APL3512 Power-Distribution Switches with Soft Start Features General Description • • • 90mΩ High Side MOSFET The APL3512A/B is a power-distribution switch with some 2A Continuous Current protection functions that can deliver current up to 2A. The device incorporates a 90mΩ N-channel MOSFET power Soft-Start Time Programmable by External switch that is controlled by an enable logic pin and has a SS pin dedicated to soft-start ramp-up rate control that Capacitor • • • • • • Wide Supply Voltage Range: 2.7V to 5.5V can be used in application where the inrush current is concerned. Current-Limit and Short-Circuit Protections Under-Voltage Lockout Protection The device integrates some protection features, including current-limit protection, short-circuit protection, over- Reverse Current Blocking when Switch Disabled temperature protection, and UVLO. The current-limit and short-circuit protection can protect down-stream devices Over-Temperature Protection Logic Level Enable Input from catastrophic failure by limiting the output current at current-limit threshold during over-load or short-circuit APL3512A: Active High APL3512B: Active Low • events. When VOUT drops below VIN-1.5V the devices limit the current to a lower and safe level. The over-tempera- Lead Free and Green Devices Available (RoHS Compliant) ture protection function shuts down the N-channel MOSFET power switch when the junction temperature Applications • • • • rises beyond 140oC and will automatically turns on the power switch when the temperature drops by 20oC. The TFT LCD Modules UVLO function keeps the power switch in off state until there is a valid input voltage present. Notebook and Desktop Computers USB Ports The device is available in lead free SOT-23-5, TDFN2x26 and SOP-8 packages with enable active-high(EN) and High-Side Power Protection Switches active-low(ENB) versions. Simplified Application Circuit APL3512A/B VIN VIN VOUT VOUT SS EN Control EN/ ENB GND ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 1 www.anpec.com.tw APL3512 Pin Configuration VIN 1 SS 2 GND 3 NC 4 8 VOUT 7 NC 6 EN 5 NC 4 SS 8 VOUT 7 NC 6 ENB 5 NC 5 VIN VOUT 1 GND 2 ENB 3 4 SS SOT-23-5 APL3512B SOP-8 APL3512B 6 VOUT 5 NC 4 EN VIN 1 SS 2 GND 3 TDFN2x2-6 APL3512A SOT-23-5 APL3512A SOP-8 APL3512A VIN 1 SS 2 GND 3 NC 4 5 VIN VOUT 1 GND 2 EN 3 6 VOUT 5 NC 4 ENB VIN 1 SS 2 GND 3 TDFN2x2-6 APL3512B Exposed Pad, connect to large ground plane for heat dissipation Ordering and Marking Information Package Code B : SOT-23-5 K : SOP-8 QB : TDFN2x2-6 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel EN Function A : Active High B : Active Low Assembly Material G : Halogen and Lead Free Device APL3512 Assembly Material Handling Code Temperature Range Package Code EN Function APL3512A B: L2AX X - Date Code APL3512B B: L2BX X - Date Code APL3512A K: APL3512A XXXXX XXXXX - Date Code APL3512B K: APL3512B XXXXX XXXXX - Date Code APL3512A QB: L12A X X - Date Code APL3512B QB: L12B X X - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 2 www.anpec.com.tw APL3512 Absolute Maximum Ratings Symbol VIN VOUT VENB, VEN Parameter Rating Unit VIN to GND Voltage -0.3 ~ 6 V VOUT to GND Voltage -0.3 ~ 6 V EN, ENB to GND Voltage -0.3 ~ 6 V VSS SS to GND Voltage IOUT Continuous Output Current TJ (Note 1) Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds -0.3 ~ 6 V Internally Limited A -40 ~ 150 o -65 ~ 150 o 260 o C C C Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit Junction-to-Ambient Resistance in Free Air (Note 2) SOT-23-5 250 SOP-8 160 TDFN2x2-6 225 Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. θJA o C/W Recommended Operating Conditions (Note 3) Symbol Parameter VIN VIN Input Voltage IOUT OUT Output Current (Note 4) Range Unit 2.7 ~ 5.5 V 0 ~2 A 0.3 ~470 nF CSS SS Pin Soft-Start Capacitor TA Ambient Temperature -40 ~ 85 o TJ Junction Temperature -40 ~ 125 o C C Note 3: Refer to the typical application circuit. Note 4: Attaching a capacitor on SS pin can adjust the VOUT soft-start rate. If the CSS is out of the recommended range, the soft-start rate could become internally controlled as if no CSS. