HIN230 thru HIN241 TM Data Sheet May 2000 +5V Powered RS-232 Transmitters/Receivers File Number 3138.7 Features • Meets All RS-232E and V.28 Specifications The HIN230-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply (except HIN231 and HIN239) and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The HIN233 and HIN235 require no external capacitors and are ideally suited for applications where circuit board space is critical. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). • Requires Only Single +5V Power Supply - (+5V and +12V - HIN231 and HIN239) • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps • HIN233 and HIN235 Require No External Capacitors • Onboard Voltage Doubler/Inverter • Low Power Consumption • Low Power Shutdown Function • Three-State TTL/CMOS Receiver Outputs • Multiple Drivers - ±10V Output Swing for 5V lnput - 300Ω Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/µs Maximum Slew Rate The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection. • Multiple Receivers - ±30V Input Voltage Range - 3kΩ to 7kΩ Input Impedance - 0.5V Hysteresis to Improve Noise Rejection Applications • Any System Requiring RS-232 Communication Ports - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems Selection Table PART NUMBER NUMBER OF RS-232 DRIVERS POWER SUPPLY VOLTAGE NUMBER OF RS-232 RECEIVERS EXTERNAL COMPONENTS LOW POWER SHUTDOWN/TTL THREE-STATE NUMBER OF LEADS HIN230 +5V 5 0 4 Capacitors Yes/No 20 HIN231 +5V and +7.5V to 13.2V 2 2 2 Capacitors No/No 16 HIN232 +5V 2 2 4 Capacitors No/No 16 HIN233 +5V 2 2 None No/No 20 HIN234 +5V 4 0 4 Capacitors No/No 16 HIN235 +5V 5 5 None Yes/Yes 24 HIN236 +5V 4 3 4 Capacitors Yes/Yes 24 HIN237 +5V 5 3 4 Capacitors No/No 24 HIN238 +5V 4 4 4 Capacitors No/No 24 HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors No/Yes 24 HIN240 +5V 5 5 4 Capacitors Yes/Yes 44 HIN241 +5V 4 5 4 Capacitors Yes/Yes 28 3-1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 HIN230 thru HIN241 Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE PART NUMBER PKG. NO. TEMP. RANGE (oC) PACKAGE PKG. NO. HIN230CB 0 to 70 20 Ld SOIC M20.3 HIN237CP 0 to 70 24 Ld PDIP E24.3 HIN230IB -40 to 85 20 Ld SOIC M20.3 HIN237CB 0 to 70 24 Ld SOIC M24.3 HIN231CB 0 to 70 16 Ld SOIC M16.3 HIN237IP -40 to 85 24 Ld PDIP E24.3 HIN231CP 0 to 70 14 Ld PDIP E14.3 HIN237IB -40 to 85 24 Ld SOIC M24.3 HIN231IB -40 to 85 16 Ld SOIC M16.3 HIN238CP 0 to 70 24 Ld PDIP E24.3 HIN231IP -40 to 85 14 Ld PDIP E14.3 HIN238CB 0 to 70 24 Ld SOIC M24.3 HIN232CP 0 to 70 16 Ld PDIP E16.3 HIN238IP -40 to 85 24 Ld PDIP E24.3 HIN232CB 0 to 70 16 Ld SOIC M16.3 HIN238IB -40 to 85 24 Ld SOIC M24.3 HIN232IP -40 to 85 16 Ld PDIP E16.3 HIN239CB 0 to 70 24 Ld SOIC M24.3 HIN232IB -40 to 85 16 Ld SOIC M16.3 HIN239CP 0 to 70 24 Ld PDIP E24.3 HIN233CP 0 to 70 20 Ld PDIP E20.3 HIN239IB -40 to 85 24 Ld SOIC M24.3 HIN234CB 0 to 70 16 Ld SOIC M16.3 HIN240CN 0 to 70 44 Ld MQFP Q44.10X10 HIN234IB -40 