Samsung CL31B104KCFNNNF Multilayer ceramic capacitor Datasheet

Multilayer Ceramic Capacitor
- General -
Multilayer Ceramic Capacitor - General
■ INTRODUCTION
MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used
in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the
better frequency characteristics, higher reliability, higher withstanding voltage and so on.
MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for
inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base
Metal Electrode), which reduced the total cost of MLCC.
This inner electrode is connected to outer termination for surface mounting, which is composed of
three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs
become Pb free by the environmental issue at present.
■ FEATURE AND APPLICATION
● Feature
- Miniature Size
- Wide Capacitance and Voltage Range
- Tape & Reel for Surface Mount Assembly
- Low ESR
● Application
- General Electronic Circuit
-1-
Multilayer Ceramic Capacitor - General
■ STRUCTURE
-2-
Multilayer Ceramic Capacitor - General
■ APPEARANCE AND DIMENSION
L
T
W
BW
CODE
EIA CODE
03
DIMENSION ( mm )
L
W
T (MAX)
BW
0201
0.6 ± 0.03
0.3 ± 0.03
0.3 ± 0.03
0.15±0.05
05
0402
1.0 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.2+0.15/-0.1
10
0603
1.6 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.3 ± 0.2
21
0805
2.0 ± 0.1
1.25 ± 0.1
1.25± 0.1
0.5+0.2/-0.3
31
1206
3.2 ± 0.2
1.6 ± 0.2
1.6 ± 0.2
0.5+0.2/-0.3
32
1210
3.2 ± 0.3
2.5 ± 0.2
2.5 ± 0.2
0.6 ± 0.3
43
1812
4.5 ± 0.4
3.2 ± 0.3
3.2 ± 0.3
0.8 ± 0.3
55
2220
5.7 ± 0.4
5.0 ± 0.4
3.2 ± 0.3
1.0 ± 0.3
-3-
Multilayer Ceramic Capacitor - General
■ PREVIOUS PART NUMBERING
CL
1
●
10
2
●
C
3
●
101
4
●
J
5
●
B
6
●
N
7
●
C
8
●
1 SAMSUNG Multilayer Ceramic Capacitor
●
2 Type(Size)
●
3 Capacitance Temperature Characteristics
●
4 Nominal Capacitance
●
5 Capacitance Tolerance
●
6 Rated Voltage
●
7 Thickness Option
●
8 Packaging Type
●
3 CAPACITANCE TEMPERATURE CHARACTERISTIC
●
▶ CLASS Ⅰ(Temperature Compensation)
Symble
EIA Code
Temperature
Coefficient(PPM/℃)
※ Temperature
C
C0G
0 ± 30
CΔ
P
PH
-150 ± 60
PΔ
R
RH
-220 ± 60
RΔ
S
SH
-330 ± 60
SΔ
T
TH
-470 ± 60
TΔ
U
UJ
-750 ± 120
UΔ
L
SL
+350 ~ -1000
SL
Characteristics
※ Temperature Characteristics
Temperature
below 2.0pF 2.2 ~ 3.9pF above 4.0pF
Characteristics
Operation
Temperature Range
-55 ~ +125℃
above 10pF
CΔ
C0G
C0G
C0G
C0G
PΔ
-
PJ
PH
PH
RΔ
-
RJ
RH
RH
SΔ
-
SJ
SH
SH
TΔ
-
TJ
TH
TH
H : ±60 PPM/℃
UΔ
-
UJ
UJ
UJ
G : ±30 PPM/℃
☞ J : ±120 PPM/℃
▶ CLASS Ⅱ(High Dielectric Constant)
Symble
EIA Code
Capacitance Change
(ΔC : %)
Operation
Temperature Range
A
X5R
± 15
-55 ~ +85℃
B
X7R
± 15
-55 ~ +125℃
F
Y5V
+22 ~ -82
-30 ~ +85℃
-4-
Multilayer Ceramic Capacitor - General
4 NOMINAL CAPACITANCE
●
The nominal capacitance value is expressed in pico-Farad(pF) and identified by threedigit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.
example)
100 : 10 × 10o =
10pF
102 : 10 × 102 = 1000pF
020 : 2 × 10o =
2pF
1R5 : 1.5pF
5 CAPACITANCE TOLERANCE
●
Temperature
Characteristics
Symbol
Tolerance
Applicable Capacitance & Range
A
± 0.05pF
B
± 0.1pF
C
± 0.25pF
C0G(NPO)
D
± 0.5pF
or
F
± 1pF
T.C Series
F
± 1%
G
± 2%
J
± 5%
K
± 10%
J
± 5%
K
± 10%
M
± 20%
Z
-20% ~ +80%
A(X5R)
B(X7R)
F(Y5V)
0.5 ~ 3pF
0.5 ~ 10pF
6 ~ 10pF
E-24 Series for over 10pF
E-12 Series
E-6 Series
※ Please Consult us for special tolerances.
6 RATED VOLTAGE
●
Symbol
Rated Voltage(Vdc)
Symbol
Rated Voltage(Vdc)
R
4V
C
100V
Q
6.3V
D
200V
P
10V
G
500V
O
16V
I
1000V
A
25V
J
2000V
B
50V
K
3000V
-5-
Multilayer Ceramic Capacitor - General
7 THICKNESS OPTION
●
Symbol
Description of the Code
N
Standard thickness (please refer to standard thickness table on next page)
A
Thinner than standard thickness
B
Thicker than standard thickness
C
Standard Thickness High Q ( Low ` D.F ` )
D
Sn-100% (High-Q)
E
Sn-100% (General)
※ Please Consult us for other termination type.
