ON CAT93W66 4 kb microwire serial cmoseeprom Datasheet

CAT93C66, CAT93W66
4 kb Microwire Serial CMOS
EEPROM
Description
The CAT93C66 is a 4 kb CMOS Serial EEPROM device which is
organized as either 256 registers of 16 bits (ORG pin at VCC) or 512
registers of 8 bits (ORG pin at GND). The CAT93W66 features x16
memory organization only. Each register can be written (or read)
serially by using the DI (or DO) pin. The device features sequential
read and self−timed internal write with auto−clear. On−chip
Power−On Reset circuitry protects the internal logic against powering
up in the wrong state.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V)
1.8 V to 5.5 V Supply Voltage Range
Selectable x8 or x16 Memory Organization: CAT93C66
Self−timed Write Cycle with Auto−clear
Sequential Read
Software Write Protection
Power−up Inadvertent Write Protection
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Ranges
8−lead PDIP, SOIC, TSSOP, 6−lead SOT−23, 8−pad TDFN and
UDFN Packages
These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
VCC
CS
SK
CS
CAT93C66
DO
SK
CAT93W66
DO
DI
DI
GND
GND
Figure 1. Functional Symbols
When the ORG pin is connected to VCC, the x16 organization is
selected. When it is connected to ground, the x8 organization is
selected. If the ORG pin is left unconnected, then an internal pull−up
device will select the x16 organization.
TDFN−8*
VP2 SUFFIX
CASE 511AK
PDIP−8
L SUFFIX
CASE 646AA
TSSOP−8
Y SUFFIX
CASE 948AL
SOIC−8
X SUFFIX
CASE 751BE
SOT23−6
TB SUFFIX
CASE 527AJ
CS
1
8 VCC
NC
1
8 ORG
SK
2
7 NC
VCC
2
7 GND
DI
3
6 ORG
CS
DO
4
5 GND
SK
3
4
6 DO
5 DI
PDIP (L), SOIC (V, X),
TSSOP (Y), TDFN (VP2)*,
UDFN (HU4)
CS
1
8 VCC
SK
2
7 NC
DI
3
6 NC
DO
4
5 GND
SOIC (W)*
DO
1
6 VCC
GND
2
5 CS
DI
3
4 SK
SOT−23 (TB)**
* Not recommended for new designs
** CAT93C66 available in SOT−23 6−pin for x8
Organization. Contact factory for availability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
CAT93W66:
The device works in x16 mode only.
April, 2012 − Rev. 11
UDFN−8
HU4 SUFFIX
CASE 517AZ
TDFN (VP2)
CAT93W66
CAT93C66 Selectable Organization:
© Semiconductor Components Industries, LLC, 2012
SOIC−8
V, W* SUFFIX
CASE 751BD
PIN CONFIGURATION
VCC
ORG
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1
Publication Order Number:
CAT93C66/D
CAT93C66, CAT93W66
Table 1. PIN FUNCTION
Pin Name
Function
Pin Name
Function
CS
Chip Select
VCC
Power Supply
SK
Clock Input
GND
Ground
DI
Serial Data Input
DO
Serial Data Output
ORG (Note 1)
NC
Memory Organization
No Connection
1. ORG Pin available for the CAT93C66 only.
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Storage Temperature
−65 to +150
°C
Voltage on Any Pin with Respect to Ground (Note 2)
−0.5 to +6.5
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may
undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns.
Table 3. RELIABILITY CHARACTERISTICS (Note 3)
Symbol
Parameter
NEND (Note 4)