to 85 16 Ld SOIC M16.3 HIN240IN -40 to 85 44 Ld MQFP Q44.10X10 HIN235CP 0 to 70 24 Ld PDIP E24.6 HIN241CB 0 to 70 28 Ld SOIC M28.3 HIN236CP 0 to 70 24 Ld PDIP E24.3 HIN241IB -40 to 85 28 Ld SOIC M28.3 HIN236CB 0 to 70 24 Ld SOIC M24.3 HIN241CA 0 to 70 28 Ld SSOP M28.209 HIN236IP -40 to 85 24 Ld PDIP E24.3 HIN241IA -40 to 85 28 Ld SSOP M28.209 HIN236IB -40 to 85 24 Ld SOIC M24.3 NOTE: Many of the surface mount devices are available on tape and reel; add -T to suffix. Pin Descriptions PIN VCC FUNCTION Power Supply Input 5V ±10%. V+ Internally generated positive supply (+10V nominal), HIN231 and HIN239 require +7.5V to +13.2V. V- Internally generated negative supply (-10V nominal). GND Ground lead. Connect to 0V. C1+ External capacitor (+ terminal) is connected to this lead. C1- External capacitor (- terminal) is connected to this lead. C2+ External capacitor (+ terminal) is connected to this lead. C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead. TOUT RIN ROUT Transmitter Outputs. These are RS-232 levels (nominally ±10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high impedance state. SHUTDOWN Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. NC No Connect. No connections are made to these leads. 3-2 HIN230 thru HIN241 Pinouts HIN230 (SOIC) TOP VIEW HIN231 (SOIC) TOP VIEW T3OUT 1 T1OUT 2 20 T4OUT 19 T5IN T2OUT 3 18 NC T2IN 4 17 SHUTDOWN T1IN 5 GND 6 16 T5OUT 15 T4IN VCC 7 14 T3IN C1+ 8 13 V- V+ 9 12 C2- C1- 10 11 C2+ C+ 1 16 V+ (14) C- 2 15 VCC (13) V- 3 14 GND (12) T2OUT 4 13 T1OUT (11) R2IN 5 12 R1IN R2OUT 6 11 R1OUT (9) T2IN 7 10 T1IN NC 8 9 NC (10) (8) NOTE: Pin numbers in parentheses are for PDIP Package. +5V +5V 15 7 8 1µF 1µF T1IN T2IN T3IN T4IN T5IN + 10 VCC C1+ C1- 11 C2+ + 12 C2- +5V TO 10V VOLTAGE DOUBLER +5V 400kΩ T2 4 14 +5V 400kΩ T3 19 + VCC 1 +5V 400kΩ +5V 400kΩ V- 13 + +5V 400kΩ T1 5 15 V+ 9 1µF 1µF +10V TO -10V VOLTAGE INVERTER +7.5V TO +13.2V 2 3 + 2 C+ C- V+ +12V TO -12V VOLTAGE INVERTER V- 3 + 1µF T1OUT T1IN T2OUT T2IN +5V 400kΩ T1 10 +5V 400kΩ T2 7 13 4 11 1 16 1µF T1OUT T2OUT 12 R1IN R1OUT T3OUT 5kΩ R1 T4 20 T4OUT R2OUT 6 5 5kΩ R2 T5 16 17 T5OUT 14 SHUTDOWN 6 NOTE: SOIC pin numbers shown. 3-3 R2IN HIN230 thru HIN241 Pinouts (Continued) HIN232 (PDIP, SOIC) TOP VIEW C1+ 1 V+ 2 HIN233 (PDIP, SOIC) TOP VIEW 16 VCC T2IN 1 20 R2OUT 15 GND T1IN 2 19 R2IN R1OUT 3 18 T2OUT C1- 3 14 T1OUT C2+ 4 13 R1IN 12 R1OUT C2- 5 6 11 T1IN T2OUT 7 10 T2IN V- 9 R2OUT R2IN 8 R1IN 4 17 V- T1OUT 5 16 C2- GND 6 15 C2+ VCC 7 14 V+ (C1-) (V+) C1+ 8 13 C1- (C1+) GND 9 12 V- (C2+) (V-) C2- 10 11 C2+ (C2-) NOTE: Pin names in parentheses are for SOIC Package. +5V +5V + 1µF 16 + 0.1µF 6 1 1µF + 3 4 1µF T1IN T2IN + 5 VCC C1+ C1C2+ C2- +5V TO 10V VOLTAGE DOUBLER V+ 2 T1IN 2 400kΩ +5V 1 +10V TO -10V VOLTAGE INVERTER T1 11 +5V 400kΩ T2 10 +5V 400kΩ 14 1µF T1OUT 8 5kΩ R2 T2 18 T2OUT T2OUT R2IN 19 R2IN NO 13 (14) CONNECT INTERNAL -10V SUPPLY INTERNAL +10V SUPPLY 12 (10) 17 14 (8) R2 C1+ 5kΩ C1- C2+ 15 16 V- C2- VV+ C2+ 11 (12) C2GND 6 10 (11) GND 9 15 NOTE: Pin numbers in parentheses are for SOIC Package. 