M27C4001 4 Mbit (512Kb x 8) UV EPROM and OTP EPROM Feature summary ■ 5V ± 10% supply voltage in Read operation ■ Access time: 35ns ■ Low power consumption: – Active Current 30mA at 5MHz – Standby Current 100µA ■ Programming voltage: 12.75V ± 0.25V ■ Programming time: 100µs/Word ■ Electronic signature – Manufacturer Code: 20h – Device Code: 41h ■ Packages – ECOPACK® compliant versions 32 1 FDIP32W (F) 32 1 PDIP32 (B) PLCC32 (C) TSOP32 (N) 8 x 20 mm March 2006 Rev 4 1/24 www.st.com 1 Contents M27C4001 Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/24 M27C4001 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18 PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21 Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3/24 List of figures M27C4001 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 4/24 Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18 PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21 M27C4001 1 Summary description Summary description The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organised as 524,288 by 8 bits. The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. Logic Diagram VCC VPP 19 8 A0-A18 E Q0-Q7 M27C4001 G VSS AI00721B Table 1. Signal names A0-A18 Address Inputs Q0-Q7 Data Outputs E Chip Enable G Output Enable VPP Program Supply VCC Supply Voltage VSS Ground 5/25 Summary description Figure 2. M27C4001 DIP Connections VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27C4001 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 VCC A18 A17 A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3 AI00722 LCC Connections A12 A15 A16 VPP VCC A18 A17 Figure 3. 1 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 9 M27C4001 25 A14 A13 A8 A9 A11 G A10 E Q7 VSS Q3 Q4 Q5 Q6 Q1 Q2 17 AI00723 6/25 M27C4001 Summary description Figure 4. TSOP Connections A11 A9 A8 A13 A14 A17 A18 VCC VPP A16 A15 A12 A7 A6 A5 A4 1 8 9 16 32 M27C4001 (Normal) 25 24 17 G A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 A3 AI01155B 7/25 Device operation 2 M27C4001 Device operation The operating modes of the M27C4001 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature. 2.1 Read Mode The M27C4001 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. 2.2 Standby Mode The M27C4001 has a standby mode which reduces the supply current from 30mA to 100µA. The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. 2.3 Two Line Output Control Because EPROMs are usually used in larger memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: a) the lowest possible memory power dissipation, b) complete assurance that output bus contention will not occur. For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. 8/25 M27C4001 2.4 Device operation System Considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. 2.5 Programming When delivered (and after each erasure for UV EPROM), all bits of the M27C4001 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C4001 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. 2.6 PRESTO II Programming Algorithm PRESTO II Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II consists of applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the necessary margin to each programmed cell. 9/25 Device operation Figure 5. M27C4001 Programming Flowchart VCC = 6.25V, VPP = 12.75V n=0 E = 100µs Pulse NO ++n = 25 YES FAIL NO ++ Addr VERIFY YES Last Addr NO YES CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4.2V AI00760B 2.7 Program Inhibit Programming of multiple M27C4001s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C4001 may be common. A TTL low level pulse applied to a M27C4001's E input, with VPP at 12.75V, will program that M27C4001. A high level E input inhibits the other M27C4001s from being programmed. 2.8 Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and VCC at 6.25V. 2.9 Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C4001. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C4001 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27C4001, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. 