Microchip MCP1405T-E/MF 4.5a dual high-speed power mosfet driver Datasheet

MCP1403/4/5
4.5A Dual High-Speed Power MOSFET Drivers
Features
General Description
• High Peak Output Current: 4.5A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2200 pF in 15 ns
- 5600 pF in 34 ns
• Short Delay Times: 40 ns (typ.)
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (typ.)
- With Logic ‘0’ Input – 150 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing
Up To 5V
• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,
and 16-Pin SOIC
The MCP1403/4/5 are a family of dual-inverting, dualnon-inverting, or complimentary output drivers. They
can delivery high peak currents of 4.5A typically into
capacitive loads. These devices also feature low shootthrough current, matched rise/fall times and
propagation delays.
Applications
•
•
•
•
The MCP1403/4/5 drivers operate from a 4.5V to 18V
single power supply and can easily charge and
discharge 2200 pF gate capacitance in under 15 ns
(typ). They provide low enough impedances in both the
on and off states to ensure the MOSFETs intended
state will not be affected, even by large transients. The
input to the MCP1403/4/5 may be driven directly from
either TTL or CMOS (3V to 18V).
The MCP1403/4/5 dual-output 4.5A driver family is
offered in both surface-mount and pin-through-hole
packages with a -40oC to +125oC temperature rating.
The low thermal resistance of the thermally enhanced
DFN package allows for greater power dissipation
capability for driving heavier capacitive or resistive
loads.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Motor and Solenoid Drive
Package Types
MCP1404
8-Pin
MCP1405
MCP1403
PDIP/SOIC
NC
IN A
GND
IN B
1
8
2
7
3
6
4
5
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
MCP1404
MCP1403
MCP1405
8-Pin DFN(2)
NC 1
8
NC
NC
NC
IN A 2
7
OUT A
OUT A
OUT A
GND 3
6
VDD
VDD
VDD
4
5
OUT B
OUT B
OUT B
IN B
© 2007 Microchip Technology Inc.
MCP1404
MCP1403
MCP1405
16-Pin SOIC
NC
IN A
NC
GND
GND
NC
IN B
NC
1
16
2
15
3
14
4
13
5
6
7
8
12
11
10
9
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
Note 1: Duplicate pins must both be connected for
proper operation.
2: Exposed pad of the DFN package is electrically
isolated.
DS22022B-page 1
MCP1403/4/5
Functional Block Diagram (1)
VDD
Inverting
730 µA
300 mV
Output
Non-inverting
Input
Effective
Input C = 20 pF
(Each Input)
4.7V
MCP1403 Dual Inverting
MCP1404 Dual Non-inverting
MCP1405 Inverting / Non-inverting
GND
Note 1: Unused inputs should be grounded.
DS22022B-page 2
© 2007 Microchip Technology Inc.
MCP1403/4/5
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
Supply Voltage ................................................................+20V
Input Voltage ............................... (VDD + 0.3V) to (GND – 5V)
Input Current (VIN>VDD)................................................50 mA
DC CHARACTERISTICS (NOTE 2)
Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.4
1.5
—
V
Logic ‘0’, Low Input Voltage
VIL
—
1.3
0.8
V
Input Current
IIN
–1
—
1
µA
Input Voltage
VIN
-5
—
VDD+0.3
V
Conditions
Input
0V ≤ VIN ≤ VDD
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
IOUT = 10 mA, VDD = 18V
Output Resistance, High
ROH
—
2.2
3.0
Ω
Output Resistance, Low
ROL
—
2.8
3.5
Ω
IOUT = 10 mA, VDD = 18V
Peak Output Current
IPK
—
4.5
—
A
VDD = 18V (Note 2)
Latch-Up Protection Withstand Reverse Current
IREV
—
>1.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µsec.
