Freescale MC8641DHX1333H Integrated host processor hardware specification Datasheet

Freescale Semiconductor
Technical Data
Document Number: MPC8641DEC
Rev. 1, 11/2008
MPC8641 and MPC8641D
Integrated Host Processor
Hardware Specifications
1
Overview
The MPC8641 processor family integrates either one or two
Power Architecture™ e600 processor cores with system
logic required for networking, storage, wireless
infrastructure, and general-purpose embedded applications.
The MPC8641 integrates one e600 core while the
MPC8641D integrates two cores.
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This section provides a high-level overview of the MPC8641
and MPC8641D features. When referring to the MPC8641
throughout the document, the functionality described applies
to both the MPC8641 and the MPC8641D. Any differences
specific to the MPC8641D are noted.
Figure 1 shows the major functional units within the
MPC8641 and MPC8641D. The major difference between
the MPC8641 and MPC8641D is that there are two cores on
the MPC8641D.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . .5
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .13
Input Clocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . .18
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . .19
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Ethernet: Enhanced Three-Speed Ethernet (eTSEC),
MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Ethernet Management Interface Electrical
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . . .60
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Signal Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
System Design Information . . . . . . . . . . . . . . . . . . . .122
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . .132
Document Revision History. . . . . . . . . . . . . . . . . . . .136
Overview
e600 Core Block
e600 Core Block
e600 Core
32-Kbyte
L1 Instruction Cache
1-Mbyte
L2 Cache
32-Kbyte
L1 Data Cache
e600 Core
32-Kbyte
L1 Instruction Cache
1-Mbyte
L2 Cache
32-Kbyte
L1 Data Cache
MPX Bus
MPX Coherency Module (MCM)
Platform Bus
SDRAM
DDR SDRAM Controller
SDRAM
DDR SDRAM Controller
ROM,
GPIO
Local Bus Controller
(LBC)
IRQs
Multiprocessor
Programmable Interrupt
Controller
(MPIC)
Serial
Dual Universal
Asynchronous
Receiver/Transmitter
(DUART)
I2C
I2C Controller
I2C
I2C Controller
RMII, GMII,
MII, RGMII,
TBI, RTBI
RMII, GMII,
MII, RGMII,
TBI, RTBI
Enhanced TSEC
Controller
[ x1/x2/x4/x8 PCI Exp (4 GB/s)
AND 1x/4x SRIO (2.5 GB/s) ]
OR [2-x1/x2/x4/x8 PCI Express
(8 GB/S) ]
Enhanced TSEC
Controller
PCI Express
Interface
Enhanced TSEC
Controller
10/100/1Gb
RMII, GMII,
MII, RGMII,
TBI, RTBI
OCeaN
Switch
Fabric
Serial RapidIO
Interface
or
PCI Express
Interface
10/100/1Gb
10/100/1Gb
RMII, GMII,
MII, RGMII,
TBI, RTBI
Platform
Four-Channel
DMA Controller
External
Control
Enhanced TSEC
Controller
10/100/1Gb
Figure 1. MPC8641 and MPC8641D
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
2
Freescale Semiconductor
Overview
1.1
Key Features
The following lists an overview of the MPC8641 key feature set:
• Major features of the e600 core are as follows:
— High-performance, 32-bit superscalar microprocessor that implements the PowerPC ISA
— Eleven independent execution units and three register files
– Branch processing unit (BPU)
– Four integer units (IUs) that share 32 GPRs for integer operands
– 64-bit floating-point unit (FPU)
– Four vector units and a 32-entry vector register file (VRs)
– Three-stage load/store unit (LSU)
— Three issue queues, FIQ, VIQ, and GIQ, can accept as many as one, two, and three instructions,
respectively, in a cycle.
— Rename buffers
— Dispatch unit
— Completion unit
— Two separate 32-Kbyte instruction and data level 1 (L1) caches
— Integrated 1-Mbyte, eight-way set-associative unified instruction and data level 2 (L2) cache
with ECC
— 36-bit real addressing
— Separate memory management units (MMUs) for instructions and data
— Multiprocessing support features
— Power and thermal management
— Performance monitor
— In-system testability and debugging features
— Reliability and serviceability
• MPX coherency module (MCM)
— Ten local address windows plus two default windows
— Optional low memory offset mode for core 1 to allow for address disambiguation
• Address translation and mapping units (ATMUs)
— Eight local access windows define mapping within local 36-bit address space
— Inbound and outbound ATMUs map to larger external address spaces
— Three inbound windows plus a configuration window on PCI Express
— Four inbound windows plus a default window on serial RapidIO
— Four outbound windows plus default translation for PCI Express
— Eight outbound windows plus default translation for serial RapidIO with segmentation and
sub-segmentation support
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
3
Overview
•
•
•
•
DDR memory controllers
— Dual 64-bit memory controllers (72-bit with ECC)
— Support of up to a 300-MHz clock rate and a 600-MHz DDR2 SDRAM
— Support for DDR, DDR2 SDRAM
— Up to 16 Gbytes per memory controller
— Cache line and page interleaving between memory controllers.
Serial RapidIO interface unit
— Supports RapidIO Interconnect Specification, Revision 1.2
— Both 1x and 4x LP-Serial link interfaces
— Transmission rates of 1.25-, 2.5-, and 3.125-Gbaud (data rates of 1.0-, 2.0-, and 2.5-Gbps) per
lane
— RapidIO–compliant message unit
— RapidIO atomic transactions to the memory controller
PCI Express interface
— PCI Express 1.0a compatible
— Supports x1, x2, x4, and x8 link widths
— 2.5 Gbaud, 2.0 Gbps lane
Four enhanced three-speed Ethernet controllers (eTSECs)
— Three-speed support (10/100/1000 Mbps)
— Four IEEE 802.3, 802.3u, 802.3x, 802.3z, 802.3ac, 802.3ab compliant controllers
— Support of the following physical interfaces: MII, RMII, GMII, RGMII, TBI, and RTBI
—
—
—
—
—
—
—
•
Support a full-duplex FIFO mode for high-efficiency ASIC connectivity
TCP/IP off-load
Header parsing
Quality of service support
VLAN insertion and deletion
MAC address recognition
Buffer descriptors are backward compatible with PowerQUICC II and PowerQUICC III
programming models
— RMON statistics support
— MII management interface for control and status
Programmable interrupt controller (PIC)
— Programming model is compliant with the OpenPIC architecture
— Supports 16 programmable interrupt and processor task priority levels
— Supports 12 discrete external interrupts and 48 internal interrupts
— Eight global high resolution timers/counters that can generate interrupts
— Allows processors to interrupt each other with 32b messages
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Electrical Characteristics
•
•
•
•
•
•
•
•
2
— Support for PCI-Express message-shared interrupts (MSIs)
Local bus controller (LBC)
— Multiplexed 32-bit address and data operating at up to 133 MHz
— Eight chip selects support eight external slaves
Integrated DMA controller
— Four-channel controller
— All channels accessible by both the local and the remote masters
— Supports transfers to or from any local memory or I/O port
— Ability to start and flow control each DMA channel from external 3-pin interface
Device performance monitor
— Supports eight 32-bit counters that count the occurrence of selected events
— Ability to count up to 512 counter-specific events
— Supports 64 reference events that can be counted on any of the 8 counters
— Supports duration and quantity threshold counting
— Burstiness feature that permits counting of burst events with a programmable time between
bursts
— Triggering and chaining capability
— Ability to generate an interrupt on overflow
Dual I2C controllers
— Two-wire interface
— Multiple master support
— Master or slave I2C mode support
— On-chip digital filtering rejects spikes on the bus
Boot sequencer
— Optionally loads configuration data from serial ROM at reset via the I2C interface
— Can be used to initialize configuration registers and/or memory
— Supports extended I2C addressing mode
— Data integrity checked with preamble signature and CRC
DUART
— Two 4-wire interfaces (SIN, SOUT, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
IEEE 1149.1-compliant, JTAG boundary scan
Available as 1023 pin Hi-CTE flip chip ceramic ball grid array (FC-CBGA)
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8641. The MPC8641 is currently targeted to these specifications.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
5
Electrical Characteristics
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings1
Characteristic
Symbol
Absolute Maximum
Value
Unit Notes
Cores supply voltages
VDD_Core0,
VDD_Core1
-0.3 to 1.21 V
V
Cores PLL supply
AVDD_Core0,
AVDD_Core1
-0.3 to 1.21 V
V
SVDD
-0.3 to 1.21 V
V
SerDes Serial I/O Supply Port 1
XVDD_SRDS1
-0.3 to 1.21V
V
SerDes Serial I/O Supply Port 2
XVDD_SRDS2
-0.3 to 1.21 V
V
SerDes DLL and PLL supply voltage for Port 1 and Port 2
AV DD_SRDS1,
AVDD_SRDS2
-0.3 to 1.21V
V
Platform Supply voltage
VDD_PLAT
-0.3 to 1.21V
V
Local Bus and Platform PLL supply voltage
AVDD_LB,
AVDD_PLAT
-0.3 to 1.21V
V
D1_GVDD,
D2_GVDD
-0.3 to 2.75 V
V
3
-0.3 to 1.98 V
V
3
LVDD
-0.3 to 3.63 V
V
4
-0.3 to 2.75 V
V
4
-0.3 to 3.63 V
V
4
-0.3 to 2.75 V
V
4
OVDD
-0.3 to 3.63V
V
Dn_MVIN
- 0.3 to (Dn_GVDD +
0.3)
V
Dn_MVREF
- 0.3 to (Dn_GVDD/2 +
0.3)
V
Three-speed Ethernet signals
LVIN
TVIN
GND to (LVDD+ 0.3)
GND to (TVDD+ 0.3)
V
5
DUART, Local Bus, DMA,
Multiprocessor Interrupts, System
Control & Clocking, Debug, Test,
Power management, I2C, JTAG
and Miscellaneous I/O voltage
OV IN
GND to (OVDD+ 0.3)
V
5
SerDes Transceiver Supply (Ports 1 and 2)
DDR and DDR2 SDRAM I/O supply voltages
eTSEC 1 and 2 I/O supply voltage
eTSEC 3 and 4 I/O supply voltage
Local Bus, DUART, DMA, Multiprocessor Interrupts, System
Control & Clocking, Debug, Test, Power management, I2C,
JTAG and Miscellaneous I/O voltage
Input voltage
DDR and DDR2 SDRAM signals
DDR and DDR2 SDRAM reference
TVDD
2
5
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Electrical Characteristics
Table 1. Absolute Maximum Ratings1 (continued)
Characteristic
Storage temperature range
Symbol
Absolute Maximum
Value
TSTG
-55 to 150
Unit Notes
°C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maxima is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Core 1 characteristics apply only to MPC8641D. If two separate power supplies are used for VDD_Core0 and VDD_Core1,
they must be kept within 100 mV of each other during normal run time.
3. The -0.3 to 2.75 V range is for DDR and -0.3 to 1.98 V range is for DDR2.
4. The 3.63V maximum is only supported when the port is configured in GMII, MII, RMII, or TBI modes; otherwise the 2.75V
maximum applies. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications” for details on
the recommended operating conditions per protocol.
5. During run time (M,L,T,O)VIN and Dn_MVREF may overshoot/undershoot to a voltage and for a maximum duration as
shown in Figure 2.
2.1.2
Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8641. Note that the values in Table 2
are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed. For details on order information and specific operating conditions for parts, see
Section 21, “Ordering Information.”
Table 2. Recommended Operating Conditions
Characteristic
Cores supply voltages
Cores PLL supply
SerDes Transceiver Supply (Ports 1 and 2)
Symbol
VDD_Core0,
VDD_Core1
AVDD_Core0,
AV DD_Core1
SVDD
Recommended
Value
Unit
Notes
1.10 ± 50 mV
V
1, 2, 8
1.05 ± 50 mV
1, 2, 7
0.95 ± 50 mV
1, 2, 12
1.10 ± 50 mV
V
1.05 ± 50 mV
7, 13
0.95 ± 50 mV
12, 13
1.10 ± 50 mV
V
1.05 ± 50 mV
SerDes Serial I/O Supply Port 1
XVDD_SRDS1
1.10 ± 50 mV
XVDD_SRDS2
1.10 ± 50 mV
V
Platform Supply voltage
AVDD_SRDS1,
AVDD_SRDS2
1.10 ± 50 mV
VDD_PLAT
1.10 ± 50 mV
V
8
7
V
1.05 ± 50 mV
1.05 ± 50 mV
8
7
1.05 ± 50 mV
SerDes DLL and PLL supply voltage for Port 1 and Port 2
8, 11
7, 11
1.05 ± 50 mV
SerDes Serial I/O Supply Port 2
8, 13
8
7
V
8
7
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
7
Electrical Characteristics
Table 2. Recommended Operating Conditions (continued)
Recommended
Value
Unit
Notes
AVDD_LB,
AVDD_PLAT
1.10 ± 50 mV
V
8
D1_GV DD,
D2_GVDD
2.5 V ± 125 mV
V
9
1.8 V ± 90 mV
V
9
LVDD
3.3 V ± 165 mV
V
10
2.5 V ± 125 mV
V
10
3.3 V ± 165 mV
V
10
2.5 V ± 125 mV
V
10
OV DD
3.3 V ± 165 mV
V
5
Dn_MV IN
GND to D n_GVDD
V
3, 6
Dn_MV REF
Dn_GVDD/2 ± 1%
V
Three-speed Ethernet signals
LVIN
TVIN
GND to LVDD
GND to TVDD
V
4, 6
DUART, Local Bus, DMA,
Multiprocessor Interrupts, System
Control & Clocking, Debug, Test,
Power management, I2C, JTAG
and Miscellaneous I/O voltage
OVIN
GND to OVDD
V
5,6
TJ
0 to 105
°C
Characteristic
Local Bus and Platform PLL supply voltage
DDR and DDR2 SDRAM I/O supply voltages
eTSEC 1 and 2 I/O supply voltage
eTSEC 3 and 4 I/O supply voltage
Local Bus, DUART, DMA, Multiprocessor Interrupts, System
Control & Clocking, Debug, Test, Power management, I2C,
JTAG and Miscellaneous I/O voltage
Input voltage
DDR and DDR2 SDRAM signals
DDR and DDR2 SDRAM reference
Junction temperature range
Symbol
TVDD
1.05 ± 50 mV
7
Notes:
1. Core 1 characteristics apply only to MPC8641D
2. If two separate power supplies are used for VDD_Core0 and VDD_Core1, they must be at the same nominal voltage and the
individual power supplies must be tracked and kept within 100 mV of each other during normal run time.
3. Caution: Dn_MVIN must meet the overshoot/undershoot requirements for Dn_GVDD as shown in Figure 2.
4. Caution: L/TVIN must meet the overshoot/undershoot requirements for L/TVDD as shown in Figure 2 during regular run time.
5. Caution: OVIN must meet the overshoot/undershoot requirements for OVDD as shown in Figure 2 during regular run time.
6. Timing limitations for M,L,T,O)VIN and Dn_MVREF during regular run time is provided in Figure 2
7. Applies to devices marked with a core frequency of 1333 MHz and below. Refer to Table 74 Part Numbering Nomenclature
to determine if the device has been marked for a core frequency of 1333 MHz and below.
8. Applies to devices marked with a core frequency above 1333 MHz. Refer to Table 74 Part Numbering Nomenclature to
determine if the device has been marked for a core frequency above 1333 MHz.
9. The 2.5 V ± 125 mV range is for DDR and 1.8 V ± 90 mV range is for DDR2.
10. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications” for details on the recommended
operating conditions per protocol.
11. The PCI Express interface of the device is expected to receive signals from 0.175 to 1.2 V. For more information refer to
Section 14.4.3, “Differential Receiver (RX) Input Specifications."
12. Applies to Part Number MC8641xxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V devices. Refer to Table 74
Part Numbering Nomenclature to determine if the device has been marked for VDD_Coren = 0.95 V.
13. This voltage is the input to the filter discussed in Section 20.2, “Power Supply Design and Sequencing” and not necessarily
the voltage at the AV DD_Coren pin, which may be reduced from VDD_Coren by the filter.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Electrical Characteristics
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8641.
L/T/D n_G/O/X/SVDD + 20%
L/T/D n_G/O/X/SV DD + 5%
VIH
L/T/Dn_G/O/X/SVDD
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tCLK1
Note:
1. tCLK references clocks for various functional blocks as follows:
DDR n = 10% of Dn_MCK period
eTsecn = 10% of EC n_GTX_CLK125 period
Local Bus = 10% of LCLK[0:2] period
I2C = 10% of SYSCLK
JTAG = 10% of SYSCLK
Figure 2. Overshoot/Undershoot Voltage for D n_M/O/L/TVIN
The MPC8641 core voltage must always be provided at nominal VDD_Coren (See Table 2 for actual
recommended core voltage). Voltage to the processor interface I/Os are provided through separate sets of
supply pins and must be provided at the voltages shown in Table 2. The input voltage threshold scales with
respect to the associated I/O supply voltage. OVDD and L/TVDD based receivers are simple CMOS I/O
circuits and satisfy appropriate LVCMOS type specifications. The DDR SDRAM interface uses a
single-ended differential receiver referenced to each externally supplied Dn_MVREF signal (nominally set
to Dn_GVDD/2) as is appropriate for the (SSTL-18 and SSTL-25) electrical signaling standards.
2.1.3
Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are preliminary
estimates.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
9
Electrical Characteristics
Table 3. Output Drive Capability
Driver Type
Programmable
Output Impedance
(Ω)
Supply
Voltage
Notes
DDR1 signal
18
36 (half strength mode)
Dn_GVDD = 2.5 V
4, 9
DDR2 signal
18
36 (half strength mode)
Dn_GVDD = 1.8 V
1, 5, 9
Local Bus signals
45
25
OVDD = 3.3 V
2, 6
eTSEC/10/100 signals
45
T/LVDD = 3.3 V
6
30
T/LVDD = 2.5 V
6
DUART, DMA, Multiprocessor Interrupts, System
Control & Clocking, Debug, Test, Power management,
JTAG and Miscellaneous I/O voltage
45
OVDD = 3.3 V
6
I2C
150
OVDD = 3.3 V
7
SRIO, PCI Express
100
SVDD = 1.1/1.05 V
3, 8
Notes:
1. See the DDR Control Driver registers in the MPC8641D reference manual for more information.
2. Only the following local bus signals have programmable drive strengths: LALE, LAD[0:31], LDP[0:3], LA[27:31], LCKE,
LCS[1:2], LWE[0:3], LGPL1, LGPL2, LGPL3, LGPL4, LGPL5, LCLK[0:2]. The other local bus signals have a fixed drive
strength of 45 ohms. See the POR Impedance Control register in the MPC8641D reference manual for more information
about local bus signals and their drive strength programmability.
3. See Section 17, “Signal Listings” for details on resistor requirements for the calibration of SDn_IMP_CAL_TX and
SDn_IMP_CAL_RX transmit and receive signals.
4. Stub Series Terminated Logic (SSTL-25) type pins.
5. Stub Series Terminated Logic (SSTL-18) type pins.
6. Low Voltage Transistor-Transistor Logic (LVTTL) type pins.
7. Open Drain type pins.
8. Low Voltage Differential Signaling (LVDS) type pins.
9. The drive strength of the DDR interface in half strength mode is at Tj = 105C and at Dn_GV DD (min).
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
10
Freescale Semiconductor
Electrical Characteristics
2.2
Power Up/Down Sequence
The MPC8641 requires its power rails to be applied in a specific sequence in order to ensure proper device
operation.
NOTE
The recommended maximum ramp up time for power supplies is 20
milliseconds.
The chronological order of power up is:
1. All power rails other than DDR I/O (Dn_GVDD, and Dn_MVREF).
NOTE
There is no required order sequence between the individual rails for this
item (# 1). However, VDD_PLAT, AVDD_PLAT rails must reach 90% of
their recommended value before the rail for Dn_GVDD, and Dn_MVREF (in
next step) reaches 10% of their recommended value. AVDD type supplies
must be delayed with respect to their source supplies by the RC time
constant of the PLL filter circuit described in Section 20.2.1, “PLL Power
Supply Filtering”.
2. Dn_GVDD, Dn_MVREF
NOTE
It is possible to leave the related power supply (Dn_GVDD, Dn_MVREF)
turned off at reset for a DDR port that will not be used. Note that these
power supplies can only be powered up again at reset for functionality to
occur on the DDR port.
3. SYSCLK
The recommended order of power down is as follows:
1. Dn_GVDD, Dn_MVREF
2. All power rails other than DDR I/O (Dn_GVDD, Dn_MVREF).
NOTE
SYSCLK may be powered down simultaneous to either of item # 1 or # 2 in
the power down sequence. Beyond this, the power supplies may power
down simultaneously if the preservation of DDRn memory is not a concern.
See Figure 3 for more details on the Power and Reset Sequencing details
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
11
Electrical Characteristics
Figure 3 illustrates the Power Up sequence as described above.
3.3 V
L/T/OVDD
DC Power Supply Voltage
If
1
L/TVDD=2.5 V
2.5 V
Dn_GVDD, = 1.8/2.5 V
Dn_MVREF
1.8 V
VDD_PLAT, AVDD_PLAT
AVDD_LB, SVDD, XVDD_SRDSn
AVDD_SRDSn
VDD_Coren, AVDD_Coren
1.2 V
100 µs Platform PLL
Relock Time 3
7
0
Power Supply Ramp Up 2
Time
SYSCLK 8 (not drawn to scale)
9
HRESET (& TRST)
Asserted for
100 μs after
SYSCLK is functional 4
e6005
PLL
Reset
Configuration Pins
Cycles Setup and hold Time 6
Notes:
1. Dotted waveforms correspond to optional supply values for a specified power supply. See Table 2.
2. The recommended maximum ramp up time for power supplies is 20 milliseconds.
3. Refer to Section 5, “RESET Initialization” for additional information on PLL relock and reset signal
assertion timing requirements.
4. Refer to Table 11 for additional information on reset configuration pin setup timing requirements. In
addition see Figure 68 regarding HRESET and JTAG connection details including TRST.
5. e600 PLL relock time is 100 microseconds maximum plus 255 MPX_clk cycles.
6. Stable PLL configuration signals are required as stable SYSCLK is applied. All other POR configuration
inputs are required 4 SYSCLK cycles before HRESET negation and are valid at least 2 SYSCLK cycles
after HRESET has negated (hold requirement). See Section 5, “RESET Initialization” for more
information on setup and hold time of reset configuration signals.
7. VDD_PLAT, AVDD_PLAT must strictly reach 90% of their recommended voltage before the rail for
Dn_GVDD, and Dn_MVREF reaches 10% of their recommended voltage.
8. SYSCLK must be driven only AFTER the power for the various power supplies is stable.
9. In device sleep mode, the reset configuration signals for DRAM types (TSEC2_TXD[4],TSEC2_TX_ER)
must be valid BEFORE HRESET is asserted.
Figure 3. MPC8641 Power-Up and Reset Sequence
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
12
Freescale Semiconductor
Power Characteristics
3
Power Characteristics
The power dissipation for the dual core MPC8641D device is shown in Table 4.
Table 4. MPC8641D Power Dissipation (Dual Core)
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD_Coren,
VDD_PLAT
(Volts)
Typical
Thermal
1500 MHz
600 MHz
1.1 V
Maximum
1333 MHz
533 MHz
1.05 V
Maximum
1250 MHz
500 MHz
32.1
1, 2
43.4
1, 3
49.9
1, 4
23.9
1, 2
30.0
1, 3
34.1
1, 4
23.9
1, 2
30.0
1, 3
34.1
1, 4
23.9
1, 2
30.0
1, 3
34.1
1, 4
16.2
1, 2, 5
21.8
1, 3, 5
25.0
1, 4, 5
105 oC
105 oC
105 oC
Typical
65
1000 MHz
400 MHz
oC
1.05 V
105 oC
Maximum
65
Typical
Thermal
65 oC
1.05 V
Maximum
Thermal
Notes
65 oC
Typical
Thermal
Power
(Watts)
65 oC
Typical
Thermal
Junction
Temperature
1000 MHz
Maximum
500 MHz
0.95 V,
1.05 V
oC
105 oC
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Coren) and 65°C junction
temperature (see Table 2)while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz with one core
at 100% efficiency and the second core at 65% efficiency.
