IRF IRFY9130C Simple drive requirement Datasheet

PD-91293C
IRFY9130C, IRFY9130CM
POWER MOSFET
THRU-HOLE (TO-257AA)
100V, P-CHANNEL
®
HEXFET MOSFET TECHNOLOGY
Product Summary
Part Number
R DS(on)
ID
Eyelets
IRFY9130C
0.3 Ω
-11.2A
Ceramic
IRFY9130CM
0.3 Ω
-11.2A
Ceramic
HEXFET® MOSFET technology is the key to International
Rectifier’s advanced line of power MOSFET transistors. The
efficient geometry design achieves very low on-state
resistance combined with high transconductance. HEXFET
transistors also feature all of the well-established advantages
of MOSFETs, such as voltage control, very fast switching,
ease of paralleling and electrical parameter temperature stability.
They are well-suited for applications such as switching power
supplies, motor controls, inverters, choppers, audio amplifiers,
high energy pulse circuits, and virtually any application where
high reliability is required. The HEXFET transistor’s totally
isolated package eliminates the need for additional isolating
material between the device and the heatsink. This improves
thermal efficiency and reduces drain capacitance.
TO-257AA
Features:
n
n
n
n
n
n
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Ceramic Eyelets
Ideally Suited For Space Level
Applications
Absolute Maximum Ratings
Parameter
ID @ VGS = -10V, TC = 25°C
ID @ VGS = -10V, TC = 100°C
IDM
PD @ TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
T STG
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current À
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy Á
Avalanche Current À
Repetitive Avalanche Energy À
Peak Diode Recovery dv/dt Â
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
Units
-11.2
-7.1
-44
75
0.6
±20
400
-11.2
7.5
-5.5
-55 to 150
300(0.063in./1.6mm from case for 10 sec)
4.3 (Typical)
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
g
For footnotes, refer to the last page
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1
02/09/10
IRFY9130C, IRFY9130CM
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
BVDSS
Parameter
Min
Drain-to-Source Breakdown Voltage
-100
—
—
V
—
-0.1
—
V/°C
—
—
0.30
Ω
VGS = -10V, ID = -7.1A Ã
-2.0
2.5
—
—
—
—
—
—
-4.0
—
-25
-250
V
S
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.8
-100
100
30
7.1
21
60
140
140
140
—
nC
VDS = VGS, ID = -250µA
VDS > -15V, IDS = -7.1A Ã
VDS= -80V ,VGS=0V
VDS = -80V,
VGS = 0V, TJ = 125°C
VGS = -20V
VGS = 20V
VGS = -10V, ID = -11.2A
VDS = -50V
ns
VDD = -50V, ID = -11.2A,
VGS = -10V, RG = 7.5Ω
∆BVDSS /∆T J Temperature Coefficient of Breakdown
Voltage
RDS(on)
Static Drain-to-Source On-State
Resistance
VGS(th)
Gate Threshold Voltage
g fs
Forward Transconductance
IDSS
Zero Gate Voltage Drain Current
IGSS
IGSS
Qg
Q gs
Q gd
td(on)
tr
td(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Typ Max Units
µA
nA
nH
Test Conditions
VGS = 0V, ID = -1.0mA
Reference to 25°C, ID = -1.0mA
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
—
—
—
800
350
125
—
—
—
pF
VGS = 0V, VDS = -25V
f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS
ISM
VSD
trr
Q RR
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) À
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
ton
Forward Turn-On Time
—
—
—
—
—
—
—
—
—
—
-11.2
-44
-4.7
250
3.0
Test Conditions
A
V
nS
µC
Tj = 25°C, IS = -11.2A, VGS = 0V Ã
Tj = 25°C, IF = -11.2A, di/dt ≤ -100A/µs
VDD ≤ -50V Ã
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
RthCS
RthJA
Junction-to-Case
Case-to-sink
Junction-to-Ambient
Min Typ Max
—
—
—
— 1.67
0.21 —
—
80
Units
Test Conditions
°C/W
Typical socket mount
Note: Corresponding Spice and Saber models are available on International Rectifier Website.
For footnotes refer to the last page
2
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IRFY9130C, IRFY9130CM
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
ID=-11.2A
Fig 3. Typical Transfer Characteristics
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Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRFY9130C, IRFY9130CM
ID=-11.2A
3a
4
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 8. Maximum Safe Operating Area
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IRFY9130C, IRFY9130CM
V DS
V GS
RD
D.U.T.
RG
-
+
V DD
V GS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
td(on)
tr
t d(off)
tf
VGS
10%
90%
Fig 9. Maximum Drain Current Vs.
Case Temperature
VDS
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFY9130C, IRFY9130CM
L
VDS
D.U.T
RG
VGS
-20V
IAS
tp
VDD
A
DRIVER
0.01Ω
15V
Fig 12a. Unclamped Inductive Test Circuit
I AS
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
tp
V(BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
QG
-10V
QGS
50KΩ
-10V
12V
.2µF
.3µF
QGD
D.U.T.
+VDS
VGS
VG
-3mA
Charge
Fig 13a. Basic Gate Charge Waveform
6
IG
ID
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
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IRFY9130C, IRFY9130CM
Foot Notes:
 ISD ≤ -11.2A, di/dt ≤ -140A/µs,
À Repetitive Rating; Pulse width limited by
VDD ≤ -100V, TJ ≤ 150°C
maximum junction temperature.
Á VDD = -25V, starting TJ = 25°C, L= 6.4mH
Peak IL = -11.2A, VGS = -10V
à Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions — TO-257AA
0.13 [.005]
A
10.66 [.420]
10.42 [.410]
3X Ø
3.81 [.150]
3.56 [.140]
16.89 [.665]
16.39 [.645]
13.63 [.537]
13.39 [.527]
1
2
5.08 [.200]
4.83 [.190]
10.92 [.430]
10.42 [.410]
1.14 [.045]
0.89 [.035]
B
3
0.71 [.028]
MAX.
C
15.88 [.625]
12.70 [.500]
2.54 [.100]
2X
3X Ø
0.88 [.035]
0.64 [.025]
Ø 0.50 [.020]
C A
3.05 [.120]
B
NOT ES :
1.
2.
3.
4.
DIMENS IONING & T OLERANCING PER ANS I Y14.5M-1994.
CONT ROLLING DIMENS ION: INCH.
DIMENS IONS ARE S HOWN IN MILLIMET ERS [INCHES ].
OUT LINE CONFORMS T O JEDEC OUT LINE T O-257AA.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 02/2010
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