8 PACKAGING TYPE
●
Symbol
Packaging
Symbol
Packaging
B
Bulk
F
Embossed Tape, 13" Reel
P
Cassette
L
Paper 13" Reel
C
Paper Tape, 7" Reel
O
Paper 10" Reel
D
Paper Tape, 13" Reel
S
Embossed Tape, 10" Reel
E
Embossed Tape, 7" Reel
▶ STANDARD CAPACITANCE STEP
Series
Capacitance Step
1.0
E- 3
1.0
E- 6
E-12
E-24
2.2
1.5
4.7
2.2
3.3
4.7
6.8
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
1.1
1.3
1.6
2.0
2.4
3.0
3.6
4.3
5.1
6.2
7.5
9.1
※ Standard Capacitance is " Each step ×10n "
-6-
Multilayer Ceramic Capacitor - General
■ NEW PART NUMBERING
CL
1
●
10
2
●
C
3
●
101
4
●
J
5
●
B
6
●
8
7
●
N
8
●
N
9
●
N
10
●
C
11
●
1 SAMSUNG Multilayer Ceramic Capacitor
●
2 Size(mm)
●
3 Capacitance Temperature Characteristic
●
4 Nominal Capacitance
●
5 Capacitance Tolerance
●
6 Rated Voltage
●
7 Thickness Option
●
8 Product & Plating Method
●
9 Samsung Control Code
●
10 Reserved For Future Use
●
11 Packaging Type
●
1 PRODUCT ABBREVIATION
●
Symbol
Product Abbreviation
CL
SAMSUNG Multilayer Ceramic Capacitor
2 SIZE(mm)
●
Symbol
Size(mm)
Length
Width
03
0.6
0.3
05
1.0
0.5
10
1.6
0.8
21
2.0
1.2
31
3.2
1.6
32
3.2
2.5
43
4.5
3.2
55
5.7
5.0
-7-
Multilayer Ceramic Capacitor - General
3 CAPACITANCE TEMPERATURE CHARACTERISTIC
●
Symbol
Temperature
Temperature Characteristics
Range
C
COG
C△
0±30(ppm/℃)
P
P2H
P△
-150±60
R
R2H
R△
-220±60
S2H
S△
-330±60
T
T2H
T△
-470±60
U
U2J
U△
-750±60
L
S2L
S△
+350 ~ -1000
A
X5R
X5R
±15%
-55 ~ +85℃
X7R
X7R
±15%
-55 ~ +125℃
Y5V
Y5V
+22 ~ -82%
-30 ~ +85℃
Class Ⅰ
S
Class Ⅱ
B
F
-55 ~ +125℃
※ Temperature Characteristic
Temperature
Characteristics
Below 2.0pF
2.2 ~ 3.9pF
Above 4.0pF
Above 10pF
CΔ
C0G
C0G
C0G
C0G
PΔ
-
P2J
P2H
P2H
RΔ
-
R2J
R2H
R2H
SΔ
-
S2J
S2H
S2H
TΔ
-
T2J
T2H
T2H
UΔ
-
U2J
U2J
U2J
J : ±120PPM/℃, H : ±60PPM/℃, G : ±30PPM/℃
4 NOMINAL CAPACITANCE
●
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
● Example
Symbol
Nominal Capacitance
1R5
1.5pF
103
10,000pF, 10nF, 0.01μF
104
100,000pF, 100nF, 0.1μF
-8-
Multilayer Ceramic Capacitor - General
5 CAPACITANCE TOLERANCE
●
Symbol
Tolerance
A
±0.05pF
B
±0.1pF
C
±0.25pF
D
±0.5pF
F
±1pF
F
±1%
G
±2%
J
±5%
K
±10%
M
±20%
Z
+80, -20%
Nominal Capacitance
Less than 10pF
(Including 10pF)
More than 10pF
6 RATED VOLTAGE
●
Symbol
Rated Voltage
Symbol
Rated Voltage
Q
6.3V
E
250V
P
10V
G
500V
O
16V
H
630V
A
25V
I
1,000V
B
50V
J
2,000V
C
100V
K
3,000V
D
200V
-9-
Multilayer Ceramic Capacitor - General
7 THICKNESS OPTION
●
Type
Symbol
Thickness(T)
Spec
0603
3
0.30
±0.03
1005
5
0.50
±0.05
1608
8
0.80
±0.10
A
0.65
C
0.85
F
1.25
±0.10
C
0.85
±0.15
F
1.25
±0.15
H
1.6
±0.20
F
1.25
H
1.6
±0.10
2012
3216
3225
±0.20
I
2.0
J
2.5
F
1.25
H
1.6
±0.20
4532
I
2.0
J
2.5
L
3.2
F
1.25
H
1.6
I
2.0
J
2.5
L
3.2
±0.30
±0.20
5750
±0.30
- 10 -
Multilayer Ceramic Capacitor - General
8 PRODUCT & PLATING METHOD
●
Symbol
Electrode
Termination
Plating Type
A
Pd
Ag
Sn_100%
N
Ni
Cu
Sn_100%
G
Cu
Cu
Sn_100%
9 SAMSUNG CONTROL CODE
●
Symbol
Description of the code
Symbol
Description of the code
A
Array (2-element)
N
Normal
B
Array (4-element)
P
Automotive
C
High - Q
W
3 Terminal EMI Filter
L
LICC
10 RESERVED FOR FUTURE USE
●
Symbol
Description of the code
N
Reserved for future use
11 PACKAGING TYPE
●
Symbol
Packaging Type
Symbol
Packaging Type
B
Bulk
F
Embossing 13" (10,000EA)
P
Bulk Case
L
Paper 13" (15,000EA)
C
Paper 7"
O
Paper 10"
D
Paper 13" (10,000EA)
S
Embossing 10"
E
Embossing 7"
- 11 -
Multilayer Ceramic Capacitor - General
▶ CAPACITANCE vs CHIP THICKNESS STANDARD
Description
Dimension
(mm)
0603 1005 1608
(0201) (0402) (0603)
2012 Type
(0805)
3216 Type
(1206)
3225 Type
(1210)
4532 Type
(1812)
5750 Type
(2220)
L
0.6
±0.03
1.0
±0.05
1.6
±0.1
2.0±0.1
3.2±0.15
3.2
±0.2
3.2±0.3
4.5±0.4
5.7±0.4
W
0.3
±0.03
0.5
±0.05
0.8
±0.1
1.25±0.1
1.6±0.15
1.6
±0.2
2.5±0.2
3.2±0.3
5.0±0.4
T
0.3
±0.03
0.5~
±0.05
0.8
±0.1
0.85
±0.1
1.25 0.85 1.25
1.6
±0.1 ±0.15 ±0.15 ±0.2
-
0.5~
240
0.5 ~
0.5 1100 ~ 1600~ 0.5 ~ 3000~ 6200~
1000 ~1000 1500 2700 2700 5600 8200
-
0.5~
47
0.5~
220
0.5 ~
1000
-
-
0.5 ~
180
0.5 ~
1000
6.3V
10
220
2200
-
-
10000
-
-
10000
-
-
-
22000
-
-
-
47000
-
-
47000
10V
10
100
1000
-
-
2200
-
-
4700~
10000
-
-
-
22000
-
-
-
-
-
-
47000
16V
-
47
330~
470
-
-
1000
-
-
4700
-
-
-
6800~
10000
-
-
-
-
-
-
-
25V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
50V
-
6.8~
10
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
6.3V
0.1~
10
47~
100
470~
1000
-
-
1000
-
-
6800~
10000
-
-
-
22000
-
-
-
-
-
-
-
10V
0.1~
10
33~
100
220~
470
220~
270
330~
470
560~
1000
-
1000~ 4700 1500~ 3300 3900~
3300
2200
4700
-
-
-
-
22000
-
-
-
16V
0.1~
1
10~
33
100~
220
68~
200
220~
330
390~
1000
330~ 1000~ 2200~ 1500~ 3300 3900~
680 1500 3300 2200
4700
-
-
-
2200
-
-
-
-
25V
-
4.7~
10
47~
100
39~
68
82~
100
150~
470
100~ 470~
330
620
680~
1000
680~ 1800
1500
2200
-
-
-
1000
-
-
-
10000
50V
-
0.22~
4.7
0.22~
100
0.22~
39
47~
100
220
1~
150
220
390~
1000
2.2~
680
820~
1000
-
-
10~
1000
-
-
-
-
-
3300~
4700
6.3V
10~
100
-
2200
-
-
10000
-
-
-
-
-
47000
-
-
-
-
-
-
-
-
10V
-
220~
330
100~
1000
-
-
4700
-
-
-
-
22000
-
-
-
-
-
-
100000
16V
-
10~
220
100~
1000
10~
680
820~ 1200~ 1000~ 2700~ 10000 3300~ 10000 15000
1000 2200 2200 4700
6800
-
-
-
22000
-
-
-
-
25V
-
10~
33
22~
330
10~
220
270~
470
560~
1000
470~ 1200~ 2700~ 1000~ 4700~
1000 2200 3300 3300 10000
-
-
-
-
-
10000
-
-
-
50V
-
2.2~
10
2.2~
100
2.2~
68
82~
150
180~
1000
10~
470
-
-
-
-
-
10000
-
-
-
-
-
3300~ 1500~ 3900~ 7500~
8200 3600 6800 10000
1.25 1.6
