AXN(5/6)
For board-to-board
Narrow pitch connectors
(0.5mm pitch)
m
8m
6.
m
4m
4.
Socket
Floating type
P5 Series
FEATURES
APPLICATIONS
1. The 0.5mm pitch stacking connector
with a built-in floating mechanism.
2. Further reduction of equipment size
is now possible.
Small mobile equipment, such as mobile
phones, PHSs, and PDAs
Header
25.9
Approx. 43%
reduction in
base area
What is a floating structure?
The header is a two-piece structure that
can absorb any variation caused when
a connector (header and socket) is
integrated into a printed circuit board.
(When two sets of connectors are used
as shown below, a maximum deviation
of 0.3mm can be absorbed.)
14.9
6.83
6.8
RoHS compliant
P8 series with 50 contacts
(0.8mm pitch)
P5 series with 50 contacts
(0.5mm pitch)
• Floating structure
3. The original structure ensures
higher reliability performance for both
electrical and mechanical
connections.
• Flux-creeping prevention structure
(header)
• Simple lock mechanism
4. Automatic Mounting
• Embossed tape packaging is standard.
5. Porosity treatment applied for
improved resistance against corrosion
Socket
0.15mm
0.15mm
Header
Header side: Two-piece structure
ORDERING INFORMATION
AXN
5
G
5: Narrow Pitch Connector P5 Floating type
(0.5 mm pitch) Socket
6: Narrow Pitch Connector P5 Floating type
(0.5 mm pitch) Header
Number of pins (2 digits)
Mated direction / Mated height
<Socket>
0: For SMD vertical mating, mated height 5.0 mm
<Header>
5: For SMD vertical mating, mated height 5.0 mm
Functions
<Socket>
4: Without soldering terminals, without positioning bosses
<Header>
8: With floating function, without soldering terminals, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
5: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface
Packing
G: 1,000 pieces embossed tape and plastic reel × 2
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
ACCTB18E 201201-T
AXN(5/6)
PRODUCT TYPES
Mated height
No. of pins
5.0 mm
20
30
40
50
60
80
100
Part No.
Socket
AXN520045G
AXN530045G
AXN540045G
AXN550045G
AXN560045G
AXN580045G
AXN500045G
Packing quantity
Inner carton (1 reel)
Outer carton
Header
AXN620585G
AXN630585G
AXN640585G
AXN650585G
AXN660585G
AXN680585G
AXN600585G
1,000 pcs.
2,000 pcs.
Note) Connectors are available in a standard embossed tape package (1,000 pcs/lot). Minimum ordering quantity is a single reel.
Samples for mounting confirmation: Available in units of 50 pieces. Please consult us. (See “Regarding sample orders to confirm proper mounting” on page 170.)
Samples: Small lot orders for the above models are possible.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Specifications
0.2A
60V AC/DC
150V AC for 1 min.
Min. 1000MΩ
Contact resistance
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Conditions
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance measurement method specified by
JIS C 5402.
Max. 80mΩ
Composite insertion force
Composite removal force
Contact holding force
Ambient temperature
Max. 0.981N {100gf} × no. of pins (initial)
Min. 0.0785N {8gf} × no. of pins
Min. 2.94N {300gf}/2 pin contacts
–55°C to +85°C
Soldering heat resistance
Max. peak temperature of 245°C (on the surface
of the PC board around the connector terminals)
300°C within 5 seconds
Thermal shock resistance
(header and socket mated)
5 cycles,
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
SO2 resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
Insertion and removal life
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
48 hours,
contact resistance max. 80mΩ
48 hours,
contact resistance max. 80mΩ
20 times
Measuring the maximum force. As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
Sequence
1. –55 –30 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 +30 °C, 30 minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Bath temperature 35±2°C, saltwarter concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Bath temperature 40±2°C, gas concentration 10±3 ppm,
humidity 90 to 95% R.H.
Repeated insertion and removal speed of max. 200 times/hours
30 pin contacts; Socket: 0.19g Header: 0.32g
50 pin contacts; Socket: 0.29g Header: 0.50g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
Heat-resistant resin (UL94V-0)
Contact/post
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
DIMENSIONS (Unit: mm)
• Socket
A
B±0.1
ACCTB18E 201201-T
5.40
4.50
7.00
9.50
12.00
14.50
19.50
24.50
4.40
7.40
9.90
12.40
14.90
17.40
22.40
27.40
1.02
B±0.05
0.50±0.05
0.50±0.05
0.25±0.05
1.07
B
0.
