IS66WVD4M16ALL 64Mb Async and Burst CellularRAM 2.0 Overview The IS66WVD4M16ALL is an integrated memory device containing 64Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 4M words by 16 bits. The device uses a multiplexed address and data bus scheme to minimize pins and includes a industry standard burst mode for increased read and write bandwidth. The device includes several power saving modes : Reduced Array Refresh mode where data is retained in a portion of the array and Temperature Controlled Refresh. Both these modes reduce standby current drain. The device can be operated in a standard asynchronous mode and high performance burst mode. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. Features Single device supports asynchronous and burst operation Mixed Mode supports asynchronous write and synchronous read operation Dual voltage rails for optional performance VDD 1.7V~1.95V, VDDQ 1.7V~1.95V Multiplexed address and data bus ADQ0~ADQ15 Asynchronous mode read access : 70ns Burst mode for Read and Write operation 4, 8, 16 or Continuous Low Power Consumption Asynchronous Operation < 25 mA Burst operation < 35 mA (@104Mhz) Standby < 150 uA(max.) Deep power-down (DPD) < 3uA (Typ) Low Power Feature Reduced Array Refresh Temperature Controlled Refresh Operation Frequency up to 104MHz Operating temperature Range Industrial -40°C~85°C Package: 54-ball VFBGA Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Rev.A | June 2011 www.issi.com - [email protected] 1 IS66WVD4M16ALL General Description CellularRAM™ (Trademark of MicronTechnology) products are high-speed, CMOS pseudo-static random access memories developed for low-power, portable applications. The 64Mb DRAM core device is organized as 4 Meg x 16 bits. This device is a variation of the industry-standard Flash control interface, with a multiplexed address/data bus. The multiplexed address and data functionality dramatically reduce the required signal count, and increase READ/WRITE bandwidth. To operate seamlessly on a burst Flash bus, CellularRAM products have incorporated a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance. Two user-accessible control registers define device operation. The bus configuration register (BCR) defines how the CellularRAM device interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up and can be updated anytime during normal operation. Special attention has been focused on standby current consumption during self refresh. CellularRAM products include three mechanisms to minimize standby current. Partial array refresh (PAR) enables the system to limit refresh to only that part of the DRAM array that contains essential data. Temperature-compensated refresh (TCR) uses an on-chip sensor to adjust the refresh rate to match the device temperature — the refresh rate decreases at lower temperatures to minimize current consumption during standby. Deep power-down (DPD) enables the system to halt the refresh operation altogether when no vital information is stored in the device. The system-configurable refresh mechanisms are adjusted through the RCR. This CellularRAM device is compliant with the industry-standard CellularRAM 2.0 feature set established by the CellularRAM Workgroup. It includes support for both variable and fixed latency, with three drive strengths, a variety of wrap options, and a device ID register (DIDR). A16~A21 Address Decode Logic Refresh Configuration Register (RCR) 4096K X 16 DRAM Memory Array Input /Output Mux And Buffers Device ID Register (DIDR) Bus Configuration Register (BCR) CE# WE# OE# CLK ADV# CRE LB# UB# WAIT Rev.A | June 2011 Control Logic ADQ0~ADQ15 [ Functional Block Diagram] www.issi.com - [email protected] 2 IS66WVD4M16ALL 54Ball VFBGA Ball Assignment 1 2 3 4 5 6 A LB# OE# NC NC NC CRE B ADQ8 UB# NC NC CE# ADQ0 C ADQ9 ADQ10 NC NC ADQ1 ADQ2 D VSSQ ADQ11 A17 NC ADQ3 VDD E VDDQ ADQ12 A21 A16 ADQ4 VSS F ADQ14 ADQ13 NC NC ADQ5 ADQ6 G ADQ15 A19 NC NC WE# ADQ7 H A18 NC NC NC NC A20 J WAIT CLK ADV# NC NC NC [Top View] (Ball Down) Rev.A | June 2011 www.issi.com - [email protected] 3 IS66WVD4M16ALL Signal Descriptions All signals for the device are listed below in Table 1. Table 1. Signal Descriptions Symbol Type VDD Power Supply Core Power supply (1.7V~1.95V) VDDQ Power Supply I/O Power supply (1.7V~1.95V) VSS Power Supply All VSS supply pins must be connected to Ground VSSQ Power Supply All VSSQ supply pins must be connected to Ground ADQ0~ ADQ15 Input / Output Address Input(A0~A15) Data Input/Output (DQ0~DQ15) A16~A21 Input Address Input(A16~A21) LB# Input Lower Byte select UB# Input Upper Byte select CE# Input Chip Enable/Select OE# Input Output Enable WE# Input Write Enable CRE Input Control Register Enable: When CRE is HIGH, READ and WRITE operations access registers. ADV# Input Address Valid signal Signal that a valid address is present on the address bus. Address are latched on the rising edge of ADV# during asynchronous Read/Write operations. Addresses are latched on the rising edge of CLK with ADV# low during synchronous operation. CLK Input Clock Latches addresses and commands on the first rising CLK edge when ADV# is active in synchronous mode. CLK must be kept static Low during asynchronous Read/Write operations. WAIT Output WAIT Data valid signal during burst Read/Write operation. WAIT is used to arbitrate collisions between refresh and Read/Write operation. WAIT is also asserted at the end of a row unless wrapping within the burst length. WAIT is asserted and should be ignored during asynchronous READ operation. WAIT is gated by CE# and is high-Z when CE# is high. Rev.A | June 2011 Description www.issi.com - [email protected] 4 IS66WVD4M16ALL Functional Description All functions for the device are listed below in Table 2. Table 2. Functional Descriptions Mode Power CLK1 ADV# CE# OE# WE# CRE2 UB#/ LB# WAIT3 ADQ [15:0]4 Note Asynchronous Mode Read Active L L L H L L Low-Z Data-out 5 Write Active L L X L L L High-Z Data-in 5 Standby Stand by L X H X X L X High-Z High-Z 6,7 No Operation Idle L X L X X L X Low-Z X 5,7 Configuration Register Write Active L L H L H X High-Z High-Z Configuration Register Read Active L L L H H L Low-Z Config-Reg Out Deep PowerDown DPD L H X X X X High-Z High-Z 10 X Synchronous Mode (Burst Mode) Async read Active L L L H L L Low-Z Data-Out 5 Async write Active L L X L L L High-Z Data-In 5 Standby Stand by L X H X X L X High-Z High-Z 6,7 No operation Idle L X L X X L X Low-Z X 5,8 Initial burst read Active L L X H L L Low-Z Address 5,8 Initial burst write Active L L H L L X Low-Z Address 5,8 Burst continue Active H L X X L L Low-Z Data-In or Data-Out 5,8 Burst suspend Active L L H X L X Low-Z High-Z 5,8 Configuration register write Active L L H L H X Low-Z High-Z 8,11 Configuration register read Active L L L H H L Low-Z Config-Reg Out 8,11 Deep PowerDown DPD X H X X X X High-Z High-Z 10 Rev.A | June 2011 L L www.issi.com - [email protected] 5 IS66WVD4M16ALL Notes 1. CLK must be LOW during Asynch Read and Asynch Write modes. CLK must be LOW to achieve low standby current during standby mode and DPD modes. CLK must be static (LOW or HIGH) during burst suspend. 2. Configuration registers are accessed when CRE is HIGH during the address portion of a READ or WRITE cycle. 