Signal and Power Isolated RS-485 Transceiver with ±15 kV ESD Protection ADM2582E/ADM2587E FEATURES FUNCTIONAL BLOCK DIAGRAM VCC VISOOUT isoPower DC-TO-DC CONVERTER OSCILLATOR RECTIFIER VISOIN REGULATOR DIGITAL ISOLATION iCoupler TRANSCEIVER Y TxD ENCODE DECODE D Z DE ENCODE DECODE RxD DECODE ENCODE A R B ADM2582E/ADM2587E RE GND1 ISOLATION BARRIER GND2 08111-001 Isolated RS-485/RS-422 transceiver, configurable as half or full duplex isoPower® integrated isolated dc-to-dc converter ±15 kV ESD protection on RS-485 input/output pins Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) ADM2582E data rate: 16 Mbps ADM2587E data rate: 500 kbps 5 V or 3.3 V operation Connect up to 256 nodes on one bus Open- and short-circuit, fail-safe receiver inputs High common-mode transient immunity: >25 kV/μs Thermal shutdown protection Safety and regulatory approvals (pending) UL recognition: 2500 V rms for 1 minute per UL 1577 VDE Certificates of Conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 560 V peak Operating temperature range: −40°C to +85°C Highly integrated, 20-lead, wide-body SOIC package Figure 1. APPLICATIONS Isolated RS-485/RS-422 interfaces Industrial field networks Multipoint data transmission systems GENERAL DESCRIPTION The ADM2582E/ADM2587E are fully integrated signal and power isolated data transceivers with ±15 kV ESD protection and are suitable for high speed communication on multipoint transmission lines. The ADM2582E/ADM2587E include an integrated isolated dc-to-dc power supply, which eliminates the need for an external dc-to-dc isolation block. They are designed for balanced transmission lines and comply with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E). The devices integrate Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a three-state differential line driver, a differential input receiver, and Analog Devices isoPower dc-todc converter into a single package. The devices are powered by a single 5 V or 3.3 V supply, realizing a fully integrated signal and power isolated RS-485 solution. The ADM2582E/ADM2587E driver has an active high enable. An active low receiver enable is also provided that causes the receiver output to enter a high impedance state when disabled. The devices have current limiting and thermal shutdown features to protect against output short circuits and situations where bus contention may cause excessive power dissipation. The parts are fully specified over the industrial temperature range and are available in a highly integrated, 20-lead, widebody SOIC package. The ADM2582E/ADM2587E contain isoPower technology that uses high frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to Application Note AN-0971, Control of Radiated Emissions with isoPower Devices, for details on board layout considerations. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved. ADM2582E/ADM2587E TABLE OF CONTENTS Features .............................................................................................. 1 Test Circuits ..................................................................................... 12 Applications ....................................................................................... 1 Switching Characteristics .............................................................. 13 Functional Block Diagram .............................................................. 1 Circuit Description......................................................................... 14 General Description ......................................................................... 1 Signal Isolation ........................................................................... 14 Revision History ............................................................................... 2 Power Isolation ........................................................................... 14 Specifications..................................................................................... 3 Truth Tables................................................................................. 14 ADM2582E Timing Specifications ............................................ 4 Thermal Shutdown .................................................................... 14 ADM2587E Timing Specifications ............................................ 4 Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 14 ADM2582E/ADM2587E Package Characteristics ................... 4 DC Correctness and Magnetic Field Immunity........................... 