APL5501/2/3 Low IQ, Low Dropout 500mA Fixed Voltage Regulator Features • • • • • • • • • Low Noise : 50µVRMS (100Hz to 100kHz) Low Quiescent Current : 50µA (No load) Low Dropout Voltage : 170mV (@500mA) Very low Shutdown Current : < 0.5uA Fixed Output Voltage : 1.3V ~ 3.4V Stable with 4.7uF Output Capacitor Stable with Aluminum, Tantalum or Ceramic Capacitors Reverse Current Protection No Protection Diodes Needed • Built in Thermal Protection • • • • • Built in Current Limit Protection Controlled Short Circuit Current : 150mA Fast Transient Response Short Setting Time SOT-23-5, SOT-89, SOT-89-5, SOT-223, SO-8, TO-252 and TO-252-5 Packages • Design with an internal P-channel MOSFET pass transistor, the APL5501/2/3 maintains a low supply current, independent of the load current and dropout voltage. Other features include reverse current protection, thermal-shutdown protection, current limit protection to ensure specified output current and controlled short-circuit current. The APL5501/2/3 regulator comes in a miniature SOT-23-5, SOT-89, SOT89-5, SOT-223, SO-8, TO-252 and TO-252-5 packages. Pin Configuration APL5501 BP GND SHDN TAB is GND 5 1 2 V IN GND 3 4 1 2 V OUT GND VOUT 3 V IN Lead Free Available (RoHS Compliant) SOT-89 (Top View) SOT-89-5 (Top View) Applications Notebook Computer PDA or Portable Equipments Noise-Sensitive Instrumentation Systems General Description IN 1 8 OUT GND 2 7 GND GND 3 6 GND SHDN 4 5 BYP V IN 1 GND 2 SHDN 3 SO-8 (Top View) The APL5501/2/3 is micropower, low noise, low dropout linear regulator. Operate from 2.7V to 6V input voltage and deliver up to 500mA. Typical output noise is just 50µVRMS with the addition of an external 0.1µF bypass capacitor in BP pin and typical dropout voltage is only 170mV at 500mA loading . Designed for use in battery-powered system, the low 50uA quiescent current makes it an ideal choice. 5 V OUT 4 BP SOT-23-5 (Top View) V IN 5 4 3 3 2 GND 2 1 VOUT BP SHDN 1 GND TAB is GND • • • VIN V OUT TO-252 (Top View) TO-252-5 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 1 www.anpec.com.tw APL5501/2/3 Pin Configuration (Cont.) APL5501 APL5502 TAB is GND APL5502 APL5503 TAB is V IN TAB is GND TAB is V IN 1 2 3 V IN GND V OUT SOT-223 (Top View) 1 2 GND V IN 3 V OUT SOT-89 (Top View) 1 2 3 GND V IN V OUT SOT-223 (Top View) 1 2 3 V O U T GND V IN SOT-223 (Top View) Ordering and Marking Information Package Code B : SOT-23-5 D : S OT-89 D5 : SOT-89-5 U : TO-252 U5 : TO-252-5 V : SOT-223 K : SO-8 Temp. Range C : 0 to 70 C H a n d l i n g C o°d e TR : Tape & Reel Voltage Code : 13 : 1.3V ~ 34 : 3.4V Lead Free Code L : Lead Free Device Blank : Original Device APL5501/2/3 Lead Free Code Handling Code Temp. Range Package Code Voltage Code APL5501/2/3 - 13 D/V/K : APL5501/2/3 XXXXX13 XXXXX - Date Code , 13 - 1.3V APL5501/2/3 - 13 U : 13 APL5501/2/3 XXXXX XXXXX - Date Code , 13 - 1.3V Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. Marking Information SOT-23-5 package Product Name Marking Product Name APL5501-13B 517X APL5501-21B APL5501-14B 518X APL5501-22B APL5501-15B 519X APL5501-23B APL5501-16B 51AX APL5501-24B APL5501-17B 51BX APL5501-25B APL5501-18B 51CX APL5501-26B APL5501-19B 51DX APL5501-27B APL5501-20B 51EX The last character “X” in the marking is for data code. Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 2 Marking 51FX 51GX 51HX 51IX 51JX 51KX 51LX Product Name APL5501-28B APL5501-29B APL5501-30B APL5501-31B APL5501-32B APL5501-33B APL5501-34B Marking 51MX 51NX 51OX 51PX 51QX 51RX 51SX www.anpec.com.tw APL5501/2/3 Pin Description PIN Name V IN No. 1 SHDN 3 (Note1) 2 GND 4 5 BP (Note1) V OUT I/O Description I Supply voltage input. Shutdown control pin, low = off , high = normal. Don’t leave open. Ground pins of the circuitry, and all ground pins must be soldered to PCB with proper power dissipation. Bypass signal pin in fixed output type device Output pin of the regulator. I O O Note1: These pins do not exist in 3-pin package. Absolute Maximum Ratings Symbol VIN, VOUT SHDN Parameter Input Voltage or Out Voltage Shutdown Control Pin RTH,JA Thermal Resistance - Junction to Ambient RTH,JC Thermal Resistance - Junction to Case PD Power Dissipation TJ Operating Junction Temperature Control Section Power Transistor TSTG TL Storage Temperature Range Lead Temperature (Soldering, 10 second) Rating 6.5 Unit V 6.5 V SOT-89 : 180 SOT-223 : 135 SO-8 : 150 SOT-23-5 : 260 SOT-89 : 38 SOT-223 : 15 SO-8 :20 SOT-23-5 : 130 Internally Limited °C/W °C/W W °C 0 to 125 0 to 150 °C °C -65 to +150 260 Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C. Symbol VIN V OUT Parameter Test Conditions Input Voltage Output Voltage 2.7 VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2% Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 APL5501/2/3 Min. Typ. Max. 3 VOUT Unit 6 V VOUT +2% V www.anpec.com.tw APL5501/2/3 Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C. Symbol Parameter Test Conditions ILIMIT Circuit Current Limit V IN =4.3V ISHORT Short Current Load Current V OUT=0V IOUT PSRR IQ Dropout Voltage (Note2) Ripple Rejection Quiescent Current Shutdown Supply (Note3) Current Noise (Note3) Shutdown Recovery (Note3) Delay OTS C OUT ISHDN V OUT+0.5V< V CC <6.0V, IOUT = 1mA V IN =V OUT +1.0V, 0mA< I OUT < IMAX 1.3V≤V OUT <1.5V515X Typ. Max. 0.7 A 200 mA IOUT =500mA mA 4 1 0.1 1100 1300 1.5V≤V OUT <2V 900 1050 2V≤V OUT <2.5V 500 700 2.5V≤V OUT <3.4V 280 380 F≤1kHz, 1Vpp at V IN = VOUT +1.0V C =10nf No load 55 10 6 65 50 100 370 450 Shutdown = low IOUT =0, V CC =6.0V 0.01 1 100Hz<f<100kHz, typical load, C BP =0.01µF, C OUT = 1µF 100Hz<f<100kHz, typical load, C BP =0.1µF, C OUT = 1µF C BP =0.01µF,C OUT =1µF, no load C BP =0.1µF,C OUT=1µF, no load mV mV % mV dB IOUT =500mA µA µA µVrms 50 40 Over Temperature Shutdown Over Temperature Shutdown Hysteresis TC Min. Unit 500 REG LINE Line Regulation REG LOAD Load Regulation VDROP APL5501/2/3 Hysteries Output Voltage Temperature Coefficient 7 70 ms 150 °C 10 °C 50 ppm/ °C Output Capacitor 4.2 4.7 5.2 µF ESR Shutdown Input (Note3) Threshold Shutdown input Bias (Note3) current Input Reverse Leakage current Reverse Protection Threshold 0.02 0.1 1 Ohm 0.4 0.7 1.6 V 0.01 100 nA 0.1 0.5 µA 11 50 mV V OUT+1.0V< V IN <6.0V V SHDN =V IN V OUT-VIN =0.1V Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V Note 3 : For 5-pin devices only. Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 4 www.anpec.com.tw APL5501/2/3 Application Circuit INPUT 2.7V to 6V V IN V OUT VOUT APL5501/2/3 C IN 1uF BP SHDN on C OUT 4.7uF GND off C BP Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 5 0.1uF www.anpec.com.tw APL5501/2/3 Typical Characteristics Ground Pin Current vs. Load Current (uA) Current Limit vs. Input Voltage APL5501/2/3-33 3 Current Limit (mA) 2.5 2 1.5 1 0.5 0 3.5 4 4.5 5 5.5 6 Ground Pin Current vs. Output Current APL5501/2/3-33 400 350 300 250 200 150 100 50 0 0 150 Ground Pin Current vs. Input Voltage 600 750 900 Input Voltage vs. Output Voltage APL5501/2/3-33 APL5501/2/3-33 3.5 3 300 Output Voltage (V) Ground Pin Current vs. Load Current (uA) 450 Output Current (mA) Input Voltage (V) 350 300 250 200 150 100 2.5 2 1.5 1 0.5 50 0 0 0 1 2 3 4 5 0 6 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 1 2 3 4 5 6 Input Voltage (V) 6 www.anpec.com.tw APL5501/2/3 Typical Characteristics Output Current vs. Output Voltage Dropout Voltage vs. Output Current 1200 APL5501/2/3-33 0 1100 VOUT=1.5V -2 Output Current (uA) Dropout Voltage (mV) 1000 900 800 VOUT=1.8V 700 600 500 400 VOUT=3.3V 300 VOUT=2.5V 200 -4 VIN=0V -6 -8 -10 100 0 -12 0 100 200 300 400 500 0 0.5 1 Output Current (mA) 1.5 2 2.5 Output Voltage (V) SHDN Threshold Voltage vs. Input Voltage PSRR vs. Frequency APL5501/2/3-33 APL5501/2/3-33 1 3 0.9 -20 0.8 VIN=0V PSRR (dB) SHDN Threshold Voltage (V) +0 -10 0.7 0.6 VIN=4V -30 -40 IOUT =50mA COUT=10uF CBP=0.1uF -50 -60 -70 0.5 VIN=5V -80 -90 0.4 3 3.5 4 4.5 5 5.5 -100 6 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k 200k Frequency (HZ) 7 www.anpec.com.tw APL5501/2/3 Typical Characteristics Output Noise vs. Bypass Capacitor Output Noise APL5501/2/3-33 100u 500 450 400 40u Output Noise (uV) VOUT (50uV/div) VIN=4.3V 80u IOUT =0mA COUT=10uF 60u CBP=0.1uF 20u 0 -20u -40u -60u 350 300 250 200 150 100 50 -80u -100u 0 0 4m 2m 6m 8m 10m 0 0.1 0.2 0.3 Bypass Capacitor (uF) Time (s) Shutdown Exit Delay Shutdown Exit Delay APL5501/2/3-33 APL5501/2/3-33 3.3V 3.3V VOUT 0.4 VOUT CBP=10nF No Load CBP=100nF No Load 0V 0V 4V 4V vSHDN vSHDN 0V 0V Time (1ms/div) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Time (20ms/div) 8 www.anpec.com.tw APL5501/2/3 Typical Characteristics Region of Stable ESR vs. Load Current Entering Shutdown APL5501/2/3-33 APL5501/2/3-33 1 3.3V VOUT=3.3V COUT ESR (Ω) VOUT COUT=1µF No Load 0V 4V 0.1 stable 0.01 unstable 0V 0.001 0 300 450 600 Output Voltage vs. Temperature 900 Line-Transient Response APL5901/2-33 APL5501/2/3-33 Output Voltage (20mV/div) 3.35 750 Load Current (mA) Time (200ms/div) 3.33 Output Voltage (V) 150 3.31 3.29 3.27 VIN 4V 3V VOUT 3.25 -40 0 40 80 120 Temperature (°C ) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Time (40µs/div) 9 www.anpec.com.tw APL5501/2/3 Typical Characteristics Load-Transient Response Output Voltage (50mV/div) APL5501/2/3-33 VOUT COUT=1µF VIN=VOUT+1V IOUT=1mA~500mA Time (10µs/div) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 