ON NL7SB3257 Mux / demux bus switch Datasheet

NL7SB3257
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Mux / Demux Bus Switch
The NL7SB3257 Mux / Demux Bus Switch is an advanced
high−speed line switch in ultra−small footprint.
Features
High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
3 W Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Ultra−Small Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MARKING
DIAGRAMS
ULLGA6
1.0 x 1.0
CASE 613AD
1
V
•
•
•
•
•
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M
G
V
B1
= Specific Device Code
(Rotated 180°)
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
A
ORDERING INFORMATION
B0
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
S
Figure 1. Logic Diagram
B1
1
6
S
GND
2
5
VCC
B0
3
4
A
Figure 2. ULLGA6
(Top View)
Function Table
Input S
Function
L
A = B0
H
A = B1
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. P0
1
Publication Order Number:
NL7SB3257/D
NL7SB3257
Table 1. MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
Control Pin Input Voltage
−0.5 to +7.0
V
VI/O
Switch Input / Output Voltage
−0.5 to +7.0
V
IIK
Control Pin DC Input Diode Current
VIN < GND
−50
mA
IOK
Switch I/O Port DC Diode Current
VI/O < GND
−50
mA
IO
On−State Switch Current
±128
mA
Continuous Current Through VCC or GND
±150
mA
ICC
DC Supply Current per Supply Pin
±150
mA
IGND
DC Ground Current per Ground Pin
±150
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
qJA
Thermal Resistance (Note 1)
ULLGA6
496
°C/W
PD
Power Dissipation in Still Air at 85°C (Note 1)
ULLGA6
252
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
1.
2.
3.
4.
5.
Parameter
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Mode (Note 2)
Machine Mode (Note 3)
Charged Device Mode (Note 4)
Latchup Performance Above VCC and Below GND at 85°C (Note 5)
>2000
>200
N/A
V
±100
mA
Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
Tested to EIA/ JESD22−A114−A
Tested to EIA/ JESD22−A115−A
Tested to JESD22−C101−A
Tested to EIA / JESD78.
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VI
VI/O
Parameter
Positive DC Supply Voltage
Control Pin Input Voltage
Switch Input / Output Voltage
TA
Operating Free−Air Temperature
Dt / DV
Input Transition Rise or Fall Rate
Control Input
Switch I/O
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2
Min
Max
Unit
4.0
5.5
V
0
5.5
V
0
5.5
V
−55
+125
°C
0
0
5
DC
nS/V
NL7SB3257
Table 3. DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
Parameter
Conditions
VCC (V)
IIN = −18 mA
4.5
Min
Typ
TA = −555C to +1255C
Max
Min
−1.2
Max
Unit
−1.2
V
VIK
Clamp Diode Voltage
VIH
High−Level Input Voltage
(Control)
4.0 to 5.5
VIL
Low−Level Input Voltage
(Control)
4.0 to 5.5
0.8
0.8
V
IIN
Input Leakage Current
0 ≤ VIN ≤ 5.5 V
5.5
±0.1
±1.0
mA
IOFF
Power Off Leakage Current
VI/O = 0 to 5.5 V
0
±0.1
±1.0
mA
ICC
Quiescent Supply Current
IO = 0, VIN =
VCC or 0 V
5.5
±0.1
±1.0
mA
DICC
Increase in Supply Current
(Control Pin)
One input at 3.4
V; Other inputs
at VCC or GND
5.5
2.5
mA
RON
Switch ON Resistance
VI/O = 0,
II/O = 64 mA
II/O = 30 mA
4.5
VI/O = 2.4,
II/O = 15 mA
4.5
VI/O = 2.4,
II/O = 15 mA
4.0
2.0
2.0
V
W
3
3
7
7
7
7
6
15
15
10
20
20
Table 4. AC ELECTRICAL CHARACTERISTICS
TA = −555C
to +1255C
TA = 255C
Symbol
Parameter
VCC (V)
Test Condition
See Figure 4
Min
Typ
Max
Min
Max
Unit
0.25
ns
ns
tPD
Propagation Delay,
A to B or B to A
4.0 to 5.5
tEN
Output Enable Time
4.5 to 5.5
0.8
2.5
4.2
0.8
4.2
4.0
0.8
3.0
4.6
0.8
4.6
4.5 to 5.5
0.8
3.1
4.8
0.8
4.8
4.0
0.8
2.9
4.4
0.8
4.4
tDIS
CIN
Output Disable Time
Control Input Capacitance
5.0
CIO(ON)
Switch On Capacitance
5.0
CIO(OFF)
Switch Off Capacitance
5.0
VIN = 3 V or 0
0.25
ns
2.0
pF
Switch ON
10
pF
Switch OFF
5.0
pF
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3
NL7SB3257
AC Loading and Waveforms
TEST
S1
tPD
tPLZ/tPZL
tPHZ/tPZH
Open
7V
GND
7V
500 W
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 W
Output
Waveform 1
S1 at 7 V
(see Note B)
3V
Input
1.5 V
1.5 V
0V
tPHL
tPLH
Output
Waveform 2
S1 at Open
(see Note B)
VOH
1.5 V
1.5 V
Output
3V
Output
Control
LOAD CIRCUIT
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
1.5 V
0V
tPZL
tPLZ
3.5 V
1.5 V
VOL + 0.3 V
tPZH
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The output is measured with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 3. Load Circuit and Voltage Waveforms
DEVICE ORDERING INFORMATION
Device
NL7SB3257CMX1TCG
Package
Shipping†
ULLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL7SB3257
PACKAGE DIMENSIONS
A
B
D
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
0.10 C
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
6X
0.22
e
5X
L
NOTE 4
3
1
1.18
L1
0.53
6
4
6X
1
PKG
OUTLINE
b
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
0.05 C
0.35
PITCH
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NL7SB3257/D
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