PPTC/MSM Series Features Applications Surface Mount Devices Almost anywhere there is a low voltage Lead free deivce power supply, up to DC33V and a load Size 4532mm/1812 mils to be protested, including: Surface Mount packaging for automated assembly Computer mother board,Modem,USB hub Agency recognition:UL PDAs & Charger,Analog & digital line card Digital cameras,Dish drivers, CD-ROMs Dimensions (mm) 1.78 ± 0.1 3.2 ± 0.1 1.78 ± 0.1 3.2 ± 0.1 Product dimensions (mm) Model A B C D E min max min max min max min min MSM010 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 MSM014 MSM020/60 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 4.37 4.73 3.07 3.41 0.50 1.30 0.30 0.25 MSM030 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 MSM050/24/30 MSM075/16/24/33 4.37 4.73 3.07 3.41 0.40 1.80 0.30 0.25 4.37 4.73 3.07 3.41 0.40 0.90 0.30 0.25 MSM110/16/24/33 4.37 4.73 3.07 3.41 0.40 1.30 0.30 0.25 4.37 4.73 3.07 3.41 0.60 1.30 0.30 0.25 MSM150/16/24 4.37 4.73 3.07 3.41 0.40 1.20 0.30 0.25 MSM160 MSM200/12 4.37 4.73 3.07 3.41 0.40 1.20 0.30 0.25 4.37 4.73 3.07 3.41 0.50 1.30 0.30 0.25 4.37 4.37 4.37 4.73 4.73 4.73 3.07 3.07 3.07 3.41 3.41 3.41 0.50 0.50 0.50 1.50 1.50 1.50 0.30 0.30 0.30 0.25 0.25 0.25 MSM125 MSM260/13.2/16 MSM300 MSM350 Environmental Specifications Test Conditions Resistance change Passive aging 85℃,1000hrs ±5% typical Humidity aging 85℃,85%℃R.H.,168hrs ±5% typical Thermal shock 85℃,to-40℃,13times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating confitions:-40℃ to 85℃ Maximum surface of the device in the tripped state is 125℃ REV.2014.05.01 01 | www.spsemi.cn PPTC/MSM Series Model Electrical characteristics(25℃) Imax Pd max Maximum Time To Trip Current Time (Vdc) (A) (w) (A) (S) Ihold Itrip (A) (A) MSM010 0.10 0.30 30 100 0.8 0.5 1.5 0.750 15.000 MSM014 0.14 0.34 60 100 0.8 1.5 0.15 0.650 6.000 MSM020 MSM020/60 MSM030 0.20 0.20 0.30 0.40 0.40 0.60 30 60 30 100 100 100 0.8 0.8 0.8 8.0 8.0 8.0 0.02 0.02 0.1 0.350 0.350 0.250 5.000 5.000 3.000 MSM050 0.50 1.00 15 100 0.8 8.0 0.15 0.150 1.000 MSM050/24 MSM050/30 0.50 0.50 1.00 1.00 24 30 100 100 0.8 0.8 8.0 8.0 0.15 0.15 0.150 0.150 1.000 1.000 MSM075 MSM075/16 MSM075/24 MSM075/33 MSM110 MSM110/16 MSM110/24 MSM110/33 MSM125 MSM150 MSM150/166 MSM150/24 MSM160 MSM200 MSM200/12 MSM260 MSM260/13.2 MSM260/16 0.75 0.75 0.75 1.10 1.10 1.50 1.50 1.50 2.20 2.20 13.2 16 24 33 8 100 100 100 100 100 0.8 0.8 0.8 0.8 0.8 8.0 8.0 8.0 8.0 8.0 0.2 0.2 0.2 0.3 0.3 0.090 0.090 0.090 0.090 0.050 0.450 0.450 0.450 0.450 0.250 1.10 1.10 1.10 1.25 1.50 1.50 1.50 1.60 2.00 2.00 2.60 2.60 2.60 2.20 2.20 2.20 2.50 3.00 3.00 3.00 2.80 4.00 4.00 5.00 5.00 5.00 16 24 33 16 8 16 24 8 8 12 8 13.2 16 100 100 100 100 100 100 100 100 100 100 100 100 100 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 