Rise Time
tR
—
15
28
ns
Figure 4-1, Figure 4-2
CL = 2200 pF
Fall Time
tF
—
18
28
ns
Figure 4-1, Figure 4-2
CL = 2200 pF
Delay Time
tD1
—
40
48
ns
Figure 4-1, Figure 4-2
Delay Time
tD2
—
40
48
ns
Figure 4-1, Figure 4-2
VDD
4.5
—
18.0
V
IS
—
1.0
2.0
mA
VIN = 3V (Both Inputs)
IS
—
0.15
0.25
mA
VIN = 0V (Both Inputs)
Switching Time (Note 1)
Power Supply
Supply Voltage
Power Supply Current
Note 1:
2:
Switching times ensured by design.
Tested during characterization, not production tested.
© 2007 Microchip Technology Inc.
DS22022B-page 3
MCP1403/4/5
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.4
Logic ‘0’, Low Input Voltage
VIL
—
Input Current
IIN
High Output Voltage
Low Output Voltage
Conditions
—
—
V
—
0.8
V
–10
—
+10
µA
0V ≤ VIN ≤ VDD
VOH
VDD – 0.025
—
—
V
DC TEST
VOL
—
—
0.025
V
DC TEST
Output Resistance, High
ROH
—
3.1
6.0
Ω
IOUT = 10 mA, VDD = 18V
Output Resistance, Low
ROL
—
3.7
7
Ω
IOUT = 10 mA, VDD = 18V
Rise Time
tR
—
25
40
ns
Figure 4-1, Figure 4-2
CL = 2200 pF
Fall Time
tF
—
25
40
ns
Figure 4-1, Figure 4-2
CL = 2200 pF
Delay Time
tD1
—
50
65
ns
Figure 4-1, Figure 4-2
Delay Time
tD2
—
50
65
ns
Figure 4-1, Figure 4-2
IS
—
—
2.0
0.2
3.0
0.3
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Input
Output
Switching Time (Note 1)
Power Supply
Power Supply Current
Note 1:
2:
Switching times ensured by design.
Tested during characterization, not production tested.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
°C
Conditions
Temperature Ranges
Specified Temperature Range
TA
–40
—
+125
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
–65
—
+150
°C
Thermal Resistance, 8L-6x5 DFN
θJA
—
33.2
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
155
—
°C/W
Thermal Resistance, 16L-SOIC
θJA
—
155
—
°C/W
Package Thermal Resistances
DS22022B-page 4
Typical four-layer board with
vias to ground plane
4-Layer JC51-7 Standard
Board, Natural Convection
© 2007 Microchip Technology Inc.
MCP1403/4/5
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
100
100
90
4700 pF
70
2200 pF
60
50
40
30
1800 pF
20
6800 pF
80
Fall Time (ns)
80
Rise Time (ns)
90
6800 pF
4700 pF
70
2200 pF
60
50
40
30
1800 pF
20
10
10
4
6
8
10
12
14
16
4
18
6
8
FIGURE 2-4:
Voltage.
100
70
90
12V
50
5V
40
30
20
18V
60
50
5V
40
30
18V
10
1000
10000
FIGURE 2-2:
Load.
Rise Time vs. Capacitive
10000
Capacitive Load (pF)
FIGURE 2-5:
Load.
Fall Time vs. Capacitive
160
Propagation Delay (ns)
CLOAD = 1800 pF
22
Time (ns)
18
12V
70
Capacitive Load (pF)
tFALL
18
16
14
16
Fall Time vs. Supply
20
10
1000
20
14
80
60
Fall Time (ns)
Rise Time (ns)
Rise Time vs. Supply
80
24
12
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-1:
Voltage.
10
tRISE
12
VDD = 12V
CLOAD = 1800 pF
135
110
85
60
tD1
tD2
35
-40 -25 -10
5
20 35 50 65 80 95 110 125
2
o
Temperature ( C)
FIGURE 2-3:
Temperature.
Rise and Fall Times vs.
© 2007 Microchip Technology Inc.
3
4
5
6
7
8
9
10
Input Amplitude (V)
FIGURE 2-6:
Amplitude.
