LAA108 Dual Single-Pole, Normally Open OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 100 300 8 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount Tape & Reel Versions Available Description IXYS Integrated Circuits Division's LAA108 is a 100V, 300mA, 8 dual single-pole, normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled outputs. The output MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 3750 Vrms of input-to-output isolation. The relay outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAlAS infrared LED. This dual single-pole OptoMOS relay provides a more compact design solution than two discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-Pin package. Approvals Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # LAA108 LAA108S LAA108STR LAA108P LAA108PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% Pb DS-LAA108-R04 10% ILOAD e3 ton www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA108 Absolute Maximum Ratings @ 25°C Parameter Ratings Blocking Voltage 100 Reverse Input Voltage 5 Input Control Current 50 Peak (10ms) 1 1 Input Power Dissipation 150 800 Total Power Dissipation 2 Isolation Voltage, Input to Output 3750 Operational Temperature -40 to +85 Storage Temperature -40 to +125 1 2 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / °C Derate linearly 6.67 mW / °C Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Symbol Min Typ Max Units t =10ms IL=300mA VL=100VP IL ILPK RON ILEAK - 4.5 - 300 ±400 8 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 0.43 0.17 110 3 3 - IL=300mA IF=5mA VR=5V IF VF IR 0.2 0.9 - 0.5 0.3 1.2 - 2 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value. 2 Measurement taken within one (1) second of on-time. For applications requiring high-temperature operation (T>60ºC), a LED drive currrent of 4mA is recommended. 3 2 Conditions www.ixysic.com A ms pF R04 INTEGRATED CIRCUITS DIVISION LAA108 PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)* LED Forward Voltage Distribution (IF=5mA) 30 Turn-On Time Distribution (IF=5mA, IL=200mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0 0 15 10 5 10 5 1.2 1.0 -40 0 20 40 60 Temperature (ºC) 80 0.80 Turn-On Time (ms) LED Current (mA) 0.445 0.3 0.2 0.1 0.65 0.60 0.55 -20 0 20 40 60 Temperature (ºC) 80 100 0.430 0.65 10 20 30 40 LED Forward Current (mA) 50 Turn-Off Time vs. Temperature (IF=5mA, IL=80mA) 0.60 0.18 0.14 0.435 0 Turn-On Time vs. Temperature (IF=5mA, IL=80mA) 0.20 0.45 -40 0.440 50 0.22 0.16 144 0.425 10 20 30 40 LED Forward Current (mA) 0.24 0.50 140 141 142 143 Blocking Voltage (VP) Turn-Off Time vs. LED Forward Current (IL=80mA) 0.4 0.26 0.70 5 0.5 0 0.75 10 0.450 100 LED Current to Operate vs. Temperature (IL=100mA) 15 139 0 -20 0.58 20 4.58 Turn-Off Time (ms) 1.1 IF=10mA IF=5mA IF=2mA 4.50 4.52 4.54 4.56 On-Resistance (:) Turn-Off Time (ms) 1.3 4.48 Turn-On Time vs. LED Forward Current (IL=80mA) Turn-On Time (ms) LED Forward Voltage (V) IF=50mA IF=20mA 0.42 0.46 0.50 0.54 Turn-Off Time (ms) 0 4.46 0.70 1.6 0.38 Blocking Voltage Distribution 15 LED Forward Voltage vs. Temperature 1.4 5 25 0 1.5 10 0.34 On-Resistance Distribution (IF=2mA, IL=200mA) 20 0 0.45 0.50 0.55 0.60 0.65 LED Current to Operate (mA) 15 0.135 0.150 0.165 0.180 0.195 0.210 0.225 Turn-On Time (ms) LED Current to Operate Distribution (IL=100mA) 0.40 20 0 1.31 Device Count (N) Device Count (N) 20 1.27 1.28 1.29 1.30 LED Forward Voltage (V) Device Count (N) 1.26 Turn-Off Time Distribution (IF=5mA, IL=200mA) 0.55 0.50 0.45 0.40 0.35 0.30 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.25 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA108 PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)* 0.6 6.0 Load Current (mA) 5.5 5.0 4.5 4.0 -40 -20 0 20 40 60 Temperature (ºC) 80 0.2 0.0 -0.2 -0.4 Blocking Voltage vs. Temperature 25 148 144 142 140 138 400 350 Single Pole Operating 300 250 200 * Neither pole to exceed single pole limits 150 100 -0.2 -0.1 0.0 0.1 Load Voltage (V) 0.2 0.3 -40 Leakage Current vs. Temperature Measured Across Pins 5 & 6, 7 & 8 (VL=100V) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s Energy Rating Curve (Single Pole, IF=5mA) 1.0 0.9 20 146 Leakage (nA) Blocking Voltage (VP) 150 Total Current - Both Poles Operating * 450 0.4 -0.6 -0.3 100 Maximum Load Current vs. Temperature (IF=5mA) 500 Load Curent (A) On-Resistance (:) 6.5 Typical Load Current vs. Load Voltage (IF=2mA) Load Current (mA) On-Resistance vs. Temperature (IF=2mA, IL=200mA) 15 10 5 0.8 0.7 0.6 0.5 0.4 0.3 136 134 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.2 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LAA108 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LAA108 / LAA108S / LAA108P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LAA108 / LAA108S 250ºC for 30 seconds LAA108P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA108 MECHANICAL DIMENSIONS LAA108 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA108S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA108P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LAA108 MECHANICAL DIMENSIONS LAA108STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LAA108PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LAA108-R04 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012