15 ADM2582E/ADM2587E Regulatory Information .................. 5 Applications Information .............................................................. 16 ADM2582E/ADM2587E Insulation and Safety-Related Specifications ................................................................................ 5 PCB Layout ................................................................................. 16 ADM2582E/ADM2587E VDE 0884 Insulation Characteristics (Pending) ............................................................ 5 Insulation Lifetime ..................................................................... 16 Absolute Maximum Ratings............................................................ 6 ESD Caution .................................................................................. 6 Pin Configuration and Function Descriptions ............................. 7 Typical Performance Characteristics ............................................. 8 EMI Considerations ................................................................... 16 Isolated Power Supply Considerations .................................... 17 Typical Applications ................................................................... 19 Outline Dimensions ....................................................................... 20 Ordering Guide .......................................................................... 20 REVISION HISTORY 9/09—Revision 0: Initial Version Rev. 0 | Page 2 of 20 ADM2582E/ADM2587E SPECIFICATIONS All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted. Table 1. Parameter ADM2587E SUPPLY CURRENT Data Rate ≤ 500 kbps Symbol ICC ADM2582E SUPPLY CURRENT Data Rate = 16 Mbps ICC ISOLATED SUPPLY VOLTAGE DRIVER Differential Outputs Differential Output Voltage, Loaded VISOUT Δ|VOD| for Complementary Output States Common-Mode Output Voltage Δ|VOC| for Complementary Output States Short-Circuit Output Current Output Leakage Current (Y, Z) Min Typ Max Unit Test Conditions 120 mA mA mA mA mA VCC = 3.3 V, 100 Ω load between Y and Z VCC = 5 V, 100 Ω load between Y and Z VCC = 3.3 V, 54 Ω load between Y and Z VCC = 5 V, 54 Ω load between Y and Z 120 Ω load between Y and Z 150 230 mA mA 120 Ω load between Y and Z 54 Ω load between Y and Z 5.0 5.0 5.0 0.2 3.0 0.2 200 30 V V V V V V mA μA RL = 100 Ω (RS-422), see Figure 23 RL = 54 Ω (RS-485), see Figure 23 −7 V ≤ VTEST1 ≤ 12 V, see Figure 24 RL = 54 Ω or 100 Ω, see Figure 23 RL = 54 Ω or 100 Ω, see Figure 23 RL = 54 Ω or 100 Ω, see Figure 23 90 72 125 98 |VOD2| |VOD3| Δ|VOD| VOC Δ|VOC| IOS IO 3.3 2.0 1.5 1.5 −30 Logic Inputs DE, RE, TxD Input Threshold Low Input Threshold High Input Current RECEIVER Differential Inputs Differential Input Threshold Voltage Input Voltage Hysteresis Input Current (A, B) Line Input Resistance Logic Outputs Output Voltage Low Output Voltage High Short-Circuit Current COMMON-MODE TRANSIENT IMMUNITY 1 1 μA VIL VIH II 0.3 × VCC −10 0.01 VTH VHYS II −200 −125 15 0.7 × VCC 10 −30 125 RIN −100 96 VOL VOH VCC − 0.3 0.2 VCC − 0.2 0.4 100 25 DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V V V μA DE, RE, TxD DE, RE, TxD DE, RE, TxD mV mV μA μA kΩ −7 V < VCM < +12 V VOC = 0 V DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V DE = 0 V, VCC = 0 V or 3.6 V, VIN = -7 V −7 V < VCM < +12 V V V mA kV/μs IO = 1.5 mA, VA − VB = −0.2 V IO = −1.5 mA, VA − VB = 0.2 V VCM = 1 kV, transient magnitude = 800 V CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. Rev. 0 | Page 3 of 20 ADM2582E/ADM2587E ADM2582E TIMING SPECIFICATIONS TA = −40°C to +85°C. Table 2. Parameter DRIVER Maximum Data Rate Propagation Delay, Low to High Propagation Delay, High to Low Output Skew Rise Time/Fall Time Enable Time Disable Time RECEIVER Propagation Delay, Low to High Propagation Delay, High to Low Output Skew 1 Enable Time Disable Time 1 Symbol Min Typ Max Unit Test Conditions tDPLH tDPHL tSKEW tDR, tDF tZL, tZH tLZ, tHZ 63 64 1 100 100 8 15 120 150 Mbps ns ns ns ns ns ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 tRPLH tRPHL tSKEW tZL, tZH tLZ, tHZ 94 95 1 110 110 12 15 15 ns ns ns ns ns CL = 15 pF, see Figure 27 and Figure 30 CL = 15 pF, see Figure 27 and Figure 30 CL = 15 pF, see Figure 27 and Figure 30 RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 Typ Max Unit Test Conditions 503 510 7 700 700 100 1100 2.5 200 kbps ns ns ns ns μs ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 91 95 4 200 200 30 15 15 ns ns ns ns ns CL = 15 pF, see Figure 27 and Figure 