCC Main clock: ceramic or crystal resonator Subsleep mode VCC Only timers operate VCC Subclock resonator: crystal Standby mode VCC CPU and timers both stop VCC Main clock: ceramic or crystal resonator Subclock: Pin X1 = VSS Rev.5.00 Nov. 02, 2005 Page 417 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.12 DC Characteristics (2) VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated. Values Item Symbol Applicable Pins Test Condition Min Typ Max Unit Notes EEPROM current consumption IEEW VCC VCC = 5.0 V, tSCL = 2.5 µs (when writing) — — 2.0 mA * IEER VCC VCC = 5.0 V, tSCL = 2.5 µs (when reading) — — 0.3 mA IEESTBY VCC VCC = 5.0 V, tSCL = 2.5 µs (at standby) — — 3.0 µA Note: * The current consumption of the EEPROM chip is shown. For the current consumption of H8/3687N, add the above current values to the current consumption of H8/3687. Rev.5.00 Nov. 02, 2005 Page 418 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.12 DC Characteristics (3) VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Applicable Pins Test Condition Allowable output low current (per pin) IOL Output pins except port 6, SCL, and SDA Allowable output low current (total) ∑IOL Allowable output high –IOH Min Typ Max Unit — — 2.0 mA Port 6 — — 20.0 Output pins except port 6, SCL, and SDA — — 0.5 Port 6 — — 10.0 SCL, SDA — — 6.0 — — 40.0 Port 6, SCL, and SDA — — 80.0 Output pins except port 6, SCL, and SDA — — 20.0 Port 6, SCL, and SDA — — 40.0 — — 2.0 — — 0.2 — — 30.0 — — 8.0 Output pins except port 6, SCL, and SDA VCC = 4.0 to 5.5 V VCC = 4.0 to 5.5 V All output pins VCC = 4.0 to 5.5 V All output pins VCC = 4.0 to 5.5 V current (per pin) Allowable output high –∑IOH current (total) mA mA mA Rev.5.00 Nov. 02, 2005 Page 419 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.3 AC Characteristics Table 23.13 AC Characteristics VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Symbol System clock oscillation frequency fOSC System clock (φ) tcyc Applicable Pins Test Condition OSC1, OSC2 VCC = 4.0 to 5.5 V Values Min Typ Max Unit Reference Figure 2.0 — 20.0 MHz * * 2.0 cycle time 10.0 1 — 64 tOSC — — 12.8 µs Subclock oscillation frequency fW X1, X2 — 32.768 — kHz Watch clock (φW) cycle time tW X1, X2 — 30.5 — µs Subclock (φSUB) cycle time tsubcyc 2 — 8 tW 2 — — tcyc tsubcyc Instruction cycle time trc OSC1, OSC2 — — 10.0 ms trc Oscillation stabilization time (ceramic resonator) OSC1, OSC2 — — 5.0 ms Oscillation stabilization time trcx X1, X2 — — 2.0 s External clock tCPH OSC1 20.0 — — ns 40.0 — — Oscillation stabilization time (crystal resonator) VCC = 4.0 to 5.5 V high width External clock tCPL OSC1 VCC = 4.0 to 5.5 V low width External clock External clock — — — — — 10.0 OSC1 VCC = 4.0 to 5.5 V — — — 15.0 tCPf OSC1 VCC = 4.0 to 5.5 V — — 10.0 — — 15.0 fall time Rev.5.00 Nov. 02, 2005 Page 420 of 500 REJ09B0027-0500 20.0 40.0 tCPr rise time 1 ns ns ns 2 2 * Figure 23.1 Section 23 Electrical Characteristics Item Symbol Applicable Pins RES pin low width tREL RES Values Typ Max Unit Reference Figure At power-on and in trc modes other than those below — — ms Figure 23.2 In active mode and 200 sleep mode operation — — ns Test Condition Min Input pin high width tIH NMI, TMIB1, IRQ0 to IRQ3, WKP0 to WKP5, TMCIV, TMRIV, TRGV, ADTRG, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1 2 — — tcyc tsubcyc Input pin low width tIL NMI, TMIB1, IRQ0 to IRQ3, WKP0 to WKP5, TMCIV, TMRIV, TRGV, ADTRG, FTIOA0 to FTIOD0, FTIOA1 to FTIOD1 2 — — tcyc tsubcyc Figure 23.3 Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is 1.0 MHz. 2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2). Rev.5.00 Nov. 02, 2005 Page 421 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.14 I2C Bus Interface Timing VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Max Unit Reference Figure 12tcyc + 600 — — ns Figure 23.4 tSCLH 3tcyc + 300 — — ns tSCLL 5tcyc + 300 — — ns SCL and SDA input fall time tSf — — 300 ns SCL and SDA input spike pulse removal time tSP — — 1tcyc ns SDA input bus-free time tBUF 5tcyc — — ns Start condition input hold time tSTAH 3tcyc — — ns Retransmission start condition input setup time tSTAS 3tcyc — — ns Setup time for stop condition input tSTOS 3tcyc — — ns Item Symbol SCL input cycle time tSCL SCL input high width SCL input low width Test Condition Min Typ Data-input setup time tSDAS 1tcyc+20 — — ns Data-input hold time tSDAH 0 — — ns Capacitive load of SCL and SDA cb 0 — 400 pF SCL and SDA output fall time tSf — — 250 ns — — 300 VCC = 4.0 to 5.5 V Rev.5.00 Nov. 02, 2005 Page 422 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Table 23.15 Serial Communication Interface (SCI) Timing VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Input clock Asynchronous cycle Clocked synchronous Symbol Min Typ Max Unit Reference Figure tScyc SCK3 4 — — Figure 23.5 6 — — 0.4 — 0.6 tScyc — — 1 tcyc — — 1 50.0 — — 100.0 — — 50.0 — — 100.0 — — Input clock pulse width tSCKW SCK3 Transmit data delay tTXD TXD VCC = 4.0 to 5.5 V time (clocked synchronous) Receive data setup tRXS RXD VCC = 4.0 to 5.5 V time (clocked synchronous) Receive data hold time (clocked synchronous) Values Applicable Pins Test Condition tRXH RXD VCC = 4.0 to 5.5 V tcyc Figure 23.6 ns ns Rev.5.00 Nov. 02, 2005 Page 423 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.4 A/D Converter Characteristics Table 23.16 A/D Converter Characteristics VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Symbol Applicable Pins Test Condition Values Min Typ Max Unit Reference Figure V * Analog power supply AVCC voltage AVCC 3.3 VCC 5.5 Analog input voltage AVIN AN0 to AN7 VSS – 0.3 — AVCC + 0.3 V Analog power supply AIOPE current AVCC — — 2.0 mA AVCC = 5.0 V 1 fOSC = 20 MHz 2 AISTOP1 AVCC — 50 — µA * Reference value AISTOP2 AVCC — — 5.0 µA * Analog input capacitance CAIN AN0 to AN7 — — 30.0 pF Allowable signal source impedance RAIN AN0 to AN7 — — 5.0 kΩ 10 10 10 bit 134 — — tcyc Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Resolution (data length) Conversion time (single mode) AVCC = 3.3 to 5.5 V Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±8.0 LSB 70 — — tcyc Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±8.0 LSB Conversion time (single mode) Rev.5.00 Nov. 02, 2005 Page 424 of 500 REJ09B0027-0500 AVCC = 4.0 to 5.5 V 3 Section 23 Electrical Characteristics Item Symbol Applicable Pins Test Condition Conversion time (single mode) Values Min AVCC = 4.0 to 5.5 V 134 Typ Max Unit — — tcyc Nonlinearity error — — ±3.5 LSB Offset error — — ±3.5 LSB Full-scale error — — ±3.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Reference Figure Notes: 1. Set AVCC = VCC when the A/D converter is not used. 2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the A/D converter is idle. 23.3.5 Watchdog Timer Characteristics Table 23.17 Watchdog Timer Characteristics VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Item Symbol On-chip oscillator overflow time tOVF Note: * Applicable Pins Test Condition Values Min Typ Max Unit Reference Figure 0.2 0.4 — s * Shows the time to count from 0 to 255, at which point an internal reset is generated, when the internal oscillator is selected. Rev.5.00 Nov. 02, 2005 Page 425 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.6 EEPROM Characteristics Table 23.18 EEPROM Characteristics VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated. Values Test Reference Condition Min Typ Max Unit Figure Item Symbol SCL input cycle time tSCL 2500 SCL input high pulse width tSCLH 600 µs SCL input low pulse width tSCLL 1200 ns SCL, SDA input spike pulse removal time tSP 50 ns SDA input bus-free time tBUF 1200 ns Start condition input hold time tSTAH 600 ns Retransmit start condition input setup time tSTAS 600 ns Stop condition input setup time tSTOS 600 ns Data input setup time tSDAS 160 ns Data input hold time tSDAH 0 ns SCL, SDA input fall time tSf 300 ns SDA input rise time tSr 300 ns Data output hold time tDH 50 ns SCL, SDA capacitive load Cb 0 400 pF Access time tAA 100 900 ns Cycle time at writing* tWC 10 ms Reset release time tRES 13 ms Note: * ns Figure 23.7 Cycle time at writing is a time from the stop condition to write completion (internal control). Rev.5.00 Nov. 02, 2005 Page 426 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.7 Power-Supply-Voltage Detection Circuit Characteristics (Optional) Table 23.19 Power-Supply-Voltage Detection Circuit Characteristics VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Values Item Symbol Test Condition Power-supply falling detection voltage Vint (D) LVDSEL = 0 3.3 3.7 — V Power-supply rising detection voltage Vint (U) LVDSEL = 0 — 4.0 4.5 V Reset detection voltage 1*1 Vreset1 LVDSEL = 0 — 2.3 2.7 V Reset detection voltage 2* 2 Vreset2 LVDSEL = 1 3.0 3.6 4.2 V Lower-limit voltage of LVDR 3 operation* VLVDRmin 1.0 — — V LVD stabilization time tLVDON 50 — — µs Current consumption in standby mode ISTBY — — 350 µA LVDE = 1, Vcc = 5.0 V, When a 32kHz