Rohm BD63730EFV Low on-resistance dmos output Datasheet

36ViHigh-performanceiand
High-reliability Withstand Voltage
Stepping Motor Driver
BD63730EFV
General Description
BD63730EFV is a low-power motor driver that drives
load by PWM current. Rated power supply voltage of
the device is 36V, and rated output current is 3.0A. The
input interface are interchangeable between CLK-IN
drive mode and the PARALLEL-IN drive mode, and
excitation mode is corresponding to FULL STEP, HALF
STEP (2 types), and QUARTER STEP modes via a
built-in DAC. In terms of current decay, the FAST
DECAY/SLOW DECAY ratio may be set without any
limitation, and all available modes may be controlled in
the most appropriate way. In addition, the power supply
may be driven by one single system, which simplifies
the design.
Key Specification
■
■
■
■
■
19 to 28 [V]
Range of Power Supply Voltage:
3.0 [A]
Rated Output Current (Continuous):
3.5 [A]
Rated Output Current (Peak Value):
-25 to +85 [°C]
Range of Operating Temperature:
Output ON-Resistance (Total of
0.40 [Ω] (Typ)
Upper and Lower Resistors):
Package
W(Typ) x D(Typ)x H(Max)
Features
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Rated output current of 3.0A DC
Low ON-Resistance DMOS output
CLK-IN drive mode
PARALLEL-IN drive mode
PWM constant current control (other oscillation)
Built-in spike noise cancel function (external noise
filter is unnecessary)
Full-step, half-step (two types), and quarter-step
functionality
Dynamic excitation mode switch
Current decay mode switch (linearly variable
FAST/SLOW DECAY ratio)
Normal rotation & reverse rotation switching
function
Power save function
Built-in logic input pull-down resistor
Power-ON reset function
Thermal shutdown circuit (TSD)
Over-current protection circuit (OCP)
Under voltage lock out circuit (UVLO)
Over voltage lock out circuit (OVLO)
Ghost Supply Prevention (protects against
malfunction when power supply is disconnected)
Electrostatic discharge: 4kV (HBM specification)
Adjacent pins short protection
Micro miniature, ultra-thin and high heat-radiation
(exposed metal type) package
Application
■
■
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■
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PPC, multi-function printer, laser beam printer, and
ink-jet printer
Monitoring camera and WEB camera
Sewing machine
Photo printer, FAX, scanner and mini printer
Toy and robot
HTSSOP-B54
18.50mm x 9.50mm x 1.00mm
Typical Application Circuit
CLK/PHASE1
CW/I01
MODE0/PHASE2
MODE1/I02
ENABLE/I12
TEST/I11
SELECT
PS
TEST1
TEST2
VCC1
VREF
OUT1A
OUT1B
RNF1
RNF1S
VCC2
CR
OUT2A
OUT2B
MTH
RNF2
RNF2S
GND
Figure 1. BD63730EFV Application Circuit Diagram
○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Pin Configuration
OUT2 A
OUT2A
NC
RNF2
RNF2
RNF2 S
NC
NC
NC
NC
NC
OUT2B
OUT2B
GND
OUT 1B
OUT 1B
NC
NC
NC
NC
NC
RNF1 S
RNF1
RNF1
NC
OUT1 A
OUT1 A
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
VCC2
VCC2
NC
CR
NC
MTH
VREF
CLK
MODE 0
MODE 1
ENABLE
TEST
CW_CCW
PS
SELECT
NC
TEST2
TEST1
NC
NC
NC
NC
GND
GND
NC
VCC1
VCC1
Figure 2. Terminals Configuration Diagram
Block Diagram
CLK/PHASE1
CW/I01
MODE0/PHASE2
MODE1/I02
ENABLE/I12
TEST/I11
SELECT
VREF
TSD
OCP
OVLO
UVLO
Translator
RESET
PS
TEST1
＋
－
2bit DAC
TEST2
VCC1
OUT1A
＋
RNF1S
－
OUT1B
Blank time
PWM control
CR
Predriver
－
Control logic
RNF2S
＋
RNF1
RNF1S
VCC2
OUT2A
OSC
OUT2B
MTH
Mix decay
control
RNF2
RNF2S
Regulator
GND
Figure 3. BD63730EFV Block Diagram
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Pin Descriptions
Pin
No.
Pin
Name
1
OUT2A
2
OUT2A
3
NC
4
RNF2
5
RNF2
Pin
No.
Pin
Name
H bridge output terminal
19
NC
H bridge output terminal
20
No connection
Function
Connection terminal of
resistor for output current
detection
Connection terminal of
resistor for output current
detection
Pin
No.
