Siemens HYB3116405BTL-50 3.3v 4m x 4-bit edo-dynamic ram Datasheet

3.3V 4M x 4-Bit EDO-Dynamic RAM
HYB3116405BJ/BT(L) -50/-60/-70
HYB3117405BJ/BT(L) -50/-60/-70
Advanced Information
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4 194 304 words by 4-bit organization
0 to 70 °C operating temperature
Performance
-50
-60
-70
tRAC
RAS access time
50
60
70
ns
tCAC
CAS access time
13
15
20
ns
tAA
Access time from address
25
30
35
ns
tRC
Read/Write cycle time
84
104
124
ns
tHPC
Hyper page mode (EDO)
cycle time
20
25
30
ns
Single + 3.3 V (± 0.3V ) supply
Low power dissipation
max. 396 active mW (HYB3117405BJ/BT-50)
max. 363 active mW (HYB3117405BJ/BT-60)
max. 330 active mW (HYB3117405BJ/BT-70)
max. 360 active mW (HYB3116405BJ/BT-50)
max. 324 active mW (HYB3116405BJ/BT-60)
max. 288 active mW (HYB3116405BJ/BT-70)
7.2 mW standby (LV-TTL)
3.6 mW standby (LV-CMOS)
720 µW standby for L-version
Output unlatched at cycle end allows two-dimensional chip selection
Read, write, read-modify-write, CAS-before-RAS refresh, RAS-only refresh, hidden refresh,
Self Refresh and test mode
Hyper page mode (EDO) capability
All inputs, outputs and clocks fully TTL-compatible
2048 refresh cycles / 32 ms for HYB3117405
4096 refresh cycles / 64 ms for HYB3116405
Plastic Package:
P-SOJ-26/24-1 (300 mil)
P-TSOPII-26/24-1 (300mil)
Semiconductor Group
1
3.96
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
The HYB 3116(7)405BJ/BT(L) is a 16MBit dynamic RAM organized as 4194304 words by 4-bits.
The HYB 3116(7)405BJ/BT(L) utilizes a submicron CMOS silicon gate process technology, as well
as advanced circuit techniques to provide wide operating margins, both internally and for the system
user. Multiplexed address inputs permit the HYB 3116(7)405BJ/BT(L) to be packaged in a standard
SOJ 26/24 300 mil or TSOPII-26/24 300 mil wide plastic package. These packages provide high
system bit densities and are compatible with commonly used automatic testing and insertion
equipment. System-oriented features include single + 3.3 V (± 0.3 V) power supply, direct
interfacing with high-performance logic device families.The HYB3116405BTL parts have a very low
power „sleep mode“ supported by Self Refresh.
Ordering Information
Type
Ordering Code
Package
Descriptions
HYB 3117405BJ-50
Q67100-Q1119
P-SOJ-26/24-1 300 mil
DRAM (access time 50 ns)
HYB 3117405BJ-60
Q67100-Q1120
P-SOJ-26/24-1 300 mil
DRAM (access time 60 ns)
P-SOJ-26/24-1 300 mil
DRAM (access time 70 ns)
HYB 3117405BJ-70
HYB 3117405BT-50
Q67100-Q1135
P-TSOPII-26/24-1 300 mil
DRAM (access time 50 ns)
HYB 3117405BT-60
Q67100-Q1136
P-TSOPII-26/24-1 300 mil
DRAM (access time 60 ns)
HYB 3117405BT-70
Q67100-Q1184
P-TSOPII-26/24-1 300 mil
DRAM (access time 70 ns)
HYB 3116405BJ-50
Q67100-Q1127
P-SOJ-26/24-1 300 mil
DRAM (access time 50 ns)
HYB 3116405BJ-60
Q67100-Q1128
P-SOJ-26/24-1 300 mil
DRAM (access time 60 ns)
P-SOJ-26/24-1 300 mil
DRAM (access time 70 ns)
HYB 3116405BJ-70
HYB 3116405BT-50
Q67100-Q1143
P-TSOPII-26/24-1 300 mil
DRAM (access time 50 ns)
HYB 3116405BT-60
Q67100-Q1144
P-TSOPII-26/24-1 300 mil
DRAM (access time 60 ns)
HYB 3116405BT-70
Q67100-Q1186
P-TSOPII-26/24-1 300 mil
DRAM (access time 70 ns)
HYB 3116405BTL-50
on request
P-TSOPII-26/24-1 300 mil
LP-DRAM (access time 50 ns)
HYB 3116405BTL-60
on request
P-TSOPII-26/24-1 300 mil
LP-DRAM (access time 60 ns)
HYB 3116405BTL-70
on request
P-TSOPII-26/24-1 300 mil
LP-DRAM (access time 70 ns)
Semiconductor Group
2
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
Vcc
I/O1
I/O2
WE
RAS
N.C.