±0.2 ±0.2
2.0
±0.2
2.5
±0.2
1.25
±0.2
1.6
±0.2
2.0
±0.2
2.5
±0.2
1.6
2.0
±0.2 ±0.2
2.5
±0.2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100000
-
-
-
-
-
(
SL
50V
C
RA
AP
NA
25V
GC
EI
T C, TC
p A (Except
F N SL,UJ)
C
50V
E
0.65
±0.1
)
A
(X5R)
C
A
P
A
C
I
T
A
N
C
E
R
A
N
G
E
B
(X7R)
(
-
560~ 11000
24000~
~
10000 22000
47000
-
1000~ 15000~ 24000~ 62000~ 43000 93000 130000
13000 22000 47000 68000
)
n
F
0.5 ~ 620~ 1100~ 0.5 ~ 2400~
560 1000 3300 2200 4700
F
(Y5V)
4700 10000~
22000
560~
1000
-
100~
1000
-
- 12 -
Multilayer Ceramic Capacitor - General
■ PACKAGING
● CARDBOARD PAPER TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
A
F
W
B
t
P0
P2
P1
unit : mm
Symbol
Type
W
F
E
P1
03
D
i
m
e
n
s
i
o
n
P2
P0
D
2.0
±0.05
05
8.0
±0.3
10
3.5
±0.05
A
B
0.37
±0.03
0.38
±0.03
0.68
±0.03
0.6
±0.05
1.75
±0.1
2.0
±0.05
4.0
±0.1
Φ1.5
+0.1/-0
4.0
±0.1
21
t
1.1
MAX
31
0.65
1.15
+0.05/-0.1 +0.05/-0.1
1.1
±0.2
1.9
±0.2
1.6
±0.2
2.4
±0.2
2.0
±0.2
3.6
±0.2
● EMBOSSED PLASTIC TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
A
F
B
t1
P0
t0
Symbol
Type
D
i
m
e
n
s
i
o
n
P2
W
P1
unit : mm
A
B
21
1.45
±0.2
2.3
±0.2
31
2.0
±0.2
3.6
±0.2
2.9
±0.2
3.6
±0.2
43
3.6
±0.2
4.9
±0.2
55
5.4
±0.2
6.0
±0.2
32
W
8.0
±0.3
F
3.5
±0.05
E
1.75
±0.1
P1
4.0
±0.1
P2
2.0
±0.05
P0
4.0
±0.1
D
Φ1.5
+0.1/-0
t0
0.6
max
t1
2.5
max
- 13 -
Multilayer Ceramic Capacitor - General
● TAPING SIZE
Empty Section
Empty Section
Packed Part
45 Pitch
Loading Section
50 Pitch
35 Pitch
END
START
unit : pcs
Symbol
Cardboard Paper Tape
Embossed Plastic Tape
7" Reel
4000
2000
13" Reel
15000
-
● REEL DIMENSION
E
C
R
B
D
W
t
A
unit : mm
Symbol
A
B
7" Reel
φ178±2.0
min.φ50
φ330±2.0
min.φ70
13"
Reel
C
D
E
W
t
R
φ13±0.5
21±0.8
2.0±0.5
10±1.5
0.8±0.2
1.0
- 14 -
Multilayer Ceramic Capacitor - General
● BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
A
B
T
C
D
E
F
W
G
H
L
I
Symbol
A
B
T
C
D
E
Dimension
6.8±0.1
8.8±0.1
12±0.1
1.5+0.1/-0
2+0/-0.1
4.7±0.1
Symbol
F
W
G
H
L
I
Dimension
31.5+0.2/-0
36+0/-0.2
19±0.35
7±0.35
110±0.7
5±0.35
● QUANTITY
Size
05(0402)
10(0603)
Quantity
50,000
10,000~15,000*
21(0805)
T≤0.85mm
T≥1.0mm
10,000
5,000
* Option
- 15 -
Multilayer Ceramic Capacitor - General
■ CHARACTERISTIC MAP
● CLASS Ⅰ
Temperature
Characteristics
Size
Capacitance Range (㎊)
Voltage
0.5
05
(0402)
50V
10
(0603)
50V
21
(0805)
50V
31
(1206)
50V
03
(0201)
25V
10
100
1000
10000
100000
1000000 10000000
100000000
240
1000
SL,UJ
05
(0402)
10
(0603)
21
(0805)
C(COG) &
TC Series
31
(1206)
32
(1210)
43
(1812)
55
(2220)
25V
50V
2700
8200
47
220
180
25V
1000
50V
1000
25V
8200
3300
50V
3300
25V
1500
50V
50V
100V
10000
4700
560
47000
4700
18000
25V
50V
50V
100000
1000
68000
43000
130000
- 16 -
Multilayer Ceramic Capacitor - General
● CLASS Ⅱ , A(X5R)
Temperature
Characteristics
Size
Capacitance Range (㎊)
Voltage
10
0603
(0201)
100
1000
10000
100000
6.3V
10000
10V
10000
6.3V
1005
(0402)
220000
10V
100000
16V
50V
1000000 10000000 100000000
47000
6800
10000
6.3V
1608
(0603)
2200000
10V
16V
1000000
330000
470000
6.3V
A(X5R)
2012
(0805)
10V
16V
10000000
2200000
1000000
6.3V
3216
(1206)
10V
10000000
4700000
16V
3225
(1210)
5750
(2220)
4700000
6.3V
22000000
10V
22000000
16V
4532
(1812)
10000000
6800000
10000000
6.3V
47000000
6.3V
47000000
10V
47000000
- 17 -
Multilayer Ceramic Capacitor - General
● CLASS Ⅱ , B(X7R)
Temperature
Characteristics
Capacitance Range (㎊)
Size
Voltage
10
03
(0201)
100
1000
10000
6.3V
100
10000
10V
100
10000
16V
100
47000
10V
16V
50V
100000
33000
10000
25V
4700
220
100000
33000
10000
4700
6.3V
470000
10V
10
(0603)
220000
16V
100000
25V
B(X7R)
50V
1000000 10000000 100000000
1000
6.3V
05
(0402)
100000
47000
1000000
470000
220000
100000
100000
220
6.3V
1000000
10V
21
(0805)
16V
68000
25V
50V
1000000
39000
470000
220
220000
6.3V
6800000
10V
31
(1206)
1000000
16V
330000
25V
50V
1000000
220000
100000
1000
10000000
4700000
3300000
1000000
1000000
- 18 -
Multilayer Ceramic Capacitor - General
● CLASS Ⅱ , B(X7R)
Temperature
Characteristics
Capacitance Range (㎊)
Size
Voltage
10
100
1000
10000
100000
1000000 10000000 100000000
6.3V
32
(1210)
22000000
10V
1500000
4700000
16V
1500000
4700000
25V
50V
B(X7R)
2200000
680000
2200
1000000
10V
43
(1812)
16V
2200000
25V
1000000
50V
55
(2220)
22000000
10000
1000000
25V
50V
10000000
3300000
4700000
- 19 -
Multilayer Ceramic Capacitor - General
● CLASS Ⅱ , F(Y5V)
Temperature
Characteristics
Size
Capacitance Range (㎊)
Voltage
10
03
(0201)
100
1000
6.3V
10000
10000
10 V
05
(0402)
100000
220000
16 V
10000
25 V
10000
50 V
100000 1000000 10000000 100000000
330000
220000
33000
10000
2200
6.3V
10
(0603)
2200000
10 V
100000
1000000
16 V
100000
1000000
25 V
50 V
22000
330000
2200
100000
6.3V
10000000
10 V
21
(0805)
4700000
16 V
10000
25 V
10000
2200000
1000000
F(Y5V)
50 V
1000000
2200
10 V
31
(1206)
4700000
16 V
1000000
25 V
50 V
10000000
470000
3300000
10000
1000000
6.3V
47000000
10 V
32
(1210)
22000000
16 V
3300000
25 V
50 V
16V
43
(1812)
55
(2220)
22000000
10000000
1000000
100000
15000000
1000000
22000000
25 V
10000000
50 V
10000000
10 V
100000000
- 20 -
Multilayer Ceramic Capacitor - General
■ RELIABILITY TEST DATA
NO
ITEM
1
APPEARANCE
PERFORMANCE
TEST CONDITION
NO ABNORMAL EXTERIOR APPEARANCE
THROUGH MICROSCOPE(×10)
10,000㏁ OR 500㏁∙㎌ PRODUCT WHICHEVER IS
2
INSULATION
SMALLER
RESISTANCE
(RATED VOLTAGE IS BELOW 16V
: 10,000㏁ OR 100㏁∙㎌)
3
WITHSTANDING
VOLTAGE
NO DIELECTRIC BREAKDOWN OR
MECHANICAL BREAKDOWN
RATED VOLTAGE SHALL BE APPLIED.
MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE
TIME 60 SEC.
CLASSⅠ: 300% OF THE RATED VOLTAGE FOR 1~5 SEC,
CLASSⅡ:250% OF THE RATED VOLTAGE FOR 1~5 SEC
IS APPLIED WITH LESS THAN 50㎃ CURRENT
CAPACITANCE
CLASS
Ⅰ
4
FREQUENCY
1,000㎊ AND
WITHIN THE SPECIFIED
1㎒±10%
BELOW
TOLERANCE
MORE THAN
CAPACIT
1㎑±10%
1,000㎊
ANCE
CLASS
Ⅱ
WITHIN THE SPECIFIED
CLASS
Ⅰ
Vrms
FREQUENCY
VOLTAGE
10㎌ AND BELOW
1㎑±10%
1.0±0.2Vrms
120㎐±20%
0.5±0.1Vrms
FREQUENCY
VOLTAGE
TOLERANCE
MORE THAN
CAPACITANCE
Q
0.5 ~ 5
CAPACITANCE
10㎌
5
VOLTAGE
1,000㎊ AND
OVER 30㎊ : Q ≥1,000
1㎒±10%
BELOW
LESS THAN 30㎊: Q ≥400 +20C
( C : CAPACITANCE )
MORE THAN
1㎑±10%
1,000㎊
1. CHAR : B
0.5 ~ 5
Vrms
CAPACITANCE
FREQUENCY
VOLTAGE
RATED VOLTAGE
DF SPEC
10㎌ AND BELOW
1㎑±10%
1.0±0.2Vrms
6.3V
0.05 max
MORE THAN 10㎌
120㎐±20%
0.5±0.1Vrms
16V
25V
50V
0.05max
0.05max
10V
0.05 max
16V
0.035 max
25V
0.025 max
50V 이상
0.025 max
2. CHAR : F
6
Tanδ
6.3V
10V
1005
-
0.125max
1608
0.16max
0.125max
0.09max
2012
0.16max
0.125max
0.09max
0.07max
0.05max
3216
0.16max
0.125max
0.09max
0.07max
0.05max
3225
0.16max
0.125max
0.09max
4532
0.16max
0.16max
0.09max
-
-
0.125max
-
-
-
CLASS
Ⅱ
5750
0.09max (C＜220nF)
0.125max (C≥220nF)
0.05max(C≤100nF)
0.07max(C>100nF)
0.07max(C≤6.8㎌)
0.09max(C>6.8㎌)
0.05max
0.05max
- 21 -
Multilayer Ceramic Capacitor - General
NO
ITEM
PERFORMANCE
TEMP. COEFFICIENT
CHARACTERISTIC
(PPM/℃)
C0G
CAPACITANCE
7
TEMPERATURE
COEFFICIENT
CLASS
Ⅰ
TEST CONDITION
0 ± 30
THESE SYMMETRICAL TOLERANCE APPLY TO
2 POINT MEASUREMENT OF TEMPERATURE
COEFFICIENT: ONE AT 25℃ AND AT 85℃
STEP
PH
-150 ± 60
RH
-220 ± 60
1
SH
-330 ± 60
2
TH
-470 ± 60
3
UL
-750 ± 120
4
SL
+350 ~ -1000
TEMPERATURE
25 ± 2
MIN RATED TEMP ± 2
25 ± 2
MAX RATED TEMP ± 2
5
25 ± 2
The change of capacitance should be got from
the capacitance at 25℃.
After capacitance measured from Min. Temp. to
CAPACITANCE CHANGE
TEMPERATURE
8
CHARACTERISTIC
S
CLASS
Ⅱ
Max. Temp.,
it should be calculated from the formula below.
CHAR.
CAP. CHANGE(%)
A,B
±15%
F
+22% ~ -82%
C2 - C1
× 100 %
C1
C1 : CAPACITANCE AT STANDARD
TEMPERATURE(25℃)
C2 : CAPACITANCE AT EACH
TEMPERATURE
NO INDICATION OF PEELING SHALL
OCCUR ON THE TERMINAL
9
ADHESIVE STRENGTH
A 500g.f PRESSURE SHALL BE
APPLIED FOR 10±1 SECOND.
ELECTRODE.
OF TERMINATION
500g.f
SEE (FIG.1)
APPEARANCE
NO MECHANICAL DAMAGE SHALL
BENDING SHALL BE APPLIED TO
OCCUR.
THE LIMIT(1mm) WITH 0.3mm/SEC.
CHARACTER
CLASS I
10
KEEP THE TEST BOARD AT THE LIMIT POINT
CAPACITANCE
IN 5 SEC., THEN MEASURE CAPACITANCE.
WITHIN ±5%
CHARACTER
LIMIT
OR ± 0.5 pF
C, A, B, F
1mm
WHICHEVER IS
BENDING
STRENGTH
CHANGE OF
20
LARGER
CAPACITANCE
A,B
WITHIN ±12.5%
R=340
50
○
CLASS II
F
○
WITHIN ±30%
45±1
SEE (FIG.2)
45±1
BENDING
LIMIT
- 22 -
Multilayer Ceramic Capacitor - General
NO
ITEM
PERFORMANCE
TEST CONDITION
MORE THAN 75% OF THE TERMINAL
SOLDER TEMPERATURE : 230±5℃
SURFACE IS TO BE SOLDERED NEWLY,
DIP TIME
: 3±1 Sec
SO METAL PART DOES NOT COME
SOLDER
: H63A
OUT OR DISSOLVE
FLUX
: RMA TYPE
*PB-FREE
11
SOLDER TEMPERATURE : 260±5℃
SOLDERABILITY
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
APPEARANCE
IN PB--FREE PART, MORE THAN 95%
DIP TIME : 3±0.1Sec
OF THE TERMINAL SURFACE IS TO BE
* PRE-HEATING : AT 80~120℃ FOR
SOLDERED NEWLY
10~30SEC.