3. WAIT polarity is configured through the bus configuration register (BCR[10]). 4. When UB# and LB# are in select mode (LOW), ADQ0~ADQ15 are affected as shown. When only LB# is in select mode, ADQ0~ADQ7 are affected as shown. When only UB# is in select mode, ADQ8~ADQ15 are affected as shown. 5. The device will consume active power in this mode whenever addresses are changed with ADV# LOW 6. When the device is in standby mode, address inputs and data inputs/outputs are internally isolated from any external influence. 7. Vin=VDDQ or 0V, all device pins be static (unswitched) in order to achieve standby current. 8. Burst mode operation is initialized through the bus configuration register (BCR[15]). 9. Byte operation can be supported Write & Read at asynchronous mode and Write at synchronous mode. 10. DPD is initiated when CE# transition from LOW to HIGH after writing RCR[4] to 0. DPD is maintained until CE# transitions from HIGH to LOW 11. Initial cycle. Following cycles are the same as BURST CONTINUE. CE# must stay LOW for the equivalent of a single word burst (as indicated by WAIT). Rev.A | June 2011 www.issi.com - [email protected] 6 IS66WVD4M16ALL Functional Description In general, this device is high-density alternatives to SRAM and Pseudo SRAM products popular in low-power, portable applications. The 64Mb device contains a 67,108,864-bit DRAM core organized as 4,194,304 addresses by 16 bits. This device implements a multiplexed address/data bus. This multiplexed configuration supports greater bandwidth through a x16 data bus, yet still reduces the required signal count. The CellularRAM bus interface supports both asynchronous and burst mode transfers. Power-Up Initialization CellularRAM products include an on-chip voltage sensor used to launch the power-up initialization process. Initialization will configure the BCR and the RCR with their default settings (see Table 3 and Table 8). VDD and VDDQ must be applied simultaneously. When they reach a stable level at or above 1.7V, the device will require 150μs to complete its self-initialization process. During the initialization period, CE# should remain HIGH. When initialization is complete, the device is ready for normal operation. Figure 1: Power-Up Initialization Timing VDD=1.7V tPU > 150us VDD VDDQ Rev.A | June 2011 Device Initialization www.issi.com - [email protected] Device ready for normal operation 7 IS66WVD4M16ALL Bus Operating Modes CellularRAM products incorporate a burst mode interface targeted at low-power, wireless applications. This bus interface supports asynchronous and burst mode read and write transfers. The specific interface supported is defined by the value loaded into the bus configuration register. Burst Mode Operation Burst mode operations enable high-speed synchronous READ and WRITE operations. Burst operations consist of a multi-clock sequence that must be performed in an ordered fashion. The size of a burst can be specified in the BCR either as a fixed length or continuous. Fixed-length bursts consist of four, eight, or sixteen words of sixteen bits. Continuous bursts have the ability to start at a specified address and burst to the end of the row. (Row length of 128 words or 256 words is a manufacturer option.) The latency count stored in the BCR defines the number of clock cycles that elapse before the initial data value is transferred between the processor and CellularRAM device. The initial latency for READ operations can be configured as fixed or variable. Variable latency allows the CellularRAM to be configured for minimum latency at high clock frequencies, but the controller must monitor WAIT to detect any conflict with refresh cycles (see Figure 23). Fixed latency outputs the first data word after the worst-case access delay, including allowance for refresh collisions. The initial latency time and clock speed determine the latency count setting. Fixed latency is used when the controller cannot monitor WAIT. Fixed latency also provides improved performance at lower clock frequencies. The WAIT output asserts when a burst is initiated and de-asserts to indicate when data is to be transferred into (or out of) the memory. WAIT will again be asserted at the boundary of the row unless wrapping within the burst length. To access other devices on the same bus without the timing penalty of the initial latency for a new burst, burst mode can be suspended. Bursts are suspended by stopping CLK. CLK must be stopped LOW. If another device will use the data bus while the burst is suspended, OE# should be taken HIGH to disable the CellularRAM outputs; otherwise, OE# can remain LOW. Note that the WAIT output will continue to be active, and as a result no other devices should directly share the WAIT connection to the controller. To continue the burst sequence, OE# is taken LOW, then CLK is restarted after valid data is available on the bus. CE# LOW time is limited by refresh considerations. CE# must not stay LOW longer than tCEM. If a burst suspension will cause CE# to remain LOW for longer than tCEM, CE# should be taken HIGH and the burst restarted with a new CE# LOW/ADV# LOW cycle. Rev.A | June 2011 www.issi.com - [email protected] 8 IS66WVD4M16ALL Burst Read Operation After CE# goes LOW, the address to access is latched on the rising edge of the next clock that ADV# is LOW. During this first clock rising edge, WE# indicates whether the operation is going to be a READ (WE# = HIGH, Figure 2) Then the data needs to be output to multiplexed data bus (ADQ0~ADQ15) according to set WAIT states. The WAIT output asserts when a burst is initiated, and de-asserts to indicate when data is to be transferred into (or out of ) the memory. WAIT will again be asserted at the boundary of a row, unless wrapping within the burst length. A full 4 word synchronous read access is shown in Figure 2 and the AC characteristics are specified in Table 16. Figure 2. Synchronous Read Access Timing tABA tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tACLK tHD VALID ADDRESS tSP ADV# tKOH VALID OUTPUT VALID OUTPUT tHZ tHD tSP tHD tHD WE# tOLZ tOHZ tOE OE# tWZ tKW WAIT tCBPH tCEM CE# tSP VALID OUTPUT tHD tCSP UB#/LB# VALID OUTPUT tKW HiZ Read Burst Identified (WE#=HIGH) Rev.A | June 2011 www.issi.com - [email protected] 9 IS66WVD4M16ALL Burst Write Operation After CE# goes LOW, the address to access is latched on the rising edge of the next clock that ADV# is LOW. During this first clock rising edge, WE# indicates whether the operation is going to be a WRITE (WE# =LOW, Figure 3). Data is placed to the multiplexed data bus (ADQ0~ADQ15) with consecutive clock cycles when WAIT de-asserts. The WAIT output asserts when a burst is initiated, and de-asserts to indicate when data is to be transferred into (or out of ) the memory. WAIT will again be asserted at the boundary of a row, unless wrapping within the burst length. A full 4 word synchronous write access is shown in Figure 3 and the AC characteristics are specified in Table 18. Figure 3. Synchronous Write Access Timing tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tSP tHD VALID ADDRESS tHD DATA IN DATA IN DATA IN DATA IN tAS tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tSP WE# tHD tHD tHD tKW tKW HiZ WAIT Write Burst Identified (WE#=LOW) Rev.A | June 2011 www.issi.com - [email protected] 10 IS66WVD4M16ALL Asynchronous Mode Asynchronous mode uses industry-standard SRAM control signals (CE#, ADV#, OE#, WE#, UB#, and LB#). READ operations (Figure 4) are initiated by bringing CE#, ADV#, UB# and LB# LOW while keeping OE# and WE# HIGH, and driving the address onto the multiplexed address/data bus. ADV# is taken HIGH to capture the address, and OE# is taken LOW. Valid data will be driven out of the I/Os after the specified access time has elapsed. WRITE operations (Figure 5) occur when CE#, ADV#, WE#, UB#, and LB# are driven LOW with the address on the multiplexed address/data bus. ADV# is taken HIGH to capture the address, then the write data is driven onto the bus. During asynchronous WRITE operations, the OE# level is a “Don't Care,” and WE# will override OE#; however, OE# must be HIGH while the address is driven onto the ADQ bus. The data to be written is latched on the rising edge of CE#, WE#, UB#, and LB# (whichever occurs first). During asynchronous operation, the CLK input must be held LOW. WAIT will be driven during asynchronous READs, and its state should be ignored. WE# must not be held LOW longer than tCEM. Figure 4. Asynchronous Read Access Timing tAA VALID ADDRESS Address tAVS ADQ0ADQ15 tAVH VALID ADDRESS VALID OUTPUT tAADV tVP ADV# tCVP CE# tWZ tCO tHZ tBHZ tBA UB#/LB# tOLZ tOE OE# WE# WAIT Rev.A | June 2011 tOHZ tOEW HiZ HiZ www.issi.com - [email protected] 11 IS66WVD4M16ALL Figure 5. Asynchronous Write Access Timing tAW tAS Address VALID ADDRESS tAVS ADQ0ADQ15 tAVH tDS VALID ADDRESS tDH VALID DATA tVS tVP ADV# tCVP CE# tWP WE# Rev.A | June 2011 tCW tBW UB#/LB# WAIT3# tAS HiZ HiZ www.issi.com - [email protected] 12 IS66WVD4M16ALL Mixed-Mode Operation The device can support a combination of synchronous READ and asynchronous READ and WRITE operations when the BCR is configured for synchronous operation. The asynchronous READ and WRITE operations require that the clock (CLK) remain LOW during the entire sequence. The ADV# latches the target address. CE# can remain LOW when transitioning between mixed-mode operations with fixed latency enabled; however, the CE# LOW time must not exceed tCEM. Mixed-mode operation facilitates a seamless interface to legacy burst mode Flash memory controllers. See Figure 33 for the “Asynchronous WRITE Followed by Burst READ” timing diagram. WAIT Operation WAIT output on the CellularRAM device is typically connected to a shared, system-level WAIT signal. The shared WAIT signal is used by the processor to coordinate transactions with multiple memories on the synchronous bus. When a synchronous READ or WRITE operation has been initiated, WAIT goes active to indicate that the CellularRAM device requires additional time before data can be transferred. For READ operations, WAIT will remain active until valid data is output from the device. For WRITE operations, WAIT will indicate to the memory controller when data will be accepted into the CellularRAM device. When WAIT transitions to an inactive state, the data burst will progress on successive rising clock edges. During a burst cycle CE# must remain asserted until the first data is valid. Bringing CE# HIGH during this initial latency may cause data corruption. When using variable initial access latency (BCR[14] = 0), the WAIT output performs an arbitration role for READ operations launched while an on-chip refresh is in progress. If a collision occurs, the WAIT pin is asserted for additional clock cycles until the refresh has completed (see Figure 23). When the refresh operation has completed, the READ operation will continue normally. WAIT will be asserted but should be ignored during asynchronous READ operations. WAIT will be High-Z during asynchronous WRITE operations. By using fixed initial latency (BCR[14] = 1), this CellularRAM device can be used in burst mode without monitoring the WAIT pin. However, WAIT can still be used to determine when valid data is available at the start of the burst and at the end of the row. If wait is not monitored, the controller must stop burst accesses at row boundaries on its own. UB#/LB# Operation The UB#/LB# enable signals support byte-wide data WRITEs. During WRITE operations, any disabled bytes will not be transferred to the RAM array and the internal value will remain unchanged. During an asynchronous WRITE cycle, the data to be written is latched on the rising edge of CE#, WE#, UB#, and LB# whichever occurs first. UB#/LB# must be LOW during READ cycles. When UB#/LB# are disabled (HIGH) during an operation, the device will disable the data bus from receiving or transmitting data. Although the device will seem to be deselected, it remains in an active mode as long as CE# remains LOW. Rev.A | June 2011 www.issi.com - [email protected] 13 IS66WVD4M16ALL Low-Power Feature Standby Mode Operation During standby, the device current consumption is reduced to the level necessary to perform the DRAM refresh operation. Standby operation occurs when CE# is HIGH. The device will enter a reduced power state upon completion of a READ or WRITE operation, or when the address and control inputs remain static for an extended period of time. This mode will continue until a change occurs to the address or control inputs. Temperature-Compensated Refresh Temperature-compensated refresh (TCR) allows for adequate refresh at different temperatures. This CellularRAM device includes an on-chip temperature sensor that automatically adjusts the refresh rate according to the operating temperature. The device continually adjusts the refresh rate to match that temperature. Partial-Array Refresh Partial-array refresh (PAR) restricts refresh operation to a portion of the total memory array. This feature enables the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map (see Table 9 ). READ and WRITE operations to address ranges receiving refresh will not be affected. Data stored in addresses not receiving refresh will become corrupted. When re-enabling additional portions of the array, the new portions are available immediately upon writing to the RCR. Deep Power-Down Operation Deep power-down (DPD) operation disables all refresh-related activity. This mode is used if the system does not require the storage provided by the CellularRAM device. Any stored data will become corrupted when DPD is enabled. When refresh activity has been re-enabled, the CellularRAM device will require 150μs to perform an initialization procedure before normal operations can resume. During this 150μs period, the current consumption will be higher than the specified standby levels, but considerably lower than the active current specification. DPD can be enabled by writing to the RCR using CRE or the software access sequence; DPD starts when CE# goes HIGH. DPD is disabled the next time CE# goes LOW. Rev.A | June 2011 www.issi.com - [email protected] 14 IS66WVD4M16ALL Registers Two user-accessible configuration registers define the device operation. The bus configuration register (BCR) defines how the CellularRAM interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up, and can be updated any time the devices are operating in a standby state. A DIDR provides information on the device manufacturer, CellularRAM