Rohm BD6538G-TR Output off latch high side switch ic Datasheet

Datasheet
1 Channel Compact High Side Switch ICs
Output OFF Latch High Side Switch ICs
BD6538G
General Description
Key Specifications
BD6538G is a high-side switch IC using a single
N-Channel MOSFET with low ON-Resistance.
Moreover, safety functions such as Over-Current
Detection (OCD), Thermal Shutdown (TSD), Under
Voltage Lock Out (UVLO) and soft start function which
are required for the power supply port protection are
integrated into 1chip.






Input Voltage Range:
2.7V to 5.5V
Continuous Load Current:
0.5A
ON-Resistance:
150mΩ(Typ)
Over-Current Threshold:
0.5A (Min), 1.0A (Max)
Standby Current:
0.01μA (Typ)
Operating Temperature Range:
-40°C to +85°C
W(Typ)
Package
D(Typ)
H (Max)
Features
 Built in Single Low ON-Resistance (Typ= 150mΩ)
N-Channel MOSFET
 Control Input Logic: Active-High
 Soft Start Function
 Over-Current Detection
（Output Off-Latch Operating)
 Thermal Shutdown
 Open Drain Error Flag Output
 Under Voltage Lockout
SSOP5
2.90mm x 2.80mm x 1.25mm
Applications
USB hub in consumer appliances, PC, PC peripheral
equipment, and so forth
Typical Application Circuit
5V(Typ)
CIN
IN
OUT
GND
CL
EN
+
-
/OC
Lineup
Over-Current Threshold
Min
Typ
Max
Control Input
Logic
0.5A
-
1.0A
High
Package
SSOP5
Orderable Part Number
Reel of 3000
BD6538G-TR
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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Block Diagram
GND
Delay
Counter
OCD
/OC
S Q
R
Charge
pump
UVLO
TSD
EN
IN
VIN
OUT
Pin Configuration
TOP VIEW
1 IN
OUT
5
2 GND
3 EN
/OC 4
Pin Description
Pin No.
Symbol
I/O
1
IN
-
Power supply input terminal.
Input terminal to the power switch and supply of the internal circuit.
2
GND
-
Ground.
3
EN
I
Power switch enable input (active high).
4
/OC
O
Over-current output. Low level at over-current detection.
Open drain output.
5
OUT
O
Power switch output.
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Absolute Maximum Ratings(Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
V IN
-0.3 to +6.0
V
Enable Voltage
V EN
-0.3 to +6.0
V
/OC Voltage
V /OC
-0.3 to +6.0
V
/OC Current
I /OC
5
mA
OUT Voltage
V OUT
-0.3 to V IN + 0.3
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
Pd
0.67
(Note 1)
W
(Note 1) Mounted on a 70mm x 70mm x 1.6mm glass epoxy board. Derate by 5.4mW/°C above Ta = 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Min
Typ
Max
Unit
Operating Voltage
V IN
2.7
-
5.5
V
Operating Temperature
Topr
-40
-
+85
°C
Continuous Output Current
I OUT
0
-
0.5
A
Electrical Characteristics
Unless otherwise specified V IN = 5.0V, Ta = 25°C
DC Characteristics
Parameter
Symbol
Limit
Min
Typ
Max
unit
Conditions
Operating Current
I DD
-
110
160
μA
V EN = 5.0V, V OUT = Open
Standby Current
I STB
-
0.01
5
μA
V EN = 0V, V OUT = Open
V ENH
2.0
-
-
V
High Input
EN Input Voltage
V ENL
-
-
0.8
V
Low Input
EN Input Current
I EN
-1.0
+0.01
+1.0
μA
V EN =0V or 5V
ON-Resistance
R ON
-
150
200
mΩ
I OUT = 50mA
Over-Current Threshold
I TH
0.5
-
1.0
A
Output Current at Short
I SC
0.35
-
-
A
V OUT = 0V (RMS)
/OC Output Low Voltage
UVLO Threshold
-
V /OC
-
-
0.4
V
I /OC = 0.5mA
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
AC Characteristics
Parameter
Symbol
Limit
unit
Conditions
Min
Typ
Max
t ON1
-
1
6
ms
Output Rise Delay Time
t ON2
-
1.5
10
ms
R L = 20Ω, Figure 2. Ref.