0.3 0.3 0.3 0.4 0.5 0.5 0.5 1.0 2.0 2.0 2.5 2.5 2.5 0.050 0.050 0.050 0.050 0.040 0.040 0.040 0.030 0.020 0.020 0.015 0.015 0.015 0.250 0.250 0.250 0.140 0.160 0.160 0.160 0.130 0.100 0.100 0.050 0.050 0.050 MSM300 3.00 5.00 8 100 0.8 8.0 4.0 0.012 0.040 MSM350 Ihold Itrip Vmax Imax Pd Rmin/max R1max *CAUTION Vmax Resistance Rmin Rmax (Ω) (Ω) 3.50 6.00 6 100 0.8 8.0 4.0 0.008 0.030 Hold Current:Maximum current device will not trip in 25℃ still air. Trip current:Minimum current at which the device will always trip in 25℃ still air Maximum operating volatge device can withstand without damage at ratde current(imax). Maximum fault current device can withstand without damage at rated voltage(Vmax). Typical power dissipatde from device when in the tripped state in 25℃ still air. Minimum/Maximum device resistance prior to tripping at 25℃. Maximum resistance of device at 25℃ measured one hour after trippde tripping. Operation beyond the specified rating may result in damage and possible arcing. Ihold versus tempetature maximun ambient operating temperature(Tmao)vs.hold current(Ihold) Model —40℃ —20℃ 0℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃ MSM010 0.160 0.14 0.120 0.10 0.080 0.07 0.06 0.05 0.030 MSM014 0.23 0.19 0.17 0.14 0.120 0.10 0.09 0.08 0.06 MSM020 0.29 0.26 0.23 0.20 0.170 0.15 0.14 0.12 0.10 MSM030 0.44 0.39 0.35 0.30 0.260 0.23 0.21 0.18 0.15 MSM050 0.59 0.57 0.55 0.50 0.450 0.43 0.35 0.30 0.23 MSM075 1.10 0.99 0.87 0.75 0.630 0.57 0.49 0.45 0.35 MSM110 1.60 1.45 1.28 1.10 0.920 0.83 0.71 0.66 0.52 MSM125 2.00 1.75 1.52 1.25 1.000 0.95 0.90 0.75 0.53 MSM150 2.30 2.05 1.77 1.50 1.230 1.09 0.95 0.82 0.61 MSM160 2.10 1.96 1.88 1.60 1.260 1.12 0.98 . 0.84 0.63 MSM200 MSM260 MSM300 MSM350 2.88 3.90 4.15 4.84 2.61 3.42 3.76 4.39 2.25 2.96 3.46 4.04 2.00 2.60 3.00 3.50 1.800 2.330 2.550 2.980 1.66 2.07 2.28 2.66 1.45 1.94 2.01 2.35 1.09 1.35 1.61 1.88 0.80 1.00 1.33 1.55 REV.2014.05.01 02 | www.spsemi.cn PPTC/MSM Series Termination pad characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Thermal Derating Curve Typical Time-To-Trip At 25°C Average Time Current Curves Derating Curves for mSMD Series 160 140 120 10 100 Time In Seconds Percentage of Derated Current 100 80 60 40 20 1 0.1 0.01 0 -40 -20 0 20 40 60 80 0.001 Temperature (°C) 0.1 1 10 0.10A 0.14A 0.20A 0.30A 0.50A 0.75A 1.10A 1.25A 1.50A 2.00A 2.50A 2.60A 100 Current In Amperes Recommended Solder Reflow Conditions Temperature(°C) mSMDmSMD Series Preheating 300 Soldering Cooling 250 200 190 160 ‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note：If reflow temperatures exceed the recommended profile, 100 0 devices may not meet the performance requirements. 60-120 sec. 30-60 sec. 120 sec. Package Information Reel: MSM010～350 REV.2014.05.01 1500pcs／ｒｅｅｌ 03 | www.spsemi.cn