generation, and the specific device configuration. The DIDR is read-only. Access Using CRE The registers can be accessed using either a synchronous or an asynchronous operation when the configuration register enable (CRE) input is HIGH (see Figures 6 through 9). When CRE is LOW, a READ or WRITE operation will access the memory array. The register values are written as an address (ADV# LOW) on the ADQ pins. In an asynchronous WRITE, the values are latched into the configuration register on the rising edge of CE# or WE#, whichever occurs first; UB#/LB# are “Don’t Care.” The BCR is accessed when A[19:18] is 10b; the RCR is accessed when A[19:18] is 00b; the DIDR is accessed when A[19:18] is 01b. For READs, address inputs other than A[19:18] are “Don’t Care,” and register bits are output as data (ADV# HIGH) on ADQ. Figure 6: Configuration Register WRITE – Asynchronous Mode Followed by READ ARRAY Operation Address VALID ADDRESS OPCODE tAVS tAVH ADQ0ADQ151 tAVS tAVH VALID ADDRESS OPCODE tVS tAADV tVP ADV# VALID OUTPUT tVP tCVP tCPP tCW CE# tCPH tHZ tCO tBA UB#/LB# tWP WE# Write Address Bus Value to Control Register OE# tAVS tOLZ tOE tAVH CRE2 Notes: 1. A[19:18] = 00b to load RCR ADQ[15:0]; 10b to load BCR ADQ[15:0]. 2. CRE must be HIGH to access registers. Rev.A | June 2011 www.issi.com - [email protected] 15 IS66WVD4M16ALL Figure 7: Configuration Register WRITE – Synchronous Mode Followed by READ ARRAY Operation tABA tCLK CLK Address VALID ADDRESS OPCODE tSP tHD tSP tHD ADQ0ADQ15 tACLK VALID ADDRESS OPCODE tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT tAS tAS ADV# tCBPH3 tCSP tCEM tCEM CE# tHD UB#/LB# tSP tHD WE# tOHZ tOE OE# WAIT tKW tKW HiZ tWZ tKW tKW tHD CRE4 tSP Notes: 1. Non-default BCR settings for configuration register WRITE in synchronous mode, followed by READ ARRAY operation: Latency code three (four clocks); WAIT active LOW; WAIT asserted during delay. 2. A[19:18] = 00b to load RCR ADQ[15:0]; 10b to load BCR ADQ[15:0]. 3. CE# must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored additional WAIT cycles caused by refresh collisions require a corresponding number of additional CE# LOW cycles. 4. CRE must be HIGH to access registers. Rev.A | June 2011 www.issi.com - [email protected] 16 IS66WVD4M16ALL Figure 8: Configuration Register READ – Asynchronous Mode Followed by DATA READ tAA Select Control Register Address VALID ADDRESS tAVS tAVH ADQ0ADQ151 tAVS tAVH VALID ADDRESS CR Valid Don’t Care tAADV tAADV tVP ADV# VALID OUTPUT tVP tCPP tCO CE# tCPH tHZ tCO tBA UB#/LB# WE# tOLZ tOE OE# tAVS tOE tAVH CRE2 Notes: 1. A[19:18] = 00b to load RCR ADQ[15:0]; 10b to load BCR ADQ[15:0]; 01b to load DIDR ADQ[15:0]. 2. CRE must be HIGH to access registers. Rev.A | June 2011 www.issi.com - [email protected] 17 IS66WVD4M16ALL Figure 9: Configuration Register READ – Synchronous Mode Followed by Data READ tABA tCLK CLK Select Control Register Address VALID ADDRESS tACLK tSP tHD ADQ0ADQ15 tKOH CR valid Don’t Care tSP tHD tACLK VALID ADDRESS tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT tAS tAS ADV# tCBPH3 tCSP tCEM tABA CE# tHD UB#/LB# tSP tHD WE# tOHZ tOE OE# WAIT tKW tKW HiZ tWZ tKW tKW tHD CRE4 tSP Notes: 1. Non-default BCR settings for configuration register READ in synchronous mode, followed by READ ARRAY operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. A[19:18] = 00b to load RCR ADQ[15:0]; 10b to load BCR ADQ[15:0]; 01b to load DIDR ADQ[15:0]. 3. CE# must remain LOW to complete a burst-of-one READ. WAIT must be monitored additional WAIT cycles caused by refresh collisions require a corresponding number of additional CE# LOW cycles. 4. CRE must be HIGH to access registers. Rev.A | June 2011 www.issi.com - [email protected] 18 IS66WVD4M16ALL Software Access Sequence Software access of the configuration registers uses a sequence of asynchronous READ and asynchronous WRITE operations. The contents of the configuration registers can be read or modified using the software sequence. The configuration registers are loaded using a four-step sequence consisting of two asynchronous READ operations followed by two asynchronous WRITE operations (see Figure 11). The read sequence is virtually identical except that an asynchronous READ is performed during the fourth operation (see Figure 10). The address used during all READ and WRITE operations is the highest address of the CellularRAM device being accessed (3FFFFFh); the contents of this address are not changed by using this sequence. The data value presented during the third operation (WRITE) in the sequence defines whether the BCR or the RCR is to be accessed. If the data is 0000h, the sequence will access the RCR; if the data is 0001h, the sequence will access the BCR; if the data is 0002h, the sequence will access the DIDR. During the fourth operation, ADQ[15:0] transfer data into or out of bits 15:0 of the control registers. The use of the software sequence does not affect the ability to perform the standard (CRE-controlled) method of loading the configuration registers. However, the software nature of this access mechanism eliminates the need for the control register enable (CRE) pin. If the software mechanism is used, the CRE pin can simply be tied to VSS. The port line often used for CRE control purposes is no longer required. Figure 10 : Configuration Register Read Address MAX ADDRESS ADQ0ADQ15 MAX ADDRESS MAX ADDRESS OUTPUT DATA MAX ADDRESS MAX ADDRESS OUTPUT DATA MAX ADDRESS MAX ADDRESS *Note1 MAX ADDRESS CR VALUE OUT ADV# CE# Read Read Write Read UB#/LB# WE# OE# Notes : 1. RCR : 0000h , BCR : 0001h , DIDR : 0002h Rev.A | June 2011 www.issi.com - [email protected] 19 IS66WVD4M16ALL Figure 11 : Configuration Register Write Address ADQ0ADQ15 MAX ADDRESS MAX ADDRESS MAX ADDRESS OUTPUT DATA MAX ADDRESS MAX ADDRESS OUTPUT DATA MAX ADDRESS MAX ADDRESS *Note1 CR VALUE IN MAX ADDRESS ADV# CE# Read Read Write Write UB#/LB# WE# OE# Notes : 1. RCR : 0000h , BCR : 0001h Rev.A | June 2011 www.issi.com - [email protected] 20 IS66WVD4M16ALL Bus Configuration Register The BCR defines how the CellularRAM device interacts with the system memory bus. Table 3 describes the control bits in the BCR. At power-up, the BCR is set to 1D1Fh. The BCR is accessed using CRE and A[19:18] = 10b, or through the configuration register software sequence with ADQ[15:0] = 0001h on the third cycle. Table 3. Bus configuration Register Remark Bit Number Definition 21-20 Reserved Must be set to “0” 19 – 18 Register Select 00 = Select RCR 01 = Select DIDR 10 = Select BCR 17 – 16 Reserved Must be set to “0” 15 Operating mode 14 Initial Latency 0 = Variable (default) 1 = Fixed 13 – 11 Latency Count 000 = 001 = 010 = 011 = 100 = 101 = 110 = 111 = 10 WAIT Polarity 0 = Active LOW : Data valid at WAIT HIGH 1 = Active HIGH : Data valid at WAIT LOW (default) 9 Reserved 8 WAIT Configuration 7–6 Reserved 9 clock cycles reserved 3 clock cycles 4 clock cycles (default) 5 clock cycles 6 clock cycles 7 clock cycles reserved Must be set to “0” 0 = Asserted during delay 1 = Asserted one data cycle before delay (default) Must be set to “0” 00 = 01 = 10 = 11 = Full drive ½ Drive (default) ¼ Drive Reserved 5–4 Output Impedance 3 Burst mode 0 = Burst wrap within the burst length 1 = Burst no wrap (default) Burst Length 001 = 4 