MN101E16 Series MN101E16K Type MN101E16Y 256K ROM (byte) RAM (byte) Package (Lead-free) Minimum Instruction Execution Time MN101EF16K Mask ROM Internal ROM type MN101EF16Z FLASH 384K 260K 512K 12K 20K 16K 30K LQFP100-P-1414, LQFP100-P-1414, QFP100-P-1818B QFP100-P-1818B QFP100-P-1818B QFP100-P-1818B 0.0588 µs (at 2.7 V to 3.6 V, 17 MHz, at internal 2, 4, 8 times oscillation)) 0.1 µs (at 2.7 V to 3.6 V, 20 MHz) 30.6 µs (at 2.7 V to 3.6 V, 32.768 kHz) Interrupts RESET. Watchdog. External 0 to 5. Timer 0 to 3. Timer 6. Timer 7 (2 systems). Timer A to E.Time base. Serial 0 (2 systems). Serial 1 (2 systems). Serial 2. Serial 3 (2 systems). Serial 4 (2 systems). Automatic transfer finish (2 systems). A/D conversion finish. Key interrupt Timer Counter 8-bit timer × 10 Timer 0 ..................Square-wave/8-bit PWM output. Event count. Pulse width measurement. Real time output control Timer 1 ..................Square-wave output. Event count. Synchronous output event Timer 2 ..................Square-wave/8-bit PWM output. Event count. Synchronous output event. Pulse width measurement. Real time output control. Serial baud rate timer Timer 3 ..................Square-wave output. Event count. Serial baud rate timer Timer 6 ..................8-bit freerun timer. Time base timer Timer A, B, C, D, E Timer 0, 1 can be cascade-connected Timer 0, 1, 2 can be cascade-connected Timer 2, 3 can be cascade-connected Timer 0, 1, 2, 3 can be cascade-connected 16-bit timer × 1 Timer 7 ..................Square-wave/16-bit PWM output (cycle/duty continuous variable). Event count. Synchronous output event. Pulse width measurement. Input capture Time base timer: One-minute count setting Watchdog timer × 1 Serial interface Synchronous type/UART (full-duplex) × 3: Serial 0, 1, 4 Synchronous type/Single-master I2C × 1: Serial 2 Synchronous type/I2C × 1: Serial 3 DMA controller Number of channels: 2 channels Maximum transfer cycles: 255 Starting factor: External request. Various types of interrupt. Software Transfer mode: 1-byte transfer. Word transfer. Burst transfer I/O Pins I/O 22 : (5 V I/F port) Common use. Specified pull-up resistor available. Input/output selectable (bit unit) 62 : (3 V I/F port) Common use. Specified pull-up resistor available. Input/output selectable (bit unit) 1 : (3 V I/F port) Common use A/D converter 10-bit × 8 channels (with S/H) Special Ports Buzzer output. High-current drive port ROM Correction Correcting address designation: Up to 7 addresses possible MAD00046LEM MN101E16K, MN101E16Y, MN101EF16K, MN101EF16Z Pin Assignment 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P43 P42, SBT4 P41, SBI4, RXD4 P40, SBO4, TXD4 P87, LED7, D7 P86, LED6, D6 P85, LED5, D5 P84, LED4, D4 P83, LED3, D3 P82, LED2, D2 P81, LED1, D1 P80, LED0, D0 VSS P77, SD7, NDK P76, SD6, NWE P75, SD5, NRE P74, SD4, NCS P73, SD3, A19 P72, SD2, A18 P71, SD1, A17 P70, SD0, A16 P67, KEY7, A15 P66, KEY6, A14 P65, KEY5, A13 P64, KEY4, A12 LQFP100-P-1414, QFP100-P-1818B 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 SBO0A, TXD0A, P00 SBI0A, RXD0A, P01 SBT0A, P02 SBO2A, SDA2A, P03 SBI2A, P04 SBT2A, SCL2A, P05 BUZZER, P06 TM0IO, P10 TM1IO, P11 TM2IO, P12 MMOD OSC2 OSC1 VSS XI XO VDD33 VDD18 NRST, P27 TM3IO, P13 TM7IOA, P14 TM7OB, P15 TM7OC, P16 SYSCLK, P17 IRQ0A, P20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SBO0B, TXD0B, P90 SBI0B, RXD0B, P91 SBT0B, P92 SBO3B, SDA3B, P93 SBI3B, P94 SBT3B, SCL3B, P95 SBO2B, SDA2B, PD0 SBI2B, PD1 SBT2B, SCL2B, PD2 IRQ0B, PD3 IRQ1B, PD4 IRQ2B, PD5 IRQ3B, PD6 VDD5 PD7 VSS AN0, PA0 AN1, PA1 AN2, PA2 AN3, PA3 AN4, PA4 AN5, PA5 AN6, PA6 AN7, PA7 VREF+ MAD00046LEM 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P63, KEY3, A11 P62, KEY2, A10 P61, KEY1, A9 P60, KEY0, A8 P57, A7 P56, A6 P55, A5 P54, A4 P53, A3 P52, A2 P51, A1 VSS P50, A0 VDD18 P35, SBT3A, SCL3A P34, SBI3A P33, SBO3A, SDA3A P32, SBT1 P31, SBI1, RXD1 P30, SBO1, TXD1 P25, IRQ5 P24, IRQ4 P23, IRQ3A P22, IRQ2A P21, IRQ1A Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805