crystal resonator is not used Min Typ Max Unit Notes: 1. This voltage should be used when the falling and rising voltage detection function is used. 2. Select the low-voltage reset 2 when only the low-voltage detection reset is used. 3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset may not occur. Therefore sufficient evaluation is required. Rev.5.00 Nov. 02, 2005 Page 427 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 23.3.8 Power-On Reset Circuit Characteristics (Optional) Table 23.20 Power-On Reset Circuit Characteristics VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated. Typ Max Unit RRES 100 150 — kΩ Vpor — — 100 mV Symbol Pull-up resistance of RES pin Power-on reset start voltage* 23.4 * Values Min Item Note: Test Condition The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after charge of the RES pin is removed completely. In order to remove charge of the RES pin, it is recommended that the diode be placed in the Vcc side. If the power-supply voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur. Operation Timing t OSC VIH OSC1 VIL t CPH t CPL t CPf t CPr Figure 23.1 System Clock Input Timing Rev.5.00 Nov. 02, 2005 Page 428 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics VCC × 0.7 VCC OSC1 tREL RES VIL VIL tREL Figure 23.2 RES Low Width Timing NMI IRQ0 to IRQ3 WKP0 to WKP5 ADTRG FTIOA0 to FTIOD0, FTIOA1 to FTIOD1, TMCIV, TMRIV TRGV VIH VIL t IL t IH Figure 23.3 Input Timing VIH SDA VIL tBUF tSTAH tSCLH tSTAS tSP tSTOS SCL P* S* tSf Sr* tSCLL P* tSDAS tSCL tSDAH Note: * S, P, and Sr represent the following: S: Start condition P: Stop condition Sr: Retransmission start condition Figure 23.4 I2C Bus Interface Input/Output Timing Rev.5.00 Nov. 02, 2005 Page 429 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics t SCKW SCK3 t Scyc Figure 23.5 SCK3 Input Clock Timing t Scyc SCK3 VIH or VOH * VIL or VOL * t TXD * TXD (transmit data) VOH VOL * t RXS t RXH RXD (receive data) Note: * Output timing reference levels Output high: V OH= 2.0 V Output low: V OL= 0.8 V Load conditions are shown in figure 23.8. Figure 23.6 SCI Input/Output Timing in Clocked Synchronous Mode Rev.5.00 Nov. 02, 2005 Page 430 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics 1/fSCL tSf tSCLH tSP tSCLL SCL tSTAS tSDAH tSTAH tSTOS tSDAS tSr SDA (in) tBUF tAA tDH SDA (out) Figure 23.7 EEPROM Bus Timing 23.5 Output Load Condition VCC 2.4 kΩ LSI output pin 30 pF 12 k Ω Figure 23.8 Output Load Circuit Rev.5.00 Nov. 02, 2005 Page 431 of 500 REJ09B0027-0500 Section 23 Electrical Characteristics Rev.5.00 Nov. 02, 2005 Page 432 of 500 REJ09B0027-0500 Appendix Appendix A Instruction Set A.1 Instruction List Condition Code Symbol Description Rd General destination register Rs General source register Rn General register ERd General destination register (address register or 32-bit register) ERs General source register (address register or 32-bit register) ERn General register (32-bit register) (EAd) Destination operand (EAs) Source operand PC Program counter SP Stack pointer CCR Condition-code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR disp Displacement → Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right + Addition of the operands on both sides – Subtraction of the operand on the right from the operand on the left × Multiplication of the operands on both sides ÷ Division of the operand on the left by the operand on the right ∧ Logical AND of the operands on both sides ∨ Logical OR of the operands on both sides ⊕ Logical exclusive OR of the operands on both sides ¬ NOT (logical complement) ( ), < > Contents of operand Rev.5.00 Nov. 02, 2005 Page 433 of 500 REJ09B0027-0500 Appendix Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers (R0 to R7 and E0 to E7). Symbol Description ↔ Condition Code Notation (cont) Changed according to execution result * Undetermined (no guaranteed value) 0 Cleared to 0 1 Set to 1 — Not affected by execution of the instruction ∆ Varies depending on conditions, described in notes Rev.5.00 Nov. 02, 2005 Page 434 of 500 REJ09B0027-0500 Appendix Table A.1 Instruction Set 1. Data Transfer Instructions Condition Code — — MOV.B @(d:16, ERs), Rd B 4 @(d:16, ERs) → Rd8 — — MOV.B @(d:24, ERs), Rd B 8 @(d:24, ERs) → Rd8 — — MOV.B @ERs+, Rd B @ERs → Rd8 ERs32+1 → ERs32 — — MOV.B @aa:8, Rd B 2 @aa:8 → Rd8 — — MOV.B @aa:16, Rd B 4 @aa:16 → Rd8 — — MOV.B @aa:24, Rd B 6 @aa:24 → Rd8 — — MOV.B Rs, @ERd B Rs8 → @ERd — — MOV.B Rs, @(d:16, ERd) B 4 Rs8 → @(d:16, ERd) — — MOV.B Rs, @(d:24, ERd) B 8 Rs8 → @(d:24, ERd) — — MOV.B Rs, @–ERd B ERd32–1 → ERd32 Rs8 → @ERd — — MOV.B Rs, @aa:8 B 2 Rs8 → @aa:8 — — MOV.B Rs, @aa:16 B 4 Rs8 → @aa:16 — — MOV.B Rs, @aa:24 B 6 Rs8 → @aa:24 — — MOV.W #xx:16, Rd W 4 #xx:16 → Rd16 — — MOV.W Rs, Rd W Rs16 → Rd16 — — MOV.W @ERs, Rd W @ERs → Rd16 — — 2 2 2 2 2 2 MOV.W @(d:16, ERs), Rd W 4 @(d:16, ERs) → Rd16 — — MOV.W @(d:24, ERs), Rd W 8 @(d:24, ERs) → Rd16 — — @ERs → Rd16 ERs32+2 → @ERd32 — — MOV.W @ERs+, Rd W MOV.W @aa:16, Rd W 4 @aa:16 → Rd16 — — MOV.W @aa:24, Rd W 6 @aa:24 → Rd16 — — MOV.W Rs, @ERd W Rs16 → @ERd — — 2 2 MOV.W Rs, @(d:16, ERd) W 4 Rs16 → @(d:16, ERd) — — MOV.W Rs, @(d:24, ERd) W 8 Rs16 → @(d:24, ERd) — — 0 — 0 — 0 — 0 — Advanced @ERs → Rd8 B ↔ ↔ ↔ ↔ ↔ ↔ — — MOV.B @ERs, Rd 2 ↔ ↔ ↔ ↔ ↔ ↔ — — Rs8 → Rd8 B C ↔ ↔ ↔ ↔ ↔ ↔ ↔ #xx:8 → Rd8 MOV.B Rs, Rd V ↔ ↔ ↔ ↔ ↔ ↔ ↔ Z ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ N ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ H ↔ ↔ ↔ ↔ ↔ I Normal — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn 2 Rn B No. of States*1 ↔ ↔ ↔ ↔ ↔ MOV MOV.B #xx:8, Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 0 — 2 0 — 4 0 — 6 0 — 10 0 — 6 4 0 — 6 0 — 8 0 — 4 0 — 6 0 — 10 0 — 6 4 0 — 6 0 — 8 0 — 4 0 — 2 0 — 4 0 — 6 0 — 10 0 — 6 6 0 — 8 0 — 4 0 — 6 0 — 10 Rev.5.00 Nov. 02, 2005 Page 435 of 500 REJ09B0027-0500 Appendix No. of States*1 Condition Code — — @(d:24, ERs) → ERd32 — — @ERs → ERd32 ERs32+4 → ERs32 — — 6 @aa:16 → ERd32 — — 8 @aa:24 → ERd32 — — ERs32 → @ERd — — ERs32 → @(d:16, ERd) — — ERs32 → @(d:24, ERd) — — ERd32–4 → ERd32 ERs32 → @ERd — — 6 ERs32 → @aa:16 — — 8 ERs32 → @aa:24 — — 0 — 0 — POP POP.W Rn W 2 @SP → Rn16 SP+2 → SP — — POP.L ERn L 4 @SP → ERn32 SP+4 → SP — — 0 — PUSH PUSH.W Rn W 2 SP–2 → SP Rn16 → @SP — — 0 — PUSH.L ERn L 4 SP–4 → SP ERn32 → @SP — — 0 — MOVFPE MOVFPE @aa:16, Rd B 4 Cannot be used in this LSI Cannot be used in this LSI MOVTPE MOVTPE Rs, @aa:16 B 4 Cannot be used in this LSI Cannot be used in this LSI W MOV.W Rs, @aa:16 W MOV.W Rs, @aa:24 W MOV.L #xx:32, Rd L MOV.L ERs, ERd L MOV.L @ERs, ERd L MOV.L @(d:16, ERs), ERd L 6 MOV.L @(d:24, ERs), ERd L 10 MOV.L @ERs+, ERd L MOV.L @aa:16, ERd L MOV.L @aa:24, ERd L MOV.L ERs, @ERd L MOV.L ERs, @(d:16, ERd) L 6 MOV.L ERs, @(d:24, ERd) L 10 MOV.L ERs, @–ERd L MOV.L ERs, @aa:16 L MOV.L ERs, @aa:24 L 2 6 2 4 4 4 Rev.5.00 Nov. 02, 2005 Page 436 of 500 REJ09B0027-0500 4 Advanced @(d:16, ERs) → ERd32 ↔ — — ↔ @ERs → ERd32 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ — — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ERs32 → ERd32 ↔ ↔ ↔ ↔ ↔ ↔ — — ↔ ↔ ↔ ↔ ↔ ↔ #xx:32 → Rd32 0 — ↔ ↔ ↔ — — ↔ ↔ ↔ — — Rs16 → @aa:24 ↔ Rs16 → @aa:16 6 C ↔ 4 V ↔ Z ↔ I ↔ N — — ↔ H ERd32–2 → ERd32 Rs16 → @ERd 0 — MOV MOV.W Rs, @–ERd Normal — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 6 6 0 — 8 0 — 6 0 — 2 0 — 8 0 — 10 0 — 14 0 — 10 10 0 — 12 0 — 8 0 — 10 0 — 14 0 — 10 10 0 — 12 0 — 6 10 6 10 Appendix 2. Arithmetic Instructions No. of States*1 Condition Code Z V C ↔ ↔ — (2) ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ERd32+ERs32 → ERd32 — (2) ↔ ↔ (3) ↔ ↔ Rd16+Rs16 → Rd16 — (1) ERd32+#xx:32 → ERd32 2 Rd8+#xx:8 +C → Rd8 — 2 B 2 Rd8+Rs8 +C → Rd8 — ADDS ADDS.L #1, ERd L 2 ERd32+1 → ERd32 — — — — — — 2 ADDS.L #2, ERd L 2 ERd32+2 → ERd32 — — — — — — 2 ADDS.L #4, ERd L 2 ERd32+4 → ERd32 — — — — — — 2 INC.B Rd B 2 Rd8+1 → Rd8 — — INC.W #1, Rd W 2 Rd16+1 → Rd16 — — INC.W #2, Rd W 2 Rd16+2 → Rd16 — — INC.L #1, ERd L 2 ERd32+1 → ERd32 — — INC.L #2, ERd L 2 ERd32+2 → ERd32 — — DAA DAA Rd B 2 Rd8 decimal adjust → Rd8 — * SUB SUB.B Rs, Rd B 2 SUB.W #xx:16, Rd W 4 SUB.W Rs, Rd W SUB.L #xx:32, ERd L SUB.L ERs, ERd L ADD.W Rs, Rd W ADD.L #xx:32, ERd L ADD.L ERs, ERd L ADDX ADDX.B #xx:8, Rd ADDX.B Rs, Rd 6 2 2 Rd8–Rs8 → Rd8 — Rd16–#xx:16 → Rd16 — (1) Rd16–Rs16 → Rd16 — (1) (3) 2 4 2 6 2 — 2 — 2 — 2 — 2 — 2 * — 2 Rd8–Rs8–C → Rd8 — SUBS SUBS.L #1, ERd L 2 ERd32–1 → ERd32 — — — — — — 2 SUBS.L #2, ERd L 2 ERd32–2 → ERd32 — — — — — — 2 SUBS.L #4, ERd L 2 ERd32–4 → ERd32 — — — — — — 2 B 2 Rd8–1 → Rd8 — — DEC.W #1, Rd W 2 Rd16–1 → Rd16 — — DEC.W #2, Rd W 2 Rd16–2 → Rd16 — — Rd8–#xx:8–C → Rd8 — ↔ ↔ 2 ERd32–ERs32 → ERd32 — (2) (3) (3) ↔ ↔ ↔ DEC DEC.B Rd 2 ↔ ↔ ↔ SUBX.B Rs, Rd B ERd32–#xx:32 → ERd32 — (2) 6 ↔ ↔ ↔ 2 SUBX SUBX.B #xx:8, Rd 2 ↔ ↔ ↔ ↔ ↔ ↔ ↔ 2 B ↔ ↔ ↔ ↔ ↔ ↔ ↔ INC B 2 ↔ ↔ ↔ ↔ ↔ W 4 ↔ ↔ ↔ ↔ ↔ ↔ ADD.W #xx:16, Rd 2 ↔ ↔ ↔ ↔ ↔ B ↔ ↔ ↔ ↔ ↔ ↔ ↔ ADD.B Rs, Rd ↔ ADD ADD.B #xx:8, Rd ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ — (1) ↔ ↔ ↔ ↔ ↔ Rd16+#xx:16 → Rd16 2 ↔ — ↔ ↔ Rd8+Rs8 → Rd8 ↔ — Advanced N ↔ ↔ I Rd8+#xx:8 → Rd8 Normal H ↔ ↔ — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) 2 @ERn B Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 4 2 6 2 2 2 — 2 — 2 — 2 Rev.5.00 Nov. 02, 2005 Page 437 of 500 REJ09B0027-0500 Appendix No. of States*1 Condition Code Advanced V C ERd32–1 → ERd32 — — L 2 ERd32–2 → ERd32 — — ↔ ↔ — 2 DAS.Rd B 2 Rd8 decimal adjust → Rd8 — * ↔ ↔ ↔ 2 DEC.L #2, ERd ↔ ↔ ↔ — * — 2 B 2 Rd8 × Rs8 → Rd16 (unsigned multiplication) — — — — — — 14 W 2 Rd16 × Rs16 → ERd32 (unsigned multiplication) — — — — — — 22 B 4 Rd8 × Rs8 → Rd16 (signed multiplication) — — ↔ W 4 Rd16 × Rs16 → ERd32 (signed multiplication) — — B 2 W DIVXU DIVXU. B Rs, Rd DIVXU. W Rs, ERd DIVXS DIVXS. B Rs, Rd DIVXS. W Rs, ERd CMP CMP.B #xx:8, Rd 16 — — 24 Rd16 ÷ Rs8 → Rd16 (RdH: remainder, RdL: quotient) (unsigned division) — — (6) (7) — — 14 2 ERd32 ÷ Rs16 → ERd32 (Ed: remainder, Rd: quotient) (unsigned division) — — (6) (7) — — 22 B 4 Rd16 ÷ Rs8 → Rd16 (RdH: remainder, RdL: quotient) (signed division) — — (8) (7) — — 16 W 4 ERd32 ÷ Rs16 → ERd32 (Ed: remainder, Rd: quotient) (signed division) — — (8) (7) — — 24 Rd8–#xx:8 — Rd8–Rs8 — Rd16–#xx:16 — (1) Rd16–Rs16 — (1) ERd32–#xx:32 — (2) ERd32–ERs32 — (2) B 2 CMP.B Rs, Rd B CMP.W #xx:16, Rd W 4 CMP.W Rs, Rd W CMP.L #xx:32, ERd L CMP.L ERs, ERd L 2 2 6 2 Rev.5.00 Nov. 02, 2005 Page 438 of 500 REJ09B0027-0500 ↔ ↔ ↔ ↔ ↔ ↔ MULXS. W Rs, ERd — — ↔ ↔ ↔ ↔ ↔ ↔ MULXS MULXS. B Rs, Rd ↔ ↔ ↔ ↔ ↔ ↔ MULXU. W Rs, ERd ↔ ↔ MULXU MULXU. B Rs, Rd ↔ ↔ ↔ ↔ ↔ ↔ DAS I Normal Z 2 ↔ N L ↔ H DEC DEC.L #1, ERd ↔ — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 4 2 4 2 Appendix No. of States*1 Condition Code W 2 0–Rd16 → Rd16 — NEG.L ERd L 2 0–ERd32 → ERd32 — EXTU EXTU.W Rd W 2 0 → (<bits 15 to 8> of Rd16) — — 0 EXTU.L ERd L 2 0 → (<bits 31 to 16> of ERd32) — — 0 EXTS EXTS.W Rd W 2 (<bit 7> of Rd16) → (<bits 15 to 8> of Rd16) — — EXTS.L ERd L 2 (<bit 15> of ERd32) → (<bits 31 to 16> of ERd32) — — Advanced ↔ ↔ ↔ NEG.W Rd Normal C ↔ ↔ ↔ — ↔ ↔ ↔ V ↔ ↔ ↔ ↔ 0–Rd8 → Rd8 2 0 — 2 ↔ 2 0 — 2 ↔ H B 0 — 2 ↔ Z ↔ I NEG NEG.B Rd ↔ ↔ ↔ N ↔ — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 0 — 2 2 2 Rev.5.00 Nov. 02, 2005 Page 439 of 500 REJ09B0027-0500 Appendix 3. Logic Instructions AND.B Rs, Rd B AND.W #xx:16, Rd W 4 AND.W Rs, Rd W AND.L #xx:32, ERd L AND.L ERs, ERd L OR.B #xx:8, Rd B OR.B Rs, Rd B OR.W #xx:16, Rd W 4 OR.W Rs, Rd W OR.L #xx:32, ERd L OR.L ERs, ERd L XOR.B #xx:8, Rd B XOR.B Rs, Rd B XOR.W #xx:16, Rd W 4 XOR.W Rs, Rd W XOR.L #xx:32, ERd L XOR.L ERs, ERd L 4 ERd32⊕ERs32 → ERd32 — — NOT.B Rd B 2 ¬ Rd8 → Rd8 — — NOT.W Rd W 2 ¬ Rd16 → Rd16 — — NOT.L ERd L 2 ¬ Rd32 → Rd32 — — Z Rd8∧Rs8 → Rd8 — — Rd16∧#xx:16 → Rd16 — — Rd16∧Rs16 → Rd16 — — 4 2 2 2 6 4 2 2 2 ERd32∧ERs32 → ERd32 — — Rd8⁄#xx:8 → Rd8 — — Rd8⁄Rs8 → Rd8 — — Rd16⁄#xx:16 → Rd16 — — Rd16⁄Rs16 → Rd16 — — ERd32⁄#xx:32 → ERd32 — — ERd32⁄ERs32 → ERd32 — — Rd8⊕#xx:8 → Rd8 — — Rd8⊕Rs8 → Rd8 — — Rd16⊕#xx:16 → Rd16 — — Rd16⊕Rs16 → Rd16 — — ERd32⊕#xx:32 → ERd32 — — 6 V C Advanced I Normal — @@aa @(d, PC) @aa N — — ERd32∧#xx:32 → ERd32 — — 6 Rev.5.00 Nov. 02, 2005 Page 440 of 500 REJ09B0027-0500 H Rd8∧#xx:8 → Rd8 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 2 Operation ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ NOT 2 @(d, ERn) 2 @ERn B Rn #xx XOR Condition Code Operand Size OR No. of States*1 AND.B #xx:8, Rd Mnemonic AND @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 2 Appendix 4. Shift Instructions W 2 SHAL.L ERd L 2 SHAR SHAR.B Rd B 2 SHAR.W Rd W 2 SHAR.L ERd L 2 SHLL SHLL.B Rd B 2 SHLL.W Rd W 2 SHLL.L ERd L 2 SHLR SHLR.B Rd B 2 SHLR.W Rd W 2 SHLR.L ERd L 2 ROTXL ROTXL.B Rd B 2 ROTXL.W Rd W 2 ROTXL.L ERd L 2 B 2 ROTXR.W Rd W 2 ROTXR.L ERd L 2 ROTL ROTL.B Rd B 2 ROTL.W Rd W 2 ROTL.L ERd L 2 ROTR ROTR.B Rd B 2 ROTR.W Rd W 2 ROTR.L ERd L 2 ROTXR ROTXR.B Rd 0 MSB LSB V C — — — — — — C MSB — — LSB — — — — 0 C MSB LSB — — — — — — 0 C MSB LSB — — — — — — C — — MSB LSB — — — — C MSB LSB — — — — — — C — — MSB LSB — — — — C MSB LSB — — — — 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Advanced Z Normal — @@aa @(d, PC) @aa @–ERn/@ERn+ @(d, ERn) I C N ↔ ↔ ↔ SHAL.W Rd H — — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 2 Condition Code Operation ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ B No. of States*1 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ SHAL SHAL.B Rd @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Rev.5.00 Nov. 02, 2005 Page 441 of 500 REJ09B0027-0500 Appendix 5. Bit-Manipulation Instructions B BSET #xx:3, @aa:8 B BSET Rn, Rd B BSET Rn, @ERd B BSET Rn, @aa:8 B B BCLR #xx:3, @ERd B BCLR #xx:3, @aa:8 B BCLR Rn, Rd B BCLR Rn, @ERd B BCLR Rn, @aa:8 B BNOT BNOT #xx:3, Rd B BNOT #xx:3, @ERd B BNOT #xx:3, @aa:8 B BNOT Rn, Rd B BNOT Rn, @ERd B BNOT Rn, @aa:8 B BTST BTST #xx:3, Rd B BTST #xx:3, @ERd B BTST #xx:3, @aa:8 B BTST Rn, Rd B BTST Rn, @ERd B BTST Rn, @aa:8 B BLD #xx:3, Rd B 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 H N Z V C Advanced I Normal — @@aa @(d, PC) @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn 2 Rev.5.00 Nov. 02, 2005 Page 442 of 500 REJ09B0027-0500 Condition Code Operation (#xx:3 of Rd8) ← 1 — — — — — — 2 (#xx:3 of @ERd) ← 1 — — — — — — 8 (#xx:3 of @aa:8) ← 1 — — — — — — 8 (Rn8 of Rd8) ← 1 — — — — — — 2 (Rn8 of @ERd) ← 1 — — — — — — 8 (Rn8 of @aa:8) ← 1 — — — — — — 8 (#xx:3 of Rd8) ← 0 — — — — — — 2 (#xx:3 of @ERd) ← 0 — — — — — — 8 (#xx:3 of @aa:8) ← 0 — — — — — — 8 (Rn8 of Rd8) ← 0 — — — — — — 2 (Rn8 of @ERd) ← 0 — — — — — — 8 (Rn8 of @aa:8) ← 0 — — — — — — 8 (#xx:3 of Rd8) ← ¬ (#xx:3 of Rd8) — — — — — — 2 (#xx:3 of @ERd) ← ¬ (#xx:3 of @ERd) — — — — — — 8 (#xx:3 of @aa:8) ← ¬ (#xx:3 of @aa:8) — — — — — — 8 (Rn8 of Rd8) ← ¬ (Rn8 of Rd8) — — — — — — 2 (Rn8 of @ERd) ← ¬ (Rn8 of @ERd) — — — — — — 8 (Rn8 of @aa:8) ← ¬ (Rn8 of @aa:8) — — — — — — 8 ¬ (#xx:3 of Rd8) → Z — — — ¬ (#xx:3 of @ERd) → Z — — — ¬ (#xx:3 of @aa:8) → Z — — — ¬ (Rn8 of @Rd8) → Z — — — ¬ (Rn8 of @ERd) → Z — — — ¬ (Rn8 of @aa:8) → Z — — — (#xx:3 of Rd8) → C — — — — — — — 2 — — 6 — — 6 — — 2 — — 6 — — 6 ↔ BSET #xx:3, @ERd BCLR BCLR #xx:3, Rd BLD B No. of States*1 ↔ ↔ ↔ ↔ ↔ ↔ BSET BSET #xx:3, Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 Appendix B BLD #xx:3, @aa:8 B BILD BILD #xx:3, Rd BST BILD #xx:3, @ERd B BILD #xx:3, @aa:8 B BST #xx:3, Rd B BST #xx:3, @ERd B BST #xx:3, @aa:8 B BIST BIST #xx:3, Rd B BIST #xx:3, @ERd B BIST #xx:3, @aa:8 B BAND BAND #xx:3, Rd B BAND #xx:3, @ERd B BAND #xx:3, @aa:8 B BIAND BIAND #xx:3, Rd BOR B B BIAND #xx:3, @ERd B BIAND #xx:3, @aa:8 B BOR #xx:3, Rd B BOR #xx:3, @ERd B BOR #xx:3, @aa:8 B BIOR BIOR #xx:3, Rd B BIOR #xx:3, @ERd B BIOR #xx:3, @aa:8 B BXOR BXOR #xx:3, Rd B BXOR #xx:3, @ERd B BXOR #xx:3, @aa:8 B BIXOR BIXOR #xx:3, Rd B BIXOR #xx:3, @ERd B BIXOR #xx:3, @aa:8 B 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 H N Z V C (#xx:3 of @ERd) → C — — — — — 6 (#xx:3 of @aa:8) → C — — — — — ¬ (#xx:3 of Rd8) → C — — — — — ¬ (#xx:3 of @ERd) → C — — — — — ¬ (#xx:3 of @aa:8) → C — — — — — C → (#xx:3 of Rd8) — — — — — — 2 C → (#xx:3 of @ERd24) — — — — — — 8 C → (#xx:3 of @aa:8) — — — — — — 8 ¬ C → (#xx:3 of Rd8) — — — — — — 2 ¬ C → (#xx:3 of @ERd24) — — — — — — 8 ¬ C → (#xx:3 of @aa:8) — — — — — — 8 C∧(#xx:3 of Rd8) → C — — — — — 2 C∧(#xx:3 of @ERd24) → C — — — — — C∧(#xx:3 of @aa:8) → C — — — — — C∧ ¬ (#xx:3 of Rd8) → C — — — — — C∧ ¬ (#xx:3 of @ERd24) → C — — — — — C∧ ¬ (#xx:3 of @aa:8) → C — — — — — C∨(#xx:3 of Rd8) → C — — — — — C∨(#xx:3 of @ERd24) → C — — — — — C∨(#xx:3 of @aa:8) → C — — — — — C∨ ¬ (#xx:3 of Rd8) → C — — — — — C∨ ¬ (#xx:3 of @ERd24) → C — — — — — C∨ ¬ (#xx:3 of @aa:8) → C — — — — — C⊕(#xx:3 of Rd8) → C — — — — — C⊕(#xx:3 of @ERd24) → C — — — — — C⊕(#xx:3 of @aa:8) → C — — — — — C⊕ ¬ (#xx:3 of Rd8) → C — — — — — C⊕ ¬ (#xx:3 of @ERd24) → C — — — — — 4 4 Advanced I Normal — @@aa @(d, PC) @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn Condition Code Operation ↔ ↔ ↔ ↔ ↔ BLD #xx:3, @ERd No. of States*1 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ BLD #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) C⊕ ¬ (#xx:3 of @aa:8) → C — — — — — 6 2 6 6 6 6 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 Rev.5.00 Nov. 02, 2005 Page 443 of 500 REJ09B0027-0500 Appendix 6. Branching Instructions Bcc No. of States*1 Condition Code BRA d:8 (BT d:8) — 2 BRA d:16 (BT d:16) — 4 BRN d:8 (BF d:8) — 2 BRN d:16 (BF d:16) — 4 BHI d:8 — 2 BHI d:16 — 4 BLS d:8 — 2 BLS d:16 — 4 BCC d:8 (BHS d:8) — 2 BCC d:16 (BHS d:16) — 4 BCS d:8 (BLO d:8) — 2 BCS d:16 (BLO d:16) — 4 BNE d:8 — 2 BNE d:16 — 4 BEQ d:8 — 2 BEQ d:16 — 4 BVC d:8 — 2 BVC d:16 — 4 BVS d:8 — 2 BVS d:16 — 4 BPL d:8 — 2 BPL d:16 — 4 BMI d:8 — 2 BMI d:16 — 4 BGE d:8 — 2 BGE d:16 — 4 BLT d:8 — 2 BLT d:16 — BGT d:8 I H N Z V C — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 4 — — — — — — 6 — 2 Z∨ (N⊕V) = 0 — — — — — — 4 BGT d:16 — 