Datasheet
DC Brushless Motor Drivers for Fans
Standard Single-phase Full wave
Fan Motor Driver
BD69830FV
Description
The BD69830FV is a 24V single-coil brushless DC FAN motor driver. The device incorporates high efficiency DMOS
H-bridge driver, regulated voltage output for hall element, and rotation speed is controlled by input PWM signal.
Package
SSOP-B14
Features
Power DMOS FET integrated
Direct PWM speed control
Low duty start up function
Quick start function
Constant voltage output for hall element
Lock protection and auto restart
(without external capacitor)
Rotating speed pulse signal (FG) output
and ALARM signal output selectable
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
Applications
BD player, Projector, STB etc,.
Office equipment, Copier, FAX, Laser Printer, etc,.
SSOP-B14
Absolute Maximum Ratings
Parameter
Supply Voltage
Power Dissipation
Symbol
Rating
Unit
VCC
30
V
(Note 1)
Pd
0.87
W
Operating Temperature
Topr
-40 to +105
°C
Storage Temperature
Tstg
-55 to +150
°C
Junction Temperature
Tjmax
150
°C
Output Voltage
VOMAX
30
V
Output Current
IOMAX
900(Note 2)
mA
VH
7
V
PWM Input Voltage
VPWM
7
V
SEL Input Voltage
VSEL
7
V
Signal Output Voltage
VSIG
30
V
Signal Output Current
ISIG
10
mA
HB Current Ability
IHB
10
mA
Hall Input Voltage
(Note 1) Reduce by 7.0mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) This value is not to exceed Pd.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
○Product structure：Silicon monolithic integrated circuit
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○This product has no designed protection against radioactive rays
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Datasheet
BD69830FV
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VCC
6
24
28
V
Hall Input Voltage
VH
0
-
2
V
fPWM
2
-
50
kHz
PWM Input Frequency
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=24V)
Parameter
Symbol
Min
Typ
Max
Unit
Circuit Current
ICC
0.4
1.2
3.0
mA
Hall Bias Voltage
VHB
1.1
1.2
1.3
V
Hall Input Hysteresis
VHYS
±5
±10
±15
mV
Conditions
Characteristics
Figure 1
IHB=-3mA
Figure 2, 3
Figure 4
Io=200mA
Upper and Lower total
VO
0.3
0.6
0.9
V
PWM Input H Level
VPWMH
2.5
-
5.5
V
-
PWM Input L Level
VPWML
-0.3
-
+0.8
V
-
IPWMH
-5
0
+5
µA
VPWM=5V
-
IPWML
-36
-27
-18
µA
VPWM=0V
-
SEL Input L Level
VSELL
-0.3
-
+0.8
V
FG:SEL pin open
AL:SEL pin GND short
-
SIG L Voltage
VSIGL
-
0.2
0.4
V
ISIG=5mA
Figure 9, 10
SIG Leak Current
ISIGL
0
-
5
µA
VSIG=30V
-
Lock Detection ON Time
tON
0.28
0.40
0.52
s
Figure 11
Lock Detection OFF Time
tOFF
8.4
12
15.6
s
Figure 12
Output Voltage
PWM Input Current
Figure 5 to 8
Truth Table
H+
H-
PWM
OUT1
OUT2
FG
H
L
H
L
L
H
L
H
H
H
L
L
H
L
OFF
L
L
H
L
OFF
L（Output Tr : ON）
H（Output Tr : OFF）
L（Output Tr : ON）
H（Output Tr : OFF）
AL signal normal operation : L(output Tr is ON)
Lock detection : H(output Tr is OFF)
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BD69830FV
Reference data
5
1.4
Hall Bias Voltage, V HB [V]
Circuit Current, Icc [mA]
4
3
2
105°C
25°C
-40°C
1.3
105°C
25°C
-40°C
1.2
1.1
1
Operating Range
Operating Range
1.0
0