3. Thermal power is the average power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz on both
cores and a typical workload on platform interfaces.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy on both cores.
5. These power numbers are for Part Number MC8641Dxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
13
Power Characteristics
The maximum power dissipation for individual power supplies of the MPC8641D is shown in Table 5.
Table 5. MPC8641D Individual Supply Maximum Power Dissipation 1
Component Description
Supply Voltage
(Volts)
Power
(Watts)
Per Core voltage Supply
VDD_Core0/VDD_Core1 = 1.1 V @ 1500 MHz
21.00
Per Core PLL voltage supply
AVDD_Core0/AVDD_Core1 = 1.1 V @ 1500 MHz
0.0125
Per Core voltage Supply
VDD_Core0/VDD_Core1 = 1.05 V @ 1333 MHz
17.00
Per Core PLL voltage supply
AV DD_Core0/AVDD_Core1 = 1.05 V @ 1333 MHz
0.0125
Per Core voltage Supply
VDD_Core0/VDD_Core1 = 0.95 V @ 1000 MHz
11.50
5
Per Core PLL voltage supply
AV DD_Core0/AVDD_Core1 = 0.95 V @ 1000 MHz
0.0125
5
DDR Controller I/O voltage supply
Dn_GVDD = 2.5 V @ 400 MHz
0.80
2
Dn_GVDD = 1.8 V @ 533 MHz
0.68
2
Dn_GVDD = 1.8 V @ 600 MHz
0.77
2
16-bit FIFO @ 200 MHz
eTsec 1&2/3&4 Voltage Supply
L/TVDD = 3.3 V
0.11
2, 3
non-FIFO eTsecn Voltage Supply
L/TVDD = 3.3 V
0.08
2
x8 SerDes transceiver Supply
SVDD = 1.1 V
0.70
2
x8 SerDes I/O Supply
XVDD_SRDS n = 1.1 V
0.66
2
SerDes PLL voltage supply Port 1 or 2
AVDD_SRDS1/AV DD_SRDS2 = 1.1 V
0.10
Platform I/O Supply
OVDD = 3.3 V
0.45
Platform source Supply
VDD_PLAT = 1.1 V @ 600 MHz
12.00
Platform source Supply
VDD_PLAT = 1.05 Vn @ 500 MHz
9.80
Platform source Supply
VDD_PLAT = 1.05 Vn @ 400 MHz
7.70
Platform, Local Bus PLL voltage Supply
AVDD_PLAT, AVDD_LB = 1.1 V
0.0125
Notes
4
5
Notes:
1. This is a maximum power supply number which is provided for power supply and board design information. The numbers are
based on 100% bus utilization for each component. The components listed are not expected to have 100% bus usage
simultaneously for all components. Actual numbers may vary based on activity.
2. Number is based on a per port/interface value.
3. This is based on one eTSEC port used. Since 16-bit FIFO mode involves two ports, the number will need to be multiplied by
two for the total. The other eTSEC protocols dissipate less than this number per port. Note that the power needs to be
multiplied by the number of ports used for the protocol for the total eTSEC port power dissipation.
4.This includes Local Bus, DUART, I2C, DMA, Multiprocessor Interrupts, System Control & Clocking, Debug, Test, Power
management, JTAG and Miscellaneous I/O voltage.
5. These power numbers are for Part Number MC8641xxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
14
Freescale Semiconductor
Input Clocks
The power dissipation for the MPC8641 single core device is shown in Table 6.
Table 6. MPC8641 Power Dissipation (Single Core)
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD_Coren,
VDD_PLAT
(Volts)
Typical
Thermal
1500 MHz
600 MHz
1.1 V
Maxim
Junction
Temperature
Power
(Watts)
Notes
65 oC
20.3
1, 2
25.2
1, 3
28.9
1, 4
16.3
1, 2
20.2
1, 3
23.2
1, 4
16.3
1, 2
20.2
1, 3
23.2
1, 4
16.3
1, 2
20.2
1, 3
23.2
1, 4
11.6
1, 2, 5
14.4
1, 3, 5
16.5
1, 4, 5
105 oC
o
Typical
65 C
Thermal
1333 MHz
533 MHz
1.05 V
Maximum
Typical
105 oC
65
Thermal
1250 MHz
oC
1.05 V
500 MHz
105 oC
Maximum
65 oC
Typical
Thermal
1000 MHz
400 MHz
1.05 V
105 oC
Maximum
65
Typical
Thermal
1000 MHz
Maximum
500 MHz
0.95 V,
1.05 V
oC
105 oC
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Coren) and 65°C junction
temperature (see Table 2)while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz.
3. Thermal power is the average power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz and a typical
workload on platform interfaces.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy.
5. These power numbers are for Part Number MC8641xx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
4
Input Clocks
Table 7 provides the system clock (SYSCLK) DC specifications for the MPC8641.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
15
Input Clocks
Table 7. SYSCLK DC Electrical Characteristics (OVDD = 3.3 V ± 165 mV.)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = V DD)
IIN
—
±5
μA
Note:
1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
4.1
System Clock Timing
Table 8 provides the system clock (SYSCLK) AC timing specifications for the MPC8641.
Table 8. SYSCLK AC Timing Specifications
At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
66
—
166.66
MHz
1
SYSCLK cycle time
tSYSCLK
6
—
—
ns
—
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
1.2
ns
2
tKHK/tSYSCLK
40
—
60
%
3
—
—
—
150
ps
4, 5
SYSCLK duty cycle
SYSCLK jitter
Notes:
1. Caution: The MPX clock to SYSCLK ratio and e600 core to MPX clock ratio settings must be chosen such that the
resulting SYSCLK frequency, e600 (core) frequency, and MPX clock frequency do not exceed their respective
maximum or minimum operating frequencies. Refer toSection 18.2, “MPX to SYSCLK PLL Ratio”, and
Section 18.3, “e600 to MPX clock PLL Ratio”, for ratio settings.
2. Rise and fall times for SYSCLK are measured at 0.4 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the short term jitter only and is guaranteed by design.
5. The SYSCLK driver’s closed loop jitter bandwidth should be <500 kHz at -20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter. Note that the
frequency modulation for SYSCLK reduces significantly for the spread spectrum source case. This is to guarantee
what is supported based on design.
4.1.1
SYSCLK and Spread Spectrum Sources
Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference emissions
(EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise magnitude in order to meet
industry and government requirements. These clock sources intentionally add long-term jitter in order to diffuse the
EMI spectral content. The jitter specification given in Table 8 considers short-term (cycle-to-cycle) jitter only and
the clock generator’s cycle-to-cycle output jitter should meet the MPC8641 input cycle-to-cycle jitter requirement.
Frequency modulation and spread are separate concerns, and the MPC8641 is compatible with spread spectrum
sources if the recommendations listed in Table 9 are observed.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
16
Freescale Semiconductor
Input Clocks
Table 9. Spread Spectrum Clock Source Recommendations
At recommended operating conditions. See Table 2.
Parameter
Min
Max
Unit
Notes
Frequency modulation
—
50
kHz
1
Frequency spread
—
1.0
%
1, 2
Notes:
1. Guaranteed by design.
2. SYSCLK frequencies resulting from frequency spreading, and the resulting core and VCO
frequencies, must meet the minimum and maximum specifications given in Table 8.
It is imperative to note that the processor’s minimum and maximum SYSCLK, core, and VCO frequencies
must not be exceeded regardless of the type of clock source. Therefore, systems in which the processor is
operated at its maximum rated e600 core frequency should avoid violating the stated limits by using
down-spreading only.
SDn_REF_CLK and SDn_REF_CLK was designed to work with a spread spectrum clock (+0 to 0.5%
spreading at 30-33kHz rate is allowed), assuming both ends have same reference clock. For better results
use a source without significant unintended modulation.
4.2
Real Time Clock Timing
The RTC input is sampled by the platform clock (MPX clock). The output of the sampling latch is then
used as an input to the counters of the PIC. There is no jitter specification. The minimum pulse width of
the RTC signal should be greater than 2x the period of the MPX clock. That is, minimum clock high time
is 2 × tMPX, and minimum clock low time is 2 × tMPX. There is no minimum RTC frequency; RTC may be
grounded if not needed.
4.3
eTSEC Gigabit Reference Clock Timing
Table 10 provides the eTSEC gigabit reference clocks (EC1_GTX_CLK125 and EC2_GTX_CLK125) AC
timing specifications for the MPC8641.
Table 10. EC n_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
ECn_GTX_CLK125 frequency
fG125
—
125 ±100
ppm
—
MHz
3
ECn_GTX_CLK125 cycle time
tG125
—
8
—
ns
ECn_GTX_CLK125 peak-to-peak jitter
tG125J
—
—
250
ps
1
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
17
RESET Initialization
Table 10. ECn_GTX_CLK125 AC Timing Specifications (continued)
ECn_GTX_CLK125 duty cycle
%
—
tG125H/tG125
45
47
GMII, TBI
1000Base-T for RGMII, RTBI
1, 2
55
53
Notes:
1. Timing is guaranteed by design and characterization.
2. ECn_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation.
ECn_GTX_CLK125 duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle
generated by the eTSEC GTX_CLK. See Section 8.2.6, “RGMII and RTBI AC Timing Specifications” for duty cycle
for 10Base-T and 100Base-T reference clock.
3. ±100 ppm tolerance on ECn_GTX_CLK125 frequency
NOTE
The phase between the output clocks TSEC1_GTX_CLK and
TSEC2_GTX_CLK (ports 1 and 2) is no more than 100 ps. The phase
between the output clocks TSEC3_GTX_CLK and TSEC4_GTX_CLK
(ports 3 and 4) is no more than 100 ps.
4.4
Platform Frequency Requirements for PCI-Express and Serial
RapidIO
The MPX platform clock frequency must be considered for proper operation of the high-speed PCI
Express and Serial RapidIO interfaces as described below.
For proper PCI Express operation, the MPX clock frequency must be greater than or equal to:
527 MHz x (PCI-Express link width)
16 / (1 + cfg_plat_freq)
Note that at MPX = 400 MHz, cfg_plat_freq = 0 and at MPX > 400 MHz, cfg_plat_freq = 1. Therefore,
when operating PCI Express in x8 link width, the MPX platform frequency must be 400 MHz with
cfg_plat_freq = 0 or greater than or equal to 527 MHz with cfg_plat_freq = 1.
For proper Serial RapidIO operation, the MPX clock frequency must be greater than:
2 × (0.80) × (Serial RapidIO interface frequency) × (Serial RapidIO link width)
64
4.5
Other Input Clocks
For information on the input clocks of other functional blocks of the platform such as SerDes, and eTSEC,
see the specific section of this document.
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8641. Table 11 provides the RESET initialization AC timing specifications.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
18
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 11. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
100
—
μs
3
—
SYSCLKs
1
100
—
μs
2
Input setup time for POR configs (other than PLL
config) with respect to negation of HRESET
4
—
SYSCLKs
1
Input hold time for all POR configs (including PLL
config) with respect to negation of HRESET
2
—
SYSCLKs
1
Maximum valid-to-high impedance time for actively
driven POR configs with respect to negation of
HRESET
—
5
SYSCLKs
1
Required assertion time of HRESET
Minimum assertion time for SRESET_0 & SRESET_1
Platform PLL input setup time with stable SYSCLK
before HRESET negation
Notes
Notes:
1. SYSCLK is the primary clock input for the MPC8641.
2 This is related to HRESET assertion time. Stable PLL configuration inputs are required when a stable SYSCLK is
applied. See the MPC8641D Integrated Host Processor Reference Manual for more details on the power-on reset
sequence.
Table 12 provides the PLL lock times.
Table 12. PLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
(Platform and E600) PLL lock times
—
100
μs
1
Local bus PLL
—
50
μs
Notes:
1. The PLL lock time for e600 PLLs require an additional 255 MPX_CLK cycles.
6
DDR and DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the
MPC8641. Note that DDR SDRAM is Dn_GVDD(typ) = 2.5 V and DDR2 SDRAM is
Dn_GVDD(typ) = 1.8 V.
6.1
DDR SDRAM DC Electrical Characteristics
Table 13 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the
MPC8641 when Dn_GVDD(typ) = 1.8 V.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
19
DDR and DDR2 SDRAM
Table 13. DDR2 SDRAM DC Electrical Characteristics for Dn_GVDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
Dn_GVDD
1.71
1.89
V
1
I/O reference voltage
Dn_MVREF
0.49 × Dn_GVDD
0.51 × Dn_GVDD
V
2
I/O termination voltage
VTT
Dn_MVREF – 0.0
4
Dn_MVREF + 0.04
V
3
Input high voltage
VIH
Dn_MVREF+ 0.1
25
Dn_GVDD + 0.3
V
Input low voltage
VIL
–0.3
Dn_MV REF – 0.125
V
Output leakage current
IOZ
–50
50
μA
Output high current (VOUT = 1.420 V)
IOH
–13.4
—
mA
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
4
Notes:
1. Dn_GV DD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. Dn_MV REF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the
receiver. Peak-to-peak noise on Dn_MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to Dn_MVREF. This rail should track variations in the DC level of Dn_MVREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GVDD.
Table 14 provides the DDR2 capacitance when Dn_GVDD(typ) = 1.8 V.
Table 14. DDR2 SDRAM Capacitance for Dn_GVDD(typ)=1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. Dn_GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = Dn_GVDD/2, VOUT
(peak-to-peak) = 0.2 V.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
20
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 15 provides the recommended operating conditions for the DDR SDRAM component(s) when
Dn_GVDD(typ) = 2.5 V.
Table 15. DDR SDRAM DC Electrical Characteristics for Dn_GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
Dn_GVDD
2.375
2.625
V
1
I/O reference voltage
Dn_MVREF
0.49 × Dn_GVDD
0.51 × Dn_GVDD
V
2
I/O termination voltage
VTT
Dn_MVREF – 0.04
Dn_MV REF + 0.04
V
3
Input high voltage
VIH
Dn_MVREF + 0.15
D n_GVDD + 0.3
V
Input low voltage
VIL
–0.3
Dn_MVREF– 0.15
V
Output leakage current
IOZ
–50
50
μA
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
4
Notes:
1. Dn_GV DD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. MVREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GV DD DC variations as measured at the receiver.
Peak-to-peak noise on Dn_MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to Dn_MVREF. This rail should track variations in the DC level of Dn_MVREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GV DD.
Table 16 provides the DDR capacitance when Dn_GVDD (typ)=2.5 V.
Table 16. DDR SDRAM Capacitance for Dn_GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. Dn_GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = Dn_GVDD/2,
VOUT (peak-to-peak) = 0.2 V.
Table 17 provides the current draw characteristics for MVREF.
Table 17. Current Draw Characteristics for MVREF
Parameter / Condition
Current draw for MVREF
Symbol
Min
Max
Unit
Note
IMVREF
—
500
μA
1
1. The voltage regulator for MVREF must be able to supply up to 500 μA current.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
21
DDR and DDR2 SDRAM
6.2
DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface.
6.2.1
DDR SDRAM Input AC Timing Specifications
Table 18 provides the input AC timing specifications for the DDR2 SDRAM when Dn_GVDD(typ)=1.8 V.
Table 18. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions
Parameter
Symbol
AC input low voltage
Min
Max
—
Dn_MVREF – 0.25
Dn_MVREF – 0.20
Dn_MVREF + 0.25
Dn_MVREF + 0.20
—
Unit
VIL
400, 533 MHz
600 MHz
AC input high voltage
V
VIH
400, 533 MHz
600 MHz
Notes
V
Table 19 provides the input AC timing specifications for the DDR SDRAM when Dn_GVDD(typ)=2.5 V.
Table 19. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
Dn_MVREF – 0.31
V
AC input high voltage
VIH
Dn_MVREF + 0.31
—
V
Notes
Table 20 provides the input AC timing specifications for the DDR SDRAM interface.
Table 20. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions.
Parameter
Symbol
Controller Skew for
MDQS—MDQ/MECC
Min
Max
tCISKEW
Unit
Notes
ps
1, 2
600 MHz
–240
240
3
533 MHz
–300
300
3
400 MHz
–365
365
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding
bit that will be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called
tDISKEW.This can be determined by the following equation: tDISKEW =+/-(T/4 - abs(tCISKEW)) where T is
the clock period and abs(tCISKEW) is the absolute value of tCISKEW.
3. Maximum DDR1 frequency is 400 MHz.
Figure 4 shows the DDR SDRAM input timing for the MDQS to MDQ skew measurement (tDISKEW).
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
22
Freescale Semiconductor
DDR and DDR2 SDRAM
MCK[n]
MCK[n]
tMCK
MDQS[n]
MDQ[x]
D0
D1
tDISKEW
tDISKEW
Figure 4. DDR Input Timing Diagram for tDISKEW
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
23
DDR and DDR2 SDRAM
6.2.2
DDR SDRAM Output AC Timing Specifications
Table 21. DDR SDRAM Output AC Timing Specifications
At recommended operating conditions.
Parameter
MCK[n] cycle time, MCK[n]/MCK[n] crossing
MCK duty cycle
Symbol 1
Min
Max
Unit
Notes
tMCK
3
10
ns
2
47.5
47
47
52.5
53
53
ADDR/CMD output setup with respect to MCK
8
9
9
tDDKHAS
ns
3
600 MHz
1.10
—
7
533 MHz
1.48
—
7
400 MHz
1.95
—
ADDR/CMD output hold with respect to MCK
tDDKHAX
ns
3
600 MHz
1.10
—
7
533 MHz
1.48
—
7
400 MHz
1.95
—
MCS[n] output setup with respect to MCK
tDDKHCS
ns
3
600 MHz
1.10
—
7
533 MHz
1.48
—
7
400 MHz
1.95
—
MCS[n] output hold with respect to MCK
tDDKHCX
ns
3
600 MHz
1.10
—
7
533 MHz
1.48
—
7
400 MHz
1.95
—
–0.6
0.6
MCK to MDQS Skew
tDDKHMH
MDQ/MECC/MDM output setup with respect
to MDQS
tDDKHDS,
tDDKLDS
ns
4
ps
5
600 MHz
500
—
7
533 MHz
590
—
7
400 MHz
700
—
MDQ/MECC/MDM output hold with respect to
MDQS
MDQS preamble start
%
tMCKH/tMCK
600 MHz
533 MHz
400 MHz
tDDKHDX,
tDDKLDX
ps
5
600 MHz
500
—
7
533 MHz
590
—
7
400 MHz
700
—
–0.5 × tMCK – 0.6
–0.5 × tMCK +0.6
tDDKHMP
ns
6
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
24
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 21. DDR SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions.
Parameter
MDQS epilogue end
Symbol 1
Min
Max
Unit
Notes
tDDKHME
–0.6
0.6
ns
6
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can
be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went
invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K)
goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR
timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data
output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR
timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be
modified through control of the DQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This
will typically be set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in
the table assume that these 2 parameters have been set to the same adjustment value. See the MPC8641
Integrated Processor Reference Manual for a description and understanding of the timing modifications enabled by
use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ),
ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the
microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows
the symbol conventions described in note 1.
7. Maximum DDR1 frequency is 400 MHz
8. Per the JEDEC spec the DDR2 duty cycle at 600 MHz is the average low and high cycle time values that are
defined as the average pulse widths calculated across any consecutive 200 pulses. Jitter can sometimes force
single low and high cycle times to drift from the average values. tJIT = ±125 ps.
9. Per the JEDEC spec the DDR2 duty cycle at 400 and 533 MHz is the low and high cycle time values.
NOTE
For the ADDR/CMD setup and hold specifications in Table 21, it is
assumed that the Clock Control register is set to adjust the memory clocks
by 1/2 applied cycle.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
25
DDR and DDR2 SDRAM
Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).
MCK[n]
MCK[n]
tMCK
tDDKHMHmax) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 5. Timing Diagram for tDDKHMH
Figure 6 shows the DDR SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tDDKHAS ,tDDKHCS
tDDKHAX ,tDDKHCX
ADDR/CMD
Write A0
NOOP
tDDKHMP
tDDKHMH
MDQS[n]
tDDKHME
tDDKHDS
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 6. DDR SDRAM Output Timing Diagram
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
26
Freescale Semiconductor
DUART
Figure 7 provides the AC test load for the DDR bus.
Z0 = 50 Ω
Output
Dn_GVDD/2
RL = 50 Ω
Figure 7. DDR AC Test Load
7
DUART
This section describes the DC and AC electrical specifications for the DUART interface of the MPC8641.
7.1
DUART DC Electrical Characteristics
Table 22 provides the DC electrical characteristics for the DUART interface.
Table 22. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
– 0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = VDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –100 μA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 100 μA)
VOL
—
0.2
V
Note:
1. Note that the symbol V IN, in this case, represents the OVIN symbol referenced in Table 1
and Table 2.
7.2
DUART AC Electrical Specifications
Table 23 provides the AC timing parameters for the DUART interface.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
27
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Table 23. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
MPX clock/1,048,576
baud
1,2
Maximum baud rate
MPX clock/16
baud
1,3
16
—
1,4
Oversample rate
Notes:
1. Guaranteed by design.
2. MPX clock refers to the platform clock.
3. Actual attainable baud rate will be limited by the latency of interrupt processing.
4. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
sampled each 16th sample.
8
Ethernet: Enhanced Three-Speed Ethernet (eTSEC),
MII Management
This section provides the AC and DC electrical characteristics for enhanced three-speed and MII
management.
8.1
Enhanced Three-Speed Ethernet Controller (eTSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical
Characteristics
The electrical characteristics specified here apply to all gigabit media independent interface (GMII), media
independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent interface
(RGMII), reduced ten-bit interface (RTBI), and reduced media independent interface (RMII) signals
except management data input/output (MDIO) and management data clock (MDC). The RGMII and RTBI
interfaces are defined for 2.5 V, while the GMII and TBI interfaces can be operated at 3.3 or 2.5 V. Whether
the GMII or TBI interface is operated at 3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard.
The RGMII and RTBI interfaces follow the Reduced Gigabit Media-Independent Interface (RGMII)
Specification Version 1.3 (12/10/2000). The RMII interface follows the RMII Consortium RMII
Specification Version 1.2 (3/20/1998). The electrical characteristics for MDIO and MDC are specified in
Section 9, “Ethernet Management Interface Electrical Characteristics.”
8.1.1
eTSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, RMII and RTBI drivers and receivers comply with the DC parametric
attributes specified in Table 24 and Table 25. The potential applied to the input of a GMII, MII, TBI,
RGMII, RMII or RTBI receiver may exceed the potential of the receiver’s power supply (i.e., a GMII
driver powered from a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply).
Tolerance for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
28
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC
EIA/JESD8-5.
Table 24. GMII, MII, RMII, TBI and FIFO DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
LVDD
TVDD
3.135
3.465
V
Output high voltage
(LV DD/TVDD = Min, IOH = –4.0 mA)
VOH
2.40
—
V
Output low voltage
(LV DD/TVDD = Min, IOL = 4.0 mA)
VOL
—
0.50
V
Input high voltage
VIH
2.0
—
V
Input low voltage
VIL
—
0.90
V
Input high current
(VIN = LVDD, VIN = TVDD)
IIH
—
40
μA
Input low current
(VIN = GND)
IIL
–600
Supply voltage 3.3 V
Notes
1, 2
1, 2, 3
μA
—
3
Notes:
1
LVDD supports eTSECs 1 and 2.
TVDD supports eTSECs 3 and 4.