Pin Name
No connection
37
TEST1
NC
No connection
38
TEST2
21
NC
No connection
39
NC
22
RNF1S
Input terminal of current
limit comparator
40
SELECT
23
RNF1
Connecting terminal of
resistor for output
current detection
41
PS
Connecting terminal of
resistor for output
current detection
42
CW_CCW
/I01
No connection
43
TEST
/I11
Input terminal of current
limit comparator
24
RNF1
Function
Function
Terminal for enabling
TEST mode
(TEST1=GND)
Terminal for enabling
TEST mode
(TEST2=GND)
No connection
Input mode select terminal
Power save terminal
Motor rotating direction
setting terminal
/VREF division ratio
setting terminal
Terminal for enabling
TEST mode
(TEST=GND)
/VREF division ratio
setting terminal
Terminal for enabling
output
/VREF division ratio
setting terminal
Motor excitation mode
setting terminal
/VREF division ratio
setting terminal
Motor excitation mode
setting terminal
/Phase selection
terminal
Clock input terminal for
advancing the electrical
angle
/Phase selection
terminal
6
RNF2S
7
NC
No connection
25
NC
8
NC
No connection
26
OUT1A
H bridge output terminal
44
ENABLE
/I12
9
NC
No connection
27
OUT1A
H bridge output terminal
45
MODE1
/I02
10
NC
No connection
28
VCC1
Power supply terminal
46
MODE0
/PHASE2
11
NC
No connection
29
VCC1
Power supply terminal
47
CLK
/PHASE1
12
OUT2B
H bridge output terminal
30
NC
No connection
48
VREF
Output current value
setting terminal
13
OUT2B
H bridge output terminal
31
GND
Ground terminal
49
MTH
Current decay mode
setting terminal
14
GND
Ground terminal
32
GND
Ground terminal
50
NC
No connection
15
OUT1B
H bridge output terminal
33
NC
No connection
51
CR
Connecting terminal of
CR for setting chopping
frequency
16
OUT1B
H bridge output terminal
34
NC
No connection
52
NC
No connection
17
NC
No connection
35
NC
No connection
53
VCC2
Power supply terminal
18
NC
No connection
36
NC
No connection
54
VCC2
Power supply terminal
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BD63730EFV
Absolute Maximum Ratings (Ta=25°C)
Parameter
Supply Voltage
Symbol
Rated Value
Unit
VCC1,2
-0.2 to +36.0
V
Power Dissipation
Input Voltage For Control Pin
RNF Maximum Voltage
(Note 1)
W
6.2
(Note 2)
W
(Note 4)
VIN
-0.2 to +5.5
V
VRNF
0.7
V
IOUT
3.0
(Note 3)
IOUTPEAK
3.5
(Note 3)
Maximum Output Current (Dc)
Maximum Output Current (Peak)
2.0
Pd
A/Phase
A/Phase
Operating Temperature Range
Topr
-25 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
(Note 1) 70mm×70mm×1.6mm glass epoxy board. Derate by 16.0mW/°C when operating above Ta=25°C.
(Note 2) 4-layer recommended board. Derate by 49.5mW/°C when operating above Ta=25°C.
(Note 3) Not exceeding Pd, ASO, or Tjmax=150°C.
(Note 4) 4 Pulse width tw≤1ms, duty 20%.
Caution: Operating the IC over its absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
its absolute maximum ratings.
Recommended Operating Conditions (Ta= -25 to +85°C)
Parameter
Supply Voltage
Maximum Output Current (DC)
Symbol
Rated Value
Unit
VCC1,2
19 to 28
V
IOUT
2.7
(Note 5)
A/ Phase
(Note 5) Not exceeding Pd, ASO or Tj=150°C
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Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC1,2=24V)
Specification
Parameter
Symbol
Unit
Conditions
Minimum Standard Maximum
[Whole]
Circuit Current at Standby
ICCST
-
0.8
2.0
mA
PS=L
ICC
-
2.0
5.0
mA
PS=H, VREF=3V
H-level Input Voltage
VIN1H
2.8
-
-
V
L-level Input Voltage
VIN1L
-
-
0.6
V
VIN1HYS
-
0.85
-
V
H-level Input Current
IIN1H
35
50
100
µA
VIN1=5V
L-level Input Current
IIN1L
-10
0
-
µA
VIN1=0V
Circuit Current
[Control input] (CLK, MODE0)
Input Hysteresis Voltage
[Control input] (CW, MODE1, ENABLE, TEST, PS, SELECT)
H-level Input Voltage
VIN2H
2.0
-
-
V
L-level Input Voltage
VIN2L
-
-
0.8
V
H-level Input Current
IIN2H
35
50
100
µA
VIN2=5V
L-level Input Current
IIN2L
-10
0
-
µA
VIN2=0V
IOUT =±2.5A
(Sum of upper and lower)
[Output (OUT1A, OUT1B, OUT2A, OUT2B)]
Output ON-Resistance
RON
-
0.40
0.52
Ω
Output Leak Current
ILEAK
-
-
10
µA
RNFxS Input Current
IRNFS
-2.0
-0.1
-
µA
RNFxS=0V
RNFx Input Current
IRNF
-40
-20
-
µA
RNFx=0V
VREF Input Current
IVREF
-2.0
-0.1
-
µA
VREF=0V
VREF Input Voltage Range
VVREF
0
-
3.0
V
MTH Input Current
IMTH
-2.0
-0.1
-
µA
MTH Input Voltage Range
VMTH
0
-
3.5
V
Minimum ON Time
(Blank Time)
tONMIN
0.3
0.9
1.5
µs
C=1000pF, R=39kΩ
Comparator Threshold
VCTH
0.57
0.60
0.63
V
VREF=3V
[Current control]
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BD63730EFV
Application Information
Function Explanation
SELECT Terminal/Input Mode Switching Terminal
This is the terminal to set the input mode.
SELECT
Input mode
L
H
CLK-IN drive
Parallel IN drive
Input mode in the case of CLK-IN drive (SELECT=L)
CLK/Clock Input Terminal for Advancing Electrical Angle
The electrical angle advances by one for each CLK input and only reflected at CLK’s rising edge.
Motor misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise being introduced.
MODE0,MODE1/Motor Excitation Mode Setting Terminal
Set the motor excitation mode
MODE0
MODE1
Excitation Mode
L
L
FULL STEP
H
L
HALF STEP A
L
H
HALF STEP B
H
H
QUARTER STEP
Please refer to the P.13, 14 for the timing chart & motor torque vector of various excitation modes.
