Features • • • • • • • • • • • • • • Full TCG/TCPA V1.1b Compatibility Single Chip Turnkey Solution Hardware Asymmetric Crypto Engine 2048 RSA Sign in 500 ms Using CRT AVR 8-bit RISC Microprocessor Internal EEPROM Storage for 10+ RSA Keys 33 MHz LPC (Low Pin Count) Bus for Easy PC Interface 100 KHz System Management Bus (SMBus) Two-wire Interface Secure Hardware and Firmware Design and Chip Layout True Random Number Generator (RNG) Secure Real-time Clock Option 3.3V ±10% Supply Voltage 28-lead TSSOP Package or 40-lead MLF Package 0–70°C Temperature Range Trusted Platform Module Description The AT97SC3201 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version 1.1b of the Trusted Computing Platform Alliance (TCPA) specification for Trusted Platform Modules (TPM). This specification has been adopted by the Trusted Computing Group (TCG). The TPM includes a crypto accelerator capable of computing a 2048-bit RSA signature in 500 ms and a 1024-bit RSA signature in 100 ms, both using CRT. Communication to and from the TPM can occur through one of two interface protocols: either a 33-MHz LPC interface or a 100-KHz SMBus two-wire interface. AT97SC3201 Summary Figure 1. AT97SC3201 Block Diagram SMBCLK/IOA SMBDAT/IOB IOC ROM Program EEPROM Program 33 MHz LPC Interface AVR 8/16 Bit CPU EEPROM Data SMBus Interface or GPIO RNG VBB 32.768 kHz SRAM RTC CRYPTO Engine Timer Physical Security Circuitry The chip includes a full hardware random number generator that is used for the TCG protocol and is also available to the system for any random numbers it may need during normal operation. Rev. 2015DS-TPM–7/04 Note: This is a summary document. A complete document is available under NDA. For more information, please contact your local Atmel sales office. 1 A real-time clock function is available using an external battery and crystal. The chip provides tamper detection if the battery or crystal are removed or tampered with, and the current time value can be signed by the appropriate internal keys to verify its accuracy. (Contact Atmel for current status of this option.) The battery detector can be used without the crystal for lower cost. In this mode, the TPM can indicate to the system if it has been removed from the PC in any way and can also take actions internally. The chip uses a dynamic internal memory management scheme to store from 10 to 20 keys. Other than the standard TCG commands (TPM_Evictkey, TPM_Loadkey), no system intervention is required to manage this internal key cache. The TPM is offered to OEM manufacturers as a turnkey solution, including the firmware integrated on the chip. In addition, Atmel provides the necessary driver software for integration into certain operating systems, along with BIOS drivers. A TCG Software Stack (TSS), also supplied by Atmel and available under license, provides communication support to any application using MSCAPI or PKCS #11 Cryptographic APIs. (Contact Atmel for a complete list of operating systems supported.) Ful l d ocumen tation for T CG primiti ves can be foun d o n the TCG W eb si te, www.trustedcomputinggroup.org. This specification includes only mechanical and electrical information. 2 AT97SC3201 2015DS-TPM–7/04 AT97SC3201 Absolute Maximum Ratings Operating Temperature..............................0°C to +70°C *NOTICE: Storage Temperature (without Bias)...........0°C to + 70°C Voltage on I/O Pins..............................−0.1 to VCC +0.3V Voltage on VCC with Respect to Ground.................6.0V Maximum ESD Voltage..........................................2000V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification may cause temporary or permanent failure. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 1. DC Parameters* Symbol Parameter Min Nom Max Units VCC Supply Voltage 3.0 3.3 3.6 V ICC Operating Current at fclk = 33 MHz 25 50 mA IST Static Current 5 10 mA VCC = 3.6V; fxtal = 0 Hz, active inputs ISL Sleep Current, Chip Idle 40 100 µA VCC = 3.6V; fxtal = 0 Hz IBB Battery Current 2 4 µA VCC = 0V; fxtal = 0 Hz. ILIO Input Leakage 0.1 3 µA Vin = VCC or GND VIH Input High Threshold 0.5 * VCC VCC + 0.5 V VIL Input Low Threshold −0.5 0.3 * VCC V VOH Output High Voltage 0.9 * VCC VOL Output Low Voltage IOLCR Output Low Current, CLKRUN# CI Input Pin Capacitance 0.98 * VCC 0.1 * VCC 7 6 Notes V At IOUT = −500 uA V At IOUT = 1.5mA mA At VOUT = .615 * VCC pF Note 1 * VCC = 3.0 to 3.6V; Temperature = 0 to 70°C Note: These parameters guaranteed but not tested. 3 2015DS-TPM–7/04 Table 2. AC Parameters* Symbol Parameter Min Nom Max Units TVAL CLK to Signal Valid Delay – LAD0-3 2 5 11 ns TON Float to Active Delay 2 4 TOFF Active to Float Delay TSU Input Setup Time to CLK 7 2 ns TH Input Hold Time from CLK 0 −500 ns TRST Reset Active Time after Power Stable 1 ms Note 2 TRST-CLK Reset Active after CLK Stable 100 m Note 2 TRST-OFF Reset Active to Output Float Delay 40 ns Note 2 TCLKIN CLK Period 29.5 31 ns Note 3 TCLKLO CLK Low Duration 13.4 18 ns Note 1, Note 3 TCLKHI CLK High Duration 13.4 18 ns Note 1, Note 3 Measured at Vtrise = 0.285 * V CC and Vtfal = 0.615 * VCC. Measured from clk at Vtest = 0.4 * VCC ; Load = 200Ω ns 28 30 Notes ns * Cl = 10pf. VCC = 3.0 to 3.7V; Temperature = 0 to 70°C Note: 1. All parameters measured with respect to signal crossing Vtest = 0.4 * VCC unless otherwise noted. 2. These parameters guaranteed but not tested. 3. The minimum parameter must never be violated under any circumstances unless Ireset# is asserted. If proper CLKRUN# signaling is observed, the maximum specification can be violated. Table 3. Ordering Information 4 Ordering Code Package Operation Range AT97SC3201-01AC 28A3 Commercial (0° to 70° C) AT97SC3201-X1AC 28A3 AT97SC3201-01MC 40ML1 AT97SC3201-X1MC 40ML1 lead-free Commercial (0° to 70° C) Commercial (0° to 70° C) lead-free Commercial (0° to 70° C) AT97SC3201 2015DS-TPM–7/04 AT97SC3201 Package Drawing 28A3 – TSSOP b L L1 E E1 e End View Top View COMMON DIMENSIONS (Unit of Measure = mm) D A A2 SYMBOL D MIN NOM MAX NOTE 9.60 9.70 9.80 2, 5 6.20 3, 5 E E1 Side View 8.10 BSC 6.00 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e L L1 Notes: 6.10 4 0.65 BSC 0.45 0.60 0.75 1.00 REF 1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 1/8/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 28A3 REV. A 5 2015DS-TPM–7/04 40ML1 A A1 D N A2 A3 1 Pin 1 Indicator 2 3 E Top View L 0 Side View COMMON DIMENSIONS (Unit of Measure = mm) D2 SYMBOL MIN D E2 E MAX 1 3.95 4.10 4.25 2 E2 3.95 4.10 4.25 b A - 0.85 0.90 A1 0.0 0.01 0.05 A2 - 0.65 0.70 N A3 e L 0.20 REF 0.30 e PIN1 ID Bottom View b NOTE 6.00 BSC D2 3 Notes: NOM 6.00 BSC 0.40 0.50 0.50 BSC 0.18 0.23 0.30 2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3/9/04 R 6 2325 Orchard Parkway San Jose, CA 95131 TITLE 40ML1, 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad Flat No Lead Package (MLF2) DRAWING NO. 40ML1 REV. A AT97SC3201 2015DS-TPM–7/04 Atmel Headquarters Atmel Operations Corporate Headquarters Memory 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600 Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany TEL (49) 71-31-67-0 FAX (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France TEL (33) 2-40-18-18-18 FAX (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France TEL (33) 4-76-58-30-00 FAX (33) 4-76-58-34-80 Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4-42-53-60-00 FAX (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland TEL (44) 1355-803-000 FAX (44) 1355-242-743 e-mail [email protected] Web Site http://www.atmel.com © Atmel Corporation 2004. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. ATMEL ® is the registered trademark of Atmel Corporation. Other terms and product names may be the trademark of others. Printed on recycled paper. 2015DS-TPM–7/04