DS40MB200
Dual 4 Gb/s 1:2 Mux/Buffer with Input Equalization and
Output Pre-Emphasis
General Description
Features
The DS40MB200 is a dual signal conditioning 2:1 multiplexer and 1:2 fan-out buffer designed for use in backplane
redundancy applications. Signal conditioning features include input equalization and programmable output preemphasis that enable data communication in FR4 backplanes up to 4 Gb/s. Each input stage has a fixed equalizer
to reduce ISI distortion from board traces. All output drivers
have 4 selectable steps of pre-emphasis to compensate for
transmission losses from long FR4 backplanes and reduce
deterministic jitter. The pre-emphasis levels can be independently controlled for the line-side and switch-side drivers.
The internal loopback paths from switch-side input to switchside output enable at-speed system testing. All receiver
inputs and driver outputs are internally terminated with 100Ω
differential terminating resistors
Dual 2:1 multiplexer and 1:2 buffer
1– 4 Gbps fully differential data paths
Fixed input equalization
Programmable output pre-emphasis
Independent switch and line side pre-emphasis controls
Programmable switch-side loopback mode
On-chip terminations
+3.3V supply
Low power, 1W max
Lead-less LLP-48 package (7mmx7mmx0.8mm, 0.5mm
pitch)
n 0˚C to +85˚C operating temperature range
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Functional Block Diagram
20021733
© 2005 National Semiconductor Corporation
DS200217
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DS40MB200 Dual 4 Gb/s 1:2 Mux/Buffer with Input Equalization and Output Pre-Emphasis
August 2005
DS40MB200
Simplified Block Diagram
20021731
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2
DS40MB200
Connection Diagram
20021732
Order number DS40MB200SQ
See NS Package Number SQA48D
3
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DS40MB200
Pin Descriptions
Pin Name
Pin
Number
I/O
Description
LINE SIDE HIGH SPEED DIFFERENTIAL IO’s
LI_0+
LI_0−
6
7
I
Inverting and non-inverting differential inputs of port_0 at the line side. LI_0+ and LI_0−
have an internal 50Ω connected to an internal reference voltage.
LO_0+
LO_0−
33
34
O
Inverting and non-inverting differential outputs of port_0 at the line side. LO_0+ and LO_0−
have an internal 50Ω connected to VCC.
LI_1+
LI_1−
30
31
I
Inverting and non-inverting differential inputs of port_1 at the line side. LI_1+ and LI_1−
have an internal 50Ω connected to an internal reference voltage.
LO_1+
LO_1−
9
10
O
Inverting and non-inverting differential outputs of port_1 at the line side. LO_1+ and LO_1−
have an internal 50Ω connected to VCC.
SWITCH SIDE HIGH SPEED DIFFERENTIAL IO’s
SOA_0+
SOA_0−
46
45
O
Inverting and non-inverting differential outputs of mux_0 at the switch_A side. SOA_0+ and
SOA_0− have an internal 50Ω connected to VCC.
SOB_0+
SOB_0−
4
3
O
Inverting and non-inverting differential outputs of mux_0 at the switch_B side. SOB_0+ and
SOB_0− have an internal 50Ω connected to VCC.
SIA_0+
SIA_0−
40
39
I
Inverting and non-inverting differential inputs to the mux_0 at the switch_A side. SIA_0+
and SIA_0− have an internal 50Ω connected to an internal reference voltage.
SIB_0+
SIB_0−
43
42
I
Inverting and non-inverting differential inputs to the mux_0 at the switch_B side. SIB_0+
and SIB_0− have an internal 50Ω connected to an internal reference voltage.
SOA_1+
SOA_1−
22
21
O
Inverting and non-inverting differential outputs of mux_1 at the switch_A side. SOA_1+ and
SOA_1− have an internal 50Ω connected to VCC.
SOB_1+
SOB_1−
28
27
O
Inverting and non-inverting differential outputs of mux_1 at the switch_B side. SOB_1+ and
SOB_1− have an internal 50Ω connected to VCC.
SIA_1+
SIA_1−
16
15
I
Inverting and non-inverting differential inputs to the mux_1 at the switch_A side. SIA_1+
and SIA_1− have an internal 50Ω connected to an internal reference voltage.