10 www.anpec.com.tw APL5501/2/3 Application Information Capacitor Selection and Regulator Stability end-of-life battery voltage. Because the APL5501/2/3 use a p-channel MOSFET pass transistor, the dropout voltage is a function of drain-to-source on-resistance (RDS(ON)) multiplied by the load current. The APL5501/2/3 use at least a 1uF capacitor on the input, and this capacitor can be Aluminum, Tantalum or Ceramic capacitor. The input capacitor with larger value and lower ESR provides better PSRR and linetransient response. The output capacitor also can use Aluminum, Tantalum or Ceramic capacitor, and a minimum v alue of 1uF and ESR abov e 0.06Ω is recommended. The curve of the stable region in typical characteristics shows the appropriate output capacitor ESR for different load current stable operation. A larger output capacitor can reduce noise and improve load-transient response, stability, and PSRR. Note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. When using this capacitor, a minimum 10uF or more may be required to ensure the stability at low temperature operation. Use a bypass capacitor at BP pin for low output nvise. Increasing the capacitance will slightly decrease the output noise, but increase the start-up time. Reverse Current Protection The APL5501/2/3 have an internal reverse protection, it does not need an external schottky diode to connect the regulator input and output. If the output voltage is forced above the input voltage by more than 11mV, the IC will be shutdown and the ground pin current is below 0.1uA. Shutdown/Enable The APL5501/2/3 have an active high enable function. Force EN high (>1.6V) enables the regulator, EN low (<0.4V) disables the regulator and enter the shutdown mode. In shutdown mode, the quiescent current can reduce below 1uA. The EN pin cannot be floating, a floating EN pin may cause an indeterminate state on the output. If it is no use, connect to VIN for normal operation. Load-Transient Considerations The APL5501/2/3 load-transient response graphs in Current Limit typical characteristics show the transient response. A step change in the load current from 0mA to 500mA at 1us will cause a 100mV transient spike. Larger output capacitor and lower ESR can reduce transient The APL5501/2/3 have a current limit protection. The ouptut voltage will drop close to zero volt, when load current reaches the limit, and then the load current will be limited at 150mA after output voltage is below 0.7V. When the load current back to the value where limiting started, the output voltage and current will return to normal value. When output is shorted to ground, the APL5501/2/3 will keep short circuit current at 150mA . spike. Input-Output (Dropout)Voltage The minimum input-output voltage difference (dropout) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 11 www.anpec.com.tw APL5501/2/3 Thermal Protection Thermal protection limits total power dissipation in the device. When the junction temperature exceeds TJ=+150℃, the thermal sensor generates a logic signal to turn off the pass transistor and allows IC to cool. When the IC’s