Burr-Brown INA170 High-side, bidirectional current shunt monitor Datasheet

INA170
SBOS193D – MARCH 2001 – REVISED JANUARY 2006
High-Side, Bidirectional
CURRENT SHUNT MONITOR
FEATURES
DESCRIPTION
● COMPLETE BIDIRECTIONAL CURRENT
MEASUREMENT CIRCUIT
● WIDE SUPPLY RANGE: 2.7V to 40V
● SUPPLY-INDEPENDENT COMMON-MODE
VOLTAGE: 2.7V TO 60V
● RESISTOR PROGRAMMABLE GAIN SET
● LOW QUIESCENT CURRENT: 75µA (typ)
● MSOP-8 PACKAGE
The INA170 is a high-side, bidirectional current shunt monitor featuring a wide input common-mode voltage range, low
quiescent current, and a tiny MSOP-8 package.
Bidirectional current measurement is accomplished by output offsetting. The offset voltage level is set with an external
resistor and voltage reference. This permits measurement of
a bidirectional shunt current while using a single supply for
the INA170.
Input common-mode and power-supply voltages are independent. Input voltage can range from +2.7V to +60V on any
supply voltage from +2.7V to +40V. Low 10µA input bias
current adds minimal error to the shunt current.
APPLICATIONS
● CURRENT SHUNT MEASUREMENT:
Automotive, Telephone, Computers, Power
Systems, Test, General Instrumentation
● PORTABLE AND BATTERY-BACKUP
SYSTEMS
● BATTERY CHARGERS
● POWER MANAGEMENT
● CELL PHONES
The INA170 converts a differential input voltage to a current
output. This current develops a voltage across an external
load resistor, setting any gain from 1 to over 100.
The INA170 is available in an MSOP-8 package, and is
specified over the extended industrial temperature range,
–40°C to +85°C with operation from –55°C to +125°C.
V+
VSUPPLY
8
+
VIN
IS
RS
RG1
1kΩ
2
–
VIN
RG2
1kΩ
1
VREF
Q1
6
OUT
3
Load
A2
ROS
A1
Q2
RL
INA170
5
GND
ROS
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2001-2006, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to GND ................................................. –0.3V to 40V
Analog Inputs, Common Mode(2) ......................................... –0.3V to 75V
+
–
Differential (VIN
) – (VIN
) .................................. –40V to 2V
Analog Output, Out(2) ........................................................... –0.3V to 40V
Input Current Into Any Pin ............................................................... 10mA
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) The input voltage at any pin may exceed the voltage shown if the current
at that pin is limited to 10mA.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
INA170EA
MSOP-8
DGK
–40°C to +85°C
INA170EA
INA170EA/250
Tape and Reel, 250
"
"
"
"
INA170EA/2K5
Tape and Reel, 2500
"
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com.
PIN CONFIGURATION
PIN DESCRIPTION
TOP VIEW
2
MSOP
–
VIN
1
8
V+
+
VIN
2
7
NC
VREF
3
6
OUT
GND
4
5
ROS
PIN
DESIGNATOR
1
2
3
4
5
6
7
8
–
VIN
+
VIN
VREF
GND
ROS
OUT
NC
V+
DESCRIPTION
Inverting Input
Noninverting Input
Reference Voltage Input
Ground
Offset Resistor
Output
No Connection
Supply Voltage
INA170
www.ti.com
SBOS193D
ELECTRICAL CHARACTERISTICS
+ = 12V, R
At TA = –40°C to +85°C, VS = 5V, VIN
OUT = 25kΩ, unless otherwise noted.
INA170EA
PARAMETER
INPUT
Full-Scale Sense (Input) Voltage
Common-Mode Input Range
Common-Mode Rejection
Offset Voltage(1) RTI
vs Temperature
vs Power Supply
Input Bias Current
OFFSETTING AMPLIFIER
Offsetting Equation
Input Voltage
Input Offset Voltage
vs Temperature
Programming Current through ROS
Input Impedance
Input Bias Current
OUTPUT
Transconductance
vs Temperature
Nonlinearity Error
Total Output Error
Output Impedance
Voltage Output
Swing to Power Supply, V+
Swing to Common Mode, VCM
FREQUENCY RESPONSE
Bandwidth
Settling Time (0.1%)
NOISE
Output-Current Noise Density
Total Output-Current Noise
POWER SUPPLY
Operating Range
Quiescent Current
CONDITION
MIN
+ – V–
VSENSE = VIN
IN
+ = +2.7V to +60V, V
VIN
SENSE = 50mV
+2.7
100
TMIN to TMAX
V+ = +2.7V to +60V, VSENSE = 50mV
+ , V–
VIN
IN
TYP
MAX
UNITS
100
500
+60
mV
V
dB
mV
µV/°C
µV/V
uA
120
±0.2
1
0.1
10
±1
10
VOS = (RL/ROS) VREF
1
±0.2
10
TMIN to TMAX
0
VS – 1
±1
1
1010 || 4
+10
+ , V–
VIN
IN
VSENSE = 10mV to 150mV
VSENSE = 100mV
VSENSE = 10mV to 150mV
VSENSE = 100mV
0.990
1
50
±0.01
±0.5
1 || 5
1.01
(V+) – 0.9
VCM – 0.6
(V+) – 1.2
VCM – 1.0
±0.1
±2
V
mV
µV/°C
mA
Ω || pF
nA
mA/V
nA/°C
%
%
GΩ || pF
V
V
ROUT = 10kΩ
5V Step, ROUT = 10kΩ
400
3
kHz
µs
BW = 100kHz
20
7
pA/√Hz
nA RMS
V+
VSENSE = 0, IO = 0
TEMPERATURE RANGE
Specification, TMIN to TMAX
Operating
Storage
Thermal Resistance, θJA
+2.7
75
–40
–55
–65
150
+40
125
V
µA
+85
+125
+150
°C
°C
°C
°C/W
NOTE: (1) Defined as the amount of input voltage, VSENSE, to drive the output to zero.