SIB_1+
SIB_1−
19
18
I
Inverting and non-inverting differential inputs to the mux_1 at the switch_B side. SIB_1+
and SIB_1− have an internal 50Ω connected to an internal reference voltage.
I
A logic low at MUX_S0 selects mux_0 to switch B. MUX_S0 is internally pulled high.
Default state for mux_0 is switch A.
CONTROL (3.3V LVCMOS)
MUX_S0
37
MUX_S1
13
PREL_0
PREL_1
12
1
I
PREL_0 and PREL_1 select the output pre-emphasis of the line side drivers (LO_0 ± and
LO_1 ± ). PREL_0 and PREL_1 are internally pulled high. See Table 3 for line side
pre-emphasis levels.
PRES_0
PRES_1
36
25
I
PRES_0 and PRES_1 select the output pre-emphasis of the switch side drivers (SOA_0 ± ,
SOB_0 ± , SOA_1 ± and SOB_1 ± ). PRES_0 and PRES_1 are internally pulled high. See
Table 4 for switch side pre-emphasis levels.
LB0A
47
I
A logic low at LB0A enables the internal loopback path from SIA_0 ± to SOA_0 ± . LB0A is
internally pulled high.
LB0B
48
I
A logic low at LB0B enables the internal loopback path from SIB_0 ± to SOB_0 ± . LB0B is
internally pulled high.
LB1A
23
I
A logic low at LB1A enables the internal loopback path from SIA_1 ± to SOA_1 ± . LB1A is
internally pulled high.
LB1B
24
I
A logic low at LB1B enables the internal loopback path from SIB_1 ± to SOB_1 ± . LB1B is
internally pulled high.
RSV
26
I
Reserve pin to support factory testing. This pin can be left open, or tied to GND, or tied to
GND through an external pull-down resistor.
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A logic low at MUX_S1 selects mux_1 to switch B. MUX_S0 is internally pulled high.
Default state for mux_1 is switch A.
4
Pin Name
Pin
Number
DS40MB200
Pin Descriptions
(Continued)
I/O
Description
POWER
VCC
2, 8, 14,
20, 29, 35,
38, 44
P
VCC = 3.3V ± 5%.
Each VCC pin should be connected to the VCC plane through a low inductance path,
typically with a via located as close as possible to the landing pad of the VCC pin.
It is recommended to have a 0.01 µF or 0.1 µF, X7R, size-0402 bypass capacitor from
each VCC pin to ground plane.
GND
5, 11, 17,
32, 41
P
Ground reference. Each ground pin should be connected to the ground plane through a low
inductance path, typically with a via located as close as possible to the landing pad of the
GND pin.
GND
DAP
P
Die Attach Pad (DAP) is the metal contact at the bottom side, located at the center of the
LLP-48 package. It should be connected to the GND plane with at least 4 via to lower the
ground impedance and improve the thermal performance of the package.
Note: I = Input, O = Output, P = Power
Functional Descriptions
The DS40MB200 is a signal conditioning 2:1 multiplexer and a 1:2 buffer designed to support port redundancy up to 4 Gb/s. Each
input stage has a fixed equalizer that provides equalization to compensate about 5 dB of transmission loss from a short backplane
trace (about 10 inches backplane). The output driver has pre-emphasis (driver-side equalization) to compensate the transmission
loss of the backplane that it is driving. The driver conditions the output signal such that the lower frequency and higher frequency
pulses reach approximately the same amplitude at the end of the backplane, and minimize the deterministic jitter caused by the
amplitude disparity. The DS40MB200 provides 4 steps of user-selectable pre-emphasis ranging from 0, -3, -6 and –9 dB to handle
different lengths of backplane. Figure 1 shows a driver pre-emphasis waveform. The pre-emphasis duration is 200ps nominal,
corresponds to 0.75 bit-width at 4 Gb/s. The pre-emphasis levels of switch-side and line-side can be individually programmed.
The high speed inputs are self-biased to about 1.5V and are designed for AC coupling. The inputs are compatible to most AC
coupling differential signals such as LVDS, LVPECL and CML.