Output Fall Time
t OFF1
-
1
20
μs
R L = 20Ω, Figure 2. Ref.
R L = 20Ω, Figure 2. Ref.
Output Rise Time
Output Fall Delay Time
t OFF2
-
3
40
μs
Blanking Time
t BLANK
10
15
20
ms
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R L = 20Ω, Figure 2. Ref.
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Measurement Circuit
VIN
VIN
A
A
IN
1µF
VEN
IN
1µF
GND
EN
A.
OUT
RL
GND
VEN
/OC
OUT
EN
/OC
B. EN Input Voltage, Output Rise / Fall Time
Operating Current
VIN
VIN
10k
A
A
IOC
IN
1µF
VEN
OUT
1µF
IOUT
GND
EN
IN
GND
VEN
/OC
EN
C. ON-Resistance, Over-Current Detection
OUT
/OC
D. /OC Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
VEN
VENL
VENH
tON2
tOFF2
90%
VOUT
90%
10%
10%
tON1
tOFF1
Figure 2. Timing Chart at Output Rise / Fall Time
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Typical Performance Curves
140
Ta=25°C
120
VIN=5.0V
120
Operating Current : IDD[μA]
Operating Current : IDD[μA]
140
100
80
60
40
20
100
80
60
40
20
0
0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
100
Figure 4. Operating Current vs
Ambient Temperature
(EN Enable)
Figure 3. Operating Current vs
Supply Voltage
(EN Enable)
1.0
1.0
VIN=5.0V
Ta=25°C
0.8
Standby Current : I [μA]
Operating Current : STB
ISTB[μA]
Operating
Current
: ISTB
[μA]
Standby
Current
: ISTB
[μA]
0
50
℃]
AmbientTemperature
Temperature::Ta[
Ta[°C]
Ambient
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
2
3
4
5
6
-50
Supply Voltage : VIN[V]
Figure 5. Standby Current vs
Supply Voltage
(EN Disable)
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0
50
Ambient
Temperature
Ambient Temperature::Ta[°C]
Ta[℃]
100
Figure 6. Standby Current vs
Ambient Temperature
(EN Disable)
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Typical Performance Curves - continued
2.0
2.0
1.5
Enable Input Voltage : VEN[V]
Enable Input Voltage : VEN[V] 0
Ta=25°C
Low to High
High to Low
1.0
0.5
VIN=5.0V
Low to High
1.5
High to Low
1.0
0.5
0.0
0.0
2
3
4
5
-50
6
0
50
℃]
AmbientTemperature
Temperature: :Ta[
Ta[°C]
Ambient
Supply Voltage : VIN[V]
Figure 7. EN Input Voltage vs
Supply Voltage
Figure 8. EN Input Voltage vs
Ambient Temperature
200
200
VIN=5.0V
ON-Resistance: RON[mΩ]
ON Resistance : R ON[mΩ]
Ta=25°C
ON-Resistance:
[mΩ]
ON
Resistance : RRON
[mΩ]
ON
100
150
100
50
150
100
50
0
0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
Figure 9. ON-Resistance vs
Supply Voltage
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AmbientTemperature
Temperature: Ta[°C]
: Ta[℃]
Ambient
100
Figure 10. ON-Resistance vs
Ambient Temperature
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Typical Performance Curves - continued
1.0
1.0
VIN=5.0V
0.9
0.9
Over-Current Threshold : ITH[A]
Overcurrent Threshold : ITH[A]
Overcurrent Threshold
[A]
TH[A]
Over-Current
Threshold :: IITH
Ta=25°C
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
Supply Voltage : VIN[V]
0
50
Ambient
Temperature
Ambient Temperature::Ta[°C]
Ta[℃]
Figure 11. Over-Current Threshold
vs Supply Voltage
Figure 12. Over-Current Threshold
vs Ambient Temperature
2
3
4
5
-50
6
100
100
Ta=25°C
/OC Output Low Voltage : V/OC[mV]
/OC Output Low Voltage : V/OC[mV]
100
80
60
40
20
VIN=5.0V
80
60
40
20
0
0
2
3
4
5
Supply Voltage : VIN[V]
-50
6
100
Figure 14. /OC Output Low Voltage
vs Ambient Temperature
Figure 13. /OC Output Low Voltage
vs Supply Voltage
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AmbientTemperature
Temperature :: Ta[
Ta[°C]
℃]
Ambient
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2.5
1.0
2.4
0.8
2.3
UVLO Hysteresis Voltage : VHYS[V]
UVLO Threshold : VTUVH, VTUVL[V]
Typical Performance Curves - continued
0.6
VTUVH
2.2
0.4
VTUVL