INA170
SBOS193D
www.ti.com
3
TYPICAL CHARACTERISTICS
+ = 12V, R = 25kΩ, unless otherwise noted.
At TA = +25°C, V+ = 5V, VIN
L
COMMON-MODE REJECTION vs FREQUENCY
GAIN vs FREQUENCY
40
120
Common-Mode Rejection (dB)
RL = 100kΩ
30
RL = 10kΩ
Gain (dB)
20
10
RL = 1kΩ
0
–10
–20
G = 100
100
80
G = 10
60
G=1
40
20
0
100
10k
1k
100k
10M
1M
0.1
10
1
Frequency (Hz)
100
5
+ – V– )
VIN = (VIN
IN
120
Total Output Error (%)
Power-Supply Rejection (dB)
–55°C
G = 100
100
G = 10
80
G=1
60
0
+150°C
–5
+25°C
–10
40
–15
20
1
100
1k
Frequency (Hz)
10
10k
0
100k
25
50
75
100
125
150
200
VIN (mV)
TOTAL OUTPUT ERROR
vs POWER-SUPPLY VOLTAGE
QUIESCENT CURRENT
vs POWER-SUPPLY VOLTAGE
2
100
Output error is essentially
independent of both
V+ supply voltage and
input common-mode voltage.
1
+150°
Quiescent Current (µA)
Total Output Error (%)
100k
TOTAL OUTPUT ERROR vs VIN
POWER-SUPPLY REJECTION vs FREQUENCY
140
G=1
0
G = 10
G = 25
–1
–2
+125°
80
60
+25°
–55°
40
20
0
0
10
20
30
0
40
Power-Supply Voltage (V)
4
10k
1k
Frequency (Hz)
10
20
30
40
Power-Supply Voltage (V)
INA170
www.ti.com
SBOS193D
TYPICAL CHARACTERISTICS (Cont.)
+ = 12V, R = 25kΩ, unless otherwise noted.
At TA = +25°C, V+ = 5V, VIN
L
STEP RESPONSE
STEP RESPONSE
1.5V
1V
G = 100
G = 50
0.5V
0V
1V
2V
G = 100
G = 10
0V
0V
20µs/div
10µs/div
INA170
SBOS193D
www.ti.com
5
OPERATION
Figure 1 shows the basic circuit diagram for the INA170.
Load current IS is drawn from supply VS through shunt
resistor RS. The voltage drop in shunt resistor VS is forced
across RG1 by the internal op-amp, causing current to flow
into the collector of Q1. External resistor RL converts the
output current to a voltage, VOUT, at the OUT pin.
Without offset, the transfer function for the INA170 is:
+ – V–)
IO = gm (VIN
IN
(1)
where gm = 1000µA/V
(2)
+ – V – ), is
In the circuit of Figure 1, the input voltage, (VIN
IN
equal to IS • RS and the output voltage, VOUT, is equal to
IO • RL. The transconductance, gm, of the INA170 is
1000µA/V. The complete transfer function for the current
measurement amplifier in this application is:
VOUT = (IS) (RS) (1000µA/V) (RL)
(3)
Applying a positive reference voltage to pin 3 causes a
current to flow through ROS, forcing output current IO to be
offset from zero. The transfer function then becomes:
 V • R L   IS • RS • R L 
VOUT =  REF
±

1kΩ
 R OS  
(4)
The maximum differential input voltage for accurate measurements is 0.5V, which produces a 500µA output current.
A differential input voltage of up to 2V will not cause
damage. Differential measurements (pins 1 and 2) can be
bipolar with a more-positive voltage applied to pin 2. If a
more-negative voltage is applied to pin 1, output current IO
will decrease towards zero.
BASIC CONNECTION
Figure 1 shows the basic connection of the INA170. The
+ and V – , should be connected as closely as
input pins, VIN
IN
possible to the shunt resistor to minimize any resistance in
series with the shunt resistance. The output resistor, RL, is
shown connected between pin 6 and ground. Best accuracy
is achieved with the output voltage measured directly across
RL. This is especially important in high-current systems
where load current could flow in the ground connections,
affecting the measurement accuracy.
