TI1 LM2459 Monolithic single channel 15 mhz dtv crt driver Datasheet

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LM2459 Monolithic Single Channel 15 MHz DTV CRT Driver
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FEATURES
DESCRIPTION
•
•
•
•
The LM2459 is a single channel high voltage CRT
driver circuit designed for use in DTV applications.
The IC contains a high input impedance, wide band
amplifier which directly drives the cathode of a CRT.
The amplifier has its gain internally set to −51 and
can drive CRT capacitive loads as well as resistive
loads present in other applications, limited only by the
package's power dissipation.
1
2
•
15MHz Bandwidth at 130VPP Output Swing
0V to 4V Input Range
Greater than 130VPP Output Swing Capability
Stable With 0–20 pF Capacitive Loads and
Inductive Peaking Networks
Transient Response Improvement Option Via
Pin 6 (EM)
APPLICATIONS
•
AC Coupled DTV Applications Using the 480p
Format as well as Standard NTSC and PAL
Formats
The IC is packaged in a staggered 7-lead TO (KCS)
molded plastic power package designed specifically
to meet high voltage spacing requirements. See
THERMAL CONSIDERATIONS section.
SCHEMATIC DIAGRAM
CONNECTION DIAGRAM
7
6
5
4
3
2
1
VIN
EM
GND
VBB
GND
VOUT
VCC
Note: Tab is at GND
Figure 1. Simplified Connection and Pinout
Diagram (Top View)
Figure 2. Simplified Schematic Diagram
1
2
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2) (3)
Supply Voltage (VCC)
+200V
Bias Voltage (VBB)
+15V
Input Voltage (VIN)
-0.5V to VBB +0.5V
−65°C to +150°C
Storage Temperature Range (TSTG)
Lead Temperature (Soldering, <10 sec.)
ESD Tolerance
300°C
Human Body Model
Machine Model
Junction Temperature
200V
150°C
θJC (typ)
(1)
(2)
(3)
2kV
4.2°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
All voltages are measured with respect to GND, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
OPERATING RANGES (1)
VCC
+130V to +180V
VBB
+7V to +13V
VIN
+0V to +4V
VOUT
+25V to +178V
Case Temperature
Refer to Figure 11
Do not operate the part without a heat sink.
(1)
2
Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured
specifications and test conditions, see ELECTRICAL CHARACTERISTICS . Datasheet min/max specification limits are specified by
design, test, or statistical analysis. The ensured specifications apply only for the test conditions listed. Some performance characteristics
may change when the device is not operated under the listed test conditions.
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ELECTRICAL CHARACTERISTICS
(See Figure 3 for Test Circuit)
Unless otherwise noted: VCC = +180V, VBB = +8V, CL = 10pF, TC = 30°C, Pin 6 floating.
DC Tests: VIN = 2.5VDC
AC Tests: Output = 130VPP (35V - 165V) at 1MHz
Symbol
Parameter
Conditions
LM2459
Min
Max
6
12
mA
4
7
mA
ICC
Supply Current
IBB
Bias Current
VOUT, 1
DC Output Voltage
No AC Input Signal, VIN = 2.5VDC
99
104
109
VDC
VOUT, 2
DC Output Voltage
No AC Input Signal, VIN = 1.2VDC
165
170
175
VDC
AV
DC Voltage Gain
No AC Input Signal
-48
−51
-54
LE
Linearity Error
See (1), No AC Input Signal
5
%
tR
Rise Time
See (2), 10% to 90%
26
ns
tF
Fall Time
See (2), 90% to 10%
30
ns
OS
Overshoot
See (2)
5
%
(1)
(2)
No AC Input Signal, No Output Load
Units
Typical
Linearity Error is the variation in DC gain from VIN = 1.1V to VIN = 3.8V.
Input from signal generator: tr, tf < 1 ns.
AC TEST CIRCUIT
Note: 10pF load includes parasitic capacitance.
Figure 3. Test Circuit
Figure 3 shows a typical test circuit for evaluation of the LM2459. This circuit is designed to allow testing of the
LM2459 in a 50Ω environment without the use of an expensive FET probe. The two 4990Ω resistors form a
400:1 divider with the 50Ω resistor and the oscilloscope. A test point is included for easy use of an oscilloscope
probe.The compensation capacitor is used to compensate the network to achieve a flat frequency response.