TDR
Endurance
Data Retention
Min
Units
1,000,000
Program / Erase Cycles
100
Years
3. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
4. Block Mode, VCC = 5 V, 25°C.
Table 4. D.C. OPERATING CHARACTERISTICS − MATURE PRODUCT
(VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Max
Units
ICC1
Power Supply Current
(Write)
fSK = 1 MHz, VCC = 5.0 V
1
mA
ICC2
Power Supply Current
(Read)
fSK = 1 MHz, VCC = 5.0 V
500
mA
ISB1
Power Supply Current
(Standby) (x8 Mode)
VIN = GND or VCC,
CS = GND ORG = GND
TA = −40°C to +85°C
2
mA
TA = −40°C to +125°C
4
Power Supply Current
(Standby) (x16 Mode)
VIN = GND or VCC, CS = GND
ORG = Float or VCC
TA = −40°C to +85°C
1
TA = −40°C to +125°C
2
Input Leakage Current
VIN = GND to VCC
TA = −40°C to +85°C
1
TA = −40°C to +125°C
2
TA = −40°C to +85°C
1
ISB2
ILI
mA
mA
ILO
Output Leakage Current
VOUT = GND to VCC,
CS = GND
VIL1
Input Low Voltage
4.5 V ≤ VCC < 5.5 V
−0.1
0.8
V
VIH1
Input High Voltage
4.5 V ≤ VCC < 5.5 V
2
VCC + 1
V
VIL2
Input Low Voltage
1.8 V ≤ VCC < 4.5 V
0
VCC x 0.2
V
VIH2
Input High Voltage
1.8 V ≤ VCC < 4.5 V
VCC x 0.7
VCC + 1
V
VOL1
Output Low Voltage
4.5 V ≤ VCC < 5.5 V, IOL = 2.1 mA
0.4
V
VOH1
Output High Voltage
4.5 V ≤ VCC < 5.5 V, IOH = −400 mA
VOL2
Output Low Voltage
1.8 V ≤ VCC < 4.5 V, IOL = 1 mA
VOH2
Output High Voltage
1.8 V ≤ VCC < 4.5 V, IOH = −100 mA
TA = −40°C to +125°C
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2
mA
2
2.4
V
0.2
VCC − 0.2
V
V
CAT93C66, CAT93W66
Table 5. D.C. OPERATING CHARACTERISTICS − NEW PRODUCT (REV H)
(VCC = +1.8 V to +5.5 V, TA=−40°C to +125°C unless otherwise specified.)
Symbol
Parameter
ICC1
Supply Current (Write)
Write, VCC = 5.0 V
ICC2
Supply Current (Read)
Read, DO open, fSK = 2 MHz, VCC = 5.0 V
ISB1
Standby Current
(x8 Mode)
VIN = GND or VCC
CS = GND, ORG = GND
TA = −40°C to +85°C
TA = −40°C to +125°C
5
Standby Current
(x16 Mode)
VIN = GND or VCC
CS = GND,
ORG = Float or VCC
TA = −40°C to +85°C
1
TA = −40°C to +125°C
3
VIN = GND to VCC
TA = −40°C to +85°C
1
TA = −40°C to +125°C
2
TA = −40°C to +85°C
1
TA = −40°C to +125°C
2
ISB2
ILI
Input Leakage Current
ILO
Test Conditions
Min
Output Leakage
Current
VOUT = GND to VCC
CS = GND
VIL1
Input Low Voltage
4.5 V ≤ VCC < 5.5 V
−0.1
VIH1
Input High Voltage
4.5 V ≤ VCC < 5.5 V
VIL2
Input Low Voltage
1.8 V ≤ VCC < 4.5 V
VIH2
Input High Voltage
1.8 V ≤ VCC < 4.5 V
VOL1
Output Low Voltage
4.5 V ≤ VCC < 5.5 V, IOL = 3 mA
VOH1
Output High Voltage
4.5 V ≤ VCC < 5.5 V, IOH = −400 mA
VOL2
Output Low Voltage
1.8 V ≤ VCC < 4.5 V, IOL = 1 mA
VOH2
Output High Voltage
1.8 V ≤ VCC < 4.5 V, IOH = −100 mA
Max
Units
1
mA
500
mA
2
mA
mA
mA
mA
0.8
V
2
VCC + 1
V
0
VCC x 0.2
V
VCC x 0.7
VCC + 1
V
0.4
V
2.4
V
0.2
VCC − 0.2
V
V
Table 6. PIN CAPACITANCE (TA = 25°C, f = 1.0 MHz, VCC = +5.0 V)
Test
Conditions
Output Capacitance (DO)
Symbol
COUT (Note 5)
CIN (Note 5)
Max
Units
VOUT = 0 V
5
pF
VIN = 0 V
5
pF
Input Capacitance (CS, SK, DI, ORG)
Min
Typ
5. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
Table 7. POWER−UP TIMING (Notes 6, 7)
Parameter
Symbol
Max
Units
tPUR
Power−up to Read Operation
1
ms
tPUW
Power−up to Write Operation
1
ms
6. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate
AEC−Q100 and JEDEC test methods.
7. tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
Table 8. A.C. TEST CONDITIONS
Input Rise and Fall Times
≤ 50 ns
Input Pulse Voltages
0.4 V to 2.4 V
4.5 V ≤ VCC ≤ 5.5 V
Timing Reference Voltages
0.8 V, 2.0 V
4.5 V ≤ VCC ≤ 5.5 V
Input Pulse Voltages
0.2 VCC to 0.7 VCC
1.8 V ≤ VCC ≤ 4.5 V
Timing Reference Voltages
0.5 VCC
1.8 V ≤ VCC ≤ 4.5 V
Output Load
Current Source IOLmax/IOHmax; CL = 100 pF
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CAT93C66, CAT93W66
Table 9. A.C. CHARACTERISTICS − MATURE PRODUCT
(VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C, unless otherwise specified.) (Note 8)
Limits
Symbol
Min
Parameter
Max
Units
tCSS
CS Setup Time
50
ns
tCSH
CS Hold Time
0
ns
tDIS
DI Setup Time
100
ns
tDIH
DI Hold Time
100
ns
tPD1
Output Delay to 1
0.25
tPD0
Output Delay to 0
0.25
ms
Output Delay to High−Z
100
ns
5
ms
tHZ (Note 9)
tEW
Program/Erase Pulse Width
ms
tCSMIN
Minimum CS Low Time
0.25
ms
tSKHI
Minimum SK High Time
0.25
ms
tSKLOW
Minimum SK Low Time
0.25
ms
tSV
Output Delay to Status Valid
SKMAX
Maximum Clock Frequency
DC
0.25
ms
2000
kHz
8. Test conditions according to “A.C. Test Conditions” table.
9. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate
AEC−Q100 and JEDEC test methods.
Table 10. A.C. CHARACTERISTICS − NEW PRODUCT (Rev H)
(VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
VCC = 1.8 V − 5.5 V
Symbol
Min
Parameter
Max
VCC = 4.5 V − 5.5 V
Min
Max
Units
tCSS
CS Setup Time
50
50
ns
tCSH
CS Hold Time
0
0
ns
tDIS
DI Setup Time
100
50
ns
100
tDIH
DI Hold Time
tPD1
Output Delay to 1
0.25
0.1
ms
tPD0
Output Delay to 0
0.25
0.1
ms
Output Delay to High−Z
100
100
ns
5
5
ms
tHZ (Note 10)
tEW
Program/Erase Pulse Width
50
ns
tCSMIN
Minimum CS Low Time
0.25
0.1
ms
tSKHI
Minimum SK High Time
0.25
0.1
ms
tSKLOW
Minimum SK Low Time
0.25
0.1
ms
tSV
Output Delay to Status Valid
SKMAX
Maximum Clock Frequency
0.25
DC
2000
10. This parameter is tested initially and after a design or process change that affects the parameter.
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DC
0.1
ms
4000
kHz
CAT93C66, CAT93W66
Device Operation
The CAT93C66 is a 4096−bit nonvolatile memory
intended for use with industry standard microprocessors.
The CAT93C66 can be organized as either registers of 16
bits or 8 bits. When organized as X16, seven 11−bit
instructions control the reading, writing and erase
operations of the device. When organized as X8, seven
12−bit instructions control the reading, writing and erase
operations of the device. The CAT93W66 works in x16
mode only. The device operates on a single power supply
and will generate on chip, the high voltage required during
any write operation.
Instructions, addresses, and write data are clocked into the
DI pin on the rising edge of the clock (SK). The DO pin is
normally in a high impedance state except when reading data
from the device, or when checking the ready/busy status
after a write operation. The serial communication protocol
follows the timing shown in Figure 2.