3-4 R1IN 5kΩ 20 8 (13) 5kΩ 9 T1OUT 4 R1 R1IN R1 5 3 13 R1OUT T1 R1OUT R2OUT 7 400kΩ T2IN V- 6 + 12 R2OUT + VCC +5V 1µF HIN230 thru HIN241 Pinouts (Continued) HIN234 (SOIC) TOP VIEW HIN235 (PDIP) TOP VIEW T1OUT 1 16 T3OUT T4OUT 1 24 R3IN T2OUT 2 15 T4OUT T3OUT 2 23 R3OUT 14 T4IN T1OUT 3 22 T5IN T2OUT 4 21 SHUTDOWN T2IN 3 T1IN 4 13 T3IN GND 5 12 V- VCC 6 11 C2- C1+ 7 10 C2+ V+ 8 9 C1- 20 EN R2IN 5 19 T5OUT R2OUT 6 T2IN 7 18 R4IN T1IN 8 17 R4OUT R1OUT 9 16 T4IN R1IN 10 15 T3IN GND 11 14 R5OUT VCC 12 13 R5IN +5V +5V 12 6 7 1µF 1µF T1IN T2IN T3IN + VCC C1+ 8 +5V TO 10V VOLTAGE DOUBLER V+ C1- 10 C2+ + 11 C2- +10V TO -10V VOLTAGE INVERTER V- 12 9 4 3 +5V 400kΩ +5V 400kΩ +5V 400kΩ 13 + VCC +5V T1IN + T1 1µF 1 T2IN 1µF T1OUT T4IN T2 2 T3IN T5IN T3 16 T3OUT R1OUT T1 8 400kΩ 7 +5V 400kΩ T2 15 +5V 400kΩ T3 16 +5V 400kΩ T4 22 +5V 400kΩ T5 T2OUT + 3 4 2 1 19 10 9 14 +5V 400kΩ T4 15 T4OUT R2OUT 5 6 23 T3OUT T4OUT T5OUT R1IN R2IN 24 R3OUT R3IN 5kΩ R3 17 18 R4OUT R4IN 5kΩ R4 14 13 R5OUT R5IN 20 5kΩ R5 21 EN SHUTDOWN GND 11 3-5 T2OUT 5kΩ R2 5 T1OUT 5kΩ R1 T4IN 0.1µF HIN230 thru HIN241 Pinouts (Continued) HIN236 (PDIP, SOIC) TOP VIEW HIN237 (PDIP, SOIC) TOP VIEW T3OUT 1 1 24 T4OUT T1OUT 24 T4OUT 23 R2IN T3OUT 2 T1OUT 2 23 R2IN T2OUT 3 22 R2OUT T2OUT 3 22 R2OUT R1IN 4 21 SHUTDOWN R1IN 4 21 T5IN R1OUT 5 20 EN R1OUT 5 20 T5OUT T2IN 6 19 T4IN T2IN 6 19 T4IN T1IN 7 18 T3IN T1IN 7 18 T3IN GND 8 17 R3OUT GND 8 17 R3OUT VCC 9 16 R3IN VCC 9 16 R3IN 15 V- C1+ 10 C1+ 10 14 C2- V+ 11 14 C2- C1- 12 13 C2+ C1- 12 13 C2+ +5V +5V 9 9 1µF 1µF T1IN T2IN T3IN T4IN 10 C1+ + 12 C113 C2+ + 14 C2- VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400kΩ T1 +5V 400kΩ T2 6 18 +5V 400kΩ T3 +5V 400kΩ + 2 3 1 1µF 1µF 1µF + 7 19 15 V- V+ 11 1µF T1OUT T2OUT T3OUT T4 24 5 T4OUT T1IN T2IN T3IN T4IN 4 R1IN R1OUT T5IN 5kΩ R1 22 10 C1+ + 12 C113 C2+ + 14 C2- V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400kΩ 7 T1 +5V 400kΩ T2 6 18 +5V 400kΩ T3 +5V 400kΩ 19 T4 +5V 400kΩ 21 T5 2 3 1 24 20 20 EN 21 8 16 R3IN R3OUT 5kΩ R3 8 3-6 T5OUT 5kΩ 17 SHUTDOWN T4OUT 23 R2 R3IN 5kΩ T3OUT R2IN 16 R3 T2OUT R1IN 22 R3OUT T1OUT 5kΩ R2OUT 17 1µF 4 R1 5kΩ + 1µF + R1OUT R2IN R2OUT 11 +5V TO 10V VOLTAGE DOUBLER 5 23 R2 VCC HIN230 thru HIN241 Pinouts (Continued) HIN238 (PDIP, SOIC) TOP VIEW HIN239 (SOIC) TOP VIEW T2OUT 1 24 T3OUT R1OUT 1 24 T1IN T1OUT 2 23 R3IN R1IN 2 23 T2IN R2IN 3 22 R3OUT GND 3 22 R2OUT R2OUT 4 21 T4IN VCC 4 21 R2IN T1IN 5 20 T4OUT R1OUT 6 R1IN GND VCC V+ 5 20 T2OUT 19 T3IN C1+ 6 19 T1OUT 7 18 T2IN C1- 7 18 R3IN 8 17 R4OUT 9 16 R4IN 17 R3OUT V- 8 16 T3IN R5IN 9 15 V- R5OUT 10 15 NC (NOTE) V+ 11 14 C2- R4OUT 11 14 EN C1- 12 13 C2+ R4IN 12 C1+ 10 13 T3OUT NOTE: No Connect +5V 1µF 1µF T1IN T2IN T3IN T4IN 10 C1+ + 12 C113 C2+ + 14 C2- VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400kΩ 5 +5V 400kΩ 18 +7.5V TO +13.2V +5V 