TABLE 1. LOGIC TABLE FOR MULTIPLEX CONTROLS
MUX_S0
Mux Function
0
MUX_0 select switch_B input, SIB_0 ± .
1 (default)
MUX_0 select switch_A input, SIA_0 ± .
MUX_S1
Mux Function
0
MUX_1 select switch_B input, SIB_1 ± .
1 (default)
MUX_1 select switch_A input, SIA_0 ± .
TABLE 2. LOGIC TABLE FOR LOOPBACK Controls
LB0A
Loopback Function
0
Enable loopback from SIA_0 ± to SOA_0 ± .
1 (default)
Normal mode. Loopback disabled.
LB0B
Loopback Function
0
Enable loopback from SIB_0 ± to SOB_0 ± .
1 (default)
Normal mode. Loopback disabled.
LB1A
Loopback Function
0
Enable loopback from SIA_1 ± to SOA_1 ± .
1 (default)
Normal mode. Loopback disabled.
LB1B
Loopback Function
0
Enable loopback from SIB_1 ± to SOB_1 ± .
1 (default)
Normal mode. Loopback disabled.
5
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DS40MB200
Functional Descriptions
(Continued)
TABLE 3. LINE-SIDE PRE-EMPHASIS CONTROLS
PreL_[1:0]
Pre-Emphasis Level in
mVPP
(VODB)
De-Emphasis Level
in mVPP
(VODPE)
Pre-Emphasis in dB
(VODPE/VODB)
Typical FR4 board
trace
00
1200
1200
0
10 inches
01
1200
850
−3
20 inches
10
1200
600
−6
30 inches
1 1 (default)
1200
426
−9
40 inches
TABLE 4. SWITCH-SIDE PRE-EMPHASIS CONTROLS
PreS_[1:0]
Pre-Emphasis Level in
mVPP
(VODB)
De-Emphasis Level
in mVPP
(VODPE)
Pre-Emphasis in dB
(VODPE/VODB)
Typical FR4 board
trace
00
1200
1200
0
10 inches
01
1200
850
−3
20 inches
10
1200
600
−6
30 inches
1 1 (default)
1200
426
−9
40 inches
20021737
FIGURE 1. Driver Pre-Emphasis Differential Waveform (showing all 4 pre-emphasis steps)
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6
Thermal Resistance, θJC-top
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Thermal Resistance, θJC-bottom
Supply Voltage (VCC)
−0.3V to 4V
ESD Rating Machine Model
CMOS/TTL Input Voltage
−0.3V to
(VCC +0.3V)
CML Input/Output Voltage
−0.3V to
(VCC +0.3V)
Junction Temperature
+125˚C
Storage Temperature
−65˚C to +150˚C
Lead Temperature
Soldering, 4 sec
5.8˚C/W
Thermal Resistance,ΦJB
18.2˚C/W
ESD Rating HBM, 1.5 kΩ, 100 pF
2.5 kV
250V
Recommended Operating Ratings
Supply Voltage (VCC-GND)
Min Typ
Max
Units
3.135 3.3
3.465
V
20
mVPP
Supply Noise Amplitude
10 Hz to 2 GHz
Ambient Temperature
+260˚C
Thermal Resistance, θJA
20.7˚C/W
0
Case Temperature
33.7˚C/W
85
˚C
100
˚C
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
(Note 2)
Max
Units
LVCMOS DC SPECIFICATIONS
VIH
High Level Input
Voltage
2.0
VCC
+0.3
V
VIL
Low Level Input
Voltage
−0.3
0.8
V
IIH
High Level Input
Current
VIN = VCC
−10
10
µA
IIL
Low Level Input
Current
VIN = GND
124
µA
RPU
Pull-High Resistance
75
94
35
kΩ
RECEIVER SPECIFICATIONS
VID
Differential Input
Voltage Range
AC Coupled Differential Signal
Below 1.25 Gb/s
At 1.25 Gbps–3.125 Gbps
Above 3.125 Gbps
This parameter is not production tested.
Common Mode
Voltage at Receiver
Inputs
Measured at receiver inputs reference to
ground.