3 The symbol V , in this case, represents the LV and TV symbols referenced in Table 1 and Table 2.
IN
IN
IN
2
Table 25. GMII, RGMII, RTBI, TBI and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
LVDD/TVDD
2.375
2.625
V
Output high voltage
(LVDD/TVDD = Min, IOH = –1.0 mA)
VOH
2.00
—
V
Output low voltage
(LVDD/TVDD = Min, IOL = 1.0 mA)
VOL
—
0.40
V
Input high voltage
VIH
1.70
—
V
Input low voltage
VIL
—
0.90
V
Input high current
(VIN = LVDD, VIN = TVDD)
IIH
—
10
μA
Input low current
(VIN = GND)
IIL
–15
Supply voltage 2.5 V
Notes
1, 2
1, 2, 3
—
μA
3
Note:
1
2
LVDD supports eTSECs 1 and 2.
TVDD supports eTSECs 3 and 4.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
29
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
3
Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
8.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII and RTBI are presented in this
section.
8.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performance and are described in a source-synchronous fashion like
FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source- synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is
relationship between the maximum FIFO speed and the platform speed. For more information see
Section 18.4.2, “Platform to FIFO Restrictions”
NOTE
The phase between the output clocks TSEC1_GTX_CLK and
TSEC2_GTX_CLK (ports 1 and 2) is no more than 100 ps. The phase
between the output clocks TSEC3_GTX_CLK and TSEC4_GTX_CLK
(ports 3 and 4) is no more than 100 ps.
A summary of the FIFO AC specifications appears in Table 26 and Table 27.
Table 26. FIFO Mode Transmit AC Timing Specification
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
TX_CLK, GTX_CLK clock period (GMII mode)
tFIT
7.0
8.0
100
ns
TX_CLK, GTX_CLK clock period (Encoded mode)
tFIT
5.3
8.0
100
ns
tFITH/tFIT
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
—
—
250
ps
Rise time TX_CLK (20%–80%)
tFITR
—
—
0.75
ns
Fall time TX_CLK (80%–20%)
tFITF
—
—
0.75
ns
TX_CLK, GTX_CLK duty cycle
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
30
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Table 26. FIFO Mode Transmit AC Timing Specification (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
FIFO data TXD[7:0], TX_ER, TX_EN setup time to
GTX_CLK
tFITDV
2.0
—
—
ns
GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN
hold time
tFITDX
0.5
—
3.0
ns
Table 27. FIFO Mode Receive AC Timing Specification
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tFIR 1
7.0
8.0
100
ns
1
5.3
8.0
100
ns
tFIRH/tFIR
45
50
55
%
RX_CLK peak-to-peak jitter
tFIRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tFIRR
—
—
0.75
ns
Fall time RX_CLK (80%–20%)
tFIRF
—
—
0.75
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tFIRDV
1.5
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tFIRDX
0.5
—
—
ns
RX_CLK clock period (GMII mode)
RX_CLK clock period (Encoded mode)
tFIR
RX_CLK duty cycle
1
±100 ppm tolerance on RX_CLK frequency
Timing diagrams for FIFO appear in Figure 8 and Figure 9.
.
tFITF
tFITR
tFIT
GTX_CLK
tFITH
tFITDV
tFITDX
TXD[7:0]
TX_EN
TX_ER
Figure 8. FIFO Transmit AC Timing Diagram
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
31
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
tFIRR
tFIR
RX_CLK
tFIRH
tFIRF
RXD[7:0]
RX_DV
RX_ER
valid data
tFIRDV
tFIRDX
Figure 9. FIFO Receive AC Timing Diagram
8.2.2
GMII AC Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
8.2.2.1
GMII Transmit AC Timing Specifications
Table 28 provides the GMII transmit AC timing specifications.
Table 28. GMII Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
GMII data TXD[7:0], TX_ER, TX_EN setup time
tGTKHDV
2.5
—
—
ns
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
0.5
—
5.0
ns
GTX_CLK data clock rise time (20%-80%)
tGTXR2
—
—
1.0
ns
GTX_CLK data clock fall time (80%-20%)
tGTXF2
—
—
1.0
ns
Parameter/Condition
Notes:
1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input
signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect
to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold
time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
32
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 10 shows the GMII transmit AC timing diagram.
tGTXR
tGTX
GTX_CLK
tGTXF
tGTXH
TXD[7:0]
TX_EN
TX_ER
tGTKHDX
tGTKHDV
Figure 10. GMII Transmit AC Timing Diagram
8.2.2.2
GMII Receive AC Timing Specifications
Table 29 provides the GMII receive AC timing specifications.
Table 29. GMII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tGRX3
—
8.0
—
ns
tGRXH/tGRX
40
—
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
Parameter/Condition
RX_CLK clock period
RX_CLK duty cycle
0.5
—
—
ns
RX_CLK clock rise time (20%-80%)
tGRXR
2
—
—
1.0
ns
RX_CLK clock fall time (80%-20%)
tGRXF2
—
—
1.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII
receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock
reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to
the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
3. ±100 ppm tolerance on RX_CLK frequency
Figure 11 provides the AC test load for eTSEC.
Output
Z0 = 50 Ω
RL = 50 Ω
LVDD/2
Figure 11. eTSEC AC Test Load
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
33
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 12 shows the GMII receive AC timing diagram.
tGRX
tGRXR
RX_CLK
tGRXH
tGRXF
RXD[7:0]
RX_DV
RX_ER
tGRDXKH
tGRDVKH
Figure 12. GMII Receive AC Timing Diagram
8.2.3
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.3.1
MII Transmit AC Timing Specifications
Table 30 provides the MII transmit AC timing specifications.
Table 30. MII Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX2
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
TX_CLK data clock rise time (20%-80%)
tMTXR2
1.0
—
4.0
ns
TX_CLK data clock fall time (80%-20%)
tMTXF2
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII
transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 13 shows the MII transmit AC timing diagram.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
34
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
tMTX
tMTXR
TX_CLK
tMTXF
tMTXH
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 13. MII Transmit AC Timing Diagram
8.2.3.2
MII Receive AC Timing Specifications
Table 31 provides the MII receive AC timing specifications.
Table 31. MII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX2,3
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX3
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
RX_CLK clock rise time (20%-80%)
tMRXR2
1.0
—
4.0
ns
RX_CLK clock fall time (80%-20%)
tMRXF2
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
3. ±100 ppm tolerance on RX_CLK frequency
Figure 14 provides the AC test load for eTSEC.
Output
Z0 = 50 Ω
RL = 50 Ω
LVDD/2
Figure 14. eTSEC AC Test Load
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
35
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 15 shows the MII receive AC timing diagram.
tMRX
tMRXR
RX_CLK
tMRXF
tMRXH
RXD[3:0]
RX_DV
RX_ER
Valid Data
tMRDVKH
tMRDXKL
Figure 15. MII Receive AC Timing Diagram
8.2.4
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
8.2.4.1
TBI Transmit AC Timing Specifications
Table 32 provides the TBI transmit AC timing specifications.
Table 32. TBI Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
TCG[9:0] setup time GTX_CLK going high
tTTKHDV
2.0
—
—
ns
TCG[9:0] hold time from GTX_CLK going high
tTTKHDX
1.0
—
—
ns
GTX_CLK rise time (20%–80%)
tTTXR2
—
—
1.0
ns
GTX_CLK fall time (80%–20%)
tTTXF2
—
—
1.0
ns
Parameter/Condition
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state
)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tTTKHDV symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the
referenced data signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing
(TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state
(X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tTTX represents the TBI (T) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
36
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 16 shows the TBI transmit AC timing diagram.
tTTXR
tTTX
GTX_CLK
tTTXH
tTTXF
tTTXF
TCG[9:0]
tTTKHDV
tTTXR
tTTKHDX
Figure 16. TBI Transmit AC Timing Diagram
8.2.4.2
TBI Receive AC Timing Specifications
Table 33 provides the TBI receive AC timing specifications.
Table 33. TBI Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
PMA_RX_CLK[0:1] clock period
PMA_RX_CLK[0:1] skew
Symbol 1
Min
tTRX3
Typ
Max
16.0
Unit
ns
tSKTRX
7.5
—
8.5
ns
tTRXH/tTRX
40
—
60
%
RCG[9:0] setup time to rising PMA_RX_CLK
tTRDVKH
2.5
—
—
ns
RCG[9:0] hold time to rising PMA_RX_CLK
tTRDXKH
1.5
—
—
ns
PMA_RX_CLK[0:1] clock rise time (20%-80%)
tTRXR2
0.7
—
2.4
ns
PMA_RX_CLK[0:1] clock fall time (80%-20%)
tTRXF2
0.7
—
2.4
ns
PMA_RX_CLK[0:1] duty cycle
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tTRDVKH symbolizes TBI receive timing (TR) with respect to the time data input signals (D) reach the valid state (V)
relative to the tTRX clock reference (K) going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI
receive timing (TR) with respect to the time data input signals (D) went invalid (X) relative to the tTRX clock reference
(K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three
letters representing the clock of a particular functional. For example, the subscript of tTRX represents the TBI (T)
receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (TRX).
2. Guaranteed by design.
3. ±100 ppm tolerance on PMA_RX_CLK[0:1] frequency
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
37
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 17 shows the TBI receive AC timing diagram.
tTRX
tTRXR
PMA_RX_CLK1
tTRXH
tTRXF
Valid Data
RCG[9:0]
Valid Data
tTRDVKH
tSKTRX
tTRDXKH
PMA_RX_CLK0
tTRXH
tTRDXKH
tTRDVKH
Figure 17. TBI Receive AC Timing Diagram
8.2.5
TBI Single-Clock Mode AC Specifications
When the eTSEC is configured for TBI modes, all clocks are supplied from external sources to the relevant
eTSEC interface. In single-clock TBI mode, when TBICON[CLKSEL] = 1 a 125-MHz TBI receive clock
is supplied on TSECn_RX_CLK pin (no receive clock is used on TSECn_TX_CLK in this mode, whereas
for the dual-clock mode this is the PMA1 receive clock). The 125-MHz transmit clock is applied on the
TSEC_GTX_CLK125 pin in all TBI modes.
A summary of the single-clock TBI mode AC specifications for receive appears in Table 34.
Table 34. TBI single-clock Mode Receive AC Timing Specification
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
Min
Typ
Max
Unit
7.5
8.0
8.5
ns
tTRRH/tTRR
40
50
60
%
RX_CLK peak-to-peak jitter
tTRRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tTRRR
—
—
1.0
ns
Fall time RX_CLK (80%–20%)
tTRRF
—
—
1.0
ns
RCG[9:0] setup time to RX_CLK rising edge
tTRRDVKH
2.0
—
—
ns
RCG[9:0] hold time to RX_CLK rising edge
tTRRDXKH
1.0
—
—
ns
RX_CLK clock period
RX_CLK duty cycle
1
Symbol
tTRR
1
±100 ppm tolerance on RX_CLK frequency
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
38
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
A timing diagram for TBI receive appears in Figure 18.
.
tTRRR
tTRR
RX_CLK
tTRRH
tTRRF
RCG[9:0]
valid data
tTRRDVKH tTRRDXKH
Figure 18. TBI Single-Clock Mode Receive AC Timing Diagram
8.2.6
RGMII and RTBI AC Timing Specifications
Table 35 presents the RGMII and RTBI AC timing specifications.
Table 35. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with L/TVDD of 2.5 V ± 5%.
Parameter/Condition
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
2
Clock period duration 3
Duty cycle for 10BASE-T and 100BASE-TX
Rise time (20%–80%)
Fall time (80%–20%)
3, 4
Symbol 1
Min
Typ
Max
Unit
tSKRGT5
–500
0
500
ps
tSKRGT
1.0
—
2.8
ns
tRGT5,6
7.2
8.0
8.8
ns
tRGTH/tRGT5
40
50
60
%
tRGTR5
—
—
0.75
ns
5
—
—
0.75
ns
tRGTF
Notes:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to
represent RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note
also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols
representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than
1.5 ns will be added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains
as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed
transitioned between.
5. Guaranteed by characterization
6. ±100 ppm tolerance on RX_CLK frequency
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
39
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 19 shows the RGMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TXD[8:5]
TXD[3:0] TXD[7:4]
TXD[4]
TXEN
TX_CTL
TXD[9]
TXERR
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[3:0] RXD[7:4]
tSKRGT
RXD[4]
RXDV
RX_CTL
RXD[9]
RXERR
tSKRGT
RX_CLK
(At PHY)
Figure 19. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.2.7
RMII AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications.
8.2.7.1
RMII Transmit AC Timing Specifications
The RMII transmit AC timing specifications are in Table 36.
Table 36. RMII Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
REF_CLK clock period
Symbol 1
Min
tRMT
Typ
Max
20.0
Unit
ns
tRMTH/tRMT
35
50
65
%
REF_CLK peak-to-peak jitter
tRMTJ
—
—
250
ps
Rise time REF_CLK (20%–80%)
tRMTR
1.0
—
2.0
ns
Fall time REF_CLK (80%–20%)
tRMTF
1.0
—
2.0
ns
REF_CLK duty cycle
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
40
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
Table 36. RMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
REF_CLK to RMII data TXD[1:0], TX_EN delay
Symbol 1
Min
Typ
Max
Unit
tRMTDX
1.0
—
10.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs
(D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
Figure 20 shows the RMII transmit AC timing diagram.
tRMT
tRMTR
REF_CLK
tRMTH
tRMTF
TXD[1:0]
TX_EN
TX_ER
tRMTDX
Figure 20. RMII Transmit AC Timing Diagram
8.2.7.2
RMII Receive AC Timing Specifications
Table 37. RMII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tRMR
15.0
20.0
25.0
ns
tRMRH/tRMR
35
50
65
%
REF_CLK peak-to-peak jitter
tRMRJ
—
—
250
ps
Rise time REF_CLK (20%–80%)
tRMRR
1.0
—
2.0
ns
Fall time REF_CLK (80%–20%)
tRMRF
1.0
—
2.0
ns
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK
rising edge
tRMRDV
4.0
—
—
ns
Parameter/Condition
REF_CLK clock period
REF_CLK duty cycle
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
41
Ethernet Management Interface Electrical Characteristics
Table 37. RMII Receive AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK
rising edge
Symbol 1
Min
Typ
Max
Unit
tRMRDX
2.0
—
—
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V)
relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII
receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference
(K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based
on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the
MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise)
or F (fall).
Figure 21 provides the AC test load for eTSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
LVDD/2
Figure 21. eTSEC AC Test Load
Figure 22 shows the RMII receive AC timing diagram.
tRMRR
tRMR
REF_CLK
tRMRH
RXD[1:0]
CRS_DV
RX_ER
tRMRF
Valid Data
tRMRDV
tRMRDX
Figure 22. RMII Receive AC Timing Diagram
9
Ethernet Management Interface Electrical
Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
GMII, RGMII, RMII, TBI and RTBI are specified in “Section 8, “Ethernet: Enhanced Three-Speed
Ethernet (eTSEC), MII Management.”
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
42
Freescale Semiconductor
Ethernet Management Interface Electrical Characteristics
9.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in Table 38.
Table 38. MII Management DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
OVDD
3.135
3.465
V
Output high voltage
(OVDD = Min, IOH = –1.0 mA)
VOH
2.10
—
V
Output low voltage
(OVDD =Min, IOL = 1.0 mA)
VOL
—
0.50
V
Input high voltage
VIH
1.70
—
V
Input low voltage
VIL
—
0.90
V
Input high current
(OVDD = Max, VIN 1 = 2.1 V)
IIH
—
40
μA
Input low current
(OVDD = Max, VIN = 0.5 V)
IIL
–600
—
μA
Supply voltage (3.3 V)
Note:
1. Note that the symbol V IN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
9.2
MII Management AC Electrical Specifications
Table 39 provides the MII management AC timing specifications.
Table 39. MII Management AC Timing Specifications
At recommended operating conditions with OVDD is 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
Notes
MDC frequency
fMDC
2.5
—
9.3
MHz
2, 4
MDC period
tMDC
80
—
400
ns
MDC clock pulse width high
tMDCH
32
—
—
ns
MDC to MDIO valid
tMDKHDV
16*tMPXCLK
MDC to MDIO delay
tMDKHDX
10
—
MDIO to MDC setup time
tMDDVKH
5
MDIO to MDC hold time
tMDDXKH
tMDCR
Parameter/Condition
MDC rise time
ns
5
16*tMPXCLK
ns
3, 5
—
—
ns
0
—
—
ns
—
—
10
ns
4
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
43
Ethernet Management Interface Electrical Characteristics
Table 39. MII Management AC Timing Specifications (continued)
At recommended operating conditions with OVDD is 3.3 V ± 5%.
Parameter/Condition
MDC fall time
Symbol 1
Min
Typ
Max
Unit
Notes
tMDHF
—
—
10
ns
4
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX
symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are
invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input
signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For
rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. This parameter is dependent on the system clock speed. (The maximum frequency is the maximum platform frequency
divided by 64.)
3. This parameter is dependent on the system clock speed. (That is, for a system clock of 267 MHz, the maximum frequency
is 8.3 MHz and the minimum frequency is 1.2 MHz; for a system clock of 375 MHz, the maximum frequency is 11.7 MHz
and the minimum frequency is 1.7 MHz.)
4. Guaranteed by design.
5. tMPXCLK is the platform (MPX) clock
Figure 23 provides the AC test load for eTSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 23. eTSEC AC Test Load
NOTE
Output will see a 50Ω load since what it sees is the transmission line.
Figure 24 shows the MII management AC timing diagram.
tMDC
tMDCR
MDC
tMDCF
tMDCH
MDIO
(Input)
tMDDVKH
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 24. MII Management Interface Timing Diagram
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
44
Freescale Semiconductor
Local Bus
10 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the MPC8641.
10.1
Local Bus DC Electrical Characteristics
Table 40 provides the DC electrical characteristics for the local bus interface operating at OVDD = 3.3 V
DC.
Table 40. Local Bus DC Electrical Characteristics (3.3 V DC)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = OVDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –2 mA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 2 mA)
VOL
—
0.2
V
Note:
1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
10.2
Local Bus AC Electrical Specifications
Table 41 describes the timing parameters of the local bus interface at OVDD = 3.3 V with PLL enabled.
For information about the frequency range of local bus see Section 18.1, “Clock Ranges.”
Table 41. Local Bus Timing Parameters (OVDD = 3.3 V)m - PLL Enabled
Symbol 1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
7.5
—
ns
2
Local Bus Duty Cycle
tLBKH/tLBK
45
55
%
LCLK[n] skew to LCLK[m] or
LSYNC_OUT
tLBKSKEW
—
150
ps
7, 8
Input setup to local bus clock (except
LGTA/LUPWAIT)
tLBIVKH1
1.8
—
ns
3, 4
LGTA/LUPWAIT input setup to local
bus clock
tLBIVKH2
1.7
—
ns
3, 4
Input hold from local bus clock (except
LGTA/LUPWAIT)
tLBIXKH1
1.0
—
ns
3, 4
LGTA/LUPWAIT input hold from local
bus clock
tLBIXKH2
1.0
—
ns
3, 4
LALE output transition to LAD/LDP
output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Parameter
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
45
Local Bus
Table 41. Local Bus Timing Parameters (OVDD = 3.3 V)m - PLL Enabled (continued)
Parameter
Symbol 1
Min
Max
Unit
Local bus clock to output valid (except
LAD/LDP and LALE)
tLBKHOV1
—
2.0
ns
Local bus clock to data valid for
LAD/LDP
tLBKHOV2
—
2.2
ns
Local bus clock to address valid for
LAD
tLBKHOV3
—
2.3
ns
Local bus clock to LALE assertion
tLBKHOV4
—
2.3
ns
Output hold from local bus clock
(except LAD/LDP and LALE)
tLBKHOX1
0.7
—
ns
Output hold from local bus clock for
LAD/LDP
tLBKHOX2
0.7
—
ns
3
Local bus clock to output high
Impedance (except LAD/LDP and
LALE)
tLBKHOZ1
—
2.5
ns
5
Local bus clock to output high
impedance for LAD/LDP
tLBKHOZ2
—
2.5
ns
5
Notes
3
Note:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional
block)(signal)(state) (reference)(state) for inputs and t(First two letters of functional
block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing
(LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes
high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the
tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output
hold time.
2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL
bypass mode.
3. All signals are measured from OVDD/2 of the rising edge of LSYNC_IN for PLL enabled or
internal local bus clock for PLL bypass mode to 0.4 × OVDD of the signal in question for 3.3-V
signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when
the total current delivered through the component pin is less than or equal to the leakage
current specification.
6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any
change in LAD. tLBOTOT is programmed with the LBCR[AHD] parameter.
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew
measured between complementary signals at BVDD/2.
8. Guaranteed by design.
Figure 25 provides the AC test load for the local bus.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
46
Freescale Semiconductor
Local Bus
Z0 = 50 Ω
Output
OVDD/2
RL = 50 Ω
Figure 25. Local Bus AC Test Load
Figure 26 to Figure 31 show the local bus signals.
LSYNC_IN
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH2
tLBIVKH2
Input Signal:
LGTA
LUPWAIT
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKHOV1
tLBKHOZ1
tLBKHOX1
tLBKHOV2
tLBKHOZ2
tLBKHOX2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKHOV3
tLBKHOZ2
tLBKHOX2
Output (Address) Signal:
LAD[0:31]
tLBOTOT
tLBKHOV4
LALE
Figure 26. Local Bus Signals (PLL Enabled)
NOTE
PLL bypass mode is recommended when LBIU frequency is at or below
83 MHz. When LBIU operates above 83 Mhz, LBIU PLL is recommended
to be enabled.
Table 42 describes the general timing parameters of the local bus interface at OVDD = 3.3 V with PLL
bypassed.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
47
Local Bus
Table 42. Local Bus Timing Parameters—PLL Bypassed
Symbol 1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
12
—
ns
2
Local bus duty cycle
tLBKH/tLBK
45
55
%
Internal launch/capture clock to LCLK delay
tLBKHKT
2.3
3.9
ns
8
Input setup to local bus clock (except
LGTA/LUPWAIT)
tLBIVKH1
5.7
—
ns
4, 5
LGTA/LUPWAIT input setup to local bus
clock
tLBIVKL2
5.6
—
ns
4, 5
Input hold from local bus clock (except
LGTA/LUPWAIT)
tLBIXKH1
-1.8
—
ns
4, 5
LGTA/LUPWAIT input hold from local bus
clock
tLBIXKL2
-1.3
—
ns
4, 5
LALE output transition to LAD/LDP output
transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except
LAD/LDP and LALE)
tLBKLOV1
—
-0.3
ns
Local bus clock to data valid for LAD/LDP
tLBKLOV2
—
-0.1
ns
4
Local bus clock to address valid for LAD
tLBKLOV3
—
0
ns
4
Local bus clock to LALE assertion
tLBKLOV4
—
0
ns
4
Output hold from local bus clock (except
LAD/LDP and LALE)
tLBKLOX1
-3.2
—
ns
4
Output hold from local bus clock for
LAD/LDP
tLBKLOX2
-3.2
—
ns
4
Local bus clock to output high Impedance
(except LAD/LDP and LALE)
tLBKLOZ1
—
0.2
ns
7
Parameter
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
48
Freescale Semiconductor
Local Bus
Table 42. Local Bus Timing Parameters—PLL Bypassed (continued)
Parameter
Symbol 1
Min
Max
Unit
Notes
Local bus clock to output high impedance for
LAD/LDP
tLBKLOZ2
—
0.2
ns
7
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case
for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect
to the output (O) going invalid (X) or output hold time.
2. All timings are in reference to local bus clock for PLL bypass mode. Timings may be negative with respect to the local bus
clock because the actual launch and capture of signals is done with the internal launch/capture clock, which precedes LCLK
by tLBKHKT.
3. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
4. All signals are measured from BVDD/2 of the rising edge of local bus clock for PLL bypass mode to 0.4 x BVDD of the signal
in question for 3.3-V signaling levels.
5. Input timings are measured at the pin.
6. The value of tLBOTOT is the measurement of the minimum time between the negation of LALE and any change in LAD
7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
8. Guaranteed by characterization.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
49
Local Bus
Internal launch/capture clock
tLBKHKT
LCLK[n]
tLBIVKH1
tLBIXKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIVKL2
Input Signal:
LGTA
tLBIXKL2
LUPWAIT
tLBKLOV1
tLBKLOX1
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKLOZ1
tLBKLOZ2
tLBKLOV2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKLOX2
tLBKLOV3
Output (Address) Signal:
LAD[0:31]
tLBKLOV4
tLBOTOT
LALE
Figure 27. Local Bus Signals (PLL Bypass Mode)
NOTE
In PLL bypass mode, LCLK[n] is the inverted version of the internal clock
with the delay of tLBKHKT. In this mode, signals are launched at the rising edge
of the internal clock and are captured at falling edge of the internal clock,
with the exception of the LGTA/LUPWAIT signal, which is captured at the
rising edge of the internal clock.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
50
Freescale Semiconductor
Local Bus
LSYNC_IN
T1
T3
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKHOV1
tLBKHOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 28. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2 (clock ratio of 4) (PLL Enabled)
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
51
Local Bus
Internal launch/capture clock
T1
T3
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 29. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2 (clock ratio of 4)
(PLL Bypass Mode)
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
52
Freescale Semiconductor
Local Bus
LSYNC_IN
T1
T2
T3
T4
tLBKHOV1
tLBKHOZ1
GPCM Mode Output Signals:
LCS[0:7]/LWE
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 30. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4 or 8 (clock ratio of 8 or 16)
(PLL Enabled)
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
53
JTAG
Internal launch/capture clock
T1
T2
T3
T4
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 31. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4 or 8 (clock ratio of 8 or 16)
(PLL Bypass Mode)
11 JTAG
This section describes the DC and AC electrical specifications for the IEEE 1149.1 (JTAG) interface of
the MPC8641/D.
11.1
JTAG DC Electrical Characteristics
Table 43 provides the DC electrical characteristics for the JTAG interface.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
54
Freescale Semiconductor
JTAG
Table 43. JTAG DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
– 0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = VDD)
IIN
—
±5
μA
High-level output voltage
(OVDD = min, IOH = –100 μA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 100 μA)
VOL
—
0.2
V
Note:
1. Note that the symbol V IN, in this case, represents the OVIN symbol referenced in Table 1
and Table 2.
11.2
JTAG AC Electrical Specifications
Table 44 provides the JTAG AC timing specifications as defined in Figure 33 through Figure 35.
Table 44. JTAG AC Timing Specifications (Independent of SYSCLK) 1
At recommended operating conditions (see Table 3).
Symbol 2
Min
Max
Unit
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
JTAG external clock cycle time
t JTG
30
—
ns
tJTKHKL
15
—
ns
tJTGR & tJTGF
0
2
ns
6
tTRST
25
—
ns
3
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
0
—
—
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
20
25
—
—
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
4
4
20
25
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
30
30
—
—
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
3
3
19
9
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
Notes
ns
Input setup times:
Input hold times:
4
ns
Valid times:
4
ns
Output hold times:
5
ns
5, 6
ns
5, 6
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
55
JTAG
Table 44. JTAG AC Timing Specifications (Independent of SYSCLK) 1 (continued)
At recommended operating conditions (see Table 3).
Parameter
Symbol 2
Min
Max
Unit
Notes
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal
in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load
(see Figure 32). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state
(V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG
timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K)
going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For rise and fall times, the latter convention is used with the
appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
56
Freescale Semiconductor
JTAG
Figure 32 provides the AC test load for TDO and the boundary-scan outputs.
Z0 = 50 Ω
Output
R L = 50 Ω
OVDD/2
Figure 32. AC Test Load for the JTAG Interface
Figure 33 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTGF
tJTG
VM = Midpoint Voltage (OVDD/2)
Figure 33. JTAG Clock Input Timing Diagram
Figure 34 provides the TRST timing diagram.
VM
TRST
VM
tTRST
VM = Midpoint Voltage (OVDD /2)
Figure 34. TRST Timing Diagram
Figure 35 provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (OV DD/2)
Figure 35. Boundary-Scan Timing Diagram
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
57
I2C
12 I2C
This section describes the DC and AC electrical characteristics for the I2C interfaces of the MPC8641.
12.1
I2C DC Electrical Characteristics
Table 45 provides the DC electrical characteristics for the I2C interfaces.
Table 45. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter
Symbol
Min
Max
Unit
Input high voltage level
VIH
0.7 × OV DD
OVDD + 0.3
V
Input low voltage level
VIL
–0.3
0.3 × OV DD
V
Low level output voltage
VOL
0
0.2 × OV DD
V
1
tI2KHKL
0
50
ns
2
Input current each I/O pin (input voltage is
between 0.1 × OVDD and 0.9 × OVDD(max)
II
–10
10
μA
3
Capacitance for each I/O pin
CI
—
10
pF
Pulse width of spikes which must be suppressed
by the input filter
Notes
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. Refer to the MPC8641 Integrated Host Processor Reference Manual for information on the digital filter used.
3. I/O pins will obstruct the SDA and SCL lines if OVDD is switched off.
12.2
I2C AC Electrical Specifications
Table 46 provides the AC timing parameters for the I2C interfaces.
Table 46. I2C AC Electrical Specifications
All values refer to VIH (min) and VIL (max) levels (see Table 45).
Symbol 1
Min
Max
Unit
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL 4
1.3
—
μs
High period of the SCL clock
tI2CH 4
0.6
—
μs
Setup time for a repeated START condition
tI2SVKH 4
0.6
—
μs
Hold time (repeated) START condition (after this period, the
first clock pulse is generated)
tI2SXKL 4
0.6
—
μs
Data setup time
tI2DVKH 4
100
—
ns
—
02
—
—
μs
20 + 0.1 C B5
300
ns
Parameter
SCL clock frequency
Data input hold time:
tI2DXKL
CBUS compatible masters
I2C bus devices
Rise time of both SDA and SCL signals
tI2CR
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
58
Freescale Semiconductor
I2C
Table 46. I2C AC Electrical Specifications (continued)
All values refer to VIH (min) and VIL (max) levels (see Table 45).
Parameter
Symbol 1
Min
Max
Unit
tI2CF
20 + 0.1 Cb 5
300
ns
Fall time of both SDA and SCL signals
3
μs
Data output delay time
tI2OVKL
—
0.9
Set-up time for STOP condition
tI2PVKH
0.6
—
μs
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs
Noise margin at the LOW level for each connected device
(including hysteresis)
VNL
0.1 × OV DD
—
V
Noise margin at the HIGH level for each connected device
(including hysteresis)
VNH
0.2 × OV DD
—
V
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH
symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C
clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that
the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low
(L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop
condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup
time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. As a transmitter, the MPC8641 provides a delay time of at least 300 ns for the SDA signal (referred to the Vihmin of
the SCL signal) to bridge the undefined region of the falling edge of SCL to avoid unintended generation of Start or
Stop condition. When MPC8641 acts as the I2C bus master while transmitting, MPC8641 drives both SCL and SDA.
As long as the load on SCL and SDA are balanced, MPC8641 would not cause unintended generation of Start or
Stop condition. Therefore, the 300 ns SDA output delay time is not a concern. If, under some rare condition, the 300
ns SDA output delay time is required for MPC8641 as transmitter, the following setting is recommended for the FDR
bit field of the I2CFDR register to ensure both the desired I2C SCL clock frequency and SDA output delay time are
achieved, assuming that the desired I2C SCL clock frequency is 400 KHz and the Digital Filter Sampling Rate
Register (I2CDFSRR) is programmed with its default setting of 0x10 (decimal 16):
I2C Source Clock Frequency
333 MHz 266 MHz
200 MHz
133 MHz
FDR Bit Setting
0x2A
0x05
0x26
0x00
Actual FDR Divider Selected
896
704
512
384
378 KHz
390 KHz
346 KHz
Actual I2C SCL Frequency Generated 371 KHz
For the detail of I2C frequency calculation, refer to the application note AN2919 “Determining the I2C Frequency
Divider Ratio for SCL”. Note that the I2C Source Clock Frequency is half of the MPX clock frequency for MPC8641.
3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. Guaranteed by design.
5. CB = capacitance of one bus line in pF.
Figure 32 provides the AC test load for the I2C.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 36. I2C AC Test Load
Figure 37 shows the AC timing diagram for the I2C bus.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
59
High-Speed Serial Interfaces (HSSI)
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2SXKL
tI2CF
tI2CR
SCL
tI2SXKL
S
tI2CH
tI2DXKL
tI2SVKH
Sr
tI2PVKH
P
S
Figure 37. I2C Bus AC Timing Diagram
13 High-Speed Serial Interfaces (HSSI)
The MPC8641D features two Serializer/Deserializer (SerDes) interfaces to be used for high-speed serial
interconnect applications. The SerDes1 interface is dedicated for PCI Express data transfers. The SerDes2
can be used for PCI Express and/or Serial RapidIO data transfers.
This section describes the common portion of SerDes DC electrical specifications, which is the DC
requirement for SerDes Reference Clocks. The SerDes data lane’s transmitter and receiver reference
circuits are also shown.
13.1
Signal Terms Definition
The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms
used in the description and specification of differential signals.
Figure 38 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for
description. The figure shows waveform for either a transmitter output (SDn_TX and SDn_TX) or a
receiver input (SDn_RX and SDn_RX). Each signal swings between A Volts and B Volts where A > B.
Using this waveform, the definitions are as follows. To simplify illustration, the following definitions
assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling
environment.
1. Single-Ended Swing
The transmitter output signals and the receiver input signals SDn_TX, SDn_TX, SDn_RX and
SDn_RX each have a peak-to-peak swing of A - B Volts. This is also referred as each signal wire’s
Single-Ended Swing.
2. Differential Output Voltage, VOD (or Differential Output Swing):
The Differential Output Voltage (or Swing) of the transmitter, VOD, is defined as the difference of
the two complimentary output voltages: VSDn_TX - VSDn_TX. The VOD value can be either positive
or negative.
3. Differential Input Voltage, VID (or Differential Input Swing):
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
60
Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
4.
5.
6.
7.
The Differential Input Voltage (or Swing) of the receiver, VID, is defined as the difference of the
two complimentary input voltages: VSDn_RX - VSDn_RX. The VID value can be either positive or
negative.
Differential Peak Voltage, VDIFFp
The peak value of the differential transmitter output signal or the differential receiver input signal
is defined as Differential Peak Voltage, VDIFFp = |A - B| Volts.
Differential Peak-to-Peak, VDIFFp-p
Since the differential output signal of the transmitter and the differential input signal of the receiver
each range from A - B to -(A - B) Volts, the peak-to-peak value of the differential transmitter output
signal or the differential receiver input signal is defined as Differential Peak-to-Peak Voltage,
VDIFFp-p = 2*VDIFFp = 2 * |(A - B)| Volts, which is twice of differential swing in amplitude, or
twice of the differential peak. For example, the output differential peak-peak voltage can also be
calculated as VTX-DIFFp-p = 2*|VOD|.
Differential Waveform
The differential waveform is constructed by subtracting the inverting signal (SDn_TX, for
example) from the non-inverting signal (SDn_TX, for example) within a differential pair. There is
only one signal trace curve in a differential waveform. The voltage represented in the differential
waveform is not referenced to ground. Refer to Figure 47 as an example for differential waveform.
Common Mode Voltage, Vcm
The Common Mode Voltage is equal to one half of the sum of the voltages between each conductor
of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out =
(VSDn_TX + VSDn_TX)/2 = (A + B) / 2, which is the arithmetic mean of the two complimentary
output voltages within a differential pair. In a system, the common mode voltage may often differ
from one component’s output to the other’s input. Sometimes, it may be even different between the
receiver input and driver output circuits within the same component. It’s also referred as the DC
offset in some occasion.
SDn_TX or
SDn_RX
A Volts
Vcm = (A + B) / 2
SDn_TX or
SDn_RX
B Volts
Differential Swing, VID or VOD = A - B
Differential Peak Voltage, VDIFFp = |A - B|
Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)
Figure 38. Differential Voltage Definitions for Transmitter or Receiver
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
61
High-Speed Serial Interfaces (HSSI)
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5V and 2.0V. Using these values, the peak-to-peak voltage swing of each signal (TD
or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since
the differential signaling environment is fully symmetrical, the transmitter output’s differential swing
(VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges
between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other
phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p)
is 1000 mV p-p.
13.2
SerDes Reference Clocks
The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by
the corresponding SerDes lanes. The SerDes reference clocks inputs are SDn_REF_CLK and
SDn_REF_CLK for PCI Express and Serial RapidIO.
The following sections describe the SerDes reference clock requirements and some application
information.
13.2.1
SerDes Reference Clock Receiver Characteristics
Figure 39 shows a receiver reference diagram of the SerDes reference clocks.
• The supply voltage requirements for XVDD_SRDSn are specified in Table 1 and Table 2.
• SerDes Reference Clock Receiver Reference Circuit Structure
— The SDn_REF_CLK and SDn_REF_CLK are internally AC-coupled differential inputs as
shown in Figure 39. Each differential clock input (SDn_REF_CLK or SDn_REF_CLK) has a
50-Ω termination to SGND followed by on-chip AC-coupling.
— The external reference clock driver must be able to drive this termination.
— The SerDes reference clock input can be either differential or single-ended. Refer to the
Differential Mode and Single-ended Mode description below for further detailed requirements.
• The maximum average current requirement that also determines the common mode voltage range
— When the SerDes reference clock differential inputs are DC coupled externally with the clock
driver chip, the maximum average current allowed for each input pin is 8mA. In this case, the
exact common mode input voltage is not critical as long as it is within the range allowed by the
maximum average current of 8 mA (refer to the following bullet for more detail), since the
input is AC-coupled on-chip.
— This current limitation sets the maximum common mode input voltage to be less than 0.4V
(0.4V/50 = 8mA) while the minimum common mode input level is 0.1V above SGND. For
example, a clock with a 50/50 duty cycle can be produced by a clock driver with output driven
by its current source from 0mA to 16mA (0-0.8V), such that each phase of the differential input
has a single-ended swing from 0V to 800mV with the common mode voltage at 400mV.
— If the device driving the SDn_REF_CLK and SDn_REF_CLK inputs cannot drive 50 ohms to
SGND DC, or it exceeds the maximum input current limitations, then it must be AC-coupled
off-chip.
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Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
•
The input amplitude requirement
— This requirement is described in detail in the following sections.
50 Ω
SDn_REF_CLK
Input
Amp
SDn_REF_CLK
50 Ω
Figure 39. Receiver of SerDes Reference Clocks
13.2.2
DC Level Requirement for SerDes Reference Clocks
The DC level requirement for the MPC8641D SerDes reference clock inputs is different depending on the
signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described
below.
• Differential Mode
— The input amplitude of the differential clock must be between 400mV and 1600mV differential
peak-peak (or between 200mV and 800mV differential peak). In other words, each signal wire
of the differential pair must have a single-ended swing less than 800mV and greater than
200mV. This requirement is the same for both external DC-coupled or AC-coupled connection.
— For external DC-coupled connection, as described in section 13.2.1, the maximum average
current requirements sets the requirement for average voltage (common mode voltage) to be
between 100 mV and 400 mV. Figure 40 shows the SerDes reference clock input requirement
for DC-coupled connection scheme.
— For external AC-coupled connection, there is no common mode voltage requirement for the
clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver
and the SerDes reference clock receiver operate in different command mode voltages. The
SerDes reference clock receiver in this connection scheme has its common mode voltage set to
SGND. Each signal wire of the differential inputs is allowed to swing below and above the
command mode voltage (SGND). Figure 41 shows the SerDes reference clock input
requirement for AC-coupled connection scheme.
• Single-ended Mode
— The reference clock can also be single-ended. The SDn_REF_CLK input amplitude
(single-ended swing) must be between 400mV and 800mV peak-peak (from Vmin to Vmax)
with SDn_REF_CLK either left unconnected or tied to ground.
— The SDn_REF_CLK input average voltage must be between 200 and 400 mV. Figure 42 shows
the SerDes reference clock input requirement for single-ended signaling mode.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
63
High-Speed Serial Interfaces (HSSI)
— To meet the input amplitude requirement, the reference clock inputs might need to be DC or
AC-coupled externally. For the best noise performance, the reference of the clock could be DC
or AC-coupled into the unused phase (SDn_REF_CLK) through the same source impedance as
the clock input (SDn_REF_CLK) in use.
SDn_REF_CLK
200mV < Input Amplitude or Differential Peak < 800mV
Vmax < 800mV
100mV < Vcm < 400mV
Vmin > 0V
SDn_REF_CLK
Figure 40. Differential Reference Clock Input DC Requirements (External DC-Coupled)
200mV < Input Amplitude or Differential Peak < 800mV
SDn_REF_CLK
Vmax < Vcm + 400mV
Vcm
Vmin > Vcm − 400mV
SDn_REF_CLK
Figure 41. Differential Reference Clock Input DC Requirements (External AC-Coupled)
400mV < SDn_REF_CLK Input Amplitude < 800mV
SDn_REF_CLK
0V
SDn_REF_CLK
Figure 42. Single-Ended Reference Clock Input DC Requirements
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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High-Speed Serial Interfaces (HSSI)
13.2.3
•
•
•
Interfacing With Other Differential Signaling Levels
With on-chip termination to SGND, the differential reference clocks inputs are HCSL (High-Speed
Current Steering Logic) compatible DC-coupled.
Many other low voltage differential type outputs like LVDS (Low Voltage Differential Signaling)
can be used but may need to be AC-coupled due to the limited common mode input range allowed
(100 to 400 mV) for DC-coupled connection.
LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at
clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in
addition to AC-coupling.
NOTE
Figure 43 to Figure 46 below are for conceptual reference only. Due to the
fact that clock driver chip's internal structure, output impedance and
termination requirements are different between various clock driver chip
manufacturers, it’s very possible that the clock circuit reference designs
provided by clock driver chip vendor are different from what is shown
below. They might also vary from one vendor to the other. Therefore,
Freescale Semiconductor can neither provide the optimal clock driver
reference circuits, nor guarantee the correctness of the following clock
driver connection reference circuits. The system designer is recommended
to contact the selected clock driver chip vendor for the optimal reference
circuits with the MPC8641D SerDes reference clock receiver requirement
provided in this document.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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65
High-Speed Serial Interfaces (HSSI)
Figure 43 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It
assumes that the DC levels of the clock driver chip is compatible with MPC8641D SerDes reference clock
input’s DC requirement.
MPC8641D
HCSL CLK Driver Chip
CLK_Out
33 Ω
SDn_REF_CLK
50 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
Clock Driver
33 Ω
SDn_REF_CLK
CLK_Out
Total 50 Ω. Assume clock driver’s
output impedance is about 16 Ω.
50 Ω
Clock driver vendor dependent
source termination resistor
Figure 43. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only)
Figure 44 shows the SerDes reference clock connection reference circuits for LVDS type clock driver.
Since LVDS clock driver’s common mode voltage is higher than the MPC8641D SerDes reference clock
input’s allowed range (100 to 400mV), AC-coupled connection scheme must be used. It assumes the
LVDS output driver features 50-Ω termination resistor. It also assumes that the LVDS transmitter
establishes its own common mode level without relying on the receiver or other external component.
MPC8641D
LVDS CLK Driver Chip
CLK_Out
10 nF
50 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
Clock Driver
CLK_Out
SDn_REF_CLK
10 nF
SDn_REF_CLK
50 Ω
Figure 44. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only)
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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High-Speed Serial Interfaces (HSSI)
Figure 45 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver.
Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with
MPC8641D SerDes reference clock input’s DC requirement, AC-coupling has to be used. Figure 45
assumes that the LVPECL clock driver’s output impedance is 50Ω. R1 is used to DC-bias the LVPECL
outputs prior to AC-coupling. Its value could be ranged from 140Ω to 240Ω depending on clock driver
vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50-Ω termination
resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8641D SerDes
reference clock’s differential input amplitude requirement (between 200mV and 800mV differential
peak). For example, if the LVPECL output’s differential peak is 900mV and the desired SerDes reference
clock input amplitude is selected as 600mV, the attenuation factor is 0.67, which requires R2 = 25Ω. Please
consult clock driver chip manufacturer to verify whether this connection scheme is compatible with a
particular clock driver chip.
LVPECL CLK
Driver Chip
MPC8641D
CLK_Out
Clock Driver
R2
R1
10nF
SDn_REF_CLK
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
R2
10nF
SDn_REF_CLK
CLK_Out
R1
50 Ω
50 Ω
Figure 45. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only)
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
67
High-Speed Serial Interfaces (HSSI)
Figure 46 shows the SerDes reference clock connection reference circuits for a single-ended clock driver.
It assumes the DC levels of the clock driver are compatible with MPC8641D SerDes reference clock
input’s DC requirement.
Single-Ended
CLK Driver Chip
MPC8641D
Total 50 Ω. Assume clock driver’s
output impedance is about 16 Ω.
Clock Driver
CLK_Out
50 Ω
SDn_REF_CLK
33 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
50 Ω
SDn_REF_CLK
50 Ω
Figure 46. Single-Ended Connection (Reference Only)
13.2.4
AC Requirements for SerDes Reference Clocks
The clock driver selected should provide a high quality reference clock with low phase noise and
cycle-to-cycle jitter. Phase noise less than 100KHz can be tracked by the PLL and data recovery loops and
is less of a problem. Phase noise above 15MHz is filtered by the PLL. The most problematic phase noise
occurs in the 1-15MHz range. The source impedance of the clock driver should be 50 ohms to match the
transmission line and reduce reflections which are a source of noise to the system.
Table 47 describes some AC parameters common to PCI Express and Serial RapidIO protocols.
Table 47. SerDes Reference Clock Common AC Parameters
At recommended operating conditions with XVDD_SRDS1 or XVDD_SRDS2 = 1.1V ± 5% and 1.05V ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
Rising Edge Rate
Rise Edge Rate
1.0
4.0
V/ns
2, 3
Falling Edge Rate
Fall Edge Rate
1.0
4.0
V/ns
2, 3
Differential Input High Voltage
VIH
+200
mV
2
Differential Input Low Voltage
VIL
—
mV
2
-200
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Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
Table 47. SerDes Reference Clock Common AC Parameters (continued)
At recommended operating conditions with XVDD_SRDS1 or XVDD_SRDS2 = 1.1V ± 5% and 1.05V ± 5%.
Parameter
Rising edge rate (SDn_REF_CLK) to falling edge rate
(SD n_REF_CLK) matching
Symbol
Min
Max
Unit
Notes
Rise-Fall
Matching
—
20
%
1, 4
Notes:
1. Measurement taken from single ended waveform.
2. Measurement taken from differential waveform.
3. Measured from -200 mV to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK). The
signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is centered
on the differential zero crossing. See Figure 47.
4. Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a 200
mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The median cross
point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The Rise Edge Rate
of SD n_REF_CLK should be compared to the Fall Edge Rate of SDn_REF_CLK, the maximum allowed difference should not
exceed 20% of the slowest edge rate. See Figure 48.
VIH = +200 mV
0.0 V
VIL = -200 mV
SDn_REF_CLK
minus
SDn_REF_CLK
Figure 47. Differential Measurement Points for Rise and Fall Time
SDn_REF_CLK
SDn_REF_CLK
SDn_REF_CLK
SDn_REF_CLK
Figure 48. Single-Ended Measurement Points for Rise and Fall Time Matching
The other detailed AC requirements of the SerDes Reference Clocks is defined by each interface protocol
based on application usage. Refer to the following sections for detailed information:
• Section 14.2, “AC Requirements for PCI Express SerDes Clocks”
• Section 15.2, “AC Requirements for Serial RapidIO SDn_REF_CLK and SDn_REF_CLK
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
69
PCI Express
13.3
SerDes Transmitter and Receiver Reference Circuits
Figure 49 shows the reference circuits for SerDes data lane’s transmitter and receiver.
