AVAGO ALM-11036-TR1G Low noise, high linearity amplifier module with fail-safe bypass feature Datasheet

ALM-11036
776 MHz – 870 MHz
Low Noise, High Linearity Amplifier Module
with Fail-Safe Bypass Feature
Data Sheet
Description
Features
Avago Technologies’ ALM-11036 is an easy-to-use GaAs
MMIC Tower Mount Amplifier (TMA) LNA Module with low
IL bypass path. The module has low noise and high linearity
achieved through the use of Avago Technologies’ proprietary 0.25 mm GaAs Enhancement-mode pHEMT process.
All matching components are fully integrated within the
module and the 50 ohm RF input and output pins are
already internally AC-coupled. This makes the ALM-11036
extremely easy to use as the only external parts are DC
supply bypass capacitors. For optimum performance
at other bands, ALM-11136 (870-915 MHz), ALM-11236
(1710-1850 MHz) and ALM-11336 (1850-1980) are recommended. All ALM-11x36 share the same package and pin
out configuration.
• Very Low Noise Figure
Pin Configuration and Package Marking
Specifications
7.0 x 10.0 x 1.5 mm3 36-lead MCOB
849 MHz; 5 V, 92 mA (typical)
• Good Return Loss
• Low Bypass IL
• Fail-safe Bypass mode
• High linearity performance
• High isolation @LNA mode
• Flat gain
• GaAs E-pHEMT Technology
• Single 5 V power supply
• Compact MCOB package 7.0 x 10.0 x 1.5 mm3
• MSL2a
• 15.6 dB Gain
• ≥ 18 dB RL
AVAGO
11036
WWYY
XXXX
• 0.78 dB Noise Figure
• 21.3 dBm IIP3
27
28
29
30
31
32
33
34
35
36
• 4 dBm Input Power at 1 dB gain compression
1
2
3
4
5
6
7
8
Connection
• 0.82 dB Bypass IL
4
RF_IN
• ≥ 18 dB Bypass RL
23
RF_OUT
• ≥ 50 dB isolation @LNA mode
28
EXT_P2
30
EXT_P1
33
Vdd
• Tower Mount Amplifier (TMA)
Others
GND
• Cellular Infrastructure
18
17
16
15
14
13
12
11
10
9
26
25
24
23
22
21
20
19
Pin
Note:
Package marking provides orientation and identification
“11036” = Device Part Number
“WWYY” = Work week and Year of manufacture
“XXXX” = Last 4 digit of Lot number
Applications
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model = 350 V
ESD Human Body Model = 1500 V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Absolute Maximum Rating [1] TA = 25° C
Symbol
Parameter
Units
Absolute Max.
Vdd
Device Voltage,
RF output to ground
V
5.5
Pin,max
CW RF Input Power
(Vdd = 5.0 V, Idd = 100 mA)
dBm
+15
Pdiss
Total Power Dissipation [3]
W
0.715
Tj
Junction Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to 150
Thermal Resistance [2]
(Vdd = 5.0 V, Idd = 100 mA) θjc = 83.1 °C/W
Notes:
1. Operation of this device in excess of any of
these limits may cause permanent damage.
2. Thermal resistance measured using Infra-Red
measurement technique.
3. Power dissipation with unit turned on. Board
temperature Tc is 25° C. Derate at 12.3 mW/°C
for TC > 92° C.
Electrical Specifications [1, 4]
RF performance at TA = 25° C, Vdd = 5 V, 849 MHz, measured on demo board in Figure 1 with component listed in Table 1
for DC bypass.
Symbol
Parameter and Test Condition
Idd
Drain Current
Gain
Gain
IRL
Input Return Loss, 50 Ω source
ORL
Output Return Loss, 50 Ω load
NF [2]
Noise Figure
IIP3 [3]
IP1dB
Bypass IL
Bypass Insertion Loss, 50 Ω load Vdd = 0 V
Bypass IRL
Bypass ORL
ISOL
Frequency (MHz)
Units
Min.
Typ.
Max.
mA
75
92
107
dB
–
14.2
15.4
15.6
–
17.2
dB
–
30
–
dB
–
26
–
dB
–
–
0.84
0.78
–
0.95
Input Third Order Intercept Point
dBm
18.7
21.3
–
Input Power at 1 dB Gain Compression
dBm
2.85
4
–
dB
–
–
0.7
0.82
–
1.1
Input Return Loss, 50 Ω source Vdd = 0 V
dB
–
35
–
Output Return Loss, 50 Ω load Vdd = 0 V
dB
–
35
–
Bypass Isolation @LNA ON Vdd = 5 V
dB
–
54
–
776
849
776
849
776
849
Notes:
1. Measurements at 849 MHz obtained using demo board described in Figure 1.
2. For NF data, board losses of the input have not been de-embedded.
3. IIP3 test condition: FRF1 = 849 MHz, FRF2 = 850 MHz with input power of -15 dBm per tone.
4. Use proper bias, heatsink and derating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and application
note for more details.
