13.50-14.50 GHz 2.5-Watt Power Amplifier February 2007 - Rev 19-Feb-07 CMM1434-SM Features 34.5 dBm (Typ.) Saturated Output Power 31.0 dB (Typ.) Linear Gain Fully Matched Uncondtionally Stable Low-Cost, Surface Mount Package Optimum Thermal Dissipation General Description The CMM1434-SM is a four-stage pHEMT GaAs MMIC power amplifier that is ideally suited for transmit subsystems designed for Ku-Band VSAT applications. The CMM1434-SM provides 31.0 dB linear gain and delivers 2.5 watts of output power at saturation operating from 13.5 to 14.5 GHz frequency. Applications The unconditional stability and internal matching provides for reduction of external components making this product a simple and low-cost solution. The low-cost 6mm x 6mm x 1.6mm surface mount package offers the same excellent RF and thermal properties as a typical flange package. Ku-Band VSAT Transmit Subsystems Electrical Characteristics (T = +25ºC,Vd = 6V, Idq = 1.5A) P arameter C o nditio n F requency R ange O utput Power S aturated O utput Power Saturated Output Power Variation Linear Gain L i near G ai n Vari ati on Input Reflection Coefficient O utput R ef l ecti on C oef f i ci ent G ate S uppl y Vol tage D rai n C urrent Power A dded E f f i ci ency Min 13. 50 31.5 33 @ 1dB compressi on Pi n = 10 dBm O ver operati ng f requency 27.0 O ver operati ng f requency I dq = 1.5A At S aturati on At S aturat ion -1. 1 T yp 32 34.5 0. 5 30.5 1. 0 -10.0 -7. 0 -0. 9 1.7 26 Max U nits 14. 50 GHz dB m dB m dB m dB dB dB dB V ol ts A % 1. 0 34.0 3. 0 -0. 7 1.9 Electrical Specifications (TA = -40°C to +75°C) P arameter C o nditio n Min Max U nits S aturated O utput Power L i near G ai n Stability V ari ati on f rom R oom T emperature V ari ati on f rom R oom T emperature -0. 5 -2. 5 3. 5 Unconditionally stable T yp dB m dB Maximum Ratings (TA = -40°C to +75°C) Operation outside these limits can cause permanent damage. P arameter T yp U nits P arameter Drain Voltage (+Vdd ) Gate Voltage (Vgg ) Quiescent Current (Idq ) Gate Current (Ig) 8.5 -3. 0 2.1 5 Volts V ol ts A mA RF Input Power (P in) D i ssi pated Power ( Pdiss) Storage Temperature O perati ng B ack si de T emperature Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com T yp 15 10 -50 to +150 -40 to +75 U nits dBm Watts °C °C Page 1 of 4 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 13.50-14.50 GHz 2.5-Watt Power Amplifier February 2007 - Rev 19-Feb-07 CMM1434-SM Power Amplifier Measurements CMM1434-SM Small Signal @ 6V, 1.5A 40 20 35 15 S21 S11 S22 30 10 25 5 20 0 15 Return Loss (dB) Gain (dB) S21 -5 S22 S11 10 -10 5 -15 0 -20 10 11 12 13 14 15 16 17 18 19 Frequency (GHz) CMM1434-SM Psat @ 6V, 1.5A Over Temperature 40 39 38 37 36 35 34 33 Pout (dBm) 32 31 30 29 28 27 26 25degC 75degC -40degC 25 24 23 22 21 20 13 13.2 13.4 13.6 13.8 14 14.2 14.4 14.6 14.8 15 Frequency (GHz) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 4 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 13.50-14.50 GHz 2.5-Watt Power Amplifier February 2007 - Rev 19-Feb-07 CMM1434-SM Physical Dimensions (Bottom View) Recommended Application Circuit Note: This schematic represents the topology of the application circuit recommended by Celeritek. Vdd RF IN 1 50 2 3 4 Vgg 5 CMM1431-SM Vdd 0.1 F ORIENTATION MARK 10 9 50 RF OUT 8 6 7 0.1 F Vgg Note: Due to the high gain of this device it is highly recommended to maintain the reverse isolation (S12) above 50 dB. Biasing Notes 1. Dual bias is required 2. 0.1 F bypass capacitors are needed on PC board as close as possible to pins 1, 5, 6 and 10. 3. Positive (+) bias can be applied either at pin 1 or pin 6. 4. Negative (-) bias can be applied either at pin 5 or pin 6. 5. No DC block is required at RF IN/OUT. 6. Negative (-) bias must be applied before applying positive (+) bias. Pin Functional Diagram 10 Vdd GROUND 2 RF IN 3 GROUND 4 Vgg 5 CMM1431-SM Vdd 1 9 GROUND 8 RF OUT 7 GROUND 6 Vgg Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 3 of 4 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 13.50-14.50 GHz 2.5-Watt Power Amplifier February 2007 - Rev 19-Feb-07 CMM1434-SM Handling and Assembly Information CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work station temperature should be 310º C +/- 10º C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. Ordering Information The CMM1434-SM is available in available in tube or tape and reel. Part Number for Ordering Package C M M 1431-S M S ur f ace mount pack age CMM1434-SM-0G0T Matte tin plated RoHS compliant surface mount package in tape and reel PB-CMM1434-SM Evaluation Board We also offer this product with SnPb (Tin-Lead) or NiPdAu plating. Please contact your regional sales manager for more information regarding different plating types. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 4 of 4 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.