TI1 HPA02141EYFFR Autonomous audio headset switch Datasheet

TS3A225E
SCDS329 – NOVEMBER 2011
www.ti.com
AUTONOMOUS AUDIO HEADSET SWITCH
Check for Samples: TS3A225E
FEATURES
APPLICATIONS
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•
•
•
•
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1
•
•
•
•
•
VDD Range = 2.7 V to 4.5 V
Break Before Make Stereo Jack Switches
Ground FET Switches ( <100mΩ)
Autonomous Detection of GND and MIC
Connections
Detection Triggered by I2C or External Trigger
Pin
HDA Compatible MIC Present Indicator
1.8V Compatible I2C Switch Control
ESD Performance Tested Per JESD 22:
– 2000-V Human-Body Model (A114-B, Class
II)
– 500-V Charged-Device Model (C101)
ESD Performance (SLEEVE, RING2, TIP)
– ±8-kV Contact Discharge (IEC 61000-4-2)
Mobile Phones/ Tablet PCs
Notebook Computers
DESCRIPTION
The TS3A225E is an audio headset switch device.
The device detects the presence of an analog
microphone and switches a system analog
microphone pin between different connectors in an
audio stereo jack. The microphone connection in a
stereo connector can be swapped with the ground
connection depending on manufacturer. When the
TAS3A225E detects a certain configuration, the
device automatically connects the microphone line to
the appropriate pin. The device also reports the
presence of an analog microphone on an audio
stereo jack.
In some systems, it is desirable to connect the stereo
jack pin to ground. The TS3A225E provides two
internal low resistance (<100mΩ) FET switches for
ground shorting.
TIP
R1
MIC_BIAS
RING1
TS3A225E
C1
C2
MICI
MICn / HP_REF
MIC_REF
SLEEVE_SENSE
MICp
S1
RING2_SENSE
SLEEVE
C3
VDD
RING2
SCL
TIP_SENSE
SDA
I2C_ADDR_SEL
FET2
Control
Logic
FET1
/MIC_PRESENT
DET_TRIGGER
GND
ORDERING INFORMATION
TA
(1)
(2)
PACKAGE (1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
YFF- WCSP
Tape and reel
TS3A225EYFFR
YP225E
–40°C to 85°C
RTE- QFN
Tape and reel
TS3A225ERTER
ZTL
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
To request a full data sheet, please send an email to:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
HPA02141EYFFR
ACTIVE
DSBGA
YFF
16
3000
Green (RoHS
& no Sb/Br)
TS3A225ERTER
ACTIVE
WQFN
RTE
16
3000
Green (RoHS
& no Sb/Br)
TS3A225EYFFR
ACTIVE
DSBGA
YFF
16
3000
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
SNAGCU
MSL Peak Temp
(3)
Samples
(Requires Login)
Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TS3A225ERTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TS3A225EYFFR
DSBGA
YFF
16
3000
180.0
8.4
1.65
1.65
0.81
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3A225ERTER
WQFN
RTE
16
3000
367.0
367.0
35.0
TS3A225EYFFR
DSBGA
YFF
16
3000
210.0
185.0
35.0
Pack Materials-Page 2
D: Max = 1.59 mm, Min = 1.53 mm
E: Max = 1.59 mm, Min = 1.53 mm
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