30 CL = 15 pF, see Figure 27 and Figure 30 CL = 15 pF, see Figure 27 and Figure 30 RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 16 Guaranteed by design. ADM2587E TIMING SPECIFICATIONS TA = −40°C to +85°C. Table 3. Parameter DRIVER Maximum Data Rate Propagation Delay, Low to High Propagation Delay, High to Low Output Skew Rise Time/Fall Time Enable Time Disable Time RECEIVER Propagation Delay, Low to High Propagation Delay, High to Low Output Skew Enable Time Disable Time Symbol tDPLH tDPHL tSKEW tDR, tDF tZL, tZH tLZ, tHZ tRPLH tRPHL tSKEW tZL, tZH tLZ, tHZ Min 500 250 250 200 ADM2582E/ADM2587E PACKAGE CHARACTERISTICS Table 4. Parameter Resistance (Input-to-Output) 1 Capacitance (Input-to-Output)1 Input Capacitance 2 Input IC Junction-to-Case Thermal Resistance Symbol RI-O CI-O CI θJCI Output IC Junction-to-Case Thermal Resistance θJCO 1 2 Min Typ 1012 3 4 33 Max 28 Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20. Input capacitance is from any input data pin to ground. Rev. 0 | Page 4 of 20 Unit Ω pF pF °C/W °C/W Test Conditions f = 1 MHz Thermocouple located at center of package underside Thermocouple located at center of package underside ADM2582E/ADM2587E ADM2582E/ADM2587E REGULATORY INFORMATION Table 5. Pending ADM2582E/ADM2587E Approvals Organization UL VDE Approval Type To be recognized under the Component Recognition Program of Underwriters Laboratories, Inc. To be certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Notes In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second. In accordance with VDE 0884-10, each ADM2582E/ADM2587E is proof tested by applying an insulation test voltage ≥ 1050 VPEAK for 1 second. ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS Table 6. Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol L(I01) Value 2500 >8.0 Unit V rms mm Minimum External Tracking (Creepage) L(I02) >8.0 mm Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI 0.017 min >175 IIIa mm V Conditions 1-minute duration Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance along body Insulation distance through insulation DIN IEC 112/VDE 0303-1 Material Group (DIN VDE 0110: 1989-01, Table 1) ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS (PENDING) This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits. Table 7. Description CLASSIFICATIONS Installation Classification per DIN VDE 0110 for Rated Mains Voltage ≤150 V rms ≤300 V rms ≤400 V rms Climatic Classification Pollution Degree VOLTAGE Maximum Working Insulation Voltage Input-to-Output Test Voltage Method b1 Method a After Environmental Tests, Subgroup 1 After Input and/or Safety Test, Subgroup 2/Subgroup 3 Highest Allowable Overvoltage SAFETY-LIMITING VALUES Case Temperature Input Current Output Current Insulation Resistance at TS Conditions Symbol Characteristic Unit I to IV I to III I to II 40/85/21 2 DIN VDE 0110, see Table 1 VIORM VPR 560 V peak VIORM × 1.875 = VPR, 100% production tested, tm = 1 sec, partial discharge < 5 pC 1050 V peak VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 896 672 V peak V peak VTR 4000 V peak TS IS, INPUT IS, OUTPUT RS 150 265 335 >109 °C mA mA Ω Transient overvoltage, tTR = 10 sec Maximum value allowed in the event of a failure VIO = 500 V Rev. 0 | Page 5 of 20 ADM2582E/ADM2587E ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground. Table 8. Parameter VCC Digital Input Voltage (DE, RE, TxD) Digital Output Voltage (RxD) Driver Output/Receiver Input Voltage Operating Temperature Range Storage Temperature Range ESD (Human Body Model) on A, B, Y, and Z pins ESD (Human Body Model) on Other Pins Lead Temperature Soldering (10 sec) Vapor Phase (60 sec) Infrared (15 sec) Rating −0.5 V to +7 V −0.5 V to VDD + 0.5 V −0.5 V to VDD + 0.5 V −9 V to +14 V −40°C to +85°C −55°C to +150°C ±15 kV ±2 kV Table 9. Maximum Continuous Working Voltage1 Parameter AC Voltage Bipolar Waveform Max Unit Reference Standard 424 V peak 50-year minimum lifetime Unipolar Waveform Basic Insulation 600 V peak 560 V peak Maximum approved working voltage per IEC 60950-1 (pending) Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10 (pending) 600 V peak 560 V peak Reinforced Insulation DC Voltage Basic Insulation 260°C 215°C 220°C Reinforced Insulation Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 1 Maximum approved working voltage per IEC 60950-1(pending) Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10 (pending) Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. ESD CAUTION Rev. 0 | Page 6 of 20 ADM2582E/ADM2587E PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND1 1 20 GND2 VCC 2 RxD 4 RE 5 DE 6 TxD 7 VCC 8 ADM2582E ADM2587E 18 A 17 B 16 GND2 TOP VIEW (Not to Scale) 15 Z 14 GND2 13 Y GND1 9 12 VISOOUT GND1 10 11 GND2 NOTES 1. PIN 12 AND PIN 19 MUST BE CONNECTED EXTERNALLY. 