MC74LCX258 Low-Voltage CMOS Quad 2-Input Multiplexer With 5 V−Tolerant Inputs and Outputs (3−State, Inverting) http://onsemi.com The MC74LCX258 is a high performance, quad 2−input inverting multiplexer with 3−state outputs operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX258 inputs to be safely driven from 5 V devices. Four bits of data from two sources can be selected using the Select input. The four outputs present the selected data in the inverted form. The outputs may be switched to a high impedance state by placing a logic HIGH on the Output Enable (OE) input. Current drive capability is 24 mA at the outputs. MARKING DIAGRAMS 16 SOIC−16 D SUFFIX CASE 751B 16 1 1 16 Features • • • • • • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V TTL Compatible CMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in all Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: ♦ Human Body Model >2000 V ♦ Machine Model >200 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 8 1 LCX258G AWLYWW 16 1 LCX 258 ALYWG G TSSOP−16 DT SUFFIX CASE 948F 1 A WL, L Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Publication Order Number: MC74LCX258/D MC74LCX258 VCC OE A3 B3 Y3 A2 B2 Y2 16 15 14 13 12 11 10 9 1 S 2 A0 3 B0 4 5 Y0 A1 6 B1 PIN NAMES 7 8 Y1 GND Pins Function An Source 0 Data Inputs Bn Source B Data Inputs OE Enable Input S Select Input Yn Outputs Figure 1. Pinout: 16−Lead Plastic Package (Top View) TRUTH TABLE Inputs Outputs Output Enable Select Y0−Y3 H X Z L L A0−A3 L H B0−B3 X = Don’t Care A0−A3, B0−B3 = The levels of the respective Data−Word Inputs PIN DESCRIPTIONS INPUTS OUTPUTS A0−A3 (Pins 2, 5, 11, 14) Y0−Y3 (Pins 4, 7, 9, 12) Nibble A inputs. The data present on these pins is transferred to the outputs when the Select input is at a low level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX258. Data outputs. The selected input nibble is presented at these outputs when the Output Enable input is at a low level. The data present on these pins is in its inverted form for the LCX258. For the Output Enable input at a high level, the outputs are at a high level for the LCX258. B0−B3 (Pins 3, 6, 10, 13) Nibble B inputs. The data present on these pins is transferred to the outputs when the Select input is at a high level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX258. Select (Pin 1) Nibble select. This input determines the data word to be transferred to the outputs. A low level on this input selects the A inputs and a high level selects the B inputs. CONTROL INPUTS Output Enable (Pin 15) Output Enable input. A low level on this input allows the selected data to be presented at the outputs. A high level on this input sets all of the outputs to 3−state off. http://onsemi.com 2 MC74LCX258 A0 B0 A1 Nibble Inputs B1 A2 B2 A3 B3 Select Output Enable 2 4 3 Y0 5 7 6 Y1 Data Outputs 11 9 10 Y2 14 12 13 1 15 Figure 2. Expanded Logic Diagram http://onsemi.com 3 Y3 MC74LCX258 MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Condition Units −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ VCC + 0.5 Note 1 V −50 VI < GND mA −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range MSL Moisture Sensitivity −65 to +150 °C Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Output in HIGH or LOW State. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Typ Max 2.0 1.5 2.3 to 3.3 3.6 3.6 VI Input Voltage 0 5.5 0 VCC VO Output Voltage (HIGH or LOW State) IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V Units V V V mA mA −40 +85 °C 0 10 ns/V ORDERING INFORMATION Package Shipping† MC74LCX258DR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel MC74LCX258DTG TSSOP−16 (Pb−Free) 96 Units / Rail MC74LCX258DTR2G TSSOP−16 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74LCX258 DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min 1.7 2.0 2.0 Max Units VIH Minimum HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.0 V 3.0 V ≤ VCC ≤ 3.6 V V VIL Maximum LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.0 V 3.0 V ≤ VCC ≤ 3.6 V VOH Minimum HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA VCC = 2.3 V; IOH = −8 mA VCC = 2.7 V; IOH = −12 mA VCC = 3.0 V; IOH = −18 mA VCC = 3.0 V; IOH = −24 mA VOL Maximum LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = 100 mA VCC = 2.3 V; IOH = 8 mA VCC = 2.7 V; IOH = 12 mA VCC = 3.0 V; IOH = 16 mA VCC = 3.0 V; IOH = 24 mA 0.2 0.7 0.4 0.4 0.55 V IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 5.5 V ±5 mA IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA 0.7 0.8 0.8 VCC − 0.2 1.7 2.2 2.4 2.2 V V IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 mA ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA 500 mA Increase in ICC per Input 2.3 V ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V DICC 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS Limits TA = −405C to +855C Symbol Parameter VCC = 3.0 V to 3.6 V VCC = 2.7 V CL = 50 pF CL = 50 pF VCC = 2.3 V to 2.7 V CL = 30 pF Min Max Min Max Min Max Units tPLH tPHL Propagation Delay A to B to Y 1.0 1.0 6.5 6.5 1.0 1.0 7.5 7.5 1.0 1.0 8.5 8.5 ns tPLH tPHL Propagation Delay S to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns tPZL tPZH Propagation Delay OE to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns tPLZ tPHZ Propagation Delay OE to Y 1.0 1.0 6.0 6.0 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 ns tOSHL tOSLH Output−to−Output Skew 1.0 1.0 ns DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP Characteristic Dynamic LOW Peak Voltage (Note 3) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V Min Typ 0.8 Max Units V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Typical Units Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF CIN Parameter Condition http://onsemi.com 5 MC74LCX258 2.7 V 1.5 V A, B, S 1.5V 0V tPHL tPLH VOH Yn 1.5 V 1.5 V VOL WAVEFORM 1 − NONINVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V 1.5 V S 0V tPHL tPLH VOH Yn 1.5 V 1.5 V VOL WAVEFORM 2 − INVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V 1.5 V OE 0V tPZH tPHZ VCC VOH − 0.3 V 1.5 V Yn ≈ 0V tPZL Yn tPLZ ≈ 3.0 V 1.5 V VOL + 0.3 V GND WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms http://onsemi.com 6 MC74LCX258 VCC PULSE GENERATOR R1 DUT RT CL Test Switch tPLH, tPHL Open tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND RL CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 7 6V OPEN GND MC74LCX258 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 1 8 −B− P 8 PL 0.25 (0.010) B M S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74LCX258 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− N F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 −W− J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 9 MC74LCX258 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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