2
Product Consistency Distribution Charts[1, 2]
LSL
USL
80
90
100
14
Figure 1. Idd, LSL = 75 mA , nominal = 92 mA, USL = 107 mA
0.8
16
17
LSL
0.9
19
Figure 3. NF, nominal = 0.7 8dB, USL = 0.95 dB
20
21
22
23
Figure 4. IIP3, LSL = 18.7 dBm, nominal = 21.3 dBm
LSL
3
15
Figure 2. Gain, LSL = 14.2 dB, nominal = 15.6 dB, USL = 17.2 dB
USL
0.7
USL
LSL
LSL
4
Figure 5. IP1dB, LSL = 2.85 dBm, nominal = 4 dBm
5
-1.1
-1
-0.9
-0.8
-0.7
-0.6
Figure 6. Bypass IL, LSL = 1.1 dB, nominal = 0.82 dB
Notes:
1. Distribution data sample size is 1500 samples taken from 3 different wafer lots. Future wafers allocated to this product may have nominal values
anywhere between the upper and lower limits.
2. Circuit trace losses have not been de-embedded from measurements above.
3
Vsupply
GND
Demo Board Layout
Avago
Technologies
Z1
C1
Z2
27 Gnd
28 EXT_P2
30 EXT_P1
31 Gnd
32 Gnd
34 Gnd
33 Vdd
35 Gnd
36 Gnd
C3
29 Gnd
C2
ALM-
16
17
18
Gnd
Gnd
19 Gnd
Gnd
8
15
20 Gnd
Gnd
Gnd
7
14
21 Gnd
Gnd
13
6
Gnd
22 Gnd
Gnd
Gnd
5
12
23 RF_OUT
Gnd
Gnd
4
11
24 Gnd
RF_IN
10
3
Gnd
25 Gnd
Gnd
Gnd
26 Gnd
9
1
2
Gnd
Gnd
Gnd
rev1gi
March'10
Low T.M.
MILS
W 21.89
G 14.57
H 10
S 60
Figure 7. Demo Board Layout Diagram
– Recommended PCB material is 10 mils Rogers RO4350.
– Suggested component values may vary according to layout and PCB material.
– Copper trace between the 2 pads is removed before Z2 0(ohm) is placed.
4
Demo Board Schematic
Vdd (5 V)
Z1
Z2
C1
C2
27,29,31,32,34,35,36
EXT_P1
33
EXT_P2
28
30
1,2,3
24,25,26
BIAS
5V
4
50 Ω TL
RFin
5V
RFout
0V
19,20,21,22
5,6,7,8
9,10,11,12,13,14,15,16,17,18
Module Outline,
7 mm x 10 mm
Truth Table
Vdd (V)
LNA Mode
5
Bypass Mode
0
Fail-safe Mode
NC
Bypass and Fail-safe mode have similar performance
Figure 8. Demo Board Schematic Diagram
Table 1. DC component list for 776-870 MHz
Part
Size
Value
Detail Part Number
C1
0805
2.2 mF (Murata)
GRM21BR61E225KA12L
C2
0402
NU
NU
Z1
0805
0 Ω (Kamaya)
RMC1/8-JPTP
Z2
0603
0 Ω (Kamaya)
RMC1/16-JPTP
Notes:
C1 is a DC bypass capacitor.
Z1 is 0 Ω resistor or fuse.
Z2 is a 0 Ω resistor if an external function block is not used.
5
23
Typical Performance
RF performance at TA = 25° C, Vdd = 5 V for LNA mode, Vdd = 0 V for Bypass mode, measured on demo board in Figure 7.
Signal = CW unless stated otherwise. Application Test Circuit is shown in Figure 8 and Table 1. IIP3 test condition: FRF1-FRF2
= 1 MHz with input power of -15 dBm per tone.