08111-002 GND1 3 19 VISOIN Figure 2. Pin Configuration Table 10. Pin Function Description Pin No. 1 2 Mnemonic GND1 VCC 3 4 GND1 RxD 5 RE 6 7 8 DE TxD VCC 9 10 11 12 GND1 GND1 GND2 VISOOUT 13 14 15 16 17 18 19 Y GND2 Z GND2 B A VISOIN 20 GND2 Description Ground, Logic Side. Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between Pin 2 and Pin 1. Ground, Logic Side. Receiver Output Data. This output is high when (A − B) > 200 mV and low when (A − B) < –200 mV. The output is tristated when the receiver is disabled, that is, when RE is driven high. Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it high disables the receiver. Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver. Driver Input. Data to be transmitted by the driver is applied to this input. Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 8 and Pin 7. Ground, Logic Side. Ground, Logic Side. Ground, Bus Side. Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11. Driver Noninverting Output Ground, Bus Side. Driver Inverting Output Ground, Bus Side. Receiver Inverting Input. Receiver Noninverting Input. Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20. Ground, Bus Side. Rev. 0 | Page 7 of 20 ADM2582E/ADM2587E TYPICAL PERFORMANCE CHARACTERISTICS 120 180 100 RL = 54Ω 140 SUPPLY CURRENT, ICC (mA) SUPPLY CURRENT, ICC (mA) 160 120 RL = 120Ω 100 80 NO LOAD 60 40 RL = 54Ω 80 RL = 120Ω 60 40 NO LOAD 20 –15 10 35 TEMPERATURE (°C) 60 85 0 –40 08111-103 0 –40 Figure 3. ADM2582E Supply Current (ICC) vs. Temperature (Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V) –15 10 35 TEMPERATURE (°C) 60 85 08111-106 20 Figure 6. ADM2587E Supply Current (ICC) vs. Temperature (Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V) 72 140 70 SUPPLY CURRENT, ICC (mA) DRIVER PROPAGATION DELAY (ns) RL = 54Ω 120 100 RL = 120Ω 80 60 NO LOAD 40 20 68 66 64 tDPHL 62 tDPLH 60 58 56 54 –15 10 35 TEMPERATURE (°C) 60 85 50 –40 08111-104 0 –40 –15 10 35 TEMPERATURE (°C) 60 85 08111-107 52 Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature Figure 4. ADM2582E Supply Current (ICC) vs. Temperature (Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V) 600 140 RL = 54Ω 100 80 RL = 120Ω 60 40 NO LOAD 20 540 tDPLH 520 tDPHL 500 480 460 440 –15 10 35 TEMPERATURE (°C) 60 Figure 5. ADM2587E Supply Current (ICC) vs. Temperature (Data Rate = 500 kbps, DE = 5 V, VCC = 5 V) 85 400 –40 –15 10 35 TEMPERATURE (°C) 60 85 08111-108 0 –40 560 420 08111-105 SUPPLY CURRENT, ICC (mA) DRIVER PROPAGATION DELAY (ns) 580 120 Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature Rev. 0 | Page 8 of 20 ADM2582E/ADM2587E 60 TxD OUTPUT CURRENT (mA) 50 1 Z Y 40 30 20 CH2 2.0V M10.00ns A CH1 1.28V 0 08111-109 CH1 2.0V CH3 2.0V Figure 9. ADM2582E Driver Propagation Delay 0 1 2 3 OUTPUT VOLTAGE (V) 4 5 08111-112 10 3 Figure 12. Receiver Output Current vs. Receiver Output Low Voltage 4.75 4.74 OUTPUT VOLTAGE(V) 4.73 TxD 1 Z Y 4.72 4.71 4.70 4.69 4.68 4.67 3 M200ns A CH1 2.56V 4.65 –40 Figure 10. ADM2587E Driver Propagation Delay 10 35 TEMPERATURE (°C) 60 85 85 Figure 13. Receiver Output High Voltage vs. Temperature 0 0.32 –10 0.30 –20 OUTPUT VOLTAGE (V) OUTPUT CURRENT (mA) –15 08111-113 CH2 2.0V 08111-110 CH1 2.0V CH3 2.0V 08111-114 4.66 –30 –40 –50 0.28 0.26 0.24 0.22 –60 0 1 2 3 OUTPUT VOLTAGE (V) 4 5 0.20 –40 08111-111 –70 Figure 11. Receiver Output Current vs. Receiver Output High Voltage –15 10 35 TEMPERATURE (°C) 60 Figure 14. Receiver Output Low Voltage vs. Temperature Rev. 0 | Page 9 of 20 ADM2582E/ADM2587E B A 1 RxD 3 CH2 2.0V M10.00ns A CH1 2.56V 98 97 96 tRPHL 95 94 93 92 tRPLH 91 90 –40 08111-115 CH1 2.0V CH3 2.0V 99 –15 10 35 TEMPERATURE (°C) 60 85 08111-118 RECEIVER PROPAGATION DELAY (ns) 100 Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature Figure 15. ADM2582E Receiver Propagation Delay 3.33 ISOLATED SUPPLY VOLTAGE (V) A B 1 RxD A CH1 2.56V 3.29 NO LOAD RL = 120Ω RL = 54Ω 3.28 3.26 –40 –15 10 35 TEMPERATURE (°C) 60 85 Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature (VCC = 3.3 V, Data Rate = 16 Mbps) Figure 16. ADM2587E Receiver Propagation Delay 98 3.36 3.35 96 tRPHL 95 tRPLH 94 93 3.34 3.33 3.32 3.31 3.30 3.29 NO LOAD RL = 120Ω RL = 54Ω 3.28 3.27 