TS3A225E SCDS329 – NOVEMBER 2011 www.ti.com AUTONOMOUS AUDIO HEADSET SWITCH Check for Samples: TS3A225E FEATURES APPLICATIONS • • • • • • 1 • • • • • VDD Range = 2.7 V to 4.5 V Break Before Make Stereo Jack Switches Ground FET Switches ( <100mΩ) Autonomous Detection of GND and MIC Connections Detection Triggered by I2C or External Trigger Pin HDA Compatible MIC Present Indicator 1.8V Compatible I2C Switch Control ESD Performance Tested Per JESD 22: – 2000-V Human-Body Model (A114-B, Class II) – 500-V Charged-Device Model (C101) ESD Performance (SLEEVE, RING2, TIP) – ±8-kV Contact Discharge (IEC 61000-4-2) Mobile Phones/ Tablet PCs Notebook Computers DESCRIPTION The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TAS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack. In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting. TIP R1 MIC_BIAS RING1 TS3A225E C1 C2 MICI MICn / HP_REF MIC_REF SLEEVE_SENSE MICp S1 RING2_SENSE SLEEVE C3 VDD RING2 SCL TIP_SENSE SDA I2C_ADDR_SEL FET2 Control Logic FET1 /MIC_PRESENT DET_TRIGGER GND ORDERING INFORMATION TA (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C YFF- WCSP Tape and reel TS3A225EYFFR YP225E –40°C to 85°C RTE- QFN Tape and reel TS3A225ERTER ZTL Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated To request a full data sheet, please send an email to: [email protected] PACKAGE OPTION ADDENDUM www.ti.com 27-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) HPA02141EYFFR ACTIVE DSBGA YFF 16 3000 Green (RoHS & no Sb/Br) TS3A225ERTER ACTIVE WQFN RTE 16 3000 Green (RoHS & no Sb/Br) TS3A225EYFFR ACTIVE DSBGA YFF 16 3000 Green (RoHS & no Sb/Br) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM CU NIPDAU Level-2-260C-1 YEAR SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TS3A225ERTER WQFN RTE 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TS3A225EYFFR DSBGA YFF 16 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A225ERTER WQFN RTE 16 3000 367.0 367.0 35.0 TS3A225EYFFR DSBGA YFF 16 3000 210.0 185.0 35.0 Pack Materials-Page 2 D: Max = 1.59 mm, Min = 1.53 mm E: Max = 1.59 mm, Min = 1.53 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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