OKI MSM5416126A 131,072-word x 16-bit dynamic ram : fast page mode type with edo Datasheet

E2L0050-29-61
¡ Semiconductor
MSM5416126A
¡ Semiconductor
This version:
Jun. 1999
MSM5416126A
Previous version: Jan. 1998
131,072-Word ¥ 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE WITH EDO
DESCRIPTION
The OKI MSM5416126A is a 128K-word ¥ 16-bit dynamic RAM fabricated in OKI's CMOS silicon
gate technology. The MSM5416126A achieves high integration, high-speed operation, and lowpower consumption due to quadruple polysilicon double metal CMOS. The MSM5416126A has
conventional two CAS type 256K ¥ 16 DRAM compatible pinout. The MSM5416126A is available in
a 40-pin plastic SOJ or 44/40-pin plastic TSOP.
FEATURES
• Fast Page Mode with Extended Data Out
• Byte wide control: 2 CAS control
• 131,072-word ¥ 16-bit organization
• Pin compatible with 2 CAS type 256K ¥ 16 DRAM
• Single 5 V power supply, ±10% tolerance
• CAS before RAS refresh, Hidden refresh, RAS only refresh capability
• Refresh: 512 cycles/8 ms
• Package options:
40-pin 400 mil plastic SOJ
(SOJ40-P-400-1.27)
(Product : MSM5416126A-xxJS)
44/40-pin 400 mil plastic TSOP (Type II) (TSOPII44/40-P-400-0.80-K) (Product : MSM5416126A-xxTS-K)
xx indicates speed rank.
PRODUCT FAMILY
Family
MSM5416126A-40
Access Time (Max.)
tRAC
tAA
tCAC tOEA
40 ns 22 ns 14 ns 14 ns
Cycle Time (Min.)
tRC
tHPC
75 ns
20 ns
Power Dissipation
Operating (Max.) Standby (Max.)
770 mW
MSM5416126A-45
45 ns 24 ns 14 ns 14 ns
85 ns
20 ns
715 mW
MSM5416126A-50
50 ns 26 ns 14 ns 14 ns
100 ns
22 ns
660 mW
MSM5416126A-60
60 ns 30 ns 15 ns 15 ns
120 ns
25 ns
605 mW
11 mW
1/22
¡ Semiconductor
MSM5416126A
PIN CONFIGURATION (TOP VIEW)
VCC 1
40 VSS
DQ0 2
39 DQ15
DQ1 3
38 DQ14
DQ2 4
37 DQ13
DQ3 5
36 DQ12
VCC 6
35 VSS
DQ4 7
34 DQ11
DQ5 8
33 DQ10
DQ6 9
32 DQ9
DQ7 10
31 DQ8
NC 11
30 NC
NC 12
29 LCAS
WE 13
28 UCAS
RAS 14
27 OE
NC 15
26 A8
A0 16
25 A7
A1 17
24 A6
A2 18
23 A5
A3 19
22 A4
VCC 20
21 VSS
VCC
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
1
2
3
4
5
6
7
8
9
10
44
43
42
41
40
39
38
37
36
35
VSS
DQ15
DQ14
DQ13
DQ12
VSS
DQ11
DQ10
DQ9
DQ8
NC
NC
WE
RAS
NC
A0
A1
A2
A3
VCC
13
14
15
16
17
18
19
20
21
22
32
31
30
29
28
27
26
25
24
23
NC
LCAS
UCAS
OE
A8
A7
A6
A5
A4
VSS
44/40-Pin Plastic TSOP (II)
(K Type)
40-Pin Plastic SOJ
Pin Name
Function
Address Input
A0 - A8
Row Address
: A0 - A8
Column Address : A0 - A7
RAS
Row Address Strobe
LCAS
Lower Byte Column Address Strobe
UCAS
DQ0 - DQ15
Upper Byte Column Address Strobe
Data - Input / Data - Output
WE
Write Enable
OE
Output Enable
VCC
Power Supply (5 V)
VSS
Ground (0 V)
NC
No Connection
Note: The same power supply voltage must be provided to every VCC pin, and the same GND
voltage level must be provided to every VSS pin.