9 + 2 1µF 1µF T2IN 1 T3 +5V 400kΩ 21 T4 T1IN T1OUT T2 +5V 400kΩ 19 6 1µF + T1 4 T2OUT T3IN 24 T3OUT R1OUT + 7 VCC C1+ C1- +10V TO -10V VOLTAGE INVERTER 6 T4OUT 7 R1IN R1OUT T1 +5V 400kΩ T2 23 16 +5V 400kΩ T3 20 13 3 R2IN R2OUT 23 R3IN 22 R2IN 5kΩ 18 R3IN R3OUT R3 5kΩ 12 R4IN R4OUT R4 5kΩ 10 17 16 R4IN R4OUT 5kΩ R4 8 3-7 T3OUT 21 R2 5kΩ R3 T2OUT R1IN 11 22 R3OUT T1OUT 5kΩ R2OUT 5kΩ R2 1µF 2 17 4 8 19 1 5kΩ R1 V- 5 + +5V 400kΩ 24 R1 20 V+ 9 R5IN R5OUT 14 R5 EN 3 5kΩ HIN230 thru HIN241 Pinouts (Continued) HIN241 (SOIC, SSOP) TOP VIEW R5IN NC R5OUT T3IN T4IN R4OUT T5OUT R4IN NC SHUT DOWN EN HIN240 (MQFP) 44 43 42 41 40 39 38 37 36 35 34 33 2 32 NC 1 T5IN R3IN 4 30 V- T4OUT 5 29 C2- T3OUT 6 28 C2+ 27 C1- 26 NC R2IN 24 EN T2IN 6 23 R4IN T1IN 7 22 R4OUT 21 T4IN R1IN 9 20 T3IN GND 10 19 R5OUT C1+ VCC 11 18 R5IN NC C1+ 12 17 V- NC V+ 13 16 C2- C1- 14 15 C2+ NC NC NC VCC R1IN GND T1IN R1OUT T2IN NC R2OUT 24 10 11 23 12 13 14 15 16 17 18 19 20 21 22 NC 25 SHUTDOWN R1OUT 8 V+ 25 9 26 R3OUT R2OUT 5 NC 8 T2OUT 3 NC 31 T2OUT 27 R3IN R2IN 4 3 7 28 T4OUT T1OUT 2 NC R3OUT T1OUT T3OUT 1 +5V +5V 19 1µF 1µF T1IN T2IN T3IN T4IN T5IN R1OUT 25 VCC C1+ + +5V TO 10V 27 C1- VOLTAGE DOUBLER 28 C2+ +10V TO -10V + 29 VOLTAGE INVERTER C2+5V T1 400kΩ 15 +5V 400kΩ 14 +5V 400kΩ 37 +5V 400kΩ 38 +5V 400kΩ 2 11 V+ V- 26 + 1µF 1µF 30 1µF 1µF 7 T1OUT T1IN T2 8 T3 6 T4 5 T5 41 17 16 R1 T2OUT T3OUT T4OUT T5OUT T3IN T4IN R1OUT T2 +5V 400kΩ T3 +5V 400kΩ 21 T4 R5IN R3IN 3-8 23 R4IN 5kΩ 18 R5IN 24 5kΩ R5 25 EN SHUTDOWN 10 SHUTDOWN R1IN 5kΩ 5kΩ 43 T4OUT 27 19 35 T3OUT 5kΩ R5OUT R5OUT T2OUT 4 22 R4IN T1OUT 5kΩ R4 5kΩ 1µF R2IN 40 18 9 R4OUT R4OUT EN 28 26 R3IN R5 1 R3 5kΩ 36 3 8 4 R4 2 R3OUT R3OUT 42 +5V 400kΩ 6 20 + + 1µF T1 R2 5kΩ 39 V- 17 5 R2IN R3 +10V TO -10V VOLTAGE INVERTER +5V 400kΩ 7 10 3 V+ 13 R2OUT R2OUT R2 VCC +5V TO 10V VOLTAGE DOUBLER R1 R1IN 5kΩ 13 T2IN 12 C1+ + 14 C115 C2+ + 16 C2- HIN230 thru HIN241 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(VCC -0.3V) < V+ < 12V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous Thermal Resistance (Typical, Note 1) θJA (oC/W) 14 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 80 24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70 16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100 20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 120 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95 44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC, SSOP, MQFP - Lead Tips Only) Operating Conditions Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range PARAMETER TEST CONDITIONS MIN TYP MAX UNITS HIN232-233 - 5 10 mA HIN230, HIN234-238, HIN240-241 - 7 15 mA HIN231, HIN239 - 0.4 1 mA HIN231 - 1.8 5 mA HIN239 - 5.0 15 mA - 1 10 µA - - 0.8 V SUPPLY CURRENTS Power Supply Current, ICC No Load, TA = 25oC V+ Power Supply Current, ICC No Load, TA = 25oC No Load, TA = 25oC Shutdown Supply Current, ICC(SD) TA = 25oC LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL TIN , EN, Shutdown Input Logic High, VlH TIN 2.0 - - V EN, Shutdown 2.4 - - V Transmitter Input Pullup Current, IP TIN = 0V - 15 200 µA TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA (HIN231-HIN233 IOUT = 3.2mA) - 0.1 0.4 V TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA 3.5 4.6 - V -30 - +30 V 7.0 kΩ RECEIVER INPUTS RS-232 Input Voltage Range VIN Receiver Input Impedance RIN VIN = ±3V 3.0 5.0 Receiver Input Low Threshold, VlN (H-L) VCC = 5V, TA = 25oC VCC = 5V, TA = 25oC 0.8 1.2 - V - 1.7 2.4 V 0.2 0.5 1.0 V Receiver Input High Threshold, VIN (L-H) Receiver Input Hysteresis VHYST TIMING CHARACTERISTICS Baud Rate (1 Transmitter Switching) RL = 3kΩ 120 - - kbps Output Enable Time, tEN HIN235, 236, 239, 240, 241 - 400 - ns Output Disable Time, tDIS HIN235, 236, 239, 240, 241 - 250 - ns 3-9 HIN230 thru HIN241 Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Propagation Delay, tPD RS-232 to TTL - 0.5 - µs Instantaneous Slew Rate SR CL = 10pF, RL = 3kΩ, TA = 25oC - - 30 V/µs RL = 3kΩ, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching - 3 - V/µs Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω RS-232 Output Short Circuit Current, ISC TOUT shorted to GND - ±10 - mA (Note 2) Transition Region Slew Rate, SRT TRANSMITTER OUTPUTS NOTE: 2. Guaranteed by design. 3-10 HIN230 thru HIN241 VOLTAGE DOUBLER C1+ S1 VOLTAGE INVERTER S2 V+ = 2VCC S5 C2+ S6 VCC GND + - + C1 - + C3 VCC GND C1- S3 S4 GND + C2 - - V- = -(V+) C2- S7 C4 S8 RC OSCILLATOR FIGURE 1. CHARGE PUMP Detailed Description The HIN230 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (except HIN231 and HIN239), feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver. Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and 10V. The nominal clock frequency is 16kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase one, C2 is also charged to 2VCC , and then during phase two, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage inverter section (V-) is approximately 450Ω. A typical application uses 1µF capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN230, 235, 236, 240 and 241), SHUTDOWN control line set to logic “1”, the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10µA. The transmitter outputs are disabled and the receiver outputs are placed in the high impedance state. resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of ±5V minimum with the worst case conditions of: all transmitters driving 3kΩ minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300Ω with ±2V applied to the outputs and VCC = 0V. V+ VCC 400kΩ 300Ω TXIN TOUT GND < TXIN < VCC V- < VTOUT < V+ V- FIGURE 2. TRANSMITTER Receivers The receiver inputs accept up to ±30V while presenting the required 3kΩ to 7kΩ input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the ±3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis to improve noise rejection. The receiver Enable line EN, when set to logic “1”, (HIN235, 