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 3 www.anpec.com.tw APL3512 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=5V, VEN=5V or VENB=0V and TA=-40~85oC. Typical values are at TA=25oC. Symbol Parameter APL3512A/B Test Conditions Unit Min. Typ. Max. - - 1 µA SUPPLY CURRENT VIN Supply Current No load, VEN=0V or VENB=5V No load, VEN=5V or VENB=0V - 60 100 µA Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 µA Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V or VENB=5V - - 1 µA IOUT=1.5A, TA=25oC - 90 110 mΩ IOUT=1.5A, TA=-40~85 C - 90 140 mΩ VIN rising, TA=-40~85oC 2.3 - 2.65 V - 0.2 - V 2.5 3.1 4.22 A POWER SWITCH RDS(ON) Power Switch On Resistance o UNDER-VOLTAGE LOCKOUT VIN UVLO Threshold Voltage VIN UVLO Hysteresis CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM ISHORT Current-Limit Threshold VIN=2.7V to 5.5V, TA=-40~85oC Short-Circuit Output Current VIN=2.7V to 5.5V - 0.8 - A VIN=5V, TA=-40~85oC 1 2 3 µA VIN=5V, No load, COUT=1µF, CSS=10nF, TA=-40~85oC - 10 - ms VIN=3.3V, No load, COUT=1µF, CSS=10nF, TA=-40~85oC - 6.6 - ms VIN=3.3V, No load, COUT=1µF, No CSS or SS tied to VIN, TA=-40~85oC 1 2 3 ms V SOFT-START CONTROL PIN SS Current tSS Soft-Start Time EN OR ENB INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 2 - - VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V - - 1 µA VEN=0V or VENB=5V - 150 - Ω TJ rising - 140 - °C - 20 - °C Input Current VOUT Discharge Resistance OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 4 www.anpec.com.tw APL3512 Typical Operating Characteristics Switch On Resistance vs. Input Voltage Switch On Resistance vs. Junction Temperature 130 140 Switch On Resistance, RDS(on) (mΩ) Switch On Resistance , RDS(on) (mΩ) 160 VIN=3.3V 120 100 80 60 VIN=5V 40 IOUT=1.5A, CIN =1µF/X7R, COUT =10µF/X7R 20 0 120 110 100 90 80 70 50 -50 0 50 100 Junction Temperature ( oC) IOUT=1.5A, CIN =1µF/X7R, COUT =1µF/X7R, TA=25oC 60 150 2.5 Supply Current vs. Junction Temperature 5.0 5.5 Supply Current vs. Input Voltage VIN =5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic 70 80 Supply Current, ICC (µA) Supply Current, ICC (µA) 3.5 4.0 4.5 Input Voltage (V) 80 100 60 IC Enabled 40 20 IC Disabled 60 50 IC Enabled 40 RLOAD = Open, CIN =COUT =1µF/X7R, TA=25oC 30 20 IC Disabled 10 0 00 -50 0 50 100 Junction Temperature ( oC) 2.5 150 3.6 3.6 Current-Limit Threshold, ILIM (A) 3.8 3.4 3.2 3.0 2.8 2.6 2.4 2.0 -50 VIN =5V 0 50 100 4.0 4.5 5.0 5.5 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 2.5 150 Junction Temperature ( oC) Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 3.5 Current-Limit Threshold vs. Input Voltage 3.8 2.2 3.0 Input Voltage (V) Current-Limit Threshold vs. Junction Temperature Current-Limit Threshold, ILIM (A) 3.0 TA =25oC 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) 5 www.anpec.com.tw APL3512 Short-Circuit Output Current vs. Input Voltage 1.4 Current-Limit Response vs. Output Peak Current 250 VIN =5V, TA=25oC TA=25oC 1.2 Current-Limit Response (µs) Short-Circuit Output Current, ISHORT (A) Typical Operating Characteristics (Cont.) 1.0 0.8 0.6 0.4 0.2 0.0 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 200 150 100 50 0 5.5 0 2 Turn-On Rising Time vs. Junction Temperature VIN UVLO Threshold Voltage, VVLOC (V) Turn-On Rising Time, tF (ms) VIN = 5V, RLOAD =30Ω, CIN = 1µF/X7R, COUT =33µF/Electrolytic 1.5 1.0 0.5 0 50 100 Junction Temperature ( oC) 3.2 2.8 UVLO Rising 2.4 UVLO Falling 2.0 1.6 1.2 IOUT =15mA, CIN = 1µF/X7R, COUT =33µF/Electrolytic 0.8 -50 150 50 100 150 EN Pin Threshold Voltage vs. Junction Temperature 3.0 EN Pin Threshold Voltage, VEN (V) EN Pin Threshold Voltage, VEN (V) 0 Junction Temperature ( oC) EN Pin Threshold Voltage vs. Input Voltage 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 12 VIN UVLO Threshold Voltage vs. Junction Temperature 2.0 0.0 -50 4 6 8 10 Output Peak Current (A) EN