1
2
3
4
5
6
26
25
24
23
22
21
Vss
I/O4
I/O3
CAS
OE
A9
Vcc
I/O1
I/O2
WE
RAS
A11
1
2
3
4
5
6
26
25
24
23
22
21
Vss
I/O4
I/O3
CAS
OE
A9
A10
A0
A1
A2
A3
VCC
8
9
10
11
12
13
19
18
17
16
15
14
A8
A7
A6
A5
A4
Vss
A10
A0
A1
A2
A3
VCC
8
9
10
11
12
13
19
18
17
16
15
14
A8
A7
A6
A5
A4
Vss
HYB3117405BJ/BT
HYB3116405BJ/BT
P-SOJ-26/24-1
(300mil)
P-TSOPII-26/24-1 (300mil)
Pin Configuration
Pin Names
A0 to A10
Row & Column Address Inputs for HYB3117405
A0 to A11
Row Address Inputs for HYB3116405
A0 to A9
Column Address Inputs for HYB3116405
RAS
Row Address Strobe
OE
Output Enable
I/O1 -I/O4
Data Input/Output
CAS
Column Address Strobe
WE
Read/Write Input
VCC
Power Supply (+ 3.3 V)
VSS
Ground (0 V)
N.C.
not connected
Semiconductor Group
3
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
I/O1 I/O2 I/O3 I/O4
WE
CAS
&
.
Data in
Buffer
No. 2 Clock
Generator
11
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
Data out
Buffer
4
4
Column
Address
Buffer(11)
11
Column
Decoder
Refresh
Controller
Sense Amplifier
I/O Gating
Refresh
Counter (11)
2048
x4
11
Row
11
RAS
Address
Buffers(11)
Row
Decoder 2048
11
No. 1 Clock
Generator
Block Diagram for HYB3117405
Semiconductor Group
OE
4
Memory Array
2048x2048x4
4
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
I/O1 I/O2 I/O3 I/O4
WE
CAS
&
.
Data in
Buffer
No. 2 Clock
Generator
10
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
Data out
Buffer
4
4
Column
Address
Buffer(10)
10
Column
Decoder
Refresh
Controller
Sense Amplifier
I/O Gating
Refresh
Counter (12)
1024
x4
12
Row
12
RAS
Address
Buffers(12)
Row
Decoder 4096
12
No. 1 Clock
Generator
Block Diagram for HYB3116405
Semiconductor Group
OE
5
Memory Array
4096x1024x4
4
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
Absolute Maximum Ratings
Operating temperature range ............................................................................................0 to 70 °C
Storage temperature range.........................................................................................– 55 to 150 °C
Input/output voltage ................................................................................-0.5 to min(Vcc+0.5, 4.6) V
Power supply voltage.................................................................................................- 0.5 V to 4.6 V
Power dissipation.................................................................................................................... 0.5 W
Data out current (short circuit) ................................................................................................ 50 mA
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage of
the device. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
DC Characteristics (values in brackets for HYB3117405)
TA = 0 to 70 °C, VSS = 0 V, VCC = 3.3 V ± 0.3 V, tT = 2 ns
Parameter
Symbol
Limit Values
min.
max.