4 — — — — — — 6 BLE d:8 — 2 Z∨ (N⊕V) = 1 — — — — — — 4 BLE d:16 — 4 — — — — — — 6 Rev.5.00 Nov. 02, 2005 Page 444 of 500 REJ09B0027-0500 If condition Always is true then PC ← PC+d Never else next; Advanced Branch Condition Normal — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) C∨ Z = 0 C∨ Z = 1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 N⊕V = 0 N⊕V = 1 Appendix JMP BSR JSR RTS JMP @ERn — JMP @aa:24 — JMP @@aa:8 — BSR d:8 — BSR d:16 — JSR @ERn — JSR @aa:24 — JSR @@aa:8 — RTS — No. of States*1 Condition Code H N Z V C Advanced I Normal — @@aa @(d, PC) Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) PC ← ERn — — — — — — PC ← aa:24 — — — — — — PC ← @aa:8 — — — — — — 8 10 2 PC → @–SP PC ← PC+d:8 — — — — — — 6 8 4 PC → @–SP PC ← PC+d:16 — — — — — — 8 10 PC → @–SP PC ← ERn — — — — — — 6 8 PC → @–SP PC ← aa:24 — — — — — — 8 10 PC → @–SP PC ← @aa:8 — — — — — — 8 12 2 PC ← @SP+ — — — — — — 8 10 2 4 2 2 4 2 4 6 Rev.5.00 Nov. 02, 2005 Page 445 of 500 REJ09B0027-0500 Appendix 7. System Control Instructions No. of States*1 Condition Code Normal Advanced — CCR ← @SP+ PC ← @SP+ ↔ ↔ 10 — Transition to powerdown state — — — — — — 2 #xx:8 → CCR ↔ W 6 @(d:16, ERs) → CCR LDC @(d:24, ERs), CCR W 10 @(d:24, ERs) → CCR LDC @ERs+, CCR W ↔ ↔ ↔ ↔ LDC @aa:16, CCR W 6 @aa:16 → CCR LDC @aa:24, CCR W 8 @aa:24 → CCR ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ LDC @(d:16, ERs), CCR ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ W ↔ ↔ ↔ ↔ ↔ ↔ ↔ LDC @ERs, CCR ↔ ↔ ↔ ↔ ↔ ↔ B ↔ ↔ ↔ ↔ ↔ ↔ ↔ C B W STC CCR, @aa:16 W STC CCR, @aa:24 W ANDC ANDC #xx:8, CCR B B B ORC #xx:8, CCR XORC XORC #xx:8, CCR NOP 6 8 12 8 10 CCR → Rd8 — — — — — — 2 CCR → @ERd — — — — — — 6 6 CCR → @(d:16, ERd) — — — — — — 8 10 CCR → @(d:24, ERd) — — — — — — 12 ERd32–2 → ERd32 CCR → @ERd — — — — — — 8 6 CCR → @aa:16 — — — — — — 8 8 CCR → @aa:24 — — — — — — 10 2 CCR∧#xx:8 → CCR 2 CCR∨#xx:8 → CCR 2 CCR⊕#xx:8 → CCR 2 4 4 — Rev.5.00 Nov. 02, 2005 Page 446 of 500 REJ09B0027-0500 2 ↔ ↔ STC CCR, @–ERd 2 2 PC ← PC+2 8 ↔ ↔ ↔ W @ERs → CCR ERs32+2 → ERs32 4 ↔ ↔ ↔ STC CCR, @(d:24, ERd) @ERs → CCR 4 ↔ ↔ ↔ W Rs8 → CCR 2 ↔ ↔ ↔ STC CCR, @(d:16, ERd) 2 ↔ ↔ ↔ B W NOP V LDC Rs, CCR STC CCR, @ERd ORC Z LDC #xx:8, CCR STC CCR, Rd STC N ↔ ↔ ↔ LDC H ↔ ↔ SLEEP SLEEP @@aa RTE RTE @(d, PC) 16 @aa 1 — — — — — 14 @ERn 2 PC → @–SP CCR → @–SP <vector> → PC Rn — #xx I TRAPA TRAPA #x:2 ↔ ↔ ↔ ↔ ↔ Operation — @–ERn/@ERn+ @(d, ERn) Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 — — — — — — 2 2 2 Appendix 8. Block Transfer Instructions EEPMOV No. of States*1 H N Z V C Normal — @@aa @(d, PC) I EEPMOV. B — 4 if R4L ≠ 0 then repeat @R5 → @R6 R5+1 → R5 R6+1 → R6 R4L–1 → R4L until R4L=0 else next — — — — — — 8+ 4n*2 EEPMOV. W — 4 if R4 ≠ 0 then repeat @R5 → @R6 R5+1 → R5 R6+1 → R6 R4–1 → R4 until R4=0 else next — — — — — — 8+ 4n*2 Advanced Condition Code Operation @aa @–ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) Notes: 1. The number of states in cases where the instruction code and its operands are located in on-chip memory is shown here. For other cases see appendix A.3, Number of Execution States. 2. n is the value set in register R4L or R4. (1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. (2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. (3) Retains its previous value when the result is zero; otherwise cleared to 0. (4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value. (5) The number of states required for execution of an instruction that transfers data in synchronization with the E clock is variable. (6) Set to 1 when the divisor is negative; otherwise cleared to 0. (7) Set to 1 when the divisor is zero; otherwise cleared to 0. (8) Set to 1 when the quotient is negative; otherwise cleared to 0. Rev.5.00 Nov. 02, 2005 Page 447 of 500 REJ09B0027-0500 REJ09B0027-0500 Rev.5.00 Nov. 02, 2005 Page 448 of 500 MULXU 5 STC Table A.2 (2) LDC 3 BVC 8 SUBX OR XOR AND MOV C D E F BILD BIST BLD BST MOV BVS 9 B JMP BPL BMI MOV Table A.2 Table A.2 (2) (2) Table A.2 Table A.2 (2) (2) A Table A.2 Table A.2 EEPMOV (2) (2) SUB ADD Table A.2 TRAPA (2) BEQ B BIAND BAND AND RTE BNE CMP BIXOR BXOR XOR BSR BCS A BIOR BOR OR RTS BCC MOV.B Table A.2 (2) LDC 7 ADDX BTST DIVXU BLS AND.B ANDC 6 9 BCLR MULXU BHI XOR.B XORC 5 ADD BNOT DIVXU BRN OR.B ORC 4 8 7 BSET BRA 6 2 1 Table A.2 Table A.2 Table A.2 Table A.2 (2) (2) (2) (2) NOP 4 3 2 1 0 0 BSR BGE C CMP MOV Instruction when most significant bit of BH is 1. Instruction when most significant bit of BH is 0. E JSR BGT SUBX ADDX Table A.2 (3) BLT D BLE Table A.2 (2) Table A.2 (2) F Table A.2 AL 1st byte 2nd byte AH AL BH BL A.2 AH Instruction code: Appendix Operation Code Map Operation Code Map (1) ADD MOV 7A BRN ADD BRA 58 MOV DAS 1F 1 79 SUBS 1B NOT 17 DEC ROTXR 13 1A ROTXL 12 DAA 0F SHLR ADDS 0B 11 INC 0A SHLL MOV 01 10 0 CMP CMP BHI 2 SUB SUB BLS NOT ROTXR ROTXL SHLR SHLL 3 4 OR OR BCC LDC/STC 1st byte 2nd byte AH AL BH BL XOR XOR BCS DEC EXTU INC 5 AND AND BNE 6 BEQ DEC EXTU INC 7 BVC SUB NEG 9 BVS ROTR ROTL SHAR SHAL ADDS SLEEP 8 BPL A MOV BMI NEG CMP SUB ROTR ROTL SHAR C D BGE BLT DEC EXTS INC Table A.2 Table A.2 (3) (3) ADD SHAL B BGT E F BLE DEC EXTS INC Table A.2 (3) Table A.2 BH AH AL Instruction code: Appendix Operation Code Map (2) Rev.5.00 Nov. 02, 2005 Page 449 of 500 REJ09B0027-0500 REJ09B0027-0500 Rev.5.00 Nov. 02, 2005 Page 450 of 500 DIVXS 3 BSET 7Faa7 * 2 BNOT BNOT BCLR BCLR Notes: 1. r is the register designation field. 2. aa is the absolute address field. BSET 7Faa6 * 2 BTST BCLR 7Eaa7 * 2 BNOT BTST BSET 7Dr07 * 1 7Eaa6 * 2 BSET 7Dr06 * 1 BTST BCLR MULXS 2 7Cr07 * 1 BNOT DIVXS 1 BTST MULXS 0 7Cr06 * 1 01F06 01D05 01C05 01406 CL BIOR BOR BIOR BOR OR 4 BIXOR BXOR BIXOR BXOR XOR 5 BIAND BAND BIAND BAND AND 6 7 BIST BILD BST BLD BIST BILD BST BLD 1st byte 2nd byte 3rd byte 4th byte AH AL BH BL CH CL DH DL 8 LDC STC 9 A LDC STC B C LDC STC D E LDC STC F Instruction when most significant bit of DH is 1. Instruction when most significant bit of DH is 0. Table A.2 AH ALBH BLCH Instruction code: Appendix Operation Code Map (3) Appendix A.3 Number of Execution States The status of execution for each instruction of the H8/300H CPU and the method of calculating the number of states required for instruction execution are shown below. Table A.4 shows the number of cycles of each type occurring in each instruction, such as instruction fetch and data read/write. Table A.3 shows the number of states required for each cycle. The total number of states required for execution of an instruction can be calculated by the following expression: Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed. BSET #0, @FF00 From table A.4: I = L = 2, J = K = M = N= 0 From table A.3: SI = 2, SL = 2 Number of states required for execution = 2 × 2 + 2 × 2 = 8 When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and on-chip RAM is used for stack area. JSR @@ 30 From table A.4: I = 2, J = K = 1, L=M=N=0 From table A.3: SI = SJ = SK = 2 Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8 Rev.5.00 Nov. 02, 2005 Page 451 of 500 REJ09B0027-0500 Appendix Table A.3 Number of Cycles in Each Instruction Access Location Execution Status (Instruction Cycle) On-Chip Memory On-Chip Peripheral Module 2 — Instruction fetch SI Branch address read SJ Stack operation SK Byte data access SL 2 or 3* Word data access SM 2 or 3* Internal operation SN Note: * 1 Depends on which on-chip peripheral module is accessed. See section 22.1, Register Addresses (Address Order). Rev.5.00 Nov. 02, 2005 Page 452 of 500 REJ09B0027-0500 Appendix Table A.4 Number of Cycles in Each Instruction Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N ADD ADD.B #xx:8, Rd 1 ADD.B Rs, Rd 1 ADD.W #xx:16, Rd 2 ADD.W Rs, Rd 1 ADD.L #xx:32, ERd 3 ADD.L ERs, ERd 1 ADDS ADDS #1/2/4, ERd 1 ADDX ADDX #xx:8, Rd 1 ADDX Rs, Rd 1 AND AND.B #xx:8, Rd 1 AND.B Rs, Rd 1 AND.W #xx:16, Rd 2 AND.W Rs, Rd 1 AND.L #xx:32, ERd 3 AND.L ERs, ERd 2 ANDC #xx:8, CCR 1 ANDC BAND Bcc Stack K BAND #xx:3, Rd 1 BAND #xx:3, @ERd 2 1 BAND #xx:3, @aa:8 2 1 BRA d:8 (BT d:8) 2 BRN d:8 (BF d:8) 2 BHI d:8 2 BLS d:8 2 BCC d:8 (BHS d:8) 2 BCS d:8 (BLO d:8) 2 BNE d:8 2 BEQ d:8 2 BVC d:8 2 BVS d:8 2 BPL d:8 2 BMI d:8 2 BGE d:8 2 Rev.5.00 Nov. 02, 2005 Page 453 of 500 REJ09B0027-0500 Appendix Instruction Mnemonic Bcc BCLR BIAND BILD Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Stack Access Access Operation I J L M N K BLT d:8 2 BGT d:8 2 BLE d:8 2 BRA d:16(BT d:16) 2 2 BRN d:16(BF d:16) 2 2 BHI d:16 2 2 BLS d:16 2 2 BCC d:16(BHS d:16) 2 2 BCS d:16(BLO d:16) 2 2 BNE d:16 2 2 BEQ d:16 2 2 BVC d:16 2 2 BVS d:16 2 2 BPL d:16 2 2 BMI d:16 2 2 BGE d:16 2 2 BLT d:16 2 2 BGT d:16 2 2 BLE d:16 2 2 BCLR #xx:3, Rd 1 BCLR #xx:3, @ERd 2 2 BCLR #xx:3, @aa:8 2 2 BCLR Rn, Rd 1 BCLR Rn, @ERd 2 2 BCLR Rn, @aa:8 2 2 BIAND #xx:3, Rd 1 BIAND #xx:3, @ERd 2 1 BIAND #xx:3, @aa:8 2 1 BILD #xx:3, Rd 1 BILD #xx:3, @ERd 2 1 BILD #xx:3, @aa:8 2 1 Rev.5.00 Nov. 02, 2005 Page 454 of 500 REJ09B0027-0500 