50 Ω
SD1_TX n or
SD2_TX n
SD1_RXn or
SD2_RXn
50 Ω
Transmitter
Receiver
50 Ω
SD1_TXn or
SD2_TXn
SD1_RXn or
SD2_RXn
50 Ω
Figure 49. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below
(PCI Express or Serial Rapid IO) in this document based on the application usage:”
• Section 14, “PCI Express”
• Section 15, “Serial RapidIO”
Note that external AC Coupling capacitor is required for the above two serial transmission protocols with
the capacitor value defined in specification of each protocol section.
14 PCI Express
This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8641.
14.1
DC Requirements for PCI Express SDn_REF_CLK and
SDn_REF_CLK
For more information, see Section 13.2, “SerDes Reference Clocks.”
14.2
AC Requirements for PCI Express SerDes Clocks
Table 48 lists AC requirements.
Table 48. SDn_REF_CLK and SDn_REF_CLK AC Requirements
Symbol
tREF
Parameter Description
REFCLK cycle time
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the period of any two
adjacent REFCLK cycles
tREFPJ
Phase jitter. Deviation in edge location with respect to mean
edge location
Min
Typical
Max
Units
Notes
-
10
-
ns
—
—
—
100
ps
—
–50
—
50
ps
—
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PCI Express
14.3
Clocking Dependencies
The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)
of each other at all times. This is specified to allow bit rate clock sources with a +/– 300 ppm tolerance.
14.4
Physical Layer Specifications
The following is a summary of the specifications for the physical layer of PCI Express on this device. For
further details as well as the specifications of the Transport and Data Link layer please use the PCI
EXPRESS Base Specification. REV. 1.0a document.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
71
PCI Express
14.4.1
Differential Transmitter (TX) Output
Table 49 defines the specifications for the differential output at all transmitters (TXs). The parameters are
specified at the component pins.
Table 49. Differential Transmitter (TX) Output Specifications
Symbol
Parameter
Min
Nom
Max
Units
Comments
399.88
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not account for
Spread Spectrum Clock dictated variations. See Note
1.
1.2
V
VTX-DIFFp-p = 2*|V TX-D+ - VTX-D-| See Note 2.
-4.0
dB
Ratio of the V TX-DIFFp-p of the second and following
bits after a transition divided by the VTX-DIFFp-p of the
first bit after a transition. See Note 2.
UI
The maximum Transmitter jitter can be derived as
TTX-MAX-JITTER = 1 - TTX-EYE= 0.3 UI.
See Notes 2 and 3.
UI
Jitter is defined as the measurement variation of the
crossing points (VTX-DIFFp-p = 0 V) in relation to a
recovered TX UI. A recovered TX UI is calculated over
3500 consecutive unit intervals of sample data. Jitter
is measured using all edges of the 250 consecutive UI
in the center of the 3500 UI used for calculating the TX
UI. See Notes 2 and 3.
UI
See Notes 2 and 5
20
mV
VTX-CM-ACp = RMS(|VTXD+ - VTXD-|/2 - V TX-CM-DC)
VTX-CM-DC = DC(avg) of |VTX-D+ - VTX-D-|/2
See Note 2
100
mV
|VTX-CM-DC (during LO) - VTX-CM-Idle-DC (During Electrical
mV
VTX-CM-DC = DC(avg) of |VTX-D+ - VTX-D-|/2 [LO]
VTX-CM-Idle-DC = DC (avg) of |VTX-D+ - VTX-D-|/2
[Electrical Idle]
See Note 2.
UI
Unit Interval
VTX-DIFFp-p
Differential
Peak-to-Peak
Output Voltage
0.8
VTX-DE-RATIO
De- Emphasized
Differential
Output Voltage
(Ratio)
-3.0
TTX-EYE
Minimum TX Eye
Width
0.70
TTX-EYE-MEDIAN-to-
Maximum time
between the jitter
median and
maximum
deviation from
the median.
MAX-JITTER
-3.5
0.15
TTX-RISE, TTX-FALL
D+/D- TX Output 0.125
Rise/Fall Time
VTX-CM-ACp
RMS AC Peak
Common Mode
Output Voltage
VTX-CM-DC-ACTIVE-
Absolute Delta of
DC Common
Mode Voltage
During LO and
Electrical Idle
0
VTX-CM-DC-LINE-DELTA Absolute Delta of
DC Common
Mode between
D+ and D–
0
25
mV
|VTX-CM-DC-D+ - VTX-CM-DC-D-| <= 25 mV
VTX-CM-DC-D+ = DC(avg) of |VTX-D+|
VTX-CM-DC-D- = DC(avg) of |VTX-D-|
See Note 2.
Electrical Idle
differential Peak
Output Voltage
0
20
mV
VTX-IDLE-DIFFp = |VTX-IDLE-D+ -VTX-IDLE-D-| <= 20 mV
See Note 2.
IDLE-DELTA
VTX-IDLE-DIFFp
Idle)|<=100
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PCI Express
Table 49. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Units
Comments
600
mV
The total amount of voltage change that a transmitter
can apply to sense whether a low impedance
Receiver is present. See Note 6.
3.6
V
The allowed DC Common Mode voltage under any
conditions. See Note 6.
90
mA
The total current the Transmitter can provide when
shorted to its ground
UI
Minimum time a Transmitter must be in Electrical Idle
Utilized by the Receiver to start looking for an
Electrical Idle Exit after successfully receiving an
Electrical Idle ordered set
VTX-RCV-DETECT
The amount of
voltage change
allowed during
Receiver
Detection
VTX-DC-CM
The TX DC
Common Mode
Voltage
ITX-SHORT
TX Short Circuit
Current Limit
TTX-IDLE-MIN
Minimum time
spent in
Electrical Idle
TTX-IDLE-SET-TO-IDLE
Maximum time to
transition to a
valid Electrical
idle after sending
an Electrical Idle
ordered set
20
UI
After sending an Electrical Idle ordered set, the
Transmitter must meet all Electrical Idle Specifications
within this time. This is considered a debounce time
for the Transmitter to meet Electrical Idle after
transitioning from LO.
TTX-IDLE-TO-DIFF-DATA Maximum time to
transition to valid
TX specifications
after leaving an
Electrical idle
condition
20
UI
Maximum time to meet all TX specifications when
transitioning from Electrical Idle to sending differential
data. This is considered a debounce time for the TX to
meet all TX specifications after leaving Electrical Idle
0
50
RLTX-DIFF
Differential
Return Loss
12
dB
Measured over 50 MHz to 1.25 GHz. See Note 4
RLTX-CM
Common Mode
Return Loss
6
dB
Measured over 50 MHz to 1.25 GHz. See Note 4
ZTX-DIFF-DC
DC Differential
TX Impedance
80
Ω
TX DC Differential mode Low Impedance
ZTX-DC
Transmitter DC
Impedance
40
Ω
Required TX D+ as well as D- DC Impedance during
all states
LTX-SKEW
Lane-to-Lane
Output Skew
500 +
2 UI
ps
Static skew between any two Transmitter Lanes within
a single Link
CTX
AC Coupling
Capacitor
200
nF
All Transmitters shall be AC coupled. The AC coupling
is required either within the media or within the
transmitting component itself.
75
100
120
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
73
PCI Express
Table 49. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Tcrosslink
Parameter
Crosslink
Random
Timeout
Min
0
Nom
Max
Units
Comments
1
ms
This random timeout helps resolve conflicts in
crosslink configuration by eventually resulting in only
one Downstream and one Upstream Port. See Note 7.
Notes:
1.) No test load is necessarily associated with this value.
2.) Specified at the measurement point into a timing and voltage compliance test load as shown in Figure 52 and measured over
any 250 consecutive TX UIs. (Also refer to the transmitter compliance eye diagram shown in Figure 50)
3.) A TTX-EYE = 0.70 UI provides for a total sum of deterministic and random jitter budget of TTX-JITTER-MAX = 0.30 UI for the
Transmitter collected over any 250 consecutive TX UIs. The TTX-EYE-MEDIAN-to-MAX-JITTER median is less than half of the total
TX jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean.
The jitter median describes the point in time where the number of jitter points on either side is approximately equal as opposed
to the averaged time value.
4.) The Transmitter input impedance shall result in a differential return loss greater than or equal to 12 dB and a common mode
return loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement
applies to all valid input levels. The reference impedance for return loss measurements is 50 ohms to ground for both the D+
and D- line (that is, as measured by a Vector Network Analyzer with 50 ohm probes—see Figure 52). Note that the series
capacitors CTX is optional for the return loss measurement.
5.) Measured between 20-80% at transmitter package pins into a test load as shown in Figure 52 for both VTX-D+ and VTX-D-.
6.) See Section 4.3.1.8 of the PCI Express Base Specifications Rev 1.0a
7.) See Section 4.2.6.3 of the PCI Express Base Specifications Rev 1.0a
14.4.2
Transmitter Compliance Eye Diagrams
The TX eye diagram in Figure 50 is specified using the passive compliance/test measurement load (see
Figure 52) in place of any real PCI Express interconnect + RX component.
There are two eye diagrams that must be met for the transmitter. Both eye diagrams must be aligned in
time using the jitter median to locate the center of the eye diagram. The different eye diagrams will differ
in voltage depending whether it is a transition bit or a de-emphasized bit. The exact reduced voltage level
of the de-emphasized bit will always be relative to the transition bit.
The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX
UI.
NOTE
It is recommended that the recovered TX UI is calculated using all edges in
the 3500 consecutive UI interval with a fit algorithm using a minimization
merit function (i.e., least squares and median deviation fits).
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
PCI Express
Figure 50. Minimum Transmitter Timing and Voltage Output Compliance Specifications
14.4.3
Differential Receiver (RX) Input Specifications
Table 50 defines the specifications for the differential input at all receivers (RXs). The parameters are
specified at the component pins.
Table 50. Differential Receiver (RX) Input Specifications
Symbol
Parameter
Min
Nom
Max
Units
Comments
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not
account for Spread Spectrum Clock dictated
variations. See Note 1.
1.200
V
VRX-DIFFp-p = 2*|VRX-D+ - VRX-D-|
See Note 2.
UI
The maximum interconnect media and
Transmitter jitter that can be tolerated by the
Receiver can be derived as TRX-MAX-JITTER =
1 - TRX-EYE= 0.6 UI.
See Notes 2 and 3.
UI
Unit Interval
399.8
8
VRX-DIFFp-p
Differential
Peak-to-Peak
Output Voltage
0.175
TRX-EYE
Minimum
Receiver Eye
Width
0.4
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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PCI Express
Table 50. Differential Receiver (RX) Input Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Units
Comments
TRX-EYE-MEDIAN-to-MAX Maximum time
between the jitter
median and
maximum
deviation from
the median.
0.3
UI
Jitter is defined as the measurement variation
of the crossing points (VRX-DIFFp-p = 0 V) in
relation to a recovered TX UI. A recovered TX
UI is calculated over 3500 consecutive unit
intervals of sample data. Jitter is measured
using all edges of the 250 consecutive UI in
the center of the 3500 UI used for calculating
the TX UI. See Notes 2, 3 and 7.
VRX-CM-ACp
AC Peak
Common Mode
Input Voltage
150
mV
VRX-CM-ACp = |VRXD+ - VRXD-|/2 - VRX-CM-DC
VRX-CM-DC = DC(avg) of |VRX-D+ - V RX-D-|/2
See Note 2
RLRX-DIFF
Differential
Return Loss
15
dB
Measured over 50 MHz to 1.25 GHz with the
D+ and D- lines biased at +300 mV and -300
mV, respectively.
See Note 4
RLRX-CM
Common Mode
Return Loss
6
dB
Measured over 50 MHz to 1.25 GHz with the
D+ and D- lines biased at 0 V. See Note 4
ZRX-DIFF-DC
DC Differential
Input Impedance
80
100
120
Ω
RX DC Differential mode impedance. See
Note 5
ZRX-DC
DC Input
Impedance
40
50
60
Ω
Required RX D+ as well as D- DC Impedance
(50 ± 20% tolerance). See Notes 2 and 5.
ZRX-HIGH-IMP-DC
Powered Down
DC Input
Impedance
Ω
Required RX D+ as well as D- DC Impedance
when the Receiver terminations do not have
power. See Note 6.
VRX-IDLE-DET-DIFFp-p
Electrical Idle
Detect Threshold
175
mV
VRX-IDLE-DET-DIFFp-p = 2*|VRX-D+ -VRX-D-|
Measured at the package pins of the Receiver
TRX-IDLE-DET-DIFF-
Unexpected
Electrical Idle
Enter Detect
Threshold
Integration Time
10
ms
An unexpected Electrical Idle (V RX-DIFFp-p <
VRX-IDLE-DET-DIFFp-p) must be recognized no
longer than TRX-IDLE-DET-DIFF-ENTERING to
signal an unexpected idle condition.
-JITTER
ENTERTIME
200 k
65
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PCI Express
Table 50. Differential Receiver (RX) Input Specifications (continued)
Symbol
LTX-SKEW
Parameter
Total Skew
Min
Nom
Max
Units
Comments
20
ns
Skew across all lanes on a Link. This includes
variation in the length of SKP ordered set
(e.g. COM and one to five Symbols) at the RX
as well as any delay differences arising from
the interconnect itself.
Notes:
1.) No test load is necessarily associated with this value.
2.) Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 52 should be used
as the RX device when taking measurements (also refer to the Receiver compliance eye diagram shown in Figure 51). If the
clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must
be used as a reference for the eye diagram.
3.) A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the Transmitter and
interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution in
which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over any
250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the point
in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value. If the
clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must
be used as the reference for the eye diagram.
4.) The Receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased
to 300 mV and the D- line biased to -300 mV and a common mode return loss greater than or equal to 6 dB (no bias required)
over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The
reference impedance for return loss measurements for is 50 ohms to ground for both the D+ and D- line (that is, as measured
by a Vector Network Analyzer with 50 ohm probes - see Figure 52). Note: that the series capacitors C TX is optional for the
return loss measurement.
5.) Impedance during all LTSSM states. When transitioning from a Fundamental Reset to Detect (the initial state of the LTSSM)
there is a 5 ms transition time before Receiver termination values must be met on all un-configured Lanes of a Port.
6.) The RX DC Common Mode Impedance that exists when no power is present or Fundamental Reset is asserted. This helps
ensure that the Receiver Detect circuit will not falsely assume a Receiver is powered on when it is not. This term must be
measured at 300 mV above the RX ground.
7.) It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm
using a minimization merit function. Least squares and median deviation fits have worked well with experimental and simulated
data.
14.5
Receiver Compliance Eye Diagrams
The RX eye diagram in Figure 51 is specified using the passive compliance/test measurement load (see
Figure 52) in place of any real PCI Express RX component.
Note: In general, the minimum Receiver eye diagram measured with the compliance/test measurement
load (see Figure 52) will be larger than the minimum Receiver eye diagram measured over a range of
systems at the input Receiver of any real PCI Express component. The degraded eye diagram at the input
Receiver is due to traces internal to the package as well as silicon parasitic characteristics which cause the
real PCI Express component to vary in impedance from the compliance/test measurement load. The input
Receiver eye diagram is implementation specific and is not specified. RX component designer should
provide additional margin to adequately compensate for the degraded minimum Receiver eye diagram
(shown in Figure 51) expected at the input Receiver based on some adequate combination of system
simulations and the Return Loss measured looking into the RX package and silicon. The RX eye diagram
must be aligned in time using the jitter median to locate the center of the eye diagram.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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PCI Express
The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX
UI.
NOTE
The reference impedance for return loss measurements is 50Ω to ground for
both the D+ and D- line (i.e., as measured by a Vector Network Analyzer
with 50Ω probes—see Figure 52). Note that the series capacitors, CTX, are
optional for the return loss measurement.
Figure 51. Minimum Receiver Eye Timing and Voltage Compliance Specification
14.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2
inches of the package pins, into a test/measurement load shown in Figure 52.
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Serial RapidIO
Figure 52. Compliance Test/Measurement Load
15 Serial RapidIO
This section describes the DC and AC electrical specifications for the RapidIO interface of the MPC8641,
for the LP-Serial physical layer. The electrical specifications cover both single and multiple-lane links.
Two transmitter types (short run and long run) on a single receiver are specified for each of three baud
rates, 1.25, 2.50, and 3.125 GBaud.
Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to
driving two connectors across a backplane. A single receiver specification is given that will accept signals
from both the short run and long run transmitter specifications.
The short run transmitter specifications should be used mainly for chip-to-chip connections on either the
same printed circuit board or across a single connector. This covers the case where connections are made
to a mezzanine (daughter) card. The minimum swings of the short run specification reduce the overall
power used by the transceivers.
The long run transmitter specifications use larger voltage swings that are capable of driving signals across
backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications
allow a distance of at least 50 cm at all baud rates.
All unit intervals are specified with a tolerance of +/– 100 ppm. The worst case frequency difference
between any transmit and receive clock will be 200 ppm.
To ensure interoperability between drivers and receivers of different vendors and technologies, AC
coupling at the receiver input must be used.
15.1
DC Requirements for Serial RapidIO SDn_REF_CLK and
SDn_REF_CLK
For more information, see Section 13.2, “SerDes Reference Clocks.”
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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79
Serial RapidIO
15.2
AC Requirements for Serial RapidIO SDn_REF_CLK and
SDn_REF_CLK
Table 51 lists AC requirements.
Table 51. SDn_REF_CLK and SDn_REF_CLK AC Requirements
Symbol
Parameter Description
Min
Typical Max Units
REFCLK cycle time
—
10(8)
—
ns
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the
period of any two adjacent REFCLK cycles
—
—
80
ps
tREFPJ
Phase jitter. Deviation in edge location with
respect to mean edge location
–40
—
40
ps
tREF
15.3
Comments
8 ns applies only to serial RapidIO
with 125-MHz reference clock
—
Signal Definitions
LP-Serial links use differential signaling. This section defines terms used in the description and
specification of differential signals. Figure 53 shows how the signals are defined. The figures show
waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each signal
swings between A Volts and B Volts where A > B. Using these waveforms, the definitions are as follows:
8. The transmitter output signals and the receiver input signals TD, TD, RD and RD each have a
peak-to-peak swing of A - B Volts
9. The differential output signal of the transmitter, VOD, is defined as VTD-VTD
10. The differential input signal of the receiver, VID, is defined as VRD-VRD
11. The differential output signal of the transmitter and the differential input signal of the receiver
each range from A - B to -(A - B) Volts
12. The peak value of the differential transmitter output signal and the differential receiver input
signal is A - B Volts
13. The peak-to-peak value of the differential transmitter output signal and the differential receiver
input signal is 2 * (A - B) Volts
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Serial RapidIO
TD or RD
A Volts
TD or RD
B Volts
Differential Peak-Peak = 2 * (A-B)
Figure 53. Differential Peak-Peak Voltage of Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5V and 2.0V. Using these values, the peak-to-peak voltage swing of the signals TD
and TD is 500 mV p-p. The differential output signal ranges between 500 mV and –500 mV. The peak
differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mV p-p.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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81
Serial RapidIO
15.4
Equalization
With the use of high speed serial links, the interconnect media will cause degradation of the signal at the
receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss
can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification.
To negate a portion of these effects, equalization can be used. The most common equalization techniques
that can be used are:
• A passive high pass filter network placed at the receiver. This is often referred to as passive
equalization.
• The use of active circuits in the receiver. This is often referred to as adaptive equalization.
15.5
Explanatory Note on Transmitter and Receiver Specifications
AC electrical specifications are given for transmitter and receiver. Long run and short run interfaces at
three baud rates (a total of six cases) are described.
The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified
in Clause 47 of IEEE 802.3ae-2002.
XAUI has similar application goals to serial RapidIO, as described in Section 8.1. The goal of this standard
is that electrical designs for serial RapidIO can reuse electrical designs for XAUI, suitably modified for
applications at the baud intervals and reaches described herein.
15.6
Transmitter Specifications
LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section.
The differential return loss, S11, of the transmitter in each case shall be better than
• –10 dB for (Baud Frequency)/10 < Freq(f) < 625 MHz, and
• –10 dB + 10log(f/625 MHz) dB for 625 MHz ≤ Freq(f) ≤ Baud Frequency
The reference impedance for the differential return loss measurements is 100 Ohm resistive. Differential
return loss includes contributions from on-chip circuitry, chip packaging and any off-chip components
related to the driver. The output impedance requirement applies to all valid output levels.
It is recommended that the 20%-80% rise/fall time of the transmitter, as measured at the transmitter output,
in each case have a minimum value 60 ps.
It is recommended that the timing skew at the output of an LP-Serial transmitter between the two signals
that comprise a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB and 15 ps at 3.125 GB.
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Serial RapidIO
Table 52. Short Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Multiple output skew
SMO
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
800
ps
+/- 100 ppm
800
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 53. Short Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Multiple Output skew
SMO
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
400
ps
+/- 100 ppm
400
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 54. Short Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Voltage relative to COMMON
of either signal comprising a
differential pair
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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83
Serial RapidIO
Table 54. Short Run Transmitter AC Timing Specifications—3.125 GBaud (continued)
Range
Characteristic
Symbol
Unit
Min
Multiple output skew
SMO
Unit Interval
UI
320
Notes
Max
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
320
ps
+/– 100 ppm
Table 55. Long Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Multiple output skew
SMO
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
800
ps
+/- 100 ppm
800
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 56. Long Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Multiple output skew
SMO
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
400
ps
+/- 100 ppm
400
Voltage relative to COMMON
of either signal comprising a
differential pair
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Serial RapidIO
Table 57. Long Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
-0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
Deterministic Jitter
JD
0.17
UI p-p
Total Jitter
JT
0.35
UI p-p
Multiple output skew
SMO
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
320
ps
+/- 100 ppm
320
Voltage relative to COMMON
of either signal comprising a
differential pair
Transmitter Differential Output Voltage
For each baud rate at which an LP-Serial transmitter is specified to operate, the output eye pattern of the
transmitter shall fall entirely within the unshaded portion of the Transmitter Output Compliance Mask
shown in Figure 54 with the parameters specified in Table 58 when measured at the output pins of the
device and the device is driving a 100 Ohm +/–5% differential resistive load. The output eye pattern of an
LP-Serial transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol
interference) need only comply with the Transmitter Output Compliance Mask when pre-emphasis is
disabled or minimized.
VDIFF max
VDIFF min
0
-VDIFF min
-VDIFF max
0
A
B
1-B
1-A
1
Time in UI
Figure 54. Transmitter Output Compliance Mask
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
85
Serial RapidIO
Table 58. Transmitter Differential Output Eye Diagram Parameters
VDIFFmin
(mV)
VDIFFmax
(mV)
A (UI)
B (UI)
1.25 GBaud short range
250
500
0.175
0.39
1.25 GBaud long range
400
800
0.175
0.39
2.5 GBaud short range
250
500
0.175
0.39
2.5 GBaud long range
400
800
0.175
0.39
3.125 GBaud short range
250
500
0.175
0.39
3.125 GBaud long range
400
800
0.175
0.39
Transmitter Type
15.7
Receiver Specifications
LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section.
Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode
return loss better than 6 dB from 100 MHz to (0.8)*(Baud Frequency). This includes contributions from
on-chip circuitry, the chip package and any off-chip components related to the receiver. AC coupling
components are included in this requirement. The reference impedance for return loss measurements is
100 Ohm resistive for differential return loss and 25 Ohm resistive for common mode.
Table 59. Receiver AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Differential Input Voltage
VIN
200
Deterministic Jitter Tolerance
JD
Combined Deterministic and Random
Jitter Tolerance
Notes
Max
mV p-p
Measured at receiver
0.37
UI p-p
Measured at receiver
JDR
0.55
UI p-p
Measured at receiver
Total Jitter Tolerance1
JT
0.65
UI p-p
Measured at receiver
Multiple Input Skew
SMI
24
ns
Skew at the receiver input
between lanes of a multilane
link
Bit Error Rate
BER
10–12
Unit Interval
UI
ps
+/– 100 ppm
800
1600
800
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 55. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Serial RapidIO
Table 60. Receiver AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Differential Input Voltage
VIN
200
Deterministic Jitter Tolerance
JD
Combined Deterministic and Random
Jitter Tolerance
Notes
Max
1600
mV p-p
Measured at receiver
0.37
UI p-p
Measured at receiver
JDR
0.55
UI p-p
Measured at receiver
Total Jitter Tolerance1
JT
0.65
UI p-p
Measured at receiver
Multiple Input Skew
SMI
24
ns
Skew at the receiver input
between lanes of a multilane
link
Bit Error Rate
BER
10–12
Unit Interval
UI
ps
+/– 100 ppm
400
400
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 55. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
Table 61. Receiver AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Differential Input Voltage
VIN
200
Deterministic Jitter Tolerance
JD
Combined Deterministic and Random
Jitter Tolerance
Notes
Max
mV p-p
Measured at receiver
0.37
UI p-p
Measured at receiver
JDR
0.55
UI p-p
Measured at receiver
Total Jitter Tolerance1
JT
0.65
UI p-p
Measured at receiver
Multiple Input Skew
SMI
22
ns
Skew at the receiver input
between lanes of a multilane
link
Bit Error Rate
BER
10-12
Unit Interval
UI
ps
+/- 100 ppm
320
1600
320
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 55. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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87
Serial RapidIO
8.5 UI p-p
Sinusoidal
Jitter
Amplitude
0.10 UI p-p
22.1 kHz
1.875 MHz
20 MHz
Frequency
Figure 55. Single Frequency Sinusoidal Jitter Limits
15.8
Receiver Eye Diagrams
For each baud rate at which an LP-Serial receiver is specified to operate, the receiver shall meet the
corresponding Bit Error Rate specification (Table 59, Table 60, Table 61) when the eye pattern of the
receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the Receiver
Input Compliance Mask shown in Figure 56 with the parameters specified in Table 62. The eye pattern of
the receiver test signal is measured at the input pins of the receiving device with the device replaced with
a 100 Ohm +/– 5% differential resistive load.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Serial RapidIO
Receiver Differential Input Voltage
VDIFF max
VDIFF min
0
-V DIFF min
-V DIFF max
A
0
B
1-B
1-A
1
Time (UI)
Figure 56. Receiver Input Compliance Mask
Table 62. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter
VDIFFmin
(mV)
VDIFFmax
(mV)
A (UI)
B (UI)
1.25 GBaud
100
800
0.275
0.400
2.5 GBaud
100
800
0.275
0.400
3.125 GBaud
100
800
0.275
0.400
Receiver Type
15.9
Measurement and Test Requirements
Since the LP-Serial electrical specification are guided by the XAUI electrical interface specified in Clause
47 of IEEE 802.3ae-2002, the measurement and test requirements defined here are similarly guided by
Clause 47. In addition, the CJPAT test pattern defined in Annex 48A of IEEE802.3ae-2002 is specified as
the test pattern for use in eye pattern and jitter measurements. Annex 48B of IEEE802.3ae-2002 is
recommended as a reference for additional information on jitter test methods.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
89
Serial RapidIO
15.9.1
Eye Template Measurements
For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point
at (Baud Frequency)/1667 is applied to the jitter. The data pattern for template measurements is the
Continuous Jitter Test Pattern (CJPAT) defined in Annex 48A of IEEE802.3ae. All lanes of the LP-Serial
link shall be active in both the transmit and receive directions, and opposite ends of the links shall use
asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane
implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The
amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10-12.
The eye pattern shall be measured with AC coupling and the compliance template centered at 0 Volts
differential. The left and right edges of the template shall be aligned with the mean zero crossing points of
the measured data eye. The load for this test shall be 100 Ohms resistive +/– 5% differential to 2.5 GHz.
15.9.2
Jitter Test Measurements
For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (Baud
Frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter
Test Pattern (CJPAT) pattern defined in Annex 48A of IEEE802.3ae. All lanes of the LP-Serial link shall
be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous
clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations
shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured
with AC coupling and at 0 Volts differential. Jitter measurement for the transmitter (or for calibration of a
jitter tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that
described in Annex 48B of IEEE802.3ae.
15.9.3
Transmit Jitter
Transmit jitter is measured at the driver output when terminated into a load of 100 Ohms resistive +/– 5%
differential to 2.5 GHz.
15.9.4
Jitter Tolerance
Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first
producing the sum of deterministic and random jitter defined in Section 8.6 and then adjusting the signal
amplitude until the data eye contacts the 6 points of the minimum eye opening of the receive template
shown in Figure 8-4 and Table 8-11. Note that for this to occur, the test signal must have vertical waveform
symmetry about the average value and have horizontal symmetry (including jitter) about the mean zero
crossing. Eye template measurement requirements are as defined above. Random jitter is calibrated using
a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade roll-off below this. The
required sinusoidal jitter specified in Section 8.6 is then added to the signal and the test load is replaced
by the receiver being tested.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Package
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8641
The package parameters are as provided in the following list. The package type is 33 mm x 33 mm, 1023
pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and
lead-free (FC-CBGA).
For all package types:
Die size
Package outline
Interconnects
Pitch
Total Capacitor count
12.1 mm x 14.7 mm
33 mm x 33 mm
1023
1 mm
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical2)
2.97 mm
2.47 mm
89.5% Pb 10.5% Sn
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical2)
1
2
2.77 mm
2.27 mm
95.5% Sn 4.0% Ag 0.5% Cu
0.60 mm
High-coefficient of thermal expansion
Typical ball diameter is before reflow
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
91
Package
16.2
Mechanical Dimensions of the MPC8641 FC-CBGA
The mechanical dimensions and bottom surface nomenclature of the MPC8641D (dual core) and
MPC8641 (single core) high-lead FC-CBGA (package option: HCTE HX) and lead-free FC-CBGA
(package option: HCTE VU) are shown respectfully in Figure 57 and Figure 58.
Figure 57. MPC8641D High-Head FC-CBGA Dimensions
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Package
1.
2.
3.
4.
5.
6.
7.
8.
NOTES for Figure 57
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or expose metal capacitor pads on package top.
All dimensions symmetrical about centerlines unless otherwise specified.
Note that for MPC8641 (single core) the solder balls for the following signals/pins are not populated in the
package: VDD_Core1 (R16, R18, R20, T17, T19, T21, T23, U16, U18, U22, V17, V19, V21, V23, W16,
W18, W20, W22, Y17, Y19, Y21, Y23, AA16, AA18, AA20, AA22, AB23, AC24) and SENSEVDD_Core1
(U20).
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
93
Package
Figure 58. MPC8641D Lead-Free FC-CBGA Dimensions
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
94
Freescale Semiconductor
Signal Listings
1.
2.
3.
4.
5.
6.
7.
8.
NOTES for Figure 58
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or expose metal capacitor pads on package top.
All dimensions symmetrical about centerlines unless otherwise specified.
Note that for MPC8641 (single core) the solder balls for the following signals/pins are not populated in the
package: VDD_Core1 (R16, R18, R20, T17, T19, T21, T23, U16, U18, U22, V17, V19, V21, V23, W16,
W18, W20, W22, Y17, Y19, Y21, Y23, AA16, AA18, AA20, AA22, AB23, AC24) and SENSEVDD_Core1
(U20).
17 Signal Listings
Table 63 provides the pin assignments for the signals. Notes for the signal changes on the single core
device (MPC8641) are italicized and prefixed by “S”.
Table 63. MPC8641 Signal Reference by Functional Block
Name1
Package Pin Number
Pin Type
Power Supply
Notes
DDR Memory Interface 1 Signals2,3
D1_MDQ[0:63]
D15, A14, B12, D12, A15, B15, B13, C13,
C11, D11, D9, A8, A12, A11, A9, B9, F11,
G12, K11, K12, E10, E9, J11, J10, G8, H10,
L9, L7, F10, G9, K9, K8, AC6, AC7, AG8,
AH9, AB6, AB8, AE9, AF9, AL8, AM8,
AM10, AK11, AH8, AK8, AJ10, AK10, AL12,
AJ12, AL14, AM14, AL11, AM11, AM13,
AK14, AM15, AJ16, AK18, AL18, AJ15,
AL15, AL17, AM17
I/O
D1_GVDD
D1_MECC[0:7]
M8, M7, R8, T10, L11, L10, P9, R10
I/O
D1_GVDD
D1_MDM[0:8]
C14, A10, G11, H9, AD7, AJ9, AM12, AK16,
N10
O
D1_GVDD
D1_MDQS[0:8]
A13, C10, H12, J7, AE8, AM9, AK13, AK17,
N9
I/O
D1_GVDD
D1_MDQS[0:8]
D14, B10, H13, J8, AD8, AL9, AJ13, AM16,
P10
I/O
D1_GVDD
D1_MBA[0:2]
AA8, AA10, T9
O
D1_GVDD
D1_MA[0:15]
Y10, W8, W9, V7, V8, U6, V10, U9, U7, U10,
Y9, T6, T8, AE12, R7, P6
O
D1_GVDD
D1_MWE
AB11
O
D1_GVDD
D1_MRAS
AB12
O
D1_GVDD
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
95
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
AC10
O
D1_GVDD
AB9, AD10, AC12, AD11
O
D1_GVDD
P7, M10, N8, M11
O
D1_GVDD
D1_MCK[0:5]
W6, E13, AH11, Y7, F14, AG10
O
D1_GVDD
D1_MCK[0:5]
Y6, E12, AH12, AA7, F13, AG11
O
D1_GVDD
D1_MODT[0:3]
AC9, AF12, AE11, AF10
O
D1_GVDD
D1_MDIC[0:1]
E15, G14
IO
D1_GVDD
27
DDR Port 1
reference
voltage
D1_GVDD /2
3
D1_MCAS
D1_MCS[0:3]
D1_MCKE[0:3]
D1_MVREF
AM18
Notes
23
DDR Memory Interface 2 Signals2,3
D2_MDQ[0:63]
A7, B7, C5, D5, C8, D8, D6, A5, C4, A3, D3,
D2, A4, B4, C2, C1, E3, E1, H4, G1, D1, E4,
G3, G2, J4, J2, L1, L3, H3, H1, K1, L4, AA4,
AA2, AD1, AD2, Y1, AA1, AC1, AC3, AD5,
AE1, AG1, AG2, AC4, AD4, AF3, AF4, AH3,
AJ1, AM1, AM3, AH1, AH2, AL2, AL3, AK5,
AL5, AK7, AM7, AK4, AM4, AM6, AJ7
I/O
D2_GVDD
D2_MECC[0:7]
H6, J5, M5, M4, G6, H7, M2, M1
I/O
D2_GVDD
D2_MDM[0:8]
C7, B3, F4, J1, AB1, AE2, AK1, AM5, K6
O
D2_GVDD
D2_MDQS[0:8]
B6, B1, F1, K2, AB3, AF1, AL1, AL6, L6
I/O
D2_GVDD
D2_MDQS[0:8]
A6, A2, F2, K3, AB2, AE3, AK2, AJ6, K5
I/O
D2_GVDD
D2_MBA[0:2]
W5, V5, P3
O
D2_GVDD
D2_MA[0:15]
W1, U4, U3, T1, T2, T3, T5, R2, R1, R5, V4,
R4, P1, AH5, P4, N1
O
D2_GVDD
D2_MWE
Y4
O
D2_GVDD
D2_MRAS
W3
O
D2_GVDD
D2_MCAS
AB5
O
D2_GVDD
Y3, AF6, AA5, AF7
O
D2_GVDD
N6, N5, N2, N3
O
D2_GVDD
U1, F5, AJ3, V2, E7, AG4
O
D2_GVDD
D2_MCS[0:3]
D2_MCKE[0:3]
D2_MCK[0:5]
23
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
96
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
V1, G5, AJ4, W2, E6, AG5
O
D2_GVDD
D2_MODT[0:3]
AE6, AG7, AE5, AH6
O
D2_GVDD
D2_MDIC[0:1]
F8, F7
IO
D2_GVDD
27
DDR Port 2
reference
voltage
D2_GVDD /2
3
D2_MCK[0:5]
D2_MVREF
A18
Notes
High Speed I/O Interface 1 (SERDES 1)4
SD1_TX[0:7]
L26, M24, N26, P24, R26, T24, U26, V24
O
SVDD
SD1_TX[0:7]
L27, M25, N27, P25, R27, T25, U27, V25
O
SVDD
SD1_RX[0:7]
J32, K30, L32, M30, T30, U32, V30, W32
I
SVDD
SD1_RX[0:7]
J31, K29, L31, M29, T29, U31, V29, W31
I
SVDD
SD1_REF_CLK
N32
I
SVDD
SD1_REF_CLK
N31
I
SVDD
SD1_IMP_CAL_TX
Y26
Analog
SVDD
19
SD1_IMP_CAL_RX
J28
Analog
SVDD
30
SD1_PLL_TPD
U28
O
SVDD
13, 17
SD1_PLL_TPA
T28
Analog
SVDD
13, 18
SD1_DLL_TPD
N28
O
SVDD
13, 17
SD1_DLL_TPA
P31
Analog
SVDD
13, 18
High Speed I/O Interface 2 (SERDES
2)4
SD2_TX[0:3]
Y24, AA27, AB25, AC27
O
SVDD
SD2_TX[4:7]
AE27, AG27, AJ27, AL27
O
SVDD
SD2_TX[0:3]
Y25, AA28, AB26, AC28
O
SVDD
SD2_TX[4:7]
AE28, AG28, AJ28, AL28
O
SVDD
34
SD2_RX[0:3]
Y30, AA32, AB30, AC32
I
SVDD
32
SD2_RX[4:7]
AH30, AJ32, AK30, AL32
I
SVDD
32, 35
SD2_RX[0:3]
Y29, AA31, AB29, AC31
I
SVDD
SD2_RX[4:7]
AH29, AJ31, AK29, AL31
I
SVDD
AE32
I
SVDD
SD2_REF_CLK
34
35
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
97
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
SD2_REF_CLK
AE31
I
SVDD
SD2_IMP_CAL_TX
AM29
Analog
SVDD
19
SD2_IMP_CAL_RX
AA26
Analog
SVDD
30
SD2_PLL_TPD
AF29
O
SVDD
13, 17
SD2_PLL_TPA
AF31
Analog
SVDD
13, 18
SD2_DLL_TPD
AD29
O
SVDD
13, 17
SD2_DLL_TPA
AD30
Analog
SVDD
13, 18
Special Connection Requirement pins
No Connects
K24, K25, P28, P29, W26, W27, AD25,
AD26
-
-
13
Reserved
H30, R32, V28, AG32
-
-
14
Reserved
H29, R31, W28, AG31
-
-
15
Reserved
AD24, AG26
-
-
16
Ethernet Miscellaneous
Signals5
EC1_GTX_CLK125
AL23
I
LVDD
39
EC2_GTX_CLK125
AM23
I
TVDD
39
EC_MDC
G31
O
OVDD
EC_MDIO
G32
I/O
OVDD
AF25, AC23,AG24, AG23, AE24, AE23,
AE22, AD22
O
LVDD
6, 10
TSEC1_TX_EN
AB22
O
LVDD
36
TSEC1_TX_ER
AH26
O
LVDD
TSEC1_TX_CLK
AC22
I
LVDD
40
TSEC1_GTX_CLK
AH25
O
LVDD
41
TSEC1_CRS
AM24
I/O
LVDD
37
TSEC1_COL
AM25
I
LVDD
AL25, AL24, AK26, AK25, AM26, AF26,
AH24, AG25
I
LVDD
TSEC1_RX_DV
AJ24
I
LVDD
TSEC1_RX_ER
AJ25
I
LVDD
TSEC1_RX_CLK
AK24
I
LVDD
eTSEC Port 1 Signals5
TSEC1_TXD[0:7]/
GPOUT[0:7]
TSEC1_RXD[0:7]/
GPIN[0:7]
10
40
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
98
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
AB20, AJ23, AJ22, AD19
O
LVDD
6, 10
AH23
O
LVDD
6,10, 38
AH21, AG22, AG21
O
LVDD
6, 10
TSEC2_TX_EN
AB21
O
LVDD
36
TSEC2_TX_ER
AB19
O
LVDD
6, 38
TSEC2_TX_CLK
AC21
I
LVDD
40
TSEC2_GTX_CLK
AD20
O
LVDD
41
TSEC2_CRS
AE20
I/O
LVDD
37
TSEC2_COL
AE21
I
LVDD
AL22, AK22, AM21, AH20, AG20, AF20,
AF23, AF22
I
LVDD
TSEC2_RX_DV
AC19
I
LVDD
TSEC2_RX_ER
AD21
I
LVDD
TSEC2_RX_CLK
AM22
I
LVDD
40
6
eTSEC Port 2 Signals5
TSEC2_TXD[0:3]/
GPOUT[8:15]
TSEC2_TXD[4]/
GPOUT[12]
TSEC2_TXD[5:7]/
GPOUT[13:15]
TSEC2_RXD[0:7]/
GPIN[8:15]
10
eTSEC Port 3 Signals5
TSEC3_TXD[0:3]
AL21, AJ21, AM20, AJ20
O
TVDD
TSEC3_TXD[4]/
AM19
O
TVDD
TSEC3_TXD[5:7]
AK21, AL20, AL19
O
TVDD
6
AH19
O
TVDD
36
TSEC3_TX_EN
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
99
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
TSEC3_TX_ER
AH17
O
TVDD
TSEC3_TX_CLK
AH18
I
TVDD
40
TSEC3_GTX_CLK
AG19
O
TVDD
41
TSEC3_CRS
AE15
I/O
TVDD
37
TSEC3_COL
AF15
I
TVDD
AJ17, AE16, AH16, AH14, AJ19, AH15,
AG16, AE19
I
TVDD
TSEC3_RX_DV
AG15
I
TVDD
TSEC3_RX_ER
AF16
I
TVDD
TSEC3_RX_CLK
AJ18
I
TVDD
40
AC18, AC16, AD18, AD17
O
TVDD
6
AD16
O
TVDD
25
AB18, AB17, AB16
O
TVDD
6
TSEC4_TX_EN
AF17
O
TVDD
36
TSEC4_TX_ER
AF19
O
TVDD
TSEC4_TX_CLK
AF18
I
TVDD
40
TSEC4_GTX_CLK
AG17
O
TVDD
41
TSEC4_CRS
AB14
I/O
TVDD
37
TSEC4_COL
AC13
I
TVDD
AG14, AD13, AF13, AD14, AE14, AB15,
AC14, AE17
I
TVDD
TSEC4_RX_DV
AC15
I
TVDD
TSEC4_RX_ER
AF14
I
TVDD
TSEC3_RXD[0:7]
eTSEC Port 4 Signals5
TSEC4_TXD[0:3]
TSEC4_TXD[4]
TSEC4_TXD[5:7]
TSEC4_RXD[0:7]
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
100
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
TSEC4_RX_CLK
AG13
Pin Type
Power Supply
Notes
I
TVDD
40
Local Bus Signals5
LAD[0:31]
A30, E29, C29, D28, D29, H25, B29, A29,
C28, L22, M22, A28, C27, H26, G26, B27,
B26, A27, E27, G25, D26, E26, G24, F27,
A26, A25, C25, H23, K22, D25, F25, H22
I/O
OVDD
6
LDP[0:3]
A24, E24, C24, B24
I/O
OVDD
6, 22
LA[27:31]
J21, K21, G22, F24, G21
O
OVDD
6, 22
LCS[0:4]
A22, C22, D23, E22, A23
O
OVDD
7
LCS[5]/DMA_DREQ[2]
B23
O
OVDD
7, 9, 10
LCS[6]/DMA_DACK[2]
E23
O
OVDD
7, 10
LCS[7]/DMA_DDONE[2] F23
O
OVDD
7, 10
E21, F21, D22, E20
O
OVDD
6
LBCTL
D21
O
OVDD
LALE
E19
O
OVDD
LGPL0/LSDA10
F20
O
OVDD
25
LGPL1/LSDWE
H20
O
OVDD
25
LGPL2/LOE/
LSDRAS
J20
O
OVDD
LGPL3/LSDCAS
K20
O
OVDD
6
LGPL4/LGTA/
LUPWAIT/LPBSE
L21
I/O
OVDD
42
LGPL5
J19
O
OVDD
6
LCKE
H19
O
OVDD
LCLK[0:2]
G19, L19, M20
O
OVDD
LSYNC_IN
M19
I
OVDD
LSYNC_OUT
D20
O
OVDD
LWE[0:3]/
LSDDQM[0:3]/
LBS[0:3]
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
101
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
E31, E32
I
OVDD
DMA_DREQ[2]/LCS[5]
B23
I
OVDD
9, 10
DMA_DREQ[3]/IRQ[9]
B30
I
OVDD
10
D32, F30
O
OVDD
DMA_DACK[2]/LCS[6]
E23
O
OVDD
10
DMA_DACK[3]/IRQ[10]
C30
O
OVDD
9, 10
F31, F32
O
OVDD
DMA_DDONE[2]/LCS[7] F23
O
OVDD
10
DMA_DDONE[3]/IRQ[11] D30
O
OVDD
9, 10
DMA Signals5
DMA_DREQ[0:1]
DMA_DACK[0:1]
DMA_DDONE[0:1]
Programmable Interrupt Controller Signals 5
MCP_0
F17
I
OVDD
MCP _1
H17
I
OVDD
IRQ[0:8]
G28, G29, H27, J23, M23, J27, F28, J24,
L23
I
OVDD
IRQ[9]/DMA_DREQ[3]
B30
I
OVDD
10
IRQ[10]/DMA_DACK[3]
C30
I
OVDD
9, 10
IRQ[11]/DMA_DDONE[3] D30
I
OVDD
9, 10
J26
O
OVDD
7, 11
IRQ_OUT
12, S4
DUART Signals5
UART_SIN[0:1]
B32, C32
I
OVDD
UART_SOUT[0:1]
D31, A32
O
OVDD
UART_CTS[0:1]
A31, B31
I
OVDD
UART_RTS[0:1]
C31, E30
O
OVDD
I2C Signals
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
102
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
IIC1_SDA
A16
I/O
OVDD
7, 11
IIC1_SCL
B17
I/O
OVDD
7, 11
IIC2_SDA
A21
I/O
OVDD
7, 11
IIC2_SCL
B21
I/O
OVDD
7, 11
System Control Signals5
HRESET
B18
I
OVDD
HRESET_REQ
K18
O
OVDD
SMI_0
L15
I
OVDD
SMI_1
L16
I
OVDD
SRESET_0
C20
I
OVDD
SRESET_1
C21
I
OVDD
CKSTP_IN
L18
I
OVDD
CKSTP_OUT
L17
O
OVDD
7, 11
READY/TRIG_OUT
J13
O
OVDD
10, 25
12, S4
12, S4
Debug Signals5
TRIG_IN
J14
I
OVDD
TRIG_OUT/READY
J13
O
OVDD
10, 25
F15, K15
O
OVDD
6, 10
K14
O
OVDD
10, 25
D1_MSRCID[3:4]/
LB_SRCID[3:4]
H15, G15
O
OVDD
10
D2_MSRCID[0:4]
E16, C17, F16, H16, K16
O
OVDD
D1_MDVAL/LB_DVAL
J16
O
OVDD
D2_MDVAL
D19
O
OVDD
O
OVDD
D1_MSRCID[0:1]/
LB_SRCID[0:1]
D1_MSRCID[2]/
LB_SRCID[2]
10
Power Management Signals5
ASLEEP
C19
System Clocking
Signals5
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
103
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
SYSCLK
G16
I
OVDD
RTC
K17
I
OVDD
32
CLK_OUT
B16
O
OVDD
23
I
OVDD
26
I
OVDD
26
Test Signals5
LSSD_MODE
TEST_MODE[0:3]
C18
C16, E17, D18, D16
JTAG
Signals5
TCK
H18
I
OVDD
TDI
J18
I
OVDD
24
TDO
G18
O
OVDD
23
TMS
F18
I
OVDD
24
TRST
A17
I
OVDD
24
J17
-
-
13
GPOUT[0:7]/
TSEC1_TXD[0:7]
AF25, AC23, AG24, AG23, AE24, AE23,
AE22, AD22
O
OVDD
6, 10
GPIN[0:7]/
TSEC1_RXD[0:7]
AL25, AL24, AK26, AK25, AM26, AF26,
AH24, AG25
I
OVDD
10
GPOUT[8:15]/
TSEC2_TXD[0:7]
AB20, AJ23, AJ22, AD19, AH23, AH21,
AG22, AG21
O
OVDD
10
GPIN[8:15]/
TSEC2_RXD[0:7]
AL22, AK22, AM21, AH20, AG20, AF20,
AF23, AF22
I
OVDD
10
AA11
Thermal
-
Y11
Thermal
-
Miscellaneous5
Spare
Additional Analog Signals
TEMP_ANODE
TEMP_CATHODE
Sense, Power and GND Signals
SENSEVDD_Core0
M14
VDD_Core0
sensing pin
31
SENSEVDD_Core1
U20
VDD_Core1
sensing pin
12,31, S1
SENSEVSS_Core0
P14
Core0 GND
sensing pin
31
SENSEVSS_Core1
V20
Core1 GND
sensing pin
12, 31, S3
SENSEVDD_PLAT
N18
VDD_PLAT
sensing pin
28
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
104
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
SENSEVSS_PLAT
P18
Pin Type
Power Supply
Platform GND
sensing pin
29
D1_GVDD
B11, B14, D10, D13, F9, F12, H8, H11,
H14, K10, K13, L8, P8, R6, U8, V6, W10,
Y8, AA6, AB10, AC8, AD12, AE10, AF8,
AG12, AH10, AJ8, AJ14, AK12, AL10, AL16
SDRAM 1 I/O
supply
D1_GVDD
2.5 - DDR
1.8 DDR2
D2_GVDD
B2, B5, B8, D4, D7, E2, F6, G4, H2, J6, K4,
L2, M6, N4, P2, T4, U2, W4, Y2, AB4, AC2,
AD6, AE4, AF2, AG6, AH4, AJ2, AK6, AL4,
AM2
SDRAM 2 I/O
supply
D2_GVDD
2.5 V - DDR
1.8 V - DDR2