5
A
C
No. of
pins
20
30
40
50
60
80
100
3.60
Dimension table (mm)
Suction face 1.80
3.05
60 0.10
60 0.12
1.07
Contact
Contact
0.50±0.05
0.50±0.05
0.20±0.03
1.46±0.05
Recommended PC board pattern
(TOP VIEW)
0.125±0.05
0.75±0.05
General tolerance: ±0.2
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
AXN(5/6)
• Header
30
40
50
60
80
100
9.90
12.40
14.90
17.40
22.40
27.40
7.00
9.50
12.00
14.50
19.50
24.50
3.80±0.1
B
4.50
0.75
A
7.40
5
0.
C
No. of
pins
20
B±0.05
0.50±0.05
0.50±0.05
0.25±0.05
6.80
4.40
Dimension table (mm)
MAX.6.00
3.88
60 0.10
60 0.12
0.75
Contact
Contact
7.80
Suction face 1.80
A
B±0.1
0.50±0.05
0.50±0.05
0.20±0.03
Resist is
recommended
4.50±0.1
Recommended PC board pattern
(TOP VIEW)
0.125±0.05
0.75±0.05
Resist is recommended
General tolerance: ±0.2
5.00±0.3
• Socket and Header are mated
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806-1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
• Plastic reel dimensions (Conforming to EIAJ ET–7200B)
B
C
12.0
Top cover tape
4
2
Pull out direction
4
2
1.75
380 dia.
1.75
Pull out direction
Taping reel
D±1
A±0.3
C
Embossed carrier tape
Embossed mounting-hole
12.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
Dimension table (mm)
Mated height
Socket and header
are common: 5.0mm
No. of pins
Type of taping
A
B
C
D
Quantity per reel
20 to 60
80
100
Tape I
Tape II
Tape II
24.0
32.0
44.0
—
28.4
40.4
11.5
14.2
20.2
25.4
33.4
45.4
1,000
1,000
1,000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P5 Floating type
Direction
of tape progress
Socket
Header
This corner is oriented on the C side.
Panasonic Corporation
Automation Controls Business Unit
This corner is oriented on the C side.
industrial.panasonic.com/ac/e
ACCTB18E 201201-T
AXN(5/6)
NOTES
1. Preventing vibration and shock
To prevent the PC board from drop-off
faults and to protect soldered spots from
direct stress, use vibration-proof pads
across boards.
Fix the PC boards in place or install a
stopper so that the gap between the
connectors is less than 0.5 mm and that
their mating is level.
Max. 0.5 mm
gap when mated
Parallel
2. Prevention of reverse mating
The socket and header are protected
from reverse mating by a molded resin
key. Excessive mating force may damage
the key, so be sure to match chamfered
corners when mating.
Mating state
B1
A1
A2
B2
Chamfered corner
3. Static electricity
This type of socket has the terminals
exposed from the connector walls, and
therefore if they are touched with
anything metal, a short circuit will occur.
Also, if the terminals are touched by
hand, the static electricity may damage
the IC.
4. About floating-type connectors
(1) When two floating-type connectors
are used on header, distance tolerance
between connectors is 0.3mm max.
a. Horizontal
A
B
ACCTB18E 201201-T
(2) If rotational error exists between two
connectors, distance tolerance between
the two connectors is as follows:
• Floating type
Panasonic Corporation
b. Vertical
A
However, A1 is mated with A2, and B1 is
mated with B2.
(3) Please consult us regarding allowable
installation pitch tolerance between
connectors when using two connectors
that have differing number of terminals.
Please refer to the latest product
specifications when designing your
product.
B
Automation Controls Business Unit
industrial.panasonic.com/ac/e
NOTES FOR USING SMD TYPE CONNECTORS (Common)
NOTES FOR USING SMD TYPE CONNECTORS (Common)
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
Panasonic Corporation
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Automation Controls Business Unit
industrial.panasonic.com/ac/e
ACCTB10E 201201-T
NOTES FOR USING SMD TYPE CONNECTORS (Common)
Regarding soldering
For products other than the ones above,
please refer to the latest product
specifications.
6) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
7) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
Apply the solder
wire here
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
ld
iro erin
n g
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
So
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) See the specifications and drawings
for the product in question for the metal
mask pattern diagrams.
4) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
5) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
(except P5 floating and P8 type)
Temperature
Peak temperature
Peak temperature 260°C
230°C
180°C
150°C
Terminal
Small angle as
possible up to
45 degrees
220°C
200°C
Preheating
25 sec.
60 to 120 sec.
PC board
70 sec.
Time
Pattern
• Narrow-pitch connector (P5 floating, P8)
Temperature
Peak temperature
245°C max.
200°C
155 to 165°C
Preheating
60 to 120 sec.
Within 30 sec.
Time
ACCTB10E 201201-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
NOTES FOR USING SMD TYPE CONNECTORS (Common)
Handling Single
Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not use alcohol for cleaning. Doing
so may whiten the surface of molded
parts.
Cleaning flux from PC board
Handling the PC board
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive forces.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
The soldered areas should not be subjected to forces.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
ACCTB10E 201201-T