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N BIOR BIOR #xx:8, Rd 1 BIOR #xx:8, @ERd 2 1 BIOR #xx:8, @aa:8 2 1 BIST #xx:3, Rd 1 BIST #xx:3, @ERd 2 2 BIST #xx:3, @aa:8 2 2 BIXOR #xx:3, Rd 1 BIXOR #xx:3, @ERd 2 1 BIXOR #xx:3, @aa:8 2 1 BLD #xx:3, Rd 1 BLD #xx:3, @ERd 2 1 BLD #xx:3, @aa:8 2 1 BIST BIXOR BLD BNOT BOR BSET BSR BST Stack K BNOT #xx:3, Rd 1 BNOT #xx:3, @ERd 2 2 BNOT #xx:3, @aa:8 2 2 BNOT Rn, Rd 1 BNOT Rn, @ERd 2 2 BNOT Rn, @aa:8 2 2 BOR #xx:3, Rd 1 BOR #xx:3, @ERd 2 1 BOR #xx:3, @aa:8 2 1 BSET #xx:3, Rd 1 BSET #xx:3, @ERd 2 2 BSET #xx:3, @aa:8 2 2 BSET Rn, Rd 1 BSET Rn, @ERd 2 BSET Rn, @aa:8 2 BSR d:8 2 1 BSR d:16 2 1 2 2 2 BST #xx:3, Rd 1 BST #xx:3, @ERd 2 2 BST #xx:3, @aa:8 2 2 Rev.5.00 Nov. 02, 2005 Page 455 of 500 REJ09B0027-0500 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N BTST BTST #xx:3, Rd 1 BTST #xx:3, @ERd 2 1 BTST #xx:3, @aa:8 2 1 BTST Rn, Rd 1 BTST Rn, @ERd 2 1 1 BXOR CMP Stack K BTST Rn, @aa:8 2 BXOR #xx:3, Rd 1 BXOR #xx:3, @ERd 2 1 BXOR #xx:3, @aa:8 2 1 CMP.B #xx:8, Rd 1 CMP.B Rs, Rd 1 CMP.W #xx:16, Rd 2 CMP.W Rs, Rd 1 CMP.L #xx:32, ERd 3 CMP.L ERs, ERd 1 DAA DAA Rd 1 DAS DAS Rd 1 DEC DEC.B Rd 1 DEC.W #1/2, Rd 1 DEC.L #1/2, ERd 1 DIVXS.B Rs, Rd 2 12 DIVXS.W Rs, ERd 2 20 DIVXU.B Rs, Rd 1 12 DIVXU.W Rs, ERd 1 DUVXS DIVXU EEPMOV EXTS EXTU 20 1 EEPMOV.B 2 2n+2* EEPMOV.W 2 2n+2*1 EXTS.W Rd 1 EXTS.L ERd 1 EXTU.W Rd 1 EXTU.L ERd 1 Rev.5.00 Nov. 02, 2005 Page 456 of 500 REJ09B0027-0500 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N INC INC.B Rd 1 INC.W #1/2, Rd 1 INC.L #1/2, ERd 1 JMP @ERn 2 JMP @aa:24 2 JMP @@aa:8 2 JSR @ERn 2 1 JSR @aa:24 2 1 JSR @@aa:8 2 LDC #xx:8, CCR 1 LDC Rs, CCR 1 LDC@ERs, CCR 2 1 LDC@(d:16, ERs), CCR 3 1 LDC@(d:24,ERs), CCR 5 1 LDC@ERs+, CCR 2 1 LDC@aa:16, CCR 3 1 LDC@aa:24, CCR 4 1 MOV.B #xx:8, Rd 1 MOV.B Rs, Rd 1 MOV.B @ERs, Rd 1 1 MOV.B @(d:16, ERs), Rd 2 1 MOV.B @(d:24, ERs), Rd 4 1 MOV.B @ERs+, Rd 1 1 MOV.B @aa:8, Rd 1 1 MOV.B @aa:16, Rd 2 1 MOV.B @aa:24, Rd 3 1 MOV.B Rs, @Erd 1 1 MOV.B Rs, @(d:16, ERd) 2 1 MOV.B Rs, @(d:24, ERd) 4 1 MOV.B Rs, @-ERd 1 1 MOV.B Rs, @aa:8 1 1 JMP JSR LDC MOV Stack K 2 2 1 1 2 1 2 2 2 Rev.5.00 Nov. 02, 2005 Page 457 of 500 REJ09B0027-0500 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N MOV MOV.B Rs, @aa:16 2 1 MOV.B Rs, @aa:24 3 1 MOV.W #xx:16, Rd 2 MOV.W Rs, Rd 1 MOV.W @ERs, Rd 1 1 MOV.W @(d:16,ERs), Rd 2 1 MOV.W @(d:24,ERs), Rd 4 1 MOV.W @ERs+, Rd 1 1 MOV.W @aa:16, Rd 2 1 MOV.W @aa:24, Rd 3 1 MOV.W Rs, @ERd 1 1 MOV.W Rs, @(d:16,ERd) 2 1 MOV.W Rs, @(d:24,ERd) 4 1 MOV.W Rs, @-ERd 1 1 MOV.W Rs, @aa:16 2 1 MOV.W Rs, @aa:24 3 1 MOV.L #xx:32, ERd 3 MOV.L ERs, ERd 1 MOV.L @ERs, ERd 2 2 MOV.L @(d:16,ERs), ERd 3 2 MOV.L @(d:24,ERs), ERd 5 2 MOV.L @ERs+, ERd 2 2 MOV.L @aa:16, ERd 3 2 MOV.L @aa:24, ERd 4 2 MOV.L ERs,@ERd 2 2 MOV.L ERs, @(d:16,ERd) 3 2 MOV.L ERs, @(d:24,ERd) 5 2 MOV.L ERs, @-ERd 2 2 MOV.L ERs, @aa:16 3 2 4 2 MOV MOV.L ERs, @aa:24 2 Stack K MOVFPE MOVFPE @aa:16, Rd* 2 1 MOVTPE MOVTPE Rs,@aa:16*2 2 1 Rev.5.00 Nov. 02, 2005 Page 458 of 500 REJ09B0027-0500 2 2 2 2 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N MULXS MULXS.B Rs, Rd 2 12 MULXS.W Rs, ERd 2 20 MULXU MULXU.B Rs, Rd 1 12 MULXU.W Rs, ERd 1 20 NEG.B Rd 1 NEG.W Rd 1 NEG NEG.L ERd 1 NOP NOP 1 NOT NOT.B Rd 1 NOT.W Rd 1 NOT.L ERd 1 OR Stack K OR.B #xx:8, Rd 1 OR.B Rs, Rd 1 OR.W #xx:16, Rd 2 OR.W Rs, Rd 1 OR.L #xx:32, ERd 3 OR.L ERs, ERd 2 ORC ORC #xx:8, CCR 1 POP POP.W Rn 1 1 2 POP.L ERn 2 2 2 PUSH.W Rn 1 1 2 PUSH.L ERn 2 2 2 ROTL.B Rd 1 ROTL.W Rd 1 ROTL.L ERd 1 ROTR.B Rd 1 ROTR.W Rd 1 ROTR.L ERd 1 ROTXL.B Rd 1 ROTXL.W Rd 1 ROTXL.L ERd 1 PUSH ROTL ROTR ROTXL Rev.5.00 Nov. 02, 2005 Page 459 of 500 REJ09B0027-0500 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N ROTXR ROTXR.B Rd 1 ROTXR.W Rd 1 ROTXR.L ERd 1 RTE RTE 2 2 2 RTS RTS 2 1 2 SHAL SHAL.B Rd 1 SHAL.W Rd 1 SHAL.L ERd 1 SHAR.B Rd 1 SHAR.W Rd 1 SHAR.L ERd 1 SHAR SHLL SHLR SHLL.B Rd 1 SHLL.W Rd 1 SHLL.L ERd 1 SHLR.B Rd 1 SHLR.W Rd 1 Stack K SHLR.L ERd 1 SLEEP SLEEP 1 STC STC CCR, Rd 1 STC CCR, @ERd 2 1 STC CCR, @(d:16,ERd) 3 1 STC CCR, @(d:24,ERd) 5 1 STC CCR,@-ERd 2 1 STC CCR, @aa:16 3 1 STC CCR, @aa:24 4 1 SUB.B Rs, Rd 1 SUB.W #xx:16, Rd 2 SUB.W Rs, Rd 1 SUB.L #xx:32, ERd 3 SUB.L ERs, ERd 1 SUBS #1/2/4, ERd 1 SUB SUBS Rev.5.00 Nov. 02, 2005 Page 460 of 500 REJ09B0027-0500 2 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J K L M N SUBX SUBX #xx:8, Rd 1 1 2 SUBX. Rs, Rd 1 TRAPA TRAPA #xx:2 2 XOR XOR.B #xx:8, Rd 1 XOR.B Rs, Rd 1 XOR.W #xx:16, Rd 2 XOR.W Rs, Rd 1 XOR.L #xx:32, ERd 3 XOR.L ERs, ERd 2 XORC #xx:8, CCR 1 XORC Stack 4 Notes: 1. n: Specified value in R4L and R4. The source and destination operands are accessed n+1 times respectively. 2. Cannot be used in this LSI. Rev.5.00 Nov. 02, 2005 Page 461 of 500 REJ09B0027-0500 Appendix A.4 Combinations of Instructions and Addressing Modes Table A.5 Combinations of Instructions and Addressing Modes — WL — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — W W — W W — — — — — — — — — — — — — — — — — — — — — — — — BW B — — BWL WL B — — — — BWL BWL B L BWL B BW — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — B — B BWL WL BWL BWL BWL B — — — — — — — — — — — B — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — B — — — — — — B B — W W — W W — W W — W W — — — — — — — — — — — — — @aa:24 — — — @aa:16 — — — @aa:8 @ERn+/@ERn @(d:24.ERn) @ERn — — — BWL BWL BWL BWL BWL BWL — — — — — — — — — — — — Rev.5.00 Nov. 02, 2005 Page 462 of 500 REJ09B0027-0500 — LDC STC ANDC, ORC, XORC NOP Block data transfer instructions @@aa:8 Bit manipulations BCC, BSR Branching instructions JMP, JSR RTS TRAPA System control RTE instructions SLEEP @(d:16.PC) Shift operations @(d:8.PC) Data MOV transfer POP, PUSH instructions MOVFPE, MOVTPE ADD, CMP Arithmetic operations SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, MULXS, DIVXU, DIVXS NEG EXTU, EXTS AND, OR, XOR Logical operations NOT Rn Instructions #xx Functions @(d:16.ERn) Addressing Mode BWL BWL — — — — Appendix Appendix B I/O Port Block Diagrams B.1 I/O Port Block Diagrams RES goes low in a reset, and SBY goes low at reset and in standby mode. Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR IRQ TRGV [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.1 Port 1 Block Diagram (P17) Rev.5.00 Nov. 02, 2005 Page 463 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR IRQ [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.2 Port 1 Block Diagram (P14, P16) Rev.5.00 Nov. 02, 2005 Page 464 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR IRQ TMIB1 [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.3 Port 1 Block Diagram (P15) Rev.5.00 Nov. 02, 2005 Page 465 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PDR PCR [Legend] PUCR: Port pull-up control register PDR: Port data register PCR: Port control register Figure B.4 Port 1 Block Diagram (P12) Rev.5.00 Nov. 02, 2005 Page 466 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR 14-bit PWM PWM [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.5 Port 2 Block Diagram (P11) Rev.5.00 Nov. 02, 2005 Page 467 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR RTC TMOW [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.6 Port 1 Block Diagram (P10) Rev.5.00 Nov. 02, 2005 Page 468 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PMR PDR PCR [Legend] PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.7 Port 2 Block Diagram (P24, P23) Rev.5.00 Nov. 02, 2005 Page 469 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PMR PDR PCR SCI3 TxD [Legend] PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.8 Port 2 Block Diagram (P22) Rev.5.00 Nov. 02, 2005 Page 470 of 500 REJ09B0027-0500 Appendix SBY Internal data bus PDR PCR SCI3 RE RxD [Legend] PDR: Port data register PCR: Port control register Figure B.9 Port 2 Block Diagram (P21) Rev.5.00 Nov. 02, 2005 Page 471 of 500 REJ09B0027-0500 Appendix SBY SCI3 SCKIE SCKOE Internal data bus PDR PCR SCKO SCKI [Legend] PDR: Port data register PCR: Port control register Figure B.10 Port 2 Block Diagram (P20) Rev.5.00 Nov. 02, 2005 Page 472 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PDR PCR [Legend] PDR: Port data register PCR: Port control register Figure B.11 Port 3 Block Diagram (P37 to P30) Rev.5.00 Nov. 02, 2005 Page 473 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PMR PDR PCR IIC2 ICE SDAO/SCLO SDAI/SCLI [Legend] PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.12 Port 5 Block Diagram (P57, P56)* Note: * This diagram is applied to the SCL and SDA pins in the H8/3687N. Rev.5.00 Nov. 02, 2005 Page 474 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR WKP ADTRG [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.13 Port 5 Block Diagram (P55) Rev.5.00 Nov. 02, 2005 Page 475 of 500 REJ09B0027-0500 Appendix Internal data bus RES SBY PUCR Pull-up MOS PMR PDR PCR WKP [Legend] PUCR: Port pull-up control register PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.14 Port 5 Block Diagram (P54 to