Propagation Delay vs. Input
DS22022B-page 5
MCP1403/4/5
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
CLOAD = 1800 pF
90
tD1
80
tD2
70
60
50
40
0.5
Quiescent Current (mA)
Propagation Delay (ns)
100
0.4
Both Inputs = 1
0.3
0.2
Both Inputs = 0
0.1
0
30
4
6
8
10
12
14
16
-40 -25 -10
18
5
20 35 50 65 80 95 110 125
o
Supply Voltage (V)
FIGURE 2-7:
Supply Voltage.
Temperature ( C)
Propagation Delay Time vs.
FIGURE 2-10:
Temperature.
7
CLOAD = 1800 pF
65
60
55
50
tD1
45
40
5
4
TJ = +25oC
3
2
35
30
1
-40 -25 -10
5
20 35 50 65 80 95 110 125
4
6
8
o
Temperature ( C)
FIGURE 2-8:
Temperature.
Propagation Delay Time vs.
12
14
16
18
FIGURE 2-11:
Output Resistance (Output
High) vs. Supply Voltage.
0.5
8
0.4
7
0.3
10
Supply Voltage (V)
ROUT-LO ( :)
Quiescent Current (mA)
VIN = 5V (MCP1404)
VIN = 0V (MCP1403)
TJ = +150oC
6
tD2
ROUT-HI ( :)
Propagation Delay (ns)
70
Quiescent Current vs.
Both Inputs = 1
0.2
VIN = 0V (MCP1404)
VIN = 5V (MCP1403)
TJ = +150oC
6
5
TJ = +25oC
4
Both Inputs = 0
0.1
3
0
2
4
6
8
10
12
14
16
Supply Voltage (V)
FIGURE 2-9:
Supply Voltage.
DS22022B-page 6
Quiescent Current vs.
18
4
6
8
10
12
14
16
18
Supply Voltage (V)
FIGURE 2-12:
Output Resistance (Output
Low) vs. Temperature.
© 2007 Microchip Technology Inc.
MCP1403/4/5
Typical Performance Curves (Continued)
100
VDD = 18V
90
80
70
60
50
40
200 kHz
30
20
10
0
100
80
650 kHz
Supply Current (mA)
Supply Current (mA)
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
400 kHz
50 kHz
100 kHz
VDD = 18V
70
60
4,700 pF
50
2,200 pF
40
30
20
10
100 pF
0
1000
10
10000
100
Capacitive Load (pF)
Supply Current (mA)
120
Supply Current vs.
FIGURE 2-16:
Frequency.
140
VDD = 12V
2 MHz
100
1 MHz
100 kHz
80
60
500 kHz
40
200 kHz
20
0
100
VDD = 12V
100
2,200 pF
80
60
100 pF
40
20
10000
10
Supply Current vs.
FIGURE 2-17:
Frequency.
140
VDD = 6V
3.5 MHz
100
2 MHz
80
200 kHz
1 MHz
500 kHz
40
20
0
100
1000
10000
Supply Current vs.
VDD = 6V
6,800 pF
120
100
4,700 pF
80
60
2,200 pF
40
20
100 pF
0
1000
10000
10
Capacitive Load (pF)
FIGURE 2-15:
Capacitive Load.
100
Frequency (kHz)
Supply Current (mA)
Supply Current (mA)
4,700 pF
6,800 pF
0
1000
FIGURE 2-14:
Capacitive Load.
60
Supply Current vs.
120
Capacitive Load (pF)
120
1000
Frequency (kHz)
Supply Current (mA)
FIGURE 2-13:
Capacitive Load.
6,800 pF
Supply Current vs.
© 2007 Microchip Technology Inc.
100
1000
10000
Frequency (kHz)
FIGURE 2-18:
Frequency.
Supply Current vs.
DS22022B-page 7
MCP1403/4/5
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.
Crossover Energy (A*sec)
1.00E-06
-6
10
10
-7
10
-8
10
-9
1.00E-07
1.00E-08
1.00E-09
4
6
8
10
12
14
16
18
Supply Voltage (V)
Note:
The values on this graph represent the
loss seen by both drivers in a package
during one complete cycle. For a single driver, divide the stated value by 2.
