MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed−in−package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size TSOP−5, 8−pin SOIC−8 and Micro8 surface mount packages. The NCV device is packaged in SOIC−8 and TO−92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. • • TO−92 P SUFFIX CASE 29 1 2 Pin 1. Reset 2. Input 3. Ground 3 1 SOIC−8 D SUFFIX CASE 751 1 Micro8 DM SUFFIX CASE 846A 1 TSOP−5 SN SUFFIX CASE 483 8 Features • • • • • • • • • http://onsemi.com Trimmed−In−Package Temperature Compensated Reference Comparator Threshold of 4.6 V at 25°C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 10 mA Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation with 1.0 V Input Low Standby Current Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb−Free Packages are Available Input 8 5 Pin 1. 2. 3. 4. 5. Reset Input Ground NC NC PIN CONNECTIONS 2 (2) Reset 1 (1) Reset 1 8 N.C. Input 2 7 N.C. N.C. 3 6 N.C. Ground 4 5 N.C. (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. 1.2 Vref DEVICE MARKING INFORMATION GND 3 (4) = Sink Only Positive True Logic See general marking information in the device marking section on page 7 of this data sheet. Pin numbers adjacent to terminals are for the 3−pin TO−92 package. Pin numbers in parenthesis are for the 8−lead packages. This device contains 21 active transistors. Figure 1. Representative Block Diagram Semiconductor Components Industries, LLC, 2005 February, 2005 − Rev. 12 1 Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 MAXIMUM RATINGS Rating Symbol Value Unit Power Input Supply Voltage Vin −1.0 to 10 V Reset Output Voltage VO 10 V Reset Output Sink Current (Note 2) ISink Internally Limited mA IF 100 mA PD RJA 625 200 mW °C/W PD RJA 625 200 mW °C/W PD RJA 520 240 mW °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature MC34064 MC33064 NCV33064 TA Storage Temperature Range Tstg Clamp Diode Forward Current, Pin 1 to 2 (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air °C 0 to +70 −40 to +85 −40 to +125 −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics Symbol Min Typ Max VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 − − − 0.46 0.15 − 1.0 0.4 0.1 Unit COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis V RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) VOL V Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA Output Off-State Leakage (Vin, Reset = 5.0 V) IOH − 0.02 0.5 A Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) VF 0.6 0.9 1.2 V Operating Input Voltage Range Vin 1.0 to 6.5 − − V Quiescent Input Current (Vin = 5.0 V) Iin − 390 500 A TOTAL DEVICE 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70°C for MC34064 4. Tlow = 0°C for MC34064 −40°C for MC33064 +85°C for MC33064 −40°C for NCV33064 +125°C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 2 MC34064, MC33064, NCV33064 10 5.0 8.0 VO , OUTPUT VOLTAGE (V) VO , OUTPUT VOLTAGE (V) RL = 10 k to Vin TA = 25°C 6.0 4.0 2.0 0 0 2.0 4.0 6.0 Vin, INPUT VOLTAGE (V) 8.0 RL = 10 k to Vin TA = 25°C 4.0 3.0 2.0 1.0 0 10 4.560 Figure 2. Reset Output Voltage versus Input Voltage 4.600 Vin, INPUT VOLTAGE (V) 4.620 4.640 Figure 3. Reset Output Voltage versus Input Voltage 1.0 4.630 RL = 10 k to Vin 4.620 Upper Threshold High State Output I in , INPUT CURRENT (mA) V th, THRESHOLD VOLTAGE (V) 4.580 4.610 4.600 4.590 Lower Threshold Low State Output 4.580 4.570 −55 −25 0 25 50 75 100 TA = +25°C 0.8 −40°C 0.6 +85°C 0.4 TA = +25°C +85°C 0.2 0 125 −40°C 0 2.0 4.0 6.0 8.0 TA, AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 4. Comparator Threshold Voltage versus Temperature Figure 5. Input Current versus Input Voltage 2.0 Reset V OL, OUTPUT SATURATION (V) Vin = 4.0 V TA = 25°C Vin = 5.0 V to 4.0 V RL = 10 k TA = 25°C 90% 1.5 TA = 85°C Vin TA = −40°C 5.0 V − 1.0 4.0 V − Vin 10k 5.0V 4.0V 0.5 Reset 10% 0 REF 0 10 20 30 ISink, SINK CURRENT (mA) 40 200 ns/DIV Figure 6. Reset Output Saturation versus Sink Current Figure 7. Reset Delay Time http://onsemi.com 3 10 MC34064, MC33064, NCV33064 I F , FORWARD CURRENT (mA) 80 Vin = 0 V TA = 25°C 60 40 20 0 0 0.4 0.8 1.2 VF , FORWARD VOLTAGE (V) 1.6 Figure 8. Clamp Diode Forward Current versus Voltage + R 2 (2) Reset Power Supply 1 (1) − Microprocessor Circuit CDLY − + A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is the microprocessor reset input threshold. 1.2 Vref 3 (4) 1 tDLY = RCDLY In 1− Vth(MPU) Vin Figure 9. Low Voltage Microprocessor Reset TEST DATA VH (mV) RH + Iin 2 (2) RL Power Supply 1 (1) − Reset Microprocessor Circuit − + 1.2Vref 3 (4) VH ≈ 4.6 RH + 0.02 RL Vth(lower) ≈ 340 RH x 10−6 Where:RH ≤ 150 Where:RL ≥ 1.5 , ≤ 10 k 20 51 40 81 71 112 100 164 190 327 276 480 Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 340 A at 4.59V. The equations are accurate to ±10% with RH less than 150 and RL between 1.5 k and 10 k Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis http://onsemi.com 4 Vth (mV) RH () RL (k) 0 3.4 6.8 6.8 10 10 16 16 34 34 51 51 0 10 20 20 30 30 47 47 100 100 150 150 0 1.5 4.