Unrelated to CLK, change in setting is reflected instantly (refer to P.16).
CW_Terminal/Motor Rotating Direction Setting
Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the
change in setting (refer to P.15)
CW
Rotating direction
L
H
Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s
current)
ENABLE Terminal/Output Enable Terminal
Turns ON or OFF all output transistors (motor output is open).
When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.
However, during excitation mode (MODE0, MODE1) switch when ENABLE=L, setting ENABLE=L→H resets the
IC and the new excitation mode will be applied (See P.16).
ENABLE
Motor Output
L
H
OPEN (electrical angle retained)
ACTIVE
PS/Power Save Terminal
Setting PS=L will cause the circuit to enter standby state and make motor output OPEN. In standby state,
translator circuit, and electrical angle are initialized.
Please take note that there is a delay of 40µs (max) before returning from standby state to normal state then the
motor output becomes ACTIVE (refer to P.12).
PS
Status
L
Standby state(RESET)
H
ACTIVE
The initial electrical angle of each excitation mode after RESET is as follows (refer to P.13, 14).
Excitation Mode
Initial Electrical Angle
FULL STEP
45°
HALFSTEP A
45°
HALFSTEP B
45°
QUARTER
STEP
45°
TEST, TEST1, TEST2 Terminal/Terminal for Inspection
This terminal is used for delivery inspection on IC, and shall be grounded before use.
In addition, malfunctions may be caused by application without grounding.
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◆ Input mode in the case of Parallel-IN drive (SELECT=H)
PS/Power Save Terminal
Setting PS=L will cause the circuit to enter standby state and make motor output OPEN. In standby state,
translator circuit, and electrical angle are initialized.
Please take note that there is a delay of 40µs (max) before returning from standby state to normal state then the
motor output becomes ACTIVE (refer to P.12).
PS
Status
L
H
Standby state(RESET)
ACTIVE
PHASE1,PHASE2/Phase Selection Terminal
PHASE1
PHASE2
OUT1A
L
L
L
H
L
H
L
H
L
H
H
H
OUT1B
H
L
H
L
OUT2A
L
L
H
H
OUT2B
H
H
L
L
I01,I02,I11,I12/VREF Division Ratio Setting Terminal
I0x
I1x
Output current level (%)
L
H
L
L
L
H
H
H
(I0X, I1X)=(H, H): motor outputs are OPEN.
100
67
33
0
VCC1,VCC2/Power Supply Terminal
Since the motor’s drive current is passing through it, please wire the power supply in such a way that the wire is
thick and short, and has low impedance.
VCC voltage may suffer from great fluctuation, so it is necessary to connect a bypass capacitor of about 100µF to
470µF as close to the terminal as possible and adjust in such a way that the VCC voltage is stable. Please
increase the capacitance if needed especially when a large current is required or those motors that have great
back electromotive force are used.
In addition, for the purpose of reducing the power supply’s impedance in wide frequency bandwidth, parallel
connection of multi-layered ceramic capacitor of 0.01µF to 0.1µF is recommended. Extreme care must be
observed to make sure that the VCC voltage does not exceed the voltage rating even for a moment.
VCC1 & VCC2 are shorted internally, so please be sure to short VCC1 & VCC2 externally when operating. It might
cause malfunction or destruction if not shorted externally because of the concentration of current in a certain route.
Moreover, in the power supply terminal, there is built-in clamp component for preventing an electrostatic
destruction. If a steep pulse or surge voltage of more than that of maximum absolute rating is present, this clamp
component operates and as a result there is the danger of destruction, so please be sure that the maximum
absolute rating is not to be exceeded. It is effective to mount a Zener diode of about the maximum absolute rating.
In addition, the diode for preventing an electrostatic destruction is inserted between VCC terminal and GND
terminal, as a result there is the danger of IC destruction if a voltage of reverse polarity is applied between VCC
terminal and GND terminal, so please be careful.
GND/Ground Terminal
In order to reduce the noise caused by switching current, and to stabilize the internal reference voltage of IC,
please wire in such a way that the wiring impedance from this terminal is made as low as possible to achieve the
lowest electrical potential no matter what operating state it may be. Moreover, please design patterns not to have
any common impedance with other GND patterns.
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OUT1A,OUT1B,OUT2A,OUT2B/H Bridge Output Terminal
Since the motor’s drive current is passing through it, please wire in such a way that the wire is thick and short, and
has low impedance. It is also effective to add a Schottky diode if the output has a big positive or negative
fluctuation when large current is present (i.e. counter electromotive voltage is big). Moreover, in the output terminal,
there is a built-in clamp component for preventing an electrostatic destruction. If a steep pulse or surge voltage of
more than that of maximum absolute rating is present, this clamp component operates and as a result there is the
danger of destruction, so please be sure that the maximum absolute rating is not to be exceeded.
RNF1,RNF2/Connecting terminal of Resistor for Detecting of Output Current
Please connect a resistor of 0.1Ω to 0.3Ω for current detection between this terminal and GND. In view of the
2
power consumption of the current-detecting resistor, please determine the resistor in such a way that W=IOUT ･R
[W] does not exceed the power dissipation of the resistor. In addition, please wire in such a way that it has low
impedance and does not have impedance common with other GND patterns because motor’s drive current passes
through RNF terminal to current-detecting resistor to GND. Do not exceed the rating because there is the
possibility of circuit malfunction (i.e. RNF voltage exceeded the maximum rating of 0.7V). Moreover, please be
careful because if RNF terminal is shorted to GND, large current flows without normal PWM constant current
control, then there is the possibility that OCP or TSD will operate. If RNF terminal is open, then there is the danger
of malfunction as output current does not flow either, so please do not leave open.