For a single transition of a single driver
divide the stated value by 4.
FIGURE 2-19:
Supply Voltage.
DS22022B-page 8
Crossover Energy vs.
© 2007 Microchip Technology Inc.
MCP1403/4/5
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
PIN FUNCTION TABLE (1)
TABLE 3-1:
8-Pin
PDIP
SOIC
8-Pin
DFN
16-Pin
SOIC
Symbol
1
1
1
NC
No Connection
2
2
2
IN A
Control Input for Output A
—
—
3
NC
3
3
4
GND
—
—
5
GND
—
—
6
NC
No Connection
4
4
7
IN B
Control Input for Output B
—
—
8
NC
No Connection
—
—
9
NC
No Connection
5
5
10
OUT B
—
—
11
OUT B
6
6
12
VDD
Supply Input
—
—
13
VDD
Supply Input
No Connection
Ground
Ground
Output B
Output B
7
7
14
OUT A
Output A
—
—
15
OUT A
Output A
8
8
16
NC
No Connection
PAD
—
NC
Exposed Metal Pad
—
Note 1:
3.1
Description
Duplicate pins must be connected for proper operation.
Supply Input (VDD)
VDD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local capacitor. This bypass
capacitor provides a localized low-impedance path for
the peak currents that are to be provided to the load.
3.2
Control Inputs A and B
The MOSFET driver input is a high-impedance, TTL/
CMOS-compatible input. The input also has hysteresis
between the high and low input levels, allowing them to
be driven from slow rising and falling signals, and to
provide noise immunity.
3.3
3.4
Outputs A and B
Outputs A and B are CMOS push-pull output that is
capable of sourcing and sinking 4.5A of peak current
(VDD = 18V). The low output impedance ensures the
gate of the external MOSFET will stay in the intended
state even during large transients. These output also
has a reverse current latch-up rating of 1.5A.
3.5
Exposed Metal Pad
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
Ground (GND)
Ground is the device return pin. The ground pin should
have a low impedance connection to the bias supply
source return. High peak currents will flow out the
ground pin when the capacitive load is being
discharged.
© 2007 Microchip Technology Inc.
DS22022B-page 9
MCP1403/4/5
4.0
APPLICATION INFORMATION
4.1
General Information
VDD = 18V
MOSFET drivers are high-speed, high current devices
which are intended to source/sink high peak currents to
charge/discharge the gate capacitance of external
MOSFETs or IGBTs. In high frequency switching
power supplies, the PWM controller may not have the
drive capability to directly drive the power MOSFET. A
MOSFET driver like the MCP1403/4/5 family can be
used to provide additional source/sink current
capability.
4.2
1 µF
Input
MCP1404
(1/2 MCP1405)
The ability of a MOSFET driver to transition from a fully
off state to a fully on state are characterized by the drivers rise time (tR), fall time (tF), and propagation delays
(tD1 and tD2). The MCP1403/4/5 family of drivers can
typically charge and discharge a 2200 pF load capacitance in 15 ns along with a typical matched propagation delay of 40 ns. Figure 4-1 and Figure 4-2 show the
test circuit and timing waveform used to verify the
MCP1403/4/5 timing.
+5V
0V
0.1 µF
Ceramic
18V
Output
4.3
90%
Input
18V
Output
tD1
tF
tD2
tR
90%
90%
0V
FIGURE 4-1:
Waveform.
DS22022B-page 10
10%
tR
tD2
10%
90%
tF
10%
Non-Inverting Driver Timing
Decoupling Capacitors
Careful layout and decoupling capacitors are highly
recommended when using MOSFET drivers. Large
currents are required to charge and discharge
capacitive loads quickly. For example, 2.5A are needed
to charge a 2200 pF load with 18V in 16 ns.