17.0
100
16.5
16.0
Gain (dB)
Idd (mA)
95
90
15.5
15.0
14.5
14.0
85
85° C
25° C
-40° C
13.5
80
-40 -30 -20 -10 0
13.0
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
10 20 30 40 50 60 70 80 90
Temperature (°C)
Figure 9. Idd vs Temperature
Figure 10. Gain vs Frequency
0
0
85° C
25° C
-40° C
-5
-15
-10
S22 (dB)
S11 (dB)
-10
-20
-25
-25
-35
-35
-40
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
Figure 12. S22 vs Frequency
1.1
1.0
0.9
0.8
IIP3 (dBm)
NF(dB)
-20
-30
Figure 11. S11 vs Frequency
0.7
0.6
0.5
0.4
0.3
85° C
25° C
-40° C
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
Figure 13. NF vs Frequency
6
-15
-30
-40
85° C
25° C
-40° C
-5
30
28
26
24
22
20
18
16
14
12
10
770 780
85° C
25° C
-40° C
790 800 810 820 830 840 850 860 870
Frequency (MHz)
Figure 14. IIP3 vs Frequency
-0.5
8.0
85° C
25° C
-40° C
7.0
5.0
-0.7
Bypass IL (dB)
IP1dB(dBm)
6.0
-0.6
4.0
3.0
2.0
770 780 790 800 810 820 830 840 850
Frequency (MHz)
85° C
25° C
-40° C
Bypass S22 (dB)
Bypass S11 (dB)
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
770 780 790 800 810 820 830 840 850
Frequency (MHz)
860 870
85° C
25° C
-40° C
-40
-45
-50
-55
-60
-65
-70
770 780 790
800 810 820 830 840 850 860 870
Frequency (MHz)
Figure 19. Bypass isolation vs Frequency (LNA mode)
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
770 780 790 800 810 820 830 840 850
Frequency (MHz)
Figure 18. Bypass S22 vs Frequency
-30
-35
85° C
25° C
-40° C
Figure 16. Bypass IL vs Frequency
Figure 17. Bypass S11 vs Frequency
Isolation (dB)
-1.0
-1.2
770 780 790 800 810 820 830 840 850 860 870
Frequency (MHz)
860 870
Figure 15. IP1dB vs Frequency
7
-0.9
-1.1
1.0
0.0
-0.8
85° C
25° C
-40° C
860 870
Typical Scattering Parameters, Vdd = 5 V, Idd = 92 mA
LNA SPAR (100 MHz – 20 GHz)
Freq (GHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
0.1
-0.96
-144.48
-12.98
-32.61
-13.07
-32.53
-0.87
-123.04
0.5
-2.21
142.14
-27.02
-94.66
-38.63
63.66
-1.07
106.09
0.7
-6.53
47.06
11.56
-4.83
-29.78
-37.54
-8.99
160.33
0.75
-14.56
22.36
14.99
-69.88
-25.15
-100.88
-19.56
96.86
0.77
-18.24
21.15
15.40
-91.79
-24.43
-121.56
-29.62
115.18
0.79
-21.72
21.48
15.61
-111.16
-23.84
-140.43
-28.92
-168.17
0.81
-25.22
13.45
15.68
-128.62
-23.40
-156.46
-25.68
-160.33
0.83
-29.79
-18.04
15.67
-144.42
-23.02
-171.42
-25.35
-157.21
0.85
-29.36
-84.38
15.62
-159.03
-22.65
174.56
-26.30
-140.35
0.87
-24.30
-124.20
15.56
-172.74
-22.38
161.58
-25.00
-112.85
0.89
-20.26
-141.54
15.45
174.50
-22.21
149.80
-21.42
-95.86
0.91
-17.80
-155.35
15.30
162.05
-22.02
137.76
-18.03
-92.18
0.92
-16.84
-162.04
15.22
156.26
-22.03
132.58
-16.69
-91.89
0.93
-16.07
-167.32
15.10
150.59
-21.87
127.13
-15.45
-93.88
0.95
-14.87
-178.09
14.87
139.60
-21.77
116.63
-13.42
-97.98
1
-14.04
155.35
14.34
114.38
-21.61
93.24
-10.38
-108.84
1.5
-8.03
-107.48
10.10
-55.73
-19.43
-68.19
-7.09
149.36
2
-2.96
-123.02
-1.92
140.66
-27.02
134.78
-1.50
-176.24
2.5
-1.42
-160.14
-13.17
79.99
-35.19
81.93
-1.12
124.52
3
-0.98
178.28
-17.99
15.79
-41.36
49.18
-3.43
30.64
3.5
-1.00
164.55