2.1
0.2
2.0
-50
0
50
℃]
Ambient
AmbientTemperature
Temperature : Ta[
Ta[°C]
0.0
100
-50
Figure 15. UVLO Threshold Voltage vs
Ambient Temperature
0
50
℃]
Ambient
AmbientTemperature
Temperature: :Ta[
Ta[°C]
100
Figure 16. UVLO Hysteresis Voltage vs
Ambient Temperature
Ambient Temperature : Ta[°C]
5.0
5.0
VIN=5.0V
Rise Time
: t ON1[ms]
Output
Rise Time
: tON1[ms]
Output
Rise :Time
: tON1[ms]
Rise Time
t ON1[ms]
Ta=25°C
4.0
3.0
2.0
1.0
0.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
Supply Voltage : VIN[V]
100
Figure 18. Output Rise Time vs
Ambient Temperature
Figure 17. Output Rise Time vs
Supply Voltage
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Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta[℃]
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Typical Performance Curves - continued
Ta=25°C
Output
Rise
tON2[ms]
Turn
ONDelay
TimeTime
: t ON2:[ms]
Output Rise Delay Time : tON2[ms]
5.0
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
-50
0
50
Ambient
Temperature
Ta[°C]
Ambient Temperature : :Ta[℃]
100
Figure 20. Output Rise Delay Time vs
Ambient Temperature
Figure 19. Output Rise Delay Time vs
Supply Voltage
VIN=5.0V
Output Fall Time : tOFF1[µs]
Output Fall Time : tOFF1[µs]
Ta=25°C
Ambient Temperature : Ta[°C]
Figure 21. Output Fall Time vs
Supply Voltage
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Figure 22. Output Fall Time vs
Ambient Temperature
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Typical Performance Curves - continued
6.0
6.0
VIN=5.0V
Output Fall Delay Time : tOFF2[µs]
Turn OFF Time : t OFF2 [μs]
Turn
OFF
TimeTime
: tOFF2: [μs]
Output
Fall
Delay
tOFF2[µs]
Ta=25°C
5.0
4.0
3.0
2.0
1.0
5.0
4.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
Supply Voltage : V IN[V]
6
-50
0
50
℃]
Ambient
AmbientTemperature
Temperature: :Ta[
Ta[°C]
100
Figure 24. Output Fall Delay Time
vs Ambient Temperature
Figure 23. Output Fall Delay Time
vs Supply Voltage
20
VIN=5.0V
Ta=25°C
Blank Time : t BLANK[ms]
18
16
14
12
10
-50
100
Figure 26. Blank Time vs Ambient
Temperature
Figure 25. Blanking Time vs Supply Voltage
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50
℃]
Ambient
Temperature
: Ta[
Ambient
Temperature
: Ta[°C]
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Typical Wave Forms
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=20Ω
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME(1ms/div.)
TIME(1μs/div.)
Figure 27. Output Rise Characteristic
Figure 28. Output Fall Characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=147μF
CL=100μF
IOUT
(0.2A/div.)
CL=47μF
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
VIN=5V
TIME (2ms/div.)
TIME (20ms/div.)
Figure 29. Inrush current response
Figure 30. Over current response
Ramped load
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Typical Wave Forms - continued
V/OC
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
TIME (5ms/div.)
TIME (5ms/div.)
Figure 31. Over-Current Response
Ramped Load
Figure 32. Over-Current Response
Enable to Short Circuit
V/OC
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (5ms/div.)
TIME (10ms/div.)
Figure 33. Over-Current Response
Output Short Circuit at Enable
Figure 34. UVLO Response
VIN Increasing
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Typical Wave Forms - continued
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 35. UVLO response
VIN Decreasing
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Typical Application Circuit
5V(Typ)
10k to
100kΩ
CIN
Controller
IN
OUT
GND
EN
CL
+
-
/OC
Application Information
When excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and IC.
