Panasonic MN101CF97D Mn101c97a Datasheet

MN101C97A, MN101C97D
MN101C97A
Type
Minimum Instruction
Execution Time
FLASH
32K
64K
1K
RAM (byte)
Package (Lead-free)
MN101CF97D
Mask ROM
Internal ROM type
ROM (byte)
MN101C97D
QFN044-P-0606A (Under planning), QFP044-P-1010F (Under planning), TQFP048-P-0707B
0.25 µs (at 2.2 V to 3.6 V, 8 MHz)
0.5 µs (at 1.8 V to 3.6 V, 4 MHz)*
62.5 µs (at 1.8 V to 3.6 V, 32 kHz)*
* The lower limit for operation guarantee for flash memory built-in type is 2.0 V.
 Interrupts
RESET, Watchdog, External 0 to 5, External 6 (key interrupt dedicated), Timer 0 to 3, Timer 6, Timer 7 (2 systems), Time base, Serial
0 (2 systems), Serial 3, A/D conversion finish
 Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement,
added pluse (2-bit) system PWM output)
(square-wave/PWM output to large current terminal P51 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1
(square-wave output, event count, synchronous output event, serial transfer clock output)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, event count,
synchronous output event, simple pulse width measurement)
(square-wave/PWM output to large current terminal P52 possible)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial transfer clock output)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192
of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
Timer counter 7 : 16-bit × 1
(square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event,
pulse width measurement, input capture, real time output control, high performance IGBT output)
(square-wave/PWM output to large current terminal P53 possible)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines), input capture register
MAD00058BEM
MN101C97A, MN101C97D
Timer counters 7, 8 can be cascade-connected.
(square-wave output, PWM input capture, pluse width measurement is possible as a 32-bit timer.)
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/4096, 1/8192, 1/16384, 1/32768, of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency
 Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency, external clock
Serial 3 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC
oscillation clock frequency, external clock
 I/O Pins
38
I/O
Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
 A/D converter
10-bit × 8-ch. (with S/H)
 Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
 ROM Correction
Correcting address designation : up to 3 addresses possible
 Electrical Charactreistics (Supply current)
Parameter
Operating supply current
Supply current at HALT
Supply current at STOP
 Development tools
Symbol
Condition
IDD1
fosc = 4 MHz, VDD = 3 V
IDD2
fx = 32 kHz, VDD = 3 V
IDD3
fx = 32 kHz , VDD = 3 V, Ta = 25°C
IDD4
fx = 32 kHz , VDD = 3 V , Ta = –40°C to +85°C
Unit
typ
max
0.9
1.7
mA
4
24
µA
2.6
5
µA
20
µA
IDD5
VDD = 3 V , Ta = 25°C
2
µA
IDD6
VDD = 3 V , Ta = –40°C to +85°C
15
µA
In-circuit Emulator
PX-ICE101C/D+PX-PRB101C97-TQFP048-P-0707B-M
PX-ICE101C/D+PX-PRB101C97-QFP044-P-1010 (under planning)
MAD00058BEM
Limit
min
P31, KEY1, TM1IO
P30, KEY0, TM0IO
P25, IRQ5, CLKOUT
P24, IRQ4
P23, IRQ3
P22, IRQ2
P21, IRQ1
P20, IRQ0
P13
P12, SBT0A
P11, TXD0A, SBO0A
P10, RXD0A, SBI0A
36
35
34
33
32
31
30
29
28
27
26
25
 Pin Assignment
P32, KEY2, TM2IO
37
24
AN7, P07
P33, KEY3, TM3IO
38
23
AN6, P06
P34, KEY4, TM7IO
39
22
AN5, P05
P35, KEY5, NBUZZER
40
21
AN4, P04
P36, KEY6, BUZZER
41
20
AN3, P03
P37, KEY7
42
19
AN2, P02
P40, SBI3
43
18
AN1, P01
P41, SBO3, SDA3
44
17
AN0, P00
P42, SBT3, SCL3
45
16
VREF+
P43, RXD0B, SBI0B
46
15
LED4, P54
P44, , TXD0B, SBO0B
47
14
TM7O, LED3, P53
P45, SBT0B
48
13
TM2O, LED2, P52
3
4
5
6
7
8
9
10
11
12
XO
XI
MMOD
OSC1
OSC2
VSS
LED5, P55
RMOUT, LED0, P50
TM0O, LED1, P51
2
VDD
NRST, P27
1
DMOD
MN101C97A
MN101C97D
TQFP048-P-0707B
QFP044-P-1010F
QFN044-P-0606A
MAD00058BEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.
Similar pages