NO MECHANICAL DAMAGE
SHALL OCCUR
CHARACTERISTIC
CAPACITANCE
RESISTANCE
12
CLASSⅠ
TO
Q
HEAT
CLASS Ⅰ
Tanδ
CLASS Ⅱ
A,B
270±5℃
CAP. CHANGE
WITHIN ±2.5% OR
EACH TERMINATION SHALL BE FULLY
±0.25㎊ WHICHEVER
IMMERSED AND PREHEATED
IS LARGER
AS FOLLOWING:
WITHIN ±7.5%
30㎊ AND OVER : Q≥ 1000
1
80~100
60
LESS THAN 30㎊ : Q≥ 400+20×C
2
150~180
60
F
WITHIN ±20%
(SEC.)
TO SATISFY THE SPECIFIED
MEASURE AT ROOM TEMP. AFTER
INITIAL VALUE
COOLING FOR
TO SATISFY THE SPECIFIED
CLASSⅠ : 24 ± 2 HOURS
RESISTANCE
INITIAL VALUE
CLASSⅡ : 48 ± 4 HOURS
VOLTAGE
APPEARANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
NO MECHANICAL DAMAGE SHALL
BENDING SHALL BE APPLIED TO
OCCUR.
THE LIMIT(1mm) WITH 0.3mm/SEC.
CHARACTERISTIC
CAPACITANCE
CLASS Ⅰ
CAP. CHANGE
VIBRATION
Q
CLASS Ⅰ
Tanδ
CLASS Ⅱ
KEEP THE TEST BOARD AT THE LIMIT
WITHIN ±2.5% OR
POINT IN 5 SEC., THEN MEASURE
±0.25㎊
CAPACITANCE.
WHICHEVER
IS LARGER
TEST
TIME
TEMP.(℃)
INSULATION
WITHSTANDING
13
DIP TIME :10±1 SEC.
STEP
CLASSⅡ
SOLDERING
DIP : SOLDER TEMPERATURE OF
CLASS
A,B
WITHIN ±5%
Ⅱ
F
WITHIN ±20%
30㎊ AND OVER : Q≥ 1000
LESS THAN 30㎊ : Q≥ 400+20×C
CHAR.
FREQUENCY RANGE
A,B,C,F
10Hz → 55Hz → 10Hz
CHAR.
TRAVERSED TIME
A,B,C,F
1 min
THE ENTIRE FREQUENCY RANGE, FROM 10
TO SATISFY THE SPECIFIED
TO 55Hz AND RETURN TO 10Hz, SHALL BE
INITIAL VALUE
TRAVERSED IN 1 MINUTE.
INSULATION
TO SATISFY THE SPECIFIED
RESISTANCE
INITIAL VALUE
THIS CYCLE SHALL BE PERFORMED 2
HOURS IN EACH THERE MUTUALLY
PERPENDICULAR DIRECTION,
FOR TOTAL PERIOD OF 6 HOURS.
* THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE
MEASURED
AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.
- 23 -
Multilayer Ceramic Capacitor - General
NO
ITEM
PERFORMANCE
APPEARANCE
TEST CONDITION
NO MECHANICAL DAMAGE SHALL OCCUR
CHARACTERISTIC
TEMPERATURE
CAPACITANCE CHANGE
CLASS Ⅰ
CAPACITANCE
Q
HUMIDITY
14
CLASSⅠ
(STEADY
STATE)
A,B
Ⅱ
F
10 ~30㎊
APPEARANCE
CLASSⅠ : 24±2 Hr.
WITHIN ±30%
CLASSⅡ : 48±4 Hr.
6.3V
LESS THAN 10pF : Q≥ 200 + 10×C
0.125 MAX *Condition
Tanδ
1005 C ≥0.22㎌
25V
AND
OVER
A,B
F
RESISTANCE
AFTER COOLING FOR
WITHIN ±12.5%
: Q≥ 275 + 2.5×C
16V
0.05
0.05 MAX
0.075
MAX
0.1MAX
(C〈1.0㎌)
0.125
MAX
(C≥1.0㎌)
CLASS Ⅱ
INSULATION
MEASURE AT ROOM TEMPERATURE
30㎊ AND OVER : Q≥ 350
CHAR.
Tanδ
: 500 +12/-0 Hr.
±0.5㎊ WHICHEVER
IS LARGER
CLASS
RELATIVE HUMIDITY:90~95 %RH
TEST TIME
WITHIN ±5% OR
: 40±2 ℃
10V
0.05
MAX
0.15
MAX
6.3V
0.075
MAX
0.195
MAX
4V
0.1
MAX
1608 C ≥2.2㎌
CLASSⅡ
(A,B)
2012 C ≥4.7㎌
3216 C ≥10.0㎌
3225 C ≥22.0㎌
0.25
MAX
4532 C ≥47.0㎌
5750 C ≥100.0㎌
MINIMUM INSULATION RESISTANCE:
1,000 ㏁ OR 50㏁∙㎌ PRODUCT WHICHEVER IS
SMALLER
APPLIED VOLTAGE :
NO MECHANICAL DAMAGE SHALL OCCUR
RATED VOLTAGE
CHARACTERISTIC
CLASS Ⅰ
CAPACITANCE CHANGE
TEMPERATURE : 40±2 ℃
WITHIN ±7.5% OR
RELATIVE HUMIDITY:90~95%RH
±0.75㎊ WHICHEVER
TEST TIME : 500 +12/-0 Hr.
CURRENT APPLIED : 50㎃ MAX.
IS LARGER
<INITIAL MEASUREMENT>
A,B
CAPACITANCE
WITHIN ±12.5%
CLASS Ⅱ SHOULD BE MEASURED
WITHIN ±30%
INITIAL VALUE AFTER BE HEAT-TREATED
FOR 1 HR IN 150℃+0/-10℃ AND BE LEFT
WITHIN +30~－40%
<LATTER MEASUREMENT>
1608 C>1.0μF
CLASSⅠ SHOULD BE MEASURED AFTER
2012 C>4.7μF
LEFT FOR 24±2 HRS IN ROOM
MOISTURE
3216 C>10.0μF
TEMPERATURE AND HUMIDITY.
RESISTANCE
3225 C>22.0μF
CLASS Ⅱ SHOULD BE MEASURED
4532 C>47.0μF
LATTER VALUE AFTER BE
Ⅱ
15
FOR 48±4HR AT ROOM TEMPERATURE.
1005 C>0.47μF
CLASS
Q
CLASSⅠ
F
HEAT-TREATED FOR 1 HR IN 150℃+0/-10
30㎊ AND OVER : Q≥ 200
℃ AND BE LEFT FOR 48±4HR AT ROOM
30㎊ AND BELOW : Q≥ 100 + 10/3×C
CHAR.
25V
AND
OVER
16V
10V
6.3V
TEMPERATURE.