P50) Rev.5.00 Nov. 02, 2005 Page 476 of 500 REJ09B0027-0500 Appendix Internal data bus SBY Timer Z Output control signals A to D PDR PCR FTIOA to FTIOD [Legend] PDR: Port data register PCR: Port control register Figure B.15 Port 6 Block Diagram (P67 to P60) Rev.5.00 Nov. 02, 2005 Page 477 of 500 REJ09B0027-0500 Appendix Internal data bus SBY Timer V OS3 OS2 OS1 OS0 PDR PCR TMOV [Legend] PDR: Port data register PCR: Port control register Figure B.16 Port 7 Block Diagram (P76) Rev.5.00 Nov. 02, 2005 Page 478 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PDR PCR Timer V TMCIV [Legend] PDR: Port data register PCR: Port control register Figure B.17 Port 7 Block Diagram (P75) Rev.5.00 Nov. 02, 2005 Page 479 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PDR PCR Timer V TMRIV [Legend] PDR: Port data register PCR: Port control register Figure B.18 Port 7 Block Diagram (P74) Rev.5.00 Nov. 02, 2005 Page 480 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PMR PDR PCR SCI3_2 TxD [Legend] PMR: Port mode register PDR: Port data register PCR: Port control register Figure B.19 Port 7 Block Diagram (P72) Rev.5.00 Nov. 02, 2005 Page 481 of 500 REJ09B0027-0500 Appendix SBY Internal data bus PDR PCR SCI3_2 RE RxD [Legend] PDR: Port data register PCR: Port control register Figure B.20 Port 7 Block Diagram (P71) SBY SCI3_2 SCKIE SCKOE Internal data bus PDR PCR SCKO SCKI [Legend] PDR: Port data register PCR: Port control register Figure B.21 Port 7 Block Diagram (P70) Rev.5.00 Nov. 02, 2005 Page 482 of 500 REJ09B0027-0500 Appendix Internal data bus SBY PDR PCR [Legend] PDR: Port data register PCR: Port control register Figure B.22 Port 8 Block Diagram (P87 to P85) Rev.5.00 Nov. 02, 2005 Page 483 of 500 REJ09B0027-0500 Appendix Internal data bus A/D converter DEC CH3 to CH0 VIN Figure B.23 Port B Block Diagram (PB7 to PB0) Rev.5.00 Nov. 02, 2005 Page 484 of 500 REJ09B0027-0500 Appendix B.2 Port States in Each Operating State Port Reset Sleep Subsleep Standby Subactive Active P17 to P14, P12 to P10 High impedance Retained Retained High Functioning impedance*1 Functioning P24 to P20 High impedance Retained Retained High impedance Functioning Functioning P37 to P30 High impedance Retained Retained High impedance Functioning Functioning P57 to P50*2 High impedance Retained Retained High Functioning impedance*1 Functioning P67 to P60 High impedance Retained Retained High impedance Functioning Functioning P76 to P74, P72 to P70 High impedance Retained Retained High impedance Functioning Functioning P87 to P85 High impedance Retained Retained High impedance Functioning Functioning PB7 to PB0 High impedance High impedance High impedance High impedance High impedance High impedance Notes: 1. High level output when the pull-up MOS is in on state. 2. The P55 to P50 pins are applied to the H8/3687N. Rev.5.00 Nov. 02, 2005 Page 485 of 500 REJ09B0027-0500 Appendix Appendix C Product Code Lineup Product Classification Product Code Model Marking Package Code H8/3687 HD64F3687H HD64F3687H QFP-64 (FP-64A) HD64F3687FP HD64F3687FP LQFP-64 (FP-64E) Flash memory Standard version product Product with HD64F3687GH HD64F3687GH POR & LVDC HD64F3687GFP HD64F3687GFP Mask ROM version Standard product QFP-64 (FP-64A) LQFP-64 (FP-64E) HD6433687H HD6433687(***)H QFP-64 (FP-64A) HD6433687FP HD6433687(***)FP LQFP-64 (FP-64E) Product with HD6433687GH HD6433687G(***)H QFP-64 (FP-64A) POR & LVDC HD6433687GFP HD6433687G(***)FP LQFP-64 (FP-64E) H8/3686 Mask ROM version Standard product HD6433686H HD6433686(***)H QFP-64 (FP-64A) HD6433686FP HD6433686(***)FP LQFP-64 (FP-64E) Product with HD6433686GH HD6433686G(***)H QFP-64 (FP-64A) POR & LVDC HD6433686GFP HD6433686G(***)FP LQFP-64 (FP-64E) H8/3685 Mask ROM version Standard product HD6433685H HD6433685(***)H QFP-64 (FP-64A) HD6433685FP HD6433685(***)FP LQFP-64 (FP-64E) Product with HD6433685GH HD6433685G(***)H QFP-64 (FP-64A) POR & LVDC HD6433685GFP HD6433685G(***)FP LQFP-64 (FP-64E) H8/3684 Flash memory Standard version product HD64F3684H HD64F3684H QFP-64 (FP-64A) HD64F3684FP HD64F3684FP LQFP-64 (FP-64E) Product with HD64F3684GH HD64F3684GH POR & LVDC HD64F3684GFP HD64F3684GFP Mask ROM version Standard product QFP-64 (FP-64A) LQFP-64 (FP-64E) HD6433684H HD6433684(***)H QFP-64 (FP-64A) HD6433684FP HD6433684(***)FP LQFP-64 (FP-64E) Product with HD6433684GH HD6433684G(***)H QFP-64 (FP-64A) POR & LVDC HD6433684GFP HD6433684G(***)FP LQFP-64 (FP-64E) H8/3683 Mask ROM version Standard product HD6433683H HD6433683(***)H QFP-64 (FP-64A) HD6433683FP HD6433683(***)FP LQFP-64 (FP-64E) Product with HD6433683GH HD6433683G(***)H QFP-64 (FP-64A) POR & LVDC HD6433683GFP HD6433683G(***)FP LQFP-64 (FP-64E) H8/3682 Mask ROM version Standard product HD6433682H HD6433682(***)H QFP-64 (FP-64A) HD6433682FP HD6433682(***)FP LQFP-64 (FP-64E) Product with HD6433682GH HD6433682G(***)H QFP-64 (FP-64A) POR & LVDC HD6433682GFP HD6433682G(***)FP LQFP-64 (FP-64E) Rev.5.00 Nov. 02, 2005 Page 486 of 500 REJ09B0027-0500 Appendix Product Classification Product Code Model Marking H8/3687 EEPROM Flash Product with HD64N3687GFP HD64N3687GFP stacked memory POR & version version LVDC Mask ROM version Package Code LQFP-64 (FP64E) HD6483687GFP HD6483687G(***)FP LQFP-64 (FP64E) Legend: (***): ROM code. POR & LVDC: Power-on reset and low-voltage detection circuits. Rev.5.00 Nov. 02, 2005 Page 487 of 500 REJ09B0027-0500 64 49 Figure D.1 FP-64E Package Dimensions e ZD 1 48 *1 y *3 bp Index mark D 16 33 x F M 17 32 E *2 HD Previous Code FP-64E/FP-64EV MASS[Typ.] 0.4g Detail F L1 L Terminal cross section b1 bp θ 0.20 L1 1.0 0.5 1.25 ZE L 1.25 ZD 0.7 0.08 8° 0.22 0.27 0.10 0.5 0.15 0.17 0.20 0.22 1.70 y 0.3 0° 0.12 0.17 0.10 12.2 12.2 Max x e θ c1 c b1 bp A1 0.00 12.0 11.8 A 12.0 11.8 A2 HE 10 1.45 E HD 10 Nom Dimension in Millimeters Min D Reference Symbol NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. c1 HE ZE RENESAS Code PLQP0064KC-A c REJ09B0027-0500 A2 A1 Rev.5.00 Nov. 02, 2005 Page 488 of 500 c JEITA Package Code P-LQFP64-10x10-0.50 Appendix Appendix D Package Dimensions The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have priority. A 64 e 1 ZD D y *3 bp 16 33 x F M 17 32 MASS[Typ.] 1.2g bp Detail F L1 L Terminal cross section b1 θ L 1.6 1.0 0.8 ZE L1 1.0 ZD 1.1 0.10 8° 0.15 0.8 y 0.5 0° 0.22 x e θ 0.15 c c1 0.35 0.17 b1 0.12 0.25 0.45 0.29 bp 0.37 3.05 0.00 A1 17.5 17.5 Max A 0.10 17.2 17.2 16.9 16.9 HD HE 14 2.70 A2 14 Nom Dimension in Millimeters Min E D Reference Symbol NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. c1 HD E *2 49 48 *1 Previous Code FP-64A/FP-64AV A2 A1 c HE ZE RENESAS Code PRQP0064GB-A c JEITA Package Code P-QFP64-14x14-0.80 Appendix Figure D.2 FP-64A Package Dimensions Rev.5.00 Nov. 02, 2005 Page 489 of 500 REJ09B0027-0500 A Appendix Appendix E EEPROM Stacked-Structure Cross-Sectional View Figure E.1 EEPROM Stacked-Structure Cross-Sectional View Rev.5.00 Nov. 02, 2005 Page 490 of 500 REJ09B0027-0500 Main Revisions and Additions in this Edition Item Page Revision (See Manual for Details) Preface vi, vii Notes: When using the on-chip emulator (E7, E8) for H8/3687 program development and debugging, the following restrictions must be noted. 1. The NMI pin is reserved for the E7 or E8, and cannot be used. 3. Area H'D000 to H'DFFF is used by the E7 or E8, and is not available to the user. 5. When the E7 or E8 is used, address breaks can be set as either available to the user or for use by the E7 or E8. If address breaks are set as being used by the E7 or E8, the address break control registers must not be accessed. 6. When the E7 or E8 is used, NMI is an input/output pin (open-drain in output mode), P85 and P87 are input pins, and P86 is an output pin. 7. Use channel 1 of the SCI3 (P21/RXD, P22/TXD) in onboard programming mode by boot mode. Note has been deleted. Section 1 Overview 4 Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Stacked Version) A/D converter POR/LVD (optional) Data bus (upper) Address bus Port B PB0/AN0 PB1/AN1 PB2/AN2 PB3/AN3 PB4/AN4 PB5/AN5 PB6/AN6 PB7/AN7 AVCC Section 5 Clock Pulse Generators 70 Figure 5.3 Typical Connection to Crystal Resonator Figure 5.5 Typical Connection to Ceramic Resonator C1 OSC 1 OSC 2 71 C2 C1 = C 2 = 10 to 22 pF C1 OSC1 C2 OSC2 C1 = 5 to 30 pF C2 = 5 to 30 pF Rev.5.00 Nov. 02, 2005 Page 491 of 500 REJ09B0027-0500 Item Page Revision (See Manual for Details) Section 6 Power-Down Modes 6.1.1 System Control Register 1 (SYSCR1) 76 Bit Bit Name 3 NESEL Description Noise Elimination Sampling Frequency Select The subclock pulse generator generates the watch clock signal (φW) and the system clock pulse generator generates the oscillator clock (φOSC). This bit selects the sampling frequency of the oscillator clock when the watch clock signal (φW) is sampled. When φOSC = 4 to 20 MHz, clear NESEL to 0. Section 8 RAM 107 Section 13 Timer Z 208 Note: * When the E7 or E8 is used, area H'F780 to H'FB7F must not be accessed. TCNT value Figure 13.17 Example of Input Capture Operation Counter cleared by FTIOB input (falling edge) H'0180 H'0160 13.4.4 Synchronous Operation 211 Figure 13.20 shows an example of synchronous operation. In this example, synchronous operation has been selected, FTIOB0 and FTIOB1 have been designated for PWM mode, GRA_0 compare match has been set as the channel 0 counter clearing source, and synchronous clearing has been set for the channel 1 counter clearing source. In addition, the same input clock has been set as the counter input clock for channel 0 and channel 1. Two-phase PWM waveforms are output from pins FTIOB0 and FTIOB1. 