Rising EN Falling RLOAD =50Ω, CIN = COUT =33µF/ Elctrolytic, TA=25oC 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 5.0 2.5 EN Rising 2.0 1.5 EN Falling 1.0 VIN =5V, RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic 0.5 5.5 -50 6 0 50 100 Junction Temperature (oC) 150 www.anpec.com.tw APL3512 Typical Operating Characteristics (Cont.) Output Voltage vs. Output Current SS Current vs. Junction Temperature 3.2 5.0 4.5 Output Voltage, VOUT (V) SS Current, ISS (µA) 2.8 2.4 2.0 1.6 1.2 0.8 VIN=5V 4.0 3.5 3.0 2.5 VIN=3.3V 2.0 1.5 1.0 0.5 VIN =5V TA=25oC 0.0 0.4 -50 0 50 100 0 150 Junction Temperature ( oC) 1 2 3 4 Output Current (A) Turn Off Leakage Current vs. Junction Temperature Turn Off Leakage Current, ILEAK(µA) 10 VIN = 5V, RLOAD = 0Ω, CIN = COUT =1µF/X7R 8 6 4 2 0 -50 0 50 100 Junction Temperature ( oC) Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 150 7 www.anpec.com.tw APL3512 Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. Power On Power Off VIN V IN 1 1 VOUT VOUT 2 2 I OUT IOUT 3 3 VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC, COUT =100µF/Electrolytic, SS open VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC, COUT =100µF/Electrolytic, SS open CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 0.5A/Div, DC TIME:5ms/Div CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 0.5A/Div, DC TIME:20ms/Div Turn On Response Turn Off Response VIN VE N 1 1 VOUT V OUT 2 2 I OUT I OUT 3 3 VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC, COUT =100µF/Electrolytic, SS open VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC, COUT =100µF/Electrolytic, SS open CH1: VEN, 5V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 0.5A/Div, DC TIME:0.5ms/Div CH1: VEN, 5V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 0.5A/Div, DC TIME:1ms/Div Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 8 www.anpec.com.tw APL3512 Operating Waveforms (Cont.) The test condition is VIN=5V, TA= 25oC unless otherwise specified. Soft Start Ramp-up Control Current Limit Response VE N V IN 1 VOUT CS S=560pF CS S=820pF 1 CS S=unconnected or SS tied to V IN C S S=330pF 2 CS S=5.6nF 2 VOUT CS S=2.2nF CS S=3.3nF CS S=4.4nF IOUT 3 VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC, COUT=33µF/Electrolytic VIN =5V, CIN =1µF/MLCC, COUT=33µF/Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 2ms/Div CH1: VEN, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 0.5ms/Div Short Circuit Protection VIN VOUT 1 2 IOUT 3 VIN =5V, VOUT short to ground, CIN =1µF/MLCC, COUT=33µF/Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 20A/Div, DC TIME: 100µs/Div Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 9 www.anpec.com.tw APL3512 Pin Description PIN FUNCTION NO. SOT-23-5 NAME SOP-8 TDFN2x2-6 1 8 6 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low the output voltage is discharged by an internal resistor. 2 3 3 GND Ground 3 6 4 EN (APL3512A) Enable Input. Pull this pin to high to enable the device and pull this pin to low to disable device. The EN pin cannot be left floating. ENB (APL3512B) Enable Input. Pull this pin to high to disable the device and pull this pin to low to enable device. The ENB pin cannot be left floating. 4 2 2 SS Soft-Start Control Pin. Connect a capacitor to GND to control the soft-tart rate. If the SS pin is left floating or tied to VIN the soft-tart time is 2ms when VIN=5V. 5 1 1 VIN Power Supply Input. Connect this pin to external DC supply. - 4, 5, 7 5 NC Internally not connected. Block Diagram VIN VOUT UVLO Charge Pump EN/ ENB Current -Limit Gate Driver and Control Logic Soft-Start SS OTP GND Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 10 www.anpec.com.tw APL3512 Typical Application Circuit APL3512A/B VOUT VIN VIN VOUT CIN CBY COUT 1µF 0.1µF 10µF CSS SS 10nF Controller EN/ENB GND Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 11 www.anpec.com.tw APL3512 Function Description VIN Under-Voltage Lockout (UVLO) VIN is the amplitude of input voltage applied