Material Content Data Sheet Sales Product Name IPI47N10S-33 MA# MA000532844 Package PG-TO262-3-1 Issued 29. August 2013 Weight* 1575.20 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 7.916 0.50 0.851 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.50 5026 5026 540 0.255 0.02 849.682 53.95 54.02 539411 162 540114 3.172 0.20 0.20 2014 2014 8.791 0.56 5581 96.704 6.14 480.590 30.51 37.21 305097 61392 372070 15.198 0.96 0.96 9648 9648 0.228 0.01 0.001 0.00 0.137 0.01 0.109 0.01 5.219 0.33 0.032 0.00 0.106 0.01 106.210 6.74 145 0.01 1 69 0.35 3313 2. 3. 68 6.75 67426 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3469 20 Important Remarks: 1. 145 87 67514 1000000