13.4.5 PWM Mode 213 Figure 13.22 shows an example of operation in PWM mode. The output signals go to 1 and TCNT is reset at compare match A, and the output signals go to 0 at compare match B, C, and D (TOB, TOC, and TOD = 1, POLB, POLC, and POLD = 0). 214 Figures 13.24 (when TOB, TOC, and TOD = 1, POLB, POLC, and POLD = 0) and 13.25 (when TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1) show examples of the output of PWM waveforms with duty cycles of 0% and 100% in PWM mode. Rev.5.00 Nov. 02, 2005 Page 492 of 500 REJ09B0027-0500 Item Page Revision (See Manual for Details) 13.4.9 Timer Z Output Timing Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER 238 T1 T2 φ Address bus TOER address Timer Z output pin I/O port Timer output I/O port Timer Z output Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger 238 φ TOER Timer Z output pin N H'FF I/O port Timer Z output Timer Z output Section 14 Watchdog Timer 14.2.1 Timer Control/Status Register WD (TCSRWD) 252 Section 17 I2C Bus Interface 2 (IIC2) 17.3.5 I2C Bus Status Register (ICSR) 314 I/O port Bit Bit Name Description 4 TCSRWE Timer Control/Status Register WD Write Enable Bit Bit Name Description 3 STOP Stop Condition Detection Flag [Setting conditions] • In master mode, when a stop condition is detected after frame transfer • In slave mode, when a stop condition is detected after the general call address or the first byte slave address, next to detection of start condition, accords with the address set in SAR 17.7 Usage Notes 336 Section 18 A/D Converter 340 18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) Added Therefore byte access to ADDR should be done by reading the upper byte first then the lower one. Word access is also possible. ADDR is initialized to H'0000. Rev.5.00 Nov. 02, 2005 Page 493 of 500 REJ09B0027-0500 Item Page Revision (See Manual for Details) Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) 362 RES Figure 20.1 Block Diagram of Power-On Reset Circuit and LowVoltage Detection Circuit Section 23 Electrical Characteristics Table 23.2 DC Characteristics (1) CRES 394, 395 Item Input high voltage Values Applicable Symbol Pins Test Condition Min VIH VCC = 4.0 to 5.5 V VCC × 0.7 PB0 to PB7 VCC × 0.8 Input low voltage 398 VIL RXD, RXD2, VCC = 4.0 to 5.5 V SCL, SDA, P10 to P12, : P85 to P87, PB0 to PB7 Mode RES Pin Internal State Active mode 1 VCC Operates Active mode 2 Sleep mode 1 Sleep mode 2 Rev.5.00 Nov. 02, 2005 Page 494 of 500 REJ09B0027-0500 –0.3 –0.3 Operates (φOSC/64) VCC Only timers operate Only timers operate (φOSC/64) Item Page Revision (See Manual for Details) Table 23.12 DC Characteristics (1) 413, 414 Item Applicable Symbol Pins Values Test Condition Min VCC = 4.0 to 5.5 V VCC × 0.7 Input high VIH voltage PB0 to PB7 Input low voltage RXD, RXD_2, VCC = 4.0 to 5.5 V SCL, SDA, P10 to P12, : P85 to P87, PB0 to PB7 VCC × 0.8 417 VIL –0.3 Mode RES Pin Internal State Active mode 1 VCC Operates Operates (φOSC/64) Active mode 2 Sleep mode 1 VCC Only timers operate Sleep mode 2 Only timers operate (φOSC/64) Table 23.16 A/D 424 Converter Characteristics Figure 23.4 I2C Bus Interface Input/Output Timing –0.3 Values Item Test Condition Min Conversion time (single mode) AVCC = 3.3 to 5.5 V 134 429 tSTAH tSCLH SCL P* Appendix D Package Dimensions 488, 489 S* tSf tSCLL tSCL Swapped with new ones. Rev.5.00 Nov. 02, 2005 Page 495 of 500 REJ09B0027-0500 Rev.5.00 Nov. 02, 2005 Page 496 of 500 REJ09B0027-0500 Index Numerics 14-bit PWM ............................................ 255 Register settings.................................. 257 Waveform output................................ 258 A A/D converter ......................................... 337 Sample-and-hold circuit...................... 344 Scan mode........................................... 343 Single mode ........................................ 343 Address break ........................................... 63 Addressing modes..................................... 33 Absolute address................................... 34 Immediate ............................................. 35 Memory indirect ................................... 35 Program-counter relative ...................... 35 Register direct....................................... 33 Register indirect.................................... 34 Register indirect with displacement...... 34 Register indirect with post-increment... 34 Register indirect with pre-decrement.... 34 C Clock pulse generators.............................. 69 Prescaler S ............................................ 73 Prescaler W........................................... 73 Subclock generator ............................... 72 System clock generator......................... 70 Condition field.......................................... 32 Condition-code register (CCR)................. 17 CPU .......................................................... 11 E Acknowledge ...................................... 353 Acknowledge polling .......................... 356 Byte write............................................ 354 Current address read ........................... 356 EEPROM interface ............................. 352 Page write ........................................... 355 Random address read .......................... 357 Sequential read.................................... 358 Slave address reference register (ESAR)................................................ 353 Slave addressing.................................. 353 Start condition..................................... 352 Stop condition ..................................... 353 Effective address....................................... 36 Effective address extension....................... 32 Exception handling ................................... 47 Reset exception handling ...................... 57 Stack status ........................................... 60 Trap instruction..................................... 47 F Flash memory ........................................... 89 Boot mode............................................. 95 Boot program ........................................ 95 Erase/erase-verify ............................... 102 Erasing units ......................................... 89 Error protection................................... 105 Hardware protection............................ 105 Power-down states .............................. 106 Program/program-verify ..................... 100 Programmer mode............................... 106 Programming units................................ 89 Programming/erasing in user program mode ....................................... 98 Software protection............................. 105 EEPROM................................................ 349 Rev.5.00 Nov. 02, 2005 Page 497 of 500 REJ09B0027-0500 G General registers ....................................... 16 I I/O ports.................................................. 109 I/O port block diagrams ...................... 463 2 I C bus format......................................... 318 I2C bus interface 2 (IIC2) ....................... 303 Acknowledge...................................... 319 Bit synchronous circuit....................... 335 Clocked synchronous serial format..... 327 Noise canceler .................................... 329 Slave address ...................................... 318 Start condition .................................... 318 Stop condition..................................... 319 Transfer rate........................................ 307 Instruction set ........................................... 22 Arithmetic operations instructions........ 24 Bit manipulation instructions................ 27 Block data transfer instructions ............ 31 Branch instructions ............................... 29 Data transfer instructions...................... 23 Logic operations instructions................ 26 Shift instructions................................... 26 System control instructions................... 30 Internal power supply step-down circuit .................................... 371 Interrupt Internal interrupts ................................. 59 Interrupt response time ......................... 60 IRQ3 to IRQ0 interrupts ....................... 57 NMI interrupt........................................ 