words 010 = 8 words 011 = 16 words 111 = continuous (default) Others = Reserved 2–0 Notes : 0 = Synchronous burst access mode (default) 1 = Asynchronous access mode 1.Burst wrap and length apply to both READ and WRITE operations. Rev.A | June 2011 www.issi.com - [email protected] 21 IS66WVD4M16ALL Burst Length (BCR[2:0]) Default = Continuous Burst Burst lengths define the number of words the device outputs during burst READ and WRITE operations. The device supports a burst length of four, eight, or sixteen words of sixteen bits. The device can also be set in continuous burst mode where data is accessed sequentially up to the end of the row. Burst Wrap (BCR[3]) Default = No Wrap The burst-wrap option determines if a 4-, 8-, or 16-word READ or WRITE burst wraps within the burst length, or steps through sequential addresses if continuous burst operation is selected in BCR[2:0]. If the wrap option is not enabled, the device accesses data from sequential addresses up to the end of the row. Table 4. Sequence and Burst Length Starting Address Wrap BL4 BL8 BL16 Continuous DEC BCR[3] Linear Linear Linear Linear 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3- ••• -12-13-14-15 0-1-2-3-4-5-6- ••• 1 1-2-3-0 1-2-3-4-5-6-7-0 1-2-3-4- ••• -13-14-15-0 1-2-3-4-5-6-7- ••• 2 2-3-0-1 2-3-4-5-6-7-0-1 2-3-4-5- ••• -14-15-0-1 2-3-4-5-6-7-8- ••• 3 3-0-1-2 3-4-5-6-7-0-1-2 3-4-5-6- ••• -15-0-1-2 3-4-5-6-7-8-9- ••• ••• ••• ••• ••• ••• 6-7-4-5 6-7-0-1-2-3-4-5 6-7-8-9- ••• -2-3-4-5 6-7-8-9-10-11-12- ••• 6 “0” Wrap 7-4-5-6 7-0-1-2-3-4-5-6 7-8-9-10- ••• -3-4-5-6 7-8-9-10-11-12-13- ••• ••• ••• ••• ••• ••• 14 14-15-12-13 14-15-8-9-10-11-12-13 14-15-0-1- ••• -10-11-12-13 14-15-16-17-18-19-20- ••• 7 15 15-12-13-14 15-8-9-10-11-12-13-14 15-0-1-2-3- ••• -11-13-13-14 15-16-17-18-19-20-21- ••• ••• ••• ••• ••• ••• 254 254-255-252-253 254-255-248-249-250-251-252-253 254-255-240-241- ••• -250-251-252-253 254-255-0-1-2-••• 255 255-252-253-254 255-248-249-250-251-252-253-254 255-240-241-242- ••• -251-252-253-254 255-0-1-2-••• 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4- ••• -12-13-14-15 0-1-2-3-4-5-6- ••• 1 1-2-3-4 1-2-3-4-5-6-7-8 1-2-3-4- ••• -13-14-15-16 1-2-3-4-5-6-7- ••• 2 2-3-4-5 2-3-4-5-6-7-8-9 2-3-4-5- ••• -14-15-16-17 2-3-4-5-6-7-8- ••• 3 3-4-5-6 3-4-5-6-7-8-9-10 3-4-5-6- ••• -15-16-17-18 3-4-5-6-7-8-9- ••• ••• ••• ••• ••• ••• 6 7 “1” No Wrap ••• 6-7-8-9 6-7-8-9-10-11-12-13 6-7-8-9- ••• -18-19-20-21 6-7-8-9-10-11-12- ••• 7-8-9-10 7-8-9-10-11-12-13-14 7-8-9-10- ••• -19-20-21-22 7-8-9-10-11-12-13- ••• ••• ••• ••• ••• 14 14-15-16-17 14-15-16-17-18-19-20-21 14-15-16-17- ••• - 26-27-28-29 14-15-16-17-18-19-20- ••• 15 15-16-17-18 15-16-17-18-19-20-21-22 15-16-17-18- ••• -27-28-29-30 15-16-17-18-19-20-21- ••• ••• ••• ••• ••• ••• 254 254-255 254-255 254-255 254-255 255 255 255 255 255 Rev.A | June 2011 www.issi.com - [email protected] 22 IS66WVD4M16ALL Drive Strength (BCR[5:4]) Default = Outputs Use Half-Drive Strength The output driver strength can be altered to full, one-half, or one-quarter strength to adjust for different data bus loading scenarios. The reduced-strength options are intended for stacked chip (Flash + CellularRAM) environments when there is a dedicated memory bus. The reduced-drive-strength option minimizes the noise generated on the data bus during READ operations. Full output drive strength should be selected when using a discrete CellularRAM device in a more heavily loaded data bus environment. Outputs are configured at half-drive strength during testing. See Table 5. Table 5. Drive Strength BCR[5] BCR[4] Drive Strength Impedance Typ (Ω) Use Recommendation 0 0 Full 25 ~ 30 CL = 30pF to 50pF 0 1 1/2(Default) 50 CL = 15pF to 30pF 104MHz at light load 1 0 1/4 100 CL = 15pF or lower 1 1 Reserved WAIT Configuration (BCR[8]) Default = WAIT Transitions One Clock Before Data Valid/Invalid The WAIT configuration bit is used to determine when WAIT transitions between the asserted and the de-asserted state with respect to valid data presented on the data bus. The memory controller will use the WAIT signal to coordinate data transfer during synchronous READ and WRITE operations. When BCR[8] = 0, data will be valid or invalid on the clock edge immediately after WAIT transitions to the de-asserted or asserted state respectively. When BCR[8] = 1, the WAIT signal transitions one clock period prior to the data bus going valid or invalid (see Figure 12). Figure 12. WAIT Configuration During Burst Operation CLK ADQ0ADQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT WAIT BCR[8]=0 Data valid/invalid in current cycle WAIT BCR[8]=1 Data valid/invalid in next cycle Notes : Non-default BCR setting : WAIT active LOW WAIT Polarity (BCR[10]) Default = WAIT Active HIGH The WAIT polarity bit indicates whether an asserted WAIT output should be HIGH or LOW. This bit will determine whether the WAIT signal requires a pull-up or pull-down resistor to maintain the de-asserted state. Rev.A | June 2011 www.issi.com - [email protected] 23 IS66WVD4M16ALL Latency Counter (BCR[13:11]) Default = Three Clock Latency The latency counter bits determine how many clocks occur between the beginning of a READ or WRITE operation and the first data value transferred. Latency codes from two (three clocks) to six (seven clocks) and eight (nine clocks) are supported (see Tables 6 and 7, Figure 13, and Figure 14). Initial Access Latency (BCR[14]) Default = Variable Variable initial access latency outputs data after the number of clocks set by the latency counter. However, WAIT must be monitored to detect delays caused by collisions with refresh operations. Fixed initial access latency outputs the first data at a consistent time that allows for worst-case refresh collisions. The latency counter must be configured to match the initial latency and the clock frequency. It is not necessary to monitor WAIT with fixed initial latency. The burst begins after the number of clock cycles configured by the latency counter. (See Table 6 and Figure 13) Table 6. Variable Latency Configuration Codes (BCR[14] = 0) Latency Latency Configuration Code BCR [13:11] Max Input CLK Frequency (MHz) Normal Refresh Collision -96 -12 66 (15.0ns) 52 (18.5ns) 104 (9.62ns) 80 (12.5ns) - - 010 2 (3 clocks) 2 4 011 3 (4 clocks)-default 3 6 100 4 (5 clocks) 4 8 Reserved - - others Notes: 1. Latency is the number of clock cycles from the initialization of a burst operation until data appears. Data is transferred on the next clock cycle. READ latency can range from the normal latency to the value shown for refresh collision. Figure 13. Latency Counter (Variable Latency, No Refresh Collision) CLK ADV# Code 2 (3 clocks) ADQ0ADQ15 VALID ADDRESS ADQ0ADQ15 VALID ADDRESS ADQ0ADQ15 VALID ADDRESS Rev.A | June 2011 Code 3 (4 clocks) : Default Code 4 (5 clocks) VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT www.issi.com - [email protected] 24 IS66WVD4M16ALL Table 7. Fixed Latency Configuration Codes (BCR[14] = 1) Latency Configuration Code BCR [13:11] Latency Count (N) Max Input CLK Frequency (MHz) -96 -12 010 2 (3 clocks) 2 33 (30ns) 25 (40ns) 011 3 (4 clocks)-default 3 52 (19.2ns) 40 (25ns) 100 4 (5 clocks) 4 66 (15.0ns) 52 (19.2ns) 101 5 (6 clocks) 5 75 (13.3ns) 66 (15.0ns) 110 6 (7 clocks) 6 104 (9.62ns) 80 (12.5ns) Reserved - - - others Figure 14. Latency Counter (Fixed Latency) CLK ADV# tAADV CE# tCO tAA ADQ0ADQ15 (READ) VALID ADDRESS VALID OUTPUT VALID OUTPUT VALID OUTPUT ADQ0ADQ15 (WRITE) VALID ADDRESS VALID INPUT VALID INPUT VALID INPUT Burst Identified (ADV#=LOW) Operating Mode (BCR[15]) Default = Synchronous Operation The operating mode bit enables synchronous burst operation or limits the device to the asynchronous mode of operation only. If the clock is stopped LOW, all accesses are asynchronous, even when synchronous mode is enabled. Rev.A | June 2011 www.issi.com - [email protected] 25 IS66WVD4M16ALL Refresh Configuration Register The refresh configuration register (RCR) defines how the CellularRAM device performs its transparent self refresh. Altering the refresh parameters can dramatically reduce current consumption during standby mode. Table 8 describes the control bits used in the RCR. The RCR is accessed using CRE and A[19:18] = 00b, or through the configuration register software access sequence with ADQ = 0000h on the third cycle (see “Registers”) Table 8. Refresh Configuration Register Bit Number Definition 21-20 Reserved Must be set to “0” 19 – 18 Register Select 00 = Select RCR 01 = Select DIDR 10 = Select BCR 17 – 7 Reserved Must be set to “0” 6–5 Reserved Setting is ignored 4 DPD 3 Reserved 2–0 Rev.A | June 2011 Partial Refresh Remark 0 = DPD enable 1 = DPD disable (default) Must be set to “0” 000 = 001 = 010 = 011 = 100 = 101 = 110 = 111 = Full array (default) Bottom 1/2 array Bottom 1/4 array Bottom 1/8 array None of array Top 1/2 array Top 1/4 array Top 1/8 array www.issi.com - [email protected] 26 IS66WVD4M16ALL Partial-Array Refresh (RCR[2:0]) Default = Full Array Refresh The PAR bits restrict refresh operation to a portion of the total memory array. This feature allows the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map (see Tables 9) Table 9. 64Mb Address Patterns for PAR (RCR[4]=1) RCR[2] RCR[1] RCR[0] Active Section Address Space Size Density 0 0 0 Full 000000h ~ 3FFFFFh 4MX16 64Mb 0 0 1 Bottom 1/2 array 000000h ~ 1FFFFFh 2MX16 32Mb 0 1 0 Bottom 1/4 array 000000h ~ 0FFFFFh 1MX16 16Mb 0 1 1 Bottom 1/8 array 000000h ~ 07FFFFh 512KX16 8Mb 1 0 0 None of array 0 1 0 1 Top 1/2 array 200000h ~ 3FFFFFh 2MX16 32Mb 1 1 0 Top 1/4 array 300000h ~ 3FFFFFh 1MX16 16Mb 1 1 1 Top 1/8 array 380000h ~ 3FFFFFh 512KX16 8Mb 0Mb Deep Power-Down (RCR[4]) Default = DPD Disabled The deep power-down bit enables and disables all refresh-related activity. This mode is used if the system does not require the storage provided by the CellularRAM device. Any stored data will become corrupted when DPD is enabled. When refresh activity has been re-enabled, the CellularRAM device will require 150μs to perform an initialization procedure before normal operations can resume. Deep power-down is enabled by setting RCR[4] = 0 and taking CE# HIGH. Taking CE# LOW disables DPD and sets RCR[4] = 1; it is not necessary to write to the RCR to disable DPD. DPD can be enabled using CRE or the software sequence to access the RCR. BCR and RCR values (other than BCR[4]) are preserved during DPD. Device Identification Register The DIDR provides information on the device manufacturer, CellularRAM generation, and the specific device configuration. Table 10 describes the bit fields in the DIDR. This register is read-only. The DIDR is accessed with CRE HIGH and A[19:18] = 01b, or through the software access sequence with ADQ = 0002h on the third cycle. Table 10. Device Identification Register Mapping Bit Field DIDR[15] DIDR[14:11] DIDR[10:8] DIDR[7:5] DIDR[4:0] Field Name Row Length Device Version Device Density CellularRAM Generation Vendor ID Length - words Bit Setting Version Bit Setting Density Bit Setting Genera tion Bit Setting Vendor Bit Setting 128 0b 1st 0000b 64Mb 010b CR1.5 010b ISSI 00101b 256 1b 2nd 0001b 128Mb 011b CR2.0 011b Rev.A | June 2011 www.issi.com - [email protected] 27 IS66WVD4M16ALL Electrical Characteristics Table 11. Absolute Maximum Ratings Parameter Rating Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.3V to VDDQ + 0.3V Voltage on VDD Supply Relative to VSS -0.2V to + 2.45V Voltage on VDDQ Supply Relative to VSS -0.2V to + 2.45V Storage Temperature (plastic) -55°Cto + 150°C Operating Temperature (case) -40°Cto + 85°C Soldering Temperature and Time : 10s (solder ball only) + 260°C Notes: Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 12. Electrical Characteristics and Operating Conditions Industrial Temperature (–40ºC < TC < +85ºC) Description Conditions MIN MAX Unit VDD 1.7 1.95 V I/O Supply Voltage VDDQ 1.7 1.95 V Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1 Input Low Voltage VIL -0.20 0.4 V 2 0.80 VDDQ V 3 3 Supply Voltage Symbol Note Output High Voltage IOH = -0.2mA VOH Output Low Voltage IOL = +0.2mA VOL 0.20 VDDQ V VIN = 0 to VDDQ ILI 1 uA Output Leakage Current OE#=VIH or Chip Disabled ILO 1 uA Operating Current Conditions MAX Unit Note -70 25 mA 4 104Mhz 35 80Mhz 30 mA 4 104Mhz 30 80Mhz 25 mA 4 104Mhz 35 80Mhz 30 mA 4 uA 5 Input Leakage Current Symbol Asynchronous Random READ/WRITE IDD1 Initial Access, Burst READ/WRITE IDD2 Continuous Burst READ VIN = VDDQ or 0V Chip enabled, IOUT = 0 Continuous Burst WRITE Standby Current Rev.A | June 2011 IDD3R IDD3W VIN=VDDQ or 0V CE#=VDDQ ISB www.issi.com - [email protected] TYP 150 28 IS66WVD4M16ALL Notes: 1. Input signals may overshoot to VDDQ + 1.0V for periods less than 2ns during transitions. 2. Input signals may undershoot to Vss – 1.0V for periods less than 2ns during transitions. 3. BCR[5:4] = 01b (default setting of one-half drive strength). 4. This parameter is specified with the outputs disabled to avoid external loading effects. User must add required current to drive output capacitance expected in the actual system. 5. ISB (MAX) values measured with PAR set to FULL ARRAY at +85°C. In order to achieve low standby current, all inputs must be driven to either VDDQ or VSS. ISB might be set slightly higher for up to 500ms after power-up, or when entering standby mode. Table 13. Deep Power-Down Specifications Description Deep Power-Down Notes: Conditions Symbol TYP MAX Unit VIN=VDDQ or 0V VDD,VDDQ=1.95V, +85°C IDPD 3 10 uA Typical (TYP) IDPD value applies across all operating temperatures and voltages. Table 14. Capacitance Description Input Capacitance Input/Output Capacitance (ADQ) Notes: Conditions Symbol MIN MAX Unit Note TC=+25°C; f=1Mhz; VIN=0V CIN 2.0 6.0 pF 1 CIO 3.0 6.5 pF 1 1. These parameters are verified in device characterization and are not 100% tested. Figure 15. AC Input/Output Reference Waveform VDDQ ∫∫ VDDQ/22 Output Test Points VSS VDDQ/23 Output ∫∫ Notes: 1. AC test inputs are driven at VDDQ for a logic 1 and VSS for a logic 0. Input rise and fall times (10% to 90%) < 1.6ns. 2. Input timing begins at VDDQ/2. 