ADDtek AMC1117-1.5 1a low dropout positive regulator Datasheet

AMC1117
1A LOW DROPOUT
POSITIVE REGULATOR
www.addmtek.com
DESCRIPTION
FEATURES
The AMC1117 series of positive adjustable and fixed
regulators is designed to provide 1A for applications
requiring high efficiency. All internal circuitry is designed
to operated down to 800mV input to output differential and
the dropout voltage is fully specified as a function of load
current.
The AMC1117 offers current limiting and thermal
protection. The on chip trimming adjusts the reference
voltage accuracy to 1%.
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Output current of 1A typical
Three-terminal adjustable or fixed 1.5V, 1.8V,
2.5V, 3.3V, 5.0V outputs
Low dropout of typical 800mV
Thermal protection built in
Typical 0.015% line regulation
Typical 0.01% load regulation
Fast transient response
Available in SOT-223 and TO-252 packages
Pin assignment identical to earlier LT1117 series.
APPLICATIONS
„
„
„
„
„
PACKAGE PIN OUT
2.85V Model for SCSI-2 Active Termination
Battery Charger
High Efficiency Linear Regulators
Battery Powered Instrumentation
Post Regulator for Switching DC/DC Converter
3. VIN
2. VOUT
1. ADJ/GND
3-Pin Plastic SOT-223
Surface Mount
(Top View)
VOLTAGE OPTIONS
AMC1117-1.5
AMC1117-1.8
AMC1117-2.5
AMC1117-3.3
AMC1117-5.0
AMC1117
– 1.5V Fixed
– 1.8V Fixed
– 2.5V Fixed
– 3.3V Fixed
– 5.0V Fixed
– Adjustable Output
3. VIN
2. V out
1. ADJ/GND
3-Pin Plastic TO-252
Surface Mount
(Top View)
ORDER INFORMATION
TA (OC)
0 to 70
Note:
SK
SOT-223
3-pin
SJ
TO-252
3-pin
AMC1117-X.XSKF (Lead Free)
AMC1117-X.XSJF (Lead Free)
AMC1117SKF (Lead Free)
AMC1117SJF (Lead Free)
1.All surface-mount packages are available in Tape & Reel.
2.The letter “F” is marked for Lead Free process.
Copyright © 2006 ADDtek Corp.
Append the letter “T” to part number (i.e. AMC1117-X.XSJT).
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AMC1117
BLOCK DIAGRAM
VIN
VOUT
ADJ
For
Fixed
Output
Options
GND
Copyright © 2006 ADDtek Corp.
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AMC1117
ABSOLUTE MAXIMUM RATINGS
(Note1)
7V
0 OC to 150 OC
-65 OC to 150 OC
260 OC
Input Voltage
Operating Junction Temperature Range, TJ
Storage Temperature Range
Lead Temperature (soldiering, 10 seconds)
Note 1: Exceeding these ratings could cause damage to the device.
out of the specified terminal.
Package
θJA
(OC /W )
SKF
SJF
136
80
All voltages are with respect to Ground.
Currents are positive into, negative
POWER DISSIPATION TABLE
TA=70 OC
Derating factor ( mW/ OC)
TA≤ 25 OC
TA≥ 25 OC
Power rating(mW) Power rating(mW)
7.35
12.5
919
1562
TA= 85 OC
Power rating (mW)
588
1000
478
812
Note :
1.
θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption.
Junction Temperature Calculation: TJ = TA + (PD × θJA), Po = DF × (TJ- TA)
The θJA numbers are guidelines for the thermal performance of the device/PC-board system.
All of the above assume no ambient airflow.
2.
θJT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD × θJT)
For SK package, θJT = 15.0 OC /W.
For SJ package, θJT = 7.0 OC /W.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Input Voltage
VIN
2.7
7
Load Current (with adequate heat sinking)
IO
5
Input Capacitor (VIN to GND)
10
Output Capacitor with ESR of 10Ω max., (VOUT to GND)
10
Junction temperature
Copyright © 2006 ADDtek Corp.
TJ
3
125
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Units
V
mA
µF
µF
O
C
JULY 2006
AMC1117
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, IO =10mA, and TJ = 25 OC.