RNF1S,RNF2S/Input Terminal of Current Limit Comparator
In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in
order to decrease the error of current-detecting accuracy caused by the internal wire impedance of RNF terminal.
Therefore, connect RNF terminal and RNFS terminal together when using PWM constant current control. In
addition, because the wires from RNFS terminal is connected near the current-detecting resistor in the case of
interconnection, the lowering of current-detecting accuracy that is caused by the impedance of board pattern
between RNF terminal and the current-detecting resistor can be decreased. Moreover, design the pattern in such
a way that there is no noise being introduced. In addition, please be careful when terminals of RNF1S & RNF2S
are shorted to GND, large current flows without normal PWM constant current control, then there is the possibility
that OCP or TSD will operate.
VREF/Output Current Value Setting Terminal
This is the terminal to set the output current value. The output current value can be set by VREF voltage and
current-detecting resistor (RNF resistor).
Output current IOUT [A ] = {VREF [V ] / 5(division ratio inside IC)}/ RNF [Ω]
Please avoid IC operation with VREF terminal open because if VREF terminal is open, the input is unsettled, and
the VREF voltage increases, and then there is the possibility of malfunctions such as the setting current increases,
then a large current flows. Please do not exceed 3V because if it exceeds 3V, then there is also the danger that a
large current flows in the output and so OCP or TSD will operate. Moreover, please take into consideration the
outflow current of 2µA (Max) if configuring by voltage division when selecting the resistance value. The minimum
current, which can be controlled by VREF voltage, is determined by motor coil’s L & R values and minimum ON
time since there is a minimum ON time in PWM drive.
CR/Connecting terminal of CR for Setting Chopping Frequency
This is the terminal to set the chopping frequency of output. Please connect the external C (470p to 1500pF) and
R (10k to 200kΩ) between this terminal and GND. Please refer to P11. Please interconnect from external
components to GND in such a way that the interconnection does not have impedance in common with other GND
patterns. In addition, please design the pattern in such a way that it keeps steep pulses such as square wave
away and that there is no noise being introduced. Please mount the two components C and R if operating by PWM
constant current control because normal PWM constant current control becomes impossible if CR terminal is open
or is biased externally.
MTH/Current Decay Mode-setting Terminal
This is the terminal to set the current decay mode. Current decay mode can be optionally set according to input
voltage.
MTH terminal input voltage[V] Current decay mode
0 to 0.3
SLOW DECAY
0.4 to 1.0
MIX DECAY
1.5 to 3.5
FAST DECAY
Please connect to GND if utilizing SLOW DECAY mode.
Please avoid IC operation with MTH terminal open because if MTH terminal is open, the input is unsettled, and
then there is the danger that PWM operation becomes unstable. Moreover, please take into consideration the
outflow current of 2µA (Max) if configuring by voltage division when selecting the resistance value.
NC Terminal
This terminal is unconnected electrically with IC internal circuit.
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Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175°C (Typ), the motor output becomes OPEN. Also, when the temperature decreases less than 150°C (Typ), it
automatically returns to normal operation. However, even when TSD is in operation and heat is continuously
added externally, heat overdrive can lead to destruction.
Over-Current Protection (OCP)
This IC has a built in over-current protection circuit as a provision against destruction when the motor outputs are
shorted to each other, or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output
to OPEN condition when the regulated threshold current flows for 4µs (Typ). It resumes normal operation by
re-applying main power supply or a reset of the PS terminal. The over-current protection circuit only aims to
prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used
as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s
function. After OCP operation, if irregular situations continue and the resume on normal operation by power
reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may
generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after
the over-current has flowed and the output terminal voltage jumps up, the absolute maximum values may be
exceeded and as a result, there is a possibility of destruction. Also, when current is over the output current rating
and under the OCP detection current, the IC can heat up to over Tjmax=150°C and can deteriorate, so current
which exceeds the output rating should not be applied.
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power
supply under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ), the motor output is set
to OPEN. This protection circuit has a 1V (Typ) hysteresis to prevent false operation cause by noise. Please be
aware that this circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO
circuit operates during CLK-IN drive mode.
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply
over voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN.
This protection circuit has a 1V (Typ) hysteresis and a 4µs (Typ) mask time to prevent false operation cause by
noise. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute
maximum value for power supply voltage is exceeded. Please be aware that this circuit does not operate during
power save mode.
Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal from logic input (e.g. MTH, VREF) is supplied when there is no power supplied to this IC, there is a
function which prevents the false operation via the electrostatic discharge protection diode from these input
terminals to VCC or to another IC’s power supply.
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BD63730EFV
PWM Constant Current Control
Current Control Operation
When the output transistor is turned ON, the output current increases, and as a result increases the voltage at the current
sense resistor. Once the voltage at the RNF pin reaches the voltage value set by the internal 2-bit DAC, and the VREF
input voltage, the current limit comparator engages and enters current decay mode. The output is then turned OFF for a
period of time determined by the RC time constant connected to the CR pin. The process repeats itself constantly for PWM
operation.
Noise-masking Function
In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC
employs an automatic current detection-masking period (tONMIN), during which current detection is disabled immediately
after the output transistor is turned ON. This allows for constant-current drive without the need for an external filter. This
noise-masking period defines the minimum ON-time for the motor output transistor.