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TYPICAL PERFORMANCE CHARACTERISTICS
(VCC = +180VDC, VBB = +8VDC, CL = 10pF, VOUT = 130VPP (35V − 165V), Test Circuit - Figure 3, Pin 6 floating, unless
otherwise specified)
200
180
160
120
20V/DIV
VOUT (V)
140
100
80
60
40
20
tf = 30 ns
tr = 26 ns
0
0
1
2
3
4
5
125 ns/DIV
VIN (V)
Figure 5. LM2459 Pulse Response
3
48
0
44
-3
40
SPEED (ns)
MAGNITUDE (dB)
Figure 4. VOUT vs VIN
-6
tf
36
-9
32
-12
28
-15
24
tr
1
10
100
8
10
12
14
16
18
20
FREQUENCY (MHz)
LOAD CAPACITANCE (pF)
Figure 6. Bandwidth
Figure 7. Speed vs Load Capacitance
55
42
50
38
45
34
SPEED (ns)
SPEED (ns)
tf
30
40
tf
35
30
26
20
22
95
4
tr
25
tr
100
105
30
40
50
60
70
80
90
100
OFFSET VOLTAGE (V)
CASE TEMPERATURE (°C)
Figure 8. Speed vs Offset
Figure 9. Speed vs Case Temperature
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(VCC = +180VDC, VBB = +8VDC, CL = 10pF, VOUT = 130VPP (35V − 165V), Test Circuit - Figure 3, Pin 6 floating, unless
otherwise specified)
5
8
7
POWER DISSIPATION (W)
POWER DISSIPATION (W)
4
3
2
6
5
4
3
2
1
1
0
0
0
5
10
15
20
0
25
20
40
60
80
100 120 140 160
CASE TEMPERATURE (ºC)
Figure 10. Power Dissipation vs Frequency
Figure 11. Power Derating Curve
20V/DIV
FREQUENCY (MHz)
77% ACTIVE TIME
125ns/DIV
Figure 12. Cathode Pulse Response
Table 1. Power Dissipation for Various Video Patterns
Power Dissipation (W)
Format
Pattern
480i
480p
Raster
0.5
0.5
Full WHite Field
1.2
1.2
White Box, 75% Screen Size
0.9
0.9
Gray Bars
1.0
1.0
Color Bars 75% Amplitude
0.8
0.8
Color Bars 100% Amplitude
0.9
0.9
SMPTE Color Bars
0.8
0.8
SMPTE 133
1.0
1.1
Cross Hatch 16x12
0.7
0.7
Resolution Chart
1.1
1.2
Multiburst
1.4
1.9
White Text on Black Background
1.5
2.2
Windows Pattern
0.9
1.2
Windows Pattern
0.9
1.2
Windows Pattern
1.4
1.7
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Table 1. Power Dissipation for Various Video Patterns (continued)
Power Dissipation (W)
Format
Pattern
6
480i
480p
Vertical Lines 5 On 5 Off
1.3
1.7
Vertical Lines 4 On 4 Off
1.3
1.8
Vertical Lines 3 On 3 Off
1.5
2.2
Vertical Lines 2 On 2 Off
1.8
2.8
Vertical Lines 1 On 1 Off
2.8
3.8
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THEORY OF OPERATION
The LM2459 is a high voltage monolithic single channel CRT driver suitable for HDTV applications. The LM2459
operates with 180V and 8V power supplies. The part is housed in a staggered 7-lead TO (KCS) molded plastic
power package.
The circuit diagram of the LM2459 is shown in Figure 2. The PNP emitter follower, Q5, provides input buffering.
Q1 and Q2 form a fixed gain cascode amplifier with resistors R1 and R2 setting the gain at −51. Emitter followers
Q3 and Q4 isolate the high output impedance of the cascode stage from the capacitance of the CRT cathode
which decreases the sensitivity of the device to load capacitance. Q6 provides biasing to the output emitter
follower stage to reduce crossover distortion at low signal levels.
Figure 3 shows a typical test circuit for evaluation of the LM2459. This circuit is designed to allow testing of the
LM2459 in a 50Ω environment without the use of an expensive FET probe. In this test circuit, the two 4.99kΩ
resistors form a 400:1 wideband, low capacitance probe when connected to a 50Ω coaxial cable and a 50Ω load
(such as a 50Ω oscilloscope input). The input signal from the generator is ac coupled to the base of Q5.
APPLICATION HINTS
INTRODUCTION
Texas Instruments is committed to provide application information that assists our customers in obtaining the
best performance possible from our products. The following information is provided in order to support this
commitment. The reader should be aware that the optimization of performance was done using a specific printed
circuit board designed at TI. Variations in performance can be realized due to physical changes in the printed
circuit board and the application. Therefore, the designer should know that component value changes may be
required in order to optimize performance in a given application. The values shown in this document can be used
as a starting point for evaluation purposes. When working with high bandwidth circuits, good layout practices are
also critical to achieving maximum performance.