Parameter
Reference
Voltage
Symbol
AMC1117
1.250
1.262
10mA ≤ IO ≤ 1A, 2.65V ≤ VIN ≤ 7V
1.225
1.250
1.275
IO = 10mA, VIN = 3.0V
1.485
1.500
1.515
10mA ≤ IO ≤ 1A, 3.0V ≤ VIN ≤ 7V
1.470
1.500
1.530
IO = 10mA, VIN = 3.3V
1.782
1.8
1.818
10mA ≤ IO ≤ 1A, 3.3V ≤ VIN ≤ 7V
1.764
1.8
1.836
IO = 10mA, VIN = 4.0V
2.475
2.500
2.525
10mA ≤ IO ≤ 1A, 4.0V ≤ VIN ≤ 7V
2.450
2.500
2.550
IO = 10mA, VIN = 4.8V
3.267
3.300
3.333
10mA ≤ IO ≤ 1A, 4.8V ≤ VIN ≤ 7V
3.235
3.300
3.365
IO = 10mA, VIN = 6.5V
4.950
5.000
5.050
10mA ≤ IO ≤ 1A, 6.5V ≤ VIN ≤ 7V
4.900
5.000
5.100
IO = 10mA, VOUT +1.5V ≤ VIN ≤ 7V
0.04
0.20
%
IO = 10mA, VOUT +1.5V ≤ VIN ≤ 7V
1.0
6.0
mV
10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V
0.10
0.40
%
10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V
1.0
10.0
mV
IO = 10mA, VIN≧2.65V
0.8
1.15
IO = 500mA, VIN≧2.65V
0.8
1.25
IO = 1A, VIN≧2.65V
0.8
1.30
VIN ≤ 7V
2
7
mA
IQ
VIN ≤ 7V
6
13
mA
ICL
VIN – VOUT = 3V
VOUT
AMC1117-3.3
AMC1117-5.0
AMC1117
Line
Regulation AMC1117-X.X
∆VOI
AMC1117
Load
Regulation AMC1117-X.X
∆VOL
∆V
Dropout Voltage
Minimum Load Current
Quiescent
Current
(Note 1)
AMC1117-X.X
Current Limit
Adjust Pin Current
Thermal Regulation
1
IO = 10mA, VIN – VOUT = 2V
(Note 2)
Ripple rejection (Note 2)
Units
1.238
AMC1117-1.8
AMC1117-2.5
AMC1117
Min
Typ
Max
IO = 10mA, VIN = 5V
VREF
AMC1117-1.5
Output
Voltage
Test Conditions
O
TA = 25 C, 30 ms pulse
RR
fO = 120HZ, 1V RMS, I O = 400mA,
VIN – VOUT = 3V
60
V
V
V
1.2
A
50
120
µA
0.01
0.1
%/W
75
dB
Note 1:
For the adjustable device, the minimum load current is the minimum current required to maintain regulation. Normally the current in
the resistor divider used to set the output voltage is selected to meet the minimum load current requirement.
Note 2:
These parameters, although guaranteed, are not tested in production.
Copyright © 2006 ADDtek Corp.
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AMC1117
CHARACTERIZATION CURVES
Unless otherwise specified, VIN= VOUT+2V,CIN=1µF,COUT=4.7µF,TA=25 OC
Load Regulation
Load Regulation
2.53
2.88
AMC1117-2.5
2.52
VO (V)
2.51
VO (V)
AMC1117-2.85
2.87
2.5
2.49
2.48
2.86
2.85
2.84
2.83
2.47
2.82
2.46
0
200
400
600
800
0
1000
200
IO (mA)
5.02
1000
800
1000
AMC1117-5.0
5.01
5
VO (V)
VO (V)
800
Load Regulation
AMC1117-3.3
4.99
4.98
4.97
4.96
4.95
4.94
0
200
400
600
800
0
1000
200
400
600
IO (mA)
IO (mA)
Quiescent Current vs.