to this device, The APL3512A/B power switch is built-in an under-voltage lockout circuit to keep the output shut off until internal of which unit is volt. If the CSS is not connected or SS pin is tied to VIN, the soft- circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ig- start time is 2ms when VIN=5V. Enable/Disable nore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts Pull the ENB above 2V, or EN below 0.8V to disable the device and pull ENB pin below 0.8V or EN above 2V to a soft-start to reduce the inrush current. enable the device. When the IC is disabled, the supply current is reduced to less than 1µA. The enable input is Power Switch compatible with both TTL and CMOS logic levels. The EN/ENB pins cannot be left floating. The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a cur- Over-Temperature Protection rent flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection When the junction temperature exceeds 140oC, the internal thermal sense circuit turns off the power FET and The APL3512A/B power switch provides the current-limit protection function. During current-limit, the devices limit allows the device to cool down. When the device’s junction temperature cools by 20 oC, the internal thermal output current at current-limit threshold. For reliable operation, the device should not be operated in current- sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal limit for extended period. protection is designed to protect the IC in the event of Short-Circuit Protection over-temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC. When the output voltage drops below VIN-1.5V, which is caused by the over load or short-circuit, the devices limit the output current down to a safe level. The short circuit current-limit is used to reduce the power dissipation during short-circuit condition. If the junction temperature is over the thermal shutdown temperature, the device will enter the thermal shutdown. Soft-Start The APLA3512A/B provides an adjustable soft-start circuitry to control rise rate of the output voltage and limit the current surge during start-up. The soft-start ramp-up rate is controlled by a capacitor from SS pin to the ground. Under a specific VIN being applied to the APL3512A/B, the soft start time can be calculated by the following equation: tSS = 0.2 x CSS x VIN where, tSS is soft-start time of VOUT rising from 0 to 100%, of which unit is second. CSS is the value of the capacitor connected from SS pin to GND, of which unit is micro-Farad. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 12 www.anpec.com.tw APL3512 Application Information Input Capacitor refer to the Recommended Operating Conditions), the A 1µF ceramic bypass capacitor from VIN to GND, located soft-start time will become internally controlled as if there is no CSS, tSS=2ms when VIN=5V, for example. If a soft- near the APL3512, is strongly recommended to suppress the ringing during short-circuit fault event. Without the by- start capacitor is used, please make sure the CSS is in the recommeded operating range. pass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage Layout Consideration internal control circuitry. Output Capacitor The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, A low-ESR 10µF MLCC, aluminum electrolytic or tantalum between VOUT and GND is strongly recommended droop and EMI. The following guidelines must be considered: to reduce the voltage droop during hot-attachment of downstream peripheral. Higher-value output capacitor is 1. Please place the input capacitors near the VIN pin as close as possible. better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling high- the immunity of the device to short-circuit transients. During soft-start process, the output bulk capacitor draws frequency ripples. 