Material Content Data Sheet Sales Product Name SGP20N60 MA# MA000892062 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2031.58 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7439-89-6 7723-14-0 7440-50-8 4.308 0.21 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.21 2121 2121 402 0.245 0.01 815.335 40.13 40.18 401329 121 401853 2.992 0.15 0.15 1473 1473 5.932 0.29 2920 112.713 5.55 474.583 23.36 29.20 233603 292004 21.462 1.06 1.06 10564 10564 0.244 0.01 0.001 0.00 0.271 0.01 0.679 0.03 1.764 0.09 0.590 0.03 0.177 0.01 589.466 29.02 55481 120 0.01 1 334 0.13 868 2. 3. 87 29.06 290151 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1336 291 Important Remarks: 1. 120 134 290529 1000000