2/22
¡ Semiconductor
MSM5416126A
BLOCK DIAGRAM
OE
RAS
WE
Timing
Generator
I/O
Controller
LCAS
UCAS
I/O
Controller
Burst
Address
Counter
8
Output
Buffers
8
Input
Buffers
8
8
Input
Buffers
8
8
Output
Buffers
8
DQ0 - DQ7
Column
Address
Buffers
8
8
Internal
Address
Counter
A0 - A8
Refresh
Control Clock
Row
Address
Buffers
9
Row
Decoders
9
Column Decoders
Sense Amplifiers
Word
Drivers
16
I/O
Selector 16
DQ8 - DQ15
Memory
Cells
8
VCC
On-chip
VBB Generator
VSS
FUNCTION TABLE
Input Pin
RAS
LCAS
DQ Pin
UCAS
WE
OE
DQ0 - DQ7
DQ8 - DQ15
Function Mode
H
*
*
*
*
High-Z
High-Z
Standby
L
H
H
*
*
High-Z
High-Z
Refresh
L
L
H
H
L
Lower Byte Read
H
L
H
L
DOUT
High-Z
High-Z
L
DOUT
Upper Byte Read
L
L
L
H
L
DOUT
DOUT
Word Read
L
L
H
L
H
DIN
Don't Care
Lower Byte Write
L
H
L
L
H
Don't Care
DIN
Upper Byte Write
L
L
L
L
H
DIN
DIN
Word Write
L
L
L
H
H
High-Z
High-Z
—
* : "H" or "L"
3/22
¡ Semiconductor
MSM5416126A
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
Unit
Voltage on Any Pin Relative to VSS
VT
Ta = 25°C
–1.0 to 7.0
V
Short Circuit Output Current
IOS
Ta = 25°C
50
mA
Power Dissipation
PD
Ta = 25°C
1
W
Operating Temperature
Topr
—
0 to 70
°C
Storage Temperature
Tstg
—
–55 to 150
°C
Recommended Operating Conditions
Parameter
Power Supply Voltage
(Ta = 0°C to 70°C)
Symbol
Min.
Typ.
Max.
Unit
VCC
4.5
5.0
5.5
V
VSS
0
0
0
V
Input High Voltage
VIH
2.4
—
6.5
V
Input Low Voltage
VIL
–1.0
—
0.8
V
Capacitance
(VCC = 5 V ±10%, Ta = 25°C, f = 1 MHz)
Symbol
Typ.
Max.
Unit
Input Capacitance (A0 - A8)
CIN1
—
7
pF
Input Capacitance
(RAS, LCAS, UCAS, WE, OE)
CIN2
—
7
pF
Output Capacitance (DQ0 - DQ15)
CI/O
—
10
pF
Parameter
4/22
¡ Semiconductor
MSM5416126A
DC Characteristics
(VCC = 5 V ±10%, Ta = 0°C to 70°C)
Parameter
Symbol
Condition
MSM5416126A MSM5416126A MSM5416126A MSM5416126A
-40
-45
-50
-60
Unit Note
Min. Max. Min. Max. Min. Max. Min. Max.
Output High Voltage
VOH
IOH = –1.0 mA
2.4
VCC
2.4
VCC
2.4
VCC
2.4
VCC
V
Output Low Voltage
VOL
IOL = 1.0 mA
0
0.4
0
0.4
0
0.4
0
0.4
V
Input Leakage Current
ILI
0 V £ VI £ 6.5 V ;
All other pins not –10
under test = 0 V
10
–10
10
–10
10
–10
10
mA
Output Leakage Current
ILO
DQi Disable
–10
0 V £ VO £ 5.5 V
10
–10
10
–10
10
–10
10
mA
Average Power
Supply Current
(Operating)
ICC1
RAS, CAS Cycling,
tRC = Min.
—
140
—
130
—
120
—
110
mA 1, 2
Power Supply
Current (Standby)
ICC2
RAS, CAS = VIH
—
2
—
2
—
2
—
2
Average Power
Supply Current
(RAS Only Refresh)
ICC3
RAS = Cycling,
CAS = VIH,
tRC = Min.
—
140
—
130
—
120
—
110
Power Supply
Current (Standby)
ICC5
RAS = VIH,
CAS = VIL,
Dout = Enable
—
5
—
5
—
5
—
5
Average Power
Supply Current
ICC6
(CAS before RAS Refresh)
RAS = Cycling,
CAS before RAS
—
140
—
130
—
120
—
110
mA 1, 2
Average Power
Supply Current
(Fast Page Mode)
RAS = VIL,
CAS Cycling,
tPC = Min.