The ready/busy status can be determined after the start of
internal write cycle by selecting the device (CS high) and
polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that the
device is ready for the next instruction. If necessary, the DO
pin may be placed back into a high impedance state during
chip select by shifting a dummy “1” into the DI pin. The DO
pin will enter the high impedance state on the rising edge of
the clock (SK). Placing the DO pin into the high impedance
state is recommended in applications where the DI pin and
the DO pin are to be tied together to form a common DI/O
pin.
The format for all instructions sent to the device is a
logical “1” start bit, a 2−bit (or 4−bit) opcode, 8−bit address
(an additional bit when organized X8) and for write
operations a 16−bit data field (8−bit for X8 organizations).
The instruction format is shown in Instruction Set table.
Table 11. INSTRUCTION SET
Address
Data
Instruction
Start Bit
Opcode
x8 (Note 11)
READ
1
10
A8−A0
A7−A0
Read Address AN – A0
ERASE
1
11
A8−A0
A7−A0
Clear Address AN – A0
WRITE
1
01
A8−A0
A7−A0
EWEN
1
00
11XXXXXXX
11XXXXXX
Write Enable
EWDS
1
00
00XXXXXXX
00XXXXXX
Write Disable
ERAL
1
00
10XXXXXXX
10XXXXXX
Clear All Addresses
WRAL
1
00
01XXXXXXX
01XXXXXX
x16
11. The x8 memory organization is available for the CAT93C66 only.
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x8 (Note 11)
D7−D0
D7−D0
x16
D15−D0
D15−D0
Comments
Write Address AN – A0
Write All Addresses
CAT93C66, CAT93W66
Read
words will follow without a dummy zero bit. The READ
instruction timing is illustrated in Figure 3.
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the CAT93C66,
CAT93W66 will come out of the high impedance state and,
after sending an initial dummy zero bit, will begin shifting
out the data addressed (MSB first). The output data bits will
toggle on the rising edge of the SK clock and are stable after
the specified time delay (tPD0 or tPD1).
For the CAT93C66, CAT93W66 after the initial data word
has been shifted out and CS remains asserted with the SK
clock continuing to toggle, the device will automatically
increment to the next address and shift out the next data word
in a sequential READ mode. As long as CS is continuously
asserted and SK continues to toggle, the device will keep
incrementing to the next address automatically until it
reaches to the end of the address space, then loops back to
address 0. In the sequential READ mode, only the initial data
word is preceeded by a dummy zero bit. All subsequent data
tSKHI
Erase/Write Enable and Disable
The device powers up in the write disable state. Any
writing after power−up or after an EWDS (erase/write
disable) instruction must first be preceded by the EWEN
(erase/write enable) instruction. Once the write instruction
is enabled, it will remain enabled until power to the device
is removed, or the EWDS instruction is sent. The EWDS
instruction can be used to disable all CAT93C66,
CAT93W66 write and erase instructions, and will prevent
any accidental writing or clearing of the device. Data can be
read normally from the device regardless of the write
enable/disable status. The EWEN and EWDS instructions
timing is shown in Figure 4.
tSKLOW
tCSH
SK
tDIS
tDIH
VALID
DI
VALID
tCSS
CS
tPD0, tPD1
tDIS
DO
tCSMIN
DATA VALID
Figure 2. Synchronous Data Timing
SK
CS
AN
DI
1
1
AN−1
Don’t Care
A0
0
tPD0
DO
HIGH−Z
Dummy 0
D15 . . . D0
or
D7 . . . D0
Address + 1
D15 . . . D0
or
D7 . . . D0
Figure 3. READ Instruction Timing
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Address + 2
D15 . . . D0
or
D7 . . . D0
Address + n
D15 . . .
or
D7 . . .
CAT93C66, CAT93W66
Write
Erase
After receiving a WRITE command (Figure 5), address
and the data, the CS (Chip Select) pin must be deselected for
a minimum of tCSMIN. The falling edge of CS will start the
self clocking clear and data store cycle of the memory
location specified in the instruction. The clocking of the SK
pin is not necessary after the device has entered the self
clocking mode. The ready/busy status of the CAT93C66,
CAT93W66 can be determined by selecting the device and
polling the DO pin. Since this device features Auto−Clear
before write, it is NOT necessary to erase a memory location
before it is written into.