Unit Test
Condition
Input high voltage
VIH
2.0
Vcc+0.5
V
1)
Input low voltage
VIL
– 0.5
0.8
V
1)
TTL Output high voltage (IOUT = – 2 mA)
VOH
2.4
–
V
1)
TTL Output low voltage (IOUT = 2 mA)
VOL
–
0.4
V
1)
CMOS Output high voltage (IOUT = –100 uA)
VOH
VCC-0.2 –
V
CMOS Output low voltage (IOUT = 100 uA)
VOL
–
0.2
V
Input leakage current
(0 V ≤ VIH ≤ Vcc + 0.3V, all other pins = 0 V)
II(L)
– 10
10
µA
1)
Output leakage current
(DO is disabled, 0 V ≤ VOUT ≤ Vcc + 0.3V)
IO(L)
– 10
10
µA
1)
Average VCC supply current:
ICC1
–
–
–
100(120) mA
90 (110) mA
80 (100) mA
2) 3) 4)
–
2
–
-50 ns version
-60 ns version
-70 ns version
2) 3) 4)
2) 3) 4)
(RAS, CAS, address cycling, tRC = tRC min.)
Standby VCC supply current (RAS = CAS = VIH) ICC2
Semiconductor Group
6
mA
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
DC Characteristics (values in brackets for HYB3117405)
TA = 0 to 70 °C, VSS = 0 V, VCC = 3.3 V ± 0.3 V, tT = 2 ns
Parameter
Average VCC supply current, during RAS-only
refresh cycles:
-50 ns version
-60 ns version
-70 ns version
Symbol
Limit Values
Unit Test
Condition
min.
max.
–
–
–
100(120) mA
90 (110) mA
80 (100) mA
2) 4)
–
–
–
70 (70)
55 (55)
45 (45)
mA
mA
mA
2) 3) 4)
–
1
200
mA
µA
1)
ICC3
2) 4)
2) 4)
(RAS cycling: CAS = VIH, tRC = tRC min.)
Average VCC supply current, during hyper page ICC4
mode EDO):
-50 ns version
-60 ns version
-70 ns version
2) 3) 4)
2) 3) 4)
(RAS = VIL, CAS, address cycling, tPC = tPC min.)
Standby VCC supply current
(RAS = CAS = VCC – 0.2 V)
ICC5
Average VCC supply current, during CASbefore-RAS refresh mode: -50 ns version
-60 ns version
-70 ns version
ICC6
–
–
–
100(120) mA
90 (110) mA
80 (100) mA
_
1
250
L-version
2) 4)
2) 4)
2) 4)
(RAS, CAS cycling, tRC = tRC min.)
Average Self Refresh Current
ICC7
mA
µA
L-version
(CBR cylce with tRAS>TRASSmin., CAS held low,
WE=Vcc-0.2V, Address and Din=Vcc-0.2V or 0.2V)
Capacitance
TA = 0 to 70 °C,VCC = 3.3 V ± 0.3V, f = 1 MHz
Parameter
Symbol
Limit Values
min.
max.
Unit
Input capacitance (A0 to A10, A11)
CI1
–
5
pF
Input capacitance (RAS, CAS, WE, OE)
CI2
–
7
pF
I/O capacitance (I/O1 - I/O4)
CIO
–
7
pF
Semiconductor Group
7
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
AC Characteristics 5)6)
TA = 0 to 70 °C,VCC = 5 V ± 10 %, tT = 2 ns
Parameter
16E
Limit Values
Symbol
-50
Unit Note
-60
-70
min.
max. min.
max. min.
max.