—
130
—
130
—
120
—
110
mA 1, 3
Notes :
ICC7
mA
1
mA 1, 2
mA
1
1. Specified values are obtained with output open.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while CAS = VIH.
5/22
¡ Semiconductor
MSM5416126A
AC Characteristics (1/2)
Parameter
(VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3
Symbol
MSM5416126A MSM5416126A MSM5416126A MSM5416126A
-40
-45
-50
-60
Unit Note
Min. Max. Min. Max. Min. Max. Min. Max.
—
120
—
ns
145
—
165
—
ns
22
—
25
—
ns
—
65
—
80
—
ns
45
—
50
—
60
ns 4, 9, 10
—
14
—
14
—
15
ns
—
24
—
26
—
30
ns 4, 10
14
—
14
—
14
—
15
ns
26
—
27
—
29
—
34
ns 4, 9, 10
0
—
0
—
0
—
0
—
ns
tRC
75
—
85
—
100
Read Modify Write Cycle Time
tRWC
115
—
130
—
Hyper Page Mode Cycle Time
tHPC
20
—
20
—
Fast Page Mode Read Modify Write Cycle Time tPRWC
60
—
60
Access Time from RAS
tRAC
—
40
—
Access Time from CAS
tCAC
—
14
Access Time from Column Address
tAA
—
22
Access Time from OE
tOEA
—
Access Time from CAS Precharge
tCPA
—
Output Low Impedance Time from CAS tCLZ
Random Read or Write Cycle Time
4, 9
Data Hold After CAS Low
tCOH
3
—
3
—
3
—
3
—
ns
Output Buffer Turn-off Delay Time
tOFF
3
8
3
8
3
8
3
10
ns
5
OE to Data Output Buffer
Turn-off Delay Time
tOEZ
3
8
3
8
3
8
3
10
ns
5
Transition Time
tT
2
35
2
35
2
35
2
35
ns
Refresh Period
tREF
—
8
—
8
—
8
—
8
ms
—
ns
RAS Precharge Time
tRP
25
—
30
—
40
—
50
RAS Pulse Width
tRAS
40
10,000
45
10,000
50
10,000
60
RAS Pulse Width (Fast Page Mode)
tRASP
40 100,000 45 100,000 50 100,000 60 100,000 ns
RAS Hold Time
tRSH
14
—
14
—
14
—
15
—
ns
RAS Hold Time referenced to OE
tROH
8
—
8
—
10
—
10
—
ns
—
ns
10,000 ns
CAS Precharge Time (Fast Page Mode) tCP
5
—
6
—
7
—
8
CAS Pulse Width
tCAS
8
10,000
8
10,000
9
10,000
12
CAS Hold Time
tCSH
40
—
45
—
50
—
60
—
ns
CAS to RAS Precharge Time
tCRP
5
—
5
—
5
—
5
—
ns
RAS to CAS Delay Time
tRCD
18
26
18
31
20
36
20
45
ns
9
RAS to Column Address Delay Time
tRAD
12
18
13
21
15
24
15
30
ns
10
Row Address Set-up Time
tASR
0
—
0
—
0
—
0
—
ns
Row Address Hold Time
tRAH
8
—
8
—
10
—
10
—
ns
Column Address Set-up Time
tASC
0
—
0
—
0
—
0
—
ns
11
Column Address Hold Time
tCAH
6
—
6
—
8
—
10
—
ns
11
Column Address Hold Time from RAS
tAR
30
—
30
—
35
—
45
—
ns
Column Address to RAS Lead Time
tRAL
22
—
24
—
26
—
30
—
ns
14
10,000 ns
12
6/22
¡ Semiconductor
MSM5416126A
AC Characteristics (2/2)
Parameter
(VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3
Symbol
MSM5416126A MSM5416126A MSM5416126A MSM5416126A
-40
-45
-50
-60
Unit Note
Min. Max. Min. Max. Min. Max. Min. Max.