10/25 M27C4001 2.10 Device operation Erasure operation (applies to UV EPROM) The erasure characteristics of the M27C4001 are such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Data shows that constant exposure to room level fluorescent lighting could erase a typical M27C4001 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C4001 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C4001 window to prevent unintentional erasure. The recommended erasure procedure for the M27C4001 is exposure to short wave ultraviolet light which has wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C4001 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. Table 2. Operating Modes(1) Mode E G A9 Vpp Q7 - Q0 Read VIL VIL X VCC or VSS Data Out Output Disable VIL VIH X VCC or VSS Hi-Z VIL Pulse VIH X VPP Data In Verify VIH VIL X VPP Data Out Program Inhibit VIH VIH X VPP Hi-Z Standby VIH X X VCC or VSS Hi-Z Electronic Signature VIL VIL VID VCC Codes Program 1. X = VIH or VIL, VID = 12V ± 0.5V. Table 3. Electronic Signature Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Electronic Signature VIH 0 1 0 0 0 0 0 1 41h 11/25 Maximum rating 3 M27C4001 Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Absolute Maximum Ratings Symbol TA Parameter Ambient Operating Temperature(1) Value Unit –40 to 125 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C VIO(2) Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V –2 to 13.5 V –2 to 14 V VCC VA9(2) VPP A9 Voltage Program Supply Voltage 1. Depends on range. 2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 12/25 M27C4001 4 DC and AC parameters DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC Measurement Conditions High Speed Standard Input Rise and Fall Times ≤10ns ≤20ns Input Pulse Voltages 0 to 3V 0.4 to 2.4V 1.5V 0.8 and 2V Input and Output Timing Ref. Voltages Figure 6. AC Testing Input Output Waveform High Speed 3V 1.5V 0V Standard 2.4V 2.0V 0.8V 0.4V AI01822 Figure 7. AC Testing Load Circuit 1.3V 1N914 3.3kΩ DEVICE UNDER TEST OUT CL CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance AI01823B 13/25 DC and AC parameters Capacitance (1) (2) Table 6. Symbol CIN COUT M27C4001 Parameter Test Condition Input Capacitance Output Capacitance Min Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF 1. TA = 25 °C, f = 1 MHz. 2. Sampled only, not 100% tested. . Table 7. Symbol Read Mode DC Characteristics(1) (2) Parameter Test Condition Min Max Unit 0V ≤VIN ≤VCC ±10 µA 0V ≤VOUT ≤VCC ±10 µA E = VIL, G = VIL, IOUT = 0mA, f = 5MHz 30 mA E = VIH 1 mA E > VCC – 0.2V 100 µA VPP = VCC 10 µA ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS IPP Program Current VIL Input Low Voltage –0.3 0.8 V VIH(3) Input High Voltage 2 VCC + 1 V VOL Output Low Voltage 0.4 V VOH IOL = 2.1mA Output High Voltage TTL IOH = –400µA 2.4 V Output High Voltage CMOS IOH = –100µA VCC – 0.7V V 1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.. 3. Maximum DC voltage on Output is VCC +0.5V. Table 8. Symbol Programming Mode DC Characteristics (1) (2) Parameter Test Condition Min 0 ≤VIN ≤VCC Max Unit ±10 µA 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current VIL Input Low Voltage –0.3 0.8 V VIH Input High Voltage 2 VCC + 0.5 V VOL Output Low Voltage 0.4 V VOH Output High Voltage TTL VID A9 Voltage E = VIL IOL = 2.1mA IOH = –400µA 2.4 11.5 V 12.5 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 14/25 V M27C4001 DC and AC parameters Figure 8. Read Mode AC Waveforms VALID A0-A18 VALID tAVQV tAXQX E tEHQZ tGLQV G tGHQZ tELQV Hi-Z Q0-Q7 AI00724B Table 9. Read Mode AC Characteristics(1) (2) M27C4001 Symbol Alt Parameter -35(3) Test Condition Min tAVQV tACC Address Valid to Output Valid tELQV tCE tGLQV -45(3) Max Min Max -55(3) Min Unit Max E = VIL, G = VIL 35 45 55 ns Chip Enable Low to Output Valid G = VIL 35 45 55 ns tOE Output Enable Low to Output Valid E = VIL 20 25 30 ns tEHQZ(4) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 0 30 ns tGHQZ(4) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 0 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 0 0 ns 1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested. 15/25 DC and AC parameters Table 10. M27C4001 Read Mode AC Characteristics(1) (2) M27C4001 Symbol Alt Parameter Test Condition -70 Min tAVQV tACC Address Valid to Output Valid tELQV tCE tGLQV -80/-90 Max Min Max -10/-12/-15 Unit Min Max E = VIL, G = VIL 70 80 100 ns Chip Enable Low to Output Valid G = VIL 70 80 100 ns tOE Output Enable Low to Output Valid E = VIL 35 40 50 ns tEHQZ(3) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 0 30 ns tGHQZ(3) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 0 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 0 0 1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested. 