common parameters
Random read or write cycle time
tRC
84
–
104
–
124
–
ns
RAS precharge time
tRP
30
–
40
–
50
–
ns
RAS pulse width
tRAS
50
10k
60
10k
70
10k
ns
CAS pulse width
tCAS
8
10k
10
10k
12
10k
ns
Row address setup time
tASR
0
–
0
–
0
–
ns
Row address hold time
tRAH
8
–
10
–
10
–
ns
Column address setup time
tASC
0
–
0
–
0
–
ns
Column address hold time
tCAH
8
–
10
–
12
–
ns
RAS to CAS delay time
tRCD
12
37
14
45
14
53
ns
RAS to column address delay
tRAD
10
25
12
30
12
35
ns
RAS hold time
tRSH
13
15
–
17
–
ns
CAS hold time
tCSH
40
50
–
60
–
ns
CAS to RAS precharge time
tCRP
5
–
5
–
5
–
ns
Transition time (rise and fall)
tT
1
50
1
50
1
50
ns
Refresh period for HYB5116405
tREF
–
64
–
64
–
64
ms
Refresh period for HYB5117405
tREF
–
32
–
32
–
32
ms
Refresh period for L-version
tREF
–
256
–
256
–
256
ms
Access time from RAS
tRAC
–
50
–
60
–
70
ns
8, 9
Access time from CAS
tCAC
–
13
–
15
–
17
ns
8, 9
Access time from column address tAA
–
25
–
30
–
35
ns
8,10
OE access time
–
13
–
15
–
17
ns
Column address to RAS lead time tRAL
25
–
30
–
35
–
ns
Read command setup time
tRCS
0
–
0
–
0
–
ns
Read command hold time
tRCH
0
–
0
–
0
–
ns
11
Read command hold time
referenced to RAS
tRRH
0
–
0
–
0
–
ns
11
CAS to output in low-Z
tCLZ
0
–
0
–
0
–
ns
8
7
Read Cycle
Semiconductor Group
tOEA
8
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
AC Characteristics (cont’d) 5)6)
TA = 0 to 70 °C,VCC = 5 V ± 10 %, tT = 2 ns
Parameter
16E
Limit Values
Symbol
-50
Unit Note
-60
-70
min.
max. min.
max. min.
max.
Output buffer turn-off delay
tOFF
0
13
0
15
0
17
ns
12
Output turn-off delay from OE
tOEZ
0
13
0
15
0
17
ns
12
Data to CAS low delay
tDZC
0
–
0
–
0
–
ns
13
Data to OE low delay
tDZO
0
–
0
–
0
–
ns
13
CAS high to data delay
tCDD
10
–
13
–
15
–
ns
14
OE high to data delay
tODD
10
–
13
–
15
–
ns
14
Write command hold time
tWCH
8
–
10
–
10
–
ns
Write command pulse width
tWP
8
–
10
–
10
–
ns
Write command setup time
tWCS
0
–
0
–
0
–
ns
Write command to RAS lead time tRWL
13
–
15
–
17
–
ns
Write command to CAS lead time tCWL
13
–
15
–
17
–
ns
Data setup time
tDS
0
–
0
–
0
–
ns
16
Data hold time
tDH
8
–
10
–
12
–
ns
16
Read-write cycle time
tRWC
113
–
138
–
162
–
ns
RAS to WE delay time
tRWD
64
–
77
–
89
–
ns
15
CAS to WE delay time
tCWD
27
–
32
–
36
–
ns
15
Column address to WE delay time tAWD
39
–
47
–
54
–
ns
15
OE command hold time
tOEH
10
–
13
–
15
–
ns
Hyper page mode (EDO) cycle
time
tHPC
20
–
25
–
30
–
ns
CAS precharge time
tCP
8
–
10
–
10
–
ns
Access time from CAS precharge
tCPA
–
27
–
32
–
37
ns
Output data hold time
tCOH
5
–
5
–
5
–
ns
RAS pulse width in EDO mode
tRAS
50
200k 60
Write Cycle
15
Read-modify-Write Cycle
Hyper Page Mode (EDO) Cycle
Semiconductor Group
9
200k 70
200k ns
7
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
AC Characteristics (cont’d) 5)6)
TA = 0 to 70 °C,VCC = 5 V ± 10 %, tT = 2 ns
Parameter
16E
Limit Values
Symbol
-50
CAS precharge to RAS Delay
tRHPC
Unit Note
-60
-70
min.
max. min.
max. min.
max.