Read Command Set-up Time
tRCS
0
—
0
—
0
—
0
—
ns
Read Command Hold Time
tRCH
0
—
0
—
0
—
0
—
ns 6, 11
Read Command Hold Time
referenced to RAS
tRRH
0
—
0
—
0
—
0
—
ns
Write Command Set-up Time
tWCS
0
—
0
—
0
—
0
—
ns 8, 11
Write Command Hold Time
tWCH
8
—
8
—
9
—
10
—
ns
Write Command Pulse Width
tWP
7
—
8
—
9
—
10
—
ns
Write Command Hold Time from RAS
tWCR
30
—
30
—
35
—
45
—
ns
OE Command Hold Time
tOEH
8
—
8
—
9
—
10
—
ns
11
6
11
Write Command to CAS Lead Time
tCWL
7
—
8
—
9
—
12
—
ns
Write Command to RAS Lead Time
tRWL
14
—
14
—
14
—
15
—
ns
Output Buffer Turn-off
Delay Time from WE
tWEZ
3
15
3
15
3
15
3
15
ns
5
Output Buffer Turn-off
Delay Time from CAS
tCEZ
3
8
3
8
3
8
3
10
ns
5
Data to CAS Delay Time
tDZC
0
—
0
—
0
—
0
—
ns
Data to OE Delay Time
tDZO
0
—
0
—
0
—
0
—
ns
Data-in Set-up Time
tDS
0
—
0
—
0
—
0
—
ns 7, 11
13
Data-in Hold Time
tDH
7
—
8
—
9
—
10
—
ns 7, 11
Data-in Hold Time referenced to RAS
tDHR
30
—
30
—
35
—
45
—
ns
OE to Data-in Delay Time
tOED
8
—
8
—
8
—
10
—
ns
CAS to WE Delay Time
tCWD
28
—
30
—
32
—
35
—
ns
8
Column Address to WE Delay Time
tAWD
38
—
40
—
44
—
50
—
ns
8
RAS to WE Delay Time
tRWD
60
—
65
—
70
—
80
—
ns
8
OE "L" to CAS "H" Lead Time
tOCH
10
—
10
—
10
—
10
—
ns
CAS "H" to OE "L" Lead Time
tCHO
10
—
10
—
10
—
10
—
ns
Hi-Z Command Pulse Width
tOEP
10
—
10
—
10
—
10
—
ns
CAS Active Delay Time
from RAS Precharge
tRPC
0
—
0
—
0
—
0
—
ns
11
RAS to CAS Set-up Time
(CAS before RAS)
tCSR
10
—
10
—
10
—
10
—
ns
11
RAS to CAS Hold Time
(CAS before RAS)
tCHR
10
—
10
—
10
—
10
—
ns
12
7/22
¡ Semiconductor
Notes:
MSM5416126A
1. An initial pause of 200 ms is required after power-up, followed by any 8 RAS cycles.
(Example : RAS-only-refresh) before proper device operation is achieved.
2. The AC characteristics assume tT = 5 ns.
3. VIH (Min.) and VIL (Max.) are reference levels for measuring timing of input signals.
Also, transition times are measured between VIH and VIL.
4. This parameter is measured with a load circuit equivalent to 1 TTL load and 50 pF.
Output timing reference levels are VOH = 2.0 V and VOL = 0.8 V.
5. tCEZ (Max.), tOFF (Max.), tWEZ (Max.) and tOEZ (Max.) define the time at which the
outputs achieve the open circuit condition and are not referenced to output voltage
levels.
6. tRCH or tRRH must be satisfied for a read cycle.
7. These parameters are referenced to UCAS, LCAS, leading edge in an early write cycle,
and to WE leading edge in an OE control write cycle or a read modify write cycle.
8. tWCS, tCWD, tRWD and tAWD are not restrictive operating parameters. They are included
in the data sheet as electrical characteristics only. If tWCS ≥ tWCS (Min.), the cycle is an
early write cycle and the data out will remain open circuit (high impedance) throughout
the entire cycle. If tCWD ≥ tCWD (Min.) , tRWD ≥ tRWD (Min.) and tAWD ≥ tAWD (Min.) ,
the cycle is a read modify write cycle and data out will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the
data out (at access time) is indeterminate.
9. Operation within the tRCD (Max.) limit insures that tRAC (Max.) can be met.
tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified
tRCD (Max.) limit, then access time is controlled by tCAC.
10. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met.
tRAD (Max.) is specified as a reference point only: If tRAD is greater than the specified
tRAD (Max.) limit, then access time is controlled by tAA.
11. These parameters are determined by the falling edge of UCAS or LCAS, whichever is
earlier.
12. These parameters are determined by the rising edge of UCAS or LCAS, whichever is
later.
13. tCWL should be satisfied by both UCAS and LCAS.
14. tCP is determined by the time both UCAS and LCAS are high.
