BAT20J ® HIGH EFFICIENCY SWITCHING AND ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 23 V IR 25°C(max) @ 15V 12 µA Tj (max) 150 °C A FEATURES AND BENEFITS Low conduction losses Very low reverse current Negligible switching losses Low capacitance diode Low forward and reverse recovery times Extremely fast switching Surface mount device K ■ SOD-323 ■ ■ ■ ■ ■ ■ DESCRIPTION The BAT20J is using 23V schottky barrier diode encapsulated on a SOD-323 package. This is specially suited for switching mode in mobile phone and PDA power management applications or LED driver circuits (step up converters). ABSOLUTE RATINGS (limiting values) Symbol * : Parameter VRRM Repetitive peak reverse voltage IF(RMS) Repetitive peak forward current Value Unit 23 V 2 A 1 A 5 A - 65 to +150 °C δ = 0.38 IF(AV) Average forward current IFSM Surge non repetitive forward current (tp=10ms sinusoidal) Tstg Maximum storage temperature range Tj Maximum operating junction temperature * 150 °C TL Maximum temperature for soldering during * 260 °C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) Order code Part Number BAT20JFILM April 2004 - Ed: 1 Marking 20 1/5 BAT20J THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to Ambient (*) Value Unit 600 °C/W (*) Mounted on epoxy board without copper heat sink. STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters IR * Reverse leakage current (see note 1) Tj = 25°C IR * Reverse leakage current Forward voltage drop VF ** Tests conditions Min. Typ. Max. Unit VR = 5 V VR = 8 V VR = 15 V 0.65 0.88 3.00 2 3 12 µA Tj = 85°C VR = 5 V VR = 8 V VR = 15 V 55 70 120 120 150 250 Tj = 25°C IF = 10 mA IF = 100 mA IF = 1 A 0.28 0.35 0.54 0.31 0.40 0.62 V Typ. Max. Unit 20 30 pF * Pulse test tp = 380 µs, δ < 2% ** Pulse test tp = 5 ms, δ < 2% Note 1: IR at 23 V and Tj = 25°C is equal to 60 µA typ. DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Parameters Cd Diode capacitance Tests conditions VR = 5 V F = 1 MHz To evaluate the maximum conduction losses, use the following equations : P = 0.32 x IF(AV) + 0.23 x IF2(RMS) 2/4 Min. BAT20J Fig. 1: Peak forward current versus ambient temperature (δ = 0.11). Fig. 2: Average forward current versus ambient temperature ( δ = 0.5). IF(AV)(A) IP(A) 0.40 3.0 Printed circuit board FR4 SCU=2.25mm2 2.5 Printed circuit board FR4 SCU=2.25mm2 0.35 0.30 2.0 0.25 0.20 1.5 0.15 1.0 0.10 T 0.5 δ=tp/T 0.0 0 0.05 Tamb(°C) tp T δ=tp/T 0.00 25 50 75 100 125 150 Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration . 0 Tamb(°C) tp 25 50 75 100 125 150 Fig. 4: Reverse leakage currrent versus reverse voltage applied (typical values). IR(µA) Zth(j-a)/Rth(j-a) 1.E+04 1.E+00 Tj=150°C Single pulse 2 SCU=2.25mm 1.E+03 1.E-01 Tj=85°C 1.E+02 1.E+01 1.E-02 Tj=25°C 1.E+00 tp(s) VR(V) 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Fig. 5: Relative variation of reverse leakage currrent versus junction temperature (typical values). 1.E-01 0 2 4 6 8 10 12 14 16 18 20 22 24 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). IR(Tj) / IR(Tj=25°C) C(pF) 1.E+04 100 F=1MHz VOSC=30mVRMS Tj=25°C VR=5V 1.E+03 1.E+02 10 1.E+01 1.E+00 VR(V) Tj(°C) 1 1.E-01 0 25 50 75 100 125 150 1 10 100 3/5 BAT20J Fig. 7-1: Forward voltage drop versus forward current (typical values, high level). Fig. 7-2: Forward voltage drop versus forward current (low level). IFM(A) IFM(A) 1.0 1.E+01 0.9 Tj=150°C Tj=150°C (typical values) 0.8 1.E+00 0.7 1.E-01 0.6 Tj=85°C Tj=85°C (typical values) Tj=25°C (typical values) 0.5 1.E-02 0.4 0.3 Tj=25°C 1.E-03 Tj=25°C (maximum values) 0.2 0.1 VFM(V) 1.E-04 VFM(V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, e CU =35µm, typical values). 0.0 0.2 0.3 0.4 0.5 0.6 0.7 Fig. 9: Thermal resistance junction to ambient versus power dissipation (epoxy printed circuit board FR4, e CU =35µm, typical values). Rth(j-a)(°C/W) Rth(j-a)(°C/W) 600 700 550 650 SCU=2.25mm2 Tamb=25°C 600 500 550 450 500 400 450 350 400 300 350 250 300 250 200 200 150 150 100 100 50 SCu(mm²) P(mW) 50 0 0 0 4/5 0.1 5 10 15 20 25 30 35 40 45 50 0 50 100 150 200 250 300 350 400 BAT20J PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS H A1 REF. b Min. A E A D c Q1 L ■ Millimeters Max. Inches Min. 1.13 Max. 0.045 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.35 0.044 0.053 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Ordering type Marking Package Weight Base qty Delivery mode BAT20JFILM 20 SOD-323 0.005g 3000 Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2004 STMicroelectronics - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - United States www.st.com 5/5