27
–
32
–
37
–
ns
Hyper Page Mode (EDO) Read-modify-Write Cycle
Hyper page mode (EDO) readwrite cycle time
tPRWC
58
–
68
–
77
–
ns
CAS precharge to WE
tCPWD
41
–
49
–
56
–
ns
CAS setup time
tCSR
10
–
10
–
10
–
ns
CAS hold time
tCHR
10
–
10
–
10
–
ns
RAS to CAS precharge time
tRPC
5
–
5
–
5
–
ns
Write to RAS precharge time
tWRP
10
–
10
–
10
–
ns
Write hold time referenced to RAS tWRH
10
–
10
–
10
–
ns
tCPT
35
–
40
–
40
–
ns
RAS pulse width
tRASS
100k _
100k _
100k _
ns
17
RAS precharge
tRPS
95
_
110
_
130
_
ns
17
CAS hold time
tCHS
-50
_
-50
_
-50
_
ns
17
Write command setup time
tWTS
10
–
10
–
10
–
ns
Write command hold time
tWTH
10
–
10
–
10
–
ns
CAS hold time
tCHRT
30
–
30
–
30
–
ns
CAS-before-RAS Refresh Cycle
CAS-before-RAS Counter Test Cycle
CAS precharge time
Self Refresh Cycle
Test Mode
Semiconductor Group
10
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
Notes:
1) All voltages are referenced to VSS.
2) ICC1, ICC3, ICC4 and ICC6 depend on cycle rate.
3) ICC1 and ICC4 depend on output loading. Specified values are obtained with the output open.
4) Address can be changed once or less while RAS = Vil. In case of ICC4 it can be changed once or less during
a hyper page mode (EDO) cycle
5) An initial pause of 200 µs is required after power-up followed by 8 RAS cycles of which at least one cycle has
to be a refresh cycle, before proper device operation is achieved. In case of using the internal refresh counter,
a minimum of 8 CAS-before-RAS initialization cycles instead of 8 RAS cycles are required.
6) AC measurements assume tT = 2 ns.
7) VIH (min.) and VIL (max.) are reference levels for measuring timing of input signals. Transition times are also
measured between VIH and VIL.
8) Measured with the specified current load and 100 pF at Vol = 0.8 V and Voh = 2.0 V. Access time is determined
by the latter of tRAC, tCAC, tAA,tCPA, tOEA . tCAC is measured from tristate.
9) Operation within the tRCD (max.) limit ensures that tRAC (max.) can be met. tRCD (max.) is specified as a reference point
only. If tRCD is greater than the specified tRCD (max.) limit, then access time is controlled by tCAC.
10) Operation within the tRAD (max.) limit ensures that tRAC (max.) can be met. tRAD (max.) is specified as a reference point
only. If tRAD is greater than the specified tRAD (max.) limit, then access time is controlled by tAA.
11) Either tRCH or tRRH must be satisfied for a read cycle.
12) tOFF (max.), tOEZ (max.) define the time at which the output achieves the open-circuit conditions and are not
referenced to output voltage levels. tOFF is referenced from the rising edge of RAS or CAS, whichever occurs
last.
13) Either tDZC or tDZO must be satisfied.
14) Either tCDD or tODD must be satisfied.
15) tWCS, tRWD, tCWD and tAWD are not restrictive operating parameters. They are included in the data sheet as
electrical characteristics only. If tWCS > tWCS (min.), the cycle is an early write cycle and data out pin will remain
open-circuit (high impedance) through the entire cycle; if tRWD > tRWD (min.), tCWD > tCWD (min.) and tAWD > tAWD (min.),
the cycle is a read-write cycle and I/O will contain data read from the selected cells. If neither of the above
sets of conditions is satisfied, the condition of I/O (at access time) is indeterminate.