4V
6.3V Tanδ
0.125 MAX *Condition
1005 C ≥0.22㎌
Tanδ
A,B
CLASSⅡ
F
INSULATION
RESISTANCE
0.05
MAX
0.05
MAX
0.075
MAX
0.1MAX
(C〈1.0㎌)
0.125MAX
(C≥1.0㎌)
0.05
MAX
0.075
MAX
0.1
MAX
1608 C ≥2.2㎌
CLASSⅡ
0.15
MAX
0.195
MAX
MINIMUM INSULATION RESISTANCE:
0.25
MAX
(A,B)
2012 C ≥4.7㎌
3216 C ≥10.0㎌
3225 C ≥22.0㎌
4532 C ≥47.0㎌
5750 C ≥100.0㎌
500 ㏁ OR 25㏁∙㎌ PRODUCT,
WHICHEVER IS SMALLER.
- 24 -
Multilayer Ceramic Capacitor - General
NO
ITEM
PERFORMANCE
TEST CONDITION
APPLIED VOLTAGE :
150%, 200% OF RATED VOLTAGE
APPEARANCE
NO MECHANICAL DAMAGE SHALL OCCUR
CHARACTERISTIC
CLASS Ⅰ
A,B
CLASS
Ⅱ
CURRENT APPLIED : 50㎃ MAX.
CAP. CHANGE
CHAR.
TEMP.
CLASS Ⅰ
125 ±3 ℃
WITHIN ±3% OR ±0.3㎊,
CLASS
WHICHEVER IS LARGER
Ⅱ
WITHIN ±12.5%
CAPACITANCE
16
TEST TIME : 1000 +48/-0 Hr.
F
A
85 ±3 ℃
B
125 ±3 ℃
F
85 ±3 ℃
WITHIN ±30%
<INITIAL MEASUREMENT>
WITHIN+30~40%
VALUE AFTER BE HEAT-TREATED FOR 1
CLASS Ⅱ SHOULD BE MEASURED INITIAL
1005 C>0.47μF
HR IN 150℃+0/-10℃ AND BE LEFT FOR 48±
1608 C>1.0μF
4HR AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
2012 C>4.7μF
CLASSⅠ SHOULD BE MEASURED AFTER
HIGH
3216 C>10.0μF
TEMPERATURE
3225 C>22.0μF
TEMPERATURE AND HUMIDITY.
RESISTANCE
4532 C>47.0μF
CLASS Ⅱ SHOULD BE MEASURED LATTER
Q
CLASSⅠ
VALUE AFTER BE HEAT-TREATED FOR 1
30㎊ AND OVER : Q ≥ 350
10 ~ 30 ㎊
HR IN 150℃+0/-10℃ AND BE LEFT FOR 48±
: Q ≥ 275 + 2.5×C
4HR AT ROOM TEMPERATURE.
LESS THAN 10㎊ :Q ≥200 + 10×C
CHAR.
Tanδ
LEFT FOR 24±2 HRS IN ROOM
A,B
*150% Authorization
25V
AND
OVER
16V
0.05
MAX
0.05
MAX
0.075
MAX
0.1MAX
(C<1.0㎌)
0.125MAX
(C≥1.0㎌)
10V
6.3V
4V
1005 C>0.47μF
1608 C ≥2.2㎌
0.05
MAX
0.075
MAX
0.1
MAX
2012 C ≥4.7㎌
CLASSⅡ
3216 C ≥10.0㎌
(A,B,F)
CLASSⅡ
F
Conditions
0.15
MAX
0.195
MAX
3225 C ≥22.0㎌
4532 C ≥47.0㎌
0.25
MAX
5750 C ≥100.0㎌
(TWICE OF RATED VOLTAGE WILL BE
INSULATION
RESISTANCE
APPEARANCE
MINIMUM INSULATION RESISTANCE:
** HOWEVER,
WHICHEVER IS SMALLER
CAP. CHANGE
WITHIN ±2.5%
17
TEMPERATURE
CYCLE
Q
CLASSⅠ
Tanδ
CLASSⅡ
CLASS Ⅰ
A/B는1005 C ≥0.22㎌
SEE (FIG.3)
NO MECHANICAL DAMAGE SHALL OCCUR
CHARACTERISTIC
CAPACITANCE
APPLIED TO ALL SERIES BUT ABOVE)
1,000 ㏁ OR 50㏁∙㎌ PRODUCT
OR ±0.25㎊ WHICHEVER IS
LARGER
CLASS
A,B
WITHIN ±7.5%
Ⅱ
F
WITHIN ±20%
30 ㎊ AND OVER : Q ≥ 1000
CAPACITORS SHALL BE SUBJECTED
TO FIVE CYCLES OF THE
TEMPERATURE CYCLE AS FOLLOWING
STEP
1
2
3
LESS THAN 30㎊:Q ≥400 +20×C
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
TO SATISFY THE SPECIFIED
RESISTANCE
INITIAL VALUE
4
TEMP.(℃)
MIN.RATED
TEMP.+0/-3
25
MAX.RATED
TEMP.+3/-0
25
TIME(MIN)
30
2~3
30
2~3
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
CLASSⅠ : 24±2 Hr.
CLASSⅡ : 48±4 Hr.
- 25 -
Multilayer Ceramic Capacitor - General
■ CHARACTERISTIC GRAPH
● ELECTRICAL CHARACTERISTICS
▶ CAPACITANCE - TEMPERATURE CHARACTERISTICS
10
20
ΔC
-5
-10
-60
-20
0
20
60
100
-20
ΔC
C0G
RH
SH
TH
UJ
0
%
X7R
0
5
-40
%
-60
Y5V
-80
-60
140
-20
Temperature(℃)
0
20
40
80
120
Temperature(℃)
▶ CAPACITANCE - DC VOLTAGE CHARACTERISTICS ▶CAPACITANCE CHANGE - AGING
40
10
20
C0G 50V
0
ΔC
%
0
C0G
-10
X7R
-20
Y5V
X7R
-20
ΔC
50V
-40
%
-60
Y5V
-80
50V
-100
0
5
10
15
20
25
30
35
-30
0
40
50 100
1000
10000
Time(Hr)
DC V o l t a g e (V d c )
▶ IMPEDANCE - FREQUENCY CHARACTERISTICS
C0G
Ohm
Ohm
100
100
10
10
X7R/Y5V
0.001㎌
0.01㎌
0.1㎌
1
1
10pF
100pF
0.1
0.1
1000pF
0.01
1.E+06
1MHz
1.E+07
10MHz
1.E+08
100MHz
1.E+09
1GHz
1.E+10
10GHz
0.01
1.E+06
1MHz
1.E+07
10MHz
1.E+08
100MHz
1.E+09
1GHz
- 26 -
Multilayer Ceramic Capacitor - General
■ APPLICATION MANUAL
● Storage Condition
▶ Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
humidity of less than 40℃ and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
▶ Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶ Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
● Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size
Solder Resist
T
W
Solder
Land
Solder Resist
b
a
2/3W < b < W
2/3T < a < T
● Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶ Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
- 27 -
Multilayer Ceramic Capacitor - General
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶ Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶ Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within
2 minutes or less.