16/25 ns M27C4001 DC and AC parameters Figure 9. Programming and Verify Modes AC Waveforms VALID A0-A18 tAVPL Q0-Q7 DATA IN tQVEL DATA OUT tEHQX VPP tVPHEL tGLQV tGHQZ VCC tVCHEL tGHAX E tELEH tQXGL G PROGRAM VERIFY AI00725 Table 11. Programming Mode AC Characteristics(1) (2) (3) Symbol Alt Parameter Test Condition Min Max tAVEL tAS Address Valid to Chip Enable Low 2 µs tQVEL tDS Input Valid to Chip Enable Low 2 µs tVPHEL tVPS VPP High to Chip Enable Low 2 µs tVCHEL tVCS VCC High to Chip Enable Low 2 µs tELEH tPW Chip Enable Program Pulse Width 95 tEHQX tDH Chip Enable High to Input Transition 2 µs tQXGL tOES Input Transition to Output Enable Low 2 µs tGLQV tOE Output Enable Low to Output Valid tGHQZ tDFP Output Enable High to Output Hi-Z 0 tGHAX tAH Output Enable High to Address Transition 0 105 Unit µs 100 ns 130 ns ns 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested. 17/25 Package mechanical 5 M27C4001 Package mechanical Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline A2 A3 A1 B1 B A L α e eA D2 C eB D S N ∅ E1 E 1 FDIPW-a 1. Drawing is not to scale. Table 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data millimeters inches Symbol Typ Min A Typ Min 5.72 Max 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177 B 0.41 0.56 0.016 0.022 – – – – C 0.23 0.30 0.009 0.012 D 41.73 42.04 1.643 1.655 B1 1.45 0.057 D2 38.10 – – 1.500 – – e 2.54 – – 0.100 – – E 15.24 – – 0.600 – – 13.06 13.36 0.514 0.526 – – – – eB 16.18 18.03 0.637 0.710 L 3.18 4.10 0.125 0.161 0.060 0.098 – – 4° 11° E1 eA N 14.99 32 S Ø α 18/25 Max 7.11 0.590 32 1.52 2.49 – – 4° 11° 0.280 M27C4001 Package mechanical Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline A2 A A1 b1 b α L e eA c D2 D S N E1 E 1 PDIP-C 1. Drawing is not to scale. Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data millimeters inches Symbol Typ Min A Typ Min 4.83 A1 A2 Max Max 0.190 0.38 0.015 3.81 0.150 b 0.41 0.53 0.016 0.021 b1 1.14 1.65 0.045 0.065 c 0.23 0.38 0.009 0.015 D 41.78 42.29 1.645 1.665 eA 15.24 – – 0.600 – – e 2.54 – – 0.100 – – E 15.24 15.88 0.600 0.625 E1 13.46 13.97 0.530 0.550 S 1.65 2.21 0.065 0.087 L 3.05 3.56 0.120 0.140 α 0° 15° 0° 15° N 32 32 19/25 Package mechanical M27C4001 Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline D D1 A1 A2 1 N B1 E2 E3 e E1 E F B 0.51 (.020) E2 1.14 (.045) A D3 R D2 CP D2 PLCC-A 1. Drawing is not to scale. Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data millimeters inches Symbol Typ Min Max A 3.18 A1 Min Max 3.56 0.125 0.140 1.53 2.41 0.060 0.095 A2 0.38 – 0.015 – B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 CP 0.10 0.004 D 12.32 12.57 0.485 0.495 D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 – – – – E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 D3 7.62 0.300 E3 10.16 – – 0.400 – – e 1.27 – – 0.050 – – 0.00 0.13 0.000 0.005 – – – – F 20/25 Typ R 0.89 N 32 0.035 32 M27C4001 Package mechanical Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline A2 N 1 e E B N/2 A D1 CP D DIE C A1 TSOP-a α L 1. Drawing is not to scale. Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data millimeters inches Symbol Typ Min A Max Typ Min 1.200 Max 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 0.950 1.050 0.0374 0.0413 B 0.170 0.250 0.0067 0.0098 C 0.100 0.210 0.0039 0.0083 CP 0.100 0.0039 D 19.800 20.200 0.7795 0.7953 D1 18.300 18.500 0.7205 0.7283 – – – – E 7.900 8.100 0.3110 0.3189 L 0.500 0.700 0.0197 0.0276 0° 5° e N α 0.500 32 0.0197 32 0° 5° 21/25 Part numbering 6 M27C4001 Part numbering Table 16. Ordering Information Scheme Example: M27C4001 -45 X C 1 Device Type M27 Supply Voltage C = 5V Device Function 4001 = 4 Mbit (512Kb x 8) Speed -35(1) = 35 ns -45(1) = 45 ns -55(1) = 55 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns VCC Tolerance blank = ± 10% X = ± 5% Package F = FDIP32W B = PDIP32 C = PLCC32 N = TSOP32: 8 x 20 mm Temperature Range 1 = 0 to 70 °C 6 = –40 to 85 °C 1. High Speed, see AC Characteristics section for further information. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 22/25 M27C4001 7 Revision history Revision history Table 17. Document revision history Date Revision July 1998 1 First Issue 09/25/00 2 AN620 Reference removed 11/29/00 3 PLCC codification changed (Table 16.) 4 Document converted to new template (sections added, information moved). LCCC32W package removed. Package specifications updated (see Section 5: Package mechanical). Packages are ECOPACK® compliant. X and TR options removed from Table 16: Ordering Information Scheme. 28-Mar-2006 Changes 23/25 M27C4001 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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