CR Timer
The CR filter connected to the CR pin is repeatedly charged and discharged between the VCRH and VCRL levels. The
output of the internal comparator is masked while charging from VCRL to VCRH in order to cancel noise. As mentioned
above, this operation defines the minimum ON-time of the motor output transistor. The CR terminal begins discharging
once the voltage reaches VCRH. When the output current reaches the current limit during this period (i.e. RNF voltage
reaches the decay trigger voltage), then the IC enters decay mode. The CR continues to discharge during this period until it
reaches VCRL; at this point the IC output is switched back ON. The current output, and CR pin begin charging
simultaneously.
The CR charge time (tONmin) and discharge time (tdischarge) are set by external components, according to the following
formulas. The sum of tONMIN and tdischarge yields the chopping period, tchop.
t DISCHARGE [s ] ≈ C • R • In [(1 + α ) / 0.4]
α:See the right graph.
0.30
0.25
α[V]
t ONMIN [s ] ≈ C • R' R / (R"+ R ) • In [(VCR − 0.4 ) / (VCR − 1.0)]
VCR = V • R / (R'+R )
Where:
V is the internal regulator voltage 5V(Typ)
R' is the CR terminal internal impedance 5kΩ(Typ)
0.20
0.15
0.10
0.05
t CHOP [s ] ≈ t ONMIN + t DISCHARGE
0.00
0
500
1000
C [pF]
1500
2000
Spike noise
Output current
RNF Voltage
Current
Value
0mA
limit
Current
Value
limit
GND
VCRH(1.0V
Typ)
CR Voltage
VCRL(0.4V
Discharge
time
Minimum ON
Time
GND
Chopping Period
tCHOP
Figure 4. Timing Chart of CR Voltage, RNF Voltage, and Output Current
Attach a resistor of at least 10kΩ to the CR terminal (10kΩ to 200kΩ is recommended) as lower values may keep
the RC from reaching the VCRH voltage level. A capacitor in the range of 470pF to 1500pF is recommended. As
the capacitance is increased, the noise-masking period (tONMIN) also increases, and there is a risk that the output
current may exceed the current limit threshold due to the internal L and R components of the output motor coil.
Also, ensure that the chopping period (tCHOP) is not set longer than necessary doing so will increase the output
ripple, in effect decreasing the average output current, and yielding lower output rotation efficiency. The optimal
value should reduce the motor drive noise while keeping distortion of the output current waveform to a minimum.
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BD63730EFV
Current Decay Mode
The IC allows for a mixed decay mode in which the ratio of fast and slow decay can be optionally set.
The following diagrams show the operating state of each transistor and the regenerative current path during
attenuation for each decay mode:
SLOW DECAY
FAST DECAY
OFF
ON→ OFF
OFF→ OFF
ON→ OFF
M
M
OFF→ ON
ON→ ON
OFF→ ON
ON→ OFF
Output ON Time
Current Decay Time
Figure 5. Route of Regenerated Current during Current Decay
The merits of each decay mode are as follows:
SLOW DECAY
During current attenuation, the voltage between motor coils is small and the regeneration current decreases
slowly decreasing the output current ripple. This is favorable for keeping motor torque high. However, due to
fall-off of current control characteristics in the low-current region, or reverse EMF of the output motors
exhibited when using high-pulse-rate half-step or quarter-step modes, the output current increases, distorting
the output current waveform, and increasing motor vibration. Thus, this decay mode is most suited to full-step
modes, or low-pulse-rate half-step or quarter-step modes.
FAST DECAY
Fast decay decreases the regeneration current more quickly than slow decay, greatly reducing distortion of
the output current waveform. However, fast decay yields a larger output current ripple, in effect decreases the
overall average current running through the motor. This creates two problems: first, the motor torque
decreases. Increasing the current limit value can help eliminate this problem, but the rated output current must
be taken into consideration; second, the power loss within the motor increases and thereby produces more
heat. If neither of these problems is of concern, then fast decay can be used for high-pulse rate half- or
quarter-step drive.
Additionally, this IC allows for a mixed decay mode that can help improve problems that arise from using fast
or slow decay mode. In this mode, the IC switches automatically between slow and fast decay, improving the
current control characteristics without increasing the output current ripple. Mixed decay mode operates by
splitting the decay period into two sections, the first X% (t1-t2) operates the IC in slow decay mode, and the
remainder (t2-t3) operates in fast decay mode. However, if the output current (i.e. the voltage on the RNF pin)
does not reach the set current limit during the first X% (t1-t2) decay period, the IC operates in fast decay mode
only.
MTH voltage [V]
Current decay mode
0 to 0.3
0.4 to 1.0
1.5 to 3.5
SLOW DECAY
MIX DECAY
t1
t2
FAST DECAY
t3
1.0V
CR Voltage
MTH Voltage
0.4V
GND
Chopping Period
tchop
Current limit value
Output Current
FAST
SLOW
DECAY DECAY
0A
Figure 6. Relation between CR Terminal Voltage, MTH Voltage, and Output Current during Mixed Decay
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BD63730EFV
Translator Circuit
This IC has a built-in translator circuit that can drive stepper motor in CLK-IN mode.
The operation of the translator circuit in CLK-IN mode is described below.
Reset Operation
The translator circuit is initialized by power ON, Reset function, or PS terminal.
Initializing Operation when Power Supply is Turned ON
① If power supply is turned ON at PS=L (Please use this sequence as a general rule)
When power supply is turned ON, the power ON reset function operates and initialized, but as long as it is
PS=L, the motor output is in OPEN state. After power supply is turned ON and changing of PS=L→H, the
motor output becomes ACTIVE, and the excitation is started at the initial electrical angle. At the time of
PS=L→H, there is a delay of 40µs (max) until the motor output becomes ACTIVE.