IMPORTANT INFORMATION
The LM2459 performance is targeted for the HDTV market. The application circuits shown in this document to
optimize performance and to protect against damage from CRT arcover are designed specifically for the
LM2459. If another member of the LM245X family is used, please refer to its datasheet.
POWER SUPPLY BYPASS
Since the LM2459 is a wide bandwidth amplifier, proper power supply bypassing is critical for optimum
performance. Improper power supply bypassing can result in large overshoot, ringing or oscillation. 0.1µF
capacitors should be connected from the supply pins, VCC and VBB, to ground, as close to the LM2459 as is
practical. Additionally, a 22µF or larger electrolytic capacitor should be connected from both supply pins to
ground reasonably close to the LM2459.
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ARC PROTECTION
During normal CRT operation, internal arcing may occasionally occur. Spark gaps, in the range of 300V,
connected from the CRT cathodes to CRT ground will limit the maximum voltage, but to a value that is much
higher than allowable on the LM2459. This fast, high voltage, high energy pulse can damage the LM2459 output
stage. The application circuit shown in Figure 13 is designed to help clamp the voltage at the output of the
LM2459 to a safe level. The clamp diodes, D1 and D2, should have a fast transient response, high peak current
rating, low series impedance and low shunt capacitance. 1SS83 or equivalent diodes are recommended. D1 and
D2 should have short, low impedance connections to VCC and ground respectively. The cathode of D1 should be
located very close to a separately decoupled bypass capacitor (C3 in Figure 13). The ground connection of D2
and the decoupling capacitor should be very close to the LM2459 ground. This will significantly reduce the high
frequency voltage transients that the LM2459 would be subjected to during an arcover condition. Resistor R2
limits the arcover current that is seen by the diodes while R1 limits the current into the LM2459 as well as the
voltage stress at the outputs of the device. R2 should be a ½W solid carbon type resistor. R1 can be a ¼W metal
or carbon film type resistor. Having large value resistors for R1 and R2 would be desirable, but this has the effect
of increasing rise and fall times. Inductor L1 is critical to reduce the initial high frequency voltage levels that the
LM2459 would be subjected to. The inductor will not only help protect the device but it will also help minimize
rise and fall times as well as minimize EMI. For proper arc protection, it is important to not omit any of the arc
protection components shown in Figure 13.
Figure 13. Recommended Application Circuit
EFFECT OF LOAD CAPACITANCE
Figure 7 shows the effect of increased load capacitance on the speed of the device. This demonstrates the
importance of knowing the load capacitance in the application.
EFFECT OF OFFSET
Figure 8 shows the variation in rise and fall times when the output offset of the device is varied from 95 to
105VDC. The rise time shows a variation of less than 7% relative to the center data point (100VDC). The fall time
shows a variation of 18% relative to the center data point.
8
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THERMAL CONSIDERATIONS
Figure 9 shows the performance of the LM2459 in the test circuit shown in Figure 3 as a function of case
temperature. The figure shows that the rise and fall times of the LM2459 increase by approximately 18% and
29%, respectively, as the case temperature increases from 50°C to 90°C. This corresponds to a speed
degradation of 5% and 7% for every 10°C rise in case temperature.
Figure 10 shows the maximum power dissipation of the LM2459 vs. frequency when the device is driving a 10pF
load with a 130VPP alternating one pixel on, one pixel off signal. The graph assumes a 77% active time (device
operating at the specified frequency), which is typical in a TV application. The other 23% of the time the device is
assumed to be sitting at the black level (165V in this case). Table 1 also shows the typical power dissipation of
the LM2459 for various video patterns in the 480i and 480p video formats.
Figure 10, Figure 11, and Table 1 give the designer the information needed to determine the heatsink
requirement for the LM2459. For example, if an HDTV application uses the 480p format and "Vertical Lines 1 On
1 Off" is assumed to be the worst-case pattern to be displayed, then the power dissipated will be 3.8W (from
Table 1). Figure 11 shows that the maximum allowed case temperature is 134°C when 3.8W is dissipated. If the
maximum expected ambient temperature is 70°C, then a maximum heatsink thermal resistance can be
calculated:
134°C - 70°C
= 16.8°C / W
RTH =
3.8W
(1)
This example assumes a capacitive load of 10pF and no resistive load. The designer should note that if the load
capacitance is increased, then the AC component of the total power dissipation will also increase.
NOTE
An LM126X preamplifier, with rise and fall times of about 2 ns, was used to drive the
LM2459 for these power measurements. Using a preamplifier with rise and fall times
slower than the LM126X will cause the LM2459 to dissipate less power than shown in
Table 1.