Upon receiving an ERASE command and address, the CS
(Chip Select) pin must be deasserted for a minimum of
tCSMIN (Figure 6). The falling edge of CS will start the self
clocking clear cycle of the selected memory location. The
clocking of the SK pin is not necessary after the device has
entered the self clocking mode. The ready/busy status of the
CAT93C66, CAT93W66 can be determined by selecting the
device and polling the DO pin. Once cleared, the content of
a cleared location returns to a logical “1” state.
SK
STANDBY
CS
DI
1
0
0
* ENABLE = 11
DISABLE = 00
*
Figure 4. EWEN/EWDS Instruction Timing
SK
tCSMIN
CS
AN AN−1
DI
1
0
A0
DN
STATUS
VERIFY
D0
STANDBY
1
tSV
HIGH−Z
DO
BUSY
READY
tHZ
HIGH−Z
tEW
Figure 5. Write Instruction Timing
SK
CS
AN
DI
DO
1
1
AN−1
A0
tCS
STATUS
VERIFY
STANDBY
1
tSV
HIGH−Z
BUSY
tEW
Figure 6. Erase Instruction Timing
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tHZ
READY
HIGH−Z
CAT93C66, CAT93W66
Erase All
Write All
Upon receiving an ERAL command (Figure 7), the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN. The falling edge of CS will start the self clocking
clear cycle of all memory locations in the device. The
clocking of the SK pin is not necessary after the device has
entered the self clocking mode. The ready/busy status of the
device can be determined by selecting the device and polling
the DO pin. Once cleared, the contents of all memory bits
return to a logical “1” state.
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN (Figure 8). The falling edge of CS will start the self
clocking data write to all memory locations in the device.
The clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy status of
the device can be determined by selecting the device and
polling the DO pin. It is not necessary for all memory
locations to be cleared before the WRAL command is
executed.
SK
CS
STATUS VERIFY
STANDBY
tCS
DI
1
0
1
0
0
tSV
tHZ
HIGH−Z
DO
BUSY
READY
HIGH−Z
tEW
Figure 7. ERAL Instruction Timing
SK
CS
STATUS VERIFY
STANDBY
tCSMIN
DI
1
0
0
0
1
DN
D0
tSV
tHZ
DO
BUSY
tEW
Figure 8. WRAL Instruction Timing
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READY
HIGH−Z
CAT93C66, CAT93W66
PACKAGE DIMENSIONS
PDIP−8, 300 mils
CASE 646AA−01
ISSUE A
SYMBOL
MIN
NOM
A
E1
5.33
A1
0.38
A2
2.92
3.30
4.95
b
0.36
0.46
0.56
b2
1.14
1.52
1.78
c
0.20
0.25
0.36
D
9.02
9.27
10.16
E
7.62
7.87
8.25
E1
6.10
6.35
7.11
e
PIN # 1
IDENTIFICATION
MAX
2.54 BSC
eB
7.87
L
2.92
10.92
3.30
3.80
D
TOP VIEW
E
A2
A
A1
c
b2
L
e
eB
b
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MS-001.
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CAT93C66, CAT93W66
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
MAX
4.00
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
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CAT93C66, CAT93W66
PACKAGE DIMENSIONS
SOIC−8, 208 mils
CASE 751BE−01
ISSUE O
SYMBOL
MIN
NOM
A
E1 E
MAX
2.03
A1
0.05
0.25
b
0.36
0.48
c
0.19
0.25
D
5.13
5.33
E
7.75
8.26
E1
5.13
5.38
e
1.27 BSC
L
0.51
0.76
θ
0º
8º
PIN#1 IDENTIFICATION
TOP VIEW
D
A
e
b
q
L
A1
c
END VIEW
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with EIAJ EDR-7320.