92 –40 –15 10 35 TEMPERATURE (°C) 60 85 Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature 3.26 –40 –15 10 35 TEMPERATURE (°C) 60 85 Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature (VCC = 5 V, Data Rate = 16 Mbps) Rev. 0 | Page 10 of 20 08111-120 ISOLATED SUPPLY VOLTAGE (V) 97 08111-117 RECEIVER PROPAGATION DELAY (ns) 3.30 08111-119 M10.00ns 08111-116 CH2 2.0V 3.31 3.27 3 CH1 2.0V CH3 2.0V 3.32 ADM2582E/ADM2587E 40 RL = 54Ω 40 ISOLATED SUPPLY CURRENT (mA) 50 RL = 120Ω 30 NO LOAD 20 10 30 RL = 120Ω 25 20 15 10 NO LOAD 5 –15 10 35 TEMPERATURE (°C) 60 85 0 –40 –15 10 35 TEMPERATURE (°C) 60 85 Figure 22. ADM2587E Isolated Supply Current vs. Temperature (VCC = 3.3 V, Data Rate = 500 kbps) Figure 21. ADM2582E Isolated Supply Current vs. Temperature (VCC = 3.3 V, Data Rate = 16 Mbps) Rev. 0 | Page 11 of 20 08111-122 0 –40 RL = 54Ω 35 08111-121 ISOLATED SUPPLY CURRENT (mA) 60 ADM2582E/ADM2587E TEST CIRCUITS RL 2 VOD2 RL 2 VOUT Y VOC TxD 08111-003 Z S1 Figure 23. Driver Voltage Measurement Y Figure 26. Driver Enable/Disable 375Ω A 60Ω VTEST B Figure 24. Driver Voltage Measurement Y TxD CL Figure 27. Receiver Propagation Delay CL +1.5V CL –1.5V VCC S1 RL 08111-005 Z VOUT RE RL RE S2 CL VOUT RE IN Figure 25. Driver Propagation Delay Figure 28. Receiver Enable/Disable Rev. 0 | Page 12 of 20 08111-008 375Ω Z 08111-004 VOD3 TxD S2 CL 50pF Z DE VCC RL 110Ω 08111-007 TxD 08111-006 Y ADM2582E/ADM2587E SWITCHING CHARACTERISTICS VCC VCC/2 VCC/2 0V tDPLH tDPHL VCC Z VO 1/2VO DE tLZ 2.3V Y, Z 90% POINT VDIFF VOL + 0.5V 90% POINT VDIFF = V(Y) – V(Z) VOL tZH 10% POINT tDF tDR tHZ 2.3V VOH VOH – 0.5V Y, Z 08111-011 10% POINT 08111-009 –VO 0.5VCC 0V tZL Y +VO 0.5VCC tSKEW = │tDPHL – tDPLH │ Figure 31. Driver Enable/Disable Timing Figure 29. Driver Propagation Delay, Rise/Fall Timing 0.7VCC RE 0.3VCC 0V 0V tRPLH tRPHL tZL tLZ 1.5V RO VOH VOL + 0.5V OUTPUT LOW tZH tSKEW = |tRPLH – tRPHL | 1.5V VOL RO 1.5V VOH – 0.5V 0V Figure 32. Receiver Enable/Disable Timing Figure 30. Receiver Propagation Delay Rev. 0 | Page 13 of 20 VOL tHZ OUTPUT HIGH 1.5V 08111-010 RxD 0.5VCC VOH 08111-012 A–B 0.5VCC ADM2582E/ADM2587E CIRCUIT DESCRIPTION SIGNAL ISOLATION Table 13. Receiving (see Table 11 for Abbreviations) The ADM2582E/ADM2587E signal isolation is implemented on the logic side of the interface. The part achieves signal isolation by having a digital isolation section and a transceiver section (see Figure 1). Data applied to the TxD and DE pins and referenced to logic ground (GND1) are coupled across an isolation barrier to appear at the transceiver section referenced to isolated ground (GND2). Similarly, the single-ended receiver output signal, referenced to isolated ground in the transceiver section, is coupled across the isolation barrier to appear at the RXD pin referenced to logic ground. POWER ISOLATION The ADM2582E/ADM2587E power isolation is implemented using an isoPower integrated isolated dc-to-dc converter. The dc-to-dc converter section of the ADM2582E/ADM2587E works on principles that are common to most modern power supplies. It is a secondary side controller architecture with isolated pulsewidth modulation (PWM) feedback. VCC power is supplied to an oscillating circuit that switches current into a chip-scale air core transformer. Power transferred to the secondary side is rectified and regulated to 3.3 V. The secondary (VISO) side controller regulates the output by creating a PWM control signal that is sent to the primary (VCC) side by a dedicated iCoupler data channel. The PWM modulates the oscillator circuit to control the power being sent to the secondary side. Feedback allows for significantly higher power and efficiency. TRUTH TABLES The truth tables in this section use the abbreviations found in Table 11. Table 11. Truth Table Abbreviations Letter H L X Z NC Description High level Low level Don’t care High impedance (off ) Disconnected A−B Inputs RE Output RxD > −0.03 V < −0.2 V −0.2 V < A − B < −0.03 V Inputs open X X X L or NC L or NC L or NC L or NC H L or NC L or NC H L X H Z H L THERMAL SHUTDOWN The ADM2582E/ADM2587E contain thermal shutdown circuitry that protects the parts from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are reenabled at a temperature of 140°C. OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER INPUTS The receiver inputs have open- and short-circuit, fail-safe features that ensure that the receiver output is high when the inputs are open or shorted. During line-idle conditions, when