0
5
10
15
20
Supply Voltage, Vcc [V]
25
30
0
5
Figure 1. Circuit Current
25
30
Figure 2. Hall Bias Voltage
1.4
30
Hall Input Hysteresis, V HYS [mV]
Hall Bais Voltage, VHB [V]
10
15
20
Supply Voltage, Vcc [V]
1.3
105°C
25°C
-40°C
1.2
1.1
105°C
25°C
-40°C
20
10
Operating Range
0
-10
-40°C
25°C
105°C
-20
-30
1.0
0
2
4
6
8
Output Current, IHB [mA]
10
Figure 3. Hall Bias Voltage Current Ability (Vcc=24V)
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0
5
10
15
20
Supply Voltage, Vcc [V]
25
30
Figure 4. Hall Input Hysteresis
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Datasheet
BD69830FV
Reference data
2.4
2.4
2.0
2.0
105°C
Output H Voltage [V]
Output H Voltage [V]
6V
1.6
24V
29V
1.2
0.8
0.4
1.6
25°C
1.2
-40°C
0.8
0.4
0.0
0.0
0.0
0.2
0.4
0.6
Output Current, Io [A]
0.8
1.0
0.0
Figure 5. Output H Voltage （Ta=25°C）
0.2
0.4
0.6
Output Current, Io [A]
Figure 6. Output H Voltage
1.2
1.2
1.0
1.0
0.8
1.0
（Vcc=24V）
105°C
Output L Voltage [V]
Output L Voltage [V]
6V
0.8
24V
29V
0.6
0.4
0.2
0.8
25°C
0.6
-40°C
0.4
0.2
0.0
0.0
0.0
0.2
0.4
0.6
Output Current, Io [A]
0.8
1.0
Figure 7. Output L Voltage （Ta=25°C）
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0.0
0.2
0.4
0.6
Output Current, Io [A]
0.8
1.0
Figure 8. Output L Voltage (Vcc=24V）
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BD69830FV
Reference data
0.4
SIG Output L Voltage, V SIGL [V]
SIG Output L Voltage, VSIGL [V]
0.4
0.3
105°C
25°C
0.2
-40°C
0.1
0.0
0.3
6V
0.2
24V
29V
0.1
0.0
0
2
4
6
Output Current, ISIG [mA]
8
10
0
Figure 9. SIG L Voltage（Vcc=24V）
4
6
Output Current, ISIG [mA]
8
10
Figure 10. SIG L Voltage（Ta=25°C）
0.6
15
Lock Detection ON/OFF Time, tOFF [V]
Lock Detection ON/OFF Time, tON [V]
2
0.5
-40°C
25°C
105°C
0.4
0.3
0.2
Operating Range
0.1
0.0
14
13
-40°C
25°C
12
105°C
11
Operating Range
10
9
0
5
10
15
20
Supply Voltage, Vcc [V]
25
30
Figure 11. Lock Detection ON Time
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0
5
10
15
20
Supply Voltage, Vcc [V]
25
30
Figure 12. Lock Detection OFF Time
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BD69830FV
Block Diagram, Application Circuit, and Pin Assignment
M
GND
GND
1
14
VCC
OUT2
Consider protection against
voltage rise due to reverse
connection of power supply
and back electromotive force.
OUT1
Constant voltage output for hall
element. Pull up resistor to VCC,
it enables to reduce heat
generation of HB output
transistor.
13
2
VCC
N.C.
3
GND
OSC
5V
12
P.8
P.12
VCC
4
0.1µF
～1µF
Lock
Protection
11
Pre-drive
N.C.
5
SEL
H+
TSD
5V
+
-
PWM
Hall
Bias
6
C ontrol
Enables speed control
by applying external
PWM signal directly.
P.10
VCC
5kΩ～ 15kΩ
10
Changeable regeneration
section at phase change
timing by hall signal
amplitude.
P.9
HB
9
SIG
H-
7
8
HALL
0Ω～ 500Ω
OSC : Internal reference oscillation circuit
TSD : Thermal shut down circuit
Pin Description
Pin No.
Pin Name
1
GND
GND
2
OUT2
Motor output 2
3
VCC
Power supply
4
VCC
Power supply
5
N.C.
-
6
PWM
PWM signal Input
7
SIG
8
H-
Hall Input -
9
HB
Constant voltage output for hall element
10
H+
Hall Input +
11
SEL
FG/AL select pin
12
N.C.
