CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 1/6 1.0Amp. Surface Mount Schottky Barrier Diodes CSOD5819AS2 Features For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 RoHS compliant package Mechanical Data Case: Molded plastic, JEDEC SOD-323. Terminals: Pure tin plated, Solderable per MIL-STD-750 method 2026 Polarity: Indicated by cathode band. Weight: 4.507 mg approximately Symbol Outline CSOD58XXAS2 2 (Anode) SOD-323 Ordering Information Device Package SOD-323 CSOD5819AS2-0-T1-G (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs/ tape & reel in 7” reel Product rank, zero for no rank products Product name CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 2/6 Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified.) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=40V,TJ=25℃(Note 1) VR=40V,TJ=125℃(Note 1) Power Dissipation Maximum thermal resistance, Junction to ambient Diode junction capacitance @ f=1MHz and applied 5V reverse voltage Storage temperature range Operating temperature range Symbol Limits Units VRRM VRMS VR VF IO 40 28 40 0.5 1 V V V V A IFSM 15 A IR 0.3 10 PD Rth,JA CD Tstg TJ 250 500(typ) 55 (typ) -65 ~ +175 -50 ~ +150 mA mA mW ℃/W pF ℃ ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle Recommended Footprint mm inch CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 3/6 Characteristic Curves CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. CSOD5817-5819S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062S2 Issued Date : 2016.08.01 Revised Date : Page No. : 6/6 SOD-323 Dimension Marking: K A XX 5H 1 2 B D Style: Pin 1.Cathode 2.Anode J H E C 2-Lead SOD-323 Plastic Surface Mounted Package CYStek Package Code: S2 Type Marking Code CSOD5819AS2 S4 Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSOD5817-5819S2 CYStek Product Specification