This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor (C IN ) should be connected
across the IN terminal and GND terminal of IC. A 1μF capacitor or higher value is recommended. Moreover, in order to
decrease voltage fluctuations of power source line and IC, connect a low ESR capacitor in parallel with C IN. A 10μF to
100μF capacitor or higher value is effective.
Use a 10kΩ to 100kΩ Pull up resistor to /OC.
Set up values for C L which satisfies the application.
This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit
constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as
dispersion of the IC.
Functional Description
1. Over-Current Detection（OCD）
The over-current detection circuit limits current flowing in the MOSFET switch when it exceeds its limit threshold.
The timer is reset when the state of the over-current is terminated before passing of T BLANK . After a state of over-current
is passed during dead time, the switch is shut down and the over-current signal (/OC) changes to Low level.
The latch is reset when EN input is Low or when UVLO is detected. Normal operation is returned by EN signal set to
High or UVLO is off. (Figure 36, Figure 37).
The over-current detection circuit works when the switch is on (EN signal is active). There are three types of response
against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short circuits or high-current load is connected while the switch is on, very large current flows
until the over-current limit circuit reacts. When the current detection and limit circuit works, current limitation is
carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds
the over-current detection value. When it exceeds the detection value, current limitation is carried out.
2. Thermal Shutdown Circuit（TSD）
Thermal shutdown circuit turns off the switch and the IC outputs an error flag (/OC) when the junction temperature
exceeds 170°C (Typ). Therefore, when the junction temperature goes lower than 150°C (Typ), the switch turns ON and
error flag (/OC) is cancelled. This operation is repeated until the cause of junction temperature increase is removed or
EN signal is turned OFF.
The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active).
3. Under Voltage Lockout （UVLO）
UVLO keeps the power switch off until V IN voltage exceeds 2.3V (Typ). On the other hand, if the power switch is ON and
V IN voltage drops to 2.2V (Typ), the power switch turns OFF. UVLO has hysteresis of a 100mV (Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active).
4. Error Flag (/OC) Output
Error flag output is an N-MOS open drain output. When over-current and thermal shutdown is detected, output becomes
low.
Over-current detection has delay filter. This delay filter prevents over-current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug.
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Over-Current Shutdown Operating
tBLANK
tBLANK
Output Current
ON
OFF
ON
Switch Status
FLAG Output
V
EN
EN
Figure 36. Over-Current Shutdown Operation（Reset at toggle of EN）
tBLANK
tBLANK
Output Current
ON
OFF
ON
Switch Status
FLAG Output
VTUVL
VIN
IN
VTUVH
VEN
EN
Figure 37. Over-Current Shutdown Operation (Reset at reclosing of power supply V IN )
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Power Dissipation
(SSOP5 package)
700
Power
Dissipation: Pd[mV]
Pd [mV]
POWER
DISSIPATION:
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT
AmbientTEMPERATURE:
Temperature: Ta Ta[℃]
[°C]
* 70mm Glass
* 70mm Epoxy
* 1.6mm Board
: glass epoxy
board mounting
70mm x 70mm x 1.6mm
Mounting
Figure 38. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No.
EN
3
OUT
5
Equivalence Circuit
EN
OUT
VOUT
/OC
/OC
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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17/21
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BD6538G
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 39. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
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TSZ22111･15･001
18/21
TSZ02201-0E3E0H300320-1-2
21.Aug.2014 Rev.002
BD6538G
Ordering Information
B
D
6
5
3
Part Number
8
G
-
Package
G: SSOP5
TR
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
Marking Diagram
SSOP5 (TOP VIEW)
A6
Part Number Marking
LOT Number
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© 2013 ROHM Co., Ltd. All rights reserved.
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TSZ02201-0E3E0H300320-1-2
21.Aug.2014 Rev.002
BD6538G
Physical Dimension, Tape and Reel Information
Package Name
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
SSOP5
20/21
TSZ02201-0E3E0H300320-1-2
21.Aug.2014 Rev.002
BD6538G
Revision History
Date
Revision
08.Mar.2013
001
21.Aug.2014
002
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
Changes
New Release
Applied the ROHM Standard Style and improved understandability.
Add applications.
Revised I/O Equivalence Circuit of EN PIN.
21/21
TSZ02201-0E3E0H300320-1-2
21.Aug.2014 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD6538G - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD6538G
SSOP5
3000
3000
Taping
inquiry
Yes