Reset is released
ACTIVE
②
①
Delay
PS
CLK
OUT1A
OUT1B
Motor output OPEN
Motor output ON
② If power supply is turned ON at PS=H
When power supply is turned ON, the power ON function in IC operates, and initialized before the motor
output becomes ACTIVE, and the excitation is started at the initial electrical angle.
Initializing Operation during Motor Operation
Please input the reset signal to PS terminal when the translator circuit is initialized during motor operation.
(Refer to P.15) But at the time of PS=L→H, there is a delay of 40µs (max) until the motor output becomes
ACTIVE, so please be careful.
Control Input Timing
Please input signals as shown below since the translator circuit operates at the rising edge of a CLK signal. If the
timing is not followed, then there is the possibility that the translator circuit will not operate as expected. In addition,
at the time of PS=L→H, there is a delay of 40µs (Max) until the motor output becomes ACTIVE, so within this
delay interval there is no phase advance operation even if CLK is inputted.
A
PS
B
C
CLK
D
MODE0
MODE1
CW
F
G
E
F
G
A:PS minimum input pulse width･･････20µs
B:PS rising edge to CLK rising edge input possible maximum delay time･･････40µs
C:CLK minimum period･･････4µs
D:CLK minimum input H pulse width･･････2µs
E:CLK minimum input L pulse width･･････2µs
F:MODE0,MODE1,CW set-up time･･････1µs
G:MODE0,MODE1,CW hold time･･････1µs
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BD63730EFV
FULL STEP (MODE0=L, MODE1=L, CW=L, ENABLE=H)
①
②
③
④
①
OUT1A
100%
PS
CLK
67%
OUT1A
33%
1
4
OUT2A
OUT2B
OUT1B
OUT2A
3
2
OUT2B
100%
67%
33%
IOUT(CH1)
-33%
-67%
-100%
OUT1B
4CLK = Electrical angle 360°
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
HALF STEP A (MODE0=H, MODE1=L, CW=L, ENABLE=H)
①
②
③
④
⑤
⑥
⑦
⑧
①
②
OUT1A
PS
100%
CLK
67%
8
33%
OUT1A
OUT2B
OUT1B
OUT2A
1
7
6
2
5
OUT2A
3
4
OUT2B
100%
67%
33%
IOUT(CH1)
-33%
-67%
-100%
OUT1B
8CLK = Electrical angle 360°
100%
67%
33%
IOUT(CH2)
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-33%
-67%
-100%
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BD63730EFV
HALF STEP B(MODE0=L, MODE1=H, CW=L, ENABLE=H)
①
②
③
④
⑤
⑥
⑦
⑧
①
②
OUT1A
PS
100%
CLK
67%
OUT1A
8
33%
OUT1B
OUT2B
1
7
2
6
OUT2A
5
OUT2A
3
4
OUT2B
100%
67%
33%
IOUT(CH1)
-33%
-67%
-100%
OUT1B
8CLK = Electrical angle 360°
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
QUARTER STEP(MODE0=H, MODE1=H, CW=L, ENABLE=H)
①②③④⑤⑥⑦⑧⑨⑩⑪⑫⑬⑭⑮⑯①②③④
OUT1A
PS
100%
CLK
67%
OUT1A
14
OUT2B
OUT2A
2
16
13
33%
OUT1B
15
1
12
2
11
1
10
4
3
9
100%
67%
33%
IOUT(CH1)
-33%
-67%
-100%
7
6
OUT1B
16CLK = Electrical angle 360°
100%
67%
33%
IOUT(CH2)
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TSZ22111・15・001
5
8
OUT2B
OUT2A
-33%
-67%
-100%
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BD63730EFV
Reset Timing Chart (QUARTER STEP, MODE0=H, MODE1=H, CW=L , ENABLE=H)
If the terminal PS is set to L, the reset operation is done regardless of other input signals then resets the
translator circuit while motor is working. At this time, IC internal circuit enters standby mode, and makes the
motor output OPEN.
RESET
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
①
②
③
④
⑤
⑥
⑦
⑧
PS
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
67%
33%
IOUT(CH1)
-33%
-67%
-100%
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
CW Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)
The switching of CW is reflected at the rising edge of the CLK. However, depending on the state of the motor
output at the switch, the motor cannot follow even if the control on driver side corresponds and there are
possibilities of step-out or misstep in motor. So please consider the sequence of the switch sufficiently.
CW
①
CCW
②
③
②
①
PS
CW
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
IOUT(CH1)
-100%
100%
IOUT(CH2)
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BD63730EFV
ENABLE Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)
The switching of ENABLE signal is reflected regardless of other input signals.
When ENABLE=L, the motor output becomes OPEN and the electrical angle won’t advance because the
translator circuit stops, and CLK input is cancelled. Therefore, the previous state will resume after
ENABLE=L→H. Excitation mode (MODE0, MODE1) can be switched within ENABLE=L interval. When
excitation mode is switched within ENABLE=L interval, restoring of the excitation mode is done after
ENABLE=L→H.
Output off & Translator stop
①
②
②
③
PS
ENABLE
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
IOUT(CH1)
-100%
100%
IOUT(CH2)
-100%
Restoring in the state prior to input of ENABLE=L
Switching of Motor Excitation Mode
The switching of the excitation mode can be done regardless of the CLK signal at the same time as changing
of the signal MODE0 and MODE1. The following built-in function can prevent motor out-of-step caused by
discrepancies of torque vector of transitional excitations during switch between excitation modes. However,
due to operation state of motor during switch, motor may not act following control on IC side of controller, and
thereby lead to out-of-step or miss step. Therefore, switch sequence shall be evaluated sufficiently before any
decision.