RITD
Input Differential
Termination
On-chip differential termination between IN+
or IN−.
RITSE
Input Termination
(single-end)
On-chip termination IN+ or IN− to GND for
frequency > 100 MHz.
VICM
100
100
100
1750
1560
1200
1.3
84
100
mVP-P
mVP-P
mVP-P
V
116
Ω
Ω
50
DRIVER SPECIFICATIONS
VODB
Output Differential
Voltage Swing
without
Pre-Emphasis
RL = 100Ω ± 1%
PRES_1=PRES_0=0
PREL_1=PREL_0=0
Driver pre-emphasis disabled.
Running K28.7 pattern at 4 Gbps.
See Figure 5 for test circuit.
7
1000
1200
1400
mVP-P
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DS40MB200
Absolute Maximum Ratings (Note 1)
DS40MB200
Electrical Characteristics
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
(Note 2)
Max
Units
DRIVER SPECIFICATIONS
VPE
tPE
Output Pre-Emphasis RL = 100Ω ± 1%
Voltage Ratio
Running K28.7 pattern at 4 Gbps
20*log(VODPE/VODB) PREx_[1:0]=00
PREx_[1:0]=01
PREx_[1:0]=10
PREx_[1:0]=11
x=S for switch side pre-emphasis control
x=L for line side pre-emphasis control
See Figure 1 on waveform.
See Figure 5 for test circuit.
Pre-Emphasis Width
(Note 8)
dB
dB
dB
dB
Tested at −9 dB pre-emphasis level,
PREx[1:0]=11
x=S for switch side pre-emphasis control
x=L for line side pre-emphasis control
See Figure 4 on measurement condition.
125
200
250
ps
42
50
58
Ω
ROTSE
Output Termination
On-chip termination from OUT+ or OUT− to
VCC
ROTD
Output Differential
Termination
On-chip differential termination between OUT+
and OUT−
∆ROTSE
Mis-Match in Output
Termination
Resistors
Mis-match in output terminations at OUT+ and
OUT−
VOCM
0
−3
−6
−9
Output Common
Mode Voltage
Ω
100
5
2.7
%
V
POWER DISSIPATION
PD
Power Dissipation
VDD = 3.465V
All outputs terminated by 100Ω ± 1%.
PREL_[1:0]=0, PRES_[1:0]=0
Running PRBS 27-1 pattern at 4 Gbps
1
W
AC CHARACTERISTICS
tR
tF
tPLH
tPHL
Differential Low to
High Transition Time
Differential High to
Low Transition Time
Differential Low to
High Propagation
Delay
Measured with a clock-like pattern at
100 MHz, between 20% and 80% of the
differential output voltage. Pre-emphasis
disabled.
Transition time is measured with fixture as
shown in Figure 5, adjusted to reflect the
transition time at the output pins.
Measured at 50% differential voltage from
input to output.
Differential High to
Low Propagation
Delay
80
ps
80
ps
0.5
2
ns
0.5
2
ns
tSKP
Pulse Skew (Note 8)
|tPHL–tPLH|
20
ps
tSKO
Output Skew
(Notes 7, 8)
Difference in propagation delay among data
paths in the same device.
200
ps
tSKPP
Part-to-Part Skew
(Note 8)
Difference in propagation delay between the
same output from devices operating under
identical condition.
500
ps
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8
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Typ
(Note 2)
Max
Units
1.8
6
ns
See Figure 5 for test circuit.
Alternating-1-0 pattern.
Pre-emphasis disabled.
At 1.25 Gbps
At 4 Gbps
2
2
psrms
psrms
30
pspp
Conditions
Min
AC CHARACTERISTICS
tSM
RJ
Mux Switch Time
Device Random Jitter
(Note 5) (Note 8)
Measured from VIH or VIL of the mux-control
or loopback control to 50% of the valid
differential output.
DJ
Device Deterministic
Jitter (Note 6) (Note
8)
See Figure 5 for test circuit.
Pre-emphasis disabled.