57 WKP5 to WKP0 interrupts ................... 58 Interrupt mask bit ..................................... 18 L Large current ports...................................... 2 Low-voltage detection circuit ................. 361 Rev.5.00 Nov. 02, 2005 Page 498 of 500 REJ09B0027-0500 LVDI....................................................... 367 LVDI (interrupt by low voltage detect) circuit.............................. 367 LVDR ..................................................... 366 LVDR (reset by low voltage detect) circuit.............................. 366 M Memory map............................................. 12 Module standby function .......................... 87 O On-board programming modes ................. 95 Operation field .......................................... 32 P Package ....................................................... 2 Package dimensions................................ 488 Pin arrangement .......................................... 5 Power-down modes................................... 75 Sleep mode............................................ 84 Standby mode ....................................... 84 Subactive mode..................................... 85 Subsleep mode ...................................... 84 Power-on reset ........................................ 361 Power-on reset circuit ............................. 365 Product code lineup ................................ 486 Program counter (PC) ............................... 17 R Realtime clock (RTC) ............................. 141 Data reading procedure ....................... 151 Initial setting procedure ...................... 150 Register ABRKCR...................... 64, 378, 384, 388 ABRKSR ...................... 65, 378, 384, 388 ADCR ......................... 342, 377, 384, 388 ADCSR....................... 341, 377, 384, 388 ADDRA ...................... 340, 377, 383, 388 ADDRB ...................... 340, 377, 384, 388 ADDRC ...................... 340, 377, 384, 388 ADDRD ...................... 340, 377, 384, 388 BARH ........................... 65, 378, 384, 388 BARL ........................... 65, 378, 384, 388 BDRH ........................... 66, 378, 384, 388 BDRL ........................... 66, 378, 384, 388 BRR ............................ 269, 377, 383, 388 EBR1 ............................ 93, 376, 383, 387 EKR ............................ 351, 380, 385, 390 FENR............................ 94, 376, 383, 387 FLMCR1....................... 91, 376, 383, 387 FLMCR2....................... 92, 376, 383, 387 FLPWCR ...................... 94, 376, 383, 387 GRA............................ 190, 374, 381, 386 GRB............................ 190, 374, 381, 386 GRC............................ 190, 374, 381, 386 GRD............................ 190, 374, 381, 386 ICCR1......................... 306, 376, 382, 387 ICCR2......................... 308, 376, 382, 387 ICDRR........................ 317, 376, 383, 387 ICDRS ................................................ 317 ICDRT ........................ 317, 376, 383, 387 ICIER.......................... 311, 376, 383, 387 ICMR.......................... 309, 376, 382, 387 ICSR ........................... 313, 376, 383, 387 IEGR1........................... 50, 379, 385, 389 IEGR2........................... 51, 379, 385, 389 IENR1........................... 52, 379, 385, 389 IENR2........................... 53, 379, 385, 389 IRR1 ............................. 53, 379, 385, 389 IRR2 ............................. 55, 379, 385, 389 IWPR ............................ 55, 379, 385, 389 LVDCR....................... 362, 375, 382, 387 LVDSR ....................... 364, 375, 382, 387 MSTCR1....................... 79, 379, 385, 389 MSTCR2....................... 80, 379, 385, 389 PCR1........................... 111, 379, 385, 389 PCR2........................... 115, 379, 385, 389 PCR3........................... 119, 379, 385, 389 PCR5........................... 124, 379, 385, 389 PCR6........................... 128, 379, 385, 389 PCR7........................... 134, 379, 385, 389 PCR8........................... 137, 379, 385, 389 PDR1........................... 111, 378, 384, 388 PDR2........................... 116, 378, 384, 389 PDR3........................... 120, 378, 384, 389 PDR5........................... 124, 378, 384, 389 PDR6........................... 129, 378, 384, 389 PDR7........................... 135, 378, 384, 389 PDR8........................... 137, 378, 385, 389 PDRB .......................... 139, 379, 385, 389 PMR1 .......................... 110, 379, 385, 389 PMR3 .......................... 116, 379, 385, 389 PMR5 .......................... 123, 379, 385, 389 POCR .......................... 197, 374, 381, 386 PUCR1 ........................ 112, 378, 384, 388 PUCR5 ........................ 125, 378, 384, 388 PWCR ......................... 256, 377, 384, 388 PWDRL ...................... 257, 377, 384, 388 PWDRU ...................... 257, 377, 384, 388 RDR ............................ 263, 377, 383, 388 RHRDR....................... 145, 375, 382, 387 RMINDR .................... 144, 375, 382, 387 RSECDR..................... 143, 375, 382, 386 RSR..................................................... 263 RTCCR1 ..................... 147, 375, 382, 387 RTCCR2 ..................... 148, 375, 382, 387 RTCCSR ..................... 149, 375, 382, 387 RWKDR...................... 146, 375, 382, 387 SAR............................. 316, 376, 383, 387 SCR3........................... 265, 377, 383, 388 SMR ............................ 264, 377, 383, 388 SSR ............................. 267, 377, 383, 388 SYSCR1........................ 76, 379, 385, 389 SYSCR2........................ 78, 379, 385, 389 TCB1........................... 155, 376, 383, 387 Rev.5.00 Nov. 02, 2005 Page 499 of 500 REJ09B0027-0500 TCNT...........................189, 374, 381, 386 TCNTV........................161, 377, 383, 388 TCORA .......................161, 377, 383, 388 TCORB........................161, 377, 383, 388 TCR .............................191, 374, 381, 386 TCRV0 ........................162, 376, 383, 387 TCRV1 ........................165, 377, 383, 388 TCSRV ........................164, 376, 383, 387 TCSRWD ....................252, 378, 384, 388 TCWD .........................253, 378, 384, 388 TDR .............................263, 377, 383, 388 TFCR ...........................185, 375, 382, 386 TIER ............................196, 374, 381, 386 TIORA.........................192, 374, 381, 386 TIORC .........................193, 374, 381, 386 TLB1 .................................................. 156 TMB1 ..........................155, 376, 383, 387 TMDR .........................183, 375, 382, 386 TMWD ........................253, 378, 384, 388 TOCR ..........................188, 375, 382, 386 TOER...........................187, 375, 382, 386 TPMR ..........................184, 375, 382, 386 TSR..............................194, 374, 381, 386 TSTR ...........................182, 375, 382, 386 Register field ............................................ 32 Framing error ...................................... 280 Multiprocessor communication function ............................................... 292 Overrun error ...................................... 280 Parity error .......................................... 280 Stacked-structure cross-sectional view of H8/3687N .................................. 491 Stack pointer (SP) ..................................... 17 T Timer B1................................................. 153 Auto-reload timer operation................ 156 Event counter operation ...................... 157 Interval timer operation....................... 156 Timer V................................................... 159 Timer Z ................................................... 175 Buffer operation.................................. 230 Complementary PWM mode .............. 221 Input capture function ......................... 207 PWM mode ......................................... 211 Reset synchronous PWM mode .......... 217 Synchronous operation........................ 210 Waveform output by compare match.................................... 203 S V Serial communication interface 3 (SCI3) ..................................................... 259 Asynchronous mode ........................... 276 Bit rate ................................................ 269 Break .................................................. 300 Clocked synchronous mode................ 284 Vector address........................................... 48 Rev.5.00 Nov. 02, 2005 Page 500 of 500 REJ09B0027-0500 W Watchdog timer....................................... 251 Renesas 16-Bit Single-Chip Microcomputer Hardware Manual H8/3687 Group Publication Date: 1st Edition, Jul, 2001 Rev.5.00, Nov. 02, 2005 Published by: Sales Strategic Planning Div. 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