15. Input levels at the AC testing are 3.0 V/0.5 V.
8/22
¡ Semiconductor
MSM5416126A
,
,,
TIMING WAVEFORM
Read Cycle (RAS Output Control)
tRC
tRP
tRAS
RAS
tCRP
tCSH
tCRP
tRCD
UCAS
LCAS
tRSH
tCAS
tAR
tRAD
tASR
A0 - A8
tRAH
tRAL
tASC
Row
tCAH
Column
tRCS
tRRH
WE
tROH
tOEZ
tOEA
OE
tCAC
tCEZ
tAA
DQ0 - 7
Open
Valid Data
tRAC
DQ8 - 15
Open
Valid Data
"H" or "L"
9/22
¡ Semiconductor
MSM5416126A
,
,,
Read Cycle (CAS Output Control)
tRC
tRP
tRAS
RAS
tCRP
tCSH
tCRP
tRCD
UCAS
LCAS
tRSH
tCAS
tAR
tRAD
tASR
A0 - A8
tRAH
tRAL
tASC
Row
tCAH
Column
tRCS
tRRH
WE
tROH
tOEZ
tOEA
OE
tCAC
tCEZ
tAA
DQ0 - 7
Open
Valid Data
tRAC
DQ8 - 15
Open
Valid Data
"H" or "L"
10/22
¡ Semiconductor
MSM5416126A
,
,,
,
,,
Early Write Cycle (LCAS and UCAS Active)
tRC
tRP
tRAS
RAS
tCSH
tCRP
tRCD
UCAS
LCAS
tRSH
tCAS
tAR
tRAD
tASR
A0 - A8
tRAH
tRAL
tASC
Row
tCAH
Column
tCWL
tRWL
tWP
WE
tWCR
tWCS
tWCH
OE
tDHR
tDS
DQ0 - 7
Valid Data
tDS
DQ8 - 15
tDH
tDH
Valid Data
"H" or "L"
11/22
¡ Semiconductor
MSM5416126A
,
,,
,
,,
Late Write Cycle (LCAS and UCAS Active)
tRC
tRP
tRAS
RAS
tCSH
tCRP
tRCD
UCAS
LCAS
tRSH
tCAS
tAR
tRAD
tASR
A0 - A8
tRAH
Row
tRAL
tASC
tCAH
Column
tCWL
tRWL
tRCS
tWP
WE
tWCR
tOEH
OE
tOED
tDH
Valid Data
DQ0 - 7
tOED
DQ8 - 15
tDS
tDS
tDH
Valid Data
"H" or "L"
12/22
¡ Semiconductor
MSM5416126A
,
,,
,,
,,
Read Modify Write Cycle (LCAS and UCAS Active)
tRWC
tRP
tRAS
RAS
tCSH
tCRP
tRCD
UCAS
LCAS
tRSH
tCAS
tAR
tRAD
tASR
A0 - A8
tRAH
tRAL
tASC
Row
tCAH
Column
tAWD
tCWL
tRWL
tWP
tRCS
WE
tRWD
tCWD
tDZO
tOEA
tOEZ
tOEH
OE
tOED
tCAC
tDZC
tDS
tCLZ
Out
DQ0 - 7
tDH
In
tRAC
tCLZ
DQ8 - 15
tDS
Out
tDH
In
"H" or "L"
13/22
¡ Semiconductor
MSM5416126A
Fast Page Mode Read Cycle with Extended Data Out
tRASP
tRP
RAS
tCSH
tHPC
tRSH
,
,
tCRP
tCP
tCP
tCAS
UCAS
LCAS
tCAS
tCAS
tRAD
tASR
A0 - A8
tRCD
Row
tRAH
tAR
tASC tCAH
Column
tASC
tASC
tCAH
Column
tRAL
tCAH
Column
tRCH
tRCS
WE
tAA
tRRH
tOEA
OE
tCAC
tCAC
tCOH
DQ0 - 7
Open
tRAC
DQ8 - 15
Open
tCAC
tCOH
tOFF
tOEZ
Valid Data
tCPA
tAA
Valid Data
tCPA
tAA
Valid Data
Valid Data
Valid Data
Valid Data
"H" or "L"
14/22
tCSH
tCRP
tRCD
UCAS
LCAS
tHPC
tRSH
tCP
tCAS
tCP
tCRP
tCP
tCAS
tCAS
tCAS
tRAL
tRAD
,
tASR tRAH
A0 - A8
tASC
Row
tCAH
tASC tCAH
tASC tCAH
tASC tCAH
Column
Column
Column
Column
tRRH
tRCS
tRCH
tRCS
tRCH
¡ Semiconductor
tAR
RAS
Fast Page Mode Read High-Z Operation
tRP
tRASP
WE
tRAC
tCHO
tOEA
tCAC
tOEP
tAA
OE
tCAC
tCOH
tWP
tOEP
tCAC
tCPA
tAA
tOCH