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CAT93C66, CAT93W66
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL−01
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.15
0.90
1.05
0.30
c
0.09
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
e
0.20
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
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CAT93C66, CAT93W66
PACKAGE DIMENSIONS
TDFN8, 2x3
CASE 511AK−01
ISSUE A
D
A
e
b
E2
E
PIN#1
IDENTIFICATION
A1
PIN#1 INDEX AREA
D2
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A2
0.45
0.55
0.65
A3
A2
A3
0.20
0.25
0.30
D
1.90
2.00
2.10
D2
1.30
1.40
1.50
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
L
BOTTOM VIEW
0.20 REF
b
e
FRONT VIEW
0.50 TYP
0.20
0.30
L
0.40
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
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13
CAT93C66, CAT93W66
PACKAGE DIMENSIONS
SOT−23, 6 Lead
CASE 527AJ−01
ISSUE O
D
SYMBOL
e
E1
E
MIN
NOM
A
0.90
1.45
A1
0.00
0.15
A2
0.90
b
0.30
0.50
c
0.08
0.22
1.15
D
2.90 BSC
E
2.80 BSC
E1
1.60 BSC
e
0.95 BSC
L
0.45
0.30
L1
PIN #1 IDENTIFICATION
1.30
0.60
0.60 REF
L2
TOP VIEW
MAX
0.25 REF
θ
0°
4°
8°
θ1
5°
10°
15°
θ2
5°
10°
15°
θ1
A2
A
θ
b
θ2
L1
A1
SIDE VIEW
L2
L
END VIEW
Notes:
(1) All dimensions in millimeters. Angles in degrees.
(2) Complies with JEDEC standard MO-178.
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14
c
CAT93C66, CAT93W66
PACKAGE DIMENSIONS
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ−01
ISSUE O
D
b
A
e
L
DAP SIZE 1.8 x 1.8
E2
E
PIN #1
IDENTIFICATION
A1
PIN #1 INDEX AREA
D2
TOP VIEW
SYMBOL
MIN
SIDE VIEW
NOM
MAX
A
0.45
0.50
0.55
A1
0.00
0.02
0.05
A3
0.127 REF
b
0.20
0.25
0.30
D
1.95
2.00
2.05
D2
1.35
1.40
1.45
E
2.95
3.00
3.05
E2
1.25
1.30
1.35
e
L
BOTTOM VIEW
DETAIL A
0.065 REF
A3 A
FRONT VIEW
0.50 REF
0.25
0.30
0.35
A3
Notes:
(1) All dimensions are in millimeters.
(2) Refer JEDEC MO-236/MO-252.
0.0 - 0.05
DETAIL A
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15
0.065 REF
Copper Exposed
CAT93C66, CAT93W66
Table 12. ORDERING INFORMATION
Device Order Number
Specific
Device
Marking*
Package Type
Temperature Range
CAT93C66LI−G
93C66H
PDIP−8
CAT93C66VE−G
93C66H
CAT93C66VE−GT3
Lead
Finish
Shipping
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 50 Units / Tube
SOIC−8, JEDEC
E = Extended
(−40°C to +125°C)
NiPdAu
Tube, 100 Units / Tube
93C66H
SOIC−8, JEDEC
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66VI−G
93C66H
SOIC−8, JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 100 Units / Tube
CAT93C66VI−GT3
93C66H
SOIC−8, JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66VP2E−GT3
M2T
TDFN−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66VP2I−GT3
M2T
TDFN−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66YI−G
M66
TSSOP−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 100 Units / Tube
CAT93C66YI−GT3
M66
TSSOP−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66YE−GT3
M66
TSSOP−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93W66VP2I−GT3
M2C
TDFN−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
93C66H
SOIC−8, EIAJ
E = Extended
(−40°C to +125°C)
Matte−Tin
Tape & Reel,
2,000 Units / Reel
CAT93C66HU4I−GT3
M2U
UDFN−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66HU4E−GT3
M2U
UDFN−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT93C66XI−T2
* Marking for New Product (Rev H)
12. All packages are RoHS−compliant (Lead−free, Halogen−free).
13. The standard lead finish is NiPdAu.
14. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
15. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
16. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT93C66/D