● Mounting
▶ Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶ Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
nozzle
force
support pin
● Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
- 28 -
Multilayer Ceramic Capacitor - General
● Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶ Soldering Methods
Method
Classification
- Overall heating
- Infrared rays
- Hot plate
- VPS(vapor phase)
- Local heating
- Air heater
- Laser
- Light beam
Reflow
soldering
- Single wave
- Double wave
Flow
soldering
-
* We recommend the reflow soldering method.
▶ Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
℃
preheating
soldering
cooling
℃
300
300
250
250
200
200
150
150
100
100
50
50
60~120sec
10~20sec
Reflow Soldering
preheating
soldering
cooling
△T≤150℃
60~120sec
3~4sec
Flow Soldering
▶ Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
- 29 -
Multilayer Ceramic Capacitor - General
▶ Amount of Solder
Too much
Solder
Cracks tend to occur due
to large stress
Weak holding force may
Not enough
cause bad connections or
Solder
detaching of the capacitor
Good
▶ Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
the temperature difference(△T) must be less than 100℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
▶ Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
- 30 -
Multilayer Ceramic Capacitor - General
■ CROSS REFERENCE
P/N
COMPANY
① COMPANY
② SIZE
(EIA/JIS)
③
MODEL(MLCC)
TAIYO
SAMSUNG
AVX
JOHANSON
KEMET
KYOCERA
MURATA
NOVACAP
PANASONIC
ROHM
TDK
VITRAMON
CL
-
-
C
CM
GRM
-
ECJ
MCH
MK
C
VJ
- YUDEN
0201(0603)
03
-
-
-
03
33
-
Z
-
063
0603
-
0402(1005)
05
0402
R07
0402
05
36
0402
0
15
105
1005
0402
0603(1608)
10
0603
R14
0603
105
39
0603
1
18
107
1608
0603
0805(2012)
21
0805
R15
0805
21
40
0805
2
21
212
2012
0805
1206(3216)
31
1206
R18
1206
316
42-6
1206
3
31
316
3216
1206
1210(3225)
32
1210
S41
1210
32
42-2
1210
4
32
325
3225
1210
1808(4520)
42
1808
R29
1808
42
-
1808
-
-
-
4520
1808
1812(4532)
43
1812
S43
1812
43
43-2
1812
-
43
432
4532
1812
2220(5750)
55
-
-
2220
55
44-1
2221
-
-
550
5650
-
COG(NPO)
C
A
N
G
CG
COG/CH
N
C
A
C
COG/CH
A
P2H(N150)
P
S
-
-
P
P2H
-
P
-
P
PH
-
R2H(N220)
R
1
-
-
R
R2H
-
R
-
R
RH
-
S2H(N330)
S
3
-
-
S
S2H
-
S
-
S
SH
-
T2H(N470)
T
O
-
-
T
T2H
-
T
-
T
TH
-
U2J(N750)
U
Z
-
-
U
U2J
-
U
UJ
U
UJ
-
S2L
L
Y
-
-
SL
SL
-
G
SL
SL
SL
-
X7R
B
C
W
R(X)
X7R
X7R
B
B
C
BJ
X7R(B)
Y(X)
Z5U
E
E
Z
U
-
Z5U
Z
-
E
-
Z5U
U
Y5V
F
G
Y
V
Y5V
Y5V
Y
F
F
F
Y5V
-
0J
-
TEMPERATURE
CHARACTERISTIC
EX) 103=10,000㎊
④ NOMINAL CAPACITANCE
B:±0.1㎊
⑤ CAPACITANCE TOLERANCE
6.3V
⑥ RATED
VOLTAGE
Q
C:±0.25㎊
221=220㎊
D:±0.5㎊
225=2,200,000㎊=2.2㎌
F:±1%
G:±2%
6
-
9
06
6.3
J:±5%
-
1R5=1.5㎊
K:±10%
010=1㎊
M:±20%
0J
-
Z:-20~+80%
J
10 V
P
Z
100
8
10
10
-
1A
4
L
1A
-
16 V
O
Y
160
4
16
16
160
1C
3
E
1C
J
25 V
A
3
250
3
25
25
250
1E
2
T
1E
X
50 V
B
5
500
5
50
50
500
1H
5
U
1H
A
100 V
C
1
101
1
100
100
101
2A
1
-
2A
B
200V
D
2
201
2
200
200
201
2D
-
-
-
C
250V
E
V
-
-
250
250
251
-
-
-
2E
-
500V
G
7
501
-
500
500
501
-
-
-
-
E
630V
H
-
-
-
630
630
-
-
-
-
2J
-
1000V
I
A
102
-
1000
1K
102
-
-
-
3A
G
2000V
J
G
202
-
2000
2K
202
-
-
-
3D
-
3000V
K
H
302
-
3000
3K
302
-
-
-
3F
H
4000V
-
J
-
4000
-
402
-
-
-
-
-
NICKEL BARRIER
N
T
V
C
A
(GRM)
N
-
(MCH)
-
-
X
Ag/Pd
P
1
-
-
B
(GR)
P
-
(MC)
-
-
F
BULK(VINYL)
B
9
(NONE)
-
B
PB
*
X
-
B
B
B
⑦ TERMINATION
PAPER TAPING
C
2, 4
T, R
-
T, L
PT
T
E,V,W
K, L
T
T
C, P
PLASTIC TAPING
E
1, 3
E, U
-
H, N
PT
-
F, Y
P, Q
T
-
T, R
BULK CASE
P
7
-
-
C
PC
-
C
C
-
-
G
⑧ PACKAGE
- 31 -
Multilayer Ceramic Capacitor - General
▶ SAMSUNG : CL10B104KA8NNNC
CL
10
Series
Size
Dielectric
Capacitance
Tolerance
=
=
=
=
=
=
=
=
C
P
R
S
T
U
L
B
A
F
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
03
05
10
21
31
32
43
55
B
0201
0402
0603
0805
1206
1210
1812
2220
=
=
=
=
=
=
=
=
=
=
104
C0G
P2H
R2H
S2H
T2H
U2H
S2L
X7R
X5R
Y5V
K
A
Z = +80,-20%
8
N
Voltage
Thickness
Q = 6.3V
P = 10V
O = 16V
A = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
H = 630V
I = 1000V
3 = 0.30
5 = 0.50
8 = 0.80
A = 0.65
C = 0.85
H = 1.60
I = 2.00
J = 2.50
L = 3.20
Electrode/
Termination/
Plating
A = Pd/Ag/
Sn 100%
N = Ni/Cu/
Sn 100%
G = Cu/Cu/
Sn 100%
N
N
C
Products
Special
Packaging
A = Array
Various
(2-element)
B = Array
(4-element)
C = High - Q
L = LICC
N = Normal
P = Automotive
W = 3 terminal
chip
B
P
C
D
=
=
=
=
Bulk
Cassette
Paper 7"
Paper 13"
(10,000EA)
E = Embossing 7"
F = Embossing 13"
L = Paper 13"
(15,000EA)
O = Paper 10"
S = Embossing 10"
▶ AVX : 06033C104KAT2A
0603
3
C
Size
Voltage
0201
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V
0402
0603
0805
1206
1210
1812
2220
2225
104
K
A
T
Dielectric
Capacitance
Tolerance
Failure Rate
A
C
D
E
G
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A = N/A
=
=
=
=
=
C0G
X7R
X5R
Z5U
Y5V
2
A
Packaging
Termination
2
4
7
9
T = Sn 100%
7 = Gold Plated
1 = Pd/Ag
=
=
=
=
7" Reel
13" Reel
Cassette
Bulk
Special
A
T
S
R
=
=
=
=
Standard
0.66mm
0.56mm
0.46mm
Z = +80, -20%
P = GMV,+100,-0%
▶ JOHANSON : 250R14W104KV6T
250
R14
Voltage
2
significant
figures