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 MC34064, MC33064, NCV33064 + 1.0k + − 2 (2) Power Supply 2 (2) 1 (1) 1 (1) − − − + + 1.2Vref 1.2Vref Solar Cells 3 (4) 3 (4) Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger 25H MPSW51A Vin = 11.5 to 14.5V + 470 22 + 680 VO = 5.0 V IO = 50 mA + 470 1N5819 1.2k 4.7k 330 2 (2) 1N756 Test 1 (1) − + Conditions Results Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp Efficiency Vin = 12.6 V, IO = 50 mA 77% 1.2Vref 3 (4) Figure 13. Low Power Switching Regulator VCC RL MTP3055EL 270 4.6V 2 (2) 1 (1) − + 1.2Vref 3 (4) Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET. Figure 14. MOSFET Low Voltage Gate Drive Protection http://onsemi.com 5 MC34064, MC33064, NCV33064 ORDERING INFORMATION Device Operating Temperature Range Package Shipping SOIC−8 98 Units / Rail SOIC−8 (Pb−Free) 98 Units / Rail SOIC−8 2500 Units/ Tape & Reel MC34064D−5R2G SOIC−8 (Pb−Free) 2500 Units/ Tape & Reel MC34064DM−5R2 Micro8 4000 Units / Tape & Reel Micro8 (Pb−Free) 4000 Units / Tape & Reel TO−92 2000 Units / Bag TO−92 (Pb−Free) 2000 Units / Bag TO−92 2000 Units / Tape & Reel TO−92 (Pb−Free) 2000 Units / Tape & Reel TO−92 2000 Units / Ammo Pack TO−92 (Pb−Free) 2000 Units / Ammo Pack MC34064P−5RM TO−92 2000 Units / Ammo Pack MC34064SN−5T1 TSOP−5 3000 Units / Tape & Reel MC33064D−005 SOIC−8 98 Units / Rail SOIC−8 (Pb−Free) 98 Units / Rail MC34064D−005 MC34064D−005G MC34064D−5R2 MC34064DM−5R2G MC34064P−005 MC34064P−005G TA = 0°C to +70°C MC34064P−5RA MC34064P−5RAG MC34064P−5RP MC34064P−5RPG MC33064D−005G MC33064D−5R2 SOIC−8 2500 Units / Tape & Reel MC33064D−5R2G SOIC−8 (Pb−Free) 2500 Units / Tape & Reel MC33064DM−5R2 Micro8 4000 Units / Tape & Reel Micro8 (Pb−Free) 4000 Units / Tape & Reel TO−92 2000 Units / Bag MC33064P−005G TO−92 (Pb−Free) 2000 Units / Bag MC33064P−5RA TO−92 2000 Units / Tape & Reel TO−92 (Pb−Free) 2000 Units / Tape & Reel TO−92 2000 Units / Ammo Pack MC33064P−5RPG TO−92 (Pb−Free) 2000 Units / Ammo Pack NCV33064D−5R2* SOIC−8 2500 Units / Tape & Reel SOIC−8 (Pb−Free) 2500 Units / Tape & Reel TO−92 2000 Units / Tape & Reel NCV33064P−5RP* TO−92 2000 Units / Ammo Pack NCV33064DM−5R2* Micro8 4000 Units / Tape & Reel MC33064DM−5R2G MC33064P−005 40°C to +85°C TJ = −40°C MC33064P−5RAG MC33064P−5RP NCV33064D−5R2G* NCV33064P−5RA* TA = −40°C to +125°C *NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 6 MC34064, MC33064, NCV33064 MARKING DIAGRAMS SOIC−8 D SUFFIX CASE 751 TSOP−5 SN SUFFIX CASE 483 5 4 8 3x064 ALYW5 SDYYW 1 2 3 Micro8 DM SUFFIX CASE 846A 8 Ly50 AYW TO−92 P SUFFIX CASE 29 * MC3x0 64P−5 ALYWW 1 1 SDY = Device Code x = 3 or 4 y = I or C A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week *This marking diagram also applies to NCV33064P. http://onsemi.com 7 123 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS P SUFFIX PLASTIC PACKAGE CASE 29−11 (TO−92) ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L SEATING PLANE K DIM A B C D G H J K L N P R V D X X G J H V C SECTION X−X 1 N N http://onsemi.com 8 INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 −−− 0.250 −−− 0.080 0.105 −−− 0.100 0.115 −−− 0.135 −−− MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 −−− 6.35 −−− 2.04 2.66 −−− 2.54 2.93 −−− 3.43 −−− MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SN SUFFIX PLASTIC PACKAGE CASE 483−02 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D S 5 4 1 2 3 B L G A MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 J C 0.05 (0.002) H M K SOLDERING FOOTPRINT 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028SCALE 10:1 http://onsemi.com 9 mm inches MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS D SUFFIX PLASTIC PACKAGE CASE 751−07 (SOIC−8 NB) ISSUE AE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 1 0.25 (0.010) M Y M 4 K −Y− G C N X 45 DIM A B C D G H J K M N S SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS DM SUFFIX PLASTIC PACKAGE CASE 846A−02 (Micro8) ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A−01 OBSOLETE, NEW STANDARD 846A−02. −A− −B− K PIN 1 ID G D 8 PL 0.08 (0.003) M T B S A DIM A B C D G H J K L S SEATING −T− PLANE 0.038 (0.0015) C L J H SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 −−− 1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 −−− 0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 MC34064, MC33064, NCV33064 Micro8 is a trademark of International Rectifier. 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