-
13
OUT1
Motor output1
14
GND
GND
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Function
Signal output
(FG/AL signal)
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BD69830FV
Description of Operations
1) Lock Protection and Automatic Restart
Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer than
the time set up at the internal counter, and IC turns off the output. Lock detection ON time (tON) and lock detection OFF
time (tOFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always
constant. Timing chart is shown in Figure 13.
Idling
H+
OUT1
tOFF
tON
Output Tr OFF
ON
OUT2
Depends on hall signal
(H in ths figure)
FG
（at SEL=open）
tON
（at SEL=GND）
AL
Motor
lock
Recovers normal
Lock
release operation
Lock
detection
SIG (7pin) output : FG signal output at SEL=open
AL signal output at SEL=GND
Figure 13. Lock Protection Timing Chart
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BD69830FV
2) Constant Voltage Output for Hall Element
By connecting a hall element to HB pin directly, hall signal amplitude does not depend on temperature change.
VCC
HB
IC
Hall
element
GND
Figure 14. Normal Connection of Hall Element
The output voltage of HB is 1.2V (Typ).
If the resistance of hall element is 300Ω, current value which flows into a hall element is
1.2V / 300Ω= 4mA
Power supply voltage = 24V, HB output voltage = 1.2V, current to hall element = 4mA, in this condition, the heat
generation of HB output is
(24V - 1.2V) x 4mA = 91.2mW ・・・(1)
If motor driving current is less, and there are some margins to power dissipation, the above-mentioned connection
method is the simplest. In the case which motor driving current is large and it needs to reduce heat generation of IC,
the application of following Figure 15 is recommended to suppress heat generation at HB output part.
VCC
R1
HB
IC
RH
GND
Figure 15. Dividing Heat Generation into Resistor
Resistance of hall element RH[Ω], Pull-up resistor R1[Ω], the heat generation of IC can be suppressed by choosing the
resistance of R1 so that it may be applied to this condition.
VCC x RH / (R1 + RH) < VHB
The current supplied to a Hall element is mainly supplied from the resistance side, and only current for a voltage to
become fixed value is supplied from HB pin.
e.g. VCC = 24V, RH = 300Ω, R1 = 6kΩ
VCC x RH / (R1 + RH) = 24V x 0.0476 = 1.143V < VHB =1.2V
Current supply source from HB is
(1.2V / 300Ω) – {(24V – 1.2V) / 6kΩ} = 0.2mA
And then, power consumption at HB output part is
(24V -1.2V) x 0.2mA = 4.56mW
It is clear that heat generation decreases greatly compared with the calculated value of (1).
HB pin has only current source ability.
If ambient temperature becomes high, the resistance of hall element becomes small. The voltage which supplies for a
hall element at the condition of low temperature may exceed the maximum rating of a hall element, if the value of R1 is
set up on the basis of the hall resistance at the condition of high temperature.
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3) Hall Input Setting
Hall input voltage range
2V
GND
Figure 16. Hall Input Voltage Range
The input voltage of a hall signal is input in "Hall Input Voltage" including signal amplitude.
In order to detect rotation of a motor, the amplitude of hall signal more than "Hall Input Hysteresis" is required.
Input the hall signal more than 30mVpp at least.
○Reducing the Noise of Hall Signal
Hall element may be affected by Vcc noise or the like depending on the wiring pattern of board. In this case, place
a capacitor like C1 in Figure 17. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, place a capacitor like C2 in Figure 17.
H-
H+
HB
C2
C1
RH
Hall element
Figure 17.
Bias current
= HB / (RH+ R2)
R2
Application near of Hall Signal
○Regeneration adjustment by hall signal level
The amplitude of hall signal can be adjusted by putting in resistor like R2 of Figure 17. There is the regeneration
section of back electromotive force at phase change timing (refer to Figure 18)
The section is determined by "Hall Input Hysteresis" and hall input signal amplitude.
In large back electromotive force (Back EMF) motor, output voltage may overshoot at the time of phase change, and
it may exceed the maximum rating voltage. In that case, set to lower the hall signal amplitude by R2, and make the
wide recirculation section.
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BD69830FV
4) PWM Speed Control
Rotation speed of motor can be changed by controlling ON/OFF of upper output depending on the duty of the input
signal to PWM pin.
When the voltage input to PWM pin applies
H logic : normal operation
L logic : H side output is off, L side output is ON
When PWM pin is open, H logic is applied.