3. Output timing ends at VDDQ/2. Figure 16. Output Load Circuit Test Point 50Ω VDDQ/2 DUT 30pF Notes: All tests are performed with the outputs configured for default setting of half drive strength (BCR[5:4] = 01b). Rev.A | June 2011 www.issi.com - [email protected] 29 IS66WVD4M16ALL AC Characteristics Table15 . Asynchronous READ Cycle Timing Requirements Symbol Parameter -70 Min Max Unit tAA Address Acess Time 70 ns tAADV ADV# Access Time 70 ns tAVH Address hold from ADV# HIGH 2 ns tAVS Address setup to ADV# HIGH 5 ns tBA UB#, LB# Access Time 70 tBHZ UB#, LB# Disable to High-Z Output 7 tCPH CE# HIGH between Subsequent Asynchronous cycles tCO Chip Select Access Time tCVP CE# low to ADV# HIGH tHZ Chip Disable to High-Z Output 7 tOE OE# low to Valid Output 20 tOEW OE# low to WAIT Valid tOHZ OE# high to High-Z Output tOLZ OE# low to Low-Z output tVP ADV# Low pulse width tWZ CE# high to WAIT High-Z 5 1 ns 70 7 1 ns Notes ns ns 1 ns 7.5 7 ns 1 3 ns 2 7 ns 7 ns 1 Notes: 1. Low-Z to High-Z timings are tested with the circuit shown in Figure 23. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. 2. High-Z to Low-Z timings are tested with the circuit shown in Figure 23. The Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL. Rev.A | June 2011 www.issi.com - [email protected] 30 IS66WVD4M16ALL Table16 . Burst READ Cycle Timing Requirements -7010 -7008 Symbol Parameter tAA Address Acess Time (Fixed Latency) 70 70 ns tAADV ADV# Access Time (Fixed Latency) 70 70 ns tABA Burst to READ Access Time (Variable Latency) 35.9 46.5 ns tACLK CLK to Output Delay 7 9 ns 1 tCBPH CE# High between Subsequent Burst or Mixed-Mode Operations ns 2 tCEM Maximum CE# Pulse width us 2 tCLK CLK Period tCO Chip Select Access Time (Fixed Latency) tCSP CE# Setup Time to Active CLK Edge 3 4 ns tHD Hold Time from Active CLK Edge 2 2 ns tHZ Chip Disable to High-Z Output tKH/tKL Min Max 5 Min Max 6 4 9.62 4 70 7 Note ns 12.5 70 Unit 7 ns ns 3 CLK HIGH or LOW Time 3 4 ns tKOH Output Hold from CLK 2 2 ns tKW CLK to WAIT Valid 7 9 ns tOE Burst OE# LOW to Output Valid 20 20 ns tOHZ OE# high to High-Z Output 7 7 ns 4 tOLZ OE# low to Low-Z output 3 3 ns 4 tSP Setup time to Active CLK Edge 3 3 ns tT CLK Rise or Fall Time tWZ CE# high to WAIT High-Z 1.6 1.8 ns 7 7 ns 1 3 Notes: 1. A refresh opportunity must be provided every tCEM by taking CE# HIGH. 2. Low-Z to High-Z timings are tested with the circuit shown in Figure 16. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. 3. High-Z to Low-Z timings are tested with the circuit shown in Figure 16. The Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL. Rev.A | June 2011 www.issi.com - [email protected] 31 IS66WVD4M16ALL Table17 . Asynchronous WRITE Cycle Timing Requirements Symbol Parameter -70 Min Max Unit tAS Address and ADV# LOW Setup Time 0 ns tAVH Address hold from ADV# HIGH 2 ns tAVS Address setup to ADV# HIGH 5 ns tAW Address Valid to End of Write 70 ns tBW UB#, LB# Select to End of Write 70 ns tCPH CE# HIGH between Subsequent Asynchronous cycles 5 ns tCVP CE# low to ADV# HIGH 7 ns tCW Chip Enable to End of Write 70 tDH Data Hold from Write Time 0 tDS Data Write Setup Time 20 tVP ADV# Low pulse width 7 ns tVS ADV# Setup to End of Write 70 ns Notes ns tWHZ WRITE to ADQ High-Z Output tWP WRITE Pulse Width 45 ns tWR WRITE Recovery Time 0 ns tWZ CE# high to WAIT High-Z 7 7 ns ns 1 2 Notes: 1. WE# must not remain LOW longer than 4μs (tCEM) while the device is selected (CE# LOW). 2. Low-Z to High-Z timings are tested with the circuit shown in Figure 16. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. Rev.A | June 2011 www.issi.com - [email protected] 32 IS66WVD4M16ALL Table18 . Burst WRITE Cycle Timing Requirements Symbol -7010 Parameter Min -7008 Max Min Max Unit Note Address and ADV# LOW Setup Time 0 0 ns 1 tCBPH CE# High between Subsequent Burst or Mixed-Mode Operations 5 6 ns 2 tCEM Maximum CE# Pulse width us 2 tCLK CLK Period tCSP tHD tAS tKH/tKL 4 4 9.62 12.5 ns CE# Setup Time to Active CLK Edge 3 4 ns Hold Time from Active CLK Edge 2 2 ns CLK HIGH or LOW Time 3 4 ns tKW CLK to WAIT Valid tSP Setup time to Active CLK Edge tT CLK Rise or Fall Time tWZ CE# high to WAIT High-Z 7 3 ns 9 3 ns 3 1.6 1.8 ns 7 7 ns 4 Notes: 1. tAS required if tCSP > 20ns. 2. A refresh opportunity must be provided every tCEM by taking CE# HIGH. 3. Low-Z to High-Z timings are tested with the circuit shown in Figure 16. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. Table19 . Initialization and DPD Timing Requirements Symbol Parameter -70 Min Max Unit tDPD Time from DPD entry to DPD exit 150 us tDPDX CE# LOW time to exit DPD 70 ns tPU Initialization Period (required before normal operations) Rev.A | June 2011 www.issi.com - [email protected] 150 Notes us 33 IS66WVD4M16ALL Timing Diagrams Figure 17: Power-Up Initialization Timing VDD(MIN) VDD, VDDQ=1.7V tPU > 150us Device ready for normal operation Device Initialization Figure 18: DPD Entry and Exit Timing Parameters tDPD tDPDX tPU DPD Enabled DPD Exit CE# Write RCR[4]=0 Device Initialization Device ready for normal operation Figure 19: Asynchronous READ tAA Address VALID ADDRESS tAVS ADQ0ADQ15 tAVH VALID ADDRESS VALID OUTPUT tAADV tVP ADV# tCVP CE# tWZ tCO tHZ tBHZ tBA UB#/LB# tOLZ tOE OE# WE# WAIT Rev.A | June 2011 tOHZ tOEW HiZ HiZ www.issi.com - [email protected] 34 IS66WVD4M16ALL Figure 20: CLK Timings for Burst Operations tCLK tT Notes : tCLK tKL tKH 1. For Burst timing diagrams, non-default BCR settings are shown Rev.A | June 2011 www.issi.com - [email protected] 35 IS66WVD4M16ALL Figure 21: Single Access Burst READ Operation – Variable Latency without refresh collision tABA tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tACLK tHD VALID ADDRESS tSP ADV# VALID OUTPUT tHD tCSP tHD tCEM CE# tSP UB#/LB# tKOH tHD WE# tOLZ tOE OE# tOHZ tKW WAIT tKW HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for single-access burst READ operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. Rev.A | June 2011 www.issi.com - [email protected] 36 IS66WVD4M16ALL Figure 22: Four-Word Burst READ Operation – Variable Latency without refresh collision tABA tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tACLK tHD VALID ADDRESS tSP ADV# tKOH VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tHD tHZ tHD tCSP tCEM CE# tSP UB#/LB# tSP tHD tHD WE# tOLZ tOHZ tOE OE# tWZ tKW WAIT tCBPH tKW HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for 4-word burst READ operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. Rev.A | June 2011 www.issi.com - [email protected] 37 IS66WVD4M16ALL Figure 23: Four-Word Burst READ Operation – Variable Latency with refresh collision tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tACLK tHD VALID ADDRESS tSP ADV# tKOH VALID OUTPUT VALID OUTPUT tHZ tHD tCBPH tCEM CE# tSP tSP VALID OUTPUT tHD tCSP UB#/LB# VALID OUTPUT tHD tWZ tHD WE# tOLZ tOE OE# tKW WAIT tKW HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for 4-word burst READ operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. If refresh collision happened, WAIT will be asserted between the latency count number of clock cycles and 2x the latency count Rev.A | June 2011 www.issi.com - [email protected] 38 IS66WVD4M16ALL Figure 24: Single Access Burst READ Operation – Fixed Latency tCLK CLK tAA VALID ADDRESS Address tSP ADQ0ADQ15 tKOH tHD VALID ADDRESS VALID OUTPUT tAADV tSP ADV# tHD tHD tCO tCSP CE# tCEM tSP UB#/LB# tSP tHZ tHD tHD WE# tOHZ tOLZ tOE OE# tWZ tKW WAIT tKW HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default fixed latency BCR settings for single-access burst READ operation: Fixed Latency; Latency code four (five clocks); WAIT active LOW; WAIT asserted during delay. Rev.A | June 2011 www.issi.com - [email protected] 39 IS66WVD4M16ALL Figure 25: Four-Word Burst READ Operation – Fixed Latency tCLK CLK tAA VALID ADDRESS Address tSP ADQ0ADQ15 tKOH tHD VALID ADDRESS VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tHZ tAADV tSP ADV# tHD tCO tHD tCSP tCEM CE# tSP UB#/LB# tSP tCBPH tHD tHD WE# tOLZ tOE OE# tWZ tKW WAIT tKW HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default fixed latency BCR settings for 4-word burst READ operation: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. Rev.A | June 2011 www.issi.com - [email protected] 40 IS66WVD4M16ALL Figure 26: READ Burst Suspend CLK Note2 VALID ADDRESS Address tSP ADQ0ADQ15 tKOH tHD VALID ADDRESS VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tHZ tAADV tSP ADV# tHD tWZ tCO tCSP tHD tCBPH tHD tHD tCEM CE# tSP UB#/LB# tHD tSP tHD WE# tOLZ tOE OE# Note3 tKW WAIT Notes: HiZ tKW 1. Non-default BCR settings for READ burst suspend: Fixed or variable latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. CLK can be stopped LOW or HIGH, but must be static, with no LOW-to-HIGH transitions during burst suspend. 