no driver on the bus is enabled, the voltage across a terminating resistance at the receiver input decays to 0 V. With traditional transceivers, receiver input thresholds specified between −200 mV and +200 mV mean that external bias resistors are required on the A and B pins to ensure that the receiver outputs are in a known state. The short-circuit, fail-safe receiver input feature eliminates the need for bias resistors by specifying the receiver input threshold between −30 mV and −200 mV. The guaranteed negative threshold means that when the voltage between A and B decays to 0 V, the receiver output is guaranteed to be high. Table 12. Transmitting (see Table 11 for Abbreviations) DE H H L X L X Inputs TxD H L X X X X Y H L Z Z Z Z Outputs Z L H Z Z Z Z Rev. 0 | Page 14 of 20 ADM2582E/ADM2587E 100 This situation should occur in the ADM2582E/ADM2587E devices only during power-up and power-down operations. The limitation on the ADM2582E/ADM2587E magnetic field immunity is set by the condition in which induced voltage in the transformer receiving coil is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur. The 3.3 V operating condition of the ADM2582E/ADM2587E is examined because it represents the most susceptible mode of operation. The pulses at the transformer output have an amplitude of >1.0 V. The decoder has a sensing threshold of about 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by V = (−dβ/dt)Σπrn2; n = 1, 2, … , N where: β is magnetic flux density (gauss). N is the number of turns in the receiving coil. rn is the radius of the nth turn in the receiving coil (cm). Given the geometry of the receiving coil in the ADM2582E/ ADM2587E and an imposed requirement that the induced voltage be, at most, 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 33. 10 1 0.1 0.001 1k 10k 100k 10M 1M MAGNETIC FIELD FREQUENCY (Hz) 100M 08111-019 0.01 Figure 33. Maximum Allowable External Magnetic Flux Density For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse (and is of the worst-case polarity), it reduces the received pulse from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing threshold of the decoder. The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the ADM2582E/ADM2587E transformers. Figure 34 expresses these allowable current magnitudes as a function of frequency for selected distances. As shown in Figure 34, the ADM2582E/ ADM2587E are extremely immune and can be affected only by extremely large currents operated at high frequency very close to the component. For the 1 MHz example, a 0.5 kA current must be placed 5 mm away from the ADM2582E/ADM2587E to affect component operation. 1k DISTANCE = 1m 100 10 DISTANCE = 100mm 1 DISTANCE = 5mm 0.1 0.01 1k 10k 100k 1M 10M 100M MAGNETIC FIELD FREQUENCY (Hz) 08111-020 Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is, therefore, either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than 1 μs, periodic sets of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses of more than approximately 5 μs, the input side is assumed to be unpowered or nonfunctional, in which case, the isolator output is forced to a default state by the watchdog timer circuit. MAXIMUM ALLOWABLE CURRENT (kA) The digital signals transmit across the isolation barrier using iCoupler technology. This technique uses chip-scale transformer windings to couple the digital signals magnetically from one side of the barrier to the other. Digital inputs are encoded into waveforms that are capable of exciting the primary transformer winding. At the secondary winding, the induced waveforms are decoded into the binary value that was originally transmitted. MAXIMUM ALLOWABLE MAGNETIC FLUX DENSITY (kGauss) DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY Figure 34. Maximum Allowable Current for Various Current-toADM2582E/ADM2587E Spacings Note that in combinations of strong magnetic field and high frequency, any loops formed by printed circuit board (PCB) traces can induce error voltages sufficiently large to trigger the thresholds of succeeding circuitry. Take care in the layout of such traces to avoid this possibility. Rev. 0 | Page 15 of 20 ADM2582E/ADM2587E APPLICATIONS INFORMATION PCB LAYOUT The ADM2582E/ADM2587E isolated RS-422/RS-485 transceiver contains an isoPower integrated dc-to-dc converter, requiring no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 35). The power supply section of the ADM2582E/ ADM2587E uses an 180 MHz oscillator frequency to pass power efficiently through its chip-scale transformers. In addition, the normal operation of the data section of the iCoupler introduces switching transients on the power supply pins. Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency capacitor, whereas ripple suppression and proper regulation require a large value capacitor. These capacitors are connected between Pin 1 (GND1) and Pin 2 (VCC) and Pin 8 (VCC) and Pin 9 (GND1) for VCC. The VISOIN and VISOOUT capacitors are connected between Pin 11 (GND2) and Pin 12 (VISOOUT) and Pin 19 (VISOIN) and Pin 20 (GND2). To suppress noise and reduce ripple, a parallel combination of at least two capacitors is required. The recommended capacitor values are 0.1 μF and 10 μF. The recommended best practice is to use a very low inductance ceramic capacitor, or its equivalent, for the smaller value. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 10 mm. GND1 1 20 VCC 2 19 GND1 3 18 A RxD 4 17 B RE 5 16 GND2 DE 6 15 Z TxD 7 14 GND2 VCC 8 13 Y GND1 9 12 GND1 10 11 EMI CONSIDERATIONS The dc-to-dc converter section of the ADM2582E/ADM2587E components must, of necessity, operate at very high frequency to allow efficient power transfer through the small transformers. This creates high frequency currents that can propagate in circuit board ground and power planes, causing edge and dipole radiation. Grounded enclosures are recommended for applications that use these devices. If grounded enclosures are not possible, good RF design practices should be followed in the layout of the PCB. See Application Note AN-0971, Control of Radiated Emissions with isoPower Devices, for more information. INSULATION LIFETIME All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. Analog Devices conducts an extensive set of evaluations to determine the lifetime of the insulation structure within the ADM2582E/ADM2587E. GND2 VISOOUT 08111-125 VISOIN GND2 The ADM2582E/ADM2587E dissipate approximately 650 mW of power when fully loaded. Because it is not possible to apply a heat sink to an isolation device, the devices primarily depend on heat dissipation into the PCB through the GND pins. If the devices are used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 35 shows enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple vias from the pad to the ground plane to reduce the temperature inside the chip significantly. The dimensions of the expanded pads are at the discretion of the designer and dependent on the available board space. Figure 35. Recommended PCB Layout In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this can cause voltage differentials between pins exceeding the absolute maximum ratings for the device, thereby leading to latch-up and/or permanent damage. Accelerated life testing is performed using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined, allowing calculation of the time to failure at the working voltage of interest. The values shown in Table 9 summarize the peak voltages for 50 years of service life in several operating conditions. In many cases, the working voltage approved by agency testing is higher than the 50-year service life voltage. Operation at working voltages higher than the service life voltage listed leads to premature insulation failure. The insulation lifetime of the ADM2582E/ADM2587E depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates, depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 36, Figure 37, and Figure 38 illustrate these different isolation voltage waveforms. Bipolar ac voltage is the most stringent environment. A 50-year operating lifetime under the bipolar ac condition determines the Analog Devices recommended maximum working voltage. Rev. 0 | Page 16 of 20 ADM2582E/ADM2587E In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 9 can be applied while maintaining the 50-year minimum lifetime, provided the voltage conforms to either the unipolar ac or dc voltage cases. Any crossinsulation voltage waveform that does not conform to Figure 37 or Figure 38 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Table 9. ISOLATED POWER SUPPLY CONSIDERATIONS The typical output voltage of the integrated isoPower dc-to-dc isolated supply is 3.3 V. The isolated supply in the ADM2587E is capable of supplying a current of 55 mA when the junction temperature of the device is kept below 120°C. It is important to note that the current available on the VISOOUT pin is the total current available and includes the current required to