1 of 3 Creation Date : December 14, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ5F4C0G2H561J085AA TDK item description CGJ5F4C0G2H561JT**** Applications Feature Series High Reliability Grade Mid Mid Voltage (100 to 630V) AEC-Q200 AEC-Q200 CGJ5(3216) [EIA 1206] Status Production (Not Recommended for New Design) Size Length(L) 3.20mm ±0.20mm Width(W) 1.60mm ±0.20mm Thickness(T) 0.85mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 560pF ±5% Rated Voltage 500VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : December 14, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ5F4C0G2H561J085AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGJ5F4C0G2H561J085AA ESR CGJ5F4C0G2H561J085AA Capacitance CGJ5F4C0G2H561J085AA CGJ5F4C0G2H561J085AA Temperature Characteristic CGJ5F4C0G2H561J085AA(No Bias) DC Bias Characteristic CGJ5F4C0G2H561J085AA(DC Bias = 250V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors CGJ5F4C0G2H561J085AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : December 14, 2017 (GMT)