Temperature
Temperature Stability
2
10
Quiescent Current (mA)
Output Voltage Change (%)
600
IO (mA)
Load Regulation
3.34
3.33
3.32
3.31
3.3
3.29
3.28
3.27
3.26
400
1.5
1
0.5
0
-0.5
-1
-1.5
-2
-40 -20
0
20 40
Copyright © 2006 ADDtek Corp.
8
6
4
2
0
-40 -20
60 80 100 120
TA (OC)
0
20 40
60 80 100 120
TA (OC)
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AMC1117
APPLICATION INFORMATION
VIN
AMC1117
VOUT
VIN
VOUT
AMC1117
R1
121Ω
1%
121Ω
10µF
C2
C1
10µF
100µF
R2
1k
100µF
TTL
1k
1k
Adjustable Regulator
VOUT = 1.25V ( 1+
365
1%
5V Regulator with Shutdown
R2
)
R1
VIN
AMC1117-X.X
VOUT
C2
C1
100µF
10µF
Fixed Voltage Regulator
Copyright © 2006 ADDtek Corp.
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AMC1117
Application Note:
Maximum Power Calculation:
TJ(MAX) – TA(MAX)
θJA
TJ(OC): Maximum recommended junction temperature
TA(OC): Ambient temperature of the application
θJA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator :
PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ
PD(MAX)=
Where:
Then
VOUT(NOM) = the nominal output voltage
IOUT(NOM) = the nominal output current, and
IQ = the quiescent current the regulator consumes at IOUT(MAX)
VIN(MAX) = the maximum input voltage
θJA = (150 OC – TA)/ PD
Thermal consideration:
When power consumption is over about 404 mW (for SOT-223 package, 687mW for TO-252 package, at TA=70 OC),
additional heat sink is required to control the junction temperature below 125 OC.
The junction temperature is: TJ = P D (θJT + θCS + θSA) + TA
P D: Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted. (Typically,
θCS < 1.0°C/W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
59
PCB θSA (OC /W)
2
PCB heat sink size (mm ) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
Copyright © 2006 ADDtek Corp.
(Bottom View)
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JULY 2006
AMC1117
PACKAGE
3-Pin Surface Mount SOT-223 (SK)
D
MIN
MILLIMETERS
TYP
MAX
A
1.50
1.65
1.80
A1
0.02
0.05
0.08
B
0.60
0.70
0.80
B1
2.90
-
3.15
c
0.28
0.30
0.32
D
6.30
6.50
6.70
E
3.30
3.50
3.70
A
c
B1
H
E
K
L
e
A1
e1
B
e
2.3 BSC
e1
4.6 BSC
H
6.70
7.00
7.30
L
0.91
1.00
1.10
K
1.50
1.75
2.00
α
0°
5°
10°
β
3°
3-Pin Surface Mount TO-252 (SJ)
INCHES
MIN
TYP
MAX
MIN
TYP
MAX
0.086
-
0.094
2.18
-
2.39
A1 0.040
-
0.050
1.02
-
1.27
0.024
-
-
0.61
-
-
0.215
5.21
-
5.46
0.018
-
0.023
0.46
-
0.58
c1 0.018
-
0.023
0.46
-
0.58
D 0.210
-
0.220
5.33
-
5.59
E
-
0.265
6.35
-
6.73
A
E
b2
A
A1
c1
L2
SEATING PLAN
b
-
b2 0.205
D
L1
b
e
c
H
L
c
e1
Copyright © 2006 ADDtek Corp.
MILLIMETERS
8
0.250
e
0.090 BSC
2.29 BSC
e1
0.180 BSC
4.58 BSC
H 0.370
-
0.410
9.40
-
10.41
L
0.020
-
-
0.51
-
-
L1 0.025
-
0.040
0.64
-
1.02
L2 0.060
-
0.080
1.52
-
2.03
DD004_K --
JULY 2006
AMC1117
IMPORTANT NOTICE
ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service
without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing
orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks
associated with the customer’s applications, the customer should provide adequate design and operating safeguards.
ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of
its products to the specifications applicable at the time of sale.
ADDtek Corp.
9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105
TEL: 2-25700299
FAX: 2-25700196
Copyright © 2006 ADDtek Corp.
9
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JULY 2006
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