Cautions of Bidirectional Switch of CW and Excitation Modes (MODE0,MODE1)
As shown in the Figure below, the area between the end of reset discharge (PS=L→H) and beginning of the
first CLK signal input is defined as interval A, while the area post the end of the first CLK signal input is
defined as interval B.
Interval A
=> For CW, no limitation is applied on switch of excitation mode.
Interval B
=> In CLK1 period, or within ENABLE=L interval, CW and excitation mode can’t be switched together.
Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.
Therefore, in case that CW and excitation modes are switched simultaneously, PS terminal must be input with
reset signal. Then start to operate in interval A before carrying out such bidirectional switch.
interval A
interval B
PS
CLK
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BD63730EFV
PARALLEL-IN Drive Mode
It is possible to drive stepping motor with FULL STEP, HALF STEP, and QUARTER STEP by inputting the following
motor control signals using PARALLEL-IN drive mode.
Examples of control sequence and torque vector
FULL STEP
Controlled by 2 logic signals of PHASE1 & PHASE2
①
②
③
④
OUT1A
100%
PHASE1
PHASE2
67%
I01
33%
I11
OUT2B
4
1
OUT2A
I02
I12
IOUT(CH1)
2
3
100%
67%
33%
OUT1B
-33%
-67%
-100%
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
HALF STEP A
Controlled by 4 logic signals of PHASE1, PHASE2, I01 (I11), and I02 (I12)
①
②
③
④
⑤
⑥
⑦
⑧
OUT1A
100%
PHASE1
67%
PHASE2
I01
33%
I11
OUT2B
I02
I12
IOUT(CH1)
IOUT(CH2)
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TSZ22111・15・001
1
100%
67%
33%
-33%
-67%
-100%
2
8
3
7
OUT2A
4
6
5
OUT1B
100%
67%
33%
-33%
-67%
-100%
17/26
TSZ02201-0P2P0B700360-1-2
17.Nov.2014 Rev.001
BD63730EFV
HALF STEP B
Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02, and I12
①
②
③
④
⑤
⑥
⑦
⑧
OUT1A
100%
PHASE1
PHASE2
67%
I01
33%
I11
OUT2B
I02
1
2
8
7
3
6
I12
IOUT(CH1)
OUT2A
4
100%
67%
33%
5
-33%
-67%
-100%
OUT1B
100%
67%
33%
IOUT(CH2)
-33%
-67%
-100%
QUARTER STEP
Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02, and I12
①②③④⑤⑥⑦⑧⑨⑩⑪⑫⑬⑭⑮⑯
OUT1A
100%
PHASE1
67%
PHASE2
I01
22
3
14
OUT2B
I02
I12
IOUT(CH2)
1
15
33%
I11
IOUT(CH1)
16
4
13
5
12
6
11
100%
67%
33%
-33%
-67%
-100%
OUT2A
7
10
9
8
OUT1B
100%
67%
33%
-33%
-67%
-100%
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BD63730EFV
Power Dissipation
Please ensure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),
package power dissipation (Pd), and ambient temperature (Ta). When Tj=150°C is exceeded the functions of the
semiconductor do not operate as expected, and problems such as parasitism and leaks occur. Constant use under
these circumstances leads to deterioration and eventually destruction of the IC. Tjmax≤150°C must be strictly obeyed
under all circumstances.
Thermal Consideration
The IC’s power consumption can be estimated roughly with power supply voltage (VCC), circuit current (ICC), output
ON-Resistance (RONH, RONL), and motor output current value (IOUT).
The calculation method during FULL STEP drive, SLOW DECAY mode is shown below:
Consumed power of the VCC [W ] = VCC [V ] • I CC [A]
Consumed power of the output DMOS [W ] =
･･･････①
(R [Ω] + R [Ω]) • I [A]
2
ONH
ONL
OUT
• 2[ch] • on duty
During output ON
+ (2 • RONL ) • I OUT [A] • 2 [ch] • (1 − on _ duty )
During current decay
2
･･･････②
PWM on duty = t ON / (t CHOP )
When ON duty:
tON varies depending on the L and R values of the motor coil and the current set value. Please confirm by actual
measurement, or make an approximate calculation.
tCHOP is the chopping period, which depends on the external CR. See P.10 for details.
IC number
Upper PchDMOS ON-Resistance
RONH[Ω] (Typ)
Lower NchDMOS ON-Resistance
RONL[Ω] (Typ)
0.27
0.13
BD63730EFV
Consumed power of total IC W_total [W] = ① + ②
Junction Temperatur e Tj = Ta [°C] + θja [°C / W ] • W _ total [W ]
However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. Refer to
the derating curve on P.21. Also, we are taking measurements of thermal resistance value θja of actual boards in
use. Please feel free to contact our sales department. The calculated values above are only theoretical. For actual
thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal
design with enough margin to not exceed Tjmax=150°C. Although unnecessary with normal use, if the IC is to be
used under strict heat conditions, please consider inserting an external Schottky diode between the motor output
terminal and GND to abate heat from the IC.
Temperature Monitoring
In case of CLK-IN drive, there is a way to approximately measure the chip temperature by using the electrostatic
discharge protection diode of TEST pin. For PARALLEL-IN drive, the logic terminal (I0x or I1x) can be used when
at L state. Temperature monitoring using this method is only for evaluation and experimenting purposes, and must
not be used in actual usage conditions.