16) These parameters are referenced to the CAS leading edge in early write cycles and to the WE leading edge
in read-write cycles.
17)When using Self Refresh mode, the following refresh operations must be performed to ensure proper DRAM
operation:
If row addresses are being refreshed on an evenly distributed manner over the refresh interval using CBR
refresh cycles, then only one CBR cycle must be performed immediately after exit from Self Refresh.
If row addresses are being refreshed in any other manner (ROR - Distributed/Burst; or CBR-Burst) over the
refresh interval, then a full set of row refreshes must be performed immediately before entry to and immediately
after exit from Self Refresh
Semiconductor Group
11
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
Waveforms
tRC
tRAS
RAS
V
IH
VIL
tCSH
V
IH
VIL
tRAD
tASR
Address
V
IH
VIL
tCRP
tRSH
tCAS
tRCD
CAS
tRP
tRAL
tCAH
tASC
tASR
Column
Row
Row
tRCH
tRAH
tRCS
tRRH
V
WE
OE
I/O
(Inputs)
IH
VIL
tAA
tOEA
V
IH
VIL
tCDD
tDZC
tODD
tDZO
V
IH
tCAC
VIL
tCLZ
V
OH
I/O
(Outputs) V
Hi Z
tOFF
tOEZ
Valid Data Out
Hi Z
OL
tRAC
WL1
“H” or “L”
Read Cycle
Semiconductor Group
12
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRAS
tRP
V
IH
RAS
VIL
tCSH
tRCD
tRSH
tCAS
V
IH
CAS
VIL
tRAD
tASR
Address
V
IH
tRAL
Row
OE
.
Row
tCWL
tWCS
t WP
IH
VIL
tWCH
tRWL
V
IH
VIL
tDS
I/O
(Inputs)
tASR
Column
VIL
V
WE
tCAH
tASC
tRAH
tCRP
tDH
V
IH
Valid Data In
VIL
V
OH
I/O
(Outputs) V
Hi Z
OL
WL2
“H” or “L”
Write Cycle (Early Write)
Semiconductor Group
13
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRAS
tRP
V
IH
RAS
VIL
tCSH
tRCD
V
IH
CAS
VIL
tRAD
tASR
tCRP
tRSH
tCAS
tCAH
tASC
tRAL
tASR
.
V
IH
Address V
IL
Row
tCWL
tRWL
tWP
tRAH
V
WE
Row
Column
IH
VIL
tOEH
V
OE
IH
tODD
tDS
tOEZ
VIL
tDZO
tDZC
I/O
(Inputs)
tDH
V
IH
Valid Data
VIL
tCLZ
tOEA
V
OH
I/O
(Outputs) V
Hi-Z
Hi-Z
OL
“H” or “L”
WL3
Write Cycle (OE Controlled Write)
Semiconductor Group
14
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRWC
tRAS
RAS
V
IH
tRP
tCSH
VIL
tRSH
tCAS
tRCD
V
tCRP
IH
CAS
VIL
tRAH
tCAH
tASR
tASC
tASR
V
IH
Address
VIL
Row
Column
Row
tCWL
tRWL
tAWD
tRAD
tCWD
tRWD
tWP
V
IH
WE
VIL
tAA
tRCS
tOEH
tOEA
V
IH
OE
VIL
tDS
tDZO
tDZC
I/O
(Inputs)
tDH
V
IH
Valid
Data in
VIL
tCLZ
tODD
tCAC
tOEZ
V
OH
I/O
(Outputs) VOL
Data