No power-supply bypass capacitors are required for stability
of the INA170. However, applications with noisy or high
impedance power supplies may require de-coupling capacitors to reject power-supply noise. Connect bypass capacitors
close to the device pins.
POWER SUPPLIES
The input circuitry of the INA170 can accurately measure
beyond its power-supply voltage, V+. For example, the V+
power supply can be 5V, while the load power-supply
voltage (INA170 input voltage) is up to +60V. However, the
output-voltage range of the OUT terminal (pin 6) is limited
by the supply.
SELECTING RS AND RL
The value chosen for the shunt resistor, RS, depends on the
application and is a compromise between small-signal accuracy and maximum permissible voltage loss in the measurement line. High values of RS provide better accuracy at lower
VP
Load Power Supply
+2.7 to 60V
V+ power can be
common or
independent of
load supply.
Shunt
RS
+
VIN
IS
–
VIN
1
2
Load
V+
INA170
RG1
1kΩ
2.7 ≤ (V+) ≤ 40V
RG2
1kΩ
8
VOLTAGE GAIN
EXACT RL (Ω)
NEAREST 1% RL (Ω)
1
1k
1k
2
2k
2k
5
5k
4.99k
10
10k
10k
20
20k
20k
50
50k
49k
100
100k
100k
VREF
3
Q2
5
Q1
4
ROS
OUT
6
+
I0
RL
VO
–
FIGURE 1. Basic Circuit Connections.
6
INA170
www.ti.com
SBOS193D
currents by minimizing the effects of offset, while low values
of RS minimize voltage loss in the supply line. For most
applications, best performance is attained with an RS value
that provides a full-scale shunt voltage of 50mV to 100mV.
Maximum input voltage for accurate measurements is 500mV.
RL is chosen to provide the desired full-scale output voltage.
The output impedance of the INA170 Out terminal is very
high which permits using values of RL up to 100kΩ with
excellent accuracy. The input impedance of any additional
circuitry at the output should be much higher than the value
of RL to avoid degrading accuracy.
output swing. The maximum output voltage compliance is
limited by the lower of the two equations below:
Vout
+ – V–)
= (V+) – 0.7V – (VIN
IN
max
(5)
or
Vout
max
– – 0.5V
= VIN
(6)
(whichever is lower)
BANDWIDTH
Measurement bandwidth is affected by the value of the load
resistor, RL. High gain produced by high values of RL will
yield a narrower measurement bandwidth (see Typical Characteristic Curves). For widest possible bandwidth, keep the
capacitive load on the output to a minimum.
If bandwidth limiting (filtering) is desired, a capacitor can be
added to the output, as shown in Figure 3. This will not
cause instability.
Some Analog-to-Digital (A/D) converters have input impedances that will significantly affect measurement gain. The
input impedance of the A/D converter can be included as
part of the effective RL if its input can be modeled as a
resistor to ground. Alternatively, an op-amp can be used to
buffer the A/D converter input, as shown in Figure 2. See
Figure 1 for recommended values of RL.
IS
2
1
1
2
f–3dB
INA170
INA170
ZIN
OPA340
6
4
1
f–3dB =
2πRLCL
6
4
RL
VO
RL
CL
Buffer of amp drives A/D converter
without affecting gain.
FIGURE 2. Buffering Output to Drive A/D Converter.
FIGURE 3. Output Filter.
OUTPUT VOLTAGE RANGE
APPLICATIONS
The INA170 is designed for current shunt measurement
circuits as shown in Figure 1, but its basic function is useful
in a wide range of circuitry. A creative engineer will find
many unforeseen uses in measurement and level shifting
circuits.
The output of the INA170 is a current, which is converted to
a voltage by the load resistor, RL. The output current remains
accurate within the compliance voltage range of the output
circuitry. The shunt voltage and the input common-mode
and power supply voltages limit the maximum possible
IS
1
2
Gain Set by RL
INA170
VREF
6
3
5
4
ROS
V0
Output Offset Current =
VREF
ROS
Output Offset Voltage =
VREF
• RL
ROS
RL
FIGURE 4. Offsetting the Output Voltage.
INA170
SBOS193D
www.ti.com
7
IS = ±10A
0.0125Ω
+5V
Load
28V
0.1µF
∆V =
±125mV
Full-Scale
8
1
2
V+
–
VIN
IO = 125µA ± 125µA
+
VIN
6
INA170
IOS = 125µA
OUT
3
+2.5V
RL
10kΩ
VREF
ROS
VOUT = 0 to +2.5V Full-Scale
GND
5
4
20kΩ
FIGURE 5. Bipolar Current Measurement.
8
INA170
www.ti.com
SBOS193D
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
INA170EA/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
INA170EA/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
INA170EA/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
INA170EA/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
INA170EA/250
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
INA170EA/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA170EA/250
VSSOP
DGK
INA170EA/2K5
VSSOP
DGK
8
250
366.0
364.0
50.0
8
2500
366.0
364.0
50.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Similar pages