MCP1403
(1/2 MCP1405)
10%
tD1 90%
FIGURE 4-2:
Waveform.
Input
0V
10%
0V
Output
CL = 2200 pF
+5V
90%
Input
VDD = 18V
Input
Output
CL = 2200 pF
Input
MOSFET Driver Timing
1 µF
0.1 µF
Ceramic
10%
Inverting Driver Timing
To operate the MOSFET driver over a wide frequency
range with low supply impedance a ceramic and low
ESR film capacitor are recommended to be placed in
parallel between the driver VDD and GND. A 1.0 µF low
ESR film capacitor and a 0.1 µF ceramic capacitor
placed between VDD and GND pins should be used.
These capacitors should be placed close to the driver
to minimized circuit board parasitics and provide a local
source for the required current.
4.4
PCB Layout Considerations
Proper PCB layout is important in a high current, fast
switching circuit to provide proper device operation and
robustness of design. PCB trace loop area and
inductance should be minimized by the use of ground
planes or trace under MOSFET gate drive signals,
separate analog and power grounds, and local driver
decoupling.
© 2007 Microchip Technology Inc.
MCP1403/4/5
Placing a ground plane beneath the MCP1403/4/5 will
help as a radiated noise shield as well as providing
some heat sinking for power dissipated within the
device.
4.5
Power Dissipation
The total internal power dissipation in a MOSFET driver
is the summation of three separate power dissipation
elements.
P T = P L + P Q + P CC
4.5.2
The power dissipation associated with the quiescent
current draw depends upon the state of the input pin.
The MCP1403/4/5 devices have a quiescent current
draw when both inputs are high of 1.0 mA (typ) and
0.15 mA (typ) when both inputs are low. The quiescent
power dissipation is:
P Q = ( I QH × D + I QL × ( 1 – D ) ) × V DD
Where:
IQH = Quiescent current in the high state
Where:
D = Duty cycle
PT = Total power dissipation
IQL = Quiescent current in the low state
PL = Load power dissipation
VDD = MOSFET driver supply voltage
PQ = Quiescent power dissipation
PCC = Operating power dissipation
4.5.1
CAPACITIVE LOAD DISSIPATION
The power dissipation caused by a capacitive load is a
direct function of frequency, total capacitive load, and
supply voltage. The power lost in the MOSFET driver
for a complete charging and discharging cycle of a
MOSFET is:
P L = f × C T × V DD
QUIESCENT POWER DISSIPATION
2
Where:
f = Switching frequency
4.5.3
OPERATING POWER DISSIPATION
The operating power dissipation occurs each time the
MOSFET driver output transitions because for a very
short period of time both MOSFETs in the output stage
are on simultaneously. This cross-conduction current
leads to a power dissipation describes as:
P CC = CC × f × V DD
Where:
CC = Cross-conduction constant (A*sec)
f = Switching frequency
VDD = MOSFET driver supply voltage
CT = Total load capacitance
VDD = MOSFET driver supply voltage
© 2007 Microchip Technology Inc.
DS22022B-page 11
MCP1403/4/5
5.0
PACKAGING INFORMATION
5.1
Package Marking Information (Not to Scale)
Example:
8-Lead DFN
XXXXXXX
XXXXXXX
XXYYWW
NNN
MCP1403
e3
E/MF^^
0648
256
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
MCP1403
e3
E/P^^256
0648
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
e3
*
Note:
DS22022B-page 12
Example:
MCP1405E
SN^^0648
e3
256
16-Lead SOIC (300 mil)
Legend: XX...X
Y
YY
WW
NNN
Example:
Example:
MCP1405
e3
E/SO^^
0648256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
MCP1403/4/5
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
b
N
L
N
K
E
E2
E1
EXPOSED
PAD
NOTE 1
2
2
1
1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
φ
A2
A
A1
A3
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
0.85
Molded Package Thickness
A2
–
0.65
0.80
Standoff
A1
0.00
0.01
0.05
Base Thickness
A3
0.20 REF
Overall Length
D
4.92 BSC
Molded Package Length
D1
Exposed Pad Length
D2
Overall Width
E
Molded Package Width
E1
Exposed Pad Width
E2
2.16
2.31
Contact Width
b
0.35
0.40
0.47
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
–
Model Draft Angle Top
φ
–
–
12°
1.00
4.67 BSC
3.85
4.00
4.15
5.99 BSC
5.74 BSC
2.46
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
© 2007 Microchip Technology Inc.