At 4 Gbps, PRBS7 pattern
DRMAX
Maximum Data Rate
(Note 8)
Tested with alternating-1-0 pattern
4
Gbps
Note 1: “Absolute Maximum Ratings” are the ratings beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits.
Note 2: Typical parameters measured at VCC = 3.3V, TA = 25˚C. They are for reference purposes and are not production-tested.
Note 3: IN+ and IN− are generic names refer to one of the many pairs of complimentary inputs of the DS40MB200. OUT+ and OUT− are generic names refer to
one of the many pairs of the complimentary outputs of the DS40MB200. Differential input voltage VID is defined as |IN+–IN−|. Differential output voltage VOD is
defined as |OUT+–OUT−|.
Note 4: K28.7 pattern is a 10-bit repeating pattern of K28.7 code group {001111 1000}
K28.5 pattern is a 20-bit repeating pattern of +K28.5 and −K28.5 code groups {110000 0101 001111 1010}
Note 5: Device output random jitter is a measurement of the random jitter contribution from the device. It is derived by the equation sqrt(RJOUT2– RJIN2), where
RJOUT is the total random jitter measured at the output of the device in psrms, RJIN is the random jitter of the pattern generator driving the device.
Note 6: Device output deterministic jitter is a measurement of the deterministic jitter contribution from the device. It is derived by the equation (DJOUT–DJIN), where
DJOUT is the total peak-to-peak deterministic jitter measured at the output of the device in pspp, DJIN is the peak-to-peak deterministic jitter of the pattern generator
driving the device.
Note 7: tSKO is the magnitude difference in the propagation delays among data paths between switch A and switch B of the same port and similar data paths
between port 0 and port 1. An example is the output skew among data paths from SIA_0 ± to LO_0 ± , SIB_0 ± to LO_0 ± , SIA_1 ± to LO_1 ± and SIB_1 ± to LO_1 ± .
Another example is the output skew among data paths from LI_0 ± to SOA_0 ± , LI_0 ± to SOB_0 ± , LI_1 ± to SOA_1 ± and LI_1 ± to SOB_1 ± . tSKO also refers to the
delay skew of the loopback paths of the same port and between similar data paths between port 0 and port 1. An example is the output skew among data paths
SIA_0 ± to SOA_0 ± , SIB_0 ± to SOB_0 ± , SIA_1 ± to SOA_1 ± and SIB_1 ± to SOB_1 ± .
Note 8: Guaranteed by desigh and characterization using statistical analysis.
Timing Diagrams
20021736
FIGURE 2. Driver Output Transition Time
9
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DS40MB200
Electrical Characteristics
DS40MB200
Timing Diagrams
(Continued)
20021735
FIGURE 3. Propagation Delay from input to output
20021739
FIGURE 4. Test condition for output pre-emphasis duration
20021734
FIGURE 5. AC Test Circuit
The DS40MB200 input equalizer provides equalization to
compensate about 5 dB of transmission loss from a short
backplane transmission line. For characterization purposes,
a 25-inch FR4 coupled micro-strip board trace is used in
place of the short backplane link. The 25-inch microstrip
board trace has approximately 5 dB of attenuation between
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375 MHz and 1.875 GHz, representing closely the transmission loss of the short backplane transmission line. The 25inch microstrip is connected between the pattern generator
and the differential inputs of the DS40MB200 for AC measurements.
10
(Continued)
Trace Length
Finished Trace
Width W
25 inches
8.5 mil
Separation between
Dielectric Constant
Traces
Dielectric Height H
eR
11.5 mil
6 mil
3.8
Loss Tangent
0.022
20021742
FIGURE 6. Data input and output eye patterns with driver set to 0 dB pre-emphasis
11
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DS40MB200
Timing Diagrams
DS40MB200
Timing Diagrams
(Continued)
20021743
FIGURE 7. Data input and output eye patterns with driver set to 9dB pre-emphasis
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12
DS40MB200
Application Information
20021740
FIGURE 8. Application diagram (showing data paths of port 0)
13
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DS40MB200 Dual 4 Gb/s 1:2 Mux/Buffer with Input Equalization and Output Pre-Emphasis
Physical Dimensions
inches (millimeters) unless otherwise noted
LLP-48 Package
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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