•
•
•
Measure the terminal voltage when a current of IDIODE=50µA passes from the TEST or I0x or I1x terminal to
the GND without supplying VCC to the IC. This measurement is the Vf voltage of the internal diode.
Measure the temperature characteristics of this terminal voltage. Vf has a linear negative temperature factor
against temperature. With these results of temperature characteristics, chip temperature may be calibrated
from the TEST or I0x or I1x terminal voltage.
Supply VCC, monitor the TEST or I0x or I1x terminal voltage while running the motor, and the chip
temperature can be approximated from the results of (2).
VCC
TEST or
I0x or I1x
-Vf[mV]
Internal circuit
IDIODE
Internal circuit
Vf
25
150
Chip temperature Tj [℃]
Figure 7.Model Diagram for Measuring Chip Temperature
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BD63730EFV
Example for Application Circuit
Logic input terminal
See P6, 7 for detail.
Power save terminal
Refer to P.6, 7 for detail.
CLK/PHASE1
CW/I01
MODE0/PHASE2
MODE1/I02
ENABLE/I12
TEST/I11
SELECT
TSD
OCP
OVLO
UVLO
Translator
RESET
TEST1
VREF
＋
－
2bit DAC
Bypass capacitor.
Setting range is
100µF to 470µF(electrolytic)
0.01µF to 0.1µF(multilayer ceramic
etc.)
Refer to P.7 for detail.
Be sure to short VCC1 & VCC2.
TEST2
Set the output current.
Input by voltage division.
Refer to P.8 for detail.
VCC1
RNF1S
Set the chopping
frequency.
Setting range is
C:470pF to 1500pF
R:10kΩ to 200kΩ
Refer to P.8, 10 for detail.
OUT1A
＋
－
OUT1B
＋
Blank time
PWM control
RNF1
Predriver
－
Control logic
RNF2S
CR
39kΩ
PS
0.2Ω
0.1µF
VCC2
OUT2A
OSC
Resistor for current detection
Setting range is
0.1Ω to 0.3Ω.
Refer to P.8 for detail.
OUT2B
1000pF
MTH
100µF
RNF1S
Mix decay
control
RNF2
0.2Ω
RNF2S
Set the current decay mode.
①SLOW DECAY
⇒Connect to GND.
②MIX DECAY
⇒Input by voltage division.
Refer to P.8, 11 for detail.
Regulator
GND
Resistor for current detection
Setting range is
0.1Ω to 0.3Ω.
Refer to P.8 for detail.
Figure 8. BD63730EFV Block Diagram and Application Circuit Diagram
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BD63730EFV
I/O Equivalent Circuit
VCC
VCC
CW
MODE1
circuitry
ENABLE
PS,SELECT
circuitry
CLK
MODE0
215kΩ
100kΩ
VREF
MTH
10kΩ
5kΩ
10kΩ
100kΩ
VREG (internal
regulator)
circuitry
RNF1S
RNF2S
5kΩ
5kΩ
CR
5kΩ
5kΩ
VCC
OUT1A
OUT2A
OUT1B
OUT2B
RNF1, RNF2
circuitry
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BD63730EFV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned OFF completely before connecting or removing it from the test setup during the inspection process.
To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport
and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
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BD63730EFV
Operational Notes – continued
12. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 10. Example of Monolithic IC Structure
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
15. Over-Current Protection Circuit (OCP)
This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is
strongly advised not to subject the IC to prolonged shorting of the output.
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BD63730EFV
Power Dissipation
HTSSOP-B54 is designed with heat-remission metal on the backside of IC to perform heat dissipation treatment using
through hole from backside. It is possible to increase power dissipation considerably by ensuring sufficient heat-releasing
area on both top and back sides such as copper foil. Please note that the power dissipation described below may not be
assured without being shorted. The back metal is shorted with the backside of the IC chip that is a GND potential. There is
a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. The back metal
should be soldered onto the GND to short. Please be careful that this package is designed to be used after performing heat
dissipation treatment on the back metal, and to improve heat dissipation efficiency.
Measurement machine：TH156 (Kuwano Electric)
Measurement condition：ROHM board
6.0
Board size：70mm*70mm*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with solder
Board①：1-layer board (Copper foil on the back 0mm*0mm)
5.0
Board③：2-layer board (Copper foil on the back 70mm*70mm)
7.0
Power
Power Dissipation：Pd[W]
Dissipation : Pd [W]
6.2W
4
Board②：2-layer board (Copper foil on the back 15mm*15mm)
4.5W
3
Board④：4-layer board (Copper foil on the back 70mm*70mm)
4.0
Board①：θja=62.5°C /W
3.0
Board③：θja=27.8°C/W
Board②：θja=50.0°C/W
2.5W
2
Board④：θja=20.2°C/W
2.0
2.0W
1
1.0
0
25
50
75
100
125
150
Ambient
Temperature
: Ta [°C]
Ambient
Temperature：Ta[℃]
Figure 9. HTSSOP-B54 Derating Curve
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BD63730EFV
Ordering Information
B
D
6
3
7
ROHM Model
3
0
E
F
V
Package type
EFV : HTSSOP-B54
-
E2
Packing, Forming specification
E2: Reel-wound embossed taping
Marking Diagram
HTSSOP-B54 (TOP VIEW)
Part Number Marking
BD63730EFV
LOT Number
1PIN MARK
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BD63730EFV
Physical Dimension, Tape and Reel Information
Package Name
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HTSSOP-B54
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001