OVDD
B22, B25, B28, D17, D24, D27, F19, F22,
F26, F29, G17, H21, H24, K19, K23, M21,
AM30
DUART, Local
Bus, DMA,
Multiprocessor
Interrupts,
System Control
& Clocking,
Debug, Test,
JTAG, Power
management,
I2C, JTAG and
Miscellaneous
I/O voltage
OVDD
3.3 V
LVDD
AC20, AD23, AH22
TSEC1 and
TSEC2 I/O
voltage
LVDD
2.5/3.3 V
TVDD
AC17, AG18, AK20
TSEC3 and
TSEC4 I/O
voltage
TVDD
2.5/3.3 V
SVDD
H31, J29, K28, K32, L30, M28, M31, N29,
R30, T31, U29, V32, W30, Y31, AA29,
AB32, AC30, AD31, AE29, AG30, AH31,
AJ29, AK32, AL30, AM31
Transceiver
Power Supply
SerDes
K26, L24, M27, N25, P26, R24, R28, T27,
U25, V26
Serial I/O
Power Supply
for SerDes
Port 1
XVDD_SRDS1
Serial I/O
Power Supply
for SerDes
Port 2
XVDD_SRDS2
Core 0 voltage
supply
VDD_Core0
XVDD_SRDS1
XVDD_SRDS2
VDD_Core0
AA25, AB28, AC26, AD27, AE25, AF28,
AH27, AK28, AM27, W24, Y27
L12, L13, L14, M13, M15, N12, N14, P11,
P13, P15, R12, R14, T11, T13, T15, U12,
U14, V11, V13, V15, W12, W14, Y12, Y13,
Y15, AA12, AA14, AB13
Notes
SVDD
1.05/1.1 V
1.05/1.1 V
1.05/1.1 V
0.95/1.05/1.1
V
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
105
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
Notes
VDD_Core1
R16, R18, R20, T17, T19, T21, T23, U16,
U18, U22, V17, V19, V21, V23, W16, W18,
W20, W22, Y17, Y19, Y21, Y23, AA16,
AA18, AA20, AA22, AB23, AC24
Core 1 voltage
supply
VDD_Core1
12, S1
M16, M17, M18, N16, N20, N22, P17, P19,
P21, P23, R22
Platform supply
voltage
VDD_PLAT
1.05/1.1 V
VDD_PLAT
0.95/1.05/1.1
V
AVDD_Core0
B20
Core 0 PLL
Supply
AVDD_Core0
0.95/1.05/1.1
V
AVDD_Core1
A19
Core 1 PLL
Supply
AVDD_Core1
0.95/1.05/1.1
V
AV DD_PLAT
B19
Platform PLL
supply voltage
AV DD_PLAT
1.05/1.1 V
AVDD_LB
A20
Local Bus PLL
supply voltage
AVDD_LB
1.05/1.1 V
AV DD_SRDS1
P32
SerDes Port 1
PLL & DLL
Power Supply
AVDD_SRDS1
SerDes Port 2
PLL & DLL
Power Supply
AVDD_SRDS2
GND
-
AV DD_SRDS2
GND
AF32
C3, C6, C9, C12, C15, C23, C26, E5, E8,
E11, E14, E18, E25, E28, F3, G7, G10, G13,
G20, G23, G27, G30, H5, J3, J9, J12, J15,
J22, J25, K7, L5, L20, M3, M9, M12, N7,
N11, N13, N15, N17, N19, N21, N23, P5,
P12, P16, P20, P22, R3, R9, R11, R13, R15,
R17, R19, R21, R23, T7, T12, T14, T16,
T18, T20, T22, U5, U11,U13, U15, U17,
U19, U21, U23, V3, V9, V12, V14, V16, V18,
V22, W7, W11, W13, W15, W17, W19, W21,
W23,Y5, Y14, Y16, Y18, Y20, Y22, AA3,
AA9, AA13, AA15, AA17, AA19, AA21,
AA23, AB7, AB24, AC5, AC11, AD3, AD9,
AD15, AE7, AE13, AE18, AF5, AF11, AF21,
AF24, AG3, AG9, AH7, AH13, AJ5, AJ11,
AK3, AK9, AK15, AK19, AK23, AL7, AL13
12, S2
1.05/1.1 V
1.05/1.1 V
AGND_SRDS1
P30
SerDes Port 1
Ground pin for
AVDD_SRDS1
-
AGND_SRDS2
AF30
SerDes Port 2
Ground pin for
AVDD_SRDS2
-
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
106
Freescale Semiconductor
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
SGND
Ground pins for
H28, H32, J30, K31, L28, L29, M32, N30,
SVDD
R29, T32, U30, V31, W29,Y32 AA30, AB31,
AC29, AD32, AE30, AG29, AH32, AJ30,
AK31, AL29, AM32
XGND
K27, L25, M26, N24, P27, R25, T26, U24,
V27, W25, Y28, AA24, AB27, AC25, AD28,
AE26, AF27, AH28, AJ26, AK27, AL26,
AM28
Power Supply
Notes
Ground pins for
XVDD_SRDS n
Reset Configuration Signals20
TSEC1_TXD[0] /
AF25
-
LVDD
TSEC1_TXD[1]/
cfg_platform_freq
AC23
-
LVDD
TSEC1_TXD[2:4]/
cfg_device_id[5:7]
AG24, AG23, AE24
-
LVDD
TSEC1_TXD[5]/
cfg_tsec1_reduce
AE23
-
LVDD
AE22, AD22
-
LVDD
TSEC2_TXD[0:3]/
cfg_rom_loc[0:3]
AB20, AJ23, AJ22, AD19
-
LVDD
TSEC2_TXD[4],
TSEC2_TX_ER/
cfg_dram_type[0:1]
AH23,
AB19
-
LVDD
TSEC2_TXD[5]/
cfg_tsec2_reduce
AH21
-
LVDD
TSEC2_TXD[6:7]/
cfg_tsec2_prtcl[0:1]
AG22, AG21
-
LVDD
TSEC3_TXD[0:1]/
cfg_spare[0:1]
AL21, AJ21
O
TVDD
TSEC3_TXD[2]/
cfg_core1_enable
AM20
O
TVDD
TSEC3_TXD[3]/
cfg_core1_lm_offset
AJ20
-
LVDD
TSEC3_TXD[5]/
cfg_tsec3_reduce
AK21
-
LVDD
AL20, AL19
-
LVDD
AC18, AC16, AD18, AD17
-
LVDD
cfg_alt_boot_vec
TSEC1_TXD[6:7]/
cfg_tsec1_prtcl[0:1]
TSEC3_TXD[6:7]/
cfg_tsec3_prtcl[0:1]
TSEC4_TXD[0:3]/
cfg_io_ports[0:3]
21
38
33
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
107
Signal Listings
Table 63. MPC8641 Signal Reference by Functional Block (continued)
Name1
Package Pin Number
Pin Type
Power Supply
AB18
-
LVDD
AB17, AB16
-
LVDD
A30, E29, C29, D28, D29, H25, B29, A29,
C28, L22, M22, A28, C27, H26, G26, B27,
B26, A27, E27, G25, D26, E26, G24, F27,
A26, A25, C25, H23, K22, D25, F25, H22
-
OVDD
LWE[0]/
cfg_cpu_boot
E21
-
OVDD
LWE[1]/
cfg_rio_sys_size
F21
-
OVDD
LWE[2:3]/
cfg_host_agt[0:1]
D22, E20
-
OVDD
LDP[0:3], LA[27] /
cfg_core_pll[0:4]
A24, E24, C24, B24,
J21
-
OVDD
22
LA[28:31]/
cfg_sys_pll[0:3]
K21, G22, F24, G21
-
OVDD
22
LGPL[3],
LGPL[5]/
cfg_boot_seq[0:1]
K20,
J19
-
OVDD
D1_MSRCID[0]/
cfg_mem_debug
F15
-
OVDD
D1_MSRCID[1]/
cfg_ddr_debug
K15
-
OVDD
TSEC4_TXD[5]/
cfg_tsec4_reduce
TSEC4_TXD[6:7]/
cfg_tsec4_prtcl[0:1]
LAD[0:31]/
cfg_gpporcr[0:31]
Notes
Note:
1. Multi-pin signals such as D1_MDQ[0:63] and D2_MDQ[0:63] have their physical package pin numbers listed in order
corresponding to the signal names.
2. Stub Series Terminated Logic (SSTL-18 and SSTL-25) type pins.
3. If a DDR port is not used, it is possible to leave the related power supply (Dn_GVDD, Dn_MVREF) turned off at reset. Note
that these power supplies can only be powered up again at reset for functionality to occur on the DDR port.
4. Low Voltage Differential Signaling (LVDS) type pins.
5. Low Voltage Transistor-Transistor Logic (LVTTL) type pins.
6. This pin is a reset configuration pin and appears again in the Reset Configuration Signals section of this table. See the Reset
Configuration Signals section of this table for config name and connection details.
7. Recommend a weak pull-up resistor (1–10 kΩ) be placed from this pin to its power supply.
8. Recommend a weak pull-down resistor (2–10 kΩ) be placed from this pin to ground.
9. This multiplexed pin has input status in one mode and output in another
10. This pin is a multiplexed signal for different functional blocks and appears more than once in this table.
11. This pin is open drain signal.
12. Functional only on the MPC8641D.
13. These pins should be left floating.
14. These pins should be connected to SV DD.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
108
Freescale Semiconductor
Signal Listings
15. These pins should be pulled to ground with a strong resistor (270-Ω to 330-Ω).
16. These pins should be connected to OVDD.
17.This is a SerDes PLL/DLL digital test signal and is only for factory use.
18. This is a SerDes PLL/DLL analog test signal and is only for factory use.
19. This pin should be pulled to ground with a 100-Ω resistor.
20. The pins in this section are reset configuration pins. Each pin has a weak internal pull-up P-FET which is enabled only when
the processor is in the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down
resistor. However, if the signal is intended to be high after reset, and if there is any device on the net which might pull down
the value of the net at reset, then a pullup or active driver is needed.
21. Should be pulled down at reset if platform frequency is at 400 MHz.
22. These pins require 4.7-kΩ pull-up or pull-down resistors and must be driven as they are used to determine PLL configuration
ratios at reset.
23. This output is actively driven during reset rather than being tri-stated during reset.
24 These JTAG pins have weak internal pull-up P-FETs that are always enabled.
25. This pin should NOT be pulled down (or driven low) during reset.
26.These are test signals for factory use only and must be pulled up (100-Ω to 1- kΩ.) to OVDD for normal machine operation.
27. Dn_MDIC[0] should be connected to ground with an 18-Ω resistor +/- 1-Ω and Dn_MDIC[1] should be connected Dn_GVDD
with an 18-Ω resistor +/- 1-Ω. These pins are used for automatic calibration of the DDR IOs.
28. Pin N18 is recommended as a reference point for determining the voltage of VDD_PLAT and is hence considered as the
VDD_PLAT sensing voltage and is called SENSEVDD_PLAT.
29. Pin P18 is recommended as the ground reference point for SENSEVDD_PLAT and is called SENSEVSS_PLAT.
30.This pin should be pulled to ground with a 200-Ω resistor.
31.These pins are connected to the power/ground planes internally and may be used by the core power supply to improve
tracking and regulation.
32. Must be tied low if unused
33. These pins may be used as defined functional reset configuration pins in the future. Please include a resistor pull up/down
option to allow flexibility of future designs.
34. Used as serial data output for SRIO 1x/4x link.
35. Used as serial data input for SRIO 1x/4x link.
36.This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is actively
driven.
37.This pin is only an output in FIFO mode when used as Rx Flow Control.
38.This pin functions as cfg_dram_type[0 or 1] at reset and MUST BE VALID BEFORE HRESET ASSERTION in device sleep
mode.
39. Should be pulled to ground if unused (such as in FIFO, MII and RMII modes).
40. See Section 18.4.2, “Platform to FIFO Restrictions” for clock speed limitations for this pin when used in FIFO mode.
41. The phase between the output clocks TSEC1_GTX_CLK and TSEC2_GTX_CLK (ports 1 and 2) is no more than 100 ps. The
phase between the output clocks TSEC3_GTX_CLK and TSEC4_GTX_CLK (ports 3 and 4) is no more than 100 ps.
42. For systems which boot from Local Bus (GPCM)-controlled flash, a pullup on LGPL4 is required.
Special Notes for Single Core Device:
S1. Solder ball for this signal will not be populated in the single core package.
S2. The PLL filter from VDD_Core1 to AVDD_Core1 should be removed. AVDD_Core1 should be pulled to ground with a weak
(2–10 kΩ) resistor. See Section 20.2.1, “PLL Power Supply Filtering” for more details.
S3. This pin should be pulled to GND for the single core device.
S4. No special requirement for this pin on single core device. Pin should be tied to power supply as directed for dual core.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
109
Clocking
18 Clocking
This section describes the PLL configuration of the MPC8641. Note that the platform clock is identical to
the MPX clock.
18.1
Clock Ranges
Table 64 provides the clocking specifications for the processor cores and Table 65 provides the clocking
specifications for the memory bus. Table 66 provides the clocking for the Platform/MPX bus and Table 67
provides the clocking for the Local bus.
Table 64. Processor Core Clocking Specifications
Maximum Processor Core Frequency
Characteristic
1000 MHz
e600 core processor frequency
1250MHz
1333MHz
1500 MHz
Min
Max
Min
Max
Min
Max
Min
Max
800
1000
800
1250
800
1333
800
1500
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The MPX clock to SYSCLK ratio and e600 core to MPX clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e600 (core) frequency, and MPX clock frequency do not exceed their respective maximum or minimum
operating frequencies. Refer to Section 18.2, “MPX to SYSCLK PLL Ratio,” and Section 18.3, “e600 to MPX clock PLL Ratio,”
for ratio settings.
2. The minimum e600 core frequency is based on the minimum platform clock frequency of 400 MHz.
Table 65. Memory Bus Clocking Specifications
Maximum Processor Core
Frequency
Characteristic
Memory bus clock frequency
1000, 1250, 1333, 1500MHz
Min
Max
200
300
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The MPX clock to SYSCLK ratio and e600 core to MPX clock ratio settings must be
chosen such that the resulting SYSCLK frequency, e600 (core) frequency, and MPX clock
frequency do not exceed their respective maximum or minimum operating frequencies. Refer to
Section 18.2, “MPX to SYSCLK PLL Ratio,” and Section 18.3, “e600 to MPX clock PLL Ratio,” for
ratio settings.
2. The memory bus clock speed is half the DDR/DDR2 data rate, hence, half the MPX clock
frequency.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
110
Freescale Semiconductor
Clocking
Table 66. Platform/MPX bus Clocking Specifications
Maximum Processor Core
Frequency
Characteristic
1000, 1250, 1333, 1500MHz
Platform/MPX bus clock frequency
Min
Max
400
500-600
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The MPX clock to SYSCLK ratio and e600 core to MPX clock ratio settings must be
chosen such that the resulting SYSCLK frequency, e600 (core) frequency, and MPX clock
frequency do not exceed their respective maximum or minimum operating frequencies. Refer to
Section 18.2, “MPX to SYSCLK PLL Ratio,” and Section 18.3, “e600 to MPX clock PLL Ratio,” for
ratio settings.
2. Platform/MPX frequencies between 400 and 500 MHz are not supported.
Table 67. Local Bus Clocking Specifications
Maximum Processor Core
Frequency
Characteristic
1000, 1250, 1333, 1500MHz
Local bus clock speed (for Local Bus
Controller)
Min
Max
25
133
Unit
Notes
MHz
1
Notes:
1. The Local bus clock speed on LCLK[0:2] is determined by MPX clock divided by the Local Bus
PLL ratio programmed in LCRR[CLKDIV]. See the reference manual for the MPC8641D for more
information on this.
18.2
MPX to SYSCLK PLL Ratio
The MPX clock is the clock that drives the MPX bus, and is also called the platform clock. The frequency
of the MPX is set using the following reset signals, as shown in Table 68:
• SYSCLK input signal
• Binary value on LA[28:31] at power up
Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note
that the DDR data rate is the determining factor in selecting the MPX bus frequency, since the MPX
frequency must equal the DDR data rate.
Table 68. MPX:SYSCLK Ratio
Binary Value of
LA[28:31]
Signals
MPX:SYSCLK Ratio
0000
Reserved
0001
Reserved
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
111
Clocking
Table 68. MPX:SYSCLK Ratio
18.3
Binary Value of
LA[28:31]
Signals
MPX:SYSCLK Ratio
0010
2:1
0011
3:1
0100
4:1
0101
5:1
0110
6:1
0111
Reserved
1000
8:1
1001
9:1
e600 to MPX clock PLL Ratio
Table 69 describes the clock ratio between the platform and the e600 core clock. This ratio is determined
by the binary value of LDP[0:3], LA[27](cfg_core_pll[0:4] - reset config name) at power up, as shown in
Table 69.
Table 69. e600 Core to MPX Clock Ratio
18.4
18.4.1
Binary Value of
LDP[0:3], LA[27] Signals
e600 core: MPX Clock Ratio
01000
2:1
01100
2.5:1
10000
3:1
11100
3.5:1
10100
4:1
01110
4.5:1
Frequency Options
SYSCLK to Platform Frequency Options
Table 70 shows some SYSCLK frequencies and the expected MPX frequency values based on the MPX
clock to SYSCLK ratio. Note that frequencies between 400 MHz and 500 MHz are NOT supported on the
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
112
Freescale Semiconductor
Thermal
platform. See note regarding cfg_platform_freq in Section 17, “Signal Listings” since it is a reset
configuration pin that is related to platform frequency.
Table 70. Frequency Options of SYSCLK with Respect to Platform/MPX Clock Speed
MPX to
SYSCLK
Ratio
SYSCLK (MHz)
66
83
100
111
133
167
Platform/MPX Frequency (MHz) 1
2
3
1
18.4.2
400
4
400
5
500
6
400
8
533
9
600
500
500
533
555
600
SYSCLK frequency range is 66-167 MHz. Platform clock/ MPX frequency
range is 400 MHz, 500-600 MHz.
Platform to FIFO Restrictions
Please note the following FIFO maximum speed restrictions based on platform speed.
For FIFO GMII mode:
FIFO TX/RX clock frequency <= platform clock frequency / 4.2
For example, if the platform frequency is 533MHz, the FIFO TX/RX clock frequency should be no more
than 127MHz
For FIFO encoded mode:
FIFO TX/RX clock frequency <= platform clock frequency / 3.2
For example, if the platform frequency is 533MHz, the FIFO TX/RX clock frequency should be no more
than 167MHz
19 Thermal
This section describes the thermal specifications of the MPC8641.
19.1
Thermal Characteristics
Table 71 provides the package thermal characteristics for the MPC8641.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
113
Thermal
Table 71. Package Thermal Characteristics1
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
RθJA
18
°C/W
1, 2
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
RθJA
13
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
RθJMA
13
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
9
°C/W
1, 3
Junction-to-board thermal resistance
RθJB
5
°C/W
4
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
5
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 °C/W.
19.2 Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8641 implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 19.2.4, “Temperature Diode,” for more
information.
To reduce the die-junction temperature, heat sinks are required; due to the potential large mass of the heat
sink, attachment through the printed-circuit board is suggested. In any implementation of a heat sink
solution, the force on the die should not exceed ten pounds force (45 newtons). Figure 59 and Figure 52
show a spring clip through the board. Occasionally the spring clip is attached to soldered hooks or to a
plastic backing structure. Screw and spring arrangements are also frequently used.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
114
Freescale Semiconductor
Thermal
Heat Sink
HCTE FC-CBGA Package
Heat Sink
Clip
Thermal
Interface Material
Printed-Circuit Board
Figure 59. FC-CBGA Package Exploded Cross-Sectional View with Several Heat Sink Options
There are several commercially-available heat sinks for the MPC8641 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
888-732-6100
60 Alhambra Road, Suite 1
Warwick, RI 02886
Internet: www.calgreg.com
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
115
Thermal
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
800-522-6752
603-635-5102
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 71, the intrinsic conduction thermal
resistance paths are as follows:
• The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
• The die junction-to-board thermal resistance
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Thermal
Figure 60 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
External Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Internal Resistance
Printed-Circuit Board
External Resistance
Radiation
Convection
(Note the internal versus external package resistance.)
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
19.2.2
Thermal Interface Materials
A thermal interface material is recommended at the package-to-heat sink interface to minimize the thermal
contact resistance. Figure 61 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 59). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC8641. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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117
Thermal
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Specific Thermal Resistance (K-in.2/W)
2
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (psi)
Figure 61. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Thermal
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-642-7674
888-246-9050
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
19.2.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ti + Tr + (RθJC + Rθint + Rθsa) × Pd
where:
Tj is the die-junction temperature
Ti is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ti)
may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to
10°C. The thermal resistance of the thermal interface material (Rθint) is typically about 0.2°C/W. For
example, assuming a Ti of 30°C, a Tr of 5°C, a package RθJC = 0.1, and a typical power consumption (Pd)
of 43.4 W, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30°C + 5°C + (0.1°C/W + 0.2°C/W + θsa) × 43.4 W
For this example, a Rθsavalue of 1.32 °C/W or less is required to maintain the die junction temperature
below the maximum value of Table 2.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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119
Thermal
heat flux of adjacent components), heat sink efficiency, heat sink placement, next-level interconnect
technology, system air temperature rise, altitude, and so on.