tAA
tOEZ
tOEA
tCAC
tOEZ tOEA
tWEZ
tAA
tCEZ
Open
Valid Data
Valid
Data
Valid*
Data
Valid*
Data
Valid Data
DQ8 - 15
Open
Valid Data
Valid
Data
Valid*
Data
Valid*
Data
Valid Data
15/22
* : Same Data,
"H" or "L"
MSM5416126A
DQ0 - 7
¡ Semiconductor
MSM5416126A
Fast Page Mode Early Write Cycle
tRASP
tRP
RAS
,,,
,
,,
tCRP
tCSH
tCAS
tCAS
tAR
tCAH
tRAD
tASR
tRAH
tASC
Row
tRAL
tASC
Column
tWCS
tWP
tWCH
tCAH
Column
tCWL
WE
tRSH
tCP
tCP
tCAS
UCAS
LCAS
A0 - A8
tHPC
tRCD
tASC
Column
tCWL
tWCS
tWP
tWCH
tCAH
tCWL
tWCS
tWP
tWCH
OE
tDS
DQ0 - 7
Input Data
tDS
DQ8 - 15
tDH
tDH
Input Data
tDS
tDH
Input Data
tDS
tDH
Input Data
tDS
tDH
Input Data
tDS
tDH
Input Data
"H" or "L"
16/22
¡ Semiconductor
MSM5416126A
Fast Page Mode Read Modify Write Cycle
,
,
,
,
tRP
tRASP
tAR
RAS
tCSH
tCRP
tRCD
tCAS
tPRWC
tCAS
tCP
tRSH
tCAS
tCP
UCAS
LCAS
tRAD
tASR tRAH
A0 - A8
tCAH
tASC
Row
tCAH
tASC
Column
tAWD
tCWD
tWP
tOEA
tCWL
tAWD
tCWD
tRCS
Column
tCWL
tAWD
WE
tASC
Column
tCWL
tRAL
tCAH
tCWD
tWP
tOEA
tOEZ
tWP
tOEA
tOEZ
tOEZ
OE
tRAC
tCAC
tAA
tCLZ
DQ0 - 7
tDS
Out
tRAC
DQ8 - 15
tCAC
tDH
tCAC
tAA
tCLZ
tAA
tDS
tCLZ
In
Out
tDH
tCAC
tAA tDS
tDS
Out
tCAC
tDH
In
tCLZ
Out
tCLZ
In
tDS
Out
tDH
In
tDH
tAA
In
tDH
tCAC
tAA tDS
tCLZ
Out
In
"H" or "L"
17/22
,
,,,
¡ Semiconductor
MSM5416126A
CAS before RAS Refresh Cycle
tRC
tRP
tRAS
tRP
RAS
tRPC
UCAS
LCAS
tCSR
tRPC
tCHR
Inhibit Falling Transition
A0 - A8
WE
OE
tOFF
Open
DQ0 - 7
tOFF
DQ8 - 15
Open
"H" or "L"
18/22
¡ Semiconductor
MSM5416126A
Hidden Refresh Cycle
,
,,
,
,
tRC
tRAS
tRP
tRAS
RAS
tCRP
tRCD
tRSH
tCHR
UCAS
LCAS
tAR
tRAD
tASR
A0 - A8
tRAH
tRAL
tASC
Row
tCAH
Column
tRRH
tRCS
WE
tROH
tOEZ
tOEA
OE
tRAC
tOFF
tCAC
tAA
DQ0 - 7
Open
Valid Data
tRAC
tCAC
tAA
DQ8 - 15
Open
tOFF
Valid Data
"H" or "L"
19/22
,,,,
¡ Semiconductor
MSM5416126A
RAS Only Refresh Cycle
tRC
tRAS
tRP
RAS
tRPC
tCRP
UCAS
LCAS
A0 - A8
tASR
tRAH
Row
WE
OE
DQ0 - 7
Open
DQ8 - 15
Open
"H" or "L"
20/22
¡ Semiconductor
MSM5416126A
PACKAGE DIMENSIONS
(Unit : mm)
SOJ40-P-400-1.27
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.70 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
21/22
¡ Semiconductor
MSM5416126A
(Unit : mm)
TSOPII44/40-P-400-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.49 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
22/22
E2Y0002-29-11
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
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