3. OE# can stay LOW during BURST SUSPEND. If OE# is LOW, ADQ[15:0] will continue to output valid data. Rev.A | June 2011 www.issi.com - [email protected] 41 IS66WVD4M16ALL Figure 27: Burst READ at End of Row (Wrap Off) tCLK CLK Address ADQ0ADQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT End of Row (A[7:0]=FFh) ADV# VIH NOTE2 CE# UB#/LB# VIH tHZ VIL VIL WE# OE# VIL tKW tHZ WAIT Notes: 1. Non-default BCR settings for burst READ at end of row: fixed or variable latency; WAIT active LOW; WAIT asserted during delay. 2. For burst READs, CE# must go HIGH before the third CLK after the WAIT period begins (before the third CLK after WAIT asserts with BCR[8] = 0, or before the fourth CLK after WAIT asserts with BCR[8] = 1). Rev.A | June 2011 www.issi.com - [email protected] 42 IS66WVD4M16ALL Figure 28: Asynchronous WRITE tAW tAS Address VALID ADDRESS tAVS ADQ0ADQ15 tAVH tDS VALID ADDRESS tDH VALID DATA tVS tVP ADV# tCVP CE# tCW tBW UB#/LB# tWP WE# WAIT3# tAS NOTE2 HiZ HiZ Notes: 1. The end of the WRITE cycle is controlled by CE#, UB#, LB#, or WE#, whichever de-asserts first. 2. WE# must not remain LOW longer than 4μs (tCEM) while the device is selected (CE# LOW). 3. During asynchronous WRITE cycles, WAIT will be High-Z while WE# is LOW or OE# is HIGH. Rev.A | June 2011 www.issi.com - [email protected] 43 IS66WVD4M16ALL Figure 29: Four-Word Burst WRITE Operation – Variable Latency tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tSP tHD VALID ADDRESS NOTE3 tHD DATA IN DATA IN DATA IN DATA IN tAS tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tSP WE# tHD tHD tHD tKW tKW HiZ WAIT NOTE2 Write Burst Identified (WE#=LOW) Notes: 1. Non-default BCR settings for burst WRITE operation, with fixed-length burst of 4, burst wrap enabled: Variable latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. WAIT asserts for LC cycles for both fixed and variable latency. LC = latency code (BCR[13:11]). 3. tAS required if tCSP > 20ns. Rev.A | June 2011 www.issi.com - [email protected] 44 IS66WVD4M16ALL Figure 30: Four-Word Burst WRITE Operation – Fixed Latency tCLK CLK VALID ADDRESS Address tSP ADQ0ADQ15 tSP tHD VALID ADDRESS NOTE3 tAS tHD DATA IN DATA IN DATA IN DATA IN tAVH tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tSP WE# tHD tHD tHD tKW tKW HiZ WAIT NOTE2 Write Burst Identified (WE#=LOW) Notes: 1. Non-default BCR settings for burst WRITE operation, with fixed-length burst of 4, burst wrap enabled: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. WAIT asserts for LC cycles for both fixed and variable latency. LC = latency code (BCR[13:11]). 3. tAS required if tCSP > 20ns. Rev.A | June 2011 www.issi.com - [email protected] 45 IS66WVD4M16ALL Figure 31: Continuous Burst WRITE at End-of-Row (Wrap Off) tCLK CLK Address ADQ0ADQ15 VALID INPUT VALID INPUT VALID INPUT End of Row (A[7:0]=FFh) ADV# VIH NOTE2 CE# VIH tHZ VIL UB#/LB# WE# OE# VIH tKW tHZ WAIT Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency; WAIT active LOW; WAIT asserted during delay. 2. For burst WRITEs, CE# must go HIGH before the third CLK after the WAIT period begins (before the third CLK after WAIT asserts with BCR[8] = 0, or before the fourth CLK after WAIT asserts with BCR[8] = 1). Rev.A | June 2011 www.issi.com - [email protected] 46 IS66WVD4M16ALL Figure 32: Burst WRITE followed by Burst READ tABA tCLK CLK VALID ADDRESS Address VALID ADDRESS tSP tHD tSP tHD ADQ0ADQ15 VALID ADDRESS tSP tHD DATA IN DATA IN DATA INDATA IN tACLK VALID ADDRESS tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT tAS tAS ADV# tCBPH tCSP tCEM tCEM CE# tSPtHD tHD UB#/LB# tSP tHD WE# tOLZ tOE OE# WAIT tOHZ tKW HiZ tKW HiZ tWZ tKW tKW Notes: 1. Non-default BCR settings for burst WRITE followed by burst READ; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. A refresh opportunity must be provided every tCEM by taking CE# HIGH. Rev.A | June 2011 www.issi.com - [email protected] 47 IS66WVD4M16ALL Figure 33: Asynchronous WRITE followed by Burst READ tCLK CLK tAW VALID ADDRESS Address tAVS ADQ0ADQ15 VALID ADDRESS tAVH tDS tSP tHD tDH VALID DATA VALID ADDRESS tACLK VALID ADDRESS tKOH VALID OUTPUT tVS tSP tHD tVP ADV# tCSP NOTE2 tCBPH tCW CE# tBW UB#/LB# tWP WE# tCSP tHD tSP tHD tWR tOLZ tOE OE# tWZ WAIT tKW HiZ Notes: 1. Non-default BCR settings for asynchronous WRITE followed by burst READ: Fixed or variable latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. When transitioning between asynchronous WRITE and variable-latency burst READ operations, CE# must go HIGH. CE# can stay LOW when transitioning to fixed-latency burst READs. A refresh opportunity must be provided every tCEM by taking CE# HIGH. Rev.A | June 2011 www.issi.com - [email protected] 48 IS66WVD4M16ALL Figure 34: Asynchronous WRITE followed by Asynchronous READ VALID ADDRESS VALID ADDRESS Address tAVS tAVH ADQ0ADQ15 tDS VALID ADDRESS tDH tAVS tAVH VALID ADDRESS VALID DATA tVS tAADV tVP ADV# tCVP CE# tVP tCPP tCW tCPH tBW UB#/LB# VALID OUTPUT tHZ tCO tBA tWP WE# tOLZ tOE OE# WAIT tOEW HiZ HiZ Notes: 1. CE# can stay LOW when transitioning between asynchronous operations. If CE# goes HIGH, it must remain HIGH for at least tCPH to schedule the appropriate internal refresh operation. Otherwise, tCPH is only required after CE#-controlled WRITEs. Rev.A | June 2011 www.issi.com - [email protected] 49 IS66WVD4M16ALL Figure 35: Asynchronous READ followed by WRITE at the Same Address tAA VALID ADDRESS Address tDS tAVS tAVH ADQ0ADQ15 VALID ADDRESS tDH VALID INPUT VALID OUTPUT tAADV tVP ADV# tCVP CE# tCO tBA UB#/LB# tWP WE# tOLZ tOE OE# WAIT Notes: HiZ tWZ tOEW HiZ 1. The end of the WRITE cycle is controlled by CE#, UB#, LB#, or WE#, whichever de-asserts first. 2. WE# must not remain LOW longer than 4μs (tCEM) while the device is selected (CE# LOW). Rev.A | June 2011 www.issi.com - [email protected] 50 IS66WVD4M16ALL Ordering Information – VDD = 1.8V Industrial Temperature Range: (-40oC to +85oC) Config. Speed (ns) Frequency (MHz) 4Mx16 70 Rev.A | June 2011 Order Part No. Package 104 IS66WVD4M16ALL-7010BLI 54-ball VFBGA 80 IS66WVD4M16ALL-7008BLI 54-ball VFBGA www.issi.com - [email protected] 51 IS66WVD4M16ALL Rev.A | June 2011 www.issi.com - [email protected] 52