BUF18830 SBOS408A – MAY 2011 – REVISED JUNE 2011 www.ti.com Programmable GAMMA-VOLTAGE GENERATOR with Two High Slew Rate VCOMs Check for Samples: BUF18830 FEATURES DESCRIPTION • • The BUF18830 offers 18 programmable gamma channels and two programmable VCOM channels. 1 2 • • • • • • • 10-BIT RESOLUTION 18-CHANNEL P-GAMMA: – 300-mV Min Swing-to-Rail (10 mA) TWO-CHANNEL P-VCOM: – 400-mA Typical IOUT HIGH SLEW RATE VCOM: 45 V/μs RAIL-TO-RAIL OUTPUT LOW SUPPLY CURRENT SUPPLY VOLTAGE: 6.5 V to 20 V DIGITAL SUPPLY: 2.0 V to 5.5 V TWO-WIRE INTERFACE: Supports 400 kHz and 3.4 MHz All gamma and VCOM channels offer a rail-to-rail output that typically swings to within 300 mV of either supply rail with a 10-mA load. All channels are programmed using a two-wire interface that supports standard operations up to 400 kHz and high-speed data transfers up to 3.4 MHz. The BUF18830 is manufactured using Texas Instruments’ proprietary, state-of-the-art, high-voltage CMOS process. This process offers very dense logic and high supply voltage operation of up to 20 V. The BUF18830 is offered in a QFN-38 package and is specified from –40°C to +85°C. APPLICATIONS • TFT-LCD AND OLED REFERENCE DRIVERS BUF18830 VS Gamma DAC Registers Gamma DAC Registers VSD DAC OUT0 DAC OUT1 DAC OUT16 DAC OUT17 GNDA A0 SDA SCL Control I/F VCOM DAC Registers GNDD VCOM DAC Registers VS-VCOM DAC VCOM-OUT1 VCOM-Feedback1 DAC VCOM-OUT2 VCOM-Feedback2 GND-VCOM 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated To request a full data sheet, send an email to: [email protected] Include the product name in the subject line of your message. PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BUF18830AIRGFR ACTIVE VQFN RGF 38 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168HRS BUF18830AIRGFT ACTIVE VQFN RGF 38 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jun-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BUF18830AIRGFR VQFN RGF 38 3000 330.0 16.4 5.25 7.25 1.45 8.0 16.0 Q1 BUF18830AIRGFT VQFN RGF 38 250 180.0 16.4 5.25 7.25 1.45 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jun-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BUF18830AIRGFR VQFN RGF 38 3000 346.0 346.0 33.0 BUF18830AIRGFT VQFN RGF 38 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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