ZXTP25100CFH 100V, SOT23, PNP medium power transistor Summary BVCEO > -100V BVECO > -7V IC(cont) = -1A VCE(sat) < -220mV @ 1A RCE(sat) = 150m PD = 1.25W Complementary part number ZXTN25100CFH Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium. B Features • High power dissipation SOT23 package • High peak current • Low saturation voltage • 7V reverse blocking voltage E E Applications • MOSFET and IGBT gate driving • DC - DC converters • Motor drive • High side driver • Load disconnect switch C B Pinout - top view Ordering information Device ZXTP25100CFHTA Reel size (inches) Tape width (mm) Quantity per reel 7 8 3000 Device marking 1G5 Issue 2 - October 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTP25100CFH Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -115 V Collector-emitter voltage VCEO -100 V Emitter-collector voltage (reverse blocking) VECO -7 V Emitter-base voltage VEBO -7 V Continuous collector current(a) IC -1 A Base current IB -500 mA Peak pulse current ICM -3 A Power dissipation at Tamb = 25°C(a) PD 0.73 W 5.84 mW/°C 1.05 W 8.4 mW/°C 1.25 W 9.6 mW/°C 1.81 W 14.5 mW/°C Tj, Tstg -55 to 150 °C Linear derating factor Power dissipation at Tamb = PD 25°C(b) Linear derating factor PD Power dissipation at Tamb = 25°C(c) Linear derating factor PD Power dissipation at Tamb = 25°C(d) Linear derating factor Operating and storage temperature range Thermal resistance Parameter Symbol Limit Unit ambient(a) RJA 171 °C/W Junction to ambient(b) RJA 119 °C/W Junction to ambient(c) RJA 100 °C/W Junction to ambient(d) RJA 69 °C/W Junction to NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 2 - October 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP25100CFH Characteristics Issue 2 - October 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP25100CFH Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Collector-base breakdown voltage BVCBO -115 -180 V IC = -100A Collector-emitter breakdown voltage (base open) BVCEO -100 -140 V IC = -10mA (*) Emitter-base breakdown voltage BVEBO -7 -8.4 V IE = -100A Emitter-collector breakdown voltage (reverse blocking) BVECX -7 -8.3 V IE = -100A, RBC < 1k or -0.25 < VBC < 0.25V Emitter-collector breakdown voltage (base open) BVECO -7 -8.8 V IE = -100A Collector-base cut-off current ICBO -50 nA VCB = -115V -0.5 A VCB = -115V, Tamb= 100°C <-1 Max. Unit Conditions Collector emitter cut-off current ICEX - -100 nA VCE = -90V, RBE < 1k or -0.25V < VBE < 1V Emitter-base cut-off current IEBO <-1 -50 nA VEB = -5.6V Collector-emitter saturation voltage VCE(sat) -140 -210 mV IC = -100mA, IB = -1mA(*) -80 -110 mV IC = -500mA, IB = -50mA(*) -180 -310 mV IC = -500mA, IB = -20mA(*) -150 -220 mV IC = -1A, IB = -100mA(*) Base-emitter saturation voltage VBE(sat) -845 -950 mV IC = -1A, IB = -100mA(*) Base-emitter turn-on voltage VBE(on) -790 -900 mV IC = -1A, VCE = -2V(*) 200 350 500 180 320 IC = -100mA, VCE = -2V(*) 110 190 IC = -500mA, VCE = -2V(*) 20 35 IC = -1A, VCE = -2V(*) Static forward current transfer hFE ratio Transition frequency fT 180 Output capacitance Cobo 14.1 Delay time td Rise time IC = -10mA, VCE = -2V(*) MHz IC = -20mA, VCE = -15V f = 100MHz 20 pF VCB = -10V, f = 1MHz(*) 15.8 ns tr 41 ns Storage time ts 411 ns VCC = -10V. IC = -500mA, IB1 = IB2= -50mA. Fall time tf 89 ns NOTES: (*) Measured under pulsed conditions. Pulse width 300s; duty cycle 2%. Issue 2 - October 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP25100CFH Typical characteristics Issue 2 - October 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP25100CFH Intentionally left blank Issue 2 - October 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP25100CFH Package outline - SOT23 E e e1 b 3 leads L1 D E1 A L A1 Dim. c Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A - 1.12 - 0.044 e1 A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055 c 0.085 0.20 0.003 0.008 L 0.25 0.60 0.0098 0.0236 D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024 - - - - - e 0.95 NOM Min. 0.037 NOM Max. Inches 1.90 NOM Min. Max. 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 2 - October 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP25100CFH Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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