Due to the complexity and variety of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction)
may vary widely. For these reasons, we recommend using conjugate heat transfer models for the board as
well as system-level designs.
For system thermal modeling, the MPC8641 thermal model is shown in Figure 62. Four cuboids are used
to represent this device. The die is modeled as 12.4x15.3 mm at a thickness of 0.86 mm. See Section 3,
“Power Characteristics” for power dissipation details. The substrate is modeled as a single block
33x33x1.2 mm with orthotropic conductivity: 13.5 W/(m • K) in the xy-plane and 5.3 W/(m • K) in the
z-direction. The die is centered on the substrate. The bump/underfill layer is modeled as a collapsed
thermal resistance between the die and substrate with a conductivity of 5.3 W/(m • K) in the thickness
dimension of 0.07 mm. Because the bump/underfill is modeled with zero physical dimension (collapsed
height), the die thickness was slightly enlarged to provide the correct height. The C5 solder layer is
modeled as a cuboid with dimensions 33x33x0.4 mm and orthotropic thermal conductivity of 0.034 W/(m
• K) in the xy-plane and 9.6 W/(m • K) in the z-direction. An LGA solder layer would be modeled as a
collapsed thermal resistance with thermal conductivity of 9.6W/(m • K) and an effective height of 0.1 mm.
The thermal model uses approximate dimensions to reduce grid. Please refer to the case outline for actual
dimensions.
Conductivity
Value
Unit
Die
Die (12.4x15.3x0.86 mm)
Bump and Underfill
z
Silicon
Temperature
dependent
Substrate
C5 solder layer
Bump and Underfill (12.4 × 15.3 × 0.07 mm)
Collapsed Resistance
kz
5.3
Side View of Model (Not to Scale)
W/(m • K)
x
Substrate (33 × 33 × 1.2 mm)
kx
13.5
ky
13.5
kz
5.3
W/(m • K)
Substrate
Die
C5 Solder layer (33 × 33 × 0.4 mm)
kx
0.034
ky
0.034
kz
9.6
W/(m • K)
y
Top View of Model (Not to Scale)
Figure 62. Recommended Thermal Model of MPC8641
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Thermal
19.2.4
Temperature Diode
The MPC8641 has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the VBE variation of each MPC8641’s internal diode.
The following are the specifications of the MPC8641 on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300 μA
Diode leakage < 10 nA @ 125°C
Ideality factor over 5–150 μA at 60°C: n = 1.0275 ± 0.9%
Ideality factor is defined as the deviation from the ideal diode equation:
qVf
___
Ifw = Is e nKT – 1
Another useful equation is:
KT
q
I
IL
H
VH – VL = n __ ln __
Where:
Ifw = Forward current
Is = Saturation current
Vd = Voltage at diode
Vf = Voltage forward biased
VH = Diode voltage while IH is flowing
VL = Diode voltage while IL is flowing
IH = Larger diode bias current
IL = Smaller diode bias current
q = Charge of electron (1.6 x 10 –19 C)
n = Ideality factor (normally 1.0)
K = Boltzman’s constant (1.38 x 10–23 Joules/K)
T = Temperature (Kelvins)
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System Design Information
The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following:
VH – VL = 1.986 × 10–4 × nT
Solving for T, the equation becomes:
nT =
VH – VL
__________
1.986 × 10–4
20 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8641.
20.1
System Clocking
This device includes six PLLs, as follows:
1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The
frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio
configuration bits as described in Section 18.2, “MPX to SYSCLK PLL Ratio.”
2. The dual e600 Core PLLs generate the e600 clock from the externally supplied input.
3. The local bus PLL generates the clock for the local bus.
4. There are two internal PLLs for the SerDes block.
20.2
20.2.1
Power Supply Design and Sequencing
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide independent filter circuits per PLL power supply as illustrated in Figure 64, one to each of the
AVDD type pins. By providing independent filters to each PLL the opportunity to cause noise injection
from one PLL to the other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit should be placed as close as possible to the specific AVDD type pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
type pin, which is on the periphery of the footprint, without the inductance of vias.
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System Design Information
Figure 63 and Figure 64 show the PLL power supply filter circuits for the platform and cores, respectively.
10 Ω
VDD_PLAT
AVDD_PLAT, AVDD_LB;
2.2 µF
2.2 µF
Low ESL Surface Mount Capacitors
GND
Figure 63. MPC8641 PLL Power Supply Filter Circuit (for platform and Local Bus)
Filter Circuit (should not be used for Single core device)
10 Ω
VDD_Core0/1
AVDD_Core0/1
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Note: For single core device the filter circuit (in the dashed box) should
be removed and AVDD_Core1 should be tied to ground with a weak
(2-10 kΩ) pull-down resistor.
Figure 64. MPC8641 PLL Power Supply Filter Circuit (for cores)
The AVDD_SRDSn signals provide power for the analog portions of the SerDes PLL. To ensure stability
of the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in
following figure. For maximum effectiveness, the filter circuit is placed as closely as possible to the
AVDD_SRDSn balls to ensure it filters out as much noise as possible. The ground connection should be
near the AVDD_SRDSn balls. The 0.003-µF capacitor is closest to the balls, followed by the two 2.2-µF
capacitors, and finally the 1 Ω resistor to the board supply plane. The capacitors are connected from
AVDD_SRDSn to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant
frequency. All traces should be kept short, wide and direct.
SVDD
1.0 Ω
AVDD_SRDSn
2.2 µF
1
2.2 µF
1
0.003 µF
GND
1. An 0805 sized capacitor is recommended for system initial bring-up.
Figure 65. SerDes PLL Power Supply Filter
Note the following:
• AVDD_SRDSn should be a filtered version of SVDD.
• Signals on the SerDes interface are fed from the SVDD power plan.
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System Design Information
20.2.2
PLL Power Supply Sequencing
For details on power sequencing for the AVDD type and supplies refer to Section 2.2, “Power Up/Down
Sequence.”
20.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8641 system, and the device
itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system
designer place at least one decoupling capacitor at each OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren,
and VDD_PLAT pin of the device. These decoupling capacitors should receive their power from separate
OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT and GND power planes in the PCB,
utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a
standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT planes, to enable quick
recharging of the smaller chip capacitors. They should also be connected to the power and ground planes
through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum
or Sanyo OSCON).
20.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD_SRDSn) to ensure
low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections
from all capacitors to power and ground should be done with multiple vias to further reduce inductance.
• First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
• Second, there should be a 1-µF ceramic chip capacitor on each side of the device. This should be
done for all SerDes supplies.
• Third, between the device and any SerDes voltage regulator there should be a 10-µF, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
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System Design Information
20.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. In general all unused active low inputs should be tied to OVDD, Dn_GVDD, LVDD, TVDD,
VDD_Coren, and VDD_PLAT, XVDD_SRDSn, and SVDD as required and unused active high inputs should
be connected to GND. All NC (no-connect) signals must remain unconnected.
Special cases:
DDR - If one of the DDR ports is not being used the power supply pins for that port can be
connected to ground so that there is no need to connect the individual unused inputs of that port to
ground. Note that these power supplies can only be powered up again at reset for functionality to
occur on the DDR port. Power supplies for other functional buses should remain powered.
Local Bus - If parity is not used, tie LDP[0:3] to ground via a 4.7 kΩ resistor, tie LPBSE to OVDD
via a 4.7 kΩ resistor (pull-up resistor). For systems which boot from Local Bus (GPCM)-controlled
flash, a pullup on LGPL4 is required.
SerDes - Receiver lanes configured for PCI Express are allowed to be disconnected (as would
occur when a PCI Express slot is connected but not populated). Directions for terminating the
SerDes signals is discussed in Section 20.5.1, “Guidelines for High-Speed Interface Termination.”
20.5.1
Guidelines for High-Speed Interface Termination
20.5.1.1
SerDes Interface
The high-speed SerDes interface can be disabled through the POR input cfg_io_ports[0:3] and through the
DEVDISR register in software. If a SerDes port is disabled through the POR input the user can not enable
it through the DEVDISR register in software. However, if a SerDes port is enabled through the POR input
the user can disable it through the DEVDISR register in software. Disabling a SerDes port through
software should be done on a temporary basis. Power is always required for the SerDes interface, even if
the port is disabled through either mechanism. Table 72 describes the possible enabled/disabled scenarios
for a SerDes port. The termination recommendations must be followed for each port.
Table 72. SerDes Port Enabled/Disabled Configurations
Disabled through POR input
Enabled through POR input
SerDes port is disabled (and cannot
be enabled through DEVDISR)
SerDes port is enabled
Enabled through DEVDISR
Complete termination required
(Reference Clock not required)
SerDes port is disabled (through
POR input)
Disabled through DEVDISR
Complete termination required
(Reference Clock not required)
Partial termination may be required 1
(Reference Clock is required)
SerDes port is disabled after software
disables port
Same termination requirements as
when the port is enabled through POR
input 2
(Reference Clock is required)
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System Design Information
1
Partial Termination when a SerDes port is enabled through both POR input and DEVDISR is determined by
the SerDes port mode. If the port is in x8 PCI Express mode, no termination is required because all pins are
being used. If the port is in x1/x2/x4 PCI Express mode, termination is required on the unused pins. If the port
is in x4 Serial RapidIO mode termination is required on the unused pins.
2
If a SerDes port is enabled through the POR input and then disabled through DEVDISR, no hardware changes
are required. Termination of the SerDes port should follow what is required when the port is enabled through
both POR input and DEVDISR. See Note 1 for more information.
If the high-speed SerDes port requires complete or partial termination, the unused pins should be
terminated as described in this section.
The following pins must be left unconnected (floating):
• SDn_TX[7:0]
• SDn_TX[7:0]
The following pins must be connected to GND:
• SDn_RX[7:0]
• SDn_RX[7:0]
• SDn_REF_CLK
• SDn_REF_CLK
NOTE
It is recommended to power down the unused lane through SRDS1CR1[0:7]
register (offset = 0xE_0F08) and SRDS2CR1[0:7] register
(offset = 0xE_0F44.) (This prevents the oscillations and holds the receiver
output in a fixed state.) that maps to SERDES lane 0 to lane 7 accordingly.
For other directions on reserved or no-connects pins see Section 17, “Signal Listings.”
20.6
Pull-Up and Pull-Down Resistor Requirements
The MPC8641 requires weak pull-up resistors (2–10 kΩ is recommended) on all open drain type pins.
The following pins must NOT be pulled down during power-on reset: TSEC4_TXD[4], LGPL0/LSDA10,
LGPL1/LSDWE, TRIG_OUT/READY, and D1_MSRCID[2].
The following are factory test pins and require strong pull up resistors (100Ω –1 kΩ) to OVDD
LSSD_MODE, TEST_MODE[0:3].The following pins require weak pull up resistors (2–10 kΩ) to their
specific power supplies: LCS[0:4], LCS[5]/DMA_DREQ2, LCS[6]/DMA_DACK[2],
LCS[7]/DMA_DDONE[2], IRQ_OUT, IIC1_SDA, IIC1_SCL, IIC2_SDA, IIC2_SCL, and
CKSTP_OUT.
The following pins should be pulled to ground with a 100-Ω resistor: SD1_IMP_CAL_TX,
SD2_IMP_CAL_TX. The following pins should be pulled to ground with a 200-Ω resistor:
SD1_IMP_CAL_RX, SD2_IMP_CAL_RX.
TSECn_TX_EN signals require an external 4.7-kΩ pull down resistor to prevent PHY from seeing a valid
Transmit Enable before it is actively driven.
When the platform frequency is 400 MHz, TSEC1_TXD[1] must be pulled down at reset.
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System Design Information
TSEC2_TXD[4] and TSEC2_TX_ER pins function as cfg_dram_type[0 or 1] at reset and MUST BE
VALID BEFORE HRESET ASSERTION when coming out of device sleep mode.
20.6.1
Special instructions for Single Core device
The mechanical drawing for the single core device does not have all the solder balls that exist on the single
core device. This includes all the balls for VDD_Core1 and SENSEVDD_Core1 which exist on the
package for the dual core device, but not on the single core package. A solder ball is present for
SENSEVSS_Core1 and needs to be connected to ground with a weak (2-10 kΩ) pull down resistor.
Likewise, AVDD_Core1 needs to be pulled to ground as shown in Figure 64.
The mechanical drawing for the single core device is located in Section 16.2, “Mechanical Dimensions of
the MPC8641 FC-CBGA.”
For other pin pull-up or pull-down recommendations of signals, please see Section 17, “Signal Listings.”
20.7
Output Buffer DC Impedance
The MPC8641 drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 66). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
OV DD
RN
SW2
Data
Pad
SW1
RP
OGND
Figure 66. Driver Impedance Measurement
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System Design Information
Table 73 summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD,
nominal OVDD, 105°C.
Table 73. Impedance Characteristics
Impedance
DUART, Control,
Configuration, Power
Management
PCI
Express
DDR DRAM
Symbol
Unit
RN
43 Target
25 Target
20 Target
Z0
W
RP
43 Target
25 Target
20 Target
Z0
W
Note: Nominal supply voltages. See Table 1, Tj = 105°C.
20.8
Configuration Pin Muxing
The MPC8641 provides the user with power-on configuration options which can be set through the use of
external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible configuration
pins). These pins are generally used as output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled
and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped
with an on-chip gated resistor of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to pull
the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and
for platform /system clocks after HRESET deassertion to ensure capture of the reset value). When the input
receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with
minimal signal quality or delay disruption. The default value for all configuration bits treated this way has
been encoded such that a high voltage level puts the device into the default state and external resistors are
needed only when non-default settings are required by the user.
Careful board layout with stubless connections to these pull-down resistors coupled with the large value
of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus
configured.
The platform PLL ratio and e600 PLL ratio configuration pins are not equipped with these default pull-up
devices.
20.9
JTAG Configuration Signals
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 68. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification, but is provided on all processors that implement the Power Architecture
technology. The device requires TRST to be asserted during reset conditions to ensure the JTAG boundary
logic does not interfere with normal chip operation. While it is possible to force the TAP controller to the
reset state using only the TCK and TMS signals, more reliable power-on reset performance will be obtained
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System Design Information
if the TRST signal is asserted during power-on reset. Because the JTAG interface is also used for accessing
the common on-chip processor (COP) function, simply tying TRST to HRESET is not practical.
The COP function of these processors allows a remote computer system (typically a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
port connects primarily through the JTAG interface of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order
to fully control the processor. If the target system has independent reset sources, such as voltage monitors,
watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be
merged into these signals with logic.
The arrangement shown in Figure 67 allows the COP port to independently assert HRESET or TRST,
while ensuring that the target can drive HRESET as well.
The COP interface has a standard header, shown in Figure 67, for connection to the target system, and is
based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The
connector typically has pin 14 removed as a connector key.
The COP header adds many benefits such as breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features. An inexpensive option can be to leave
the COP header unpopulated until needed.
There is no standardized way to number the COP header shown in Figure 67; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then
left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 67 is common to all known emulators.
For a multi-processor non-daisy chain configuration, Figure 68, can be duplicated for each processor. The
recommended daisy chain configuration is shown in Figure 69. Please consult with your tool vendor to
determine which configuration is supported by their emulator.
20.9.1 Termination of Unused Signals
If the JTAG interface and COP header will not be used, Freescale recommends the following connections:
• TRST should be tied to HRESET through a 0 kΩ isolation resistor so that it is asserted when the
system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during
the power-on reset flow. Freescale recommends that the COP header be designed into the system
as shown in Figure 68. If this is not possible, the isolation resistor will allow future access to TRST
in case a JTAG interface may need to be wired onto the system in future debug situations.
• Tie TCK to OVDD through a 10 kΩ resistor. This will prevent TCK from changing state and
reading incorrect data into the device.
• No connection is required for TDI, TMS, or TDO.
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129
System Design Information
COP_TDO
1
2
NC
COP_TDI
3
4
COP_TRST
NC
5
6
COP_VDD_SENSE
COP_TCK
7
8
COP_CHKSTP_IN
COP_TMS
9
10
NC
COP_SRESET
11
12
NC
COP_HRESET
13
KEY
No pin
COP_CHKSTP_OUT
15
16
GND
Figure 67. COP Connector Physical Pinout
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
System Design Information
OVDD
SRESET0
From Target
Board Sources
(if any)
SRESET1
HRESET
13
11
10 kΩ
SRESET0
10 kΩ
SRESET1
10 kΩ
HRESET1
COP_HRESET
10 kΩ
COP_SRESET
10 kΩ
5
1
2
10 kΩ
4
4
5
6
6
7
8
5
9
10
COP Header
3
11
12
KEY
13 No
pin
15
10 kΩ
15
COP_TRST
COP_VDD_SENSE2
TRST1
10 Ω
NC
COP_CHKSTP_OUT
CKSTP_OUT
10 kΩ
14 3
10 kΩ
COP_CHKSTP_IN
CKSTP_IN
8
COP_TMS
16
TMS
9
COP Connector
Physical Pinout
1
3
COP_TDO
TDO
COP_TDI
TDI
COP_TCK
7
TCK
2
NC
10
NC
12
4
10 kΩ
16
Notes:
1. The COP port and target board should be able to independently assert HRESET and TRST to the processor
in order to fully control the processor as shown here.
2. Populate this with a 10 Ω resistor for short-circuit/current-limiting protection.
3. The KEY location (pin 14) is not physically present on the COP header.
4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for
improved signal integrity.
5. This switch is included as a precaution for BSDL testing. The switch should be open during BSDL testing to avoid
accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed or removed.
Figure 68. JTAG/COP Interface Connection for one MPC8641 device
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
131
Ordering Information
OVDD
10kΩ
10kΩ
TDI
MPC8641
SRESET0
10kΩ
SRESET0
From Target
Board Sources
(if any)
SRESET1
SRESET1
3
HRESET
HRESET 4
OVDD
10kΩ
10kΩ
3
10kΩ
COP_TDI
COP_SRESET
COP_HRESET
COP_CHKSTP_IN
2
COP_TMS
COP_TCK
GND
10kΩ
10kΩ
13
CHKSTP_OUT
CHKSTP_IN
TMS
TCK
3
TDO
NC
15
8
2
10
JTAG/COP
Header
10kΩ
TRST 4
5
11
4
COP_TRST
5
COP_CHKSTP_OUT
10kΩ
14
TDI
MPC8641
SRESET0
SRESET1
HRESET 4
NC
NC
9
TRST 4
7
12
16
CHKSTP_OUT
CHKSTP_IN
TMS
TCK
6
10Ω
1
6
COP_VDD_SENSE
TDO
COP_TDO
1
Notes:
1. Populate this with a 10Ω resistor for short circuit/current-limiting protection.
2. KEY location; pin 14 is not physically present on the COP header.
3. Use a AND gate with sufficient drive strength to drive two inputs.
4. The COP port and target board should be able to independently assert HRESET and TRST to the processor in order
to fully control the processor as shown above.
5. This switch is included as a precaution for BSDL testing. The switch should be open during BSDL testing to avoid
accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed or removed.
6. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for
improved signal integrity.
Figure 69. JTAG/COP Interface Connection for Multiple MPC8641 Devices in Daisy Chain Configuration
21 Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Section 21.1, “Part Numbers Fully Addressed by This Document.”
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Ordering Information
21.1
Part Numbers Fully Addressed by This Document
Table 74 provides the Freescale part numbering nomenclature for the MPC8641. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier which may specify special application conditions. Each part number also
contains a revision code which refers to the die mask revision number.
Table 74. Part Numbering Nomenclature
MC
nnnn
Product
Part
Code
Identifier
x
xx
nnnn
x
x
Core
Count
Package 1
Core Processor
Frequency 2
(MHz)
DDR speed
(MHz)
Product Revision Level
Blank =
Single
Core
MC
8641
D = Dual
Core
N = 500 MHz4
HX = High-lead
HCTE FC-CBGA
VU = RoHS lead-free
HCTE FC-CBGA
K = 600 MHz
1000, 1250, 1333,
1500
J = 533 MHz
H = 500 MHz
G = 400 MHz
Revision B = 2.0
System Version Register
Value for Rev B:
0x8090_0020 - MPC8641
0x8090_0120 - MPC8641D
Revision C = 2.1
System Version Register
Value for Rev C:
0x8090_0021 - MPC8641
0x8090_0121 - MPC8641D
Notes:
1. See Section 16, “Package,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support other
maximum core frequencies.
3. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These
parts have only preliminary reliability and characterization data. Before pilot production prototypes may be shipped, written
authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the
fact that product changes may still occur while shipping pilot production prototypes.
4. Part Number MC8641xxx1000NX is our low VDD_Coren device. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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133
Ordering Information
Table 75 shows the parts that are available for ordering and their operating conditions.
Table 75. Part Offerings and Operating Conditions
Part Offerings 1
1
Operating Conditions
MC8641Dxx1500KX
Dual core
Max CPU speed = 1500 MHz,
Max DDR = 600 MHz
Core Voltage = 1.1 volts
MC8641Dxx1333JX
Dual core
Max CPU speed = 1333 MHz,
Max DDR = 533 MHz
Core Voltage = 1.05 volts
MC8641Dxx1250HX
Dual core
Max CPU speed = 1250 MHz,
Max DDR = 500 MHz
Core Voltage = 1.05 volts
MC8641Dxx1000GX
Dual core
Max CPU speed = 1000 MHz,
Max DDR = 400 MHz
Core Voltage = 1.05 volts
MC8641Dxx1000NX
Dual core
MAX CPU speed = 1000 MHz,
MAX DDR = 500 MHz
Core Voltage = 0.95 volts
MC8641xx1500KX
Single core
Max CPU speed = 1500 MHz,
Max DDR = 600 MHz
Core Voltage = 1.1 volts
MC8641xx1333JX
Single core
Max CPU speed = 1333 MHz,
Max DDR = 533 MHz
Core Voltage = 1.05 volts
MC8641xx1250HX
Single core
Max CPU speed = 1250 MHz,
Max DDR = 500 MHz
Core Voltage = 1.05 volts
MC8641xx1000HX
Single core
Max CPU speed = 1000 MHz,
Max DDR = 400 MHz
Core Voltage = 1.05 volts
MC8641xx1000NX
Single core
Max CPU speed = 1000 MHz,
Max DDR = 500 MHz
Core Voltage = 0.95 volts
Note that the xx in the part marking represents the package option. The upper case “X” represents the
revision letter. For more information see Table 74.
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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Ordering Information
21.2
Part Marking
Parts are marked as the example shown in Figure 70.
MC8641x
xxnnnnxx
TWLYYWW
MMMMMM
YWWLAZ
8641D
NOTE:
TWLYYWW is the test code
MMMMMM is the M00 (mask) number.
YWWLAZ is the assembly traceability code.
Figure 70. Part Marking for FC-CBGA Device
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1
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135
Document Revision History
22 Document Revision History
Table 76 provides a revision history for the MPC8641D hardware specification.
Table 76. Document Revision History
Revision
Date
Substantive Change(s)
1
11/2008
• Added Section 4.4, “Platform Frequency Requirements for PCI-Express and Serial RapidIO”
• Removed the statement “Note that core processor speed of 1500 MHz is only available for the
MPC8641D (dual core)” from Note 2 in Table 74 because a 1500 MHz core is offered for both
MPC8641D (dual core) and MPC8641 (single core).
• Added Note 8 to Figure 57 and Figure 58.
0
07/2008
• Initial Release
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