Out
tRAC
“H” or “L”
WL4
Read-Write (Read-Modify-Write) Cycle
Semiconductor Group
15
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRP
tRAS
V
tRCD
IH
RAS
tRHCP
VIL
tRSH
tHPC
tCRP
tCAS
tCP
tCAS
tCRP
tCAS
V
IH
CAS
VIL
tCSH
tASR
tRAH tASC
tRAL
tCAH
tASC tCAH
tASC tCAH
Column 2
Column N
V
IH
Address
VIL
Row
Column 1
tRAD
tRRH
tRCH
tRCS
WE
VIH
VIL
tOES
OH
V
tCPA
tCPA
tOFF
tOEA
V
OE
tCAC
tAA
tCAC
tAA
OL
tRAC
tAA
tCAC
tOEZ
tCOH
tCLZ
V
I/O
IH
(Output) V
IL
Data Out
1
Data Out
2
Data Out
N
WL5
“H” or “L”
Hyper Page Mode (EDO) Read Cycle
Semiconductor Group
tCOH
16
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRP
tRAS
V
tRHCP
tRCD
IH
RAS
VIL
tRSH
tHPC
tCRP
tCAS
tCAS
tCP
tCRP
tCAS
V
IH
CAS
VIL
tCSH
tASR
tRAH tASC
tRAL
tCAH
tASC tCAH
tASC tCAH
Column 2
Column N
V
IH
Address
VIL
Row
Addr
Column 1
tRAD
tWCS
tCWL
tCWL
tWCH tWCS
tWCH
tWP
tWP
WE
VIH
tRWL
tCWL
tWCS
tWCH
tWP
VIL
V
OE
OH
V
OL
tDS
tDH
tDS
tDH
tDS
tDH
V
IH
I/O (Input) V
IL
Data In 1
Data In 2
“H” or “L”
WL8
Hyper Page Mode (EDO) Early Write Cycle
Semiconductor Group
Data In N
17
Semiconductor Group
18
IH
IH
IH
IH
V
IH
V IL
V
V IL
V
V IL
V
V IL
V
V IL
IH
Hyper Page Mode (EDO) Late Write and Read-Modify-Write Cycle
OL
OH
I/O
(Outputs) V
V
I/O
(Inputs) V IL
OE
WE
Address
CAS
RAS
V
tASR
Row
tRAH
tRAD
tRAC
tCAS
tAA
tOEA
tCAC
Data In
tDS
tOEH
tCLZ
tOEZ
tWP
tDS
tDH
Data In
tODD
Data
Out
tOEA
tAWD
tCPA
tAA
tDZC
tCAS
tPRWC
tCPWD
tCWD
tCAH
Column
tASC
tCP
tCWL
tWP
tOEZ tDH
tODD
Data
Out
tAWD
tRWD
tCWD
Column
tASC
tCAH
tDZC
tCLZ
tDZO
tRCS
tRCD
tCSH
tRASP
tOEH
tDZC
tCWL
tAWD
tCAC
tAA
tCLZ
tCPA
tRAL
Data
Out
tDS
tDH
tOEH
tRWL
tCWL
tWP
Data In
tODD
tCPWD
tCWD
tOEA
Column
tASC
tCAH
tCAS
tRSH
tCRP
Row
tASR
tRP
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
WL17
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRAS
RAS
tRP
V
IH
VIL
tCRP
tRPC
CAS
V
IH
VIL
tRAH
tASR
tASR
V
Address
IH
Row
VIL
Row
V
OH
I/O
(Outputs) V
HI-Z
OL
“H” or “L”
WL9
RAS-Only Refresh Cycle
Semiconductor Group
19
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRP
RAS
tRASS
tRPS
V
IH
VIL
tRPC
tCP
V
CAS
tCRP
tCHS
tCSR
IH
VIL
tWRP
tWRH
V
WE
OE
IH
VIL
V
IH
VIL
tCDD
I/O
(Inputs)
V
IH
VIL
tODD
tOEZ
V
OH
I/O
(Outputs) V
OL
HI-Z
tOFF
“H” or “L”
WL13
Self Refresh
Semiconductor Group
20