3. Locate APL3512 and output capacitors near the load to inrush current from VIN. If the inrush current reaches foldback current-limit threshold, namely 0.8A, the output reduce parasitic resistance and inductance for excellent load transient performance. current will be clamped in 0.8A level. It will take longer to complete the soft-start process since the soft-start rate 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. is controlled neither by internal soft-start nor by external 5. Keep VIN and VOUT traces as wide and short as possible. soft-start circuitry. When the COUT meets the following formula, the soft-start will be controlled by foldback current-limiting: COUT > (0.8xtSS)/VIN Recommended Minimum Footprint Where, tSS is 1ms when SS is open or tied to VIN, or obtained by the tss equation, described in the paragraph of Soft-Start 0.075 in Functional Description section when CSS is used. If the soft-start rate is controlled by the foldback current0.1 limiting, the soft-start time can be got by the following equation: tSS_Foldback = (COUT x VIN)/0.8 0.05 Soft-Start Capacitor The APL3512 has a built-in adjustable soft-start control for user to set an optimum soft-start time for the app- 0.037 lication. The soft-start time can be calculated by the equation, described in the paragraph of Soft-Start in Func- 0.02 Unit : Inch SOT-23-5 tional Description section. Please note that there are minimum and maximum limitations of soft-start capacitor. If the value of soft-start capacitor is less than the minimum limitation or higher than the maximum limitation (please Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 13 www.anpec.com.tw APL3512 Recommended Minimum Footprint 7 6 5 1 2 3 4 6.0 8 1.3 0.5 1.27 Unit : mm SOP-8 Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 14 www.anpec.com.tw APL3512 Package Information SOT-23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. MIN. MAX. A 1.45 A1 0.00 0.15 A2 0.90 MAX. 0.057 0.000 0.006 1.30 0.035 0.051 0.020 b 0.30 0.50 0.012 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 0.118 0.071 E 2.60 3.00 0.102 E1 1.40 1.80 0.055 e 0.95 BSC e1 1.90 BSC 0.037 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 15 www.anpec.com.tw APL3512 Package Information SOP-8 -T- SEATING PLANE < 4 mils D E E1 SEE VIEW A h X 45 ° c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 INCHES MILLIMETERS MIN. MAX. A MIN. MAX. 1.75 0.069 0.010 0.004 0.25 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0° 8° 0° 8° Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 16 www.anpec.com.tw APL3512 Package Information TDFN2x2-6 A b E D D2 A1 A3 L K E2 Pin 1 Corner e TDFN2x2-6 S Y M B O L MIN. MAX. A 0.70 0.00 A1 MILLIMETERS A3 INCHES MIN. MAX. 0.80 0.028 0.031 0.05 0.000 0.002 0.20 REF 0.008 REF 0.30 0.007 0.012 1.90 2.10 0.075 0.083 D2 1.00 1.60 0.039 0.063 E 1.90 2.10 0.075 0.083 1.00 0.024 0.039 0.45 0.012 b D E2 0.18 0.60 e 0.65 BSC L 0.30 K 0.20 0.026 BSC 0.018 0.008 Note : 1. Followed from JEDEC MO-229 WCCC. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 17 www.anpec.com.tw APL3512 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-5 Application SOP-8 Application TDFN2x2-6 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 W E1 F 4.0±0.10 4.0±0.10 A H T1 C d D 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T 1.5 MIN. 0.6+0.00 -0.40 12.0±0.30 1.75±0.10 A0 B0 5.5±0.05 K0 4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 A H T1 C d D 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 2.35+0.20 2.35+0.20 1.30±0.20 4.0±0.10 4.0±0.10 6.40±0.20 5.20±0.20 W E1 12.0±0.30 1.75±0.10 2.10±0.20 F 5.5±0.05 (mm) Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 18 www.anpec.com.tw APL3512 Devices Per Unit Package Type Unit Quantity SOT-23-5 Tape & Reel 3000 SOP-8 Tape & Reel 2500 TQFN2x2-6 Tape & Reel 3000 Taping Direction Information SOT-23-5 USER DIRECTION OF FEED SOP-8 USER DIRECTION OF FEED TDFN2x2-6 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 19 www.anpec.com.tw APL3512 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 20 www.anpec.com.tw APL3512 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.6 - Aug., 2012 21 www.anpec.com.tw