supply the internal RS-485 circuitry. The ADM2587E can typically supply 15 mA externally on VISOOUT when the driver is switching at 500 kbps loaded with 54 Ω, while the junction temperature of the part is less than 120°C. 08111-021 RATED PEAK VOLTAGE 0V RATED PEAK VOLTAGE Table 14. Typical Maximum External Current Available on VISOOUT 0V External Load Current (mA) 15 RT 54 Ω 29 46 120 Ω Unloaded 08111-023 Figure 36. Bipolar AC Waveform Figure 37. DC Waveform RATED PEAK VOLTAGE The ADM2582E typically has no current available externally on VISOOUT. When external current is drawn from the VISOOUT pin, there is an increased risk of generating radiated emissions due to the high frequency switching elements used in the isoPower dc todc converter. Special care must be taken during PCB layout to meet emissions standards. See Application Note AN-0971, Control of Radiated Emissions with isoPower Devices, for details on board layout considerations. 08111-022 0V NOTES 1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE. THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE VOLTAGE CANNOT CROSS 0V. System Configuration Double terminated bus with RT = 110 Ω Single terminated bus Unterminated bus Figure 38. Unipolar AC Waveform VCC EXTERNAL LOAD VISOOUT VCC isoPower DC-TO-DC CONVERTER GND1 OSCILLATOR GND RECTIFIER GND2 VISOIN REGULATOR TRANSCEIVER DIGITAL ISOLATION iCoupler Y TxD 500kbps ENCODE DECODE ENCODE DECODE DECODE ENCODE D Z VCC DE RT A R B ADM2582E/ADM2587E RE GND1 ISOLATION BARRIER GND2 Figure 39. ADM2587E Typical Maximum External Current Measurements Rev. 0 | Page 17 of 20 08111-038 RxD ADM2582E/ADM2587E 3.3V/5V POWER SUPPLY 100nF 10µF 100nF 10nF VCC VCC VISOOUT 100nF 10µF isoPower DC-TO-DC CONVERTER OSCILLATOR RECTIFIER VISOIN 100nF REGULATOR DIGITAL ISOLATION iCoupler TxD DE ENCODE DECODE ENCODE DECODE DECODE ENCODE D Y Z RT A RxD RE R B RT ADM2582E/ADM2587E GND1 ISOLATION BARRIER GND2 GND1 Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E Figure 40 is an example of a circuit diagram using the ADM2582E/ADM2587E. Rev. 0 | Page 18 of 20 08111-124 MICROCONTROLLER AND UART TRANSCEIVER 10nF ADM2582E/ADM2587E TYPICAL APPLICATIONS Figure 41 and Figure 42 show typical applications of the ADM2582E/ ADM2587E in half duplex and full duplex RS-485 network configurations. Up to 256 transceivers can be connected to the RS-485 bus. To minimize reflections, terminate the line at the receiving end in its characteristic impedance, and keep stub lengths off the main line as short as possible. For half-duplex operation, this means that both ends of the line must be terminated because either end can be the receiving end. MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256 ADM2582E/ ADM2587E RxD R A A B B RE D RxD R RE RT RT DE TxD ADM2582E/ ADM2587E Z Z Y Y A B ADM2582E/ ADM2587E R Z Y A D RxD RE B ADM2582E/ ADM2587E DE TxD R Z DE D TxD Y D RxD RE DE TxD 08111-027 NOTES 1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE. 2. ISOLATION NOT SHOWN. Figure 41. ADM2582E/ADM2587E Typical Half Duplex RS-485 Network MAXIMUM NUMBER OF NODES = 256 MASTER SLAVE A R RxD B Y D RT RE DE Z D B RT Y A ADM2582E/ ADM2587E RE R RxD ADM2582E/ ADM2587E A B Z Y A B Z Y SLAVE SLAVE R ADM2582E/ ADM2587E RxD RE R D DE TxD RxD RE D ADM2582E/ ADM2587E DE TxD NOTES 1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE. 2. ISOLATION NOT SHOWN. Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network Rev. 0 | Page 19 of 20 08111-028 DE TxD TxD Z ADM2582E/ADM2587E OUTLINE DIMENSIONS 13.00 (0.5118) 12.60 (0.4961) 11 20 7.60 (0.2992) 7.40 (0.2913) 10 2.65 (0.1043) 2.35 (0.0925) 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 10.65 (0.4193) 10.00 (0.3937) 1.27 (0.0500) BSC 0.51 (0.0201) 0.31 (0.0122) SEATING PLANE 0.75 (0.0295) 0.25 (0.0098) 45° 8° 0° 0.33 (0.0130) 0.20 (0.0079) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-013-AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060706-A 1 Figure 43. 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model ADM2582EBRWZ 1 ADM2582EBRWZ-REEL71 ADM2587EBRWZ1 ADM2587EBRWZ-REEL71 EVAL-ADM2582EEBZ1 EVAL-ADM2587EEBZ1 1 Data Rate (Mbps) 16 16 0.5 0.5 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Z = RoHS Compliant Part. ©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08111-0-9/09(0) Rev. 0 | Page 20 of 20 Package Description 20-Lead SOIC_W 20-Lead SOIC_W 20-Lead SOIC_W 20-Lead SOIC_W ADM2582E Evaluation Board ADM2587E Evaluation Board Package Option RW-20 RW-20 RW-20 RW-20