OPTIMIZING TRANSIENT RESPONSE
Referring to Figure 13, there are three components (R1, R2 and L1) that can be adjusted to optimize the
transient response of the application circuit. Increasing the values of R1 and R2 will slow the circuit down while
decreasing overshoot. Increasing the value of L1 will speed up the circuit as well as increase overshoot. It is very
important to use inductors with very high self-resonant frequencies, preferably above 300 MHz. Ferrite core
inductors from J.W. Miller Magnetics (part # 78FR_ _k) were used for optimizing the performance of the device in
the TI application board. The values shown in Figure 14 can be used as a good starting point for the evaluation
of the LM2459. Using a variable resistor for R1 will simplify finding the value needed for optimum performance in
a given application. Once the optimum value is determined, the variable resistor can be replaced with a fixed
value.
Figure 12 shows the typical cathode pulse response with an output swing of 110VPP using a LM1269
preamplifier.
The transient response can also be improved by adding a capacitor from pin 6 to the ground plane used by the
LM2459. A small capacitor, such as a 22pF ceramic, will notably improve the fall time and only increase the
overshoots and settling times slightly. Note that increasing the capacitance beyond 22pF will only improve the fall
time marginally, but will increase the settling times significantly. This option allows for better matching between
the rise and fall time.
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PC BOARD LAYOUT CONSIDERATIONS
For optimum performance, an adequate ground plane, isolation between channels, good supply bypassing and
minimizing unwanted feedback are necessary. Also, the length of the signal traces from the preamplifier to the
LM2459 and from the LM2459 to the CRT cathode should be as short as possible. The following references are
recommended:
Ott, Henry W., “Noise Reduction Techniques in Electronic Systems”, John Wiley & Sons, New York, 1976.
“Video Amplifier Design for Computer Monitors”, Texas Instruments Application Note 1013.
Pease, Robert A., “Troubleshooting Analog Circuits”, Butterworth-Heinemann, 1991.
Because of its high small signal bandwidth, the part may oscillate in a TV if feedback occurs around the video
channel through the chassis wiring. To prevent this, leads to the video amplifier input circuit should be shielded,
and input circuit wiring should be spaced as far as possible from output circuit wiring.
TYPICAL APPLICATION
A typical application of the LM2459 is shown in the schematic for the TI demonstration board in Figure 14. Used
in conjunction with an LM126X preamplifier, a complete video channel from input to CRT cathode can be
achieved. Performance is ideal for DTV applications. The TI demonstration board can be used to evaluate the
LM2459 in a TV.
TI DEMONSTRATION BOARD
Figure 15 shows the routing and component placement on the TI LM2459 demonstration board. This board
provides a good example of a layout that can be used as a guide for future layouts. Note the location of the
following components:
• C7203—VCC bypass capacitor, located very close to pin 1 and ground pins
• C7205—VBB bypass capacitor, located close to pin 4 and ground
• C7207—VCC bypass capacitor, near LM2459 and VCC clamp diodes. Very important for arc protection.
The routing of the LM2459 output to the CRT is very critical to achieving optimum performance. Figure 16 shows
the routing and component placement from pin 2 (VOUT) of the LM2459 to the cathode. Note that the components
are placed so that they almost line up from the output pin of the LM2459 to the cathode pin of the CRT
connector. This is done to minimize the length of the video path between these two components. Note also that
D7204, D7205, R7251 and D7214 are placed to minimize the size of the video nodes that they are attached to.
This minimizes parasitic capacitance in the video path and also enhances the effectiveness of the protection
diodes. The anode of protection diode D7204 is connected directly to a section of the the ground plane that has
a short and direct path to the LM2459 ground pins. The cathode of D7205 is connected to VCC very close to
decoupling capacitor C7207 (see Figure 16) which is connected to the same section of the ground plane as
D7204. The diode placement and routing is very important for minimizing the voltage stress on the LM2459
during an arcover event. Lastly, notice that SG7202 is placed very close to the cathode and is tied directly to
CRT ground.
This demonstration board uses medium-sized PCB holes to accommodate socket pins, which function to allow
for multiple insertions of the LM2459 in a convenient manner. To benefit from the enhanced LM2459 package
with thin leads, the device should be secured in small PCB holes to optimize the metal-to-metal spacing between
the leads.
10
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Figure 14. LM2459 Demonstration Board Schematic
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Figure 15. LM2459 Demonstration Board Layout
Figure 16. Trace Routing and Component Placement from LM2459 Output to Cathode
12
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REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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