-26.05
-66.05
-36.47
-40.63
-4.70
-148.81
4
-0.89
154.97
-37.39
-127.94
-69.35
15.05
-2.20
140.32
4.5
-1.37
144.20
-56.59
179.37
-50.93
-33.28
-8.59
-10.69
5
-4.74
133.59
-60.21
-37.96
-59.46
-72.44
-1.68
-159.63
5.5
-1.67
152.92
-62.99
-147.73
-67.86
73.07
-0.91
160.23
6
-1.86
126.12
-54.39
33.97
-56.51
57.13
-0.96
130.17
7
-1.48
112.34
-37.36
-164.63
-38.00
-161.07
-1.15
79.40
8
-0.85
86.81
-46.38
95.84
-46.38
101.79
-1.11
32.34
9
-1.77
78.40
-28.25
-45.00
-28.67
-42.61
-2.28
-26.39
10
-3.36
58.78
-25.97
150.57
-24.74
160.81
-7.18
-92.13
11
-6.31
26.98
-23.28
-173.77
-23.41
-166.84
-4.70
-121.47
12
-3.68
-25.16
-22.76
-158.65
-22.78
-157.77
-3.95
-94.58
13
-5.10
-68.82
-29.35
166.53
-29.53
166.64
-10.27
172.28
14
-11.62
147.68
-25.22
-20.01
-25.12
-21.30
-12.64
131.06
15
-5.04
46.97
-27.14
118.03
-27.07
118.94
-8.31
-60.24
16
-6.53
-49.32
-26.80
-15.28
-26.68
-14.29
-4.89
-144.80
17
-13.93
170.79
-31.39
139.93
-31.28
140.16
-2.80
-153.41
18
-7.60
-17.67
-29.19
117.19
-28.95
115.28
-5.70
173.60
19
-3.86
-80.47
-27.82
7.47
-27.74
7.75
-4.89
-171.62
20
-5.46
-136.04
-28.58
53.03
-28.54
53.25
-2.77
150.14
8
PCB Layout and Stencil Design
9.795
9.765
0.845 (pitch)
0.50
3.65
0.845
(pitch)
6.770
4.50
0.47
1.0375
6.80
5.20
0.50
8.10
0.20
1.0375
Pin 1
0.845
(pitch)
Pin 1
0.845 (pitch)
0.47
Stencil Opening
Land Pattern
0.845
0.845
(pitch)
Pin 1
1.0375
Metal
Combination of Land Pattern and Stencil Opening
Part Number Ordering Information
Part Number
No. of Devices
Container
ALM-11036-TR1G
1000
13” Reel
ALM-11036-BLKG
100
antistatic bag
9
Soldermask Open
Note :
1. Recommended Land Pattern & Stencil Opening.
2. Stencil thickness is 0.1 mm (4 mils)
3. All dimension are in MM unless otherwise specified
MCOB 7 x 10 Package Dimensions
Pin1 Identification
10.00±0.10
AVAGO
11036
WWYY
XXXX
1.50±0.10
7.00±0.10
1.12
Top View
0.50
Side View
0.845 (pitch)
Pin 1
0.50
0.10
0.05
(SM to metal gap)
0.845 (pitch)
R0.15
5.20
8.10
Bottom SM
Bottom Metal
1.0375
Notes:
1. All dimensions are in milimeters
2. Dimensions are inclusive of plating
3. Dimensions are exclusive of mold flash and metal burr
Bottom View
Device Orientation
REEL
USER FEED DIRECTION
CARRIER
TAPE
AVAGO
11036
WWYY
XXXX
TOP VIEW
USER
FEED
DIRECTION
COVER TAPE
10
AVAGO
11036
WWYY
XXXX
AVAGO
11036
WWYY
XXXX
END VIEW
Tape Dimensions
12.00 ± 0.10
2.00 ± 0.10
4.00 ± 0.10
1.75 ± 0.10
Ø 1.50 + 0.10
11.50 ± 0.10
24.00 + 0.30
− 0.10
Ø 1.50 + 0.25
0.318 ± 0.02
5° MAX
8° MAX
7.32 ± 0.10
A.
11
10.49 ± 0.10
2.06 ± 0.10
K.
B.
Reel Dimensions - 13” Reel
ESD Label
(See Below)
Recycle Symbol
Detail ‘X’
Embossed Line X2
90.0mm Length
Lines 147.0mm away from center point
Embossed ‘M’ 5.0mm Height
FRONT VIEW
Ø20.2 (Min)
25.65±1.75**
25.4±1.0*
Recycle Symbol
+0.5
Ø13.1 -0.2
2.2±0.5
See Detail ‘X’
FRONT
BACK
Ø100.0±0.5
Ø331.5 Max
Detail ‘X’
1.0
BACK VIEW
Detail ‘Y’
Slot 10.0±0.5(2x)
Slot 5.0±0.5***(1x)
4.0
30.4*
Max
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-2846EN - June 18, 2013
Detail ‘Y’
(Slot Hole)
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