+
number
of zeros
Size
Dielectric
R07 = 0402
R14
R15
R18
S41
S43
S47
S48
S49
S54
=
=
=
=
=
=
=
=
=
W
0603
0805
1206
1210
1812
2220
2225
1825
3640
N = C0G
W = X7R
X = X5R
Z = Z5U
Y = Y5V
104
K
V
Capacitance
Tolerance
Termination
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
V = Ni Barrier
6
T
Marking
Packaging
4 = No Mark
6 = Marking
E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk
A
Z = +80, -20%
P = GMV,+100,-0%
▶ KEMET : C0603C104K3RAC
C
Series
0603
Size
0402
0603
0805
1206
1210
1812
2220
2225
C
Specification
C = Standard
A = GR900
P = Mil-C-55681
CDR01-CDR06
N = Mil-C-55681
CDR31-CDR35
Z = Mil-C-123
E = Mil Equivalent
(Group A Only)
104
K
3
R
Capacitance
Tolerance
Voltage
Dielectric
Failure Rate
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
G
R
P
U
X
V
A
M
P
R
S
9
8
4
3
5
1
2
=
=
=
=
=
=
=
6.3V
10V
16V
25V
50V
100V
200V
=
=
=
=
=
=
C0G
X7R
X5R
Z5U
BX(Mil)
Y5V
=
=
=
=
=
Standard
1.0 (Mil)
0.1 (Mil)
0.01 (Mil)
0.001 (Mil)
C
Termination
C
H
T
G
=
=
=
=
Ni w/Tin Plate
Ni w/Solder
Silver
Gold Plated
Z = +80, -20%
P = +100, 0%
- 32 -
Multilayer Ceramic Capacitor - General
▶ KYOCERA : CM105X7R104K25AT
CM
105
X7R
104
Series
K
25
Size
Dielectric
Capacitance
Tolerance
03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
CG
X8R
X7R
X5R
Z5U
Y5V
Y5U
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A
Voltage
Z = +80, -20%
P = +100, 0%
T
Termination
04 = 4V
06 = 6.3V
10 = 10V
16 = 16V
25 = 25V
50 = 50V
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V
Packaging
A = Ni Barrier
T
L
H
N
B
C
=
=
=
=
=
=
7" Reel (4mm Pitch)
13" Reel (4mm Pitch)
7" Reel (2mm Pitch)
13" Reel (2mm Pitch)
Bulk (Vinyl Bags)
Bulk Cassette
▶ MURATA : GRM188R71E104KA01D
GRM
18
8
R7
1E
104
K
A01
Series
Size
Thickness
Dielectric
Voltage
Capacitance
Tolerance
Ni Barrier
03 = 0201
3 = 0.3mm
5 = 0.5mm
8 = 0.8mm
A = 1.0mm
B = 1.25mm
C = 1.6mm
D = 2.0mm
E = 2.5mm
F = 3.2mm
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Individual
Specification
Code
15
18
21
31
32
42
43
55
=
=
=
=
=
=
=
=
0402
0603
0805
1206
1210
1808
1812
2220
5C
R7
R6
E4
F5
=
=
=
=
=
C0G
X7R
X5R
Z5U
Y5V
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V
D
Packaging
D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B = Bulk
C = Bulk Cassette
T = Bulk Tray
Z = +80,-20%
P = +100, 0%
▶ NOVACAP : 0603B104K250N_TM
1206
B
104
K
250
N
Size
Dielectric
Capacitance
Tolerance
Voltage
Termination
Thickness
0402
0603
0805
1005
1206
1210
1808
1812
2220
N
B
X
Z
Y
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
2
significant
figures
+
number
of zeros
P = Pd/Ag
N = Ni Barrier
(Sn 100%)
Y = Ni Barrier
(Sn/Pb)
Per Specified
=
=
=
=
=
C0G
X7R
BX
Z5U
Y5V
-
T
Packaging
M
Marking
T = Reel
None = Bulk
W = Waffle Pack
Z = +80,-20%
P = +100,
0%
▶ PANASONIC : ECJ1EB1E104K
ECJ
1
Series
Size
Z
0
1
2
3
4
=
=
=
=
=
=
0201
0402
0603
0805
1206
1210
E
Packaging
X = Bulk
E = Paper 2mm
V = Paper 4mm
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette
B
Dielectric
C = C0G
B = X7R, X5R
F = Y5V
1E
104
K
Voltage
Capacitance
Tolerance
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
C = ±0.25pF
D = ±0.5pF
F = ±1%
J = ±5%
K = ±10%
M = ±20%
Z = +80, -20%
- 33 -
Multilayer Ceramic Capacitor - General
▶ ROHM : MCH182C104KKN
MCH
18
2
Series
Size
Voltag
e
15
18
21
31
32
43
=
=
=
=
=
=
0402
0603
0805
1206
1210
1812
4
3
2
5
=
=
=
=
C
10V
16V
25V
50V
104
K
K
Dielectric
Capacitance
Tolerance
A = C0G
C = X7R
F = Y5V
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
N
Packaging
Marking/Thickness
K = 7" Reel Paper
P = 7" Reel Plastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B = Bulk
C = Bulk Cassette
N = Marked
Special Thickness
Z = +80,-20%
P = +100, 0%
▶ TAIYO-YUDEN : TMK107BJ104K_T
T
M
K
107
Voltage
Type
Termination
Size
A = 4V
J = 6.3V
L = 10V
E = 16V
T = 25V
U = 50V
M = Multilayer
V = Hi Q
K = Ni Barrier
105
107
212
316
325
432
550
=
=
=
=
=
=
=
BJ
0402
0603
0805
1206
1210
1812
2220
104
K
-
T
Dielectric
Capacitance
Tolerance
Special
Packaging
CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,
X7R
F = Y5V
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Various
T = Reel
B = Bulk
Z = +80,-20%
▶ TDK : C1608X7R1E104KT
C
Series
1608
X7R
1E
104
Size
Dielectric
Voltage
Capacitance
Tolerance
Packaging
CG
X7R
Z5U
Y5V
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
T = Reel
B = Bulk
0603
1005
1608
2012
3216
3225
4532
5650
=
=
=
=
=
=
=
=
0201
0402
0603
0805
1206
1210
1812
2220
K
T
Z = +80, -20%
▶ VITRAMON : VJ0603Y104KXXMC
VJ
0603
Y
Series
Size
Dielectric
Capacitance
Tolerance
0402
0603
0805
1206
1210
1812
2225
X =
A,N
Y =
U =
H =
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
BX
= C0G
X7R
Z5U
X8R
104
K
X
Termination
X = Silver,
Ni Barrier
Tin Plated
X
M
Voltage
Marking
J = 16V
X = 25V
A = 50V
B = 100V
C = 200V
M = Marking
A = No Marking
C
Packaging
C
T
P
R
B
=
=
=
=
=
7" Reel Paper
7" Reel Plastic
13" Reel Paper
13" Reel Plastic
Bulk
Z = +80, -20%
P = +100, 0%
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