DS22022B-page 13
MCP1403/4/5
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS22022B-page 14
© 2007 Microchip Technology Inc.
MCP1403/4/5
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
L1
Units
Dimension Limits
Number of Pins
β
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS22022B-page 15
MCP1403/4/5
16-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2 3
e
b
h
α
h
A
c
φ
A2
L
A1
Units
Dimension Limits
Number of Pins
β
L1
MILLIMETERS
MIN
N
NOM
MAX
16
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
2.05
–
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
Molded Package Width
E1
7.50 BSC
Overall Length
D
10.30 BSC
2.65
10.30 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.20
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-102B
DS22022B-page 16
© 2007 Microchip Technology Inc.
MCP1403/4/5
APPENDIX A:
REVISION HISTORY
Revision B (May 2007)
•
•
•
•
•
•
Page 13: Updated Package Outline Drawing
Page 14: Updated Package Outline Drawing
Page 15: Updated Package Outline Drawing
Page 16: Updated Package Outline Drawing
Page 17: Updated Revision History
Page 19: Corrected Package Codes in Product
Identification System
Revision A (December 2006)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS22022B-page 17
MCP1403/4/5
NOTES:
DS22022B-page 18
© 2007 Microchip Technology Inc.
MCP1403/4/5
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
XX
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP1403: 4.5A Dual MOSFET Driver, Inverting
MCP1403T: 4.5A Dual MOSFET Driver, Inverting
(Tape and Reel)
MCP1404: 4.5A Dual MOSFET Driver, Non-Inverting
MCP1404T: 4.5A Dual MOSFET Driver, Non-Inverting
(Tape and Reel)
MCP1405: 4.5A Dual MOSFET Driver, Complementary
MCP1405T: 4.5A Dual MOSFET Driver, Complementary
(Tape and Reel)
Temperature Range:
E
Package: *
MF
P
SN
SO
=
-40°C to +125°C
=
=
=
=
Dual, Flat, No-Lead (6x5 mm Body), 8-lead
Plastic DIP, (300 mil body), 8-lead
Plastic SOIC (150 mil Body), 8-Lead
Plastic SOIC (Wide), 16-Lead
* All package offerings are Pb Free (Lead Free)
c)
d)
a)
b)
a)
b)
c)
© 2007 Microchip Technology Inc.
MCP1403-E/SN:
4.5A Dual Inverting
MOSFET Driver,
8LD SOIC package.
MCP1403-E/P:
4.5A Dual Inverting
MOSFET Driver,
8LD PDIP package.
MCP1403-E/MF: 4.5A Dual Inverting
MOSFET Driver,
8LD DFN package.
MCP1403-E/SO: 4.5A Dual Inverting
MOSFET Driver,
16LD SOIC package.
MCP1404T-E/SN: Tape and Reel.
4.5A Dual Non-Inverting,
MOSFET Driver,
8LD SOIC package,
MCP1404-E/P:
4.5A Dual Non-Inverting,
MOSFET Driver,
8LD PDIP package.
MCP1405-E/SN:
4.5A Dual Complementary,
MOSFET Driver,
8LD SOIC package.
MCP1405-E/P:
4.5A Dual Complementary,
MOSFET Driver,
8LD PDIP package.
MCP1405T-E/SO: Tape and Reel,
4.5A Dual Complementary
MOSFET Driver,
16LD SOIC package.
DS22022B-page 19
MCP1403/4/5
NOTES:
DS22022B-page 20
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS22022B-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS22022B-page 22
© 2007 Microchip Technology Inc.