MC74LCX244 Low-Voltage CMOS Octal Buffer With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting) www.onsemi.com The MC74LCX244 is a high performance, non−inverting octal buffer operating from a 2.3 to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX244 inputs to be safely driven from 5 V devices. The MC74LCX244 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OE) input, when HIGH, disables the output by placing them in a HIGH Z condition. SOIC−20 WB DW SUFFIX CASE 751D TSSOP−20 DT SUFFIX CASE 948E QFN20 MN SUFFIX CASES 485AA & 485CB MARKING DIAGRAMS 20 Features • • • • • • • • • • • • Designed for 2.3 to 5.5 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: ♦ Human Body Model >2000 V ♦ Machine Model >200 V NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant LCX244 AWLYYWWG 1 SOIC−20 WB 20 LCX 244 ALYW G G 1 TSSOP−20 1 1 LCX 244 ALYWG G 244 ALYWG G QFN20 − 485AA QFN20 − 485CB A L, WL Y, YY W, WW G or G = = = = = Assembly Location Wafer Lot Year Work Week Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2016 January, 2016 − Rev. 19 1 See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: MC74LCX244/D MC74LCX244 VCC 2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3 20 19 18 17 16 15 14 13 12 11 1OE 1D0 1D1 1 2 3 4 5 6 7 8 9 10 1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND 1D2 1D3 19 1 2 18 4 16 6 14 8 12 1O0 1O1 1O2 1O3 12 11 20 QFN PIN #1 2OE 19 10 2D0 2 9 2D1 17 3 15 5 13 7 11 9 2O0 2O1 Figure 1. Pinouts: 20−Lead (Top View) 2D2 PIN NAMES PINS FUNCTION 2D3 nOE Output Enable Inputs 1Dn, 2Dn Data Inputs 1On, 2On 3−State Outputs 1OE 2OE OUTPUTS 1Dn 2Dn 1On, 2On L L L L H H H X Z 2O3 Figure 2. Logic Diagram TRUTH TABLE INPUTS 2O2 H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs www.onsemi.com 2 MC74LCX244 MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage Condition Units −0.5 to +7.0 V V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin TSTG Storage Temperature Range ±100 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TL = 260 °C TJ Junction Temperature Under Bias TJ = 150 °C qJA Thermal Resistance (Note 2) qJA = 140 °C/W MSL Moisture Sensitivity Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Typ Max 2.0 1.5 2.5, 3.3 2.5, 3.3 5.5 5.5 V VI Input Voltage 0 5.5 VO Output Voltage HIGH or LOW State 3−State 0 0 VCC 5.5 IOH IOL TA Dt/DV Units V V HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V −24 −12 mA LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V 24 12 mA Operating Free−Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V −55 +125 °C 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 MC74LCX244 DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol VIH Characteristic HIGH Level Input Voltage (Note 3) VIL LOW Level Input Voltage (Note 3) VOH HIGH Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V VOL LOW Level Output Voltage IOZ 3−State Output Current IOFF Power Off Leakage Current Units V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 V VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 5.5 V ±5 mA VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 mA ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA DICC Increase in ICC per Input Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) Limits TA = −55°C to +125°C VCC = 3.0 V to 3.6 V CL = 50 pF Symbol Parameter VCC = 2.5 V ± 0.2 VCC = 2.7 V CL = 50 pF CL = 30 pF Waveform Min Max Min Max Min Max Units tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 6.5 6.5 1.5 1.5 7.5 7.5 1.5 1.5 7.8 7.8 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 8.0 8.0 1.5 1.5 9.0 9.0 1.5 1.5 10 10 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 7.0 7.0 1.5 1.5 8.0 8.0 1.5 1.5 8.4 8.4 ns tOSHL tOSLH Output−to−Output Skew (Note 4) 1.0 1.0 ns 4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Units VOLP Dynamic LOW Peak Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 5. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. www.onsemi.com 4 MC74LCX244 CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units VCC = 3.3 V, VI = 0 V or VCC 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance VCC Vmi 1Dn, 2Dn Vmi 0V tPLH tPHL VOH Vmo 1On, 2On Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Vmi 1OE, 2OE Vmi 0V tPZH tPHZ VCC VOH - 0.3 V Vmo 1On, 2On ≈0V tPZL tPLZ ≈ 3.0 V Vmo 1On, 2On VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VLZ VOH − 0.3 V VOH − 0.3 V VOH − 015 V www.onsemi.com 5 MC74LCX244 VCC PULSE GENERATOR DUT RT CL RL TEST SWITCH tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 ± 0.3 V 6 V at VCC = 2.5 ± 0.2 V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND CL = CL = RL = RT = 6V OPEN GND R1 50 pF at VCC = 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† MC74LCX244DWG SOIC−20 WB (Pb−Free) 38 Units / Rail MC74LCX244DWR2G SOIC−20 WB (Pb−Free) 1000 / Tape & Reel MC74LCX244DTG TSSOP−20 (Pb−Free) 75 Units / Rail MC74LCX244DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel NLV74LCX244DTR2G* TSSOP−20 (Pb−Free) 2500 / Tape & Reel MC74LCX244MNTWG QFN20, 2.5x4.5 (Pb−Free) 3000 / Tape & Reel MC74LCX244MN2TWG (In Development) QFN20, 2.5x3.5 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable www.onsemi.com 6 MC74LCX244 PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE G q A 20 X 45 _ h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE C T www.onsemi.com 7 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74LCX244 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X 0.10 (0.004) S L/2 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K REF 20 M T U S V K K1 S J J1 11 B −U− L PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 ----C 1.20 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 MC74LCX244 PACKAGE DIMENSIONS QFN20, 2.5x4.5 MM CASE 485AA ISSUE B D A ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. B DIM A A1 A3 b D D2 E E2 e K L E 2X 0.15 C 2X 0.15 C TOP VIEW 0.10 C A 20X 0.08 C (A3) A1 SIDE VIEW C SEATING PLANE D2 e 11 20X L 9 12 e E2 20X b 0.10 C A B 0.05 C NOTE 3 19 2 1 20 20X K BOTTOM VIEW www.onsemi.com 9 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 4.50 BSC 2.85 3.15 0.50 BSC 0.20 --0.35 0.45 MC74LCX244 PACKAGE DIMENSIONS QFN20, 2.5x3.5, 0.4P CASE 485CB ISSUE O PIN ONE REFERENCE L B ÉÉÉ ÉÉÉ ÉÉÉ 2X DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E DIM A A1 A3 b D D2 E E2 e L L1 ÇÇÇ ÉÉÉ ÉÉÉ EXPOSED Cu 0.15 C L L1 0.15 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A D TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A DETAIL B MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 2.50 BSC 0.90 1.10 3.50 BSC 2.00 2.20 0.40 BSC 0.35 0.45 --0.15 (A3) 0.10 C A1 0.08 C NOTE 4 C SIDE VIEW SEATING PLANE SOLDERING FOOTPRINT* 3.80 0.10 C A B 2.24 D2 20X PACKAGE OUTLINE L 9 12 0.10 C A B DETAIL A 20X 2.80 1.14 E2 1 20X 2 19 1 0.63 b 0.10 C A B 0.05 C 0.40 PITCH NOTE 3 20X 0.25 DIMENSIONS: MILLIMETERS e *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. e/2 BOTTOM VIEW ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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