Hall input
hysteresis
H+
PWM
OUT1
OUT2
FG
Figure 18. Timing Chart of PWM Control and Hall Signal
5) Quick Start Function
When PWM signal is input, the motor starts rotation at once regardless of the lock detection time.
Lock protection function is turned off when the time of PWM=L has elapsed more than 1ms in order to disable lock
protection function when the motor is stopped by PWM signal. When H level duty of PWM input signal is close to 0%,
lock protection function does not work if input frequency is slower than 1kHz. Therefore enter a frequency faster than
2kHz.
6) Low Duty Start up Function
Even if the input duty of PWM signal is low, the motor can start rotation by this function.
During the motor starts up from stop condition, outputs are driven by a PWM signal of 100% duty until detecting motor
rotation (max 200ms). It doesn't depend on input PWM duty (except 0% duty).
VCC
Input duty=80%
Input duty=10%
PWM
Output duty=100%
Output
Output duty=80%
Power
ON
Duty assist section
Figure 19. Low Duty Start up Function
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BD69830FV
Equivalent Circuit
1) Hall input
2) Motor output
VCC
1kΩ
H+, H-
OUT1
OUT2
GND
3) HB output
4) SIG output
SIG
HB
50kΩ
5) PWM input
6) SEL input
5.2V internal voltage
5.2V internal voltage
200kΩ
200kΩ
10kΩ
10kΩ
SEL
PWM
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BD69830FV
Safety Measure
1) Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 20. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
In normal energization
Reverse power connection
VCC
After reverse connection
destruction prevention
VCC
VCC
Circuit
block
Each
pin
GND
Internal circuit impedance high
amperage small
Circuit
block
Each
pin
Circuit
block
GND
Large current flows
Thermal destruction
Each
pin
GND
No destruction
Figure 20. Flow of Current when Power is Connected Reversely
2) Protection against VCC Voltage Rise by Back Electromotive Force
Back EMF generates regenerative current to power supply. However, when reverse connection protection diode is
connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
ON
ON
Phase
switching
ON
Figure 21. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. It necessary, add both (C).
(B) Zener Diode
(A) Capacitor
ON
ON
ON
ON
(C) Capacitor and Zener Diode
ON
ON
Figure 22. Protection against VCC Voltage Rise
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BD69830FV
3) Problem of GND Line PWM Switching
Do not perform PWM switching of GND line because GND potential cannot be kept to a minimum.
VCC
M
Motor
Driver
Controller
GND
PWM input
Prohibited
Figure 23. GND Line PWM Switching Prohibited
4) SIG Output
SIG is an open drain outuput and requires pull-up resistor. VCC voltage that is beyond its absolute maximum rating
when SIG pin is directly connected to power supply, could damage the IC. The IC can be protected by adding
resistor R1. (as shown in Figure 24)
VCC
Pull-up
resistor
SIG
Protection
Resistor R1
Connector
of board
Figure 24. Protection of SIG Pin
Thermal Derating Curve
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured
at a specified condition. Figure 25 shows a thermal derating curve.
Pd(W)
1.0
0.87
0.8
0.6
0.4
0.2
0
25
50
75
100 105 125
150
Ta(°C)
Reduce by 7.0 mW/°C over 25°C.
(70.0mm x 70.0mm x 1.6mm glass epoxy board)
Figure 25. Thermal Derating Curve
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BD69830FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P
P
+
+
N
N
P
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
GND
Parasitic
Elements
N Region
close-by
Figure 26. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/17
TSZ02201-0H1H0B101050-1-2
5.Jun.2014 Rev.001
Datasheet
BD69830FV
Ordering Information
B
D
6
9
8
3
0
Part Number
F
V
-
Package
FV: SSOP-B14
GE2
Packaging and forming specification
G: Halogen free
E2: Embossed tape and reel
Marking Diagrams
SSOP-B14(TOP VIEW)
Part Number Marking
69830
LOT Number
1PIN MARK
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/17
TSZ02201-0H1H0B101050-1-2
5.Jun.2014 Rev.001
Datasheet
BD69830FV
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B14
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
17/17
TSZ02201-0H1H0B101050-1-2
5.Jun.2014 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001