junction temperature is down by 10℃, the thermal sensor will turn the pass transistor on again, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the APL5501/2/3 in the event of fault conditions. For continuous operation, do not exceed the absolute maximum junction temperature of TJ=+150℃. Operating Region and Power Dissipation The thermal resistance of the case to circuit board, and the rate of air flow all control the APL5501/2/3’s maximum power dissipation. The power dissipation across the device is PD = IOUT (VIN-VOUT) and the maximum power dissipation is: PDMAX = (TJ-T A) / (θ JC + θ CA) where TJ-TA is the temperature difference between the junction and ambient air, θ JC is the thermal resistance of the package, and θ CA is the thermal resistance through the printed circuit board, copper traces, and other materials to the ambient air. The GND pin of the APL5501/3 provide an electrical connection to ground and channeling heat away. If power dissipation is large, connect the GND pin to ground using a large pad or ground plane, can improve the problem of over heat of IC. Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 12 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-23-5 e1 5 4 E1 1 E 3 2 e b D A2 A a A1 Dim A A1 A2 D E E1 L L1 L2 N α L Millimeters Min. 0.95 0.05 0.90 2.8 2.6 1.5 0.35 Inches Max. 1.45 0.15 1.30 3.00 3.00 1.70 0.55 Min. 0.037 0.002 0.035 0.110 0.102 0.059 0.014 0.7 0.020 10° 0° 0.20 BSC 0.5 Max. 0.057 0.006 0.051 0 . 11 8 0 . 11 8 0.067 0.022 0.008 BSC 5 0° Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 L2 L1 0.028 5 13 10 ° www.anpec.com.tw APL5501/2/3 Packaging Information E e1 0.015X45 SOP-8 pin ( Reference JEDEC Registration MS-012) H e2 D A1 A 1 L 0.004max. Dim Millimeters Inches Min. Max. Min. Max. A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC φ 1 8° 8° Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 14 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-223( Reference JEDEC Registration SOT-223) D A B1 a c H E L K e A1 e1 b B Dim A A1 B B1 c D E e e1 H L K α β Millimeters Min. 1.50 0.02 0.60 2.90 0.28 6.30 3.30 Min. 0.06 Max. 0.07 0.02 0.11 0.01 0.25 0.13 0.03 0.12 0.01 0.26 0.15 2.3 BSC 4.6 BSC 6.70 0.91 1.50 0° Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Inches Max. 1.80 0.08 0.80 3.10 0.32 6.70 3.70 0.09 BSC 0.18 BSC 7.30 1.10 2.00 10° 13° 0.26 0.04 0.06 0° 0.29 0.04 0.08 10° 13° 15 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-89 (Reference EIAJ ED-7500A Reg stration SC-62) D D1 a E H 1 2 3 L C B1 B e e1 A a Dim A B B1 C D D1 e e1 E H L α Millimeters Min. 1.40 0.40 0.35 0.35 4.40 1.35 Min. 0.055 0.016 0.014 0.014 0.173 0.053 1.50 BSC 3.00 BSC 2.29 3.75 0.80 Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Inches Max. 1.60 0.56 0.48 0.44 4.60 1.83 Max. 0.063 0.022 0.019 0.017 0.181 0.072 0.059 BSC 0.118 BSC 2.60 4.25 1.20 10° 16 0.090 0.148 0.031 0.102 0.167 0.047 10° www.anpec.com.tw APL5501/2/3 Packaging Information SOT-89-5 Dim A B C D E F G H I J K L Millimeters Min. 4.40 4.05 1.50 1.30 2.40 0.80 Min. 0.17 0.16 0.06 0.05 0.09 0.03 3.00 REF 1.50 REF 0.40 1.40 0.35 Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Inches Max. 4.60 4.25 1.70 1.50 2.60 - Max. 0.18 0.17 0.07 0.06 0.1 0.12 REF 0.06 REF 0.52 1.60 0.41 5 TYP 0.01 0.05 0.01 0.02 0.06 0.02 0.2 TYP 17 www.anpec.com.tw APL5501/2/3 Packaging Information TO-252( Reference JEDEC Registration TO-252) E A b2 C1 L2 D H L1 L b C e1 Dim A1 Millimeters Inches Min. Max. Min. Max. 2.18 2.39 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 C 0.46 0.58 0.018 0.023 C1 0.46 0.58 0.018 0.023 D 5.334 6.22 0.210 0.245 E 6.35 6.73 0.250 0.265 e1 3.96 5.18 0.156 0.204 H 9.398 10.41 0.370 0.410 L 0.51 L1 0.64 1.02 0.025 0.040 L2 0.89 2.032 0.035 0.080 A Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 0.020 18 www.anpec.com.tw APL5501/2/3 Packaging Information TO-252-5 H A J D M C B K L S Dim A B C D P S H J K L M P Millimeters Min. 6.40 5.20 6.80 2.20 Inches Max. 6.80 5.50 7.20 2.80 1.27 REF Max. 0.26 0.21 0.27 0.11 0.05 REF 0.50 2.20 0.45 0 0.90 5.40 0.80 2.40 0.55 0.15 1.50 5.80 Copyright ANPEC Electronics Corp. 19 Rev. B.2 - May., 2005 Min. 0.25 0.20 0.26 0.08 0.02 0.08 0.01 0 0.03 0.21 0.03 0.09 0.02 0.006 0.06 0.22 www.anpec.com.tw APL5501/2/3 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25 °C to Peak Time Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. (mm) Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 20 www.anpec.com.tw APL5501/2/3 Classification Reflow Profiles(Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s 3 3 Package Thickness Volume mm Volume mm <350 ≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 SEC 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 100mA Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ko Ao Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 D1 21 www.anpec.com.tw APL5501/2/3 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Reel Dimensions Application SOP- 8 Application SOT-89 Application SOT-223 Application TO-252 A B C J T1 T2 W P E 330 ± 1 62 +1.5 12.75+ 0.15 2 ± 0.5 12.4 ± 0.2 2 ± 0.2 12 ± 0. 3 8± 0.1 1.75 ±0.1 F D D1 Po P1 Ao Bo Ko t 5.5 ± 1 1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0. 1 2.1 ± 0.1 0.3 ±0.013 A B C J T1 T2 P E 178 ±1 70 ± 2 13.5 ± 0.15 3 ± 0.15 14 ± 2 1.3 ± 0.3 W 12 + 0.3 12 - 0.1 8 ± 0.1 1.75± 0.1 F D D1 Po P1 Ao Bo Ko t 5.5 ± 0.05 1.5± 0.1 1.5 ± 0.1 4.0 ± 0.1 2.0 ± 0.1 4.8 ± 0.1 4.5± 0.1 1.80± 0.1 0.3 ±0.013 A B T1 T2 W P E 62±1.5 C 12.75 ± 0.15 J 330±1 2 ± 0.6 12.4 +0.2 2 ± 0.2 12 ± 0.3 8 ± 0.1 1.75± 0.1 F D D1 Po P1 Ao Bo Ko t 5.5 ± 0.05 1.5+ 0.1 1.5+ 0.1 4.0 ± 0.1 2.0 ± 0.05 6.9 ± 0.1 7.5± 0.1 2.1 ± 0.1 0.3 ±0.05 A B C J T2 E 100 ± 2 13 ± 0. 5 2 ± 0.5 2.5 ± 0.5 W 16+ 0.3 - 0.1 P 330 ±3 T1 16.4 + 0.3 -0.2 8 ± 0.1 1.75± 0.1 F D D1 Po P1 Ao Bo Ko t 7.5 ± 0.1 1.5 +0.1 1.5± 0.25 4.0 ± 0.1 2.0 ± 0.1 6.8 ± 0.1 10.4 ± 0.1 2.5 ± 0.1 0.3 ±0.05 (mm) Cover Tape Dimensions Application SOP- 8 SOT- 89 SOT- 223 TO- 252 Carrier Width 12 12 12 16 Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 Cover Tape Width 9.3 9.3 9.3 13.3 22 Devices Per Reel 2500 1000 2500 2500 www.anpec.com.tw APL5501/2/3 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. B.2 - May., 2005 23 www.anpec.com.tw