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRP
tRAS
tRP
V
RAS
IH
VIL
tRPC
tCSR
tCRP
tCP
CAS
tRPC
tCHR
V
IH
VIL
tWRP
tWRH
V
WE
IH
VIL
tOEZ
V
IH
OE
VIL
tCDD
I/O
(Inputs)
V
IH
VIL
tODD
V
OH
I/O
(Outputs)VOL
HI-Z
tOFF
“H” or “L”
WL10
CAS-Before-RAS Refresh Cycle
Semiconductor Group
21
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRC
RAS
tRP
tRAS
V
tRP
tRAS
IH
VIL
tRSH
tRCD
tCRP
tCHR
V
CAS
IH
tRAD
VIL
tWRP
tASC
tASR
tRAH
tASR
tWRH
tCAH
V
Address
IH
VIL
Column
Row
Row
tRRH
tRCS
V
WE
IH
VIL
tAA
tOEA
V
OE
IH
VIL
tDZC
tCDD
tDZO
tODD
V
I/O
(Inputs)
IH
VIL
tCAC
tOFF
tCLZ
tOEZ
tRAC
V
OH
I/O
(Outputs) V
Valid Data Out
HI-Z
OL
“H” or “L”
WL11
Hidden Refresh Cycle (Read)
Semiconductor Group
22
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRC
tRP
RAS
tRP
tRAS
V
IH
tRAS
VIL
tRCD
tRSH
tCHR
tCRP
V
CAS
IH
VIL
tRAD
tRAH
tASC
tCAH
tASR
tASR
V
Address
IH
VIL
Row
tWCS
tWRP
tWCH
tWRH
tWP
V
WE
Row
Column
IH
VIL
tDS
tDH
V
I/O
(Input)
IH
Valid Data
V
IL
V
OH
I/O
(Output) V
OL
HI-Z
“H” or “L”
WL12
Hidden Refresh Cycle (Early Write)
Semiconductor Group
23
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRP
tRAS
Read Cycle:
RAS
V IH
V IL
tRSH
tCAS
tCP
tCHR
tCSR
CAS
V IH
V IL
tRAL
tASC
Address
V IH
Column
V IL
tWRP
WE
OE
I/O
(Inputs)
I/O
(Outputs)
V IL
tWRH
tRRH
tOEA
tRCS
V IH
V IL
tDZC
V IH
V IL
tODD
tDZO
VOH
VOL
V IH
V IL
OE
V IH
V IL
I/O
(Inputs)
V IH
tWCS
tWRH
tDH
Data In
HI-Z
CAS-Before-RAS Refresh Counter Test Cycle
Semiconductor Group
tRWL
tCWL
tWCH
V IL
V
IH
V
IL
tOEZ
Data Out
tDS
24
tCDD
tOFF
tCLZ
Write Cycle:
I/O
(Outputs)
Row
tAA
tCAC
V IH
tWRP
WE
tASR
tCAH
tRCH
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
tRC
tRP
tRAS
V
RAS
tRP
IH
VIL
tRPC
tCP
tCSR
tCHR
tRPC
tCRP
V
CAS
IH
VIL
tASR tRAH
V
Address IH
Row
VIL
tWTS
tWTH
V
WE
IH
VIL
V
OE
IH
VIL
V
I/O
IH
(Inputs) V
IL
tODD
HI-Z
tCDD
tOEZ
V
OH
I/O
(Outputs) V
HI-Z
OL
tOFF
“H” or “L”
WL15
Test Mode Entry
Semiconductor Group
25
HYB 3116(7)405BJ/BT(L) -50/-60/-70
3.3V 4Mx4-DRAM
Package Outlines
Plastic Package P-SOJ-26/24-1 (300 mil)
(Small Outline J-leads, SMD)
GPJ05628
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max per side
7.62
1.27
0.4
+- 0.13
0.6
+0.12
-0.1
0.2
M
0.1
24x
26
9.22
-0.2
+- 0.2
14
GPX05857
1
13
17.27
-0.25
1)
Index Marking
Semiconductor Group
26