ON NSR0140P2T5G Schottky barrier diode Datasheet

NSR0140P2T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
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Features
•
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1.0 mA
Low Reverse Current
Lead−Free Plating
This is a Pb−Free Device
40 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
MARKING
DIAGRAM
2
MAXIMUM RATINGS
Symbol
Value
Unit
Repetitive Peak Reverse Voltage
Rating
VRM
40
V
Continuous Reverse Voltage (DC)
VR
30
V
Continuous Forward Current (DC)
IF
70
mA
IFSM
500
mA
Non−Repetitive Peak Forward Surge Current
ESD Rating: Class 1C per Human Body Model
Class A per Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
PD
100
mW
1.0
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA
1000
°C/W
Junction and Storage
Temperature Range
TJ, Tstg
−55 to +125
°C
1
SOD−923
CASE 514AA
PLASTIC
1
M MG
G
2
M = Specific Device Code*
(Character is rotated 270° clockwise)
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NSR0140P2T5G
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. FR−5 Minimum Pad.
© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 3
1
Publication Order Number:
NSR0140P2/D
NSR0140P2T5G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
V(BR)R
30
−
−
V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT
−
2.0
2.5
pF
Reverse Leakage
(VR = 30 V)
IR
−
300
500
nA
Forward Voltage
(IF = 1.0 mA)
VF
−
0.28
0.35
V
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
1000
IR , REVERSE CURRENT (μA)
1.0
150°C
TA = 150°C
100
125°C
10
85°C
1.0
0.1
25°C
0.01
125°C
85°C
25°C
-40°C
-55°C
0.3
0.4
0.001
0.1
0
0.05
0.1
0.15
0.2
0.25
0.35
0.45
0.5
5
0
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
2.5
2.0
1.5
1.0
0.5
0
0
2.0
4.0
30
Figure 2. Reverse Current versus Reverse
Voltage
3.0
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
10
6.0
8.0
10
12
14
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
16
18
35
NSR0140P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AA−01
ISSUE D
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.39
0.43
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.017
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSR0140P2/D
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