236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode. VCC Transmitters The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ 0.6V). Each transmitter input has an internal 400kΩ pullup 3-11 RXIN -30V < RXIN < +30V ROUT 5kΩ GND < VROUT < VCC GND FIGURE 3. RECEIVER HIN230 thru HIN241 TIN OR RIN TOUT OR ROUT VOL VOL tPHL tPLH Average Propagation Delay = tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION Typical Performance Curves TA = 25oC 12 12 TRANSMITTER OUTPUTS OPEN CIRCUIT SUPPLY VOLTAGE (|V|) V- SUPPLY VOLTAGE 1µF 10 0.47µF 8 0.10µF 6 4 10 V+ (VCC = 5V) 8 6 V+ (VCC = 4.5V) V- (VCC = 4.5V) 4 V- (VCC = 5V) 2 2 0 0 3.0 4.0 3.5 4.5 5.0 5.5 6.0 0 5 10 VCC FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING CAPACITORS 15 20 |ILOAD| (mA) 25 FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232) Test Circuits (HIN232) +4.5V TO +5.5V INPUT - 1µF C3 1µF C1 + + - 1µF + C2 - - + 3kΩ 1µF C4 1 C1+ VCC 16 2 V+ GND 15 3kΩ 3 C1- T1OUT 14 4 C2+ R1IN 13 RS-232 ±30V INPUT 5 C2- R1OUT 12 TTL/CMOS OUTPUT 6 V7 T2OUT 8 R2IN T1 OUTPUT T1IN 11 TTL/CMOS INPUT T2IN 10 TTL/CMOS INPUT R2OUT 9 TTL/CMOS OUTPUT 1 C1+ VCC 16 2 V+ GND 15 3 C1- T1OUT 14 4 C2+ R1IN 13 5 C2- R1OUT 12 6 V7 T2OUT 8 R2IN T1IN 11 T2IN 10 R2OUT 9 ROUT = VIN/1 T2OUT T2 OUTPUT T1OUT VIN = ±2V RS-232 ±30V INPUT FIGURE 7. GENERAL TEST CIRCUIT 3-12 30 A FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION 35 HIN230 thru HIN241 Applications +5V The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. TD TTL/CMOS INPUTS AND OUTPUTS RTS 6 5 11 - RS-232 INPUTS AND OUTPUTS + T1 14 T2 10 TTL/CMOS RTS INPUTS AND 12 RD OUTPUTS R2 9 CTS 7 13 R1 8 15 TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING - 14 T2 10 + C2 1µF 5 T1 11 12 TD (2) TRANSMIT DATA 7 RTS (4) REQUEST TO SEND 13 RD (3) RECEIVE DATA RD CTS HIN232 4 HIN232 3 9 3 C2 + 1µF TD DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT 2 4 In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. 1 16 1 C1 + 1µF - A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kΩ resistor connected to V+. C1 + 1µF - + R2 R1 8 CTS (5) CLEAR TO SEND 15 16 6 2 - C3 + + C4 V- V+ 2µF 6 - 2µF 2 16 +5V RS-232 INPUTS AND OUTPUTS HIN232 C1 + 1µF DTR TTL/CMOS INPUTS AND OUTPUTS DSRS 1 4 3 5 T1 11 14 T2 10 12 7 13 DCD R1 9 R2 R1 15 8 + C2 1µF - DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 3-13 HIN230 thru HIN241 Die Characteristics DIE DIMENSIONS: PASSIVATION: 160 mils x 140 mils Type: Nitride over Silox Nitride Thickness: 8kÅ Silox Thickness: 7kÅ METALLIZATION: Type: Al Thickness: 10kÅ ±1kÅ TRANSISTOR COUNT: 238 SUBSTRATE POTENTIAL PROCESS: V+ CMOS Metal Gate Metallization Mask Layout HIN240 T2OUT T1OUT T3OUT T4OUT R3OUT R3IN T5IN R2IN SHUTDOWN R2OUT EN T2IN T5OUT T1IN R4IN R1OUT R4OUT R1IN T4IN GND T3IN R5OUT VCC R5IN C1+ 3-14 V+ C1- C2+ C2- V- HIN230 thru HIN241 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. 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